Vishay Intertechnology, Inc.
Telecommunications
Mobile
One of the World’s Largest Manufacturers of
www.vishay.com
Discrete Semiconductors and Passive Components
Telecommunications
Mobile
Smartphones4
Wireless Modems
5
Wireless Charging
6
The Engineer’s Toolbox highlights, by market application, some innovative components Vishay
manufactures that help design engineers develop superior end products. We recognize that offering
unique component solutions helps improve the performance of next-generation devices, overcome
technical barriers, and create new markets.
More information on the Engineer’s Toolbox, including product datasheet links, can be found at
www.vishay.com/ref/et2. For inquiries, please contact your local sales representative.
Telecommunications
Key components for
Telecommunications
Mobile
SmartPhoneS
Wireless ModemS
The Vishay Advantage
High-Frequency Operation
Small Size
Low Profile
High Q
Optimized Impedance
High SRF
Wireless Charging
3
and more...
Telecommunications
Telecommunications Mobile
RESISTORS
RESISTORS
CAPACITORS
WSL0805
MC Series
298D Series (Standard) and
298W Series (Extended)
Microtan®
SMD, Power Metal Strip
Resistor
®
SmartPhoneS
Features
• 0.125 W current sensing resistor in 0805
package size
• Features a very low 5.0 mΩ to 200 mΩ
resistance value range
• Standard tolerance of 1.0 % with 0.5 %
available
• High-temperature performance up to
+ 170 °C
Thin Film Chip Resistors
Features
• CECC approved according
to EN 140401-801
• Available from 1R to 10 M
• Low TCR down to ± 10 ppm/K,
tight tolerance down to 0.1 %
• High pulse load robustness
Ideal for Space Constrained
Applications
Features
• Industry’s best volumetric efficiency
• Small sizes including 0402, 0603, and
0805 footprints
INDUCTORS
MOSFETs
ICs
ICs
IFSC-0806-AZ-01
SiA445EDJ/Si8809EDB
SiP32454/SiP32408
SiP4612A/B
Low-Profile High-Current
Inductor
Single, - 20 V P-Channel Power MOSFETs
3 A Slew Rate Control Smart
Load Switches
Power Switch
Features
• Shielded construction
• Frequency range up to 5 MHz
• RoHS-compliant
Features
• Maximum current of 9.5 A,
2 mm x 2 mm PowerPAK® SC-70
packaging, maximum on-resistance down
to 0.0165 Ω, and 2000 V typical ESD
protection (SiA445EDJ)
• Maximum current of 1.5 A, industry smallest chip scale packaging with MICRO
FOOT® 0.8 mm x 0.8 mm, maximum onresistance down to 0.09 Ω, and 1000 V
typical ESD protection (Si8809EDB)
Features
• Low input operating voltage
• Low and flat RDS(on) on the entire
operating voltage
• Reverse current blocking when the
switch is off
• Compact 1.2 mm x 1.6 mm plastic
package and 0.8 mm x 0.8 mm WCSP
package
Features
• Overcurrent protected high-side
load switch
• 1 A continuous output current
• 2.4 V to 5.5 V supply voltage range
• User settable current limit level and low
quiescent current
• Undervoltage lockout and thermal
shutdown protection
OPTOELECTRONICS
DIODES
RESISTORS
RESISTORS
VCNL4020
VBUS54ED-FBL (USB OTG)
CZA
RCWE 0402/0603
16-Bit Effective Resolution for
Both Proximity and Ambient Sensing
4 Line ESD Protection Array in
LLP2510
Thick Film Chip Attenuator
Thick Film Surface-Mount
Chip Resistor
Features
• Excellent crosstalk immunity;
no mechanical barrier required
• Programmable LED drive current from
10 mA to 200 mA in 10 mA steps
• Proximity distance up to 20 cm (8 in.)
• Driver for external emitters to increase
range up to 1 meter
• Ambient light detection from 0.25 lx to
16 klx
Features
• Compact LLP2510-10L package
• Low package height < 0.6 mm
• Low capacitance between I/O lines: 0.3 pF
• Ideal for high speed data line protection
like HDMI, USB 3.0 and Thunderbolt
Features
• Reduces component count and
board space requirements
• Available in 04S and 06S package sizes,
attenuations from 0 dB to 20 dB
• Tolerance matching and temperature
tracking superior to individual components
• Simplifies the manufacture of smaller,
lighter electronic systems
Features
• Extremely low resistance value range
(10 mΩ to 976 mΩ)
• 0.125 W/0.2 W power rating and
wraparound termination
• Standard tolerance of 1.0 % and 5.0 %
• Temperature coefficient:
from ± 400 ppm/°C to ± 100 ppm/°C
4
Telecommunications
Telecommunications Mobile
RESISTORS
RESISTORS
CapacitorS
WSL0805
TNPW e3 Series
592D/592W Series
Low-Profile, Ultra High
Capacitance Tantamount®
SMD, Power Metal Strip
Resistor
High Stability Thin Film
Chip Resistors
Features
• 0.125 W current sensing resistor in 0805
package size
• Features a very low 5.0 mΩ to 200 mΩ
resistance value range
• Standard tolerance of 1.0 % with 0.5 %
available
• High-temperature performance up to
+ 170 °C
Features
• Low temperature coefficient and tight
tolerances: ± 0.1 %, ± 10 ppm/K
• Excellent overall stability at harsh
environmental conditions
• AEC-Q200 qualified, automotive grade
• Case sizes: 0402 to 1210
INDUCTORS
MOSFETs
ICs
IFSC-1111AZ
SiA431DJ/Si8809EDB
SiP2802DY
Low-Profile High-Current
Inductor
Single, - 20 V P-Channel
Power MOSFETs
Low-Power PWM Current
Mode Controller
Features
• Shielded construction
• Frequency range up to 5 MHz
• RoHS-compliant
Features
• Maximum current of 7.7 A,
2 mm x 2 mm PowerPAK® SC-70
packaging, maximum on-resistance down
to 0.025 Ω at VGS = 4.5 V (SiA431DJ)
• Maximum current of 1.5 A, industry smallest chip scale packaging with MICRO
FOOT® 0.8 mm x 0.8 mm, maximum onresistance down to 0.09 Ω, and 1000 V
typical ESD protection (Si8809EDB)
Features
• Supports DC/DC and off-line power
supplies
• Less than 500 µA operating current
• Internal soft start
RECTIFIERS
OPTOELECTRONICS
RESISTORS
SS2PH10
VLMx1300
RCWE 0402/0603
2 A, 100 V Schottky in SMP
0603 LED Indicator
Features
• Very low profile - typical height of 1.0 mm
for SMP
• Low forward voltage drop
• Ideal for automated placement
• RoHS-compliant, halogen-free
Features
• Super red, soft orange, yellow,
yellow-green, true-green, and blue
• Exceptionally bright in a chip LED
package
• Viewing angle of 130°
• 1.6 mm x 0.8 mm x 0.8 mm height
Thick Film Surface-Mount
Chip Resistor
®
Wireless ModemS
5
Features
• Extremely low resistance value range
(10 mΩ to 976 mΩ)
• 0.125 W/0.2 W power rating and
wraparound termination
• Standard tolerance of 1.0 % and 5.0 %
• Temperature coefficient:
from ± 400 ppm/°C to ± 100 ppm/°C
Low-Profile High Capacitance
Tantalum Capacitors
Features
• Capacitance values up to 2200 µF
• Ideal for use in creating a capacitance bank
for energy storage
• These high capacitance devices minimize
component count
• Low profile package will fit in your design
(1.5 mm to 2.0 mm)
mlcc Capacitors
VJ1812Y High-Capacitance MLCC
Vishay Vitramon Commercial Series
Features
• C0G (NP0) and X7R dielectrics with
voltages up to 1000 V
• X7R dielectric version offers high C/V
values, available in large case sizes
• Reliable Noble Metal Electrode (NME)
system built with wet process
THE VISHAY ADVANTAGE
High-Frequency Operation
Small Size
Low Profile
High Q
Optimized Impedance
High SRF
and more...
Telecommunications
Telecommunications Mobile
RESISTORS
CAPACITORS
CAPACITORS
WSL0603
VJ.....W1BC Series
298D Series (Standard) and
298W Series (Extended)
Microtan®
SMD, Power Metal Strip
Resistor
SMD Multilayer Ceramic Chip
Capacitors (Including X5R)
Features
• 0.1 W current sensing resistor in 0603
package size
• Features a very low 10 mΩ to 100 mΩ
resistance value range
• Standard tolerance of 1.0 % with 0.5 %
available
• High-temperature performance up
to + 170 °C
Features
• Available from 0201 to 1210 body sizes
• C0G (NP0), X5R, X7R, Y5V, high Q, and
ultra high Q/low ESR dielectrics
• Chip array size 0612 with 4 capacitors
inside
• Build with dry sheet technology
process and 100 % tin termination,
fully ROHS-compliant
INDUCTORS
RESISTORS, NON-LINEAR
MOSFETs
IWAS-3827
NTCS0402E3
SiS472DN, SiA915EDJ, SiA426DJ
Wireless Charging Receiving
Coil/Shield
Glass-Protected SMD 0402
NTC Thermistor
Features
• Used for Rx applications up
to 10 W
• Optimized for 5 V charging circuitry
• High permeability shielding for wireless
charging
• Blocks charging flux from sensitive
components or batteries
Features
• Tolerance on R25 down to 1 %, and on
B25/85 down to 1 %
• High operating temperature up to 150 °C
Single 20 V to 30 V N-Channel,
Dual - 30 V P-Channel
Power MOSFETs
®
Wireless Charging
Features
• Maximum current up to 12 A
• Thermally enhanced 3.3 mm x 3.3 mm
PowerPAK® 1212-8 (1/3 the size of an
SO-8) and 2 mm x 2 mm PowerPAK
SC-70 packaging
• Maximum on-resistance down to
0.0085 Ω
RECTIFIERS
ICs
RESISTORS
MSS2P2/MSS2P3,
SS2P2L/SS2P3L
SiP12107/SiP12108
CZA
Scalable 3 A/5 A Compact
Buck Regulators
Thick Film Chip Attenuator
2 A, 20 V and 30 V Schottky
in MicroSMP, SMP
Features
• Very low profile - typical height of 0.68 mm
for MicroSMP, typical height of 1.0 mm
for SMP
• Low forward voltage drop
• Ideal for automated placement
• RoHS-compliant, halogen-free
Features
• Ultrafast transient response
• Supports all ceramic capacitor solution
with no external ESR requirement
• Full protection set of OTP, SCP, UVP, OVP
• Compact 16 lead QFN 3 mm x 3 mm
package
Features
• Reduces component count and board
space requirements
• Available in 04S and 06S package sizes,
attenuations from 0 dB to 20 dB
• Tolerance matching and temperature
tracking superior to individual components
• Simplifies the manufacture of smaller,
lighter electronic systems
Ideal for Space Constrained
Applications
Features
• Industry’s best volumetric efficiency
• Small sizes including 0402, 0603, and
0805 footprints
Vishay Intertechnology’s reputation for innovation, reliability, and
quality is complemented by a
decades-long record of service to
and improvements for the telecommunications industry.
Detailed Applications Information
Cell Phones
www.vishay.com/applications/telecommunications/cellphone/
POL Power
www.vishay.com/applications/telecommunications/pol_power/
Design Support Tools
Thermal Simulation Tools, Performance
Calculators, and Spice and 3D Models
www.vishay.com/how/design-supporttools/
Technical Library
www.vishay.com/how/onlineliterature/
technical-library/
View datasheets for these products at
www.vishay.com/ref/et2te
6
Vishay Intertechnology, Inc.
BUILD VISHAY
into your
DESIGN
www.vishay.com
VMN-MS6761-1212