TDA2030
14 W hi-fi audio amplifier
Features
■
Wide-range supply voltage, up to 36 V
■
Single or split power supply
■
Short-circuit protection to ground
■
Thermal shutdown
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Description
Pentawatt (horizontal)
The TDA2030 is a monolithic integrated circuit in
the Pentawatt® package, intended for use as a
low frequency class-AB amplifier. Typically it
provides 14 W output power (d = 0.5%) at
14 V/4 Ω. At ±14 V or 28 V, the guaranteed output
power is 12 W on a 4 Ω load and 8 W on an 8 Ω
(DIN45500).
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The TDA2030 provides high output current and
has very low harmonic and crossover distortion.
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Table 1.
Device summary
Order code
Package
TDA2030H
Pentawatt horizontal
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Furthermore, the device incorporates an original
(and patented) short-circuit protection system
comprising an arrangement for automatically
limiting the dissipated power so as to keep the
operating point of the output transistors within
their safe operating range. A conventional thermal
shutdown system is also included.
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Figure 1.
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Ex: Functional block diagram
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Device overview
1
TDA2030
Device overview
Figure 2.
Pin connections (top view)
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Figure 3.
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Test circuit
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TDA2030
Electrical specifications
2
Electrical specifications
2.1
Absolute maximum ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
±18 (36)
V
Vs
Supply voltage
Vi
Input voltage
Vs
Vi
Differential input voltage
±15
Io
Output peak current internally limited)
3.5
Ptot
Power dissipation at Tcase = 90 °C
20
Tstg, Tj
Storage and junction temperature
-40 to 150
2.2
Thermal data
Table 3.
Thermal data
Symbol
Rth j-case
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W
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°C
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Parameter
Thermal resistance junction-case
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Electrical characteristics
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2.3
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Value
Unit
max 3
C
Refer to the test circuit in Figure 3; VS = ±14 V, Tamb = 25°C unless otherwise specified.
Table 4.
Electrical characteristics
Symbol
Parameter
Vs
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Id
Ib
VOS
IOS
Po
Test conditions
Supply voltage
Min.
Typ.
±6
12
Max.
Unit
± 18
36
V
Quiescent drain current
40
60
mA
Input bias current
0.2
2
μA
±2
± 20
mV
± 20
± 200
nA
Input offset voltage
Input offset current
Vs = ± 18 (Vs = 36)
Output power
d = 0.5%, f = 40 to 15,000 Hz;
GV = 30 dB
RL = 4 Ω
RL = 8 Ω
12
8
14
9
W
W
d = 10%, f =1 kHz; GV = 30 dB
RL = 4 Ω
RL = 8 Ω
12
8
14
9
W
W
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Electrical specifications
Table 4.
Electrical characteristics (continued)
Symbol
d
TDA2030
Parameter
Distortion
Test conditions
B
Frequency response
(–3 dB)
Ri
Input resistance (pin 1)
Gv
Voltage gain (open loop)
Gv
Voltage gain (closed loop)
eN
Input noise voltage
iN
Input noise current
Typ.
Max.
Unit
Po = 0.1 to 12 W, RL = 4 Ω,
GV = 30 dB
f = 40 to 15.000 Hz
0.2
0.5
%
Po = 0.1 to 8 W, RL = 8 Ω,
GV = 30 dB
f = 40 to 15.000 Hz
0.1
0.5
%
Po = 12 W, RL = 4 Ω;
GV = 30 dB
Hz
5
MΩ
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10
µV
80
200
pA
90
f = 1 kHz
29.5
Supply voltage rejection
GV = 30 dB; RL = 4 Ω,
Rg = 22 kΩ, fripple = 100 Hz;
Vripple = 0.5 Veff
Id
Drain current
Po = 14 W, RL = 4 Ω
Po = 9 W, RL = 8 Ω
Tj
Thermal shutdown junction
temperature
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10 Hz to 140
0.5
B = 22 Hz to 22 kHz
SVR
Min.
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40
30
dB
30.5
dB
50
dB
900
500
mA
145
°C
TDA2030
Electrical specifications
2.4
Characterizations
Figure 4.
Output power vs. supply voltage
Figure 5.
Output power vs. supply voltage
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Figure 6.
Distortion vs. output power
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Figure 7.
Distortion vs. output power
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Electrical specifications
Figure 8.
TDA2030
Distortion vs. output power
Figure 9.
Distortion vs. frequency
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Figure 10. Distortion vs. frequency
Figure 11. Frequency response with different
values of the rolloff capacitor C8
(see typical amplifier with split
power supply)
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TDA2030
Electrical specifications
Figure 12. Quiescent current vs. supply
voltage
Figure 13. Supply voltage rejection vs. voltage
gain
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Figure 14. Power dissipation and efficiency
vs. output power
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Figure 15. Maximum power dissipation vs.
supply voltage (sine wave
operation)
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Applications
3
TDA2030
Applications
Figure 16. Typical amplifier with split power
supply
Figure 17. Typical amplifier with single power
supply
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Figure 18. PC board and component layout for Figure 19. PC board and component layout for
a typical amplifier with split power
a typical amplifier with single power
supply
supply
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TDA2030
Applications
Figure 20. Bridge amplifier configuration with split power supply (Po = 28 W, Vs = ±14 V)
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Practical considerations
TDA2030
4
Practical considerations
4.1
Printed circuit board
The layout shown in Figure 19 should be adopted by the designers. If different layouts are
used, the ground points of input 1 and input 2 must be well decoupled from the ground
return of the output in which a high current flows.
4.2
Assembly suggestion
No electrical isolation is needed between the package and the heatsink with single supply
voltage configuration.
4.3
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Application suggestions
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The recommended values of the components are those shown on application circuit of
Figure 16. However, if different values are chosen, then the following table can be helpful.
Table 5.
Recommanded
Component
Smaller than
recommanded value
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Closed loop gain setting
Increase of gain
Decrease in gain(1)
R2
680 Ω
Closed loop gain setting
Decrease of gain(1)
Increase in gain
R3
22 kΩ
Non-inverting input biasing
Increase of input
impedance
Decrease in input
impedance
R4
1Ω
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Frequency stability
Danger of oscillation at
high frequencies with
inductive loads
3 R2
Upper frequency cutoff
Poor high-frequency
attenuation
1 µF
Input DC decoupling
Increase in lowfrequency cutoff
C2
22 µF
Inverting input DC
decoupling
Increase in lowfrequency cutoff
C3C4
0.1 µF
Supply voltage bypass
Danger of oscillation
C5C6
100 µF
Supply voltage bypass
Danger of oscillation
C7
0.22 µF
Frequency stability
Danger of oscillation
C8
1
-----------------2πBR 1
D1D2
1N4001
let
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Upper frequency cutoff
Smaller bandwidth
To protect the device against output voltage spikes
Closed loop gain must be higher than 24 dB
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Larger than
recommanded value
22 kΩ
so
1.
Purpose
value
R1
R5
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Variations from recommended values
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Danger of oscillation
Larger bandwidth
TDA2030
Table 6.
Practical considerations
Single supply application
Recommanded
Component
Purpose
value
Larger than
Smaller than
recommanded value
recommanded value
R1
150 kΩ
Closed loop gain setting
Increase in gain
Decrease in gain(1)
R2
4.7 kΩ
Closed loop gain setting
Decrease in gain(1)
Increase in gain
R3
100 kΩ
Non-inverting input biasing
Increase of input
impedance
Decrease in input
Impedance
R4
1Ω
Frequency stability
Danger of oscillation at
high frequencies with
inductive loads
RA/RB
100 kΩ
Non-inverting input biasing
Poor high-frequency
attenuation
C1
1 µF
Input DC decoupling
C2
22 µF
Inverting DC decoupling
C3
0.1 µF
Supply voltage bypass
C5
100 µF
Supply voltage bypass
C7
0.22 µF
Frequency stability
C8
1
-----------------2πBR 1
Upper frequency cutoff
D1D2
1N4001
To protect the device against output voltage spikes.
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Smaller bandwidth
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Danger of oscillation
Increase in lowfrequency cutoff
Increase in lowfrequency cutoff
Danger of oscillation
Danger of oscillation
Danger of oscillation
Larger bandwidth
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1. Closed loop gain must be higher than 24 dB
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Short-circuit protection
5
TDA2030
Short-circuit protection
The TDA2030 has an original circuit which limits the current of the output transistors.
Figure 21 shows that the maximum output current is a function of the collector emitter
voltage; hence the output transistors work within their safe operating area (Figure 5).
This function can therefore be considered as being peak power limiting rather than simple
current limiting.
It reduces the possibility that the device gets damaged during an accidental short-circuit
from AC output to ground.
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Figure 21. Maximum output current vs.
Figure 22. Safe operating area and collector
voltage [VCEsat] across each output
characteristics of the protected
transistor
power transistor
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TDA2030
6
Thermal shutdown
Thermal shutdown
The presence of a thermal limiting circuit offers the following advantages:
1.
An overload on the output (even if it is permanent), or an above limit ambient
temperature can be easily supported since Tj cannot be higher than 150°C.
2.
The heatsink can have a smaller factor of safety compared with that of a conventional
circuit. There is no possibility of device damage due to high junction temperature. If for
any reason, the junction temperature increases to 150°C, the thermal shutdown simply
reduces the power dissipation at the current consumption.
The maximum allowable power dissipation depends upon the size of the external heatsink
(i.e. its thermal resistance); Figure 25 shows this power dissipation as a function of ambient
temperature for different thermal resistances.
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Figure 23. Output power and drain current vs. Figure 24. Output power and drain current vs.
case temperature (RL = 4 Ω)
case temperature (RL = 8 Ω)
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Thermal shutdown
TDA2030
Figure 26. Example of heatsink
Figure 25. Maximum allowable power
dissipation vs. ambient
temperature
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The following table shows the length that the heatsink in Figure 26 must have for several
values of Ptot and Rth.
Table 7.
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Recommended values of heatsink
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Dimension
Ptot
Pr
Recommended values
12
8
6
W
Length of heatsink
60
40
30
mm
Rth of heatsink
4.2
6.2
8.3
°C/W
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Unit
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TDA2030
7
Package mechanical data
Package mechanical data
Figure 27. Pentawatt (horizontal) package outline and dimensions
mm
DIM.
MIN.
inch
TYP.
MAX.
A
MIN.
4.80
C
0.188
1.37
0.054
2.40
2.80
0.094
0.11
D1
1.20
1.35
0.047
0.053
E
0.35
0.55
0.014
0.022
F
0.80
1.05
0.031
0.041
F1
1.00
1.40
0.039
0.055
G
3.20
3.40
3.60
0.126
0.134
0.142
G1
6.60
6.80
7.00
0.260
0.267
0.275
10.40
10.05
10.40
0.395
L
14.20
15.00
0.56
0.59
L1
5.70
6.20
0.224
0.244
L2
14.60
15.20
0.574
0.598
L3
3.50
4.10
0.137
2.60
3.00
0.102
0.118
L6
15.10
15.80
0.594
0.622
L7
6.00
6.60
0.236
0.260
2.10
2.70
0.083
0.106
4.30
4.80
0.170
0.189
DIA
3.65
3.85
0.143
(s)
L
Pr
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Pentawatt H
-O
0.151
C
A
D1
L1
E
L3
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L9
L10
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.161
0.05
L5
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0.409
1.29
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0.41
H3
L4
OUTLINE AND
MECHANICAL DATA
MAX.
D
H2
ete
TYP.
F
L2
L7
L5
L4
G
G1
H2
H3
F1
Resin between
leads
Dia.
L9
L6
L10
PENTHME.EPS
0015982
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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Revision history
8
TDA2030
Revision history
Table 8.
Document revision history
Date
Revision
June 1998
2
Second issue
3
Added Features on page 1
Removed Pentawatt (vertical) package option
Replaced Figure 27 with Pentawatt (horizontal) package data
Updated presentation of document, minor textual changes
21-Jun-2011
Changes
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Please Read Carefully:
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