TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC TQP887052 TABLE OF CONTENTS 1.0 Description 2.0 Product Block Diagram and Operation 3.0 Recommended Handset Schematic and Layout Considerations 3.1 DC Block Recommendations 3.2 Bypassing Recommendations 3.3 PC Board Layout 4.0 Pin Out Table 5.0 Application Board Information 6.0 Additional Supporting Data 7.0 Additional Information TQP887052 Application Board 1.0 DESCRIPTION This document describes the demonstration board for the TQP887052 Front-End Module (FEM) for IEEE802.11a/n/ac WLAN applications. It includes schematics, assembly drawings, Bill of Material (BOM) and board construction information. It also includes information on board losses and other information that could affect the performance of the TQP887052 with regards to comparisons with the Data Sheet specifications. Test data for the individual boards is included as a separate document or on CD. Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 1 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC 2.0 Product Block Diagram and Operation Please note that the Product Block Diagram presented here is for reference and discussion purposes and may not reflect the most up to date version included in the data sheet. Please refer to the data sheet document from the TriQuint web page for the most up to date information. PAEN TX SW_CTL PA ANT RX The TQP887052 combines many of the discrete components required for WLAN transmit and receive chains into a single module. The module contains a Power Amplifier (PA) and RF switch. The RF ports of the device are TX, ANT and RX. Each of these ports has been internally matched to 50 Ohms. However, some external matching may be required at each of the RF ports to optimize the overall system performance due to mismatch between the TQP887052 and the RF components following these ports. DC supplies and control signals for the PA are carried on VCC1, VCC2, and Vbat, SW_CTL and PAEN. The VCC pins provide the primary DC power supply for the PA. VCC1 provides DC supply pin of 1 and 2nd stage of PA, VCC2 is DC supply pin of 3rd stage of PA and Vbias provides DC supply of logic and switch, while PAEN enables operation of the PA. In normal operation, TX is connected to the RF output of a SoC. The manufacturer’s recommended matching network should be used so that the VSWR interaction between the TQP887052 and the SoC is minimized. The ANT port is connected to the handset antenna. The RX port is connected to the RX input of the SoC. Again, some matching adjustment may be necessary to get optimum performance from the complete TX and RX chain. VCC and Vbat lines are connected directly to the main power supply (battery or DC to DC converter). The SoC provides SW_CTL and PAEN. Please refer to the TQP887052 datasheet for further technical specifications. Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 2 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC 3.0 Recommended Handset Level Schematic and Layout Considerations The recommended handset level schematic for the TQP887052 is presented in this section. One bypass capacitors are required on Vbat and two on VCC1/2. These bypass capacitors should be placed as close to the FEM as possible to reduce supply line inductance. 3.1 DC Block Recommendations There is no external DC blocking capacitor for all RF ports (Internally DC blocked). 3.2 Bypassing Recommendations The supply voltage for the FEM is supplied externally through VCC1/2 and Vbat. Power supply bypassing on VCC1/2 and Vbat is accomplished by 3 surface mount capacitors (C1, C2, C3) and are placed as close to the FEM as possible. The control voltages are supplied externally though SW_CTL and PAEN. These pins do not require bypass capacitors but adding provisions for debug purposes is recommended. Values of the capacitors on control supply lines can be changed to meet dynamic switching speed requirement Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 3 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC during initial product development. 3.3 PC Board Layout 3.3.1 RF Layout and Calibration Losses RF layout is critical in achieving the specified performance of the TQP887052. Impedances of all the RF traces should be 50 . When determining device performance at the package pins using a connectorized PC board, the RF trace losses need to be subtracted from the measured data (Section 6.2). 3.3.2 Grounding Considerations Providing the FEM with proper grounding is required to ensure optimal performance. It is important to maintain a solid/uninterrupted ground beneath the FEM and ensure the ground vias connect to “True Ground”. Depending on the type of design, the location of “True Ground” can be different. Do not run signal traces or supply lines beneath the FEM ground. Below are high level descriptions of two different designs – Module and Mobile Device PCB: Module Based Design In a “Module Based Design”, the WLAN System (FEM and SoC) is mounted on a separate PCB which is then mounted onto the final product (Mobile Device PCB). The FEM on the module will not see a “True Ground” until the ground vias make contact to the ground layer of the Mobile Device PCB as illustrated below. FEM Ground VIAs Bypass Caps and Ground Slug Uninterrupted Connection to Module Bottom Layer SoC Module Mid Layer Ground Not a “True Ground” FEM Module Bottom Layer Ground is Considered to be “True Ground” Connection Point to Mobile Device PCB WiFi Radio Module PCB Mobile Device PCB Mobile Device PCB Grounds Depending on Design - May be Middle layer or Bottom Layer Mobile Device PCB Design In a “Mobile Device PCB Design”, the WLAN System is mounted directly onto the final product (Mobile Device PCB). The FEM will see a “True Ground” when the ground vias connect to the Mobile Device PCB ground layer. Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 4 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC FEM Ground VIAs Bypass Caps and Ground Slug Uninterrupted Connection to Mobile Device PCB Ground SoC FEM Mobile Device PCB “True Ground” Depending on Design - May be Middle layer or Bottom Layer WiFi Radio Mounted Directly onto Mobile Device PCB 3.3.3 Footprint Recommendations This section provides footprint information based on package dimensions. Detailed package dimensions can be found in the TQP887052 Datasheet. Top Layer – Metal Layer (in mm) 1.600 +/- 0.050 0.200 +/- 0.050 1.600 +/-0.050 0.475 +/- 0.050 Top Layer – Solder Mask and Stencil (in mm) Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 5 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC 1.130 +/-0.050 (Square) 1.700 +/- 0.050 0.300 +/- 0.050 1.700 +/-0.050 0.575 +/- 0.050 Solder Stencil: 100% Pad, 50% Ground Slug Solder Mask 4.0 Pinout Table Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 6 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 7 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC 5.0 Application Board Information The TriQuint Application board has been designed to provide performance as close as possible to the actual system level performance. Assembly drawings and layer stack up are included here to illustrate layout practices that will help ensure superior performance in a handset board application. Further assistance may be requested from TriQuint Application Engineering. 5.1 Application Board Schematic J4 SW_CTRL PA_EN VCC Vbat VCC C12 4.7uF C11 C7 DNI C8 DNI C3 C2 100nF 2.2uF 4.7uF J1 U1 GND VCC1 VCC2 NC J2 R1 GND ANT GND SW_CTL 0 VBAT GND RX GND TX GND PA_EN GND C9 PA_EN SW_CTRL Vbat C4 C5 DNI C10 DNI TQP887052 C6 DNI DNI C1 DNI 100nF J3 5.2 Applications Board Bill of Material (BOM) Component Reference Designator Value Size Quantity Part Number FEM Capacitor Capacitor Capacitor Capacitor U1 C1,C3 C3 C4 C11,12 0201 0402 0201 0402 1 2 1 1 1 TQP887052 0.1uF 2.2uF DNI 4.7uF Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 8 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC Resistor Capacitor R1, C5,C6,C7,C8,C9,C10 0 Ohm DNI Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 0201 1 9 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC 5.3 Application Board Silkscreen and Top Assembly Drawing Silkscreen Top Assembly Drawing Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 10 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC 6.0 Additional Supporting Data 6.1 Truth Table for Various Modes Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 11 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC 6.2 PC Board Offset The following are the offsets (5.5GHz) that can be used for the TriQuint application board as mentioned in section 3.3.1. MEASUREMENT OFFSET RX port Insertion Loss 0.21dB TX port Insertion Loss 0.25dB Antenna port Loss 0.25dB Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 12 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC 7.0 Additional Information For technical questions and application information: Please contact TriQuint Application Engineering Team Additional Information 1 1 For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Tel: (503) 615-9000 Email: info_wireless@tqs.com Fax: (503) 615-8902 For technical questions and additional information on specific applications: Email: info_wireless@tqs.com The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 13 TQP887052 Application Note Application Note for TQP887052 5GHz 802.11a/n/ac FEM MMIC circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright © 2006 TriQuint Semiconductor, Inc. All rights reserved. Application Note: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Revision C, February 15, 2013 © 2013 TriQuint 14