














28-pin Thin TSSOP
4.4 mm x 9.7 mm Body
0.65 mm Pitch
31 NBO
32 NBO
33 NBO
34 NBO
35 NBO
36 NBO
37 SERIRQ
39 ATest
40 ATest
28-pin TSSOP
6.1 mm x 9.7 mm Body
0.65 mm Pitch
38 LPCPD#
40-pin QFN
6.0 mm x 6.0 mm Body
0.50 mm Pitch
ATest
1
28 LPCPD#
ATest
1
30 LAD0
ATest
2
27 SERIRQ
GND
2
29 GND
ATest
3
26 LAD0
SB3V
3
28 VCC
GPIO6
4
27 LAD1
NC
5
26 LFRAME#
TestI
6
25 LCLK
TestBI
7
24 LAD2
7
22 LFRAME#
TestI
8
21 LCLK
VCC
8
23 VCC
TestBI
9
20 LAD2
GND
9
22 GND
VCC 10
GND 11
19 VCC
NBO 10
21 LAD3
NBO 12
NBO 13
17 LAD3
NBO 14
15 CLKRUN#
18 GND
16 LRESET#
LRESET# 20
NC
CLKRUN# 19
23 LAD1
NBO 18
6
NBO 17
GPIO6
NBO 16
24 VCC
NBO 15
5
NBO 14
SB3V
NBO 13
25 GND
NBO 12
4
NBO 11
GND
b
L
L1
E
E1
e
A
D
A2
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
1.
2.
3.
4.
Dimension "D" does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions and gate burrs shall not exceed
.15mm (.006 in) per side.
Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed .25mm (.010 in)
per side.
Dimension 'b' does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08 mm total in excess of the 'b'
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
Dimension 'D' and 'E1' to be determined at Datum Plane H.
D
MIN
NOM
MAX
NOTE
9.60
9.70
9.80
1,4
4.50
2,4
E
E1
6.40 BSC
4.30
4.40
A
1.20
A2
0.80
b
0.19
e
L
L1
1.00
1.05
0.30
0.45
0.60
0.75
1.00 REF
This drawing is for general information only. Please refer to
JEDEC Drawing MO-153, Variation AE for additional information.
Package Drawing Contact:
packagedrawings@atmel.com
TITLE
28A2, 28-lead, 4.4x9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
3
0.65 BSC
6/17/08
GPC
TFL
DRAWING NO.
REV.
28A2
B
b
L
L1
E E1
e
End View
Top View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
D
D
A
A2
NOM
MAX
NOTE
9.70
9.80
2, 5
6.10
6.20
3, 5
E
E1
Side View
MIN
9.60
8.10 BSC
6.00
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
e
L
L1
Note: 1.
2.
3.
4.
5.
R
4
0.65 BSC
0.45
0.60
0.75
1.00 REF
This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional
information.
Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of
the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07 mm.
Dimension D and E1 to be determined at Datum Plane H.
1/8/02
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
REV.
28A3
A
A
D
A1
N
A2
A3
1
2
Pin 1 Indicator
3
E
Top View
L
0
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
D2
SYMBOL
MIN
D
E2
2
b
1
N
Bottom View
2.
R
4.10
4.25
E2
3.95
4.10
4.25
A
-
0.85
0.90
A1
0.0
0.01
0.05
A2
-
0.65
0.70
0.20 REF
0.30
e
PIN1 ID
Note: 1.
3.95
L
b
NOTE
6.00 BSC
D2
A3
e
MAX
6.00 BSC
E
3
NOM
0.40
0.50
0.50 BSC
0.18
0.23
0.30
2
This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper
dimensions, tolerances, datums, etc.
Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal
tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be
measured in that radius area.
9/27/07
2325 Orchard Parkway
San Jose, CA 95131
TITLE
40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded
Quad Flat No Lead Package (QFN) Punched
DRAWING NO.
REV.
40ML1
C
Mouser Electronics
Authorized Distributor
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