ZXTN08400BFF
400V NPN MEDIUM POWER HIGH VOLTAGE TRANSISTOR IN SOT23F
Features
Mechanical Data
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
BVCEX > 450V
BVCEO > 400V
BVECO > 6V
IC = 0.5A Continuous Collector Current
Low Saturation Voltage VCE(SAT) < 175mV @ 500mA
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1.5W Power Dissipation
Complementary PNP Type: ZXTP08400BFF
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability



Case: SOT23F
Case Material: Molded Plastic. ―Green‖ Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.012 grams (Approximate)
Description
Applications
This NPN transistor has been designed for applications requiring high
voltage blocking. The SOT23F package is pin compatible with the
industry standard SOT23 foot print but offers lower profile and higher
power dissipation for applications where power density is of utmost
importance.



High Voltage
Low Saturation Voltage
Low Profile Small Package Outline
C
SOT23F
E
B
C
B
E
Top View
Device Symbol
Top View
Pin Configuration
Ordering Information (Note 4)
Product
ZXTN08400BFFTA
Notes:
Compliance
AEC-Q101
Marking
1D5
Reel Size (inches)
7
Tape Width (mm)
8
Quantity per Reel
3,000
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
1D5
ZXTN08400BFF
Document number: DS33675 Rev. 2 - 2
YW
SOT23F
1D5 = Product Type Marking Code
YW = Date Code Marking
Y = Year : 0~9
W = Week : A~Z : 1~26
a~z : 27~52
z represents 52 & 53 week
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Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage (Forward Blocking)
Collector-Emitter Voltage
Emitter-Collector Voltage (Reverse Blocking)
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current
Symbol
VCBO
VCEX
VCEO
VECO
VEBO
IC
ICM
IB
Value
450
450
400
6
7
0.5
1
0.2
Unit
V
V
V
V
V
A
A
A
Value
0.84
6.72
1.34
10.72
1.5
12
2
16
149
93.4
83.3
60
43.8
-55 to +150
Unit
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
(Note 5)
Power Dissipation
Linear Derating Factor
(Note 6)
PD
(Note 7)
(Note 8)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and Storage Temperature Range
(Note 5)
(Note 6)
(Note 7)
(Note 8)
(Note 9)
RθJA
RθJL
TJ, TSTG
W
mW/°C
°C/W
°C/W
°C
ESD Ratings (Note 10)
Characteristic
Electrostatic Discharge – Human Body Model
Electrostatic Discharge – Machine Model
Notes:
Symbol
ESD HBM
ESD MM
Value
4,000
400
Unit
V
V
JEDEC Class
3A
C
5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR-4 PCB; device is measured
under still air conditions whilst operating in a steady-state.
6. Same as Note 5, except the device is mounted on 25mm x 25mm 2oz copper.
7. Same as Note 5, except the device is mounted on 50mm x 50mm 2oz copper.
8. Same as Note 7, whilst measured at t < 5 seconds.
9. Thermal resistance from junction to solder-point (at the end of the collector lead).
10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
ZXTN08400BFF
Document number: DS33675 Rev. 2 - 2
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Thermal Characteristics and Derating Information
50mm x 50mm FR-4, 2oz Cu
IC Collector Current (A)
IC Collector Current (A)
1m
VCE(SAT)
1 Limited
100μ
100
100m
DC
1s
100ms
10m
10ms
Single Pulse
o
T AMB=25 C
1m
100m
1ms
100s
1
10
10μ
10
1μ
1
BV(BR)CEX=450V
o
T AMB=25 C
100
0
VCE Collector-Emitter Voltage (V)
200
300
400
o
80
T AMB=25 C
70 50mm x 50mm FR-4
2oz Cu
60
50
D=0.5
40
30
D=0.2
Single Pulse
20
D=0.05
10
0
100μ
100
D=0.1
1m
10m 100m
1
10
500
600
700
Safe Operating Area
Maximum Power (W)
o
Thermal Resistance ( C/W)
100
VCE Collector-Emitter Voltage (V)
Safe Operating Area
100
Single Pulse
o
T AMB=25 C
100
1k
Pulse Width (s)
50mm x 50mm FR-4
2oz Cu
10
1
100μ
100
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
Max Power Dissipation (W)
Failure may occur
in this region
BV(BR)CEO=400V
Pulse Power Dissipation
1.6
1.4
50mm x 50mm FR-4, 2oz Cu
1.2
25mm x 25mm FR-4
2oz Cu
1.0
0.8
0.6
0.4
0.2
0.0
15mm x 15mm FR-4, oz Cu
0
20
40
60
80
100 120 140 160
o
Temperature ( C)
Derating Curve
ZXTN08400BFF
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Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
(Forward Blocking)
Collector-Emitter Breakdown Voltage
(Base Open) (Note 11)
Emitter-Base Breakdown Voltage
Emitter-Collector Breakdown Voltage
(Reverse Blocking)
Emitter-Collector Breakdown Voltage
(Base Open)
Symbol
Min
Typ
Max
Unit
BVCBO
450
550
—
V
BVCEX
450
550
—
V
BVCEO
400
500
—
V
IC = 10mA
BVEBO
7
8.1
—
V
BVECX
6
8
—
V
IE = 100µA
IE = 100µA, RBC≤1kΩ or
-0.25V < VBC < 0.25V
BVECO
6
8.5
—
V
IE = 100µA
Collector-Base Cutoff Current
ICBO
—
<1
—
50
20
nA
µA
Collector-Emitter Cutoff Current
ICEX
—
<1
100
nA
Emitter-Base Cutoff Current
ON CHARACTERISTICS (Note 11)
IEBO
—
<1
50
nA
VCB = 360V
VCB = 360V, TA = +100°C
VCE = 360V, RBE≤1kΩ
-1V < VBE < 0.25V
VEB = 5.6V
Static Forward Current Transfer Ratio
hFE
90
100
10
165
180
20
300
—
Collector-Emitter Saturation Voltage
VCE(SAT)
—
70
50
120
125
85
70
170
175
mV
Base-Emitter Saturation Voltage
Base-Emitter On Voltage
SMALL SIGNAL CHARACTERISTICS (Note 11)
VBE(SAT)
VBE(ON)
—
—
865
800
950
900
mV
mV
Transition Frequency
fT
—
40
—
MHz
Output Capacitance
Delay Time
Rise Time
Storage Time
Fall Time
COBO
tD
tR
tS
tF
—
—
—
—
—
8
100
52
3122
240
10
—
—
—
—
pF
ns
ns
ns
ns
Note:
Test Condition
IC = 100µA
IC = 100µA, RBE≤1kΩ or
-1V < VBE < 0.25V
IC = 1mA, VCE = 5V
IC = 50mA, VCE = 5V
IC = 500mA, VCE = 5V
IC = 20mA, IB = 1mA
IC = 50mA, IB = 5mA
IC = 300mA, IB = 30mA
IC = 500mA, IB = 100mA
IC =500mA, IB = 100mA
IC = 500mA, VCE = 10V
IC = 10mA, VCE = 20V,
f = 20MHz
VCB = 20V, f = 1MHz
VCC = 100V,
IC = 100mA,
IB1 =10mA
IB2 = -20mA
11. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.
ZXTN08400BFF
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Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
3.0
o
T AMB=25 C
IC/IB=20
100m
IC/IB=10
10m
o
150 C
2.0
o
100 C
1.5
o
25 C
1.0
0.5
IC/IB=5
10m
1m
IC/IB=10
2.5
IC/IB=50
VCE(SAT) (V)
VCE(SAT) (V)
1
o
100m
-55 C
0.0
10m
1
IC Collector Current (A)
100m
VCE(SAT) v IC
1.4
1.2
1.0
0.8
280
240
o
100 C
200
160
o
25 C
0.6
0.4
120
80
o
-55 C
0.2
40
0.0
1m
10m
100m
0
1
IC/IB=10
320
o
25 C
0.6
o
150 C
0.4
0.2
1m
IC Collector Current (A)
o
100 C
10m
100m
IC Collector Current (A)
VBE(SAT) v IC
hFE v IC
1.0
o
-55 C
0.8
VBE(SAT) (V)
150 C
1.0
360
Typical Gain (hFE)
Normalised Gain
1.6
VCE(SAT) v IC
VCE=10V
o
1
IC Collector Current (A)
VCE=10V
o
-55 C
o
25 C
VBE(ON) (V)
0.8
0.6
o
0.4
150 C
o
100 C
0.2
1m
10m
100m
1
IC Collector Current (A)
VBE(ON) v IC
ZXTN08400BFF
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23F
D
c
b
L1
E1
E
b
e1
A1
e
R
L
A
k
SOT23F
Dim Min
Max
Typ
A
0.80 1.00
0.90
A1
0.00 0.10
0.01
b
0.35
0.50
0.44
c
0.10
0.20
0.16
D
2.80
3.00
2.90
e
0.95 REF
e1
1.90 REF
E
2.30
2.50
2.40
E1
1.50
1.70
1.65
k
1.20
L
0.30
0.65
0.50
L1
0.30
0.50
0.40
R
0.05
0.15
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23F
X
C
Dimensions
C
X
Y
Y1
Y1
Value
(in mm)
0.95
0.80
1.110
3.000
Y
ZXTN08400BFF
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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