HI-8190, HI-8191, HI-8192
12W, Quad, SPST, 3.3V / 5.0V compatible
Analog Switch
December 2013
GENERAL DESCRIPTION
FEATURES
The HI-8190 is a quad analog CMOS switch fabricated with Silicon-on-Insulator (SOI) technology for latch-up free operation
and maximum switch isolation. The switch voltages can range
from bipolar ± 3.3V to ± 15V or single ended from 3.3V to 15V.
The logic supply can range from 3.3V to 5.0V. The HI-8190 provides four each normally open switches when the switch control
inputs are Low. The HI-8191 provides four each normally
closed switches when the switch control inputs are Low. The HI8192 provides a combination of two normally On and two normally Off switches. The limits of the operating range are defined by the V+/V- bias voltage.
· ± 3.3V to ± 15V CMOS analog switches
On-resistance of each switch depends upon only the VLOGIC
selection. At 5V, RON ranges from 10W to 17W while at 3.3V supply RON ranges from 10W to 22W. Each switch is designed using
back to back high voltage transistors. Switch transistors are
symmetrical and conduct equally well in either direction. Signal
range can run the full rails. Off leakages are very low (1 nA typical) and charge injection is less than 3 pC. Switch ESD tolerance is greater than 4 KV.
· Low RON: 12 W to 15 W typical
· Robust CMOS Silicon-on-Insulator (SOI) technology
· SOI switch isolation with 1nA typical Off leakage
· Superior ESD protection > 4KV HBM
· Fast switching time with break-before-make
· Low power
· Extended Temperature Range (-55°C to +125°C)
PIN CONFIGURATIONS (Top Views)
IN1 1
16 IN2
S1A 2
15 S2A
S1B 3
14 S2B
V- 4
13 V+
GND 5
12 VLOGIC
S4B 6
11 S3B
S4A 7
10 S3A
IN4 8
9 IN3
Industry-standard plastic package options include 16-pin
TSSOP, SO, DIP and 16-pin QFN. Ceramic packaging is available on request. All three products are offered in both Industrial
(-40°C to +85°C) and extended (-55°C to +125°C) temperature
range options.
14 IN2
13 S2A
16 S1A
HI-8190PSx, HI-8190PDx
16-Pin SO or DIP package
15 IN1
The Off state is achieved first before any On condition is applied. Switching times with a 3.3V VLOGIC supply are typically
35 ns to the On state and 20 ns to the Off state.
S1B 1
12 S2B
V- 2
11 V+
GND 3
10 VLOGIC
S4B 4
· Data bus isolation
· Sample-and-Hold circuits
IN3 7
S3B
S3A 8
IN4 6
S4A 5
APPLICATIONS
9
HI-8190PCx
16-pin 5mm x 5mm Chip-scale package
· Test Equipment
· Communications Systems
· Battery operated Systems
· PBX, PABX
· Audio Signal Routing
· Data Acquisition Systems
· xDSL Modems
· Avionics
(DS8190 Rev. C)
PRODUCT OPTIONS
PART TYPE IN1
HI-8190
0
1
HI-8191
0
1
HI-8192
0
1
HOLT INTEGRATED CIRCUITS
www.holtic.com
Switch 1
Open
Closed
Closed
Open
Open
Closed
IN2
0
1
0
1
0
1
Switch 2
Open
Closed
Closed
Open
Closed
Open
IN3
0
1
0
1
0
1
Switch 3
Open
Closed
Closed
Open
Closed
Open
IN4
0
1
0
1
0
1
Switch 4
Open
Closed
Closed
Open
Open
Closed
12/13
HI-8190, HI-8191, HI-8192
PIN DESCRIPTIONS
SIGNAL
FUNCTION
IN1
S1A
S1B
VGND
S4B
S4A
IN4
IN3
S3A
S3B
VLOGIC
V+
S2B
S1B
IN2
Logic Input
Switch Node
Switch Node
Supply
Supply
Switch Node
Switch Node
Logic Input
Logic Input
Switch Node
Switch Node
Supply
Supply
Switch Node
Switch Node
Logic input
DESCRIPTION
HI-8190 and HI-8192 are normally Open when input Low
Switch 1 Node
Switch 1 Node
Negative supply for Bipolar configuration. GND for Unipolar use
Reference Ground
Switch 4 Node
Switch 4 Node
HI-8190 and HI-8192 are normally Open when input Low
HI-8191 and HI-8192 are normally Closed when input Low
Switch 3 Node
Switch 3 Node
3.3V or 5.0V Logic supply
Positive supply for Bipolar and Unipolar configurations
Switch 2 Node
Switch 2 Node
HI-8191 and HI-8192 are normally Closed when input Low
24W
24W
22W
18W
16W
VLOGIC = 5.0V
18W
T = +25°C
16W
T = -55°C
14W
14W
12W
12W
10W
10W
8W
-15V
-10V
-5V
T = +125°C
20W
RON
RON
20W
22W
VLOGIC = 3.3V
0V
5V
10V
15V
8W
-15V
-10V
VSWITCH
Typical RON as a function of VLOGIC and VSWITCH
(10mA switch current, 25°C)
-5V
0V
VSWITCH
5V
10V
Typical RON as a function of VSWITCH and
Temperature (10mA switch current)
VLOGIC = 5V
HOLT INTEGRATED CIRCUITS
2
15V
HI-8190, HI-8191, HI-8192
VDD = 3.3V
1.00E-06
Leakage (A)
1.00E-07
125C
1.00E-08
85C
25C
-55C
-40C
1.00E-09
10
11
12
13
14
15
Vswitch (V)
Switch leakage vs switch voltage as a function of temperature at Vdd = 3.0V
VDD = 5.0V
Leakage (A)
1.00E-07
125C
1.00E-08
85C
25C
-40C
1.00E-09
10
11
12
13
14
Vswitch (V)
Switch leakage vs switch voltage as a function of temperature at Vdd = 5.0V
HOLT INTEGRATED CIRCUITS
3
15
HI-8190, HI-8191, HI-8192
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND = 0V)
Supply Voltage, V+: ............................................................................16.5V Continuous Power Dissipation (TA=70°C):
Supply Voltage, V-:.............................................................................-16.5V
SO Package (derate 6.7mW/°C above 70°C)...................696mW
Supply Volgate, VLOGIC .........................................................................5.5V
Plastic DIP (derate 10.53 mw/°C above 70°C) .................842mW
Switch Current (either direction, DC): .................................................20mA
Thin QFN (derate 21.3mW/°C above 70°C) ...................1702mW
Peak Switch Current (1 ms pulse, 10% duty cycle max.)..................100mA
Digital Input Voltage (IN1-4):.....................................-0.3V to VLOGIC + 0.3V Storage Temperature Range: ......................................-65°C to +150°C
Operating Temperature Range: (Industrial)..........................-40°C to +85°C
(Hi-Temp) ........................-55°C to +125°C
Soldering Temperature:
(Ceramic)......................60 sec. at +300°C
(Plastic - leads).............10 sec. at +280°C
(Plastic - body) .....................+260°C Max.
Maximum Junction Temperature ........................................................175°C
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
V+ = 15V, V- = -15V, GND = 0V. Operating temperature range (unless otherwise noted).
VLOGIC = 3.3V
PARAMETER
SYMBOL
CONDITIONS
FIGURE
MIN
TYP
MAX
VLOGIC = 5.0V
MIN
TYP
MAX
UNIT
SWITCH PARAMETERS
Switch Signal Range
Switch Resistance
Leakage
VRANGE
-15
+15
V
10
8
17
20
W
W
5
5
nA
2
20
20
nA
2
150
150
nA
RON
25°C, 10mA
-55°C to +125°C, 10mA
1
1
|ISWLEAK|
Switch voltage ± 15V, 25°C
2
|ISWLEAK|
Switch voltage ± 15V, 125°
|ISWLEAK|
Switch voltage ± 15V, -55°C
10
8
22
26
LOGIC INPUTS
Input High Voltage
VIH
70
70
%VLOGIC
Input Low Voltage
VIL
Input Current
IIN
VIN = 0V or VIN=VLOGIC
VLOGIC Current
IDD1
Any state
0.5
0.5
µA
V+ Current
IDD2
Any state
0.5
0.5
µA
V- Current
IEE
Any state
TON
V+/V- = ±10V, 25°C
VS = ±10V, -55°C to +125°C
3
3
55
V+/V- = ±10V, 25°C
VS = ±10V, -55°C to +125°C
3
3
35
10V signal, 25°C
10V signal, -55°C to +125°C
4
4
30
-0.5
0.5
30
-0.5
0.5
%VLOGIC
µA
SUPPLY
-0.5
µA
-0.5
DYNAMIC PARAMETERS
Turn On Time
Turn Off time
Break-Before-Make Time
TOFF
TD
35
75
ns
ns
25
ns
ns
20
40
8
4
55
8
ns
ns
4
Charge Injection
Q
VS=0V, RS=0W, 25°C
5
4
4
pC
Off Isolation
RR
f = 1 MHz, 25°C
6
65
65
dB
Crosstalk
CR
f = 1 MHz, 25°C
7
90
90
dB
COFF
CON
Switch Off, 25°C
Switch On, 25°C
8
9
5
20
5
20
pF
pF
Capacitance
HOLT INTEGRATED CIRCUITS
4
HI-8190, HI-8191, HI-8192
TEST CIRCUITS
IDS
V1
SA
VS
+
-
RON = V1/IDS
+
-
VS
Figure 1 - On Resistance
+5V
0.1µF
0.1µF
VIN (HI-8191)
V+
SA
VD
+
-
Figure 2 - Off Leakage
+15V
VLOGIC
ID(OFF)
SB
A
IS(OFF)
SA
A
SB
50%
50%
50%
50%
VIN (HI-8190)
SB
VOUT
IN
VS
GND
+
-
90%
300W
35pF
V-
50%
VOUT
0.1µF
-15V
t ON
t OFF
Figure 3. Switching Times
0.1µF
+5V
+15V
VLOGIC
V+
0.1µF
5V
VIN
50%
50%
0V
VS1
VS2
S1A
S1B
S2A
S2B
IN
VOUT1
VOUT2
35pF
GND
V-
35pF
0.1µF
90%
50%
VOUT1
300W
300W
90%
VOUT2
50%
-15V
tD
Figure 4. Break-Before-Make Time Delay (HI-8192)
HOLT INTEGRATED CIRCUITS
5
tD
HI-8190, HI-8191, HI-8192
RS
+5V
+15V
VLOGIC
V+
SA
SB
VOUT
VIN
IN
VS
GND
+
-
CL
10nF
V-
DVOUT
VOUT
-15V
QINJ = CL x DVOUT
Figure 5. Charge Injection
0.1µF
0.1µF
+5V
+15V
VLOGIC
0.1µF
+15V
VLOGIC
V+
SA1
V+
SA
+5V
SB
VOUT
0.1µF
SB1
50W
IN1
VS
IN
IN2
GND
50W
V-
VS
0.1µF
SB2
VOUT
50W
-15V
SA2
GND
NC
V0.1µF
-15V
Figure 7 - Channel-to-Channel Crosstalk
Figure 6 - Off Isolation
0.1µF
+5V
+15V
VLOGIC
V+
SA
Capacitance
Meter
f=1MHz
0.1µF
0.1µF
SB
+15V
VLOGIC
V+
SA
Capacitance
Meter
f=1MHz
IN
GND
+5V
V-
SB
VS
IN
GND
V-
0.1µF
0.1µF
-15V
-15V
Figure 8 - Off Capacitance
Figure 9 - On Capacitance
HOLT INTEGRATED CIRCUITS
6
0.1µF
HI-8190, HI-8191, HI-8192
FREQUENCY RESPONSE
Figure 10 shows a typical frequency response.
Frequency Response
0.0
-1.0
LOSS (dB)
-2.0
-3.0
-4.0
-5.0
-6.0
-7.0
0
1
10
Frequency (MHz)
Figure 10. Frequency Response.
HOLT INTEGRATED CIRCUITS
7
100
HI-8190, HI-8191, HI-8192
ORDERING INFORMATION
HI - 819x xx x x
PART
NUMBER
Blank
F
PART
NUMBER
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free, RoHS compliant)
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
I
NO
T
-55°C TO +125°C
T
NO
M
-55°C TO +125°C
M
YES
PART
NUMBER
PACKAGE
DESCRIPTION
PC
16 PIN PLASTIC 5x5 mm CHIP SCALE (16PCS1) (No M-flow, Pb-free only)
PS
16 PIN PLASTIC NARROW BODY SOIC (16HN)
PD
16 PIN PLASTIC DIP (16P)
PART
NUMBER
FUNCTION
8190
QUAD SWITCH, NORMALLY OPEN
8191
QUAD SWITCH, NORMALLY CLOSED
8192
QUAD SWITCH, TWO NORMALLY OPEN, TWO NORMALLY CLOSED
HOLT INTEGRATED CIRCUITS
8
HI-8190, HI-8191, HI-8192
REVISION HISTORY
P/N
Rev
DS8190 New
A
B
C
Date
10/26/11
12/12/11
09/26/12
12/05/13
Description of Change
Initial release
Update DC and Peak switch current values in maximum ratings. Clarify QFN available only
in Pb-free.
Add frequency response curve.
Add leakage vs switch voltage as a function of temperature curves. Update package
drawings.
HOLT INTEGRATED CIRCUITS
9
HI-8190 PACKAGE DIMENSIONS
millimeters (inches)
16-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
0.175 ± 0.075
(0.007 ± 0.003)
9.90
(0.390) BSC
6.00
(0.236) BSC
Top View
Package Type: 16HN
3.90
(0.154) BSC
See Detail A
0.410 ± 0.100
(0.016 ± 0.004)
1.25
(0.049) min
1.27
BSC
(0.050)
0° to 8°
0.175 ± 0.075
(0.007 ± 0.003)
0.835 ± 0.435
(0.033 ± 0.017)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Detail A
millimeters (inches)
16-PIN PLASTIC CHIP-SCALE PACKAGE
Package Type: 16PCS1
5.00
BSC
(0.197)
5.00
BSC
(0.197)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
3.355 ± 0.075
(0.132 ± 0.003)
3.355 ± 0.075
(0.132 ± 0.003)
Top View
Bottom
View
0.50 ± 0.050
(0.0197 ± 0.002)
1.00
(0.039)max.
.203
(0.008)typ.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
10
0.80
BSC
(0.031)
0.30 ± 0.050
(0.012 ± 0.002)
HI-8190 PACKAGE DIMENSIONS
16-PIN PLASTIC DUAL IN-LINE PACKAGE (PDIP)
(300mil Body)
inches (millimeters)
Package Type: 16P
.255
BSC
(6.48)
.300
BSC
(7.62)
.100 BSC
(2.54)
0.755
BSC
(19.18)
.150 ± .020
(3.81 ± .508)
.011 ± .002
(.279 ± .051)
.130 ± .010
(3.302 ±.254)
.028 ± .013
(.711 ± .330)
.058 ± .013
(1.473 ± .330)
.018 ± .002
(.457 ± .051)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
11
.345 ± .035
(8.763 ± .889)