Product Brief August 2002
SST25 Series SPI Serial Flash
Make Obsolescence Obsolete!
The Breakthrough Flash with a
Clear Migration Path.
Take your flash designs to the next level with the
new SST SPI Serial Flash. With our split-gate
cell design, thick oxide tunneling, and patented,
high-performance CMOS SuperFlash ® technology,
SST’s family of SPI Serial Flash has the performance,
capacity, and flexibility to handle the most demanding
consumer, industrial and computing applications.
Better still, SPI Serial Flash gives you a clear
migration path using the same footprint from
512 Kbits to 16 Mbits—and you can add new
features and capabilities to your products without
costly, time-consuming redesigns.
Fast In-Application (In-field) Updates.
A fast <100 ms typical 4 KByte re-write time
@ 20 MHz allows faster and more efficient memory
updates in the field.
Upgrade Compatibility.
All SST SPI Serial Flash devices, from 512 Kbits to
16 Mbits, share the same footprint. Which means
you can create an entire family of products, with
different capabilities and densities, without costly,
time-consuming redesigns.
Migration from 512 Kb to 16 Mb
Improved Manufacturability.
SST’s Auto Address Increment (AAI) programming
enables fast and easy programming on the
production line.
–8-lead SOIC & low profile 8-contact
WSON
∆ Operating Voltage
–Single 2.7-3.6V Read and Write operations
∆ Serial Interface Architecture
–SPI Compatible: Mode 0 and Mode 3
∆ Continuous Byte Read Operation with
Wrap-around Feature
–8 µA (typical)
∆ Flexible Erase Capability
–4 KByte uniform Sector-Erase
–32 KByte Block-Erase
–Chip-Erase
Fast Access Times.
Smaller and more efficient SPI Serial Flash delivers
lightning-fast 20 MHz performance in the 512 Kbit to
4 Mbit densities and 33 MHz in 8 Mbit and 16 Mbit
densities to handle the most demanding applications.
Greater Reliability.
With traditional flash, repeated Erase cycles
eventually damage cell insulators and degrade data
retention. Our proven CMOS SuperFlash technology
and nearly 4X thicker insulators boost data retention
and endurance.
∆ Small Footprint
∆ Low Standby Current
Lower Overall System Costs.
With its small footprint and economical 8-pin
packages, SPI Serial Flash gives you a lower pin
count, saves board space, and keeps your system
overhead down.
Reduced Power Consumption.
SPI Serial Flash uses far less energy than alternative
approaches, especially during intensive Erase and
Program cycles, allowing you to build cooler running,
more portable, and less power hungry designs.
Key Features
∆ Fast Sector-Erase or Block-Erase Time
–18 ms (typical)
With the same footprint from the lowest to the highest density,
SST SPI Serial Flash lets you add capabilities and introduce
new generations of products without starting from scratch.
Added Value for All Applications.
SST SPI Serial Flash increases the functionality and
value for all applications that require a fast download of
code. It’s ideal for consumer applications such as video
game memory cards, electronic toys, cordless phones,
and electronic books. In industrial applications, it’s
perfect for handheld terminals, medical monitors,
industrial controllers, and data loggers and recorders.
And in computing, it’s the optimum solution for optical
and hard disk drives and graphics cards.
For additional information, contact your SST
sales representative or visit our web site at
www.SuperFlash.com. And get on the fast migration
path to higher densities with SPI Serial Flash.
∆ Auto Address Increment (AAI)
Programming for Fast Production
Throughput
∆ Hardware Write Protection through WP#
SST25 Series SPI Serial Flash
SST25 Series SPI Serial Flash Product Selector
Device
SST25VF512
SST25VF010
SST25VF020
SST25VF040
SST25VF080
SST25VF016
Density
Voltage
512 Kb (64Kx8)
1 Mb (128Kx8)
2 Mb (256Kx8)
4 Mb (512Kx8)
8 Mb (1024Kx8)
16 Mb (2048Kx8)
2.7-3.6V
2.7-3.6V
2.7-3.6V
2.7-3.6V
2.7-3.6V
2.7-3.6V
Clock Frequency
20
20
20
20
33
33
Packages
MHz
MHz
MHz
MHz
MHz
MHz
SOIC-8, WSON-8
SOIC-8, WSON-8
SOIC-8, WSON-8
WSON-8
SOIC-8, WSON-8
WSON-8
Packaging Diagram
Packaging Diagram
8-Lead Small Outline Integrated
Circuit (SOIC)
SST Package Code SA
8-Contact Ultra-Thin Small
Outline No-Lead (WSON)
SST Package Code QA
Pin #1
Identifier
Side View
Top View
7˚
4 places
Side View
Top View
Bottom View
0.25
0.19
Pin #1
Corner
Pin #1
1.27 BSC
0.51
0.33
5.0
4.8
4.00
5.00
BSC
0.076
1.27 BSC
3.40
0.48
0.35
End View
45˚
4.00
3.80
0.25
0.10
6.20
5.80
1.75
1.35
7˚
4 places
0.25
0.19
0.05 Max
6.00
BSC
0.75
0.50
0.8
0.7
Cross Section
0˚
0.8
0.7
8˚
1.27
0.40
Pin Description
Recommended Solder Pattern
For SOIC and WSON
[Approximate 1:1 Ratio]
6.00
WSON Note: 1. All linear dimensions are in millimeters (max/min).
SOIC Note:
4.00
3.40
1. SOIC Complies with JEDEC publication 95 MS-012 AA dim
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. SOIC Coplanarity: 0.1 mm
4. SOIC Maximum allowable mold flash is 0.15 mm at the pac
ends and 0.25 mm between leads.
CE#
1
8
VDD
SO
2
7
HOLD#
SCK
WP#
3
6
SCK
SI
VSS
4
5
SI
CE#
1
8
VDD
SO
2
7
HOLD#
WP#
3
6
VSS
4
5
Top View
Top View
.50
Use for Flexible
PC Boards
1218 08-soic P1.0
.75
1218 08-wson P2.0
08-wson
8-Lead SOIC
8-Contact WSON
WSON Note: 1. All linear dimensions are in millimeters (max/min).
SOIC Note:
1. SOIC complies with JEDEC publication 95 MS-012 AA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. SOIC coplanarity: 0.1 mm
4. SOIC maximum allowable mold flash is 0.15 mm at the package
ends and 0.25 mm between leads.
Silicon Storage Technology, Inc.
1171 Sonora Court, Sunnyvale, CA 94086
Tel: (408) 735-9110 Fax: (408) 735-9036
www.SuperFlash.com, www.sst.com
©2002 Silicon Storage Technology, Inc. The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice.
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