DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
μPC8236T6N
SiGe:C LOW NOISE AMPLIFIER FOR GPS
DESCRIPTION
The μPC8236T6N is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise
amplifier for GPS. This device exhibits low noise figure and high power gain characteristics, so this IC can improve the
sensitivity of GPS receiver. In addition, the μPC8236T6N which is included output matching circuit contributes to
reduce external components and system size.
The package is a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) suitable for surface mount.
This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process.
FEATURES
• Supply voltage
: VCC = 1.6 to 3.3 V (2.7 V TYP.)
• Low noise
: NF = 0.8 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz
: NF = 0.8 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz
• High gain
: GP = 19.5 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz
: GP = 19.1 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz
• Low current consumption
: ICC = 6.5 mA TYP. @ VCC = 2.7 V
• Built-in power-saving function
: VPSon = 1.0 V to VCC, VPSoff = 0 to 0.4 V
• High-density surface mounting
: 6-pin plastic TSON (T6N) package (1.5 × 1.5 × 0.37 mm)
• Included output matching circuit
• Included very robust bandgap regulator (Small VCC and TA dependence)
• Included protection circuits for ESD
APPLICATION
• Low noise amplifier for GPS
ORDERING INFORMATION
Part Number
Order Number
μPC8236T6N-E2
μPC8236T6N-E2-A
Package
6-pin plastic TSON
(T6N) (Pb-Free)
Marking
6S
Supplying Form
• 8 mm wide embossed taping
• Pin 1, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPC8236T6N
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PU10713EJ01V0DS (1st edition)
Date Published March 2008 NS
Printed in Japan
2008
μPC8236T6N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
3
6
1
6
6
1
5
2
5
5
2
4
Bias
2
6S
1
(Bottom View)
(Top View)
3
4
3
4
Pin No.
Pin Name
1
VCC
2
GND
3
INPUT
4
Power Save
5
OUTPUT
6
VCC
Remark Exposed pad : GND
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C
4.0
V
Power-Saving Voltage
VPS
TA = +25°C
4.0
V
Total Power Dissipation
Ptot
150
mW
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Input Power
Pin
+10
dBm
RECOMMENDED OPERATING RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
1.6
2.7
3.3
V
Operating Ambient Temperature
TA
−40
+25
+85
°C
Power Save Turn-on Voltage
VPSon
1.0
−
VCC
V
Power Save Turn-off Voltage
VPSoff
0
−
0.4
V
ELECTRICAL CHARACTERISTICS
(TA = +25°C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified)
Parameter
Circuit Current
Symbol
ICC
Test Conditions
MIN.
TYP.
MAX.
Unit
5.0
6.5
8.0
mA
At Power-Saving Mode (VPS = 0 V)
−
−
1
μA
Pin = −35 dBm
17
19.5
22
dB
No Signal (VPS = 2.7 V)
Power Gain
GP
Noise Figure
NF
−
0.8
1.1
dB
Input Return Loss
RLin
7.5
11
−
dB
Output Return Loss
RLout
11
14
−
dB
2
Data Sheet PU10713EJ01V0DS
μPC8236T6N
STANDARD CHARACTERISTICS FOR REFERENCE 1
(TA = +25°C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified)
Parameter
Symbol
Test Conditions
Unit
−3
dBm
Input 3rd Order Intercept Point
IIP3
Isolation
ISL
39
dB
Pin (1 dB)
−18
dBm
Reference
Unit
Gain 1 dB Compression Input Power
fin1 = 1 575 MHz, fin2 = 1 574 MHz
Reference
STANDARD CHARACTERISTICS FOR REFERENCE 2
(TA = +25°C, VCC = VPS = 1.8 V, fin = 1 575 MHz, unless otherwise specified)
Parameter
Symbol
Test Conditions
Circuit Current
ICC
No Signal (VPS = 1.8 V)
6.2
mA
Power Gain
GP
Pin = −35 dBm
19.1
dB
Noise Figure
NF
0.8
dB
Input 3rd Order Intercept Point
IIP3
−5
dBm
Input Return Loss
RLin
11
dB
Output Return Loss
RLout
14
dB
ISL
39
dB
Pin (1 dB)
−19
dBm
Isolation
Gain 1 dB Compression Input Power
fin1 = 1 575 MHz, fin2 = 1 574 MHz
TEST CIRCUIT
VCC
1
6
1 000 pF
1 000 pF
2
5
OUTPUT
1.0 pF
3
INPUT
1 000 pF
4
VPS
4.7 nH
Data Sheet PU10713EJ01V0DS
3
μPC8236T6N
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
10
10
9
TA = +85°C
8
Circuit Current ICC (mA)
Circuit Current ICC (mA)
9
7
6
+25°C
5
–40°C
4
3
2
VCC = VPS
RF = off
1
0
1
2
7
6
5
1.8 V
4
3
2
VCC = VPS
RF = off
1
3
0
–50
4
–25
CIRCUIT CURRENT vs.
POWER-SAVING VOLTAGE
100
10
9
Circuit Current ICC (mA)
TA = +85°C
8
7
6 +25°C
5
4
–40°C
3
2
VCC = 2.7 V
RF = off
0
0
1
2
TA = +85°C
8
7
6
+25°C
5
4
–40°C
3
2
VCC = 1.8 V
RF = off
1
0
0
3
1
Power-Saving Voltage VPS (V)
2
3
Power-Saving Voltage VPS (V)
NOISE FIGURE vs. FREQUENCY
POWER GAIN vs. FREQUENCY
1.8
26
1.6
24
22
Noise Figure NF (dB)
TA = –40°C
Power Gain GP (dB)
75
50
CIRCUIT CURRENT vs.
POWER-SAVING VOLTAGE
1
+25°C
20
18
16
+85°C
14
VCC = VPS = 2.7 V
1 525
1 550
1 575
1 600
1 625
1 650
1.4
TA = +85°C
1.2
1.0
0.8
0.6
+25°C
0.4
0.2
0.0
1 500
Frequency fin (MHz)
–40°C
1 525
1 550
VCC = VPS = 2.7 V
1 575
1 600
Frequency fin (MHz)
Remark The graphs indicate nominal characteristics.
4
25
Operating Ambient Temperature TA (°C)
9
12
1 500
0
Supply Voltage VCC (V)
10
Circuit Current ICC (mA)
VCC = 2.7 V
8
Data Sheet PU10713EJ01V0DS
1 625
1 650
μPC8236T6N
NOISE FIGURE vs. FREQUENCY
POWER GAIN vs. FREQUENCY
1.8
26
1.6
24
22
Noise Figure NF (dB)
Power Gain GP (dB)
TA = –40°C
+25°C
20
18
16
+85°C
14
1 525
1 550
1 575
1 600
1.0
0.8
0.6
+25°C
0.4
–40°C
0.0
1 500
1 650
1 625
1.2
0.2
VCC = VPS = 1.8 V
12
1 500
TA = +85°C
1.4
1 525
Frequency fin (MHz)
POWER GAIN vs. SUPPLY VOLTAGE
1 600
1 625
1 650
NOISE FIGURE vs. SUPPLY VOLTAGE
VCC = VPS
fin = 1 575 MHz
1.6
TA = –40°C
Noise Figure NF (dB)
Power Gain GP (dB)
1 575
1.8
24
22
20
18
+25°C
16
+85°C
14
1.0
1.5
2.0
2.5
TA = +85°C
1.2
1.0
0.8
0.6
+25°C
0.4
–40°C
0.0
1.0
1.5
2.0
2.5
3.0
3.5
Supply Voltage VCC (V)
Supply Voltage VCC (V)
POWER GAIN vs. OPERATING
AMBIENT TEMPERATURE
NOISE FIGURE vs. OPERATING
AMBIENT TEMPERATURE
4.0
1.8
VCC = VPS
fin = 1 575 MHz
1.6
22
Noise Figure NF (dB)
24
VCC = 2.7 V
20
18
1.8 V
16
14
12
–50
1.4
0.2
VCC = VPS
fin = 1 575 MHz
3.0
3.5
4.0
26
Power Gain GP (dB)
1 550
Frequency fin (MHz)
26
12
VCC = VPS = 1.8 V
–25
0
25
VCC = VPS
fin = 1 575 MHz
75
100
50
1.4
1.2
1.0
0.8
VCC = 2.7 V
0.6
0.4
1.8 V
0.2
0.0
–50
Operating Ambient Temperature TA (°C)
–25
0
25
50
75
100
Operating Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
5
μPC8236T6N
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
10
VCC = VPS = 2.7 V
fin = 1 575 MHz
Output Power Pout (dBm)
Output Power Pout (dBm)
10
0
–10
–20
VCC = VPS = 1.8 V
fin = 1 575 MHz
0
–10
–20
Pin (1dB) = –18.5 dBm
Pin (1dB) = –17.9 dBm
–30
–50
–40
–20
–30
–30
–50
–10
Input Power Pin (dBm)
POWER GAIN vs. INPUT POWER
POWER GAIN vs. INPUT POWER
VCC = VPS = 1.8 V
fin = 1 575 MHz
20
Power Gain GP (dB)
20
Power Gain GP (dB)
–10
25
VCC = VPS = 2.7 V
fin = 1 575 MHz
15
10
15
10
5
5
Pin (1dB) = –18.5 dBm
Pin (1dB) = –17.9 dBm
0
–50
–40
–20
–30
–10
0
–50
0
VCC = VPS = 2.7 V
fin1 = 1 575 MHz
0 fin2 = 1 574 MHz
Pout
–20
IM3
–60
–80
IIP3 = –3.5 dBm
–100
–40
–30
–20
–10
0
Output Power Pout (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
OUTPUT POWER, IM3 vs. INPUT POWER
+20
–40
–40
–20
–30
–10
0
Input Power Pin (dBm)
Input Power Pin (dBm)
Output Power Pout (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
–20
–30
Input Power Pin (dBm)
25
OUTPUT POWER, IM3 vs. INPUT POWER
+20
VCC = VPS = 1.8 V
fin1 = 1 575 MHz
0 fin2 = 1 574 MHz
Pout
–20
–40
IM3
–60
–80
IIP3 = –4.7 dBm
–100
–40
Input Power Pin (dBm)
–30
–20
–10
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
6
–40
Data Sheet PU10713EJ01V0DS
0
GAIN 1 dB COMPRESSION INPUT
POWER vs. SUPPLY VOLTAGE
–10
TA = +85°C
–15
–20
+25°C
–40°C
–25
1.0
1.5
2.0
2.5
VCC = VPS
fin = 1 575 MHz
3.0
3.5
4.0
Input 3rd Order Intercept Point IIP3 (dBm)
Output 3rd Order Intercept Point OIP3 (dBm)
IIP3, OIP3 vs. SUPPLY VOLTAGE
–5
20
TA = +85°C
15
+25°C
–40°C
5
TA = –40°C
0
IIP3
–5
–10
VCC = VPS
fin1 = 1 575 MHz
fin2 = 1 574 MHz
3.0
3.5
4.0
+25°C
–15
1.0
+85°C
1.5
2.0
2.5
Supply Voltage VCC (V)
GAIN 1 dB COMPRESSION INPUT POWER
vs. OPERATING AMBIENT TEMPERATURE
IIP3, OIP3 vs. OPERATING AMBIENT
TEMPERATURE
–5
–10
–15
VCC = 2.7 V
–20
VCC = VPS
fin = 1 575 MHz
1.8 V
–25
–50
–25
0
25
50
75
100
20
VCC = 2.7 V
15
OIP3
10
1.8 V
5
VCC = 2.7 V
0
IIP3
–5
1.8 V
–10
–15
–50
–25
0
25
VCC = VPS
fin1 = 1 575 MHz
fin2 = 1 574 MHz
100
50
75
Operating Ambient Temperature TA (°C)
Operating Ambient Temperature TA (°C)
K FACTOR vs. FREQUENCY
K FACTOR vs. FREQUENCY
20
20
VCC = VPS = 2.7 V
VCC = VPS = 1.8 V
15
K factor K
15
K factor K
OIP3
10
Supply Voltage VCC (V)
Input 3rd Order Intercept Point IIP3 (dBm)
Output 3rd Order Intercept Point OIP3 (dBm)
Gain 1 dB Compression Input Power Pin (1 dB) (dBm)
Gain 1 dB Compression Input Power Pin (1 dB) (dBm)
μPC8236T6N
10
5
10
5
1
1
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0
Frequency fin (GHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Frequency fin (GHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
7
μPC8236T6N
S-PARAMETERS (TA = +25°C, VCC = VPS = 2.7 V, monitored at connector on board)
S11–FREQUENCY
S22–FREQUENCY
1:1 575 MHz
62.80 Ω
–11.60 Ω
1:1 575 MHz
31.80 Ω
14.00 Ω
1
1
START 100.000 000 MHz
START 100.000 000 MHz
STOP 5 000.000 000 MHz
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT RETURN LOSS vs. FREQUENCY
Power Gain GP (dB)
Output Return Loss RLout (dB)
0
–5
–10
–15
–5
–10
–15
–20
–25
–30
0
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
Frequency fin (MHz)
POWER GAIN vs. FREQUENCY
ISOLATION vs. FREQUENCY
30
0
25
–10
20
15
10
5
0
0
–20
–30
–40
–50
–60
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
–70
0
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
Frequency fin (MHz)
Frequency fin (MHz)
Remark The graphs indicate nominal characteristics.
8
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
Frequency fin (MHz)
Isolation ISL (dB)
Input Return Loss RLin (dB)
0
–20
0
STOP 5 000.000 000 MHz
Data Sheet PU10713EJ01V0DS
μPC8236T6N
S-PARAMETERS (TA = +25°C, VCC = VPS = 1.8 V, monitored at connector on board)
S11–FREQUENCY
S22–FREQUENCY
1:1 575 MHz
61.05 Ω
–14.10 Ω
1:1 575 MHz
33.15 Ω
13.30 Ω
1
1
START 100.000 000 MHz
START 100.000 000 MHz
STOP 5 000.000 000 MHz
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT RETURN LOSS vs. FREQUENCY
Power Gain GP (dB)
Output Return Loss RLout (dB)
0
–5
–10
–15
–5
–10
–15
–20
–25
–30
0
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
Frequency fin (MHz)
POWER GAIN vs. FREQUENCY
ISOLATION vs. FREQUENCY
30
0
25
–10
20
15
10
5
0
0
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
Frequency fin (MHz)
Isolation ISL (dB)
Input Return Loss RLin (dB)
0
–20
0
STOP 5 000.000 000 MHz
–20
–30
–40
–50
–60
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
–70
0
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
Frequency fin (MHz)
Frequency fin (MHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
9
μPC8236T6N
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (T6N) (UNIT: mm)
(Top View)
(Bottom View)
(Side View)
0.3±0.07
1.5±0.1
0.37+0.03
–0.05
1.2±0.1
A
0.08 MIN.
0.2+0.07
–0.05
A
1.5±0.1
0.5±0.06
(0.24)
0.2±0.1
0.7±0.1
Remark A>0
( ) : Reference value
10
Data Sheet PU10713EJ01V0DS
μPC8236T6N
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
(4) Do not supply DC voltage to INPUT pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 3 times
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Partial Heating
: 1 time
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10713EJ01V0DS
11
μPC8236T6N
• The information in this document is current as of March, 2008. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1