Ver 1.0 Radiation-Hardened QUARD DRIVER B54LVDS031RH Datasheet Beijing Microelectronics Technology Institute 2011.3.20 Beijing Microelectronics Technology Institute B54LVDS031RH INDEX 1. Features ........................................................................................................................ 1 2. General Description ....................................................................................................... 1 3. Block Diagram ............................................................................................................... 2 4. Pin Description .............................................................................................................. 2 5. Pin Configurations ......................................................................................................... 3 6. Product Description ....................................................................................................... 4 7.Electrical Characteristic .................................................................................................. 4 7.1 ABSOLUTE MAXIMUM RATINGS ......................................................................................... 4 7.2 RECOMMENDED OPERATING CONDITIONS ......................................................................... 4 7.3 ELECTRICAL CHARACTERISTICS ........................................................................................... 5 8.Typical Application ......................................................................................................... 7 9.Package ......................................................................................................................... 8 10.Naming Rule ................................................................................................................ 9 11.Replaced Product.......................................................................................................... 9 2 Beijing Microelectronics Technology Institute B54LVDS031RH 1. Features >155.5 Mbps (77.7 MHz) switching rates +350mV nominal differential signaling 5 V power supply TTL compatible inputs Ultra low power CMOS technology 5.0ns maximum, propagation delay 3.0ns maximum, differential skew Radiation-hardened design: - Total-dose: 300 krad(Si) - Latchup immune (LET > 100MeV-cm2/mg) Packaging options: - 16-lead flatpack Compatible with IEEE 1596.3SCI LVDS Compatible with ANSI/TIA/EIA 644-1996 LVDS Standard 2. General Description The B54LVDS031RH Quad Driver is a quad CMOS differential line driver designed for applications requiring ultra low power dissipation and high data rates. The device is designed to support data rates in excess of 155.5 Mbps(77.7 MHz) utilizing Low Voltage Differential Signaling(LVDS) technology.The B54LVDS031RH accepts TTL input levels and translates them to low voltage (340mV) differential output signals. In addition, the driver supports a three-state function that may be used to disable the output stage, disabling the load current, and thus dropping the device toan ultra low idle power state.The B54LVDS031RH and companion quad line receiver B54LVDS032RH provide new alternatives to high power pseudo-ECL devices for high speed point-to-point interface applications. Quad Driver is a quad CMOS differential line driver designed for applications requiring ultra low power dissipation and high data rates. The device is designed to support data rates in excess of 155.5 Mbps(77.7 MHz) utilizing Low Voltage Differential Signaling(LVDS) technology.The B54LVDS031RH accepts TTL input levels and translates them to low voltage (340mV) differential output signals. In addition, the driver supports a three-state function that may be used to disable the output stage, disabling the load current, and thus dropping the device toan ultra low idle power state.The B54LVDS031RH and 1 Beijing Microelectronics Technology Institute B54LVDS031RH companion quad line receiver B54LVDS032RH provide new alternatives to high power pseudo-ECL devices for high speed point-to-point interface applications. 3. Block Diagram Figure.1. B54LVDS031RH Quad Driver Block Diagram 4. Pin Description 2 B54LVDS031RH Beijing Microelectronics Technology Institute Pin No. 1,7,9, 15 Name DIN 2,6,10, DOUT+ 14 3,5,11, DOUT13 4 EN 12 EN 16 VDD 8 VSS Description Driver input pin, TTL/CMOS compatible Non-inverting driver output pin, LVDS levels Inverting driver output pin, LVDS levels Active high enable pin, OR-ed with EN Active low enable pin, OR-ed with EN Power supply pin, +5V + 10% Ground pin Figure.2. B54LVDS031RH Pinout & PIN DESCRIPTION 5. Pin Configurations Pin No. 1 2 Symbol DIN1 DOUT1+ 3 DOUT1- 4 EN 5 DOUT2- 6 DOUT2+ 7 8 DIN2 VSS Function INPUT DATA1 OUTPUT DATA1 POSITIVE OUTPUT DATA1 NEGATIVE Active high enable pin OUTPUT DATA2 NEGATIVE OUTPUT DATA2 POSITIVE INPUT DATA2 GND Pin No. Symbol 9 DIN3 10 DOUT3+ 3 11 DOUT3- 12 EN 13 DOUT4- 14 DOUT4+ 15 16 DIN4 VDD Function INPUT DATA3 OUTPUT DATA3 POSITIVE OUTPUT DATA3 NEGATIVE Active low enable pin OUTPUT DATA4 NEGATIVE OUTPUT DATA4 POSITIVE INPUT DATA4 POWER B54LVDS031RH Beijing Microelectronics Technology Institute 6. Product Description TRUTH TABLE Enables EN Input EN Output DIN DOUT+ DOUT- X Z Z L L H H H L L H All other combinations of ENABLE inputs The device is designed to support data rates in excess of 155.5 Mbps(77.7 MHz) utilizing Low Voltage Differential Signaling(LVDS) technology. The B54LVDS031RH accepts TTL input levels and translates them to low voltage (340mV) differential output signals. In addition, the driver supports a three-state function that may be used to disable the output stage, disabling the load current, and thus dropping the device to an ultra low idle power state. 7.Electrical Characteristic 7.1 ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER LIMITS VDD DC supply voltage VI/O Voltage on any pin during operation Tstg Storage temperature TJ Rth(J-C) II -0.3V ~ 6.0 V Maximum junction temperature Thermal resistance, junction-to-case3 DC input current -0.3V ~ (VDD+0.3V) -65℃ ~ +150℃ +150℃ 10℃/W ±10mA 7.2 RECOMMENDED OPERATING CONDITIONS 4 B54LVDS031RH Beijing Microelectronics Technology Institute SYMBOL PARAMETER LIMITS VDD Positive supply voltage 4.5 V ~ 5.5 V TA Case temperature range -55℃ ~ +125℃ VI DC input voltage 0V ~ VDD 7.3 ELECTRICAL CHARACTERISTICS PARAMETER High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Input leakage current Differential Output Voltage Change in Magnitude of VOD for Complementary Output States Offset Voltage Change in Magnitude of VOS for Complementary Output States Input clamp voltage Output Short Circuit Currenta Output Three-State Current Loaded supply current drivers enabled Loaded supply current drivers disabled Function test SYMBOL CONDITION (-55℃≤ TA ≤ 125℃ ,VDD=5.0× (1±10%)V) LIMIT UNIT MIN MAX VIH 2.0 VDD V VIL GND 0.8 V VOH RL=100Ω ― 1.6 V VOL RL=100Ω 0.9 ― V IIN VIN= VDDorVSS,VDD=5.5V -10 10 μA VOD RL=100Ω 250 400 mV △VOD RL=100Ω ― 10 mV 1.12 5 1.37 5 V ― 25 mV ICL =-18 mA VIN=VDD,VOUT+=0V 或 VIN=0V,VOUT-=0V VDD=5.5V, EN=0V , EN =5.5V , VOUT-=0V or VDD RL = 100Ω all channels VIN = VDD or VSS (all inputs) -1.5 — V -5.0 ― mA -10 10 μA ― 25.0 mA EN=0V, EN =VDD, VIN= VDD or 0V ― 10 mA VOS △VOS VCL IOS IOZ ICCL ICCZ RL=100Ω,VOS =( VOL+VOH) /2 RL=100Ω f =77.7MHz 5 Beijing Microelectronics Technology Institute B54LVDS031RH Differential Propagation Delay tPHLD Figure 3 ― 5.0 ns High to Low Differential Propagation Delay Low tPLHD Figure 3 ― 5.0 ns to High Differential Skew tSKD tPLHD -tPHLD ― 3.0 ns (tPHLD - tPLHD) Channel-to-Channel tSK1 ― 3.0 ns Skewb Chip-to-Chip Skewc tSK2 ― 4.5 ns Rise Time tTLH Figure 3 2.0 ns Fall Time tTHL Figure 3 2.0 ns Disable Time High to Z tPHZ Figure 4 ― 10 ns Disable Time Low to Z tPLZ Figure 4 ― 10 ns Enable Time Z to High tPZH Figure 4 ― 10 ns Enable Time Z to Low tPZL Figure 4 ― 10 ns Notes: 1、Devices are tested Devices are tested @ VDD = 4.5V&5.5V. 2、Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except differential voltages. 3、Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50, tr < 6 ns, and tf < 6 ns. a Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. b Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs. c Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays. Figure.3. Driver Propagation Delay and Transition Time Waveforms 6 Beijing Microelectronics Technology Institute B54LVDS031RH Figure.4. Driver Three-State Delay Waveform 8.Typical Application The B54LVDS031RH driver’s intended use is primarily in an uncomplicated point-to-point configuration as is shown in Figure5. This configuration provides a clean signaling environment for quick edge rates of the drivers. The receiver is connected to the driver through a balanced media such as a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic impedance of the media is in the range of 100Ω. A termination resistor of 100Ω should be selected to match the media and is located as close to the receiver input pins as possible. The termination resistor converts the current sourced by the driver into voltages that are detected by the receiver. Other configurations are possible such as a multireceiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities, as well as ground shifting, noise margin limits, and total termination loading must be taken into account. Figure.5. Point-to-Point Application 7 Beijing Microelectronics Technology Institute B54LVDS031RH The B54LVDS031RH differential line driver is a balanced current source design. A current mode driver, has a high output impedance and supplies a constant current for a range of loads (a voltage mode driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in one direction to produce a logic state and in the other direction to produce the other logic state. The current mode requires (as discussed above) that a resistive termination be employed to terminate the signal and to complete the loop as shown in Figure5. AC or unterminated configurations are not allowed. The 3.5mA loop current will develop a differential voltage of 350mV across the 100Ω termination resistor which the receiver detects with a 250mV minimum differential noise margin neglecting resistive line losses (driven signal minus receiver threshold (350mV - 100mV = 250mV)). The signal is centered around +1.125V (Driver Offset, VOS) with respect to ground. 9.Package B54LVDS031RH adopt 16-Lead Ceramic Quad Flat package, as in Figure 6 and the size is listed in Table 1. Figure.6. Package Outline 8 Beijing Microelectronics Technology Institute B54LVDS031RH Table 1 Package Size Value(unit:mm) Symbol Min Normal Max A —— —— 2.3 b 0.20 —— 0.56 c 0.07 —— 0.20 e —— 1.27 —— HE 13.72 —— 25.4 Z —— —— 0.635 GE —— —— 7.7 LE 3 —— —— Q 0.13 —— 0.90 10.Naming Rule B54LVDS031RH Design Type: Radiation-Hardened Device Type: LVDS Quad Driver Company code 11.Replaced Product Device Type B54LVDS031RH Substituted Device Type Aeroflex UT54LVDS031 9 Beijing Microelectronics Technology Institute 10 B54LVDS031RH