91/XXXX/RM
For IEC use only
2013-11-14
®
INTERNATIONAL ELECTROTECHNICAL COMMISSION
TECHNICAL COMMITTEE No. 91: Electronics Assembly Technology
Unconfirmed Minutes of the TC 91 Plenary meeting held in Richardson, Texas, USA on
October 11 in 2013
Attendees
Chairman
Mr. Dieter W. BERGMAN (Chairman, Convener of WG 11 and WG12,
Acting Convener of WG 2, USA)
Vice Chairman
Mr. Christopher HUNT (Vice Chairman, Head of delegation, UK)
Secretary
Mr. Masahide OKAMOTO (JAPAN)
GERMANY
Mr. Walter HUCK (Head of delegation, Convener of WG 1)
Mr. Rainer TAUBE
Mr. Udo WELZEL
JAPAN
Mr. Toshiro HIRAMOTO (Head of delegation)
Mr. Hisao KASUGA (Convener of WG 3, Co-Convener of WG6)
Mr. Hajime TOMOKAGE (Co-Convener of WG6)
Mr. Kunio TAKAHARA (Acting Convener of WG10)
Mr. Satoshi KOJIMA (Co-Convener of WG13)
Mr. Mitsuru TAKAHASHI (Co-Convener of WG14)
Mr. Osamu KARATSU (Co-Convener of WG15)
Mr. Katsumi YAMAMOTO
Mr. Hideyuki ARAKANE
Mr. Masahiro TAMBO
Mr. Tsuyoshi YAMAMOTO
Mr. Koji SERIZAWA
Mr. Yoshihiko MIYAKE
KOREA, Republic of
Mr. Minsu LEE (Head of delegation, Convener of WG 5)
Mr. Hyun-Ho KIM
Mr. Jaeho LEE
Mr. Young-Min IM
Mr. Jae Keun KWAK
Mr. Yang CHANWOO
® Registered trademark of the International Electrotechnical Commission
UNITED STATES OF
AMERICA
Mr. P. Marc CARTER (Head of delegation)
Mr. Douglas J SOBER (Convener of WG4)
Mr. Kris ROBERSON
Mr. Jasbir BATH
Mr. Alec G. STANCULESCU
Switzerland
Mr. Michael WEINHOLD (Head of delegation)
* Head of delegations is in bold letters.
1. Opening the meeting
Mr. Dieter Bergman, Chairman of TC91, announced opening of the Plenary Meeting and expressed
appreciation to USA National Committee and Fujitsu Network Communications for providing meeting
rooms and other facilities for the TC91 plenary and WG meetings.
2. Approval of the Agenda – 91/1105A/DA
Mr. Christopher Hunt, Vice Chairman of TC91, explained the draft agenda of the meeting 91/1105A/DA.
The agenda was approved without any change.
3. Confirmation of the minutes of the last TC91 meeting held in Fukuoka, Japan - 91/1077/RM
Mr. Christopher Hunt explained the minutes of the last TC91 meeting held in Fukuoka, Japan,
91/1077/RM. The minutes were approved without any change.
4. Information from IEC Central Office
Mr. Dieter Bergman in behalf of IEC CO presented the IEC CO News. He mainly explained the following
items.
(1) IEC in figures
(2) New Technical Committees and Advisory Committees established
(3) New editions of the Directives and Procedures
(4) IEC new website
(5) Calendar of IEC General Meetings
5. Report from the Secretary
Mr. Masahide Okamoto, Secretary of TC91, explained the following items.
(1) Report to SMB last TC91 meeting in Fukuoka – SMB/4961/R
(2) Creation of the role of “Vice Chairman” in TC91 and Mr. Christopher Hunt’s assumption of Vice
Chairman – 91/1111/Q, 91/1146/RQ
6. Report from conveners on discussion and activities at each WG
6.1 WG1
Mr. Walter Huck, Convener of WG1, reported the activity of WG1.

Ongoing Projects
IEC 61760-4: Classification, packaging and labeling of moisture sensitive components
- 91/1127/CDV (voting: 2014-01-17)
- 91/xxxx/FDIS (2014-03)
Many technical and editorial comments were received, but could all be included. The project
team achieved the target to set a standard, which is based on and not in conflict to J-STD020
and J-STD033, extending the scope to all kind of electronic components, and including a new
cost effective packing system. The CDV is forwarded to IPC committee for consideration at
the current review of J-STD020D.1

Potential New Work Items
- TR – Soldering Profile for Sensitive components, Priority; A, Team; W. Huck, U. Welzel, M.
Tambo and K. Robertson, Status; Start: Nov. 13, DTR: Mar. 14
- TR – Surface strain measurement method to determine mechanical loads in assembly
processes, Priority; A, Team; W. Huck, U. Welzel, M. Tambo and K. Robertson + WG12,
Status; Start: Dec. 13, DTR: Feb. 14
- Requirements to Components for Embedding Technology, Priority; B, Team;  WG6
- Requirements to Components for Solderless Connections, Priority; C, Status; On hold
- Assembly of Optoelectronic Components, Priority; C, Status; On hold

Maintenance work:
- 61760-1 needs editorial update, MT starting 2014
(DC to be issued; MT leader W. Huck)
- 61760-2 needs editorial update, MT starting 2014
(DC to be issued; MT leader W. Huck, Co-leader M. Tambo)
- 61760-3 stability date is to be prolonged to 2017, since the standard is based on 61760-1
and cannot be revised before.
- 62588 (PAS) is not to be converted into an IS and can be withdrawn in 2014.
- 62421 the standard is technically up to date, stability date is to be prolonged to 2020.

Update of SBP Item E
New projects related to requirements to components
- 2014-03: Classification, packing and handling of moisture sensitive devices – to finalize
project 61760-4 up to FDIS stage
- New work items
(1) Technical report for definition of soldering profiles and testing of temperature sensitive
or high thermal mass devices
(2) Technical report for assembly of mechanically sensitive components
2013-2015: to investigate future requirements to electronic components coming from new
component and assembly technologies
- Requirements from solderless interconnection technology (e.g. silver sintering)
- Assembly of optoelectronic components

Next meeting is to be held in conjunction with JIC meeting in Nuremberg, Germany in May 2014.
6.2 WG2
Mr. Dieter Bergman, Acting Convener of WG2, reported the activity of WG2.



IEC 61190-1-2 Ed.2.0: Attachment materials for electronic assembly - Part 1-2: Requirements for
soldering paste for high - quality interconnects in electronics assembly
Discussed comments from Central office and agreed with suggestions. Forward to CO for FDIS
publication.
Discussed changes to -3 as proposed in 6.3 and agreed to start new edition
IEC 61191-3 Ed.2.0: Printed board assemblies - Part 3: Sectional specification - Requirements for
through-hole mount soldered assemblies
IEC 61191-4 Ed.2.0: Printed board assemblies - Part 4 Sectional specification - Requirements for
terminal soldered assemblies
Reviewed documented and made notations as to changes or discrepancies. Convener to
prepare draft and send to committee for review and discussion at next meeting. Circulate by no
later than February. Maybe first draft end December to provide several iterations.

Amendments to IEC 61191-2 to fix the requirements in order to agree with the workmanship
standard.
Discussed the discrepancies between the requirements of 61191-2 and the J-STD-001/IPC-A610. Most tables need to be updated and revised. Other changes may also be necessary. The
date of stability is 2015. Start the process to make changes to reflect these needs.
Requested TC91 secretary to issue documents to National Committees informing them of this
action and ask for participation or comments. Leader for the work of IEC 61191-1 is Dieter
Bergman; Leader for IEC 61191-2 is Rainer Taube.
Similar discrepancies may exist in -3 and -4 and we can address those in this maintenance
project.

IEC 61189-5: Test methods for electrical materials - Part 5: Test methods for print 61191-2ed
board assemblies.
Obtain word document and send to committee for review in May.

IEC 62588 Ed. 1.0: Marking and Labelling and review of J-STD-609A conversion to IEC standard.
Take no Action. Encourage NC to use the PAS or J-STD-609A as agreed to between
customers and suppliers

New work proposal IEC 61190-1-3 Ed.2.0 Am1. Attachment materials for electronic assembly - Part
1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for
electronic soldering applications.
1) Definition change of lead free solder, Pb 0.10% Max to Pb 0.07% Max as IPC J-STD-006_2013,
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for
Electronic Soldering Applications
2) Addition of some new lead free solders, Sn-2Bi-1Ag-0.7Cu and Sn-1.6Bi-1Ag-0.7Cu-0.2In,
those were introduced as low silver containing solders with high performance and reliability at
JISSO Council Meeting at Seoul on April 2013 by JEITA.
Start New edition of IEC 61190-1-3 to add the new solders and while doing this edition review the
entire document to bring it up to date with new rules and Technical requirements. Mr. Tsuruta to
be leader and prepare the first draft. Circulate an RR to inform national Committees of this action.

New work to define component mounting conditions
Discussed and agreed to develop companion documents for land patterns (WG12) and
component mounting (WG2). Started draft layout and organization to be continued during time to
next meeting.
Next meeting is to be held in conjunction with JIC meeting in Nuremberg, Germany in May 2014.

6.3 WG3
Mr. Hisao Kasuga, Convener of WG3, reported the activity of WG3.

IEC 60068-2-58 Ed. 4.0: Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
Waiting for comments on CDV to be circulated on 2013-11-01

IEC 60068-2-69 Ed. 3.0: Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of
electronics components for surface mounting devices (SMD) by the wetting balance method
Oshima’s proposal to be input into Graham’s WD
1) Mr. Graham Naisbitt to discuss this document according to Oshima data at the next week
IPC meeting: 2013-10-14
2) Mr. Graham Naisbitt and Mr. Hiroshi Oshima to make a CD draft by 2013-12-31 (to be
finalized with Walter Huck and 6.2 with Dr. Chris Hunt)
3) CD final draft to be submitted to Secretary by 2014-01-31

IEC 61189-5-1 Ed. 1.0: Test methods for electrical materials, interconnection structures and
assemblies-Part 5-1: Test methods for printed board assemblies-Guidance
WD to be developed by new members for CD draft by 2014-03-31

IEC 61189-5-2 Ed. 1.0: Test methods for electrical materials, interconnection structures and
assemblies-Part 5-2: Test methods for printed board assemblies-Soldering Flux
- Waiting for comments and Approval
- J-Std 004 to be checked before FDIS draft preparation

IEC 61189-5-3 Ed. 1.0: Test methods for electrical materials, interconnection structures and
assemblies-Part 5-3: Test methods for printed board assemblies-Soldering paste
- Waiting for comments and Approval
- J-Std 005 to be checked before FDIS draft preparation

IEC 61189-5-4 Ed. 1.0: Test methods for electrical materials, interconnection structures and
assemblies-Part 5-4: Test methods for printed board assemblies-Soldering alloys and fluxed and
non-fluxed solid wire
- Waiting for comments and Approval
- J-Std 006 to be checked before FDIS draft preparation

IEC 61189-5-5 Ed. 1.0: Test methods for electrical materials, interconnection structures and
assemblies-Part 5-5: Test methods for printed board assemblies-Surface insulation
resistance(SIR)
- JPN proposal that IS part of 91/1035/NP was integrated into IPC TM650method 2.6.25 to
be reviewed
- Mr. Graham Naisbitt kindly proposed the target dates for submission of WD (61189-5-5) in
2014-05 (Ex. CD: 2014-11 in Tokyo and CDV & FDIS).
- Ad hoc meeting to be conducted by Project Leader until the next meeting in 2014-05

IEC 62137-4 Ed. 1.0: Electronics assembly technology – Part 4: Environmental and endurance test
methods for solder joint array type package surface mount devices
- RVC draft to be submitted to Secretary by 2013-11-30
- FDIS draft to be circulated by 2013-12-31

PNW 91-1139 Ed. 1.0 (Future IEC 62739-2): Test method for erosion of wave soldering equipment
using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface
processing
Waiting for comments and nomination of experts from All NCs

Maintenance review
IEC/TR 60068-3-12 Ed. 1.0 (2007-03-12): Environmental testing - Part 3-12: Supporting
documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature
profile [Stability Date: 2013]
- Any additional comments will be received from members by 2013-10-25
- RR to be submitted to Secretary before 2013-10-26
- DTR to be submitted to Secretary after 2013-10-26

Harmonization work with other TCs
Whisker with TC47WG2
(IEC 60068-2-82 Ed. 1.0 (TC91WG3) vs. IEC 62483 Ed. 1.0 (IEC/TC47WG2)
- Project plan including the above issues on whisker test methods to be prepared by Mr.
Ichizo Sakamoto in cooperation with Mr. Udo Welzel and Mr. Stephen Tisdale, a liaison
member of TC47WG2, for the next meeting discussion
- Discussion point is how to harmonize duplication work between TC91 (General test method)
and TC47 (Specific TC47 conditions)
- TC47 documents (JEDEC documents) shall be reviewed and may be updated according to
the latest market requirement

Next meeting is to be held in conjunction with JIC meeting in Nuremberg, Germany in May 2014.
Follow on meeting with TC91 meeting in Tokyo, Japan in November 2014.
6.4 WG4
Mr. Douglas Sober, Convener of WG4, reported the activity of WG4.

Published Standards
None since last meeting

Final Draft International Standards (FDIS)
IEC 61249-4-18: Materials for printed boards and other interconnecting structures – Part 4-18:
Prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide
woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly.
This document was approved by the member countries that voted. There were a small number of
editorial comments submitted. These will be resolved and the document amended accordingly.
Sober plans to have voting report and new document ready to publish within 6 weeks.
IEC-61249-4-19: Materials for printed boards and other interconnecting structures – Part 419:Prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, nonhalogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for leadfree assembly.
This document was approved by the member countries that voted. There were a small number of
editorial comments submitted. These will be resolved and the document amended accordingly.
Sober plans to have voting report and new document ready to publish within 6 weeks.

Committee Drafts Voting (CDV)
None presented within last 6 months.

Committee Drafts (CD)
IEC 62326-20: Printed Boards: Electronic circuit board for high brightness LED.
Voting period for this second circulation as a CD was from 9 August 2013 to 11 October 2013. For
the initial CD circulation, members from Asia indicated that there was too much information in the
document and that the focus should be on the high brightness LED only.
However for the second circulation, the document was only two or three pages. Mr. Bergman and
Mr. Sober thought that there was too much chopped away and both would like to see some of the
original information put back in. It is important that the document be “stand alone” and not have to
reference or look up pertinent information in other documents.
Sober and Takahara will look at the comments at the end of the comment period. Then a third CD
draft will be prepared with more of a “stand alone document” orientation. This strawman proposal
will be circulated just to the attendees in Richardson for their comments before sending along to the
Central Office for CD review.
IEC 61249-2-43: Materials for printed boards and other interconnecting structures – Part 2-43:
Reinforced base materials clad and unclad – Non-halogen epoxide cellulose paper/woven E-glass
reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free
assembly.
This document was approved with a number of comments. Mr. Sober will resolve the comments
and the document will be amended accordingly. This document will be submitted as a CDV before
the end of 2013.
IEC 61249-44: Materials for printed boards and other interconnecting structures – Part 2-44:
Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass
reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free
assembly.
This document was approved with a number of comments. Mr. Sober will resolve the comments
and the document will be amended accordingly. This document will be submitted as a CDV before
the end of 2013.

New Work Item Proposals (NP)
No items for future work was presented.

Delete Work Items
IEC 62326-7-1: Printed boards – Part 7-1: Performance guide for single-and double-sided flexible
printed boards
IEC 62326-3-1: Printed boards – Part 3-1: Copper-Clad Laminate for Flexible Printed Wiring Boards
(Adhesive and Non-adhesive types)

PAS Documents
IPC-SM-840
Soldermask
Mr. Bergman will discuss with Mr. David Torp of IPC about publishing this document as a PAS.
IPC-CC-830
Conformal Coating
Mr. Bergman will discuss with Mr. David Torp of IPC about publishing this document as a PAS.

Next Meetings
The next spring meeting is currently being planned for Nuremberg, Germany in May 2014.
The next fall meeting will be held in Tokyo, Japan in November 2014.
Shengyi Technology Co., Ltd. Has proposed that the spring 2015 meeting be held in Dongguan City
China and that they will host the conference at their facility.
6.5 WG5
Mr. Minsu Lee, Convener of WG5, reported the activity of WG5.
IEC 60194 Ed. 6.0: Printed board design, manufacture and assembly - Terms and definitions
The first FDIS was submitted after numbering of some 300 new terms.
The central office asked the use of IEV definition and the previous CVD version for FDIS.
About 500 terms in FDIS are present in IEV.
Upon reviewing the list, 140 terms are close enough to warrant replacement or referencing.
The 12 terms which are particularly hard to choose the action have been discussed and decided.
Structure and Scope of IEC 60194 Ed. 7.0
Due to the large number of terms (~2400) on the current document, it is decided to include terms
directly related with TC91 only on the next edition, which is PCB and electronic assembly technology.
From an internal coordination of effort perspective, the consensus was that the numbering task be
deferred until all possible narrowing of the 60194 document to ONLY those needed for TC91 be
completed, to avoid the numbering effort on terms that will be dropped.
The details about the scope, size and numbering system of the 7th edition will be discussed at the
next meeting.
Next meeting is to be held in 6th May, 2014 in Nuremberg, Germany.
6.6 WG6
Mr. Hisao Kasuga, Co-convener of WG6, reported the activity of WG6.

Standard structure of TC91WG6
According to 91/1115/INF, It was reported that the new project number, IEC 62878-x-x for device
embedded substrate standards was officially registered as follows;
Part 1: Generic standards (IS)
IEC 62878-1
Device embedded substrate – Generic specification
IEC 62878-1-1
Device embedded substrate – Generic specification - Test method (the former
draft 62326-18)
Part 2: Guidelines and supporting documentation
IEC/TS 62878-2-1 Device embedded substrate – Guidelines - General description of technology
(the former d draft 62326-16)
IEC/TR 62878-2-2 Device embedded substrate – Guidelines - Electrical testing (the former draft
62326-15)
IEC/TS 62878-2-3 Device embedded substrate – Guidelines - Design guide (the former draft
62326-19)
IEC/TS 62878-2-4 Device embedded substrate – Guidelines - Test element groups (TEG) (the
former draft 62326-17)
Part 3: Sectional standards (IS)
IEC 62878-3-X
TBD

Terms in WG6 (IEC 60194 with IPC T-50)
Harmonization of some new terms of WG6 documents would be reviewed with relevant TCs
(TC47, SC47A, SC47D) as well as TC91WGs was addressed according to the “comparison table
of all terms of WG6 vs. that of TC91WGs and TC47” according to 91WG6(Richardson/Kasuga)1

IEC 62878-1 Ed. 1.0: Device embedded substrate - Generic specification
- By 2013-10-30, all members to review Huck-san’s draft before submitting it to
Secretary
- 2013-11-15, NP draft to be submitted to Secretary for CO circulation

IEC 62878-1-1 Ed. 1.0: Device embedded substrate - Generic specification- Test method
Waiting for approval and comments

IEC/TS 62878-2-1 Ed. 1.0: Device embedded substrate - Guidelines - General description of
technology
Waiting for approval and comments

IEC/TR 62878-2-2 Ed. 1.0: Device embedded substrate - Guidelines - Electrical testing
It was found that the latest document of 91/1138/CD was not the draft prepared by Mr.
Hyun-Ho Kim but old version which was not modified according to the last meeting decision
The 3CD draft re-confirmed by Project Leader and Convener shall be submitted to CO by
Secretary and 91/1138A/CD would be circulated

IEC/TS 62878-2-3 Ed. 1.0: Device embedded substrate - Guidelines - Design guide
Waiting for approval and comments

IEC/TS 62878-2-4 Ed. 1.0: Device embedded substrate - Guidelines -Test element groups (TEG)
Waiting for approval and comments

Next meeting
It was announced that TC91WG3 would be on the afternoon of 2014-05-05 in Nuremburg,
Germany in conjunction with JIC meeting and that would be held in 2014-11 in Tokyo, Japan.
6.7 WG10
Mr. Kunio Takahara, Acting Convener of WG10, reported the activity of WG10.
Discussion Items
IEC 61189-2-721: Measurement of Relative Permittivity and Loss Tangent for Copper Clad
Laminate at Microwave Frequency Using Split Post Dielectric Resonator
Observation for CD draft was explained


IEC 61189-2-629: Test method of adhesion between a dielectric and inkjet printed circuits
- Test method of adhesion between a dielectric and inkjet printed circuits
- Project leader confirmed to transfer this item to TC119
- WG10 considers to submit a series of adhesion tests

IEC 61189-3-719: Monitoring of single plated – through hole (PTH) resistance during the thermal
Cycles
CD draft will be ready in October, 2013

IEC 61189-3-913: Test methods for electronic circuit board for high-brightness LEDs
- 2nd CD is now in circulation until Oct. 11, 2013
- Discussion regarding if the document should contain general board contents or not
- 2nd CD deleted general board contents

IEC 62866 Ed. 1.0: Electrochemical migration test method (formerly, IEC 61189-3-720)
- Overlapping portion of IEC 61189-3-720 has been merged with 61189-5-5
- TR 62866 focus upon the test methods for PWBs
- Observation for CD draft was explained
- Targeting to issue TR by Jan., 2014

Any other business
Test methods for noise suppression materials for FPCB from Korean NC
Working to provide NP in Apr., 2014

Triplate line resonator method from Japanese NC
NP should be submitted before the next meeting

Supplementary document for the test methods for electronic circuit board for high-brightness
LEDs from Japanese NC
To be discussed at the next meeting
Next meeting was confirmed to be held in Nuremberg, Germany in May, 2014.
6.8 WG11
Mr. Dieter Bergman, Convener of WG11, reported the activity of JWG11.




Discussion of Standard IEC 61182-2-2
Discussion on Design sectional IEC 61182-2-1
Discussion on Assembly sectional IEC 61182-2-3
Provide CO with PAS proposal for replacement of all 61182 documentation. All existing documents
should be withdrawn as there is no known usage and invite participation of company
representatives to recommend modifications through the 2581 consortium.
Proposals for defining 3D orientation and explain the XML concepts for reference in the IEC
61188-8-1a IEC vs. ISO formats
Universal 3D (U3D) is a compressed file format standard for 3D computer graphics data.
The format was defined by a special consortium called 3D Industry Forum that brought together a
diverse group of companies and organizations, including Intel, Boeing, HP, Adobe Systems,
Bentley Systems, Right Hemisphere and others whose main focus had been the promotional
development of 3D graphics for use in various industries, specifically at this time manufacturing as
well as construction and industrial plant design. The format was later standardized by Ecma
International in August 2005 as ECMA-363.
The goal is a universal standard for three-dimensional data of all kinds, to facilitate data exchange.
The consortium promoted also the development of an open source library for facilitating the
adoption of the format. The library is also well known for having serious memory management
issues.
Can we develop a 3D XML schema??
Next meeting will be held on May 13, 2014 in Berlin after ECWC13.
6.9 WG12
Mr. Dieter Bergman, Convener of WG12, reported the activity of WG12.
Status of Land pattern standardization

Mathematical model for numerical recommendations
Still valid – avoid using worse case analysis. Use “sum-of-squares”
Discuss the idea of a 3 tier model Still OK however Component information should recommend
what to use as a default. Have WG2 review 61191-1,-2,-3 and -4 as well as IPC-A-610 and
determine the component mounting conditions per component type.
WG12 should develop a Land Pattern document with a close link to the Component Mounting
Document of WG2 using the simplified logic for component to and pattern descriptions.
Recommend the naming convention as a way to establish the relationship.
Continue discussion in WG2.

Status of PCB Library tools and component standardization
Mentor Calculator and Wizard, Ema footprint builder, PCB Libraries
Lots of tools, much interaction also difference

Discuss land pattern dimensions, especially for the new BTC Components and for the packages
smaller than 0603 (0402 and 0201). Review new Logic Descriptions that separate the rules for
the components that are smaller.
Discussed with new logic proposed.

IEC 61188-5-1 through IEC 61188-5-8 maintenance date is 2011.
The Working Group recommends the withdrawal of this series right away since many of the
dimensions are not appropriate for the components and the solder alloys used in the industry
today.

IEC 61188-5-1: Generic Requirements for land pattern descriptions Make as master document
- Describes all component types both surface mount and through hole and arrange them in the
order that they will appear in the sectionals -2 and -3 where the land patterns are defined.
Use the proposal by Japan and what is being proposed by TC47 and explain the best fit
indicating which “popular” name” or industry version fits with what group.
- New idea from IPC-7070 revision Consider new logic classification and joint effort by WG2
Discussion of re-organization based on merger of TC93 work into TC91 program

Submittal of PAS of IPC-2581B as replacement for 61182-1 out dated version Discuss at WG11
meeting and provide report to Plenary.

Discussion of 3 Dimensional Characteristics of Electronic Products IEC 61188-8-1
Remove from Program of work.
Discuss the subject of 3D descrtiptions in WG11 to see what the interest is
New activity for WG12 items

Discussion of methods to provide the Artwork for the patterns called for in the test methods.
Status of Action Item:
Discussion on going from Machine language (Gerber Data) to intelligent descriptions (61182-2).
IPC-2581 consortium wanted to provide a link to Gerber legacy files. This has something to do with
the naming convention which may not be XML compatible.
Next meeting will be held on May 12, 2014 in Berlin after ECWC13.
6.10 WG13
Mr. Satoshi Kojima, Co- Convener of WG13, reported the activity of WG13.

IEC/TR 62856 Ed. 1.0 (BVDL-The bird’s-eye view of design languages):
91/1085/DTR, the vote was closed on 05Apr2013 and then approved. BVLD was published on
07Aug2013. The project has been done by Kojima as the leader after fixing tens of editor’s
comments and French translation by FRNC

Maintenance works
Nine documents in WG13 have been reviewed. Two documents dated 2013 decided to be
changed according to IEEE maintenance schedule. The other seven ones were made no changes.
(1) IEC 61691-1-1 (VHDL): from 2013 to 2016
(2) IEC 61691-6 (VHDL-AMS): from 2013 to 2015

Dual Logo new proposals from IEEE
Dr. Stan Krolikoski as the IEEE DASC chair proposed to get started dual logo procedure of three
IEEE standards. WG13 agreed to be maintenance team of those future IS candidates.
(1) IEEE1685-2009 (IP-XACT)
(2) IEEE1801-2009 (Power Format)
(3) IEEE1734-2011 (Quality IP)

The TC91 US TAG approved and proposed NWIP of HDLMath TR. WG13 agreed to form the
project team. The TR describes one language that covers both the mathematical and HDL levels
of abstraction.

The next meeting will be held in conjunction with TC91 plenary meeting in Tokyo in November,
2014. Another meeting might be tentatively held in conjunction with international conferences
such as DVCon2014 and DAC2014, San Jose in March 2014 and San Francisco in June 2014
respectively.
6.11 WG14
Mr. Mitsuru Takahashi, Co- Convener of WG14, reported the activity of WG14.

IEC 62699 Ed.1.0: Mapping rules and exchanges methods for heterogeneous parts libraries.
The first CDV on 91/1078/CDV was rejected. WG14 discussed and appointed the future
progress direction, and decided to do two parallel projects, one IS project for the normative parts
of IEC 62699 and another TR project for the informative parts.
The DTR document on “Rules and methods for integrated use of heterogeneous parts libraries”
will be prepared for ballot by November 30, 2013, and will be forwarded to Secretary.
The second CDV document with all the comments in 91/1104/RVC addressed will be prepared
for ballot by March 31, 2014, and will be forwarded to Secretary.

New business
WG14 set up two new business and confirmed continuous examination of standardization.
(1) IPC 2581/ISO STEP Translator
(2) PDX (product data exchange) technology

Maintenance works
Stability date to four documents in WG14 has no change.
(1) IEC/TR 62014-3 Ed. 1.0 : 2015
(Electronic design automation libraries, IC models for EMI)
(2) IEC/TR 61908 Ed. 1.0 : 2015
(The technology roadmap for industry data dictionary structure, ---)
(3) IEC 61690-2 Ed. 1.0 : 2015
(Electronic design interchange format (EDIF), version 400, HTML format)
(4) IEC 61690-1 Ed. 1.0 : 2015
(Electronic design interchange format (EDIF), version 300, HTML format)
The next meeting is to be held on May 2014 in Germany, and the following meeting on November
2014 is to be held in conjunction with the TC91 Plenary meeting in Tokyo, Japan.
6.12 WG15
Mr. Osamu Karatsu, Co- Convener of WG15, reported the activity of WG15.

Approval of agenda, confirmation of membership and attendees.

Report from Feeder organization, IEEE SCC20

Dual Logo proposals, 5 IS and 2 TR candidates, from IEEE SCC20
AI-ESTATE
IEEE 1232-2010 (IEC-62243 (1232-2002))
DTIF
IEEE 1445-2010 (IEC-61445 (1445-1998))
DTIF Users Guide IEEE 1546-2000 (R2011) -> TR
STD
IEEE 1641-2010 (IEC-62529 (1641-2004)
C/ATLAS
IEEE 716-2011 (IEC-61926 (716-1995))
ATLAS Users Guide IEEE 771-1998 (R2009) -> TR
ATML
IEEE 1671-2010 (IEC-61671 (1671-2006))


Maintenance works
9 IS and 1 TR documents in WG15 have been reviewed. No stability date change was necessary.
The next meeting will be held in conjunction with TC91 plenary meeting in Tokyo in November,
2014. Another meeting might be planned held in conjunction with IEEE SCC20 meeting in early
spring 2014 (schedule TBD).
7. Updated the Program of Work of TC91 as recorded by IEC Central Office
Mr. Dieter Bergman, Chairman of TC91, suggested that convener of each WG should modify the
schedule of each project stated in 91/1145/PW and report to secretary by October 25, 2013.
8. Review of Liaisons
How to construct the cooperation with other TCs that concludes the liaison relationship with TC91 will be
discussed at the TC’s Officer meeting in IEC general meeting, Tokyo in 2014.
9. Review of stability date
10. Review of the Strategic Business Plan
Mr. Dieter Bergman, Chairman of TC91, suggested that convener of each WG should modify the Stability
Date of each project and Strategic Business Plan in SMB/4961/R and report to secretary by October 25,
2013.
11. Proposed creation of the role of “Vice Chairman” in IEC/TC91
See 5. Report from the Secretary (2)
12. Any other business

Establishment of “Advisory Working Group” in TC91 was proposed by German NC and approved to
be advanced to next step.
Purpose and Work program
- To contact to other TCs asking for there inputs to develop a standardization strategy based on
“JISSO” idea
- To join/organize conferences to determine technology trends and to discuss standardization
needs
- To develop work program based on inputs a standardization roadmap
- To synchronize within TC91 and with roadmap of other committees and stakeholders
Convener: Vice Chairman
Members: Conveners of the WGs and Invited experts
Meetings: Face to face twice a year, Web-meeting on demand

AC document concerning “Call for candidates from TCs and SCs as members of ACEA (Advisory
Committee on Environmental Aspects) were introduced by Mr. Masahide Okamoto, Secretary of
TC91.
Applicant should contact Mr. Masahide Okamoto by middle of November 2013.
13. Date and place of the next meeting
Next meeting is to be held in Tokyo, Japan in November 2014.