KYOCERA Corporation
Die Attach Pastes for Electronic
Devices
Product Classification of Die Attach Paste
Our die attach paste is classified in categories for semiconductors, LEDs and
electronic components. Furthermore, there is standard type, high thermal
conductivity addition type, low-temperature curable type, and available for
large-size device type as a characteristic of each product.
The below table gathered up the recommended products in each category and
characteristic. There are the products with an each characteristic. In addition,
we suggest a no listed product in this catalogue and a custom product
developed to meet a need of customer. Please feel free to contact us.
*1
*2
○
◆
Product Classification of Die Attach Paste
Use
Application
Standard
High
Thermal
Conductivity
Low
Temperatur
e Curable
(*1)
For
large
size
(*2)
○
◆ CT2510
○
Semiconductor
○
○
○
○
QFP/QFN
○
BGA
Visible light LED
Coupler
○
○
CT284T-1
CT262M
CT285LT
○
CT285F
○
CT2001E
○
CT2020E
○
CT2100
○
CT2021E
○
◆ CT256
CT262K
CT285
CT285-2
CT265L
◆ CT2021S
◆ CT256B
LED
○
CT220HK-D2
○
CT288-3
○
○
Electronic
components
Capacitor
CT284R
◆ CT256BL2
CT212HS-F1
White LED
Power LED
Recommended product
CT212H
○
SOP/DIP
：Cure temperature <150℃
：Adhesive area >5mm2
：Recommended item
：Insulation paste
CT284T-1
○
CT285LT
○
CT233KF
Resonator
○
CT290K-1
High thermal
resistivity
○
CT291
CT220HK-S1
CT285
CT227L
CT285MK
This product classification table is current as of February 2016, and is subject to change at any time depending on product development.
For details, please contact our sales staff.
Die Attach Paste for Semiconductors
Our paste product for semiconductors has many actual achievements as die
attach paste for IC, LSI, transistor and various discrete devices. We have
contributed to improving the performance, function and productivity of
semiconductor devices by responding to the needs of customers.
Our line-up includes a standard type for good conductivity and a low-stress
type for large-size devices or a low-temperature curable type and an in-line
curable type or a high reliability type for in-vehicle applications. In addition,
there is a series of insulation paste products which is highly rated by
customers. We offer high reliability for a wide range of applications by
having various products that match to device sizes and applications.
Conductive Paste for Semiconductors
Product
name
Viscosity
(Pa･s)
Elastic
modul
us
(GPa)
Tg
(℃)
Thermal
conductivity
(W/m･k)
Volume
resistivity
(Ω･cm)
Adhesive strength
（N/4mm2）
25℃
260℃
Cure condition
(In-line)
Applied
chip size
Characteristics
CT212H
120
6.0
180
2.8
4x10-5
40
25
200℃x1.5h
～2mm2
For small-size IC
good electrical
conductivity
CT262K
90
6.0
115
1.3
1x10-2
140
15
150℃x1h
(180℃x120s)
2～8mm2
General type
For in-vehicle
15
100℃x2h
or 150℃x1h
(180℃ｘ60s)
2～8mm2
Low-temperature
and fast cure
Inhabitation of
oxidation for Cu
flame
135℃x2h
or 150℃x1h
1～8mm2
For SOP/QFP/QFN
Low-stress
CT265L
80
6.2
110
1.0
1
150
CT2001E
30
6.7
50
0.5
6x10-1
190
(Cu)
(Cu)
CT2020E
20
0.6
50
0.5
8x10-1
100
(Cu)
30
(Cu)
170℃x1h
1～15mm2
For SOP/QFP/QFN
Lead Flame : Cu
Low-stress
Low Moisture
CT2021E
30
2.5
65
0.7
6x10-1
150
27
170℃x1h
1～15mm2
For BGA
Low-stress
Low Moisture
(Cu)
18
(Cu)
Insulator paste for semiconductor
Product
name
Viscosity
(Pa･s)
Elastic
modulus
(GPa)
Tg
(℃)
Thermal
conductivity
(W/m･k)
Volume
resistivity
(Ω･cm)
CT2021S
50
1.5
70
0.3
CT256B
75
6.5
95
CT256BL2
50
6.7
CT256BL2
B
45
CT2510
5
Adhesive strength
（N/4mm2）
Cure condition
(In-line)
Applied
chip size
Characteristics
25℃
260℃
5x1016
140
22
170℃x1h
2～15mm2
For BGA
Low-stress
Low Moisture
0.3
5x1016
130
18
100℃x1.5h
or 150℃x1h
(180℃x60s)
2～8mm2
Low-temperature
and fast curable
Black color type
95
0.3
5x1016
200
<
10
100℃x1.5h
or 150℃x1h
(180℃x60s)
2～8mm2
Low-viscosity
type
of CT256B
6.7
95
0.3
5x1016
200
<
10
100℃x1.5h
or 150℃x1h
(180℃x60s)
2～8mm2
Thickness control
type of CT256BL2
7.2
175
0.3
3x1015
150
25
150℃x1h
～5mm2
Support smallsize chip
High-Tg
micro dispensing
High Thermal Conductive Paste
Our high thermal conductive paste product was developed as a heat radiation countermeasure
for small and high-density assembly of semiconductor packages and an environmentally
friendly product for use as a substitute of lead solder. It has a thermal conductivity of the
highest level in the industry from its high filling of silver filler and also has a high electrical
conductivity. Therefore, it has been adopted by many customers since first developed. By
applying our product adoption results, technical know-how and research results that we have
accumulated as a market pioneer, we have succeeded in the paste development of a low
temperature cure type and a low stress type.
In the rapidly developing smart society, energy control technology is expected to become the
most important key technology. Please consider our high thermal conductive paste for various
power devices such as power IC, LSI and power LEDs.
High Thermal Conductive Paste
Thermal
conduct
ivity
(W/m･
k)
Viscos
ity
(Pa･s)
Elastic
modul
us
(GPa)
Tg
(℃)
CT262M
100
10.0
115
5
CT284R
90
17.0
165
CT284T-1
90
15.0
CT285
100
CT285-2
Name
Volume
Resistivity
(Ω･cm)
Adhesive
strength
（N/4mm2）
Cure
condition
(In-line)
Applied
chip size
Characteristic
260℃
6x10-4
160
20
150℃×1.5h
2～8mm2
Solventless
Corresponding largesize IC
25
8x10-6
40
35
150℃x0.5h
+200℃x1.5h
～3mm2
High electrical and
thermal conductivity
standard type
160
25
1x10-5
35
35
150℃x0.5h
+200℃x1.5h
～3mm2
CT284R solventless
long tack free
16.5
160
25
9x10-6
35
28
150℃x0.5h
+200℃x1.5h
～4mm2
High electrical and
thermal conductivity
standard type
90
17.0
160
40
5x10-6
30
23
150℃x0.5h
+200℃x1.5ｈ
～3mm2
High electrical and
thermal conductivity
CT285 hi filling type
CT285F
85
11.0
165
30
2x10-5
45
35
150℃x1h
+200℃x1.5h
～6mm2
High electrical and
thermal conductivity
low-stress
corresponding largesize chip
CT285LT
100
15.0
120
25
3x10-5
50
25
160℃x1.5h
～4mm2
High electrical and
thermal conductivity
low-temperature cure
CT2100
90
9.0
120
30
2x10-4
95
25
130℃x0.5h
+180℃x1.0h
～6mm2
High Thermal
Conductivity
Low Stress
Relation between silver-content rate
and thermal conductivity
CT284R / CT285 / CT285-2
Conventional product (75-80%)
Silver content rate (wt%)
Device reliability test
Rate of change
of thermal resistivity
Thermal conductivity (W/mK)
25℃
Conventional
silver paste
Hi thermal conductive paste
of other companies
Hi thermal conductive paste CT285
PbSn solder
Thermal sock cycles
Pretreatment condition (P.C.): 85℃/85%/72h+260℃
TCT: -60℃(30min)⇔150℃(30min) reflow 3-times
Conductive Pastes for LED
and Electronic Components
We have expanded the business of pastes for LED and electronic
components, and we have the results from many customers. In
particular, our silver paste for LEDs has had the best sales share in the
world and can meet various needs.
Because our paste for LEDs has characteristics of excellent
conductivity, workability and reliability, it has got a high evaluation
of standard pastes in the LED industry.
Our paste for electronic components has been adopted for adhesion of
capacitors and quartz resonators, and we have a characteristic product
line-up. For customer requirements of cost reduction, we also have a
line-up of paste products using silver coated conductive.
Conductive Paste for LEDs
Viscos
ity
(Pa･s)
Elastic
modul
us
(GPa)
Tg
(℃)
CT212HS
-F1
200
8.8
130
2.0
CT220HK
-S1
115
6.3
115
CT220HK
-D2
115
8.0
CT227L
90
CT288-3
85
Name
Thermal
conductiv
ity
(W/m･k)
Volume
Resistivity
(Ω･cm)
Adhesive
strength
（N/4mm2）
Cure
condition
(In-line)
Applied
chip size
Characteristic
25℃
260℃
4x10-5
120
30
200℃x1.5h
～2mm2
Low pollution by
outgas
For coupler application
2.0
1x10-4
60
13
150℃x1.5h
～2mm2
For general purpose
LED
standard type
115
2.0
1x10-4
80
15
150℃x1.5h
～2mm2
For general purpose
LED
High reliability
6.5
143
2.0
5x10-5
75
20
150℃x1.5h
～2mm2
Low temperature cure
Good strength during
hot state
7.8
90
1.8
2x10-4
150
20
150℃x1.0h
～4mm2
Good thermal and UV
resistance
High reliability
Conductive Paste for Electronic Components
Viscos
ity
(Pa･s)
Elastic
modul
us
(GPa)
Tg
(℃)
CT233KF
80
9.5
130
6.0
CT290K-1
90
1.0
-40
2.0
Name
Thermal
conducti
vity
(W/m･k)
Volume
Resistivity
(Ω･cm)
Adhesive
strength
（N/4mm2）
Cure
condition
(In-line)
Applied
chip size
Characteristic
25℃
260℃
1x10-4
200
30
150℃x1.0h
1～3mm2
Low pollution by
outgas
For tantalum
capacitor application
5x10-5
40
15
100℃x0.5h
+180℃x1.0h
1～4mm2
Low modulus type
Silicon modification
Measurement conditions in the table
Viscosity: E-type 3°cone, Value of 0.5min-1
Modulus: DMA25℃
Tg: DMA
Adhesive strength: Cu/Ag plating flame vs. Bare-Si (2x2mm2)
Pressure-less Silver Sintering Paste
Recently, power devices such as IGBTs, LED power and automotive modules need
more strict critical quality and are reaching their performance limit with resin-based
DA pastes, so a new solution is needed to overcome technical hurdles. In addition, for
environmental and health endangerment from lead, the semiconductor industry is
making every effort to eliminate high-lead solder, when feasible. However, even now
there is no single identified lead-free solution for all applications. The unique properties,
such as the high melting point and thermal conductivity of these high-lead alloys are
necessary for the level of reliability required for these products. Therefore, in order to
achieve their requirement, we have developed pressure-less silver sintering paste based
on nano-Ag technology. Our paste demonstrates a thermal conductivity of more than
200W/mK and excellent die shear adhesion to bare Cu as well as noble plating like
gold and silver. Moreover, this paste shows excellent interface reliability in not only
general automotive requirements but also in SiC applications with high Tj by adoption
of an original resin dispersion system.
Pressure-less Silver Sintering Paste
Viscosity
(Pa･s)
Elastic
modulus
(GPa)
Thermal
conductivity
(W/m･k)
Volume
Resistivity
(Ω･cm)
CT2700R6
60
17.6
200
CT2700R7
55
26.2
CT2700R7S
100
21.6
Name
Adhesive strength
（N/4mm2）
Cure condition
(Nitrogen)
Applied chip
size
Characteristic
25℃
260℃
6x10-6
>400
>400
200deg.Cx1.5h
(250deg.Cx1.5h)
2～6mm2
Standard
High thermal
conductivity
200
4x10-6
>400
>400
200deg.Cx1.5h
(250deg.Cx1.5h)
1～10mm2
For Bare Cu
application
Excellent interface
reliability
200
4x10-5
>400
>400
200deg.Cx1.5h
(250deg.Cx1.5h)
0.3～
12mm2
Printable
Wide die size
window
Sintering Mechanism
um size Ag
Ag nano particle
CT2700R7
Excellent heat conduction path
by intermetalic bond between Ag particles
Comparison with solder
High Adhesion
Thermal Resistance
Rth (K/W)
Die shear@260C (MPa)
Adhesive Strength
Low Thermal
Resistance