Performance Comparison between Carbon Nanotube and Copper Interconnects for GSI Azad Naeemi, Reza Sarvari, and James D. Meindl 791 Atlantic Dr. N.W. Atlanta, GA 30332, Georgia Institute of Technology, Email: azad@ece.gatech.edu Abstract The performances of minimum-size copper and carbon nanotube interconnects are compared for various ITRS generations. Results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Since wave propagation is slow in a single nanotube, nanotube-bundles with larger wave speeds must be used. At the 45nm node (year 2010), the performance enhancement that can be achieved by using nanotube-bundles is negligible, and at the 22nm node (year 2016) it can be as large as 30% and 80% if carbon nanotubes with electron mean free paths of 5µm and 10µm, respectively, can be fabricated. Introduction As interconnect feature sizes shrink, copper resistivity increases due to surface and grain boundary scatterings, and also surface roughness [1]. Furthermore, wires, especially power and ground lines, are becoming more and more vulnerable to electromigration because of rapid increases in current densities [2]. In contrast, carbon nanotubes exhibit ballistic flow of electrons with electron mean free paths of several microns, and are capable of conducting very large current densities [3]. Carbon nanotubes are therefore proposed as potential candidates for power and signal interconnection [4, 5]. In this paper, after reviewing the circuit models for single wall carbon nanotubes (SWCN), the performances of copper wires and nanotube interconnects are compared. The results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Circuit Models for Metallic Carbon Nanotubes Neglecting electron spin and sub-lattice degeneracy, the dc conductance of an ideal quantum wire is e2/h, where h is the Plank constant, and e is electron charge [6]. For a nanotube above a ground plane, its magnetic inductance is rg µ (1) lm = 0 ln( ) ≈ 0.2 pH / µ m r0 2π where rg and r0 dimensions are shown in Fig. 1. The current carriers of a nanotube occupy the 1-D conduction bands with very low density of states, and hence the kinetic energy stored in current is so large that it results in a very large kinetic inductance [6, 7, 8]. To explain this qualitatively, the energy levels and wave vectors accessible to free electrons in a quantum wire are shown in Fig. 2. Due to the degenerative approximation, all states below the Fermi level are occupied and the states above are empty. At zero current, the number of electrons moving from left to right (with positive k vectors) is the same as those moving in opposite direction (negative k vectors). To generate current, ε= h2k 2 2m εF kF δk = 2π L k Figure 2: Electron energy versus wave-vector in a quantum wire. Allowable states are shown by circles. Wave-vectors of electrons have to be integer multiplications of 2π/L where L is the length of the quantum wire. Due to the degenerative approximation, all states below the Fermi-level, εF, (gray area) are filled. For current equal to zero, the numbers of right-mover electrons (positive k) and left-mover electrons (negative k) are the same. The axes are not to scale since kF >>> δk. some of the left-movers should be converted to right-movers or vice versa, and since only one electron can stay at each state (two if spin of electrons is considered), the converted electrons have to go to higher states (Fig. 3). In this manner, the kinetic energy of the system increases as N2/D(εF) where N is the number of converted electrons and D(εF) is the density of states near the Fermi level. By equating the kinetic energy stored in current I with LkI2/2, one can calculate kinetic inductance per unit length as h (2) lk = 2 2e v F where vF is the Fermi velocity [8]. For graphene and hence carbon nanotubes vF =8×105 m/s [6, 7]. The kinetic inductance per unit length of carbon nanotubes is therefore around 16nH/µm, more than 4 orders of magnitude larger than its magnetic counterpart (1). The electrostatic capacitance of a nanotube above a ground plane is 2πε r ε 0 2πε r ε 0 (3) cE = ≈ ≈ 100aF / µ m cosh −1 (rg / 2r0 ) ln(rg / r0 ) ε εF-R εF-L k rg r0 Figure 1: A single-wall carbon nanotube above an ideal ground plane. Figure 3: The Fermi levels for left and right movers (εF-L and εF-R, respectively) in a quantum wire with a net current from left to right. Some of the left-movers are converted to right-movers because of which the kinetic energy of the system has increased. Due to small density of states compared to the 3-D cases, the kinetic energy stored in current is large which results in a large kinetic inductance. The axes are not to scale since kF >>> δk. 0-7803-8684-1/04/$20.00 ©2004 IEEE CL h/2e2 lk cQ h/2e2 lk lk lk cQ cQ cQ h/2e2 Ground Plane h/2e2 Figure 6: Single layer of carbon nanotubes above a ground plane. Connecting these nanotubes in parallel lowers the overall contact resistance, characteristic impedance, and inductance. The wave propagation speed; however, does not change considerably because overall capacitance increases. cE h/2e2 2 h/2e h/2e2 h/2e2 Figure 4: The circuit model for a single wall carbon nanotube considering spin and sub-lattice degenercies [6]. The magnetic inductance is not shown because it is more than 4 orders of magnitude smaller than the kinetic inductance. where εrε0 is the dielectric permittivity. To add electric charge to a quantum wire, one must add electrons to available states above the Fermi level (Pauli exclusion principle); hence there is a quantum capacitance of 2e 2 (4) cQ = hvF in series with the electrostatic capacitance [6, 7, 8]. The quantum capacitance of a carbon nanotube is 100aF/µm, which is in the same order of magnitude as its electrostatic counterpart (3). Electron spin and sublattice degeneracy result in four parallel channels shown in Fig. 4 through which three spin-modes and one charge-mode can travel [6]. The effective circuit for the charge-mode is shown in Fig. 5 [6]. The wave propagation speed of nanotubes and their characteristic impedance are 1 1 1 (5) v= ( + ) lK cE cQ and Z 0 = lK ( (6) 1 1 + ) cE cQ respectively. Assuming that the electrostatic and quantum capacitances are equal, the wave speed is 5vF= 1.78×106, which is 162 times smaller than the speed of light in free space. The characteristic impedance also becomes numerically 7.1 KΩ. The speed of spin-modes through which no charge is transferred is always vF regardless of nanotube electrostatic capacitance [6]. Due to large values of contact resistance and characteristic impedance of a single nanotube, many of them need to be used in parallel for interconnect applications. Connecting nanotubes above a ground plane in parallel as shown in Fig. 6 decreases the inductance; however, the overall capacitance also increases Contact Resistance, h/8e2 Contact Resistance, lk/4 h/8e2 4cQ cE CL Ground Plane Figure 7: A bundle of carbon nanotubes above a ground plane. The wave propagation speed increases as n , where n is the number of nanotubes in the bundle. because of which the wave propagation speed remains approximately constant. Latency of such a “single layer” nanotube interconnect is L (7) τ = 0.7 + nano Rtr CL where Rtr is driver resistance (equal to the line characteristic impedance for impedance matching), CL is load capacitance and L is interconnect length. In contrast, using a bundle of carbon nanotubes above a ground plane as shown in Fig. 7 allows lowering inductance with no considerable change in capacitance because of which the wave propagation speed increases as n0.5, where n is the number of nanotubes in the bundle. For n>100, the wave travel time becomes much smaller than the RC charge up time of most typical interconnects even at the end of the ITRS, and hence latency would be equal to (8) τ bundle = Rtr (cbundle L + CL ) where cbundle is capacitance per unit length of the bundle of nanotubes. Since the diameter of SWCNs can be less than 1 nm [9], a bundle of, for instance, 400 SWCNs can be as narrow as 20nm. Ideal Carbon Nanotubes versus Copper Wires For copper interconnects, the RC distributed model τ wire = 0.7 Rtr C L + 0.7( rint CL + cint Rtr ) L + 0.4rint cint L2 (9) can be used where rint and cint are resistance and capacitance per unit length of copper wires [10]. Resistance per unit length, rint can be calculated by the combination of FuchsSondheimer and Mayadas-Shatzkes models for surface scattering and grain boundary scattering [11, 12], respectively. For the 22nm node (year 2016), latencies of carbon nanotube and copper interconnects are plotted versus length in Fig. 8. It is evident that for all practical lengths, a single level of nanotubes above a ground plane has a latency larger than that of a copper wire because of its very small wave propagation speed. A bundle of nanotubes, however, has a smaller latency especially for long lengths. By comparing (8) and (9), and assuming that cbundle≈ cint, the ratio of latencies of nanotube bundles and copper wires can be written as 0.57 + Figure 5: The effective circuit model for the charge mode propagation in a single wall carbon nanotube [6]. 2v F CL τ copper cint L rint L r L = 1+ ≈ 1 + int CL R Rtr τ Bundle tr 1+ 0-7803-8684-1/04/$20.00 ©2004 IEEE cint L (10) Figure 8: Latency versus interconnect length for ideal single-layered carbon nanotubes above a ground plane, minimum sized copper wires implemented at the 22 nm technology node (year 2016) and bundles of ideal SWCNs for n>100. For copper interconnects, surface scattering co-efficient, p, and grain boundary reflection coefficient, R, are pessimistically assumed to be 0 and 0.5, respectively. Figure 9: Latency versus interconnect length for minimum sized copper wires implemented at the 22 nm node and bundles of SWCNs with electron mean free paths of 5µm and 10µm. For copper interconnects p=0 and R=0.5 are assumed. suitable for lengths larger than 10 times the electron mean free path. The performance enhancement that can be achieved by using carbon nanotubes is a function of length as shown in Fig. 11. The maximum performance enhancement and the which shows that performance enhancement is larger for longer length at which it occurs are given by interconnects and larger drivers. ⎧⎪ ⎫⎪ τ copper ⎡L r ⎤ 2R (14) ≈ max ⎨0.76 ⎢ 0 int (ln tr − 1) + 1⎥ , 1⎬ R R τ Bundle max ⎪ ⎪ tr 0 ⎣ ⎦ ⎩ ⎭ Non-Ideal Carbon Nanotubes versus Copper wires Even initially ideal carbon nanotubes become disordered and once they are physisorbed on a surface [13]. Electron mean free ⎡ 2R R ⎤ (15) Lmax ≈ 2 L0 ⎢0.8ln( tr ) + 0.25 − 0.25 tr ⎥ , path in real carbon nanotubes is hence finite. Electron-phonon R L r 0 0 int ⎦ ⎣ scattering that is dominant in copper wires is inelastic. In respectively. In Fig. 12, the maximum performance contrast, electron-defect scattering, which is the major scattering enhancement that can be achieved by carbon nanotubes is mechanism in carbon nanotubes, is elastic because of which plotted versus electron mean free path in carbon nanotubes for electron waves in nanotubes do not loose their phase coherency. four various technology generations. It can be seen that the The incident electron wave and reflected waves therefore performance enhancement at the 45nm node (year 2010) is interfere and resistance increases exponentially with length [13, 14]. Resistance of a bundle of nanotubes can be written as [13, negligible even if mean free paths as large as 10µm or 20µm are achieved. This is mainly due to small resistance per unit 15] L (11) R = R0 e 2 L0 where R0 is the resistance of the bundle of defect free nanotubes (ideally equal to h /(4e2n)), and L0 is the electron mean free path. As an example, in Fig. 9, latencies of nanotube-bundles and copper interconnects implemented at the 22nm node are plotted versus interconnect length for L0 =5µm and L0 =10µm. There is a length beyond which resistance of nanotube bundles become larger than that of copper wires. This length is equal to R (12) Lcrit = −2 LambertW (−1, − 0 ) rint L0 where LambertW(-1, x) is the solution of equation exp(x)=x. Equation (12) can be approximated by ⎡ 2r L ⎤ (13) Lcrit ≈ 2 L0 ⎢ 0.9 + 1.15ln( int 0 ) ⎥ R0 ⎦ ⎣ with less than 5% error for 2rL0 / R0 > 10 , which is valid for virtually all practical cases. The critical length is plotted versus electron mean free path in Figure 10. As a rule of thumb, it can be said that the critical length is roughly 10 times the electron mean free path. This means that carbon nanotubes are not Figure 10: The critical length beyond which resistance of nanotubebundles becomes larger than that of minimum size copper interconnects versus electron mean free path in carbon nanotubes for three generations of technology. 0-7803-8684-1/04/$20.00 ©2004 IEEE Figure 12: Maximum performance enhancement that can be achieved by using carbon nanotubes versus electron mean free path in nanotubes for four various generations of technology. At the 22nm node (year 2016) performance enhancement is 30% for mean free path of 5µm, and it can be as large as 80% if achieving a mean free path of 10µm is feasible Figure 11: Relative performance of nanotube-bundles to minimum sized copper interconnects implemented at the 22nm node (year 2016) versus interconnect length for three various values of electron mean free path in carbon nanotubes. length of copper wires. At the 22nm node (year 2016), however, performance enhancement is 30% for mean free path of 5µm, and it can be as large as 80% if achieving a mean free path of 10µm is feasible. It is also evident from Fig. 12 that the maximum performance enhancement increases linearly as electron mean free path in nanotubes increases. As (14) shows, the key factor determining the maximum performance enhancement is the product of resistance of a copper interconnect whose length is equal to the mean free path of electrons in carbon nanotubes and reciprocal driver resistance (rintL0/Rtr ). In other words, having a larger resistance per unit length of copper interconnects, a larger electron mean free path of electrons in carbon nanotubes, or a smaller driver resistance augment the advantage of using carbon nanotube interconnects. The electron mean free path in a carbon nanotube is a function of the amount of disorder as well as the nanotube diameter. Since electron wave has a doughnut-like wave packet extended around its circumference, the effective disorder that an electron experiences is smaller for larger diameters because of which electron mean free path is linearly proportional to nanotube diameter [13]. Nanotubes with very large diameters, however, may not be mechanically robust. Conclusions For the first time, the performances of carbon nanotube and minimum-size copper interconnects are compared for various generations of technology. The wave propagation speed in a single carbon nanotube above a ground plane is more than two orders of magnitude smaller than the speed of light in free space because of extremely large kinetic inductance values. It is therefore critical to use bundles of nanotubes to lower the overall inductance value without increasing capacitance to improve the wave speed such that the RC charge-up time becomes dominant. Otherwise, latency of minimum-sized copper interconnects will be smaller than that of nanotubes for all practical lengths. Resistance of carbon nanotubes is exponentially proportional to the ratio of nanotube length to electron mean free path. Hence there is a critical length beyond which minimum size copper wires have smaller latencies compared to nanotube-bundles. As a rule of thumb, this critical length is roughly 10 times the electron mean free path in nanotubes. It is also shown that the maximum performance enhancement that can be achieved using nanotubebundles is proportional to the product of reciprocal driver resistance and resistance of a copper interconnect whose length is equal to the mean free path of electrons in carbon nanotubes. The performance enhancement at the 45nm node (year 2010) is negligible even if mean free paths as large as 10µm or 20µm are achieved. 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