Hitachi Semiconductor Package
DATA BOOK
ADE 410-001A
Introduction
Thank you for using Hitachi’s semiconductor devices.
The growing market for electronic equipment requires mounting semiconductor
devices with higher functional capacity and higher density and developing packages
for housing them.
As we deal with the contradictory aims of enlarging chip sizes and making packages
smaller, the concerted efforts of the entire company are focused on advances being
made in development of packaging materials, stress analysis simulation and
development of mounting technology.
As the packages we develop are used throughout the world, we have pursued
international standardization through package outline and materials standardization
organizations in Japan and abroad.
Our catalog of packages was first published in Japan in 1984. There have since been
five editions. During this period, they were carefully evaluated from various
aspects. From this point on, the format is being changed to a data book format and
the contents have been made more substantial. We hope you will use it on a regular
basis when using our semiconductor devices. In addition, we would appreciate your
comments.
These descriptions attempt to make accurate and clear explanations and to include
the most recent information. However, there may be points that have not been
thoroughly presented. If you notice any such points, please send us your comments.
This data book is concerned primarily with general topics. Please consult with our
Semiconductor Division for details about individual data.
March 1994
Semiconductor & Integrated Circuit Division,
Hitachi, Ltd.
The contents recorded in this document consist of technological information
concerning semiconductor packages. Although we believe the data are accurate,
there are restrictions in respect to such legal aspects as patents, contracts and
guarantees.
2
Contents
Section 1 Introduction of Packages ................................................................................................. 5
1.1
1.2
1.3
1.4
1.5
Types of Packages and Advantages ..................................................................................................... 5
1.1.1 Types of Packages .................................................................................................................... 5
1.1.2 Package Structures .....................................................................................................................7
1.1.3 Advantages of Principal Packages ......................................................................................... 13
IC Package Names and Code Designations ....................................................................................... 19
Method of Indicating IC Package Dimensions .................................................................................. 20
1.3.1 Definitions of Package Dimension Reference Characters ..................................................... 21
1.3.2 Examples of Indications of Dimensions in Terms of External ............................................... 24
Lineups in Terms of Shapes and Materials ........................................................................................ 31
1.4.1 IC Packages ............................................................................................................................ 31
1.4.2 Transistors .............................................................................................................................. 38
Package List ....................................................................................................................................... 39
1.5.1 IC Packages ............................................................................................................................ 39
1.5.2 Pin Insertion Type Discrete Packge ........................................................................................ 48
1.5.3 Surface Mount Type Discrete Package ....................................................................................49
1.5.4 Hybrid IC Package ...................................................................................................................50
Section 2 Package Outline Dimensions ....................................................................................... 53
2.1
2.2
2.3
2.4
2.5
2.6
IC packages ....................................................................................................................................... 53
2.1.1 Pin Insertion Packages ........................................................................................................... 53
2.1.2 Surface Mount Packages ...................................................................................................... 119
Transistor Packages ......................................................................................................................... 200
2.2.1 Pin Insertion Packages ......................................................................................................... 200
2.2.2 Surface Mount Packages ...................................................................................................... 207
Diode Packages ............................................................................................................................... 216
Optodevice Packages ....................................................................................................................... 223
2.4.1 Laser Diode Packages .......................................................................................................... 223
2.4.2 IRED Packages ..................................................................................................................... 232
2.4.3 Photo Diode Packages .......................................................................................................... 237
Module and Array Packages ............................................................................................................ 242
2.5.1 Modules ................................................................................................................................ 242
2.5.2 Array Packages ..................................................................................................................... 249
Standard Packages for Hybrid IC ................................................................................................... 251
Section 3 Thermal Resistance of IC Packages ......................................................................... 253
3.1
3.2
3.3
Thermal Resistance ......................................................................................................................... 253
Thermal Resistance Testing Method ............................................................................................... 254
Thermal Resistance of Various Packages ........................................................................................ 255
3
Contents
Section 4 Packing Specifications ................................................................................................. 259
4.1
4.2
4.3
4.4
4.5
Forms of Package Packing ................................................................................................................259
Moistureproof Packing ......................................................................................................................260
Surface Mount IC Package Specifications ........................................................................................261
IC Packages ..................................................................................................................................... 265
4.4.1 Magazines for IC .................................................................................................................. 265
4.4.2 Trays for IC .......................................................................................................................... 281
4.4.3 Taping for IC ........................................................................................................................ 303
Transistors and Diodes .................................................................................................................... 307
4.5.1 Magazines for Transistors and Diodes ................................................................................. 311
4.5.2 Taping for Transistors and Diodes ....................................................................................... 313
Section 5 Sockets for Evaluation of Characteristics .............................................................. 323
5.1
5.2
5.3
5.4
Sockets for IC Packages .................................................................................................................. 323
Sockets for Transistors .................................................................................................................... 332
Precautions for Handling Sockets ................................................................................................... 332
Methods of Purchasing Sockets ....................................................................................................... 333
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without Hitachi's permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other reasons
during operation of the user's unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and performance of
Hitachi's semiconductor products. Hitachi assumes no responsibility for any intellectual property claims or other
problems that may result from applications based on the examples described herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi's products are not authorized for use in MEDICAL APPLICATIONS without the
written consent of the appropriate officer of Hitachi's sales company. Such use includes, but is not limited to, use in life
support systems. Buyers of Hitachi's products are requested to notify the relevant Hitachi sales offices when planning
to use the products in MEDICAL APPLICATIONS.
4
Section 1 Introduction of Packages
1.1 Types of Packages and Advantages
1.1.1 Types of Packages
The packages are classified as indicated in figure 1-1 through figure 1-3 on the basis of their mounting
characteristics on printed circuit boards and their shapes.
IC Package
Insertion type
Standard package
DIP
(Dual In-line Package)
ZIP
(Zigzag In-line Package)
SIP
(Single In-line Package)
PGA
Shrink package
Surface
mount type
Gull wing
lead package
S-DIP
Two-directional
type
Four-directional
type
J-lead package
Two-directional
type
SOP
HSOP
(SOP with Heat Sink)
SSOP
(Shrink SOP)
QFP
(Low Profile QFP)
TQFP
(Thin Quad Flat Package)
HQFP
(QFP with Heat Sink)
SOJ
QFJ(PLCC)
Two-directional
type
SOI
QFI(MSP)
HQFI
Four-directional
type
(Quad Flat Package)
LQFP
HSOI
Non-lead package
(Small Outline Package)
(Thin Small Outline Package)
Four-directional
type
Four-directional
type
(Shrink DIP)
TSOP
HSOJ
I-lead package
(Pin Grid Array)
QFN(LCC)
(Small Outline J-leaded Package)
(SOJ with Heat Sink)
(Quad Flat J-leaded Package)
(Small Outline I-leaded Package)
(SOI with Heat Sink)
(Quad Flat I-leaded Package)
(QFI with Heat Sink)
(Quad Flat Non-leaded Package)
Figure 1-1 Classification of IC Package
5
Introduction of Packages
Transistor
packages
Insertion type
TO-92
Diode
packages
Insertion type
SPAK
DO-41
DO-41 Mod.
TO-92 Mod.
DO-35
TO-126
DO-34(MHD)
TO-202
DPAK
DO-201AD
L
TO-220FM
UMD
TO-220CFM
LDPAK
TO-220FM
L
TO-220AB
TO-3
TO-92
TO-3P
HDPAK
Surface mount
type
TO-3PA
L
TO-3PFM
SIP
SMPAK
DIP-M
CMPAK
Surface mount
type
CMPAK-4
LLD
MPAK
MPAK
SRP
MPAK-4
FPAK
URP
UPAK
LRP
DPAK
S
LDPAK
SSP
S
HDPAK
CMPAK
S
ERP
Transistor
arrays
SP-10
DIP-S
SP-12
MOP
SP-12TA
SPAK:
SMPAK:
CMPAK:
MPAK:
FPAK:
HDPAK:
UPAK:
DPAK:
LDPAK:
SP-10:
SP-12:
Small Package
Super Mini Package
Compact Mini Package
Mini Package
Flat Package
Huge Deca-Watt Package
Uni-Watt Package
Deca-Watt Package
Large Deca-Watt Package
Single In Line Package 10 Pin
Single In Line Package 12 Pin
Figure 1-2 Transistor Classification
6
UMD:
LLD:
MPAK:
SRP:
URP:
LRP:
CMPAK:
ERP:
MOP:
SSP:
Ultra Mini Diode
Leadless Diode
Mini Package
Small Resin Package
Ultra Small Resin Package
Large Resin Package
Compact Mini Package
Extremely Small Resin Package
Mini Oct-Lead Package
Super Small Resin Package
Figure 1-3 Diode Classification
Introduction of Packages
Hybrid IC
package
Insertion type
Surface mount
type
SIP
Standard
QFP
High frequency
application
SIP
Special
Power module
Card
Figure 1-4 Hybrid IC Classification
1.1.2 Package Structures
The standard structure of representatives of each type of package is shown below.
(1) Structure and Materials of Representative Insert-Type Packages
(a) Plastic DIP
S-DIP
SK-DIP
(b) Laminated ceramic DIP
Cap
Resin
Chip
Glass of low melting point
Alumina-clad lead
Lead with spot
gold or silver
Base
7
Introduction of Packages
(c) Cerdip
(d) Plastic SIP
Cap
Chip
Resin
Gold wire
Glass of low melting point
Alumina-clad lead
Heat sink
Copper lead
Base
(e) ZIP
(f) Ceramic PGA
Partial silver plating
Low stress resin
Aluminium
wire
Chip
Gold wire
8
Chip
Gold/Silicon
eutectic
Polyimide silver paste
or resin type paste
Alloy 42 or copper lead
Solder plating or solder
dipping
Lid
Ceramic
Lead
Solder
dipping
Glass seal
(Low melting
point glass)
Introduction of Packages
(2) Structure and Materials of Representative Surface Mount Type Packages
(g) SOP
(h) TSOP (II) (LOC Type) LOC: Lead On Chip
Chip
Low stress resin
Partial silver plating
Silver paste
Partial silver
plating
Resin
Gold wire
Polyimide insulator
Gold wire
Alloy 42 lead solder
plating or copper lead
solder plating
(i) QFP
Chip
Alloy 42 lead solder plating
(j) SOJ
Chip
Gold wire
Low stress resin
Low stress Ausy, spherical
filler resin
Chip
Resin type paste
Tip link silver plating
Gold wire
Copper lead solder plating
Partial silver plating
or alloy 42 lead solder plating
Alloy 42 or copper lead/solder
dipping or solder plating
9
Introduction of Packages
(k) QFJ (PLCC)
Low stress resin
Chip
Gold wire
(l) QFI (MSP)
Silver paste
Partial silver plating
Chip
Resin
Gold wire
Copper lead
Copper lead/solder dipping or solder plating
(m)QFN (LCC)
Silicon chip
(n) QFJ-G
Sealing material (Glass)
Chip
Aluminium wire
Cap (Alumina) of glass of low
melting point
Window
Cap (Alumina)
Board (Alumina)
Aluminium wire
10
Alloy 42 lead
(solder dipping)
Base (Alumina)
Introduction of Packages
(o) MPAK
(p) LLD
Epoxy resin
Transistor chip
Gold wire
Alloy 42 lead
(solder dipping)
Glass
Alloy 47
(solder dipping)
Diode chip
(3) Structure of Hybrid Package
(q) High Frequency Module
(r) High Frequency Module
Resin case
Metal cap
Header
Base
Header
Lead
Lead
Base
11
Introduction of Packages
(s) Low Frequency Power Module (C Type)
(t) TA-CHIP
Hole
Mold resin
Bolt
Resin case
Header
Hole
Base
(u) COB
Mold resin
IC chip
Base
12
Lead
Base
Introduction of Packages
1.1.3 Advantages of Major Packages
The forms of packages of semiconductor devices have rapidly been shifting toward larger numbers of pins
and smaller and thinner forms as electronics equipment has become more diversified in function and
smaller.
ZIP
Zigzag In-line Package
• Lead form of the package is formed in a zigzag
pattern.
• Lead pitch is 100 mil (standard)
Major devices to which applied:
Dynamic RAM
PGA
Pin Grid Array
• A package in which the lead pins emerge in a
perpendicular pattern.
• Lead pitch is 100 mil (standard)
• Used primarily in LSIs with more than 50 pins
• Also called plug-in
Major devices to which applied:
Gate arrays and processors
SOP
Small Outline Package
QFI
(MSP)
Quad Flat I-leaded Package
(Mini-Square Package)
• A gull-wing type surface mount package in
which the lead pins emerge in two directions.
• Lead pitch is 50 mil
• Also called DFP (dual flat package)
• A package with butt type lead shapes
• Lead pins emerge in four directions and the
shape of the package is square or rectangular
• Lead pin pitches are 50 mil, 40 mil, and 30 mil
Major devices to which applied:
IC memories, standard logic, standard linear ICs
Major devices to which applied:
Linear ICs
13
Introduction of Packages
QFJ
Quad Flat J-leaded Package
(PLCC) (Plastic Leaded Chip Carrier)
SOJ
• A package with the lead shape formed as a J
shape
• Lead pins emerge in four directions and the
shape of the package is square or rectangular
• Lead pin pitch is 50 mil
• Leads are protected by the package body, so it
is easily handled
• A package with the lead shapes formed in a J
shape
• Lead pins emerge in two directions
• Lead pin pitch is 50 mil
Small Outline J-bend Package
Major devices to which applied:
Dynamic RAM
Major devices to which applied:
Microcomputers, gate arrays and IC memories
TSOP (I)
Thin Small Outline Package (Type I)
• The package installation height of the ultra-thin
SOP is less than 1.20 mm
• Lead pitch is 0.05 mm
• Corresponds to IC card
Major devices to which applied:
IC memories
14
TSOP (II)
This Small Outline Package (Type II)
• The package installation height of the ultra-thin
SOP is less than 1.20 mm
• Lead pitches are 1.27 mm and 0.80 mm
Major devices to which applied:
IC memories
Introduction of Packages
TQFP
Thin Quad Flat Package
• Ultra-thin QFP with a package installation height
of less than 1.20 mm
• Lead pitches of 0.80 mm, 0.65 mm, and 0.50
mm
QFP
(FP)
Quad Flat Package
(Fine Pitch)
• Lead pitch of less than 0.50 mm
Major devices to which applied:
Gate arrays, LCD drivers
Major devices to which applied:
Mask ROM, gate arrays, microcomputers,
LCD drivers
TO–220FM
LDPAK Large Deca-watt Package
• An insulated type in which surface resin molding
is attached to a conventional TO-220 heat
radiation fin
When the heat sink is installed, an insulator
(spacer, washer, etc.) is not necessary
• A large area mounting package that assures
characteristics equal to those of a TO-220AB
resin power transistor
• Surface mounting allows high-density mounting
and automatic assembly
Major devices to which applied:
Power transistors
Major devices to which applied:
Power transistors
15
Introduction of Packages
SP–10 Single in Line Package 10pin
CMPAK–4
Compact Mini Package–4 leads
(Scale : 4/1)
• Can contain two or four circuits
• Allows high density mounting
• The transistor with the smallest external shape
in this series, even smaller than the previous
MPAK-4 (Its circuit board area is approximately
60% of the MPAK’s)
• Primarily for VHF/UHF high-frequency transistors
• Ideal for use in ultra-small tuners such as liquid
crystal televisions
Major devices to which applied:
Power transistor arrays
Major devices to which applied:
Transistors for VHF/UHF-band high frequencies,
FET
ERP
Extremely Small Resin Package
(Scale : 4/1)
LRP
Large Resin Package
(Scale : 4/1)
• Extremely small reactance component
• Simple circuit design for ultra-high frequency
uses
• Highest output (power dissipation: 1 W)
obtainable in a two-terminal surface mount
package.
Major devices to which applied:
Diodes (SHF band mixer diodes and others)
Major devices to which applied:
Diodes (1-W zener diodes and others)
16
Introduction of Packages
SP–12TA
Single In-line Package 12pin
• Can contain four or six circuits
• Allows high density mounting
• Higher output possible with installation of heat
sink
TO–3PL
• Small high current type (module)
• Low thermal resistance
Major devices to which applied:
Power transistors
Major devices to which applied:
Power transistor arrays
MOP
Mini Oct-lead Package
• Permits high-density mounting of multiple chips
• Double-balanced type with low reactance,
simplifying high-frequency circuit designs
Major devices to which applied:
Diodes (double-balanced mixer diodes etc.)
RF-B1
Radio Frequency
• High-output package with headers
• Slim, compact type
Major devices to which applied:
RF power modules for automobile telephones
17
Introduction of Packages
RF-E
Radio Frequency
• Ultra-compact, lightweight surface-mount
package (1 cc, 3 g)
• All-metal case shuts out noise
Major devices to which applied:
RF power modules for portable telephones
QFP
(FP)
Quad Flat Package
(Fine Pitch)
• Enables a system to be integrated into a
multichip module
• Permits high-density mounting and automated
assembly
Major devices to which applied:
TA CHIP (multichip module)
18
LF-C
Low Frequency
• High current, output, and breakdown voltage
ratings (50 V, 500V)
Major devices to which applied:
Power-transistor modules
COB
Chip On Board
• For ISO-compliant smart cards
• Only 0.6 mm thick
• Customizable electrode-pad pattern
Major devices to which applied:
Smart cards
Introduction of Packages
1.2 IC Package Names and Code Designations
The IC package name assigned by the company is a package code indicating the shape of the package, the
package material, and the number of pins.
Table 1-1 shows the content of the code designation.
Table 1-1 IC Package Code Designation
F
Outline code
D: Dual in-line
S: Single in-line
P: Pin grid array
Z: Zigzag in-line
F: Flat
TF: Flat with an installation
height less than
1.27 mm
C: Chip carrier
M: Mini square
P
Material code
P: Plastic
G: Glass shielded
ceramics
C: Laminated
ceramics
–
24
Number
of Pin
D
A
Additional outline
code (1)
S: Shrink type
N: Skinny type
W: Wide type
D: Dual lead type
T: Fin, header
attached type
Additional outline
code (2)
A,B
Additional outline code (2) is used when additional outline code (1) is not used. The skinny type with a
dual lead is designated as DN.
19
Introduction of Packages
1.3 Method of Indicating Package Designations
The outline drawings recorded in this data book have been prepared by reference to the standards issued by
domestic and foreign standardization organizations. The standards relating to the major packages are listed
below.
• EIAJ Standards (Standards of Electronic Industries Association of Japan)
Standards specifying external outlines, characteristics, ratings, and test methods for systems, equipment
and components that have been formulated and issued by the Electronic Industries Association of Japan.
The standards for the package outline of semiconductors are as follows:
ED-7400
Standard package outline drawings of semiconductor devices (integrated circuits)
ED-7400-1
Standard package outline drawings of semiconductor devices (integrated circuits)
ED-7402-1
(Formulated in February 1989) Small outline package (SOP)
ED-7402-2
(Formulated in February 1990) Shrink small outline package (SSOP)
ED-7402-3
(Formulated in April 1991) Thin small outline package (Type I) (TSOP (I))
ED-7402-4
(Formulated in February 1990) Thin small outline package (Type II) (TSOP (II))
ED-7403-1
(Formulated in April 1988) Plastic dual in-line package
ED-7404
(Formulated in January 1990) Quad flat package (QFP)
ED-7404-1
(Formulated in January 1989) Quad flat package (fine pitch)
ED-7405-1
(Formulated in March 1990) Shrink zigzag in-line package (SZIP)
ED-7406
(Formulated in May 1988) Small outline J-leaded package (SOJ)
ED-7407
(Formulated in June 1988) Quad flat J-leaded package (QFJ)
ED-7408
(Formulated in October 1988) Pin grid array package (PGA)
ED-7409
(Formulated in June 1988) Quad flat I-leaded package (QFI)
ED-7410
(Formulated in June 1988) Small outline I-leaded package (SOI)
ED-7411
(Formulated in February 1989) Package names and codes
ED-7412
(Formulated in November 1988) Quad flat leadless package (QFN)
ED-7413
(Formulated in January 1989) Single in-line package (SIP)
ED-7414
(Formulated in November 1989) Guard ring quad flat package (GQFP)
ED-7415
(Formulated in November 1989) Heat sink equipped small outline package (HSOP)
ED-7417
(Formulated in February 1990) Bumpered quad flat package (BQFP)
20
Introduction of Packages
ED-7418
(Formulated in July 1990) Glass shield quad flat package (QFP-G)
ED-7419
(Formulated in September 1990) Glass shield dual in-line package (DIP-G)
ED-7500
Standard package outline for semiconductor devices (Discrete devices)
• IEC Standards (International Electrotechnical Commission Standards)
Designations of recommended standards or published documents regarding equipment, systems and
components that are set by the International Electrotechnical Commission.
IEC Publication 148
(Character Symbols for Discrete Devices and Integrated Circuits)
IEC Publication 191
(Package outline of Discrete Devices and Integrated Circuits)
IEC Publication 747
(Methods of Determining Ratings and Characteristics of Semiconductors)
IEC Publication 286.3
(Methods of Packaging Components in Automated Mounting)
• JEDEC Standards (Joint Electron Device Engineering Council standards) Package outline given package
names by the Joint Electron Device Engineering Council (JEDEC), which is a subsidiary of the
Electronic Industries Association (EIA).
Publication 95
(Registered Standard Package of Semiconductor Devices)
1.3.1 Definitions of Package Dimension Reference Characters
Reference
Character Terminology
Definition
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
—
Mounting surface (seating The face that is determined when the IC is placed on the mount
plane)
pad of a printed board
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
A
Seated height
Distance from the seating plane to the highest point of the
package
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
A1
Stand-off height
Distance between the seating plane and the base plane
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
A2
Package height
Distance from the base plane to the highest point of the package
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
b
Terminal width
Major dimension of the cross - section of a terminal
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
b1, b2
Terminal widths
Largest dimensions of terminal width (including cut remnant of
the tie bar)
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
c
Terminal thickness
Minor dimension of the cross-section of a terminal
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
D
Package length
Major dimension of the package excluding terminals, measured in
a plane parallel to the seating plane
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
D1
Other package length
Other package length usually smaller than D
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
21
Introduction of Packages
Definitions of Package Dimension Reference Characters (cont)
Reference
Character Terminology
Definition
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
D2
Terminal linear interval
Linear interval at the center of the terminal bend
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
E
Package width
Minor dimension of the package excluding terminals
measured in a plane parallel to the seating plane
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
E1
Other package width
Other package width, usually smaller than E
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
E2
Terminal linear interval
Linear interval at the center of the terminal bend
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
e
Terminal spacing, linear
Linear spacing between true positions of terminalcenters
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
HD
Overall length
Largest overall dimension, including package length, of peripheral
terminals which are presented for mounting in the length
direction
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
HE
Overall width
Largest overall dimension, including package width, of peripheral
terminals which are presented for mounting in the width direction
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
L
Terminal length
Length of terminal available for mounting, measured from the
seating plane
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
θ
Terminal spread, angular
Angle between the terminal and a line perpendicular to the
seating plane
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
y
Terminal precision
Uniformity of the bottom-most surface of the terminal relative to
(coplanarity)
the mounting surface
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Z
Package overhang
Distance from the end of terminal true position to the extremity of
the package
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Indication of Geometric Common Difference
X
M
Mode of common difference in which the
maximum physical state is taken as the base
Value of the common difference
Type of geometric common difference
(in this case, the common difference of
degree of position)
22
Introduction of Packages
Example
b
Indication of Terminal Precision "y"
0.12
M
When the terminal width b is the maximum
dimension, it indicates that a divergence from
the true position of the center position of up to
0.12 mm is permitted.
y
Permitted value
Terminal precision
If b is smaller than the maximum dimension,
the common difference corresponding to b
can be extended.
23
Introduction of Packages
1.3.2 Examples of Indications of Dimensions in Terms of External
(1) DIP
D
D1
n-1
n/2+1
1
2
n/2
b3
b2
E
n
A
A2
A1
Base plane
L
Seating plane
b1
Z1
Z
X M
Z1
e
e
e
e
θ
Z
e1
c
EIAJ ED-7403-1 (1988.4)
(2) DIP-G
D
n/2+1
E
n n-1
1
2
n/2
b2
b1
L
A1
A
A2
Base plane
Seating plane
b
Z
e
e
e
e
Z
X M
θ
e1
c
EIAJ ED-7419 (1990.9)
24
Introduction of Packages
(3) ZIP
A3
A2
E
A
D
L
A1
Base
plane
Seating plane
c
e1
e
Z
b
Z
φX M
EIAJ ED-7405 (1987.3)
(4) SIP
D
E
X M
Base plane
Seating plane
L
n
b2
A1
1
b3
A2
Index
area
A
A3
D1
b1
e
Z
c
EIAJ ED-7413 (1989.1)
25
Introduction of Packages
(5) PGA
D1
E
E1
D
φb
e
L A
A1
A2
R
Z
φX M
EIAJ ED-7408 (1988.10)
(6) SOP
n
Detail
n-1
+θ
1
2
HE
D
D1
e
e
e
Z
e
y
φX M
26
L1
θ
b
Z1
E
A
A2
L1
Z1
A1
L
L
C
Z
EIAJ ED-7402-1 (1989.2)
Introduction of Packages
(7) TSOP (I)
1
n
n-1
Detail
θ
GD
L
Z1
Z
L
Z1
Z
e
b
y
A1
A2
L1
c
L1
A
E
E1
HD
X M
EIAJ ED-7402-3 (1991.4)
(8) QFP
HD
HE
E
ZE
D
e
n-1
ZE
n
1
ZD
2
e
3
b
X M
ZD
A
A2
G D or G E
A1
c
L
L2
L1
y
θ
EIAJ ED-7404 (1991.1)
27
Introduction of Packages
(9) SOJ
n
n
2 +1
1
n/2
HE
D
E
D1
b1
c
A
Z1
b
X M
e
Z
L
A1
e1
y
EIAJ ED-7406 (1988.5)
(10) QFJ (PLCC)
HD
D
nE
HE
e1 E
E
b1
nD
Index corner
c
e
b1
h
A
L
A1
b
e1 D
28
y
X M
EIAJ ED-7407 (1988.6)
Introduction of Packages
(11) SOI
D
D1
n n-1
HE
E
1 2
A2
A
b
XM
e
Z
Z1
y
A1
L2
c
e1
L1
EIAJ ED-7410 (1988.6)
(12) QFI (MSP)
HE
E
HD
D
n-1
n
1
2
A2
A
Zo
e
e 1D
b
A1
c
y
e 1E
ZE
X M
L2
L1
EIAJ ED-7409 (1988.6)
29
Introduction of Packages
X M A B C
(13) QFN (LCC)
–B–
E1
Z
E
D1
b1
D
–C–
e
A
R1
L1
Index corner
–A–
y
A1
A2
L
EIAJ ED-7412 (1988.11)
30
Introduction of Packages
1.4 Lineups in Terms of Shapes and Materials
1.4.1 IC Package
(1) Plastic DIP
Nominal
Lead
Number of Pins
Packge
Size
Pitch
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Name
mm
mm
8 14 16 18 20 22 24 28 30 32 36 40 42 48 56 64 90
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP
7.62
2.54
● ● ● ● ● ● ● ●
❍
–––––––––––
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
10.16
● ● ● ●
–––––––––––
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
15.24
●
● ●
● ● ● ● ●
–––––––––––
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
22.86
●
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SDIP
7.62
1.778
●
–––––––––––
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
10.16
● ● ●
–––––––––––
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
15.24
●
●
–––––––––––
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
19.05
●
–––––––––––
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
22.86
●
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
(2) Cerdip
Nominal
Lead
Number of Pins
Packge
Size
Pitch
——————————————————————
Name
mm
mm
8 14 16 18 20 22 24 28 32 40 42
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP-G
7.62
2.54
● ● ● ● ● ● ●
–––––––––––
–––––––––––––––––––––––––––––––––––––––
10.16
● ●
–––––––––––
–––––––––––––––––––––––––––––––––––––––
15.24
● ● ● ● ●
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
(3) Ceramic DIP
Nominal
Lead
Number of Pins
Packge
Size
Pitch
————————————
Name
mm
mm
24 28 40 42 48 64
——————————————————————————————
DIP-C
15.24
2.54
● ● ● ● ●
–––––––––––
————————————
22.86
●
—————————————————————————
19.05
1.778
●
——————————————————————————————
Note : ● Under mass production, ❍ Under development
31
Introduction of Packages
(4) ZIP
Nominal
Lead
Number of Pins
Packge
Size
Pitch
–––––––––––——––––––––––
Name
mm (mil)
mm
16 20 21 24 28 32 40
–––––––––––––––––––––––––––––––––––––––––––——–––––––––––
ZIP
(325)
1.27
●
–––––––––––––––––––––––––––––––——––
0.635
●
–––––––––––––––––––––––––––––––––––––––——–––––
(350)
1.50
●
–––––––––––––––––––––––––––––––––––——–––––––––
(400)
1.27
● ● ● ●
–––––––––––––––––––––––––––––––––––––——–––––––
(475)
1.27
❍
● ●
––––––––––––––––––––––––––––––––––––
0.635
❍
–––––––––––––––––––––––––––––––––––––––––––––——–––––––––
(5) SIP
Nominal
Lead
Number of Pins
Packge
Size
Pitch
––––––––––––––––––––––––––––
Name
mm
mm
3 5 7 8 12 15 16 23
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SIP
—
2.54
●
● ● ●
–––––––––––––––––––––––––––––––––––––––
1.778
●
–––––––––––––––––––––––––––––––––––––––
1.70
●
●
–––––––––––––––––––––––––––––––––––––––
1.50
●
–––––––––––––––––––––––––––––––––––––––
1.27
●
●
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
(6) Ceramic PGA
Nominal
Lead
Number of Pins
Cavity
Size
Pitch
————————————————————
Package name
Direction
(mm)
(mm)
68 72 120 121 135 179 240 257 299 401
——————————————————————————————————————————————————————–
PGA Conventional Upward
—
2.54
● ● ● ● ● ● ●
type
————————————————————————————————————————————
Downword
—
2.54
●
❍
● ●
—————————————————————————————
2.54 (Stagger)
●
———————————————————————————————————————————————————
Low thermal
Downword
—
2.54
❍
resistant type
—————————————————————————————
2.54 (Stagger)
❍
——————————————————————————————————————————————————————–
• Heat sink can be attached to standard and cavity down type PGA.
• Metal heat spreaders are built in low thermal resistant type PGA to reduce the thermal resistance.
Note : ● Under mass production, ❍ Under development
32
Introduction of Packages
(7) SOP
Nominal Mounting Lead
Number of Pins
Package Size
Height
Pitch
————————————————————————————————
name
(mm)
(mm)
(mm)
8 14 16 18 20 24 26 28 30 32 36 40 44 48 56 64
—————————————————————————————————————————————————————
SOP
(*150)
1.75
1.27
● ●
——————————
————————————————————————————————
(225)
2.03
●
——————————
————————————————————————————————
(300)
2.20
● ●
●
——————————
————————————————————————————————
(*300)
2.65
●
——————————
————————————————————————————————
(375)
2.40
● ●
——————————
————————————————————————————————
(450)
3.0
●
(*330)
—————
————————————————————————————————
2.50
●
●
——————————
————————————————————————————————
(525)
3.0
●
●
—————
————————————————————————————————
(600)
●
—————————————————————————————————————————————————————
HSOP
(300)
2.20
1.27
●
●
———————————————————————————————————————————————
(375)
3.0
0.8
●
—————————————————————————————————————————————————————
SSOP
(225)
1.10
0.65
● ●
● ●
—————————————————————————————————————
0.5
❍
———————————————————————————————————————————————
(300)
1.20
0.5
❍ ❍
———————————————————————————————————————————————
(*300)
2.65
0.635
● ●
———————————————————————————————————————————————
(375)
2.0
0.65
●
———————————————————————————————————————————————
(525)
3.0
0.8
❍
●
—————
————————————————————————————————
(600)
●
—————
————————————————————————————————
(675)
●
—————————————————————————————————————————————————————
TSOP (I) 6 × 16
1.20
0.5
●
—————
————————————————————————————————
8 × 14
●
—————
————————————————————————————————
8 × 20
●
●
—————————————————————————————————————————————————————
TSOP (II) (300)
1.20
1.27
● ❍
—————
—————————————————————————————————————
(400)
1.27
●
●
● ❍
—————————————————————————————————————
0.8
● ● ❍
—————
—————————————————————————————————————
(550)
0.8
●
—————————————————————————————————————————————————————
*: JEDEC
Note : ● Under mass production, ❍ Under development
33
Introduction of Packages
(8) QFP
Body
Mounting
Lead
Number of Pins
Package
Size
Height
Pitch
————————————————————————————————————————————————————————
name
(mm)
(mm)
(mm)
28 40 44 48 54 56 60 64 80 88 100 112 120 136 144 160 168 176 208 232 256 296 304 384
————————————————————————————————————————————————————————————————————————————————
QFP
7×7
1.70
0.65
●
—————————————————————————————————————————————————————————————
0.5
●
——————————————————————————————————————————————————————————————————————————
10 × 10
2.54
0.65
●
————————————————————————————————————————————————————————————————————–
2.50
0.5
●
——————
—————————————————————————————————————————————————————————
1.70
●
——————————————————————————————————————————————————————————————————————————
14 × 14
3.05
0.8
●
●
—————————————————————————————————————————————————————————————
0.65
●
—————————————————————————————————————————————————————————————
0.5
●
——————————————————————————————————————————————————————————————————————————
14 × 20
3.10
1.0
●
● ●
—————————————————————————————————————————————————————————————
0.8
●
—————————————————————————————————————————————————————————————
0.65
●
——————————————————————————————————————————————————————————————————————————
20 × 20
3.05
0.8
●
—————————————————————————————————————————————————————————————
0.65
●
————————————————————————————————————————————————————————————————————–
1.70
0.5
●
—————————————————————————————————————————————————————————————
0.4
❍
—————
—————————————————————————————————————————————————————————————
24 × 24
0.5
❍
——————————————————————————————————————————————————————————————————————————
28 × 28
3.56
0.8
●
—————————————————————————————————————————————————————————————
0.65
●
—————————————————————————————————————————————————————————————
0.5
●
—————————————————————————————————————————————————————————————
0.4
❍
—————
—————————————————————————————————————————————————————————————
32 × 32
0.4
❍
—————————————————————————————————————————————————————————————
0.3
❍
—————
—————————————————————————————————————————————————————————————
28 × 40
0.5
●
——————————————————————————————————————————————————————————————————————————
40 × 40
4.36
0.65
●
—————————————————————————————————————————————————————————————
0.5
❍
———————————————————————————————————————————————————————————————————————————————–
TQFP
12 × 12
1.20
0.5
●
—————
—————————————————————————————————————————————————————————————
14 × 14
0.8
●
❍
—————————————————————————————————————————————————————————————
0.65
●
—————————————————————————————————————————————————————————————
0.5
●
—————————————————————————————————————————————————————————————
0.4
❍
—————————————————————————————————————————————————————————————
0.3
❍
———————————————————————————————————————————————————————————————————————————————–
Note : ● Under mass production, ❍ Under development
34
Introduction of Packages
(8) QFP (cont)
Body
Mounting
Lead
Number of Pins
Package
Size
Height
Pitch
————————————————————————————————————————————————————————
name
(mm)
(mm)
(mm)
28 40 44 48 54 56 60 64 80 88 100 112 120 136 144 160 168 176 208 232 256 296 304 384
————————————————————————————————————————————————————————————————————————————————
HQFP
7×7
1.70
0.65
●
——————————————————————————————————————————————————————————————————————————
10 × 10
2.54
0.65
●
——————————————————————————————————————————————————————————————————————————
14 × 14
3.05
0.65
●
—————————————————————————————————————————————————————————————
0.5
●
——————
—————————————————————————————————————————————————————————
1.20
●
——————————————————————————————————————————————————————————————————————————
14 × 20
3.10
1.0
●
—————————————————————————————————————————————————————————————
0.8
●
——————————————————————————————————————————————————————————————————————————
26 × 28
3.56
0.8
●
—————————————————————————————————————————————————————————————
0.65
●
—————————————————————————————————————————————————————————————
0.5
❍
—————
—————————————————————————————————————————————————————————————
28 × 40
0.5
❍
————————————————————————————————————————————————————————————————————————————————
(9) SOJ Package
Body
Mounting Lead Number of Pins
Package
Size
Height
Pitch ————————————————–
name
(mm)
(mm)
(mm) 20 24 28 30 32 36 40 44
———————————————————————————————————————––
SOJ
(300)
3.76
1.27
● ● ● ❍ ❍
—————
————————————————–
(350)
●
—————
————————————————–
(400)
● ●
● ❍ ● ❍
———————————————————————————————————————––
(10) QFJ (PLCC) Package
Body
Mounting Lead Number of Pins
Package
Size
Height
Pitch ————————————–
name
(mm)
(mm)
(mm) 18 32 44 52 68 84
———————————————————————————————————–
QFJ (PLCC) Rectangle 3.56
1.27
● ●
———————————–
————————————–
Square
4.40
● ● ● ●
———————————————————————————————————–
Note : ● Under mass production, ❍ Under development
35
Introduction of Packages
(11) SOI Package
Body
Mounting Lead Number of Pins
Package
Size
Height
Pitch ———————–
name
(mm)
(mm)
(mm) 26 44
———————————————————————————————
SOI
(375)
3.0
0.8
❍
——————–
———————–
HSOI
●
———————————————————————————————
(12) QFI (MSP) Package
Body
Mounting Lead Number of Pins
Package
Size
Height
Pitch ——————————
name
(mm)
(mm)
(mm) 18 28 44 56 68
—————————————————————————————————–
QFI (MSP)
(300 × 300) 2.92
1.27
●
—————–
——————————
2.58
●
——————————————————————————–
(430 × 460) 2.92
1.27
●
—————–
——————————
2.58
●
——————————————
0.762
●
——————————————————————————–
(500 × 600) 2.92
1.016
●
——————————————
0.762
●
——————————————————————————–
(800 × 800) 3.58
1.016
●
—————————————————————————————————–
HQFI
(300 × 300) 2.92
1.27
●
——————
——————————
(430 × 460)
●
——————
——————————————
(500 × 600)
1.016
●
—————————————————————————————————–
(13) Ceramic Surface-Mount Package
Body
Mounting Lead Number of Pins
Package
Size
Height
Pitch ———————————————————————
name
(mm)
(mm)
(mm) 20 22 24 28 40 44 64 68 80 84 132
——————————————————————————————————————————————–
QFP-G
14 × 20
3.10
1.0
●
———————————————————————————
0.8
●
———————————————————————————————————————–
24 × 24
4.0
0.635
●
——————————————————————————————————————————————–
QFJ-G
Square
4.80
1.27
●
—————–
———————————————————————
4.68
❍
❍
——————————————————————————————————————————————–
Note : ● Under mass production, ❍ Under development
36
Introduction of Packages
(14) QFN (LCC) Package
Body
Mounting Lead Number of Pins
Package
Size
Height
Pitch ———————————————————————
name
(mm)
(mm)
(mm) 20 22 24 28 40 44 64 68 80 84 132
——————————————————————————————————————————————–
QFN
—
4.03
1.27
●
—————–
———————————————————————
2.45
●
—————–
———————————————————————
2.25
●
—————–
———————————————————————
2.20
●
—————–
———————————————————————
2.11
●
—————————————————————————————————–
2.35
1.016
●
——————————————————————————————————————————————–
Note : ● Under mass production, ❍ Under development
Definitions of Nominal Size
Packge Definition
Unit
––––––––––––––––––––––––––––––––––––––––––––––––––
SOP
Distance between centers of pads
mil
HSOP
used to mount the package (EIAJ)
Width of package body (JEDEC)
––––––––––––––––––––––––––––––––––––––––––––––––––
TSOP(I)
Width of package body × Length of
mm
package body
––––––––––––––––––––––––––––––––––––––––––––––––––
TSOP(II)
Width of package body
mil
––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
Width of package body × Length of
mm
TQFP
package body
––––––––––––––––––––––––––––––––––––––––––––––––––
Packge Definition
Unit
––––––––––––––––––––––––––––––––––––––––––––––––––
SOJ
Width of package body
mil
HSOJ
––––––––––––––––––––––––––––––––––––––––––––––––––
QFI
Distance between centers of lead
mil
rows
––––––––––––––––––––––––––––––––––––––––––––––––––
SOI
Distance between centers of lead
mil
QFI
rows
––––––––––––––––––––––––––––––––––––––––––––––––––
37
Introduction of Packages
1.4.2 Transistors
The various surface mount transistor packages provided by Hitachi are listed below.
(1) Low-Frequency Transistors
Max. Current Rating (A)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Package
0.02 0.05
0.1
0.2
0.5
1
2
5
10
20
50
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
●● ●
●
CMPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
●● ●
●
● ●
MPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
●
●
●
●
UPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
●
● ●●●●
DPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
●●●●●●● ●●●●
LDPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
❍
●
HDPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Note : ● Under mass production, ❍ Under development
(2) High-Frequency Transisitors
Operation Frequency or Transition Frequency (GHz)
–––––––––––––––––––––––––––––––––––––––––––––––
Package
0.1
0.2
0.5
1
2
5
10
20
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
● ●
● ●
● ● ●●
CMPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
● ●● ● ●●●
●●● ●●●
MPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
●
●
●
●●
MPAK-4
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
●
● ●
UPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
●●● ●●
● ●●●●
FPAK
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Note : ● Under mass production
38
Introduction of Packages
1.5 Package List
1.5.1 IC Package
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP
Plastic
7.62
8
2.54
DP-8
53
––––––––––––
––––––––––––––––––––––––
14
DP-14
54
––––––––––––––––––––––––
DP-14T
54
––––––––––––
––––––––––––––––––––––––
16
DP-16
55
––––––––––––––––––––––––
DP-16A
56
––––––––––––––––––––––––
DP-16B
56
––––––––––––––––––––––––
DP-16C
57
––––––––––––
––––––––––––––––––––––––
18
DP-16-2
55
––––––––––––––––––––––––
DP-18
57
––––––––––––––––––––––––
DP-18A
58
––––––––––––––––––––––––
DP-18B
58
––––––––––––––––––––––––
DP-18C
59
––––––––––––
––––––––––––––––––––––––
20
DP-20N
60
––––––––––––––––––––––––
DP-20NA
60
––––––––––––
––––––––––––––––––––––––
22
DP-22N
62
––––––––––––––––––––––––
DP-22NA
62
––––––––––––––––––––––––
DP-22NB
63
––––––––––––
––––––––––––––––––––––––
24
DP-24N
65
––––––––––––––––––––––––
DP-24NA
65
––––––––––––––––––––––––
DP-24NC
66
––––––––––––
––––––––––––––––––––––––
28
DP-28N
68
––––––––––––––––––––––––
DP-28NA
68
––––––––––––––––––––––––––
––––––––––––––––––––––––
10.16
20
DP-20
59
––––––––––––
––––––––––––––––––––––––
22
DP-22
61
––––––––––––
––––––––––––––––––––––––
24
DP-24A
64
––––––––––––
––––––––––––––––––––––––
28
DP-28C
67
––––––––––––––––––––––––––
––––––––––––––––––––––––
15.24
20
DP-20T
61
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
39
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP
Plastic
15.24
24
2.54
DP-24
64
––––––––––––
––––––––––––––––––––––––
28
DP-28
67
––––––––––––
––––––––––––––––––––––––
32
DP-32
70
––––––––––––
––––––––––––––––––––––––
36
DP-36
70
––––––––––––
––––––––––––––––––––––––
40
DP-40
71
––––––––––––
––––––––––––––––––––––––
42
DP-42
71
––––––––––––
––––––––––––––––––––––––
48
DP-48
73
––––––––––––––––––––––––––
––––––––––––––––––––––––
22.86
64
DP-64
74
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SDIP
Plastic
7.62
22
1.778
DP-22NS
63
––––––––––––––––––––––––––
––––––––––––––––––––––––
10.16
24
DP-24TS
66
––––––––––––
––––––––––––––––––––––––
28
DP-28S
69
––––––––––––
––––––––––––––––––––––––
30
DP-30S
69
––––––––––––––––––––––––––
––––––––––––––––––––––––
15.24
42
DP-42S
72
––––––––––––––––––––––––
DP-42SA
72
––––––––––––
––––––––––––––––––––––––
56
DP-56S
73
––––––––––––––––––––––––––
––––––––––––––––––––––––
19.05
64
DP-64S
75
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
22.86
90
1.78
DP-90S
76
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP-G
Ceramic
7.62
8
2.54
DG-8
77
––––––––––––
––––––––––––––––––––––––
14
DG-14
77
––––––––––––––––––––––––
DG-14A
78
––––––––––––
––––––––––––––––––––––––
16
DG-16
78
––––––––––––––––––––––––
DG-16A
79
––––––––––––––––––––––––
DG-16B
79
––––––––––––––––––––––––
DG-16C
80
––––––––––––
––––––––––––––––––––––––
18
DG-18
80
––––––––––––
––––––––––––––––––––––––
20
DG-20N
81
––––––––––––––––––––––––
DG-20NA
81
––––––––––––
––––––––––––––––––––––––
22
DG-22N
82
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
40
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP-G
Ceramic
7.62
24
2.54
DG-24V
85
––––––––––––––––––––––––––
––––––––––––––––––––––––
10.16
24
DG-24N
84
––––––––––––––––––––––––
DG-24NA
85
––––––––––––
––––––––––––––––––––––––
28
DG-28N
87
––––––––––––––––––––––––––
––––––––––––––––––––––––
15.24
24
DG-24
82
––––––––––––––––––––––––
DG-24A
83
––––––––––––––––––––––––
DG-24B
83
––––––––––––––––––––––––
DG-24C
84
––––––––––––
––––––––––––––––––––––––
28
DG-28
86
––––––––––––––––––––––––
DG-28B
86
––––––––––––
––––––––––––––––––––––––
32
DG-32
87
––––––––––––––––––––––––
DG-32A
88
––––––––––––
––––––––––––––––––––––––
40
DG-40
88
––––––––––––––––––––––––
DG-40A
89
––––––––––––––––––––––––
DG-40B
89
––––––––––––
––––––––––––––––––––––––
42
DG-42
90
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP-C
Ceramic
15.24
24
2.54
DC-24
91
––––––––––––
––––––––––––––––––––––––
28
DC-28
91
––––––––––––
––––––––––––––––––––––––
40
DC-40
92
––––––––––––––––––––––––
DC-40A
92
––––––––––––––––––––––––
DC-40P
93
––––––––––––
––––––––––––––––––––––––
42
DC-42
93
––––––––––––––––––––––––
DC-42P
94
––––––––––––
––––––––––––––––––––––––
48
DC-48
94
––––––––––––––––––––––––––
––––––––––––––––––––––––
22.86
64
DC-64
95
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SDIP-C
Ceramic
19.05
64
1.778
DC-64S
96
––––––––––––––––––––––––
DC-64SP
96
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZIP
Plastic
(325)
16
1.27
ZP-16
97
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
41
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZIP
Plastic
(400)
20
1.27
ZP-20
97
––––––––––––––––––––––––––––––––––
0.635
ZP-20ST
98
––––––––––––––––––––––––––––––––––––––––––––––
21
1.27
ZP-21
98
––––––––––––
––––––––––––––––––––––––
24
ZP-24
99
––––––––––––
––––––––––––––––––––––––
28
ZP-28
100
–––––––––––––––––––––––––
––––––––––––––––––––––––
(475)
24
ZP-24A
99
––––––––––––
––––––––––––––––––––––––
32
ZP-32
100
––––––––––––
––––––––––––––––––––––––
40
ZP-40
101
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SIP
Plastic
—
3
2.54
SP-3T
102
––––––––––––––––––––––––––––––––––––––––––––––
5
1.7
SP-5T
102
––––––––––––––––––––––––
SP-5TA
103
––––––––––––––––––––––––––––––––––––––––––––––
7
2.54
SP-7
103
––––––––––––
––––––––––––––––––––––––
8
SP-8
104
––––––––––––
––––––––––––––––––––––––
12
SP-12T
104
––––––––––––––––––––––––––––––––––––––––––––––
15
1.27
SP-15TA
105
––––––––––––––––––––––––
SP-15TB
105
––––––––––––––––––––––––
SP-15TC
106
––––––––––––––––––––––––––––––––––––––––––––––
16
1.5
SP-16
106
––––––––––––––––––––––––––––––––––
1.778
SP-16TA
107
––––––––––––––––––––––––––––––––––––––––––––––
23
1.27
SP-23TA
107
––––––––––––––––––––––––
SP-23TB
108
––––––––––––––––––––––––
SP-23TC
108
––––––––––––––––––––––––
SP-23TD
109
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PGA
Ceramic
—
68
2.54
PC-68
110
––––––––––––
––––––––––––––––––––––––
72
PC-72
110
––––––––––––
––––––––––––––––––––––––
120
PC-120
111
––––––––––––
––––––––––––––––––––––––
121
PC-121
111
––––––––––––
––––––––––––––––––––––––
135
PC-135
112
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
42
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PGA
Ceramic
—
179
2.54
PC-179
112
––––––––––––
––––––––––––––––––––––––
240
PC-240
113
––––––––––––
––––––––––––––––––––––––
257
PC-257
114
––––––––––––
––––––––––––––––––––––––
299
PC-299
115
––––––––––––––––––––––––
PC-299A
116
––––––––––––––––––––––––
PC-299AT
117
––––––––––––
––––––––––––––––––––––––
401
PC-401
118
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOP
Plastic
(150)*1
14
1.27
FP-14DN
120
––––––––––––
––––––––––––––––––––––––
16
FP-16DN
121
–––––––––––––––––––––––––
––––––––––––––––––––––––
(225)
8
FP-8D
119
–––––––––––––––––––––––––
––––––––––––––––––––––––
(300)
14
FP-14DA
119
––––––––––––
––––––––––––––––––––––––
16
FP-16DA
120
––––––––––––
––––––––––––––––––––––––
20
FP-20DA
121
––––––––––––
––––––––––––––––––––––––
24
FP-24DA
123
––––––––––––––––––––––––
FP-24DS
123
––––––––––––––––––––––––––
––––––––––––––––––––––––
(375)
20
FP-20DB
122
––––––––––––––––––––––––––
––––––––––––––––––––––––
(450)
24
FP-24D
122
––––––––––––
––––––––––––––––––––––––
28
FP-28D
124
––––––––––––––––––––––––
FP-28DA
125
––––––––––––––––––––––––––
––––––––––––––––––––––––
(525)
32
FP-32D
126
––––––––––––
––––––––––––––––––––––––
40
FP-40D
127
––––––––––––––––––––––––––
––––––––––––––––––––––––
(600)
44
FP-44D
127
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SSOP
Plastic
(225)
14
0.65
TTP-14D
134
––––––––––––
––––––––––––––––––––––––
16
TTP-16DA
135
––––––––––––
––––––––––––––––––––––––
20
TTP-20DA
136
––––––––––––
––––––––––––––––––––––––
24
TTP-24DB
138
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Note: 1. JEDEC
43
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SSOP
Plastic
(375)
30
0.65
FP-30D
125
––––––––––––––––––––––––
FP-30DB
126
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
(400)
48
0.635
FP-48DSA
129
––––––––––––
––––––––––––––––––––––––
56
FP-56DS
129
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
(450)
26
0.8
FP-26DT
124
––––––––––––––––––––––––––
––––––––––––––––––––––––
(500)
64
FP-64DS
130
––––––––––––––––––––––––––
––––––––––––––––––––––––
(600)
48
FP-48DA
128
–––––––––––––
––––––––––––––––––––––––
(675)
FP-48D
128
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TSOP(I)
Plastic
6×16
20
0.5
TFP-20D/DR
130
––––––––––––––––––––––––––
––––––––––––––––––––––––
8×14
32
TFP-32DA/DAR
133
––––––––––––––––––––––––––
––––––––––––––––––––––––
8×20
20
TFP-20DA/DAR
131
––––––––––––––––––––––––––
––––––––––––––––––––––––
8×20
32
TFP-32D/DR
132
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TSOP(II)
Plastic
(300)
20
1.27
TTP-20D/DR
135
––––––––––––
––––––––––––––––––––––––
24
TTP-24DA
137
–––––––––––––––––––––––––
––––––––––––––––––––––––
(400)
24
TTP-24D/DR
137
––––––––––––
––––––––––––––––––––––––
28
TTP-28D/DR
138
––––––––––––––––––––––––
TTP-28DA
139
––––––––––––
––––––––––––––––––––––––
32
TTP-32D/DR
140
––––––––––––––––––––––––
TTP-32DA
141
––––––––––––––––––––––––
TTP-32DB
141
––––––––––––
––––––––––––––––––––––––
36
TTP-36D
142
––––––––––––––––––––––––
TTP-36DA
142
––––––––––––––––––––––––––––––––––––––––––––––
40
0.8
TTP-40DA/DAR
143
––––––––––––––––––––––––
TTP-40DB
144
––––––––––––
––––––––––––––––––––––––
44
TTP-44D
144
––––––––––––––––––––––––
TTP-44DB/DBR
145
––––––––––––––––––––––––
TTP-44DC
146
––––––––––––––––––––––––
TTP-44DE
146
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
44
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TSOP(II)
Plastic
(400)
50
0.8
TTP-50D
147
–––––––––––––––––––––––––
––––––––––––––––––––––––
(550)
48
TTP-48D
147
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
Plastic
7×7
40
0.65
FP-40
148
––––––––––––––––––––––––––––––––––––––––––––––
48
0.5
FP-48
149
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
10×10
56
0.65
FP-56
151
––––––––––––––––––––––––––––––––––––––––––––––
64
0.5
FP-64C
154
––––––––––––––––––––––––
FP-64E
154
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
14×14
44
0.8
FP-44A
149
––––––––––––
––––––––––––––––––––––––
64
FP-64A
153
––––––––––––––––––––––––––––––––––––––––––––––
80
0.65
FP-80A
155
––––––––––––––––––––––––––––––––––––––––––––––
100
0.5
FP-100B
158
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
14×20
54
1.0
FP-54
150
––––––––––––––––––––––––
FP-54A
150
––––––––––––
––––––––––––––––––––––––
60
FP-60
151
––––––––––––––––––––––––
FP-60A
151
––––––––––––
––––––––––––––––––––––––
64
FP-64
152
––––––––––––––––––––––––
FP-64B
153
––––––––––––––––––––––––––––––––––––––––––––––
80
0.8
FP-80
155
––––––––––––––––––––––––
FP-80B
156
––––––––––––––––––––––––––––––––––––––––––––––
100
0.65
FP-100
157
––––––––––––––––––––––––
FP-100A
157
––––––––––––––––––––––––––––––––––––––––––––––
128
0.50
FP-128
159
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
20×20
88
0.8
FP-88
156
––––––––––––––––––––––––––––––––––––––––––––––
112
0.65
FP-112
158
––––––––––––––––––––––––––––––––––––––––––––––
144
0.5
FP-144A
160
–––––––––––––––––––––––––
––––––––––––––––––––––––
24×24
176
FP-176
162
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
28×28
136
0.8
FP-136
159
––––––––––––––––––––––––
FP-136A
160
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
45
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
Plastic
28×28
160
0.65
FP-160A
161
––––––––––––
––––––––––––––––––––––––
168
FP-168
161
––––––––––––––––––––––––––––––––––––––––––––––
208
0.5
FP-208
162
––––––––––––––––––––––––––––––––––––––––––––––
256
0.4
FP-256C
164
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
28×40
256
0.5
FP-256
163
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
32×32
296
0.4
FP-296
165
––––––––––––––––––––––––––––––––––––––––––––––
384
0.3
FP-384
166
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
40×40
232
0.65
FP-232
163
––––––––––––––––––––––––––––––––––––––––––––––
304
0.5
FP-304
165
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TQFP
Plastic
12×12
80
0.5
TFP-80A
168
––––––––––––––––––––––––
TFP-80C
168
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
14×14
44
0.8
TFP-44
166
––––––––––––
––––––––––––––––––––––––
64
TFP-64
167
––––––––––––––––––––––––––––––––––––––––––––––
80
0.65
TFP-80
167
––––––––––––––––––––––––
TFP-80F
169
––––––––––––––––––––––––––––––––––––––––––––––
100
0.5
TFP-100
169
––––––––––––––––––––––––
TFP-100B
170
––––––––––––––––––––––––––––––––––––––––––––––
120
0.4
TFP-120
170
––––––––––––––––––––––––––––––––––––––––––––––
168
0.3
TFP-168
171
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
HQFP
Plastic
7×7
28
0.65
FP-28T
148
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
28×40
256
0.5
FP-256T
164
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOJ
Plastic
(300)
20
1.27
CP-20D
172
––––––––––––
––––––––––––––––––––––––
24
CP-24D
173
––––––––––––––––––––––––
CP-24DB
174
––––––––––––
––––––––––––––––––––––––
28
CP-28DN
175
––––––––––––
––––––––––––––––––––––––
32
CP-32DN
177
–––––––––––––––––––––––––
––––––––––––––––––––––––
(350)
20
CP-20DA
172
–––––––––––––––––––––––––
––––––––––––––––––––––––
(400)
24
CP-24DA
173
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
46
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOJ
Plastic
(400)
28
1.27
CP-28D
174
––––––––––––––––––––––––
CP-28DA
175
––––––––––––
––––––––––––––––––––––––
32
CP-32D
176
––––––––––––––––––––––––
CP-32DB
176
––––––––––––
––––––––––––––––––––––––
36
CP-36D
177
––––––––––––
––––––––––––––––––––––––
40
CP-40D
178
––––––––––––––––––––––––
CP-40DA
178
––––––––––––
––––––––––––––––––––––––
42
CP-42D
179
––––––––––––
––––––––––––––––––––––––
44
CP-44D
179
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFJ
Plastic
—
18
1.27
CP-18
180
––––––––––––
––––––––––––––––––––––––
32
CP-32
180
––––––––––––
––––––––––––––––––––––––
44
CP-44
181
––––––––––––
––––––––––––––––––––––––
52
CP-52
181
––––––––––––
––––––––––––––––––––––––
68
CP-68
182
––––––––––––
––––––––––––––––––––––––
84
CP-84
182
–––––––––––––
––––––––––––
––––––––––––––––––––––––
Ceramic
44
CC-44
183
––––––––––––
––––––––––––––––––––––––
68
CC-68
183
––––––––––––
––––––––––––––––––––––––
84
CC-84
184
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOI
Plastic
(375)
26
0.8
MP-26DT
185
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFI
Plastic
(300×300)
18
1.27
MP-18
186
––––––––––––––––––––––––
MP-18A
186
–––––––––––––––––––––––––
––––––––––––––––––––––––
(430×460)
28
MP-28
187
––––––––––––––––––––––––
MP-28A
187
––––––––––––––––––––––––––––––––––––––––––––––
44
0.762
MP-44S
189
–––––––––––––
––––––––––––––––––––––––––––––––––
(500×600)
1.016
MP-44T
188
––––––––––––––––––––––––––––––––––––––––––––––
56
0.762
MP-56S
189
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
HQFI
Plastic
(300×300)
18
1.27
MP-18T
186
–––––––––––––––––––––––––
––––––––––––––––––––––––
(430×460)
28
MP-28T
188
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
47
Introduction of Packages
IC Package (cont)
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DFP
Ceramic
—
20
1.27
FG-20D
190
––––––––––––
––––––––––––––––––––––––
28
FG-28D
192
––––––––––––––––––––––––––––––––––––––––––––––
22
0.762
FG-22D
190
––––––––––––
––––––––––––––––––––––––
24
FG-24D
191
––––––––––––
––––––––––––––––––––––––
28
FG-28DA
192
––––––––––––––––––––––––
FG-28DB
193
––––––––––––
––––––––––––––––––––––––
32
FG-32D
193
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FPG
Ceramic
—
24
1.27
FG-24
191
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
14×20
64
1.0
FG-64B
194
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
14×20
80
0.8
FG-80A
194
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
24×24
132
0.635
FG-132
195
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFN
Ceramic
7.37×10.8
20
1.27
CG-20
196
–––––––––––––––––––––––––
––––––––––––––––––––––––
7.39×12.45
22
CG-22A
196
–––––––––––––––––––––––––
––––––––––––––––––––––––
7.62×10.16
24
CG-24
197
–––––––––––––––––––––––––
––––––––––––––––––––––––
8.6×11.8
28
CG-28
197
–––––––––––––
––––––––––––––––––––––––
9.45×12.65
CG-28A
198
–––––––––––––
––––––––––––––––––––––––
9.55×15.35
CG-28B
198
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
12.19×12.19
40
1.016
CG-40
199
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
29.2×29.2
84
1.27
CG-84/84A
199
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
1.5.2 Pin Insertion Type Discrete Package
Package
Package
Classification
Material
Package Code
Ref. Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Transistor
Plastic
TO-3P
200
––––––––––––––––––––––––––
TO-3PFM
201
––––––––––––––––––––––––––
SPAK
202
––––––––––––––––––––––––––
TO-92 (1)
202
––––––––––––––––––––––––––
TO-92 (2)
203
––––––––––––––––––––––––––
TO-92Mod
203
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
48
Introduction of Packages
1.5.2 Pin Insertion Type Discrete Package (cont)
Package
Package
Classification
Material
Package Code
Ref. Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Transistor
Plastic
TO-126FM
204
––––––––––––––––––––––––––
TO-126Mod
204
––––––––––––––––––––––––––
TO-220AB
205
––––––––––––––––––––––––––
TO-220FM
205
––––––––––––––––––––––––––––––––––––––––
Can
RFPAK-A
206
––––––––––––––––––––––––––
RFPAK-B
206
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Transistor Array
Plastic
SP-10
249
––––––––––––––––––––––––––
SP-12
249
––––––––––––––––––––––––––
SP-12TA
250
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Diode
Plastic
SIP
221
––––––––––––––––––––––––––
DIP-M
222
––––––––––––––––––––––––––
DO-201AD
220
––––––––––––––––––––––––––
TO-220AB
205
––––––––––––––––––––––––––
TO-220FM
205
––––––––––––––––––––––––––––––––––––––––
Glass
DO-41
217
––––––––––––––––––––––––––
DO-41Mod
217
––––––––––––––––––––––––––
DO-35
216
––––––––––––––––––––––––––
DO-34 (MHD)
216
––––––––––––––––––––––––––
UMD
216
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
1.5.3 Surface Mount Type Discrete Package
Package
Package
Classification
Material
Package Code
Ref. Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Transistor
Plastic
CMPAK
207
––––––––––––––––––––––––––
CMPAK-4
207
––––––––––––––––––––––––––
MPAK (2)
208
––––––––––––––––––––––––––
MPAK-4
208
––––––––––––––––––––––––––
UPAK
209
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
49
Introduction of Packages
1.5.3 Surface Mount Type Discrete Package (cont)
Package
Package
Classification
Material
Package Code
Ref. Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Transistor
Plastic
LDPAK (L)
209
––––––––––––––––––––––––––
LDPAK (S)
210
––––––––––––––––––––––––––
DPAK (L)
210
––––––––––––––––––––––––––
DPAK-2(L)
211
––––––––––––––––––––––––––
DPAK (S)
211
––––––––––––––––––––––––––
FPAK
212
––––––––––––––––––––––––––
µFPAK (L)
213
––––––––––––––––––––––––––
µFPAK (S)
213
––––––––––––––––––––––––––
CFPAK (L)
214
––––––––––––––––––––––––––
CFPAK (S)
214
––––––––––––––––––––––––––
HDPAK(L)
215
––––––––––––––––––––––––––
HDPAK(S)
215
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Diode
Plastic
MPAK (1)
221
––––––––––––––––––––––––––
CMPAK
221
––––––––––––––––––––––––––
MOP
219
––––––––––––––––––––––––––
LRP
220
––––––––––––––––––––––––––
SRP
218
––––––––––––––––––––––––––
URP
218
––––––––––––––––––––––––––
ERP
218
––––––––––––––––––––––––––
DIP-S
222
––––––––––––––––––––––––––
SSP
219
––––––––––––––––––––––––––––––––––––––––
Glass
LLD
217
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––
50
Introduction of Packages
1.5.4 Hybrid IC Package
Nominal
Lead
Package
Size
Number
Pitch
Package
Ref.
Name
Material
mm (mil)
of Pins
mm
Code
Page
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SIP
Plastic
—
6
Special
RF-A
242
–––––––––––
––––––––––––––––––––––––
4
RF-B
243
–––––––––––
––––––––––––––––––––––––
4
RF-B1
243
–––––––––––
––––––––––––––––––––––––
4
RF-B2
244
–––––––––––
––––––––––––––––––––––––
4
RF-B3
244
–––––––––––
––––––––––––––––––––––––
5
RF-C
245
––––––––––––
–––––––––––
––––––––––––––––––––––––
Metal Cap
4
RF-E
245
––––––––––––
–––––––––––
––––––––––––––––––––––––
Plastic
5
RF-F
246
––––––––––––
–––––––––––
––––––––––––––––––––––––
Metal Cap
5
RF-G
246
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Power
Plastic
—
8
Special
LF-C
247
Module
–––––––––––
––––––––––––––––––––––––
8
LF-F
247
–––––––––––
––––––––––––––––––––––––
7
LF-J
248
–––––––––––
––––––––––––––––––––––––
7
LF-K
248
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
Plastic
28 × 28
160
0.65
FP-160
251
––––––––––––––––––––––––––––––––––––––––––––––
208
0.5
FP-208
251
––––––––––––
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
COB
—
8
(ISO)
—
252
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
51
52
Section 2 Package Outline Dimensions
2.1 IC Package
2.1.1 Pin Insertion Packages
(1) Plastic DIP
Unit: mm
6.3
7.4 Max
9.6
10.6 Max
8
5
4
1.3
2.54 ± 0.25
7.62
2.54 Min 5.08 Max
0.1 Min
1
0.88
0.48 ± 0.10
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-8
MO-001AN Mod.
SC-504-8C
0.54
53
Package Outline Dimensions
19.2
20.32 Max
8
6.3
7.4 Max
14
7
7.62
2.54 ± 0.25
0.51 Min
0.76
1.3
0.48 ± 0.10
2.54 Min 5.06 Max
1
+ 0.10
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-14
MO-001AA Mod.
SC-501-14A
0.97
19.3
20.32 Max
14
1
7.11 Max
6.2
8
7
0.93
7.62
3.09 ± 0.20
2.54 Min
2.54 ± 0.25
0.51 Min
5.06 Max
1.32
0.55 ± 0.10
+ 0.10
0.3 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
54
DP-14T
–
–
–
Package Outline Dimensions
19.2
20.0 Max
1
6.65 Max
9
6.3
16
8
0.89
7.62
2.54 Min 5.08 Max
0.48 ± 0.10
0.51 Min
2.54 ± 0.25
1.3
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-16
MO-001AP Mod.
SC-503-16A
1.07
24.5
25.65 Max
9
6.3
7.4 Max
16
1.3
8
18
0.48 ± 0.10
0.51 Min
2.54 ± 0.25
2.54 Min 5.08 Max
1
0.76
17
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-16-2
–
–
–
55
Package Outline Dimensions
19.2
20.32 Max
1
7.0 Max
9
6.3
16
8
1.3
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 Min 5.08 Max
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-16A
MO-001AP Mod.
SC-503-16A
–
19.2
20.32 Max
1
7.3 Max
9
6.6
16
8
5.08 Max
1.3
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 Min
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
56
DP-16B
MO-001AP Mod.
SC-503-16A
–
Package Outline Dimensions
19.2
20.32 Max
9
6.20
6.9 Max
16
1
8
1.3
0.48 ± 0.10
7.62
3.18 Min 5.06 Max
2.54 ± 0.25
0.51 Min
0.76
0.89
+ 0.08
0.30 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-16C
MO-001AP Mod.
SC-503-16A
–
22.0
22.86 Max
1
7.0 Max
10
6.3
18
9
0.48 ± 0.10
2.54 Min 5.08 Max
2.54 ± 0.25
1.3
0.51 Min
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-18
–
SC-505-18A
1.24
57
Package Outline Dimensions
24.5
25.4 Max
18
6.3
7.0 Max
10
9
1
0.48 ± 0.10
2.54 Min 5.08 Max
2.54 ± 0.25
0.51 Min
1.3
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-18A
–
SC-505-18B
–
22.0
22.86 Max
10
6.6
7.0 Max
18
9
1
1.3
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 Min 5.08 Max
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
58
DP-18B
–
SC-505-18A
1.3
Package Outline Dimensions
22.26
22.86 Max
18
7.1
7.4 Max
10
1
9
0.51 Min
2.54 ± 0.25
2.54 Min 5.08 Max
1.3
0.48 ± 0.10
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
1.3
10
10.16
0.48 ± 0.10
2.54 Min
2.54 ± 0.25
0.51 Min
5.08 Max
1
9.9 Max
11
8.8
20
27.10
28.1 Max
DP-18C
–
SC-505-18A
1.3
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-20
–
SC-506-20B
–
59
Package Outline Dimensions
24.5
25.4 Max
1
7.4 Max
11
6.3
20
10
2.54 ± 0.25
0.51 Min
1.27 Max
0.48 ± 0.10
2.54 Min 5.08 Max
1.3
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
1.14
1.3
10
0.48 ± 0.10
0.51 Min
1.5 Max
2.54 ± 0.25
7.62
5.08 Max
1
7.4 Max
11
7.1
20
2.54 Min
24.8
25.40 Max
DP-20N
–
SC-541-20A
1.26
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
60
DP-20NA
–
SC-541-20A
1.3
Package Outline Dimensions
35.6
36.5 Max
11
13.4
14.6 Max
20
10
8.82
5.7 Max
15.24
2.54 ± 0.25
8.10± 0.25
0.51 Min
0.76
1.2
0.48 ± 0.10
2.54 Min
1
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-20T
–
–
–
27.10
27.94 Max
12
8.8
9.9 Max
22
1
0.89
1.3
11
0.48 ± 0.10
2.54 Min
2.54 ± 0.25
0.51 Min
5.08 Max
10.16
0.25
+ 0.11
– 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-22
–
SC-502-22A
–
61
Package Outline Dimensions
27.08
27.90 Max
6.6
1
11
1.3
7.62
0.48 ± 0.10
2.54 Min
2.54 ± 0.25
0.51 Min
5.08 Max
0.88
7.0 Max
12
22
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-22N
–
SC-554-22A
1.51
27.8
29.21 Max
22
6.6
7.0 Max
12
1
1.3
11
0.48 ± 0.10
2.54 Min
2.54 ± 0.25
0.51 Min
5.08 Max
0.88
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
62
DP-22NA
–
SC-554-22A
–
Package Outline Dimensions
27.08
27.90 Max
12
6.6
7.0 Max
22
1
11
2.54 ± 0.25
0.48 ± 0.10
7.62
2.54 Min 5.08 Max
1.3
0.51 Min
0.88
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-22NB
–
SC-554-22A
1.5
19.2
20.32 Max
22
1
7.4 Max
6.3
12
11
0.48 ± 0.10
2.90 Min 5.06 Max
1.778 ± 0.250
1.0
0.51 Min
0.89
7.62
+ 0.10
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-22NS
–
SC-546-22
–
63
Package Outline Dimensions
11
0.89
14.6 Max
13.4
1
13
7.4 Max
1.0
1.778 ± 0.250
0.48 ± 0.10
2.54 ± 0.25
7.62
15.24
5.7 Max
0.51 Min
2.2 Max
12
0.51 Min
1.2
2.90 Min 5.06 Max
1
+ 0.10
2.54 Min
24
31.6
32.5 Max
12
6.3
22
19.2
20.32 Max
0.25 – 0.05
+ 0.11
0.25 – 0.05
0° – 15°
0.48 ± 0.10
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-24
MO-015-AA
SC-509-24E
3.73
19.2
20.32 Max 29.62
30.4812
Max
9.14
9.74 Max
11
0.89
1.0
1
12
1.3
0.51 Min
1.5 Max
2.90 Min 5.06 Max
0.89
1.778 ± 0.250
0.48 ± 0.10
0.48 ± 0.10
2.54 ± 0.25
7.62
2.54 Min 5.08 Max
1
13
0.51 Min
6.3
24
7.4 Max
22
10.16
+ 0.10
0.25 – 0.05
0° – 15°
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
64
DP-24A
–
SC-507-24A
2.1
Package Outline Dimensions
30.4
31.75 Max
13
6.6
7.0 Max
24
12
1.3
0.88
7.62
2.54 ± 0.25
0.51 Min
5.08 Max
1.90 Max
0.48 ± 0.10
2.54 Min
1
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-24N
–
SC-555-24A
1.84
29.92
30.48 Max
13
6.6
7.3 Max
24
1
12
1.3
7.62
0.48 ± 0.10
2.90 Min
2.54 ± 0.25
0.51 Min
5.08 Max
1.1
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-24NA
–
SC-555-24A
–
65
Package Outline Dimensions
29.88
30.48 Max
1
7.4 Max
13
7.1
24
12
1.14
1.3
5.08 Max
7.62
0.48 ± 0.10
2.54 Min
2.54 ± 0.25
0.51 Min
1.27 Max
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-24NC
–
SC-555-24A
1.84
27.10
28.10 Max
1
10.0 Max
13
8.8
24
12
1.0
5.08 Max
2.54 Min
0.76
0.48 ± 0.10
0.51 Min
1.778 ± 0.250
4.036
10.16
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
66
DP-24TS
–
–
2.04
Package Outline Dimensions
35.6
36.5 Max
15
13.4
14.6 Max
28
14
1.2
15.24
2.54 ± 0.25
0.51 Min
1.9 Max
0.48 ± 0.10
2.54 Min 5.7 Max
1
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
15
9.64
9.91 Max
28
34.70
35.56 Max
DP-28
–
SC-510-28E
4.26
1
14
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 ± 0.25
10.16
5.08 Max
1.3
2.54 Min
0.89
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-28C
–
–
–
67
Package Outline Dimensions
36.0
37.32 Max
6.6
14
7.62
5.08 Max
1.3
2.54 ± 0.25
0.51 Min
2.2 Max
0.48 ± 0.10
2.54 Min
1
7.0 Max
15
28
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-28N
–
–
2.04
36.0
14
1.3
0.48 ± 0.10
2.54 Min
2.54 ± 0.25
0.51 Min
5.08 Max
1
7.40 Max
15
7.1
28
37.32 Max
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
68
DP-28NA
–
SC-606-B
2.2
Package Outline Dimensions
27.10
27.94 Max
28
14
10.16
5.08 Max
1.0
1.78 ± 0.25
0.51 Min
2.413 Max
0.48 ± 0.10
2.54 Min
1
10.50 Max
8.8
15
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-28S
–
SC-548-28B
1.9
27.10
28.10 Max
8.8
15
0.48 ± 0.10
5.06 Max
0.51 Min
1.778 ± 0.250
10.16
2.54 Min
1.0
0.76
1
10.0 Max
16
30
+ 0.10
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-30S
–
SC-549-30
1.98
69
Package Outline Dimensions
41.9
42.5 Max
17
13.4
13.7 Max
32
1
16
5.08 Max
1.2
0.51 Min
2.54 Min
2.3 Max
0.48 ± 0.10
2.54 ± 0.25
15.24
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-32
–
SC-613
2.28
47.60
48.72 Max
19
13.40
15.0 Max
36
1
18
0.48 ± 0.10
15.24
2.54 Min
2.54 ± 0.25
0.51 Min
5.06 Max
1.2
0.11
0.25 +– 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
70
DP-36
–
SC-614
–
Package Outline Dimensions
21
1
1.2
20
0.48 ± 0.10
2.54 ± 0.25
2.54 Min 5.06 Max
0.51 Min
13.40
15.0 Max
40
52.80
53.80 Max
15.24
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
13.40
2.54 ± 0.25
1.2
0.48 ± 0.10
21
0.51 Min
1
15.0 Max
22
2.54 Min 5.06 Max
42
52.80
53.80 Max
DP-40
MO-015J Mod.
SC-511-40D
5.83
15.24
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-42
–
SC-512-42D
–
71
Package Outline Dimensions
37.34
38.6 Max
22
21
1.0
1.78 ± 0.25
0.48 ± 0.10
0.51 Min
1
2.54 Min 5.08 Max
14.0
14.6 Max
42
15.24
0.10
0.25 +– 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
37.34
38.0 Max
22
1.0
21
1.78 ± 0.25
0.48 ± 0.10
2.54 Min 5.10 Max
1 0.89
0.51 Min
13.4
14.6 Max
42
DP-42S
–
SC-551-42
4.42
15.24
0.10
0.25 +– 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
72
DP-42SA
–
SC-551-42
4.42
Package Outline Dimensions
61.72
63.50 Max
13.40
25
1.3
2.54 ± 0.25
0.48 ± 0.10
52.8
53.3 Max
15.24
0.11
0.25 +– 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-48
–
SC-617
–
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-56S
–
SC-629
5.88
29
1.78 ± 0.250
1.0
28
0.48 ± 0.10
0.51 Min
1
2.54 Min 5.06 Max
13.4
56
24
0.51 Min
3.18 Min 5.08 Max
1
14.0 Max
48
15.24
0.13
0.25 +– 0.05
0° – 15°
73
Package Outline Dimensions
82.04
83.22 Max
33
21.00
21.60 Max
64
5.08 Max
32
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.3
22.86
3.18 Min
1
0.11
0.25 +– 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
74
DP-64
–
SC-619
–
Package Outline Dimensions
33
17.0
18.6 Max
64
57.6
58.50 Max
1.78 ± 0.25
0.48 ± 0.10
2.54 Min 5.08 Max
32
1.0
0.51 Min
1
19.05
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DP-64S
–
SC-553-64A
8.57
75
Package Outline Dimensions
82.04
83.22 Max
90
1.78
0.25 M
0.48 ± 0.10
3.18 Min 5.08 Max
45
1.0
0.51 Min
1
21.60 Max
21.00
46
22.86
0.25
+ 0.11
– 0.05
0° – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
76
DP-90S
–
SC-630
–
Package Outline Dimensions
(2) Cerdip
Unit: mm
9.65
5
1
1.30
4
6.30
8
0.51 Min
0.48 ± 0.10
2.80 Min 5.08 Max
2.54 ± 0.25
7.62
0.11
0.25 +– 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-8
–
SC-504-8A
0.92
19.30
8
1
7
6.30
14
2.54 ± 0.25
0.48 ± 0.10
7.62
2.80 Min 5.08 Max
0.51 Min
1.50
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-14
–
SC-501-14A
2.07
77
Package Outline Dimensions
19.30
8
6.81
14
1
7
1.50
2.54 ± 0.25
2.80 Min 5.08 Max
0.51 Min
7.62
0.48 ± 0.10
0.11
0.25 +– 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-14A
–
SC-501-14A
2.09
19.30
9
6.30
16
8
1
1.00
2.54 ± 0.25
0.48 ± 0.10
7.62
2.80 Min 5.08 Max
0.51 Min
1.30
0.25
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
78
+ 0.11
– 0.05
DG-16
–
–
2.09
Package Outline Dimensions
19.30
20.19 Max
16
7.32
9
8
1
1.52
2.54 ± 0.25
0.48 ± 0.10
7.62
2.80 Min 5.08 Max
0.38 Min
1.00
0.11
0.25 +– 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-16A
–
SC-503-16B
–
19.30
9
1
8
6.81
16
2.54 ± 0.25
0.48 ± 0.10
7.62
2.80 Min 5.08 Max
0.51 Min
1.30
+ 0.11
0.25– 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-16B
–
SC-503-16A
2.09
79
Package Outline Dimensions
19.30
9
1
8
6.30
16
1.30
2.54 ± 0.25
2.80 Min 5.08 Max
0.51 Min
7.62
0.48 ± 0.10
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-16C
–
SC-503-16A
–
22.80
18
7.32
10
9
1
0.90
2.54 ± 0.25
0.48 ± 0.10
2.54 Min 5.08 Max
7.62
0.51 Min
1.32
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
80
DG-18
–
SC-505-18A
2.51
Package Outline Dimensions
25.16
27.94 Max
11
7.32
20
1
10
1.01
0.48 ± 0.10
2.54 ± 0.25
7.62
2.54 Min 5.08 Max
0.51 Min
1.54
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-20N
–
SC-603
2.82
24.13
11
6.81
20
1
10
2.54 ± 0.25
0.48 ± 0.10
2.80 Min 5.59 Max
0.99
0.51 Min
1.53
7.62
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-20NA
–
SC-603
2.85
81
Package Outline Dimensions
27.18
28.06 Max
12
7.32
8.13 Max
22
11
1
1.01
2.54 ± 0.25
0.48 ± 0.10
7.62
3.18 Min 5.08 Max
0.51 Min
1.54
0.11
0.25 +– 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-22N
–
SC-604
3.24
31.75
24
14.66
13
1
12
15.24
5.89 Max
2.54 Min
0.38 Min
1.32
2.54 ± 0.25
0.48 ± 0.10
0.25
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
82
+ 0.11
– 0.05
DG-24
–
SC-509-24E
4.49
Package Outline Dimensions
31.75
24
14.66
13
1
12
1.32
5.72 Max
2.54 Min
0.38 Min
15.24
0.48 ± 0.10
2.54 ± 0.25
0.25
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
+ 0.11
– 0.05
DG-24A
–
SC-509-24E
–
31.75
33.02 Max
14.66
15.51 Max
13
.89
φ8
1.32
12
15.24
0.38 Min
1
2.54 ± 0.25
0.48 ± 0.10
2.54 Min 5.89 Max
24
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.11
0.25 +– 0.05
DG-24B
–
SC-509-24E
6.78
83
Package Outline Dimensions
31.80
13
13.20
24
1
12
15.24
2.80 Min 5.80 Max
0.51 Min
1.30
+ 0.11
0.48 ± 0.10
2.54 ± 0.25
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-24C
–
SC-509-24E
6.78
30.30
13
9.14
24
12
1
2.54 ± 0.25
0.48 ± 0.10
10.16
2.80 Min 5.80 Max
0.38 Min
1.40
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
84
DG-24N
–
SC-507-24A Mod.
–
Package Outline Dimensions
30.30
24
9.14
13
12
1
0.93
0.48 ± 0.10
2.54 ± 0.25
10.16
2.80 Min 5.80 Max
0.38 Min
1.40
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
29.75
DG-24NA
–
SC-507-24A Mod.
4.48
+ 0.85
– 0.35
13
7.32
24
12
1
1.01
2.54 ± 0.25
0.48 ± 0.10
7.62
2.80 Min 5.84 Max
0.38 Min
1.54
+ 0.09
0.27 – 0.07
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-24V
–
SC-605 Mod.
3.46
85
Package Outline Dimensions
36.83
38.1 Max
15
14.66
15.51 Max
.89
φ8
14
1.32
15.24
0.38 Min
1
2.54 ± 0.25
0.48 ± 0.10
2.54 Min 5.89 Max
28
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-28
–
SC-661
8.73
36.83
28
13.21
15
15.24
2.54 ± 0.25
86
0.48 ± 0.10
2.54 Min 5.715 Max
14
1.32
0.38 Min
1
+ 0.11
0.25 – 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-28B
–
SC-611
8.18
Package Outline Dimensions
34.71
15
9.65
28
14
10.16
2.80 Min 5.30 Max
0.93
1.40
0.51 Min
1
2.54 ± 0.25
0.48 ± 0.10
0.11
0.25 +– 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-28N
–
SC-610-A
5.50
41.91
43.18 Max
32
14.66
15.51 Max
17
.89
φ8
1
16
15.24
2.54 ± 0.25
0.48 ± 0.10
2.54 Min 5.89 Max
0.38 Min
1.32
0.11
0.25 +– 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-32
–
SC-613
9.76
87
Package Outline Dimensions
41.91
43.18 Max
32
17
7.00
14.66
15.51 Max
17.00
16
2.54 ± 0.25
15.24
2.54 Min
0.38 Min
1.32
5.89 Max
1
0.48 ± 0.10
0.11
0.25 +– 0.05
0 – 15°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-32A
–
–
9.37
52.07
21
13.21
40
20
2.54 ± 0.25
0.48 ± 0.10
2.80 Min 5.715 Max
1.40
0.51 Min
1
15.24
+ 0.11
0 – 15°
0.25 – 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
88
DG-40
–
SC-615
–
Package Outline Dimensions
52.07
53.34 Max
14.66
21
φ 8.89
20
1.32
2.54 ± 0.25
0.51 Min
2.54 Min 6.30 Max
1
15.51 Max
40
0.48 ± 0.10
15.24
+ 0.11
0 – 15°
0.25– 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
52.07
53.34 Max
21
14.66
15.51 Max
40
DG-40A
–
SC-615 Mod.
12.57
20
0.51 Min
1.32
2.54 ± 0.25
0.48 ± 0.10
2.54 Min 6.30 Max
1
15.24
+ 0.11
0 – 15°
0.25– 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DG-40B
–
SC-615
12.53
89
Package Outline Dimensions
Under development
21
2.54 ± 0.25
0.48 ± 0.10
2.54 Min
1 1.32
0.51 Min
14.66
6.30 Max 15.51 Max
22
7.00
42
54.61
55.88 Max
20.00
15.24
0 – 15°
0.11
0.25 +– 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
90
DG-42
–
–
12.51
Package Outline Dimensions
(3) Ceramic DIP
Unit: mm
29.94
24
14.90
13
12
1
15.24
2.54 ± 0.25
2.54 Min 5.08 Max
0.51 Min
1.27
0.48 ± 0.10
0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
+ 0.11
– 0.05
DC-24
–
SC-509-24B
3.9
35.02
15
14.90
28
1
14
15.24
2.54 ± 0.25
0.48 ± 0.10
5.08 Max
2.54 Min
0.51 Min
1.27
+ 0.11
0.25 – 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DC-28
–
SC-510-28B
4.4
91
Package Outline Dimensions
50.26
21
1
1.27
20
0.48 ± 0.10
2.54 ± 0.25
0.51 Min
2.54 Min 5.08 Max
15.02
40
15.24
0.11
0.25 +– 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DC-40
–
SC-511-40B
6.5
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DC-40A
–
SC-511-40B
6.8
50.26
21
1.27
2.54 ± 0.25
92
20
0.48 ± 0.10
2.54 Min 5.06 Max
1
0.50 Min
15.02
40
15.24
+ 0.13
0.25 – 0.05
Package Outline Dimensions
50.26
40
1
2.54 ± 0.25
2.54 ± 0.25
1.02
20
0.48 ± 0.10
0.51 Min
2.54 Min 7.50 Max
19.00
21
15.24
0.11
0.25 +– 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DC-40P
–
–
11.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DC-42
–
SC-512-42B
11.6
52.80
22
1.27
2.54 ± 0.25
21
0.48 ± 0.10
2.54 Min 5.06 Max
1
0.51 Min
14.99
42
15.24
+ 0.11
0.25 – 0.05
93
Package Outline Dimensions
52.80
22
1
0.51 Min
21
2.54 ± 0.25
2.54 ± 0.25
1.0
0.48 ± 0.10
2.54 Min 7.50 Max
19.00
42
15.24
0.11
0.25 +– 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DC-42P
–
–
11.6
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DC-48
–
SC-617
8.3
60.42
25
2.54 ± 0.25
94
24
1.27
0.48 ± 0.10
2.54 Min 5.08 Max
1
0.51 Min
14.99
48
15.24
0.11
0.25 +– 0.05
Package Outline Dimensions
81.28
33
32
1.02
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1
2.54 Min 5.08 Max
22.56
64
22.86
Hitachi code
JEDEC code
EIAJ code
Weight (g)
+ 0.11
0.25 – 0.05
DC-64
–
SC-619
15.4
95
Package Outline Dimensions
57.30
64
32
0.9
1.778 ± 0.250
0.48 ± 0.10
0.51 Min
1
2.54 Min 5.60 Max
18.92
33
19.05
0.11
0.25 +– 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DC-64S
–
SC-553-64A
9.7
57.30
33
23.00
64
1
0.9
0.48 ± 0.10
0.51 Min
1.778 ± 0.250
2.54 Min 7.5 Max
32
2.54 ± 0.25
15.24
0.11
0.25 +– 0.05
19.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
96
DC-64SP
–
–
15.2
Package Outline Dimensions
(4) Plastic ZIP
Unit: mm
1
16
1.27
0.94 Max
0.11
0.25 +– 0.05
2.54
2.85
0.48 ± 0.10
2.8 Min 8.3 Max
6.75
20.13
20.65 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
ZP-16
MO-054AA
SC-557-16A
0.91
1
20
1.27
1.14 Max
+ 0.10
0.25 – 0.05
2.54
2.85
+ 0.08
0.50 – 0.12
2.8 Min 10.16 Max
8.51
25.61
26.11 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
ZP-20
–
SC-558-20A
1.44
97
Package Outline Dimensions
7.62
1.90 Min 8.255 Max
14.72
15.23 Max
1
0.635
1.27
1.50
0.30 +0.08
–0.12
20
0.15 +0.10
–0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
ZP-20ST
–
–
0.4
11Max
14.5 Max
8.8
27.1
28.1 Max
0.10
0.25 +– 0.05
1
21
1.27 ± 0.25
2.54
3.6
0.48 ± 0.10
98
Hitachi code
JEDEC code
EIAJ code
Weight (g)
ZP-21
–
–
–
Package Outline Dimensions
24
1
+ 0.08
1.27
1.05 Max
10.16 Max
0.10
0.25 +– 0.05
2.54
2.85
0.50 – 0.12
2.80 Min
8.51
30.5
31.0 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
ZP-24
–
SC-558-24A
1.70
24
0.50 +0.06
–0.08
1.27
1.045 Max
12.07 Max
0.25 +0.10
–0.05
2.54
2.85
1
2.80 Min
10.42
30.50
31.52 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
ZP-24A
–
–
1.69
99
Package Outline Dimensions
1
28
+ 0.08
1.27
1.045 Max
2.54
2.85
0.50 – 0.12
0.10
0.25 +– 0.05
2.80 Min
8.71
10.16 Max
35.58
36.57 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
ZP-28
–
SC-558-28A
1.95
40.66
32
1
+ 0.08
1.27
1.045 Max
2.85
0.50 – 0.12
2.80 Min 12.07 Max
10.42
41.68 Max
+ 0.10
0.25 – 0.05
2.54
Hitachi code
JEDEC code
EIAJ code
Weight (g)
100
ZP-32
–
–
2.78
Package Outline Dimensions
50.82
1
40
1.27
1.045 Max
+ 0.10
0.25 – 0.05
2.54
2.85
0.50
+ 0.08
– 0.12
2.8 Min 12.07 Max
10.42
51.84 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
ZP-40
–
–
3.35
101
Package Outline Dimensions
(5) Plastic SIP
Unit: mm
11.5 Max
9.8 Max
7.6 Min
4.8 Max
7.1 ± 0.5
12.0 Min
15.3 Max
6.0 Min
1.5 Max
1.27
3 0.76
0.5 Max
5.08
φ 3.80 ± 0.15
10.4 Max
1
3.4
102
SP-3T
TO-220AB
SC-46
1.84
Hitachi code
JEDEC code
EIAJ code
Weight (g)
SP-5T
–
–
2.02
4.8 Max
17.75 ± 0.3
6.0 Min
1 Max
1.7
Hitachi code
JEDEC code
EIAJ code
Weight (g)
1.37 Max
15.8 Max
2.8
10.15
2.8 Max
22.5
1 2
2.54
21.2
3.0 Max
φ 3.6 ± 0.2
2.5
5
0.5 Max
4.5
8.4
Package Outline Dimensions
φ 3.2 ± 0.2
10.0 ± 0.3
2.79 ± 0.15
2.5 ± 0.2
2.1 ± 0.2
20.6
21.9
0.6
8.45
12.0 ± 0.3
15.2 ± 0.3
17.0 ± 0.3
7.0 ± 0.3
4.44 ± 0.20
2.5 ± 0.2
1
5
1.7
4.3
8.2
3.4
Hitachi code
JEDEC code
EIAJ code
Weight (g)
SP-5TA
–
–
–
3.6
19.2
20.32 Max
1
0.48 ± 0.10
7
2.54 Min
9.2 Max
6.3
7.4 Max
1.6
+ 0.10
0.25 – 0.05
2.54
1.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
SP-7
–
–
–
103
Package Outline Dimensions
3.6
19.2
20.32 Max
9.2 Max
6.3
7.4 Max
1.6
8
2.54 Min
1
+ 0.10
0.25 – 0.05
0.48 ± 0.10
2.54 ± 0.25
1.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
30.21
SP-8
–
–
–
φ 3.6 ± 0.2
31 Max
28.0 ± 0.3
3.8 Max
20.0 ± 0.2
1.5 Max
1.23 ± 0.25
16 Max
12
1
2.54
23.97 ± 0.30
7 Min
3.6 ± 0.2
7.7
9.0
12.5 ± 0.3
4.1 ± 0.3
0.65 ± 0.10
0.25
+ 0.10
– 0.05
1.80 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
104
SP-12T
–
–
4.44
Package Outline Dimensions
φ 3.6 ± 0.2
19.66
20.5 Max
3.8 Max
3.0 ± 0.2
19.0 ± 0.3
17.90
13.8
7.8
11.3 ± 0.3
1.5 Max
1.80 ± 0.25
15
1
1.11 ± 0.25
1.27
0.10
0.25 +– 0.05
0.6 ± 0.1
3.5 ± 0.5
6.04 ± 0.50
2.54±0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
φ 3.6 ± 0.2
19.66
20.5 Max
3.8 Max
19.0 ± 0.3
3.0 ± 0.2
SP-15TA
–
–
3.10
18.2 Max
17.8 Max
13.8
7.8
11.3 ± 0.3
1.5 Max
1.8 ± 0.25
15
1
1.11 ± 0.25
1.27
2.54
0.6 ± 0.1
5.08 ± 0.50
0.10
0.25 +– 0.05
0.4
5.48 ± 0.50
Hitachi code
JEDEC code
EIAJ code
Weight (g)
SP-15TB
–
–
–
105
Package Outline Dimensions
3.0 ± 0.2
20.5 Max
19.0 ± 0.3
φ 3.6 ± 0.2
3.8 Max
1.80 ± 0.25
0.2 ± 0.2
17.1 Max
14.3 ± 0.4
7.8
11.3 ± 0.3
1.5 Max
15
+ 0.10
0.25 – 0.05
0.6 ± 0.1
2.0 Min
0° – 10°
1.27
1.11 ± 0.25
5.5 Max
1
17.78 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
24.5
25.0 Max
3.6
8.5 Max
12.0 Max
6.3
1.8
0.10
0.25 +– 0.05
16
1
1.5 ± 0.25
0.48 ± 0.10
2.7 ± 0.5
Hitachi code
JEDEC code
EIAJ code
Weight (g)
106
SP-15TC
–
–
–
SP-16
–
–
4.48
Package Outline Dimensions
φ 3.6 ± 0.2
31.0 Max
3.8 Max
17.4
13.8
7.7
9
11.2 ± 0.3
1.5 Max
3.6 ± 0.2
14.7 Max
28.0 ± 0.3
20.0 ± 0.2
4.1 ± 0.3
17.9
30.0
1.80 ± 0.25
16
1
1.87 ± 0.25
1.778
0.10
0.25 +– 0.05
0.6 ± 0.1
3.5 ± 0.5
23.33 ± 0.30
6.04 ± 0.50
26.67 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
30.0
SP-16TA
–
–
–
φ 3.6 ± 0.2
31.0 Max
28.0 ± 0.3
3.8 Max
20.0 ± 0.2
1.5 Max
1.23 ± 0.25
1.27
2.54
23.97 ± 0.30
23
0.6 ± 0.1
5.0 Min
6.2 Min
12.33 ± 0.45
+ 0.10
– 0.05
0.25
11.2 ± 0.3
1.80 ± 0.25
2.2 ± 0.5
1
9.0
7.7
3.6 ± 0.2
14.7 Max
4.1 ± 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
SP-23TA
–
–
4.61
107
Package Outline Dimensions
31.0 Max
φ 3.6 ± 0.2
28.0 ± 0.3
3.8 Max
0.6 ± 0.1
2.2 ± 0.5
2.54
0.925 ± 0.250
23.97 ± 0.30
30.0
1.80 ± 0.25
0.10
0.25 +– 0.05
1.275 ± 0.250
Hitachi code
JEDEC code
EIAJ code
Weight (g)
31.0 Max
17.3 Max
13.5 ±0.5
11.2 ± 0.3
23
1.27
1.23 ± 0.25
6.3 Min
7.7
1
9.0
1.5 Max
3.6 ±0.2
14.7 Max
20.0 ± 0.2
4.1 ± 0.3
6.0 Min
30.0
SP-23TB
–
–
–
φ 3.6 ± 0.2
28.0 ± 0.3
3.8 Max
1.23 ± 0.25
0.6 ± 0.1
11.2 ± 0.3
7.7
1.27
8.3 Max
23
1
9.0
1.5 Max
3.6 ± 0.2
14.7 Max
20.0 ± 0.2
4.1 ± 0.3
0.10
0.25 +– 0.05
1.80 ± 0.25
23.97 ± 0.30
Hitachi code
JEDEC code
EIAJ code
Weight (g)
108
SP-23TC
–
–
–
Package Outline Dimensions
30.0
φ 3.6 ± 0.2
31.0 Max
28.0 ± 0.3
3.8 Max
20.0 ± 0.2
1.5 Max
17.0 Max
11.2 ± 0.3
9.0
7.7
3.6 ± 0.2
14.7 Max
4.1 ± 0.3
1.27
0 – 10°
0.10
0.25 +– 0.05
5.5 Max
1.23 ± 0.25
23
0.6 ± 0.1
2.0 Min
1.80 ± 0.25
1
23.97 ± 0.30
Hitachi code
JEDEC code
EIAJ code
Weight (g)
SP-23TD
–
–
–
109
Package Outline Dimensions
(6) Ceramic PGA
Unit:mm
3.3 +0.7
–0.76
22.86 ± 0.45
22.86 ± 0.45
2.54
0.10
0.48 +– 0.074
1.15 Typ
26.42 +0.6
–0.4
5.1 Max
φ 0.25 M
1.27
26.42 +0.6
–0.4
1.78 +0.76
–0.76
5.1 Max
2.7 +0.86
–0.67
PC-68
–
–
6.1
2.23 – 3.83
3.03 Typ
29.46
25.4 ± 0.45
2.54 ± 0.25
1.15 Typ
2.54 ± 0.25
25.4 ± 0.45
0.48 ± 0.1
1.27 Typ
110
Hitachi code
JEDEC code
EIAJ code
Weight (g)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PC-72
–
–
7.7
Package Outline Dimensions
30.48 ± 0.45
2.00 ± 0.54
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PC-120
–
–
9.98
30.48 ± 0.45
1.27
2.54 ± 0.25
2.54 ± 0.25
34.48
34.48
30.48 ± 0.45
3.05 - 3.81
φ 0.46 ± 0.1
6.40 Max
φ 1.27
1.15
2.54
+0.1
0.48 –0.074
34.48 +0.7
–0.51
30.48 ± 0.45
2.7 +0.86
–0.67
3.3 +0.7
–0.76
3.3 Typ
1.27
φ 0.25 M
5.1 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PC-121
–
–
17.32
111
Package Outline Dimensions
5.08 Max
2.7 +0.86
–0.67
3.3 +0.7
–0.76
1.27
33.02 ± 0.45
112
33.02 ± 0.45
φ 0.25 M
PC-135
–
–
12.7
35.56 ± 0.45
35.56 ± 0.45
φ 0.25 M
2.03 ± 0.51
2.54
3.06 +0.5
–1.03
1.15
39.62 ± 0.5
39.62 ± 0.5
Hitachi code
JEDEC code
EIAJ code
Weight (g)
3.3 +0.7
–0.76
3.3 Typ
1.27
+0.1
0.48 –0.074
5.08 Max
2.03 ± 0.51
1.15
2.54
37.08 ± 0.51
+0.1
0.48 –0.074
37.08 ± 0.51
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PC-179
–
–
17.4
Package Outline Dimensions
3.30
+0.70
–0.76
40.64 ± 0.45
2.54
φ 0.25 M
40.64 ± 0.45
φ 1.15
φ 0.48 ± 0.1
1.27 Typ
2.00 ± 0.54
44.64 ± 0.6
44.64 ± 0.6
5.08 Max
3.33 ± 0.6
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PC-240
–
–
22.0
113
Package Outline Dimensions
3.48 +0.33
–0.43
0.97
45.72 ± 0.45
φ 0.25 M
1.905 ± 0.635
2.54
45.72 ± 0.45
5.08
φ 1.27 Typ
49.53 ± 0.6
φ 0.46 +0.048
–0.054
49.53 ± 0.6
4.80 Max
3.07 ± 0.6
Hitachi code
JEDEC code
EIAJ code
Weight (g)
114
PC-257
–
–
26.66
Package Outline Dimensions
4.80 Max
+0.33
2.54 Max
3.48 –0.43
48.26 ± 0.45
48.26 ± 0.45
φ 0.25 M
1.27 Typ
φ 0.46 –0.054
3.07 ± 0.6
2.54
2.035 ± 0.505
52.33 ± 0.6
+0.048
2.54 Max
52.33 ± 0.6
+0.23
0.97 –0.33
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PC-299
–
–
31.5
115
Package Outline Dimensions
2.54 Max
48.26 ± 0.45
φ 0.25 M
1.27 Typ
2.54
25.00 ± 0.25
φ 0.46 –0.054
+0.048
25.00 ± 0.25
52.33 ± 0.60
48.26 ± 0.45
2.54 Max
52.33 ± 0.60
+0.23
0.97 –0.33
9.15 Max
+0.33
3.48 –0.43
Hitachi code
JEDEC code
EIAJ code
Weight (g)
116
PC-299A
–
–
37.9
Package Outline Dimensions
2.54 Max
48.26 ± 0.45
φ 0.25 M
48.26 ± 0.45
+0.048
φ 0.46 –0.054
2.54
1.27 Typ
φ 45.50
52.33 ± 0.60
2.54 Max
52.33 ± 0.60
18.6 Max
+0.23
0.97 –0.33
+0.33
3.48 –0.43
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PC-299AT
–
–
67.7
117
Package Outline Dimensions
+0.23
–0.205
45.72 ± 0.45
0.40
+0.635
45.72 ± 0.45
2.54 ± 0.25
1.27 ± 0.15
2.54 ± 0.25
φ 0.7
1.905 –0.631
49.53 ± 0.6
1.27 ± 0.15
0.84
+0.37
–0.43
+0.06
–0.05
3.2 ± 0.6
3.63
2.54 ± 0.25
4.80 Max
2.54 ± 0.25
49.53 ± 0.6
Hitachi code
JEDEC code
EIAJ code
Weight(g)
118
PC-401
–
–
28.5
Package Outline Dimensions
2.1.2 Surface Mount Package
(1) Plastic SOP
Unit: mm
4
0.75 Max
6.80 Max
0.05
0.20 +– 0.02
1
2.03 Max
5
2.00 Max
8
4.55 Max
5.25 Max
0 – 10 °
0.10 ± 0.10
1.27 ± 0.15
0.40
0.25
0.60 +– 0.18
+ 0.10
– 0.05
0.15
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.12 M
FP-8D
–
SC-527-8A
0.10
7.62 (300 mil) Type
10.06
10.5 Max
8
5.5
14
1.27 ± 0.15
0.10
0.40 +– 0.05
+ 0.05
– 0.02
0.20
7.80 +– 0.30
0.20
2.20 Max
2.00 Max
1.42 Max
7
0.10 ± 0.10
1
0 – 10 °
0.70 ± 0.20
0.15
0.12 M
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-14DA
–
SC-529-14B
–
119
Package Outline Dimensions
5.72 (225 mil) Type
9.05 Max
8
1
7
0.25 Max
1.75 Max
4 Max
14
6.2 Max
0–8°
1.27 Max
0.25 Max
1.27
0.49 Max
0.15
0.25 M
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-14DN
MS-012AB
SC-529-14A
0.13
7.62 (300 mil) Type
10.06
10.5 Max
9
1
8
1.27 ± 0.15
+ 0.10
0.40 – 0.05
+ 0.05
– 0.02
0.20
7.80 +– 0.30
0.20
0.80 Max
0.10 ± 0.10 2.00 Max
2.20 Max
5.5
16
0 – 10 °
0.70 ± 0.20
0.15
0.12 M
120
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-16DA
–
SC-530-16C
–
Package Outline Dimensions
5.72 (225 mil) Type
9
1
8
0.25 Max
1.27
0.25 Max
1.75 Max
16
4 Max
10.30 Max
6.2 Max
0–8°
0.49 Max
0.15
1.27 Max
0.25 M
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-16DN
MS-012AC
SC-530-16A
0.15
7.62 (300 mil) Type
12.6
13 Max
11
1
10
5.5
20
1.27
0.10
0.40 +– 0.05
0.15
0.12 M
0.05
0.20 +– 0.02
2.20 Max
0.20
7.80 +– 0.30
0.10 ± 0.10 2.00 Max
0.80 Max
0 – 10 °
0.70 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-20DA
–
SC-531-20
0.31
121
Package Outline Dimensions
13.2 Max
11
1
10
7.90 Max
20
0.05
0.27 +– 0.04
2.65 Max
10.65 Max
0.30 Max
0–8°
1.27
0.49 Max
1.27 Max
0.15
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.12 M
FP-20DB
MS-013-AC
–
0.52
11.43 (450 mil) Type
15.8
16.21 Max
13
1.27 ± 0.10
0.40 – 0.05
+ 0.10
0.08
0.17 +– 0.07
12
11.8
12.1 Max
0 – 10 °
0.1 Min
1
1.12 Max
2.5 Max
8.4
24
1.0 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
122
FP-24D
MO-059AA
SC-532-24B
0.53
Package Outline Dimensions
13
1
12
1.27
0.15
0.40 ± 0.1
0.13 M
0.05 Min
0.67 Max
0.15 ± 0.05
2.00 Max
24
5.30 ± 0.3
15.00 ± 0.3
15.8 Max
7.80 ± 0.4
0 – 10 °
0.75 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-24DA
–
–
–
8.20 ± 0.3
1
0.65
0.13 M
0.15
0.05 Min
2.00 Max
0.30 ± 0.1
0.15 ± 0.05
0.68 Max
12
5.30 ± 0.3
13
24
7.80 ± 0.4
0 – 10°
0.75 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-24DS
–
–
–
123
Package Outline Dimensions
11.43 mm (450 mil) Type
18.4
19.2 Max
14
1
13
10.93
+ 0.15
– 0.25
0.3
+ 0.1
– 0.05
2.8 ± 0.2
2.7 ± 0.15
8.3 ± 0.25
26
0.35 ± 0.08
0 – 10 °
0.10
0.1 +– 0.05
0.80
2.8 3.6
0.16 M
0.50 Min
1.20 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.10
FP-26DT
–
–
–
11.43 mm (450 mil) Type
18.3
18.75 Max
15
2.5 Max
14
0.17 – 0.07
1
1.12 Max
+ 0.08
8.4
28
11.8
12.10 Max
+ 0.10
0.40 – 0.05
0.1 Min
0 – 10 °
1.27 ± 0.10
1.0
Hitachi code
JEDEC code
EIAJ code
Weight (g)
124
FP-28D
MO-059AC
SC-533-28C
0.63
Package Outline Dimensions
11.43 mm (450 mil) Type
18.00
18.75 Max
15
+ 0.08
– 0.07
14
1.77 Max
11.80 ± 0.30
0.17
1
3.00 Max
8.4
28
0.10 Min
0 – 10 °
+ 0.10
0.40 – 0.05
1.27 ± 0.10
1.00 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
9.53 mm
(375 mil) Type
FP-28DA
MO-059AD
SC-533-28C
0.82
11.00
11.20 Max
16
1
15
8.00
30
0.65
0.00 Min
1.05 Max
0.17 ± 0.05
0.10 M
2.00 Max
0.30 ± 0.05
10.00 ± 0.20
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-30D
–
–
–
125
Package Outline Dimensions
9.53 mm
(375 mil) Type
11.00
11.20 Max
16
1
15
8.00 ± 0.13
30
0.65
0.17 ± 0.05
2.00 Max
10.00 ± 0.20
0 – 10°
0.20 Max
0.00 Min
0.85 ± 0.10
1.85 ± 0.10
0.13 M
0.30 ± 0.05
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-30DB
–
–
–
13.34 mm (525 mil) Type
20.45
20.95 Max
17
11.30
32
14.14 ± 0.30
1
1.27
0.10
0.40 +– 0.05
126
0.10
0.15 M
0.05 Min
1.42
0.22
1.00 Max
+ 0.13
– 0.07
3.00 Max
16
0–8°
0.8 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-32D
–
–
1.3
Package Outline Dimensions
13.34 mm (525 mil) Type
26.00
26.20 Max
21
20
1.27
0.10
0.40 ± 0.10
14.13 ± 0.30
1.72
0 – 10°
0.09 Min
1.04 Max
0.17 ± 0.05
1
3.00 Max
10.70
40
0.12 M
0.80 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-40D
–
–
1.37
15.24 mm (600 mil) Type
28.50
28.70 Max
23
1
22
0.40 ± 0.10
1.27
0.10
0.12 M
0.09 Min
1.02 Max
16.04 ± 0.30
0.17 ± 0.05
3.00 Max
12.60
44
1.72
0 – 10°
0.80 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-44D
–
–
–
127
Package Outline Dimensions
17.15 mm (675 mil) Type
20
25
14
48
17.8 ± 0.3
0.15
0.35 ± 0.10
0 – 10 °
0.1 ± 0.1
0.80
3.0 Max
24
0.17 ± 0.05
1
0.8 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.15 M
FP-48D
–
–
0.43
15.24 mm (600 mil) Type
20.0
20.4 Max
25
1
24
14.0
48
1.00 Max
0.17 ± 0.05
3.0 Max
15.60 ± 0.30
0.80
0.10
0.35 ± 0.10
128
0.15 M
0.10 Min
0–5°
0.80
0.40 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-48DA
–
–
–
Package Outline Dimensions
10.16 mm (400 mil) Type
15.85 ± 0.3
25
1
24
2.65 Max
7.50 ± 0.3
48
0.78 Max
10.40 ± 0.4
0.15
0.25 ± 0.1
0.13 M
0.15 ± 0.05
0.635
0.10 Min
0 – 10°
0.60 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-48DSA
–
–
–
10.16 mm (400 mil) Type
18.40 ± 0.3
29
1
28
2.65 Max
7.50 ± 0.3
56
0.78 Max
10.40 ± 0.4
0.25 ± 0.1
0.15
0.13 M
0.15 ± 0.05
0.635
0.10 Min
0 – 10°
0.60 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-56DS
–
–
–
129
Package Outline Dimensions
26.2
27.0 Max
33
11.60
64
1
1.10 Max
0.10
0.08
0.30 +– 0.02
0.16 M
+ 0.08
– 0.07
13.8 ± 0.2
0 – 10°
0.30
0.50 +– 0.25
0.05 Min
0.8
0.17
3.0 Max
32
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-64DS
–
–
1.7
6.0
6.2 Max
14.40
20 16 15 11
1 56
0.08 M
16.0 ± 0.2
130
0.10
0 – 5°
0.17 ± 0.05
1.20 Max
0.45 Max
0.08 Min
0.18 Max
0.20 ± 0.10
10
0.50
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-20D
–
SC-662
0.22
Package Outline Dimensions
14.40
6.0
6.2 Max
11 15 16 20
10
6 5
1
0.50
0.08 M
16.0 ± 0.2
0 – 5°
0.10
0.17 ± 0.05
1.20 Max
0.45 Max
0.08 Min
0.18 Max
0.20 ± 0.10
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-20DR
–
SC-662
0.22
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-20DA
–
SC-664
0.37
8.0
8.2 Max
16
15
1
5
6
11
18.40
20
0.20 ± 0.10
10
0.50
0.08 M
20.0 ± 0.2
0.08 Min
0.18 Max
0.10
0 – 5°
0.17 ± 0.05
1.20 Max
0.45 Max
0.50 ± 0.10
131
Package Outline Dimensions
18.40
8.0
8.2 Max
11 15 16 20
10
6
0.20 ± 0.10
5
1
0.50
0.08 M
20.0 ± 0.2
0.10
8.0
8.2 Max
17
1
16
0.5
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-20DAR
–
SC-664
0.37
18.4
32
0.08 Min
0.18 Max
0 – 5°
0.17 ± 0.05
1.20 Max
0.45 Max
0.2 ± 0.1
0.08 M
20.0 ± 0.2
0.45 Max
132
0.08 Min
0.18 Max
0.10
0.17 ± 0.05
1.2 Max
0–5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-32D
MO-142BD
SC-664
0.39
Package Outline Dimensions
8.0
8.2 Max
32
16
1
18.40
17
0.50
0.20 ± 0.10
0.08 M
20.0 ± 0.2
0.45 Max
0.08 Min
0.18 Max
0.17 ± 0.05
1.20 Max
0–5°
0.10
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-32DR
MO-142BD
SC-664
0.39
8.0
8.2 Max
17
1
16
12.4
32
0.50
0.08 M
14.0 ± 0.2
0.10
0.17 ± 0.05
1.2 Max
0.45 Max
0–5°
0.08 Min
0.18 Max
0.20 ± 0.10
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-32DA
MO-142BA
SC-663
0.26
133
Package Outline Dimensions
8.0
8.2 Max
32
16
1
12.4
17
0.50
0.20 ± 0.10
0.08 M
14.0 ± 0.2
0.10
0–5°
0.08 Min
0.18 Max
0.17 ± 0.05
1.20 Max
0.45 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.50 ± 0.10
TFP-32DAR
MO-142BA
SC-663
0.26
5.00
5.4 Max
8
1
7
4.40
14
0.65
0.20 ± 0.10
0.13 M
0.03 Min
0.1Max
0.10
0.17 ± 0.05
1.10 Max
6.40 ± 0.20
0 – 10°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
134
TTP-14D
–
–
–
Package Outline Dimensions
5.20
5.4 Max
9
1
8
4.40
16
0.65
0.20 ± 0.10
0.13 M
0.10
0 – 10°
0.03 Min
0.1Max
0.17 ± 0.05
1.10 Max
6.40 ± 0.20
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
11
7.62
20
17.14
17.54 Max
16
15
TTP-16DA
–
–
–
1
5
10
6
1.27
0.40 ± 0.10
0.21
M
9.22 ± 0.2
1.15 Max
0.08 Min
0.18 Max
0.10
0.17 ± 0.05
1.20 Max
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-20D
MO-132AA
–
0.32
135
Package Outline Dimensions
10
7.62
1
17.14
17.54 Max
5
6
20
16 15
1.27
0.21
0.40 ± 0.10
11
M
9.22 ± 0.2
0 – 5°
0.08 Min
0.18 Max
0.10
0.17 ± 0.05
1.20 Max
1.15 Max
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-20DR
MO-132AA
–
0.32
6.50
6.9 Max
11
1
10
4.40
20
0.65
0.10
0.03 Min
0.10 Max
6.40 ± 0.20
0.13 M
0.17 ± 0.05
1.10 Max
0.20 ± 0.10
0 - 10°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
136
TTP-20DA
–
–
0.07
Package Outline Dimensions
18.41
18.81 Max
19 18
13
10.16
24
1
6 7
1.27
0.40 ± 0.10
0.21 M
12
11.76 ± 0.2
1.15 Max
0.68
0.145
0.10
0.08 Min
0.18 Max
+0.075
–0.025
1.20 Max
0 – 5°
0.50 ± 0.10
TTP-24D
MO-133AB
–
0.43
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-24DA
MO-132AB
–
0.30
13
7.62
24
17.14
17.54 Max
19 18
Hitachi code
JEDEC code
EIAJ code
Weight (g)
1
6 7
1.27
0.40 ± 0.10
0.21 M
12
9.22 ± 0.2
1.15 Max
0.50 ± 0.10
0.68
0.08 Min
0.18 Max
+0.075
–0.025
0.10
0.145
1.20 Max
0 – 5°
137
Package Outline Dimensions
8.0
8.2 Max
13
1
12
4.4
24
0.65
0.17 ± 0.05
0.10
0.03 Min
0.10 Max
6.4 ± 0.2
0.13 M
0.65 Max
1.10 Max
0.20 ± 0.10
0 - 10°
0.5 ± 0.1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-24DB
–
–
–
18.41
18.81 Max
15
10.16
28
0.40 ± 0.10
1.27
0.21
14
M
11.76 ± 0.2
138
0.10
0.17 ± 0.05
1.20 Max
1.15 Max
0 – 5°
0.08 Min
0.18 Max
1
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-28D
MO-133AA
–
0.43
Package Outline Dimensions
18.41
18.81 Max
14
10.16
1
28
0.40 ± 0.10
1.27
0.21
15
M
11.76 ± 0.2
1.15 Max
0.08 Min
0.18 Max
0.17 ± 0.05
1.20 Max
0 – 5°
0.10
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-28DR
MO-133AA
–
0.43
18.41
18.81 Max
15
10.16
28
0.21
14
M
11.76 ± 0.2
+0.075
–0.025
0.10
0.145
1.20 Max
1.15 Max
0 – 5°
0.50 ± 0.10
0.68
0.40 ± 0.10
1.27
0.08 Min
0.18 Max
1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-28DA
MO-133AA
–
0.43
139
Package Outline Dimensions
10.16 mm
(400 mil) Type
20.95
21.35 Max
17
10.16
32
1.27
0.21
0.40 ± 0.10
16
M
11.76 ± 0.2
0.17 ± 0.05
1.20 Max
1.15 Max
0.10
0 – 5°
0.08 Min
0.18 Max
1
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-32D
MO-133CA
–
0.51
20.95
21.35 Max
10.16 mm
(400 mil) Type
16
10.16
1
1.27
0.40 ± 0.10
0.21
17
M
11.76 ± 0.2
0.10
0.17 ± 0.05
1.20 Max
1.15 Max
0 – 5°
0.08 Min
0.18 Max
32
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
140
TTP-32DR
MO-133CA
–
0.51
Package Outline Dimensions
10.16 mm (400 mil) Type
20.95
21.35 Max
32
10.16
17
1
16
1.27
0.21
M
11.76 ± 0.20
0.145
0.10
0.50 ± 0.10
0 – 5°
0.68
+0.075
–0.025
1.2 Max
1.15 Max
0.08 Min
0.18 Max
0.40 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-32DA
MO-133CA
–
0.43
10.16 mm (400 mil) Type
20.95
21.35 Max
17
10.16
32
1
1.27 16
0.40 ± 0.10
0.21 M
11.76 ± 0.20
0.10
0.08 Min
0.16 Max
0 – 5°
0.17 ± 0.05
1.20 Max
1.15 Max
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-32DB
–
–
0.51
141
Package Outline Dimensions
23.49
23.89 Max
10.16 mm
(400 mil) Type
19
10.16
36
1
1.27
0.21
M
11.76 ± 0.2
0.145
0.10
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
10.16 mm
(400 mil) Type
0.68
+0.075
–0.025
1.20 Max
1.15 Max
0.08 Min
0.18 Max
0.4 ± 0.1
18
TTP-36D
–
–
0.55
23.46
23.89 Max
19
10.16
36
1.27
0.21
M
11.76 ± 0.2
+0.075
–0.025
0.10
0.145
1.20 Max
1.15 Max
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
142
0.68
0.20 ± 0.07
18
0.08 Min
0.18 Max
1
TTP-36DA
–
–
0.55
Package Outline Dimensions
10.16 mm (400 mil) Type
18.41
18.81 Max
31 30
21
10.16
40
10 11
0.80
1
20
0.21 M
0.30 ± 0.10
11.76 ± 0.2
1.005 Max
0.10
0.08 Min
0.18 Max
0.17 ± 0.05
1.20 Max
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-40DA
MO-133BA
–
0.43
10.16 mm (400 mil) Type
18.41
18.81 Max
10 11
20
10.16
1
31 30
40
21
0.80
0.30 ± 0.10
0.21 M
11.76 ± 0.2
1.005 Max
0.08 Min
0.18 Max
0.10
0.17 ± 0.05
1.20 Max
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-40DAR
MO-133BA
–
0.43
143
Package Outline Dimensions
10.16 mm (400 mil) Type
18.41
18.81 Max
31 30
40
10.16
21
1
10 11
0.80
20
0.21 M
0.27 ± 0.07
11.76 ± 0.2
1.005 Max
0.145
0.68
0.10
0.08 Min
0.18 Max
+0.075
–0.025
1.20 Max
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-40DB
MO-133BA
–
0.44
10.16 mm (400 mil) Type
18.41
18.81 Max
23
10.16
44
1
0.80
22
0.13 M
0.30 ± 0.10
11.76 ± 0.20
0.08 Min
0.16 Max
0.10
0 – 5°
0.17 ± 0.05
1.20 Max
1.105 Max
0.50 ± 0.10
144
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-44D
–
–
–
Package Outline Dimensions
10.16 mm (400 mil) Type
18.41
18.81 Max
23
10.16
44
1
0.80
22
0.21 M
0.30 ± 0.10
11.76 ± 0.20
1.005 Max
0.10
0.08 Min
0.18 Max
0.17 ± 0.05
1.20 Max
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-44DB
–
–
0.43
10.16 mm (400 mil) Type
18.41
18.81 Max
22
10.16
1
44
0.80
23
0.21 M
0.30 ± 0.10
11.76 ± 0.20
1.005 Max
0.08 Min
0.18 Max
0.10
0.17 ± 0.05
1.20 Max
0 – 5°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-44DBR
–
–
0.43
145
Package Outline Dimensions
10.16 mm (400 mil) Type
20.95
21.35 Max
23
10.16
44
1
22
0.80
0.13 M
0.27 ± 0.07
11.76 ± 0.20
1.15 Max
0.68
0.145
0.10
0.08 Min
0.18 Max
+0.075
–0.025
1.20 Max
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.50 ± 0.10
TTP-44DC
MO-133DA
–
0.50
10.16 mm (400 mil) Type
18.41
18.81 Max
23
10.16
44
1
0.80
0.27 ± 0.07
22
0.13 M
11.76 ± 0.20
1.15 Max
0.50 ± 0.10
146
0.68
0.08 Min
0.18 Max
0.145
0.10
+0.075
–0.025
1.20 Max
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-44DE
–
–
–
Package Outline Dimensions
13.97 mm (550 mil) Type
19.68
20.00 Max
25
13.97
48
1
0.80
0.30 ± 0.10
24
15.57 ± 0.10
0.13 M
0.10
0.08 Min
0.16 Max
0 – 5°
0.17 ± 0.05
1.20 Max
0.94 Max
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-48D
–
–
–
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TTP-50D
–
–
0.50
10.16 mm (400 mil) Type
20.95
21.35 Max
26
10.16
50
1
0.80
0.27 ± 0.07
25
0.13 M
11.76 ± 0.20
1.15 Max
0.68
0.08 Min
0.18 Max
+0.075
–0.025
0.10
0.145
1.2 Max
0 – 5°
0.5 ± 0.1
147
Package Outline Dimensions
(2) Plastic QFP
9.0 ± 0.2
9.0 ± 0.2
7.0
20
15
14
21
28
7
6
1
0.30 ± 0.10
M
0.22 Max
0.08 Min
1.7 Max
0.13
2.25 ± 0.10
0.1
0.17 ± 0.05
0.65 mm Pitch
0.65
Unit: mm
1.0 ± 0.2
0 – 10°
0.95 ± 0.10
0.5 ± 0.1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-28T
–
–
–
31
20
40
11
10
0.13
M
0.1
148
0.15 ± 0.07
1.7 Max
1
0.3 ± 0.1
0.17 ± 0.05
9.0 ± 0.2
9.0 ± 0.2
7.0
30
21
0.65
0.65 mm Pitch
1.0 ± 0.2
0 – 10°
0.5 ± 0.1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-40
–
–
–
Package Outline Dimensions
17.2 ± 0.3
0.8 mm Pitch
14
23
33
34
17.2 ± 0.3
0.80
22
12
44
11
+0.08
2.70 –0.16
3.05 Max
+0.20
0.15 M
0.17 –0.05
1
0.35 ± 0.10
1.6
0.1
0–5°
0.10
0.8
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.8 – 0.3
FP-44A
–
SC-577-A
1.0
37
24
48
13
12
0.10
M
0.17 ± 0.05
0.08
1.7 Max
1
0.20 ± 0.05
0.10 ± 0.07
9.0 ± 0.2
9.0 ± 0.2
7.0
36
25
0.50
0.5 mm Pitch
1.00
0 – 10°
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-48
–
SC-592-A
0.17
149
Package Outline Dimensions
25.6 ± 0.4
1 mm Pitch
20.0
33
49
32
1.0
54
1
5
23
0.17 ± 0.05
2.70 –0.16
0.15 M
2.80
0 – 10 °
0.10
0.35 ± 0.10
+0.20
22
6
3.10 Max
14.0
19.6 ± 0.4
50
1.70 ± 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-54
–
SC-582-E
–
24.8 ± 0.4
1 mm Pitch
20.0
33
49
32
1.0
54
1
5
0.17 ± 0.05
3.10 Max
22
0.15 M
+0.20
6
0.35 ± 0.10
23
2.70 –0.16
14.0
18.8 ± 0.4
50
2.40
0.15
0.20
0 – 10 °
1.20 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
150
FP-54A
–
SC-582-F
–
Package Outline Dimensions
12.8 ± 0.3
0.65 mm Pitch
10.0
42
29
28
56
15
14
0.13 M
0.10
1.40
0–5°
0.1
0.3 ± 0.10
0.15 ± 0.05
1
2.54 Max
0.65
12.8 ± 0.3
43
0.60
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-56
–
SC-560-A
0.51
25.6 ± 0.4
1 mm Pitch
20.0
36
54
35
1.0
60
1
0.17 ± 0.05
0.15 M
3.10 Max
0.35 ± 0.10
2.70
24
23
6
+0.20
–0.16
5
0.10
14.0
19.6 ± 0.4
55
2.80
0 – 10 °
1.70 ± 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-60
–
SC-582-E
1.5
151
Package Outline Dimensions
24.8 ± 0.4
1 mm Pitch
20.0
36
54
35
1.0
60
1
5
24
2.70
0.15 M
0.17 ± 0.05
+0.20
–0.16
23
2.40
0 – 10 °
0.20
6
0.35 ± 0.10
3.10 Max
14.0
18.8 ± 0.4
55
0.15
1.20 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-60A
–
SC-582-F
–
25.6 ± 0.4
1 mm Pitch
20.0
33
51
32
1.0
19.6 ± 0.4
14.0
52
64
0.17 ± 0.05
3.10 Max
0.15 M
0.10
0.35 ± 0.10
19
2.70
1
+0.20
–0.16
20
2.80
0 – 10 °
1.70 ± 0.30
Hitachi code
JEDEC code
EIAJ code
Weight (g)
152
FP-64
–
SC-582-E
1.56
Package Outline Dimensions
17.2 ± 0.3
0.8 mm Pitch
14
33
48
32
0.80
17.2 ± 0.3
49
64
17
1
+0.08
–0.05
0.17
1.6
0–5°
0.1
0.1
3.05 Max
+0.20
–0.16
0.15 M
2.70
0.35 ± 0.10
16
0.8 – 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-64A
–
SC-577-A
1.0
24.8 ± 0.4
1 mm Pitch
20
33
32
64
20
0.20
0.17 ± 0.05
+0.20
2.70 –0.16
+0.1
–0.2
19
0.20 M
0.2
1
0.35 ± 0.10
3.10 Max
1.0
52
14
18.8 ± 0.4
51
2.40
0 – 10 °
1.2 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-64B
–
SC-582-F
–
153
Package Outline Dimensions
0.5 mm Pitch
12.0 ± 0.2
10.0
48
33
32
0.50
12.0 ± 0.2
49
64
17
16
0.20 ± 0.05
1.00
0 – 10°
0.10
2.5 Max
0.08 M
0.17 ± 0.05
1
0.10
0.50 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-64C
–
SC-593-B
0.33
0.5 mm Pitch
12.0 ± 0.2
10.0
48
33
32
64
17
0.50
12.0 ± 0.2
49
16
154
0.10 ± 0.10
0.10
0.17 ± 0.05
1.70 Max
0.08 M
1.45
1
0.22 ± 0.10
1.00
0 – 5°
0.50 ± 0.15
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-64E
–
–
–
Package Outline Dimensions
25.6 ± 0.4
0.8 mm
Pitch
20.0
41
64
40
80
25
0.35 ± 0.10
+0.20
–0.16
24
2.80
0 – 10 °
0.10
2.70
0.15 M
0.17 ± 0.05
1
3.10 Max
0.8
19.6 ± 0.4
14.0
65
1.70 ± 0.30
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-80
–
SC-581-G
1.60
17.2 ± 0.3
0.65 mm
Pitch
14.0
60
41
40
0.65
17.2 ±0.3
61
80
21
1
+0.08
–0.05
1.60
0.17
3.05 Max
+0.20
–0.16
2.70
0.12 M
0–5°
0.10
0.10
0.30 ±0.10
20
0.80 ± 0.30
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-80A
–
SC-579-A
1.15
155
Package Outline Dimensions
24.8 ± 0.4
0.8 mm Pitch
20.0
41
65
40
80
25
2.70
0.20
0.15
0.17 ± 0.05
24
0.15 M
3.10 Max
1
0.35 ± 0.10
+0.20
–0.16
0.8
14.0
18.8 ± 0.4
64
2.40
0 – 10 °
1.20 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-80B
–
SC-581-H
–
23.2 ± 0.3
0.8 mm Pitch
20
66
45
44
88
23
0.10
0.17 ± 0.05
0.15 M
3.05 Max
22
1.6
0–5°
0.1
1
0.35 ± 0.10
2.70 +0.20
–0.16
0.8
23.2 ± 0.3
67
0.8 ± 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
156
FP-88
–
SC-583
–
Package Outline Dimensions
25.6 ± 0.4
0.65 mm
Pitch
20.0
51
80
50
0.65
14.0
100
0.30 ± 0.10
2.80
0 – 10 °
0.10
2.70
0.15 M
0.17 ± 0.05
30
3.10 Max
31
1
+0.20
–0.16
19.6 ± 0.4
81
1.70 ± 0.30
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-100
–
SC-581-J Mod.
1.61
24.8 ± 0.4
0.65 mm Pitch
20.0
51
50
100
31
0.15
0.17 ± 0.05
M
+0.20
0.13
2.70 –0.16
30
0.20
1
0.30 ± 0.10
3.10 Max
0.65
81
14.0
18.8 ± 0.4
80
2.40
0 – 10 °
1.20 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-100A
–
SC-580-J
–
157
Package Outline Dimensions
16.0 ± 0.3
0.5 mm Pitch
14
75
51
50
100
26
+0.08
–0.05
0.12
0.08 M
0.17
2.70
0.20 ± 0.10
+0.20
–0.16
25
1
3.05 Max
0.5
16.0 ± 0.3
76
0.10
1.0
0 – 10 °
0.50 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-100B
–
SC-595-D
–
23.2 ± 0.3
0.65 mm Pitch
20
84
57
56
112
29
0.65
23.2 ± 0.3
85
0.17 ± 0.05
1.6
0–5°
0.1
3.05 Max
0.13 M
+0.20
–0.16
28
2.70
1
0.30 ± 0.10
0.10
0.8 ± 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
158
FP-112
–
–
–
Package Outline Dimensions
22.0 ± 0.2
20.0
0.5 mm Pitch
102
65
64
0.50
14.0
128
39
1
0.10 M
+0.03
–0.07
0.10
0.10
1.00
0.17
+0.05
–0.04
2.70 ± 0.20
0.22
38
3.15 Max
16.0 ± 0.20
103
0 – 10 °
0.50 ± 0.20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-128
–
–
–
31.2 ± 0.3
0.8 mm Pitch
28.0
69
102
103
0.8
31.2 ± 0.3
68
0.8 ± 0.3
0.10
0.17 ± 0.05
0.15 M
3.56 Max
0.35 ± 0.10
3.20
1.6
34
0–5°
0.15
1
+ 0.10
– 0.14
35
136
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-136
–
SC-586-A
5.28
159
Package Outline Dimensions
0.8 mm
Pitch
31.2 ± 0.3
28.0
69
102
68
136
35
0.8 ± 0.3
0.5
0.10
0–5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-136A
–
SC-586-A
5.28
22.0 ± 0.3
0.5 mm Pitch
20
108
73
72
144
37
0.50
22.0 ± 0.3
109
0.5 ± 0.1
0.5
0.10
0.12
0.17 ± 0.05
1.70 Max
0.08 M
1.0
1.45 +0.20
–0.16
36
1
0.20 ± 0.10
160
0.17 ± 0.05
0.43
3.56 Max
0.15 M
3.20 – 0.14
34
0.35 ± 0.10
0.15
1
1.6
+ 0.10
0.8
31.2 ± 0.3
103
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-144A
–
SC-596-A
–
Package Outline Dimensions
0.65 mm
Pitch
32.0 ± 0.3
28.0
120
81
80
160
41
0 – 5°
0.15
2.00
0.17 ± 0.05
40
0.13 M
3.20 +0.10
–0.14
1
0.30 ± 0.10
3.56 Max
0.65
32.0 ± 0.3
121
0.80 ± 0.02
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-160A
–
–
–
31.2 ± 0.3
28.0
0.65 mm Pitch
126
85
84
0.65
31.2 ± 0.3
127
168
43
0.80 ± 0.30
0.10
0.17 ± 0.05
1.60
3.56 Max
0.15 M
0.10
0.35 ± 0.10
+0.10
3.20 –0.14
42
1
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-168
–
–
–
161
Package Outline Dimensions
26.0 ± 0.3
24.0
0.5 mm Pitch
132
89
88
176
45
0.50
26.0 ± 0.3
133
1.45
0.08 M
0.5
0.5 ± 0.1
0.12 ± 0.04
1.00 ± 0.20
0.10
0 – 8°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-176
–
SC-597
1.74
30.0 ± 0.3
0.5 mm Pitch
28.0
105
156
104
208
53
0.50 ± 0.20
0.50
0.10
0.15 ± 0.05
3.56 Max
1.00
3.20 – 0.14
0.08 M
0.15
52
0.20 ± 0.10
+ 0.10
0.50
30.0 ± 0.3
157
1
162
0.17 ± 0.05
44
1.70 Max
1
0.20 ± 0.10
0–5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-208
–
SC-598-A
4.82
Package Outline Dimensions
43.2 ± 0.3
40.0
0.65 mm Pitch
174
117
116
232
59
0.15 ± 0.05
58
1.6
0 - 0.20
0.13 M
+0.10
1
0.3 ± 0.10
4.00 –0.14
4.41 Max
0.65
43.2 ± 0.3
175
0.10
0.8
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-232
–
–
–
42.6 ± 0.3
40.0
0.5 mm Pitch
204
129
128
256
77
0.50
30.6 ± 0.3
28.0
205
1
0.50 ± 0.20
0.10
0.15 ± 0.05
1.30
0.15
3.20 –0.14
+0.10
0.10 M
3.56 Max
76
0.22 ± 0.10
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-256
–
–
–
163
Package Outline Dimensions
30.6 ± 0.2
0.4 mm
Pitch
28.0
192
129
128
256
65
30.6 ± 0.2
0.40
193
1
64
0.22 ± 0.10
0.50 ± 0.20
0.08
+ 0.02
0.17 – 0.07
3.95 Max
1.30
0 – 10 °
0.40
3.20 ± 0.25
0.105 M
Hitachi code
JEDEC code
EIAJ code
Weight (g)
42.6 ± 0.3
40.0
0.5 mm Pitch
204
129
128
0.50
30.6 ± 0.3
28.0
205
256
77
1
0.50 ± 0.20
0.10
3.56 Max
1.30
0.15
3.20 –0.14
+0.10
0.10 M
0.15 ± 0.05
76
0.22 ± 0.10
164
FP-256C
–
–
–
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-256T
–
–
–
Package Outline Dimensions
34.6 ± 0.2
0.4 mm
Pitch
32.0
222
149
148
34.6 ± 0.2
0.40
223
296
75
0.105 M
0.50 ± 0.20
0 – 10 °
0.40
1.30
0.17 – 0.07
0.180 ± 0.035
+ 0.02
74
3.20 ± 0.25
3.95 Max
1
0.08
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-296
–
–
–
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-304
–
SC-601-A
–
42.6 ± 0.3
40.0
0.5 mm Pitch
228
153
229
0.50
42.6 ± 0.3
152
0.50 ± 0.20
0.10
0.15 ± 0.05
4.00
0.08 M
1.30
0.20
0.20 ± 0.10
76
+0.10
–0.14
1
4.41 Max
77
304
165
Package Outline Dimensions
34.6 ± 0.3
0.3 mm Pitch
Under development
32.0
288
193
289
0.3
34.6 ± 0.3
192
384
0 – 0.25
1.30
0.05
0.12 +– 0.015
0.12
3.70 Max
96
3.20 ± 0.25
97
1
0.50
0 – 10°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-384
–
–
6.3
0.8 mm Pitch
15.6 ± 0.3
14.0
33
23
22
0.80
15.6 ± 0.3
34
0.35 ± 0.10
12
0.15 M
0.10
0.50 ± 0.10
166
0.30
0 Min
0.2 Max
0.80 ± 0.20
0.17 ± 0.05
11
1
1.20 Max
44
0–5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-44
–
SC-577-B Mod.
0.48
Package Outline Dimensions
0.8 mm Pitch
15.6 ± 0.3
14.0
48
33
32
0.80
15.6 ± 0.3
49
17
64
1
0.35 ± 0.10
1.20 Max
0.15 M
0.80 ± 0.20
0.50 ± 0.10
0–5°
0 Min
0.2 Max
0.10
0.17 ± 0.05
16
0.30
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-64
–
SC-577-B Mod.
0.47
15.6 ± 0.3
0.65 mm Pitch
14.0
60
41
40
80
21
0.65
15.6 ± 0.3
61
0.30 ± 0.10
1.20 Max
0.13 M
0.10
0.50 ± 0.10
0.30
0 Min
0.2 Max
0.80 ± 0.20
0.17 ± 0.05
20
1
0–5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-80
–
SC-579-B Mod.
0.45
167
Package Outline Dimensions
13.6 ± 0.3
0.5 mm Pitch
12.0
60
41
40
80
21
0.50
13.6 ± 0.3
61
1
20
0.20 ± 0.10
0.00 Min
0.02 Max
0.80
0.10
0.50 ± 0.10
0.30
0.5 mm Pitch
0.17 ± 0.05
1.20 Max
0.08 M
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-80A
–
–
–
14.0 ± 0.2
12.0
60
41
40
80
21
0.50
14.0 ± 0.2
61
1
20
1.00
0.10
0.50 ± 0.10
168
0.17 ± 0.05
1.20 Max
0.10 M
0.00 Min
0.20 Max
0.20 ± 0.05
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-80C
–
–
–
Package Outline Dimensions
16.0 ± 0.2
0.65 mm Pitch
14.0
60
41
40
80
21
0.65
16.0 ± 0.2
61
1.20 Max
0.13 M
0.17 ± 0.05
20
1
0.30 ± 0.10
0–5°
0.00 Min
0.20 Max
1.00
0.10
0.50 ± 0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-80F
–
–
–
0.5 mm Pitch
15.6 ± 0.3
14.0
75
51
50
100
26
0.50
15.6 ± 0.3
76
0.10 M
0.50 ± 0.10
0.30
0.10
0.00 Min
0.20 Max
0.80
0.17 ± 0.05
25
1.20 Max
1
0.20 ± 0.05
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-100
–
SC-595-B Mod.
0.46
169
Package Outline Dimensions
0.5 mm Pitch
16.0 ± 0.2
14.0
75
51
50
100
26
0.50
16.0 ± 0.2
76
0.08 M
0.00 Min
0.20 Max
1.00
0.10
0.50 ± 0.10
0.17 ± 0.05
25
1.20 Max
1
0.20 ± 0.05
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-100B
–
–
–
0.4 mm Pitch
16.0 ± 0.3
14.0
90
61
60
120
31
0.4
16.0 ± 0.3
91
0.065 M
0.50 ± 0.10
170
0.10
0.00 Min
0.20 Max
1.00
0.17 ± 0.05
30
1.20 Max
1
0.17 ± 0.05
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-120
–
–
–
Package Outline Dimensions
16.0 ± 0.2
14.0
126
85
84
168
43
42
1.20 Max
1
0.14 ± 0.035
0.05 M
0.50 ± 0.10
0.05
0.00 Min
0.20 Max
1.00
0.145 ± 0.04
0.30
16.0 ± 0.2
127
0 – 5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TFP-168
–
–
–
171
Package Outline Dimensions
(3) Plastic SOJ
Unit: mm
16.90
17.27 Max
1
8.51 ± 0.13
11
7.62 ± 0.13
20
10
1.27
0.43 ± 0.10
0.21
2.40 +– 0.24
1.3 Max
0.63 Min
3.50 ± 0.26
0.74
6.71 ± 0.28
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-20D
MO-077AB
SC-633-A
0.6
17.00
17.27 Max
8.89 ± 0.13
1
0.43 ± 0.10
1.27
0.10
0.63 Min
3.50 ± 0.26
1.3 Max
0.21
2.40 +– 0.24
10
0.74
172
9.78 ± 0.13
11
20
8.13 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-20DA
MO-063-AA
SC-635
0.81
Package Outline Dimensions
15.63
16.00 Max
7.62 ± 0.13
8.64 ± 0.13
13
24
1
0.63 Min
3.50 ± 0.26
1.3 Max
+ 0.35
6.76 – 0.16
1.27
0.43 ± 0.10
0.21
2.40 +– 0.24
12
0.74
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
1.3 Max
1.27
0.43 ± 0.10
0.10
2.85 ± 0.12
12
0.63 Min
6
7
0.74
3.50 ± 0.26
1
11.18 ± 0.13
13
10.16 ± 0.13
24
18.17
18.54 Max
19 18
CP-24D
MO-065AA
SC-631-B
0.76
9.40 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-24DA
MO-061AA
SC-637-B
1.1
173
Package Outline Dimensions
16.90
17.27 Max
19 18
6 7
0.74
0.43 ± 0.10
0.63 Min
1.3 Max
2.65 ± 0.12
12
3.50 ± 0.26
1
8.51 ± 0.13
13
7.62 ± 0.13
24
1.27
6.71 ± 0.25
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-24DB
MO-077AA
SC-632-A
0.80
14
3.50 ± 0.26
0.74
1.3 Max
0.43 ± 0.10
1.27
0.10
174
0.21
2.40 +– 0.24
1
0.63 Min
15
10.16 ± 0.13
28
11.18 ± 0.13
18.17
18.54 Max
9.40 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-28D
MO-061AA
SC-637-B
1.16
Package Outline Dimensions
18.17
18.54 Max
15
1
11.18 ± 0.13
10.16 ± 0.13
28
0.43 ± 0.10
2.85 ± 0.12
1.30 Max
0.63 Min
3.50 ± 0.26
14
0.74
9.40 ± 0.25
1.27
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-28DA
MO-061AA
SC-637-B
1.16
14
3.50 ± 0.26
0.74
1.3 Max
0.43 ± 0.10
1.27
0.10
0.21
2.40 +– 0.24
1
0.63 Min
15
7.62 ± 0.13
28
8.64 ± 0.13
18.17
18.54 Max
0.35
6.76 +– 0.16
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-28DN
MO-077AB
SC-633-A
0.92
175
Package Outline Dimensions
1
16
1.3 Max
0.63 Min
3.50 ± 0.26
0.74
9.40 ± 0.25
1.27
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.10
1.3 Max
0.43 ± 0.10
1.27
0.63 Min
16
0.74
3.50 ± 0.26
1
11.18 ± 0.13
17
10.16 ± 0.13
32
20.71
21.08 Max
CP-32D
MO-061AB
SC-638
1.42
2.85 ± 0.12
0.43 ± 0.10
0.31
2.30 +– 0.14
17
10.16 ± 0.13
32
11.18 ± 0.13
20.71
21.08 Max
9.40 ± 0.25
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
176
CP-32DB
MO-061AB
SC-638
1.7
Package Outline Dimensions
1
16
1.265 Max
0.43 +0.08
–0.03
0.63 Min
3.50 ± 0.26
0.74
2.30 +0.31
–0.14
17
7.62 ± 0.13
32
8.51 ± 0.13
20.71
21.08 Max
6.71 +0.28
–0.11
1.27
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-32DN
MO-077AC
SC-634
1.3
18
3.50 ± 0.26
0.74
1.3 Max
0.43 ± 0.10
1.27
0.10
2.85 ± 0.12
1
0.63 Min
19
10.16 ± 0.13
36
11.18 ± 0.13
23.25
23.62 Max
9.40 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-36D
MO-061AC
SC-639
1.4
177
Package Outline Dimensions
1
20
1.3 Max
0.63 Min
3.50 ± 0.26
0.74
9.40 ± 0.25
1.27
0.43 ± 0.10
0.31
2.30 +– 0.14
21
10.16 ± 0.13
40
11.18 ± 0.13
25.80
26.16 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.10
CP-40D
–
SC-640
1.73
20
1.265 Max
0.43 ± 0.10
1.27
0.10
178
3.50 ± 0.26
0.74
2.85 ± 0.12
1
0.63 Min
21
10.16 ± 0.13
40
11.18 ± 0.13
25.80
26.16 Max
9.40 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-40DA
–
SC-640
1.7
Package Outline Dimensions
1
21
1.3 Max
0.63 Min
3.50 ± 0.26
0.74
9.40 ± 0.25
1.27
0.43 ± 0.10
2.65 ± 0.12
22
10.16 ± 0.13
42
11.18 ± 0.13
27.06
27.43 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.10
CP-42D
–
–
–
28.33
28.90 Max
3.50 ± 0.26
1.15 Max
0.43 ± 0.10
1.27
0.10
2.65 ± 0.13
22
0.74
0.63 Min
1
11.18 ± 0.13
23
10.16 ± 0.13
44
9.40 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-44D
–
–
1.8
179
Package Outline Dimensions
(4) QFJ (PLCC)
Unit: mm
13.39 ± 0.12
12.45
12
11
18
1
7
3
0.74 ± 0.07
2.00 ± 0.20
8
3.40 ± 0.16
7.34
8.18 ± 0.12
16
1.27
0.43 ± 0.10
6.29 ± 0.50
11.35 ± 0.50
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-18
MO-052AB
SC-650
0.56
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-32
MO-052AE
SC-653
0.95
14.99 ± 0.12
13.98
30
32
1
20
4
14
5
13
0.74 ± 0.07
0.43 ± 0.10
1.27
2.00 ± 0.20
21
3.40 ± 0.16
11.44
12.45 ± 0.12
29
10.41 ± 0.50
12.96 ± 0.50
0.10
180
Package Outline Dimensions
17.53 ± 0.12
16.58
39
29
28
17.53 ± 0.12
40
17
7
0.74
2.55 ± 0.15
18
6
4.40 ± 0.20
44
1
1.27
0.43 ± 0.10
15.50 ± 0.50
15.50 ± 0.50
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-44
MO-047AC
SC-643
2.01
20.07 ± 0.12
19.12
46
34
33
7
21
20
8
0.75
0.42 ± 0.10
2.55 ± 0.15
52
1
4.40 ± 0.20
20.07 ± 0.12
47
1.27
18.04 ± 0.50
18.04 ± 0.50
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-52
MO-047AD
SC-644
2.83
181
Package Outline Dimensions
25.15 ± 0.12
24.20
60
44
43
68
1
27
10
26
0.75
2.55 ± 0.15
9
4.40 ± 0.20
25.15 ± 0.12
61
1.27
0.42 ± 0.10
23.12 ± 0.50
23.12 ± 0.50
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-68
MO-047AE
SC-645
4.21
30.23 ± 0.12
29.28
74
54
53
84
1
11
32
12
0.75
0.42 ± 0.10
28.20 ± 0.50
1.27
28.20 ± 0.50
182
2.55 ± 0.15
33
4.40 ± 0.20
30.23 ± 0.12
75
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CP-84
MO-047AF
SC-646
6.35
Package Outline Dimensions
17.57 +0.16
–0.24
16.51 +0.38
–0.22
39
29
+0.16
–0.24
40
28
.89
17.57
44
1
φ8
6
18
7
17
0.73
+0.07
–0.13
1.27
0.18 M
15.75
+0.38
–0.22
2.75 Max
0.46
4.80 Max
1.025
0.89
15.75
+0.38
–0.22
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.15
CC-44
–
–
2.62
25.19 ± 0.12
24.13
+0.52
–0.22
60
44
43
5
27
10
26
0.72 ± 0.10
+0.07
2.60 ± 0.16
9
1.27
0.49 –0.13
0.15
0.18 M
23.37 ± 0.50
0.51 Min
φ 9.6
68
1
4.40 ± 0.28
25.19 ± 0.12
61
0.21 ± 0.10
23.37 ± 0.50
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CC-68
–
–
6.75
183
Package Outline Dimensions
30.23 ± 0.16
+0.52
29.02 –0.22
74
54
53
3
84
1
1.4
φ1
11
33
12
32
0.21 ± 0.10
0.18 M
28.20 ± 0.50
1.27
2.55 ± 0.16
+0.07
4.40 ± 0.28
0.76 ± 0.10
0.46 –0.13
0.51 Min
30.23 ± 0.16
75
28.20 ± 0.50
Hitachi code
JEDEC code
EIAJ code
Weight (g)
184
0.15
CC-84
–
–
10.39
Package Outline Dimensions
(5) SOI
Unit: mm
18.4
19.2 Max
14
1
13
0.15
0.1 +– 0.10
0.80
2.8 3.6
6.4
2.8 ± 0.2
2.7 ± 0.15
8.95 Max
26
0.3
+ 0.10
– 0.05
9.53 ± 0.25
1.20 Max
0.35 ± 0.08
0.16 M
0.10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MP-26DT
–
–
0.98
185
Package Outline Dimensions
(6) Plastic QFI
Unit: mm
0.6 ± 0.2
6.8 ± 0.25
16
12
11
18
1.27 ± 0.25
8.4 ± 0.4
3
7
1.27
± 0.25
8
0.3 Min
2.0 ±0.30
2.54 ± 0.38
1
0.10
0.25 +– 0.05
2.54 ± 0.25
0.4 ± 0.1
0.20
7.62 ± 0.38
7.62 ± 0.38
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MP-18/MP-18T
–
–
0.24
6.8 ± 0.25
16
1.27 ± 0.25
0.6 ± 0.2
8.4 ± 0.4
12
11
18
7
1.27
± 0.25
8
2.0 ± 0.30
3
0.15
0.2 +– 0.20
2.2 ± 0.38
1
+ 0.10
0.25 – 0.05
0.4 ± 0.1
2.54 ± 0.25
0.20
7.62 ± 0.38
7.62 ± 0.38
Hitachi code
JEDEC code
EIAJ code
Weight (g)
186
MP-18A
–
–
0.22
Package Outline Dimensions
10.0 ± 0.25
17
1.27
18
25
0.6 ± 0.2
12.4 ± 0.4
10.8 ± 0.25
28
1
12
4
11
2.0 ± 0.30
0.3 Min
2.54 ± 0.38
1.27
0.10
0.25 +– 0.05
0.4 ± 0.1
2.54 ± 0.25
0.10
11.68 ± 0.38
10.92 ± 0.38
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MP-28
–
–
0.52
12.4 ± 0.4
17
28
1
12
1.27
11
2.0 ± 0.30
2.2 ± 0.38
4
0.15
0.2 +– 0.20
10.0 ± 0.25
1.27
18
25
0.6 ± 0.2
10.8 ± 0.25
+ 0.10
2.54 ± 0.25
0.4 ± 0.1
0.10
11.68 ± 0.38
10.92 ± 0.38
0.25 – 0.05
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MP-28A
–
–
0.50
187
Package Outline Dimensions
18
17
28
1
12
11
0.3 Min
1.27
0.4 ± 0.1
2.0 ± 0.30
4
2.54 ± 0.38
10.0 ± 0.25
25
1.27
12.4 ± 0.4
10.8 ± 0.25
0.75
0.5 ± 0.1
1.395 ± 0.3
11.68 ± 0.38
0.10
0.25 +– 0.05
2.54 ± 0.25
1.65 ± 0.3
0.10
10.92 ± 0.38
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MP-28T
–
–
–
16.0 ± 0.4
14.42 ± 0.25
28
1.016
27
44
1
18
1.016
2.032 ± 0.15
0.4 ± 0.08
1.52 ± 0.3
0.15
15.24 ± 0.3
2.0 ± 0.30
17
6
0.3 Min
2.54 ± 0.38
11.88 ± 0.25
39
0.10
0.25 +– 0.05
2.032 ± 0.15
1.27 ± 0.3
12.7 ± 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
188
MP-44/MP-44T
–
–
0.81
Package Outline Dimensions
10.8 ± 0.25
0.762
29
28
44
1
18
2.2 ± 0.2
7
17
0.762
0.35 ± 0.08
2.0 ± 0.15
6
0.2 ± 0.1
10.0 ± 0.25
39
40
0.10
0.25 +– 0.05
2.03 ± 0.25
1.65 ± 0.25
0.10
10.92 ± 0.25
11.68 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MP-44S
–
–
0.51
14.42 ± 0.25
35
51
56
1
0.762
36
23
7
22
0.762
0.35 ± 0.08
2.0 ± 0.15
8
0.54 ± 0.2
2.54 ± 0.38
11.88 ± 0.25
50
0.10
0.25 +– 0.05
2.286 ± 0.25
1.778 ± 0.25
0.15
12.7 ± 0.25
15.24 ± 0.25
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MP-56S
–
–
0.85
189
Package Outline Dimensions
(7) Ceramic Flat Package
Unit: mm
11
10.0 Max
1.27
2.35 Max
0.43 ± 0.10
12.9 Max
0.13 ± 0.05
10
1
0.95 ± 0.19
28.4 ± 0.3
20
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FG-20D
–
–
0.91
22
12
1
11
0.127
0.229 ± 0.038
0.914
0.762
2.286 Max
13.818 Max
24.994 Max
9.246 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
190
FG-22D
–
–
0.77
Package Outline Dimensions
28.1 Max
9.9 Max
24
7
1.27
12
28.1 Max
19
0.43 ± 0.06
13
18
1.02
0.04
0.13 +– 0.02
2.38 Max
6
1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FG-24
–
–
0.70
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FG-24D
–
–
0.77
9.17 ± 0.23
13
1
12
5.14
+0.22
–0.09
2.29 Max
0.14
+0.03
–0.04
0.23 ± 0.04
+0.12
–0.13
0.762 ± 0.025
1.02
13.60
24.74 Max
+0.32
–0.31
24
191
Package Outline Dimensions
28
15
1
14
0.13 ± 0.03
0.43 ± 0.06
0.95 ± 0.19
1.27
2.0 ± 0.3
10.2 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
12.92
+0.29
–0.09
+0.22
–0.09
5.57 +0.22
–0.29
15
13.60
+0.04
–0.03
0.23 ± 0.04
0.13
0.762 ± 0.025
14
+0.12
1
1.02 –0.13
24.74 Max
28
Hitachi code
JEDEC code
EIAJ code
Weight (g)
192
FG-28D
–
–
1.28
2.29 Max
27.94 Min
17.8 Max
FG-28DA
–
–
–
Package Outline Dimensions
15
1
14
6.605 ± 0.255
28
+0.04
–0.03
2.29 Max
FG-28DB
–
–
–
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FG-32D
–
–
–
6.86 Max
6.35 Min
Hitachi code
JEDEC code
EIAJ code
Weight (g)
17
1
16
11.10 Max
10.80 Min
32
0.64 Max
0.23 ± 0.04
2.29 Max
0.762 ± 0.05
+0.04
–0.03
0.15 ± 0.05
0.13
23.75 Min
16.59 Max
16.13 Min
2.413 ± 0.20
0.13
0.23 ± 0.04
+0.12
–0.13
0.762 ± 0.025
1.02
+0.21
–0.09
10.89
+0.33
–0.31
1.02 ± 0.13
+0.40
–0.41
24.16
16.26
193
Package Outline Dimensions
24.8 ± 0.4
20.0
51
33
32
18.8 ± 0.4
14.0
52
.89
1.0
φ8
64
0.15
0.15 +– 0.05
0.20 M
3.56 Max
19
2.4
0 – 10 °
0.2
1
0.35 ± 0.10
0.41
2.49 +– 0.45
20
1.2 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FG-64B
–
–
2.13
24.8 ± 0.4
20.0
64
41
40
.89
0.8
φ8
80
+ 0.15
– 0.05
0.15 M
2.4
0.15
24
0.41
2.49 +– 0.45
1
0.35 ± 0.10
25
3.56 Max
18.8 ± 0.4
14.0
65
0.2
0 – 10 °
1.2 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
194
FG-80A
–
–
2.17
Package Outline Dimensions
28.13 ± 0.40
24.13
67
99
66
132
34
4.00 Max
33
0.20
0 Min
0.15 M
0.15 – 0.05
1
0.30 ± 0.1
+ 0.15
0.635
28.13 ± 0.4
100
0 – 10 °
0.80
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FG-132
–
–
6.61
195
Package Outline Dimensions
(8) Ceramic QFN
Unit: mm
+ 0.38
7.37 – 0.26
+ 0.31
10.80 – 0.25
3
2.21 Max
Index
8
9
1
20
12
18
13
1.27
0.64
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CG-20
–
–
–
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CG-22A
–
–
0.55
+ 0.30
0.30
7.37 +– 0.25
12.45 – 0.25
3
9
10
1
22
13
20
1.27
196
2.11 Max
Index
14
0.64
Package Outline Dimensions
10.16 ± 0.3
1
8
20
12
7.62 ± 0.3
7
24
13
1.65
2.03
2.25 Max
19
0.64
0.76
1.27
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CG-24
–
–
0.45
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CG-28
–
–
0.61
0.25
11.8 +– 0.2
7.19 Typ
6.35 ± 0.2
0.25
8.6 +– 0.2
0.62 Typ
Index
1.27 Typ
8.89 ± 0.2
2.2 ± 0.25
10.39 Typ
197
Package Outline Dimensions
2.2 Typ
9.45 Max
12.65 Max
1.27 Typ
8.89 ± 0.2
0.68 Typ
6.35 ± 0.2
0.62 Typ
Index
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CG-28A
–
–
0.66
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CG-28B
–
–
0.78
2.20 Typ
9.55 Max
15.35 Max
1.27 Typ
11.43 ± 0.2
198
0.68 Typ
6.35 ± 0.2
0.62 Typ
Index
Package Outline Dimensions
2.35 Max
12.19 ± 0.3
6
15
5
16
1
40
36
25
26
35
1.016
0.51
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CG-40
–
–
0.8
29.21 ± 0.38
4.03 Max
φd
12
32
33
0.635
11
1
84
75
53
54
74
2.16
Hitachi code φd
CG-84
8.89
CG-84A
10.16
1.27
1.27
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CG-84, CG-84A
–
–
8.96
199
Package Outline Dimensions
2.2 Transistor Packages
2.2.1 Pin Insertion Packages
Unit: mm
5.0 Max
1.5
0.3
20.1 Max
14.9 ± 0.2
2.0
0.5
1.0
16.0 Max
5.0 ± 0.3
φ 3.2 ± 0.2
1.6
1.4 Max
2.8
18.0 ± 0.5
2.0
1.0 ± 0.2
3.6
0.6 ± 0.2
0.9
1.0
5.45 ± 0.5
5.45 ± 0.5
TO-3P
200
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TO-3P
–
SC-65
5.0
Package Outline Dimensions
0.4
φ 3.2 +– 0.2
5.8 Max
5.0
2.7
19.9 ± 0.3
5.0 ± 0.3
16.0 Max
4.0
1.6
1.4 Max
3.2
1.4 Max
1.0 ± 0.2
5.45 ± 0.5
21.0 ± 0.5
2.6
0.6 ± 0.2
5.45 ± 0.5
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TO-3PFM
–
–
5.6
201
Package Outline Dimensions
2.2 Max
3.2 Max
0.6
1.8 Max
4.2 Max
14.5 Min
0.6 Max
0.45 ± 0.1
0.4 ± 0.1
SPAK
Hitachi code
JEDEC code
EIAJ code
Weight (g)
1.27 1.27
2.54
SPAK
–
–
0.10
4.2 Max
0.60 Max
0.55 Max
0.7
2.3 Max
12.7 Min
5.2 Max
5.2 Max
1.27
2.54
202
0.5 Max
TO-92
SCALE : 2/1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TO-92(1)
TO-92
SC-43A
0.25
Package Outline Dimensions
4.2 Max
0.55 Max
0.5 Max
0.7
2.3 Max
12.7 Min
5.2 Max
5.2 Max
0.5 Max
1.27
2.54
TO-92
SCALE : 2/1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TO-92(2)
TO-92
SC-43A
0.25
4.2 Max
5.2 Max
0.70 Max
0.75 Max
0.60 Max
0.55 Max
0.7
2.3 Max
10.1 Min
8.5 Max
TO-92 (2)
0.5 Max
TO-92MOD
1.27
2.54
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TO-92Mod.
–
SC-51
0.35
203
φ 3.2 +0.15
–0.1
8.0 ± 0.4
6.0
3.2 ± 0.4
1.9 Max
11.0 ± 0.5
3.5
1.0
Package Outline Dimensions
15.6 ± 0.5
1.7
0.7
0.65
2.29 ± 0.5
φ 3.1 +0.15
–0.1
TO-126FM
–
–
0.87
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TO-126Mod
–
–
0.67
3.1 Max
120°
3.7 ± 0.7
11.0 ± 0.5
12
0°
2.3 ± 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
12
0°
8.5 Max
120°
2.29 ± 0.5
15.6 ± 0.5
1.1
0.75
2.29 ± 0.5
2.29 ± 0.5
0.5
1.2
204
TO-126MOD
Package Outline Dimensions
0.1
φ 3.6 +– 0.08
15.3 Max
12.7 Min
18.5 ± 0.5
1.5 Max
7.8 ± 0.5
4.8 Max
1.5 Max
6.3 Min
3.0 Max
1.27
11.5 Max
9.8 Max
7.6 Min
0.5 Typ
0.76 ± 0.1
2.54 ± 0.5
5.1 ± 0.5
φ 3.2 ± 0.2
TO-220AB
TO-220AB
SC-46
1.8
Hitachi code
JEDEC code
EIAJ code
Weight (g)
TO-220FM
–
SC-67
1.8
17.0 ± 0.3
4.45 ± 0.3
0.7 ± 0.1
14.0 ± 1.0
2.54 ± 0.5
2.0 ± 0.3
5.0 ± 0.3 12.0 ± 0.3
1.2 ± 0.2
1.4 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
2.8 ± 0.2
2.52 ± 0.2
0.6
10.0 ± 0.3
7.0 ± 0.3
2.7 Max
2.54 ± 0.5
0.5 ± 0.1
2.7
205
Package Outline Dimensions
18.6 Max
4.1 Max
24.5 Max
φ 3.3 Max
32.0 ± 0.2
40.2 Max
24.7 Max
11.5 ± 0.2
10.3 ± 0.2
RFPAK-B
206
RFPAK-A
–
–
5.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
RFPAK-B
–
–
12.8
10.6 Max
3.4 Max
5.2 Min
4.1 Max 4.1 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
2.7 Max
2.1 Max
5.2 Min
2.7 Max
4.4 Max
2.2 Max
5.1 Max 5.7 Max 5.1 Max
24.8 Max
φ 12.8 Max
Package Outline Dimensions
2.2.2 Surface Mount Packages
0.1
0.3 +– 0.05
0.65
0.2
1.3 ± 0.2
0.9 ± 0.1
0.1
0.3 +– 0.05
0.65
+ 0.1
0.16 – 0.06
0 - 0.1
0.425
1.25 ± 0.1
0.1
0.3 +– 0.05
2.1 ± 0.3
2.0 ± 0.2
0.425
Unit: mm
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CMPAK
–
SC-70
0.006
2.0 ± 0.2
0.1
0.3 +– 0.05
0.2
0.65 0.6
1.25 ± 0.2
0.9 ± 0.1
0.1
0.4 +– 0.05
+ 0.1
0.16– 0.06
2.1 ± 0.3
0.1
0.3 +– 0.05
0 - 0.1
0.1
0.4 +– 0.05
0.65 0.65
0.1
0.3 +– 0.05
0.1
1.25 ± 0.2 0.4 +– 0.05
1.3 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CMPAK-4
–
–
0.006
207
0.95
0.95
1.9
+ 0.2
– 0.6
2.8
0 – 0.15
1.1 – 0.1
+ 0.2
0.3
0.3
2.8 +– 0.1
+ 0.10
0.16 – 0.06
0.1
0.65 +– 0.3
1.5
0.65 – 0.3
+ 0.10
0.4 – 0.05
+ 0.1
Package Outline Dimensions
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MPAK(2)
–
SC-59A
0.011
0.3
2.8 +– 0.1
0.65 – 0.3
0.1
0.4 +– 0.05
0.1
0.6 +– 0.05
0.95
0.85
1.1 – 0.1
+ 0.2
0.3
1.8
0 – 0.1
0.1
0.65 +– 0.3
0.1
0.4 +– 0.05
+ 0.1
0.16 – 0.06
0.2
2.8 +– 0.6
+ 0.1
– 0.05
1.5
0.4
+ 0.1
1.9
0.95 0.95
208
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MPAK-4
–
SC-61AA
0.013
Package Outline Dimensions
4.5 ± 0.1
(1.4)
UPAK
–
SC-62
0.050
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LDPAK(L)
–
–
1.4
4.44 ± 0.2
1.3 ± 0.2
2.54 ± 0.5
11.0 ± 0.5
2.59 ± 0.2
0.2
0.86 +– 0.1
0.76 ± 0.1
2.54 ± 0.5
Hitachi code
JEDEC code
EIAJ code
Weight (g)
11.3 ± 0.5
(1.5)
10.2 ± 0.3
8.6 ± 0.3
0.3
10.0 +– 0.5
1.5 1.5
3.0
(0.2)
(2.5)
0.44 Max
0.8 Min
0.53 Max
0.48 Max
(1.6)
(0.4)
φ1
1.27 ± 0.2
1.2 ± 0.2
1.5 ± 0.1
0.44 Max
2.5 ± 0.1
4.25 Max
0.4
1.8 Max
0.4 ± 0.1
209
2.54 ± 0.5
1.15 ± 0.1
0.8 ± 0.1
2.29 ± 0.5
1.5 – 2.4
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LDPAK(S)
–
–
1.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DPAK(L)
–
SC-64
0.42
2.3 ± 0.5
7.2
0.5 ± 0.1
2.29 ± 0.5
0.55 ± 0.1
210
7.8
16.2 ± 0.5
3.1 ± 0.5 5.5 ± 0.5
6.5 ± 0.5
5.4 ± 0.5
0.4 ± 0.1
0.3
3.0 +– 0.5
2.54 ± 0.5
1.7 ± 0.5
0.2
0.86 +– 0.1
2.35
2.59 ± 0.2
0.8
0.2
0.1 +– 0.1
9.2 – 10.3
7.2 – 8.2
6.0 – 7.4
(1.5)
(1.4)
8.6 ± 0.3
1.3 ± 0.2
1.27 ± 0.2
1.2 ± 0.2
10.2
7.6
6.6
4.44 ± 0.2
0.3
10.0 +– 0.5
10.2 ± 0.3
(1.5)
Package Outline Dimensions
1.5 Max
1.7 ± 0.5
Package Outline Dimensions
2.3 ± 0.2
6.5 ± 0.5
5.4 ± 0.5
5.5 ± 0.5
0.55 ± 0.1
1.2 Typ
3.1 ± 0.5
1.15 ± 0.1
4.7 ± 0.5
16.2 ± 0.5
0.8 ± 0.1
2.29 ± 0.5
2.29 ± 0.5
0.55 ± 0.1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
0.55 ± 0.1
(5.3)
2.29 ± 0.5
2.29 ± 0.5
0 - 0.25
(1.9)
0.8 ± 0.1
1.15 ± 0.1
(4.9)
9.5
5.5 ± 0.5
2.3 ± 0.5
0.5 ± 0.1
2.5 ± 0.5
1.2 Max
6.5 ± 0.5
5.4 ± 0.5
1.7 ± 0.5
0.55 ± 0.1
DPAK-2(L)
–
–
0.42
0.55 ± 0.1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
DPAK(S)
–
SC-63
0.28
211
4.0 Min
Package Outline Dimensions
4.0 Min
1.15
4.0 Min
φ 1.0
2.0 Max
10.0 Min
0.5
0.2
4.2 Max
1.8 Max
0.65
0.05
0.6
0.85
Hitachi code
JEDEC code
EIAJ code
Weight (g)
212
FPAK
–
–
0.07
0.8 ± 0.1
3.0 Min 1.7 ± 0.2 3.0 Min
4-R 0.13
+ 0.1
0.16 – 0.06
0.5 ± 0.1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
µFPAK(L)
–
–
0.019
Hitachi code
JEDEC code
EIAJ code
Weight (g)
µFPAK(S)
–
–
0.013
1.7 ± 0.2
1.4 ± 0.2
0.5 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
1.4 ± 0.2
0 – 0.15
1.1 ± 0.15
(0.8)
+0.1
–0.08
0.5 ± 0.1
0.16
1.4 ± 0.2
2.5 ± 0.2
1.4 ± 0.2
1.1 ±0.15
3.0 Min 2.5 ± 0.2
(0.8)
3.0 Min
Package Outline Dimensions
(0.15)
(0.15)
µ FPAK(S)
213
Package Outline Dimensions
1.8 ± 0.4
4 Min
1 ± 0.2
1 ± 0.2
0.5 ± 0.15
0.5 ± 0.15
4 Min
1.8 ± 0.4
4 Min
4 Min
+ 0.1
1.15 ± 0.3
0.1 – 0.05
φ 1.8 ± 0.4
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CFPAK(L)
–
–
0.026
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CFPAK(S)
–
–
0.015
4.0 ± 0.2
4.0 ± 0.2
1 ± 0.2
1 ± 0.2
0.5 ± 0.15
+0.1
φ 1.8 ± 0.4
0.1 –0.05
1.15 ± 0.3
1.8 ± 0.4
0.5 ± 0.15
214
Package Outline Dimensions
4.8 ± 0.2
1.5 ± 0.2
15.0
1.6 ± 0.2
2.0 ± 0.2
1.2 ± 0.2
1.2 ± 0.2
2.8 ± 0.2
18.0 ± 0.5
13.5 ± 0.3
4
15.7 ± 0.3
(1.5)
13.6
+0.3
–0.5
(2.0)
15.6 ± 0.3
1.0 ± 0.2
1
2
3
5.45 ± 0.5
5.45 ± 0.5
0.6 ± 0.2
7.4 ±0.2
1.0 ± 0.2
1.0 ± 0.2
3.6 ± 0.2
Hitachi code HDPAK(L)
JEDEC code –
EIAJ code
–
Weight (g)
4.8 ± 0.2
3
+0.3
(1.5)
1.5 ± 0.2
0.3
2
11.3 ± 0.3
1
1.5 ± 0.3
4
13.5 ± 0.3
13.6
15.0 –0.5
(2.0)
15.6 ± 0.3
2.8 ± 0.2
+0.3
2.0 ± 0.2
1.2 ± 0.2
1.2 ± 0.2
1.0 ± 0.2
5.45 ± 0.5
5.45 ± 0.5
0.6 ± 0.2
0.2 Min
1.6 ± 0.2
4.5 ± 0.5
0.1 –0.5
7.4 ±0.2
1.0 ± 0.2
1.0 ± 0.2
3.6 ± 0.2
Hitachi code HDPAK(S)
JEDEC code –
EIAJ code
–
Weight (g)
215
Package Outline Dimensions
2.3 Diode Packages
Unit: mm
4.2 Max
26.0 Min
φ 0.5
φ 2.0
Max
26.0 Min
2.4 Max
DO-35
DO-35
SC-48
132.7 - 135.5
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
MHD
DO-34
–
83.4 - 85.7
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
UMD
–
–
74.6 - 75.0
26.0 Min
φ 0.4
φ 2.0
Max
26.0 Min
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
2.6 Max
26.0 Min
φ 0.4
φ 1.6
Max
26.0 Min
216
Package Outline Dimensions
5.0 Max
26.0 Min
φ 0.8
φ 3.0
Max
26.0 Min
3.5 Max
DO-41
DO-41
SC-47
375.8 – 377.1
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
DO-41 Mod.
–
–
166.6
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
LLD
–
–
24.1 – 29.4
26.0 Min
φ 0.5
φ 2.5
Max
26.0 Min
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
φ 1.35 ± 0.1
3.5
+0.1
–0.2
(0.3)
217
1.0
0.3
Package Outline Dimensions
1.0
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
ERP
–
–
2.0 – 2.1
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
SRP
–
–
10.4 – 10.6
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
URP
–
–
4.5 – 4.8
0.6 ± 0.2
1.6 ± 0.2
0 ± 0.1
0.6
3.5 ± 0.15
218
1.25 ± 0.15
0.9 ± 0.15
0 ± 0.05
1.7 ± 0.15
2.5 ± 0.15
0.3 ± 0.15
0 ± 0.05
1.1 ± 0.2
2.65 ± 0.2
3.80 ± 0.2
2.8 +0.3
–0.6
1.5
0.65 +0.2
–0.3
SSP
–
–
2.1
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
MOP
–
–
19.8
0.4 –0.05
+0.10
(1.27)
0.16 +0.10
–0.06
0.45
(1.27)
0 - 0.1
0.8
1.1 +0.2
-0.1
(4.71)
(1.27)
0.65 +0.2
–0.3
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
0 - 0.2
0 ± 0.05
2.1 ± 0.10
0.7 ± 0.15
1.3 ± 0.10
0.3 ± 0.05
0.8 ± 0.10
Package Outline Dimensions
219
1.5 ± 0.2
2.5 ± 0.3
0.2
2.0 ± 0.3
Package Outline Dimensions
4.5 ± 0.2
5.0 ± 0.3
1.2 ± 0.3
1.2 ± 0.3
9.5 Max
LRP
–
–
58
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
DO-201AD
–
–
1121.4
25.4 Min
φ 1.32
φ 5.3
Max
25.4 Min
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
220
Package Outline Dimensions
4.8 ± 0.3
0.8
9.0 ± 0.5
3.2
1.0
12.7 Min
1.5
15.2 Min
11.2 ± 0.5
14.7 ± 0.5
2.4 ± 0.3
φ 0.8
0.65 – 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
MPAK(1)
–
SC-59A
11
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
CMPAK
–
SC-59A
11
+ 0.10
0 – 0.15
2.8
1.5
0.95
1.9
0.2
1.3 ± 0.2
0.9 ± 0.1
0.1
0.3 +– 0.05
0.65
+ 0.1
0.16 – 0.06
0 - 0.1
0.425
1.25 ± 0.1
0.1
0.3 +– 0.05
2.1 ± 0.3
2.0 ± 0.2
0.425
+ 0.2
1.1 – 0.1
0.3
0.3
2.8 +– 0.1
0.1
0.3 +– 0.05
0.65
SIP
–
–
1764.3 – 1773.2
0.1
0.65 +– 0.3
0.95
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
0.16 – 0.06
+ 0.2
– 0.6
+ 0.1
+ 0.1
3.8 3.8 3.8
0.4 – 0.05
2.4 ± 0.3
221
Package Outline Dimensions
6.35 ± 0.13
7.62
8.51 Max
1.65
3.18
2.0
5.08 ± 0.13
2.5
0.25 ± 0.05
1.2 ± 0.1
0.51 ± 0.1
8.26 ± 0.64
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
DIP-M
–
–
409.7 – 413.3
Hitachi code
JEDEC code
EIAJ code
Weight (mg)
DIP-S
–
–
394.8 – 402.9
6.35 ± 0.13
7.62
8.51 Max
1.65
222
11.2 Max
0.2 ± 0.13
1.2 ± 0.1
0.25 ± 0.05
3.18
5.08 ±0.13
Package Outline Dimensions
2.4 Optodevice Packages
2.4.1 Laser Diode Packages
Unit: mm
1
1
Po
Pm
Po
Pm
2
2
Pm
Po
2.0 ± 2.0 ±
0.15 0.15
5.0 ± 0.2
2 - φ 2.3 ± 0.2
3.0 ± 0.2
3.0 ± 0.2
6.0 ± 0.2
6.0 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
3.0 ± 0.2
2 - φ 2.3 ± 0.2
11.2 ± 0.2
12.4 ± 0.3
5.0 ± 0.2
3.0 ± 0.2
11.2 ± 0.2
12.4 ± 0.3
(1.0)
2.0 ± 2.0 ±
0.15 0.15
Pm
(1.0)
Po
1
6.0 ± 0.3
1.0 ± 0.2
6.0 ± 0.3
1.0 ± 0.2
0.1 ± 0.05
2.0 ± 0.15
1
2
0.1 ± 0.05
2.0 ± 0.15
2
LD/A1
–
–
1.0
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LD/A2
–
–
1.0
223
1
Po
1.0 ± 0.2
φ 1.1± 0.1 2
Pm
2.4 ± 0.15
Pm
1.8 ± 0.15
1
0.8
± 0.3
0.9 ±0.15
2.0 ± 0.1
0.8
± 0.3
2
6.0 ± 0.3
Package Outline Dimensions
Po
3.0 ± 0.3
Emittng Point
6.0 ± 0.25
(2.45)
Emitting
Point
1.55 ± 0.2
1.75 ± 0.15
1.05 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LD/AC
–
–
0.15
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LD/E
–
–
1.1
16.0 ± 0.15
8.0 ± 0.2
11.0 ± 0.15
3.5 ± 0.2
3.4 ± 0.2
Emitting Point
Glass
R0.8
3 - φ 0.45 ± 0.1
14.0 ± 1.0
1.2 ± 0.1
φ 5.35 ± 0.15
φ 4.73 ± 0.1
φ 2.1
0.3
φ 2.8 ± 0.1
3.35 ± 0.2
7.0 ± 0.15
Emitting Point
1 2 3
φ 2.54 ± 0.25
(φ1.05)
2
1
224
3
φ 9.0 +0
–0.025
1.0 ± 0.1
(0.65)
1
2
9±1
2.45
Emitting Point
3 – φ 0.45 ± 0.1
1
3
2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
2
3
3
1
3
1
Glass
0.3
3 – φ 0.45 ± 0.1
1.5 ± 0.1
14 ± 1
2.45
Emitting Point
φ 7.2 +0.3
–0.2
φ 6.2 ± 0.2
(φ 2.0)
3.5 ± 0.2
Glass
φ 7.2 +0.3
–0.2
φ 6.2 ± 0.2
(φ 2.0)
3.5 ± 0.2
0.3
(90°)
(90°)
(0.65)
φ 2.54 ± 0.35
LD/G1
–
–
1.1
1.5 ± 0.1
φ 9.0 +0
–0.025
1.0 ± 0.1
0.4 +0.1
–0
0.4 +0.1
–0
Package Outline Dimensions
2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
φ 2.54 ± 0.35
LD/G2
–
–
1.1
225
Package
Outline Dimensions
P-LD-FG.MF
2
4
LD
PD
Po
Glass
window
3
φ 5.6 +0
–0.03
φ 4.8 ± 0.2
φ 4.2 ± 0.2
φ 5.6 +0
–0.025
0.4 +0.1
–0
(0.3)
1
(1.0)
(0.3)
1.0 ± 0.1
(90°)
φ 4.1 ± 0.3
φ 3.55 ± 0.1
Glass
R0.15 Max
0.25
(2.7)
2.0 Min
2.3 ± 0.2
φ 1.6 ± 0.2
0.25 ± 0.03
2.3 ± 0.3
110°
(0.4)
6.5 ± 1.0
1.2 ± 0.1
3 4 1
(2)
1.27
(1.27)
20 ± 1
1.2 ± 0.1
Emitting Point
3 – φ 0.45 ± 0.1
1
2
3
4
3
2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
226
1
1
φ 2.0 ± 0.2
LD/MF
–
–
0.5
3
2
φ 2.0 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LD/MG
–
–
0.5
Package Outline Dimensions
8
9
10
11
12
13
14
–
SMF
T. E. C
LD Th
PD
+
6
5
4
3
2
1
LD: Laser diode
PD: Photodiode
Th: Thermistor
2
3
4
5
6
8
9
10
11
12
13
14
PD anode
LD cathode
LD anode (case)
Thermistor
Thermistor
N. C.
T. E. C. cathode
30.0 ± 0.15
26.0 ± 0.2
20.8 ± 0.15
12.5 ± 0.15
7
T.E.C. anode
N. C.
N. C.
N. C.
Case
N. C.
PD cathode
500 Min
1
9.0 ± 0.2
7
(14.75)
4 – φ 2.4 ± 0.15
2.54 ± 0.2
8
2.78 ± 0.3
(15.24)
25.0 Max
φ 3.0
1.5 ± 0.15
9.0 ± 0.3
14 – 0.46 ± 0.1
14
14 – 0.3 ± 0.07
1
T. E. C.: T. E. cooler
SMF: Single-mode fiber
6.0 ± 0.15
7
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LD/BF
–
–
15.0
227
Package Outline Dimensions
2
1
LD
2
3
5.2 ± 0.3
0.1 +0.1
–0
4
5.6
1
6.5
φ 2.0 ± 0.2
0.5
± 0.2
φ 0.9
4
4 – φ 0.45 ± 0.1
3
PD
(20)
(6.8)*
500 Min
1.2 ± 0.1
(20 Max)
* HL1325CF : (6.8)
HL1324CF : (10.2)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
228
LD/CF
–
–
3.8
Package Outline Dimensions
8
9
10
11
12
13
14
–
SMF
T. E. C
LD Th
PD
+
3
2
1
LD: Laser diode
PD: Photodiode
Th: Thermistor
T. E. C.: T. E. cooler
SMF: Single-mode fiber
T.E.C. anode
—
—
—
Case
N. C.
PD cathode
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PD anode
LD cathode
LD anode (case)
Thermistor
Thermistor
—
T. E. C. cathode
21.8 ± 0.3
25.4 ± 0.2
19.1 ± 0.2
12.5 ± 0.15
500 Min
1.0 ± 0.2
2.54 ± 0.2
3.81 ± 0.3
6.25 ± 0.5
(1)
25 Max
(15.24)
8
14
7
1
4 – R1
φ3
11.8 ± 0.3
4
10.2 ± 0.3
5
6.0 ± 0.35
6
7.7 ± 0.15
7
2 – φ 3.2 ± 0.15
10 – φ 0.45 ± 0.07
7.62 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LD/DL
–
–
13.4
229
Package Outline Dimensions
3
8 9 10 11 12 13 14
4
5
6
7
8
9
10
7 6 5 4 3 2 1
11
12
13
14
1.3 ± 0.1
20.32 ± 0.1
6.0 ± 0.5
2.54 ± 0.2
(15.24)
3.81 ± 0.3
500 Min
25 Max
8
14
7
1
N. C.
N. C.
N. C.
N. C.
Case
N. C.
PD cathode
PD anode
LD cathode
LD anode (case)
N. C.
N. C.
N. C.
N. C.
23.0 ± 0.15
19.1± 0.15
12.7 ± 0.15
14 – φ 0.45 ± 0.07
7.62 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
230
5.1 ± 0.15
2
2.5 ± 0.15
1
LD/DM
–
–
10.0
Package Outline Dimensions
2
3
LD
PD
4
1
5.6
2
6.5
3
14 ± 1
φ 0.9
0.5
± 0.2
5.2 ± 0.3
0.1 +0.1
–0
φ 2.0 ± 0.2
4 – φ 0.45 ± 0.1
4
1
(6.8)*
500 Min
1.2 ± 0.1
(20 Max)
* HL1326/1352 : (10.2)
HL1327 : (6.8)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
CN
–
–
–
231
Package Outline Dimensions
2.4.2 IRED Packages
1
2
2
φ 5.4 ± 0.2
1.
0
±
0.
2
φ 4.65 ± 0.2
φ 4.0 ±0.2
1.
± 5°
0
±
0.
14 ± 2
45°
0.5 ± 0.2
2
1.15 ± 0.15
(0.3)
2 – φ 0.45 ± 0.1
φ 5.4 ± 0.2
φ 4.2 ± 0.2
( φ 0.6)*
1
±
0.
0
1.
14 ± 2
(2 – φ 1.05)
2
0
±
2
0.
0.35 ± 0.1
2
2.54 ± 0.35
1.
2 – φ 0.45 ± 0.1
2.54 ± 0.35
1
2
* HE8403R : ( φ 0.4)
HLP20R, HLP30R, HLP40R : ( φ 0.6)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
232
IR/R
–
–
–
4.6 ± 0.2
1
0.7 ± 0.25
Unit: mm
45°
±5
°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
IR/RG
–
–
–
1
1
2
2
φ 5.4 ± 0.2
φ 4.65 ± 0.2
φ 4.0 ± 0.2
1
1
2
0
1.
2
2.54 ± 0.35
(2 – φ 1.05)
2
0.
14 ± 2
2 – φ 0.45 ± 0.1
2.54 ± 0.35
±
0.4 ± 0.2
1.2 ± 0.15
2 – φ 0.45 ± 0.1
14 ± 2
0.55 ± 0.2
2.7 ± 0.2
2.6 ± 0.2
0.65 ± 0.2
φ 5.4 ± 0.2
φ 4.65 ± 0.2
φ 4.0 ± 0.2
0.65 ± 0.2
Package Outline Dimensions
2
0
1.
±
0.
1.
0
0
1.
±
±
0.
2
2
0.
45°
45°
±5
°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
IR/SG
–
–
–
±5
°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
IR/VG
–
–
–
233
Package Outline Dimensions
1
1
3
2
1
3.85 ± 0.2
2
1
1.
0.
±
0
0.
0
±
1.
0
2
(2 – φ 1.05)
0.
1.
0
3
2.54 ± 0.35
2
1.
2
2.54 ± 0.35
±
2
2
0.
45°
45°
±5
± 5°
°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
234
14 ± 2
3 – φ 0.45 ± 0.1
2.54 ± 0.35
±
0.55 ± 0.2
2 – φ 0.45 ± 0.1
14 ± 2
0.55 ± 0.2
3.85 ± 0.2
φ 4.7 ± 0.2
φ 5.4 ± 0.2
φ 4.7 ± 0.2
( φ 1.3)
(0.65)
φ 5.4 ± 0.2
(0.7)
2
IR/ML1
–
–
–
Hitachi code
JEDEC code
EIAJ code
Weight (g)
IR/ML3
–
–
–
1
1
2
2
2 – φ 0.45 ± 0.1
1
0.55 ± 0.2
3.55 ± 0.2
14 ± 2
14 ± 2
(5.45)
φ 4.65 ± 0.2
( φ 4.0)
3.75 ± 0.2
φ 5.4 ± 0.2
φ 4.65 ± 0.2
0.55 ± 0.2
φ 5.4 ± 0.2
2 – φ 0.45 ± 0.1
1
2
(2 – φ 1.05)
1.
1.
0
0
±
±
0.
2
(2 – φ 1.05)
2
2
2.54
2.54 ± 0.35
0.
(6.52)
Package Outline Dimensions
0
0
1.
1.
±
±
2
2
0.
0.
45°
45°±
±5
°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
IR/SL
–
–
–
5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
IR/CL
–
–
–
235
Package Outline Dimensions
1
2
φ 5.4 ± 0.2
1
2
1.
0
±
0.
2
2.54 ± 0.35
0
1.
±
2
0.
±5
°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
236
6.0 ± 0.3
14 ± 2
(0.4)
2 – φ 0.45
45°
4.5 ± 0.2
φ 4.65 ± 0.1
IR/FL
–
–
–
Package Outline Dimensions
2.4.3 Photo Diode Packages
Unit: mm
1
1
2
(1.0)
0.5 ± 0.3
2.0 ± 0.25
0.3 ± 0.3
(30°)
2
0.5 ± 0.3
2.54 ± 0.3
2.0 ± 0.25
4.0 ± 0.25
(2.0)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PD/CX
–
–
–
3 – φ 0.45 ± 0.1
1
3
φ 2.54 ± 0.35
1
3
2
3
1
6.7 ± 2
16.5 ± 2
(14)
23.5 ± 2
φ 6.5 ± 0.5
1.
2
0
0.
2
±
±
5°
0
0.
45°±
1.
2
2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
900 Min
PD/CR
–
–
3.8
237
Package Outline Dimensions
1
2.54 ± 0.2
2
0.8 ± 0.3
13.5 ± 1.0
500 Min
10.2 ± 0.2
13 ± 0.3
1.5 ± 0.3
5.2 ± 0.2
4 - 0.46 ± 0.1
7 ± 0.2
6 ± 1.0
3.55 ± 0.3
0.1 ± 0.07
1
0.45 ± 0.1
2
5.08 ± 0.2
5.08 ± 0.2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
238
PD/FR
–
–
–
Package Outline Dimensions
1
1
2
2
0.3
0.5
φ 5.4 ± 0.2
φ4.65 ± 0.2
φ 3.0 ± 0.2
1
2.6 ± 0.2
0.4
2- φ 0.45 ± 0.1
2
1
3
14 ±2
2 – φ 0.43 ± 0.1
13 ± 2
(0.4)
2.6 ± 0.2
(1.2)
φ 5.4 ± 0.2
φ 4.65 ± 0.2
φ 3.0 ± 0.2
(0.3)
3
2
1.
0
±
1.
0
0.
2
±
0.
2
2.54 ± 0.35
0
1.
±
0
0.
1.
φ 2.54 ± 0.35
2
±
2
0.
45°
45°
±5
±5
°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PD/QG
–
–
–
°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PD/TG1
–
–
–
239
Package Outline Dimensions
1
1
3
3
2
φ 4.35 ± 0.3
φ 3.66 ± 0.1
φ1.3 ± 0.1
2
3
3.0 ± 0.2
14 ± 2.0
1.2 ± 0.1
3- φ 0.45 ± 0.1
14 ±2
(0.4)
(0.6)
2.9 ± 0.2
(0.3)
φ 5.4 ± 0.2
φ4.73 ± 0.2
φ 2.0 ± 0.2
(0.7)
2
3 – φ 0.45 ± 0.1
1
3
1
1.
0
±
0.
2
2
φ 2.0 ± 0.2
±
2
0.
(90°)
0
1.
φ 2.54 ± 0.35
(0.4)
45°
±5
Hitachi code
JEDEC code
EIAJ code
Weight (g)
240
φ 5.6 ± 0.1
°
PD/TG2
–
–
–
Hitachi code
JEDEC code
EIAJ code
Weight (g)
PD/MR
–
–
–
Package Outline Dimensions
1
3
φ 3.55 ± 0.1
14 ± 2.0
1.2 ± 0.1
(0.65)
φ1.6 ± 0.2
2.3 ± 0.2
2
3 – φ 0.45 ± 0.1
2
3
1
(90°)
φ 2.0 ± 0.2
(0.4)
φ 5.6 ± 0.1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
MH
–
–
–
241
Package Outline Dimensions
2.5 Module and Array Packages
2.5.1 Modules
Unit: mm
53.3 ± 0.3
(48.5)
4.4 ± 0.15
(0.25)
(4.0)
(6.75)
3.0 ± 0.3
9.0
+0.8
–0.2
0.5 +0.3
–0.2
1 2 3
4
5
6
(8.0) (8.3)
(3.15)
(4.3)(3.5)
(4.3)
5±1
(2–R2)
4.0 ± 0.2
3.0 ± 0.15
2– φ 2.5 ± 0.15
6.5 ± 0.15
10.1 ± 0.5
17.0 ± 0.2
38.3 ± 0.3
20.2 ± 0.3
47.3 ± 0.2
3.0 ± 0.15
Hitachi code
JEDEC code
EIAJ code
Weight (g)
242
RF-A
–
–
30
Package Outline Dimensions
(R1.6)
5±1
11.0 ± 0.3
14.0 ± 0.5
60.5 ± 0.5
57.5 ± 0.5
1
2
+0.3
3
4
2.3 ± 0.2
50.2 ± 0.5
(0.25)
6.0 +0.8
–0.4
0.5 –0.2
9.2 ± 1
8.0 ± 1
13.0 ± 1
22.0 ± 1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
RF-B
–
–
18
Hitachi code
JEDEC code
EIAJ code
Weight (g)
RF-B1
–
–
18
(R1.6)
(5±1)
11.0±0.3
14.0±0.5
60.5±0.5
57.5±0.5
1
2
+0.3
3
4
50.2±0.5
(0.25)
2.3±0.2
6.0 +0.8
–0.4
0.5 –0.2
9.2±1
22.5±1
8.0±1
12.5±1
243
60.5 ± 0.5
57.5 ± 0.5
2
+ 0.3
3
4
5±1
1
(R1.6)
2.3 ± 0.2
13.0 ± 1
(3.3)
49.8 ± 0.5
(0.25)
0.6
5.0 +– 0.3
0.5 – 0.2
6.35 ± 0.5
11.0 ± 0.3
12.7 ± 0.5
Package Outline Dimensions
9.2 ± 1
8.0 ± 1
60.5 ± 0.5
57.5 ± 0.5
2
3
4
RF-B3
–
–
16
9.2 ± 1
8.0 ± 1
12.5 ±1
244
Hitachi code
JEDEC code
EIAJ code
Weight (g)
(3.3)
49.8 ± 0.5
22.5 ± 1
RF-B2
–
–
16
(R1.6)
5±1
0.3
0.5 +– 0.2
(0.25)
2.3 ± 0.2
0.6
5.0 +– 0.3
1
Hitachi code
JEDEC code
EIAJ code
Weight (g)
6.35 ± 0.5
11.0 ± 0.3
12.7 ± 0.5
22.0 ±1
Package Outline Dimensions
45 ± 0.5
8 Min
5
10 ± 0.5
(R1.6)
0.5 +0.3
–0.2
3
5 9.74 ± 1
17.36 ± 1
19.90 ± 1
32.60 ± 1
37.68 ± 1
2
4
+0.8
(3.3)
1
6.5 –0.5
Hitachi code
JEDEC code
EIAJ code
Weight (g)
(0.25)
2.3 ± 0.3
RF-C
–
–
11
25 ± 0.5
(5.8)
(8.8)
(2.4)
3
4
(0.3)
3.7 ± 0.5
(1.8)
2
(5.1) (7.6) (5.1)
0.5
+0.3
–0.2
(0.3)
(5 – 3.0)
1
12 ± 0.5
(1.5)
22 ± 0.5
2.35 ± 0.5
(1.5)
(1.5)
12 ± 0.5
(42)
35 ± 0.5
(0.25)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
RF-E
–
–
3
245
Package Outline Dimensions
8 Min
12 ± 0.5
35 ± 0.5
0.5 +0.3
–0.2
1
2
4
3
5
(2.6)
(5.14)
(12.76)
4.8 Max
(0.25)
1 Max
(15.18)
(2.2)
(10.1)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
RF-F
–
–
7
37 ± 0.5
G
G
1
2
3 4
2.35 ± 0.5
3 4
5
(2.6)
(5.14)
(10.1)
(15.18)
(12.76)
5
+0.3
0.5 –0.2
3.8 ± 0.5
2
(0.3)
1
11.4 ± 0.5
G
(10.2)
G
(7.2)
G
(2.0)
246
(1.5)
34 ± 0.5
G
(4–3.0)
(2–2.0)
(1.5)
(0.25)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
RF-G
–
–
4
Package Outline Dimensions
3- φ 6.6 ± 0.2
(7)
(7)
54 ± 0.5
54 ± 0.5
φ 13.2 –0
+0.5
4-M5 Screw
D1
S2
G2
S2
S1
(18)
(27)
33 Max
D2
S1
G1
(24)
(20)
(34)
(20)
(16)
(8)
32 Max
(7)
(2.8)
123 Max
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LF-C
–
–
330
G2
S1 S2
S2
D2
D1
(18.5)
S1
G1
(6.5)
80 ± 0.6
(24.5)
(15)
(15)
(15)
(2.8)
27 ± 1.0
4-M4 Screw
94 Max
36 Max
36 Max
JAPAN
(30.0)
2- φ 5.3 ± 0.3
Hitachi code
JEDEC code
EIAJ code
Weight (g)
LF-F
–
–
220
247
Package Outline Dimensions
80 ± 0.6
(23)
(23)
3-M5 Screw
(24)
G2
S2
JAPAN
S1 D2
S2
S1
G1
D1
(19)
(27)
35 Max
(7)
2- φ 5.5 ± 0.3
(12)
95 Max
(19)
(2.8)
31 Max
(19) (7) (16) (7)
S2
LF-K
–
–
410
D1
G1 S1
(30)
S2 G2
S1
D2
Hitachi code
JEDEC code
EIAJ code
Weight (g)
3-M5 Screw
80 ± 0.6
(23)
(23)
4- φ 5.5 ± 0.3
LF-J
–
–
220
JAPAN
(11)
(21)
48 ± 0.6
62 Max
(7)
Hitachi code
JEDEC code
EIAJ code
Weight (g)
(6.5)
(12)
95 Max
(2.8)
31Max
(18) (7) (16) (7) (18)
248
Package Outline Dimensions
2.5.2 Array Packages
Unit: mm
26.5 ± 0.3
1.82
2.54
1
2
3
4
1.4
5
6
1.2
7
8
9
10.5 ± 0.5
2.5
10.0 ± 0.3
4.0 ± 0.2
0.55
1.5 ± 0.2
0.55 ± 0.1
10
Hitachi code
JEDEC code
EIAJ code
Weight (g)
SP-10
–
–
2.9
4.0 ± 0.2
0.7 ± 0.1
1
2
3
1.4
4
5
6
1.15
7
8
9
2.54
10
11
10.5 ± 0.5
2.5
10.0 ± 0.3
31.0 ± 0.3
1.5 ± 0.2
0.55 ± 0.1
12
Hitachi code
JEDEC code
EIAJ code
Weight (g)
SP-12
–
–
3.6
249
Package Outline Dimensions
31.3 +0.2
–0.3
24.4 ± 0.1
16.4 ± 0.3
5.0 ± 0.2
2.0 ± 0.1
3.2
3.0
3.8
2.54
1.4
1
2
3
4
0.85 ± 0.1
5
6
7
8
9
16.0 ± 0.3
10.5 ± 0.5
2.7
10.0 ± 0.3
φ 3.2
1.15
2.2 ± 0.2
1.0
0.55
10 11 12
Hitachi code
JEDEC code
EIAJ code
Weight (g)
250
+0.1
–0.06
SP-12TA
–
–
6.1
Package Outline Dimensions
2.6 Standard Packages for Hybrid IC
Unit: mm
31.2 ± 0.3
28.0
81
120
80
160
41
0 – 5°
0.15 ± 0.05
0.80
0.80
3.56 Max
0.10
1.60
3.20 – 0.14
40
1 0.30 ± 0.10
+ 0.10
0.65
31.2 ± 0.3
121
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-160
–
–
5
30.0 ± 0.3
28.0
156
105
157
0.5
30.0 ± 0.3
104
208
0.5
3.56 Max
0.15 ± 0.05
0.5
0.15
1.0
52
+ 0.10
3.20 – 0.14
53
1
0.20 ± 0.10
0–5°
Hitachi code
JEDEC code
EIAJ code
Weight (g)
FP-208
–
–
5
251
Package Outline Dimensions
(0.3)
N.C.
N.C.
(4.05)
(0.2)
(3.0)
(0.2)
(14.0)
(4.05)
(0.2) (0.2)
(Terminal Side)
(0.75)
(0.3)
(0.2)
(9.1) 2.0 Min
2.25 Min
(2-1.15)
(2-1.15)
I/O
(2-4.73)
CLK
(2-5.3)
N.C.
2.25 Min
(0.2) (0.2)
(12.0)
RST
(0.2)
GND
0.63 Max
(0.2)
(0.75)
VCC
(2.46) (2.34) (2.34) (2.36) (1.3) (0.2)
• COB for Smartcard
(4-R1.5)
(7.6)
2.0 Min
(4-R1.5)
(0.95)
(10.8)
(Mold Side)
Weight : 0.2g
252
(0.95)
Section 3 Thermal Resistance of IC Packages
3.1 Thermal Resistance
Semiconductor devices are sensitive to temperature. When the temperature is above the junction
temperature of the semiconductor, the device does not operate normally. The maximum permitted
temperature of silicon is on the order of 100°C to 125°C. The device failure rate changes abruptly as
junction temperature rises (figure 3-1). For this reason, it is necessary to perform thermal design for
mounting to lower the junction temperature.
When carrying out heat sink design of a package, thermal resistance is the parameter that indicates the heat
sink capacity of the package.
Tj – Tr
θj = ––––––––– (°C/W)
Pd
Pd:
Tj:
Tr:
Power dissipation per device
Junction temperature
Standard temperature
θja, the junction to ambient thermal resistance, and θjc, the junction to case thermal resistance, are the
most generally used factors. Ambient temperature (Ta) and case temperature (Tc) are taken as the standard
temperatures. Figure 3-2 shows package temperatures and thermal resistance.
Here, θca indicates the case to ambient thermal resistance. The relationship:
θja = θjc + θca
is established between them.
10
–5
Ta
Resin mold
Failure rate (1/hr)
10
θ ca
–6
Tc
θ jc
10
–7
Hermetic
seal
10
Resin
Tj Die bond
Chip
–8
Lead frame
10
Ta
–9
PCB
25
50
75
125 200
Junction temperature (°C)
Figure 3-1 IC Junction Temperatures and
Failure Rates
Figure 3-2 Thermal Resistance of Packages
253
Thermal Resistance of IC Packages
3.2 Thermal Resistance Testing Method
Thermal resistance test is essentially junction temperature test. The power dissipation per device (Pd) and
the ambient temperature (Ta) can be directly tested. However, junction temperature (Tj) cannot be tested
directly. For this reason, junction temperature is tested indirectly making use of electrical parameters that
are sensitive to temperature, such as the base to emitter voltage of the transistor and the forward voltage of
the diode.
Table 3-1 shows an outline of the test system and of the principles of test. As error in the thermal resistance
test is decreased by increasing the power dissipation per device and by sufficiently rising junction
temperature, tests are made using power transistors. This method is based on MIL-STD-883C, which is a
standard method.
Table 3-1 Outline of Test Method and Principles of Test
Item
Details
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Outline of
test system
Test device
SW
A
V
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Principles
STEP 1. Correction
Temperature characteristics of base
Fixed current
to emitter voltage (correction curve) are
V BE
found.
(V)
Tj (°C)
Correction curve
STEP 2. Power impression test. The base to emitter
voltage (VBE) is tested when the power dissipation
Pd is added. Tj is found from the VBE that has
been tested.
STEP 3. Calculation of thermal resistance
Thermal resistance is found by the following
Tj – Ta
θja = ————
Pd
(V)
V BE
Tj
(°C)
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
254
Thermal Resistance of IC Packages
3.3 Thermal Resistance of Various Packages
Table 3-2 shows examples of thermal resistance of surface mount packages.
θja indicates thermal resistance tested in a natural convection state with the package suspended as a unit
and thermal resistance tested in a natural convection state with the package mounted on a glass epoxy
board. In each case, the lead frame material, the chip size and the board area are different. Because θja
varies depending on the lead frame material and chip size, the data must be handled taking the test
conditions into consideration.θjc indicates thermal resistance between the junction and the case when the
surface temperature of the main body of the package is taken as the case temperature, Tc. The heat sink
temperature is taken as the case temperature for packages in the shape of a heat sink. θjc is obtained by
applying silicone grease to reduce contact thermal resistance to the upper surface of the package or to the
heat sink and by testing thermal resistance in a state in which the grease is in contact with a water-cooled
heat sink of a copper plate.
Table 3-2 Test Examples of Thermal Resistance for Various Package
Lead frame
θja (°C/W)
material
–––––––––––––––
Package
Appliacation (Ceramic
Chip size
Applicable
Board
name
package
material)
(mm)
board
Unit
mountin θjc (°C/W)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOP
FP-8D
Cu alloy
1.16 × 1.44
1
258
169
72
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-14D
Cu alloy
1.16 × 1.44
1
234
163
99
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-16D
Cu alloy
1.16 × 1.44
1
230
158
99
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-18D
Cu alloy
1.16 × 1.44
1
190
135
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-20DN
Cu alloy
1.16 × 1.44
1
193
144
95
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-24D
42% Ni alloy
4.5 × 4.5
4
159
94
40
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-28D
42% Ni alloy
4.5 × 9.0
4
121
84
40
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-32D
Cu alloy
6.0 × 6.0
3
102
66
19
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
FP-28T
Cu alloy
2.76 × 2.4
6
168
55
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-44A
42% Ni alloy
6.0 × 6.0
5
121
102
34
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-64A
42% Ni alloy
6.0 × 6.0
5
118
103
34
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-80A
42% Ni alloy
6.0 × 6.0
5
115
99
–
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-136
42% Ni alloy
6.0 × 6.0
5
88
73
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-136A
Cu alloy
5.5 × 5.5
6
–
40
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-56
Cu alloy
6.0 × 6.0
6
–
70
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-64
42% Ni alloy
6.0 × 6.0
5
111
87
22
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-80
42% Ni alloy
6.0 × 6.0
5
98
88
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-80C
Cu alloy
6.0 × 6.0
2
85
78
37
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
255
Thermal Resistance of IC Packages
Test examples of Thermal Resistance for Various Package (cont)
Lead frame
θja (°C/W)
material
–––––––––––––––
Package
Appliacation (Ceramic
Chip size
Applicable
Board
name
package
material)
(mm)
board
Unit
mountin θjc (°C/W)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
FP-100
42% Ni alloy
6.0 × 6.0
5
97
88
24
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-100C
Cu alloy
6.0 × 6.0
2
84
76
33
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOJ
CP-20D
Cu alloy
4.5 × 9.0
5
119
72
30
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-24D
Cu alloy
6.0 × 6.0
5
131
76
30
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-28D
Cu alloy
6.0 × 6.0
5
101
64
15
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-28DN
Cu alloy
4.5 × 9.0
5
110
76
20
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFJ
CP-44
Cu alloy
6.0 × 6.0
3
85
60
(PLCC)
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-52
Cu alloy
6.0 × 6.0
3
72
57
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-68
Cu alloy
6.0 × 6.0
5
62
54
19
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFJ-G
CC-44
(Al2 O3)
8.4 × 8.4
5
79
–
12
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFI
MP-18
Cu alloy
2.76 × 2.4
1
200
106
35
(MSP)
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-18T
Cu alloy
2.76 × 2.4
1
186
97
–
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-28
Cu alloy
2.76 × 2.4
1
140
92
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-28T
Cu alloy
2.76 × 2.4
1
130
83
–
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-44
Cu alloy
2.76 × 2.4
1
107
77
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-44T
Cu alloy
2.76 × 2.4
1
100
64
–
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-68
Cu alloy
2.76 × 2.4
1
67
54
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFN(LCC) CG-28B
(Al2 O3)
1
111
99
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FPG
FG-28B
Cu alloy
1
109
68
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FG-132
Cu alloy
1
52
41
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PGA
PC-135
(Al2 O3)
12.6 × 12.6
–
26
–
–
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PC-179
(Al2 O3)
10.5 × 10.5
–
26
–
–
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PC-240
(Al2 O3)
10.5 × 10.5
–
24
–
–
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PC-257
(Al2 O3)
10.5 × 10.5
–
23
–
–
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PC-299
(Al2 O3)
10.5 × 10.5
–
20
–
–
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
256
Thermal Resistance of IC Packages
Test examples of Thermal Resistance for Various Package (cont)
Lead frame
θja (°C/W)
material
–––––––––––––––
Package
Appliacation (Ceramic
Chip size
Applicable
Board
name
package
material)
(mm)
board
Unit
mountin θjc (°C/W)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PGA
PC-401
(Al2 O3)
10.5 × 10.5
–
23
–
–
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP-G
DG-28
42% Ni alloy
6.3 × 6.3
–
56
–
14
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-32A
42% Ni alloy
10.5 × 4.2
–
57
–
8
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-32
42% Ni alloy
6.3 × 6.3
–
70
–
28
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-40A
42% Ni alloy
6.3 × 6.3
–
53
–
11
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Test conditions:
• Natural convection state
• Ta:room temperature
• Board material: glass epoxy
• Board area: (mm)
1. 40 × 40 × 1.6 (Wiring density, 10%)
2. 55 × 45 × 1.6 (Wiring density, 10%)
3. 67 × 58.5 × 1.6 (Wiring density, less than 15%)
4. 120 × 21 × 1.6 (Wiring density, 30%)
5. 140 × 50 × 1.6 (Wiring density, 30%)
6. 40 × 40 × 1.6 (Wiring density, 200%)
257
258
Section 4 Packing Specifications
4.1 Forms of Package Packing
The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an
inside box in which there is a magazine, a tray, or tape, with the IC being housed inside. In the unsealed
mode, the order of operations should be (1) corrugated cardboard packing box → (2) inside box → (3)
magazine (or tray or tape) .
The magazine, tray, or tape is designed so that the package is not subjected to damage during transport.
When the seal is opened, the package should be handled with great care so that it is not damaged.
1. Cardboard packing box
Carton tape (blue)
PP band
2. Inside box
Corrugated cardboard
Cardboard
Magazine
Label
Corrugated cardboard
Tape
3. Magazine, tray or tape
Tape
Stopper
IC device
IC device
Magazine
Tray
Reel
259
Packing Specifications
4.2 Moistureproof Packing
When a surface mount product is subjected to solder reflow mounting after the package has absorbed
moisture, cracking of the package occurs during mounting. For this reason, moistureproof packing is
carried out for plastic surface mount packages which carry large chips for the purpose of preventing
moisture absorption during transport and storage. The specifications are shown below.
Stopper
Magazine
LSI
Magazine
Band
Moisture proof bag
(within aluminium foil)
Moisture proof
packing
Inside box
260
Silicagel
Label
Packing Specifications
* : JEDEC
** : Limited availability-please inquire
*** : Partly under development
: Not applicable to all products
4.3 Surface Mount IC Package Specifications
Tray
Abbreviation
SOP
Nominal Number
Magazine
Dimensions of Pins
150 mil*
14
—
Taping
Hard
Soft
Not HeatResistant
HeatResistant
Adhesive
Embossed
—
—
—
—
In volume
production
16
225 mil
8
300 mil*
14
In volume
production
In volume
production
16
In volume
production
20
—
24
375 mil
18
In volume
production
20
450 mil
24
In volume
production
28
525 mil
32
40
SSOP
600 mil
44
675 mil
48
225 mil
14
In volume
production
In volume
production
—
—
—
16
—
—
In volume
production
In volume
production
—
Under
development
20
24
400 mil
48
56
TOSP (I)
600 mil
48
In volume
production
In volume
production
6 × 16 mm
20
—
—
8 × 14 mm
32
8 × 20 mm
20
—
—
In volume
production
—
In volume
production
—
—
In volume
production
32
TOSP (II)
300 mil
20
400 mil
24
—
—
—
Under
development
—
261
Packing Specifications
Surface Mount IC Package Specifications (cont)
Tray
Abbreviation
TOSP (II)
Nominal Number
Magazine
Dimensions of Pins
400 mil
28
Taping
Hard
Soft
Not HeatResistant
HeatResistant
Adhesive
Embossed
—
—
—
In volume
production
—
In volume
production
32
40
44
550 mil
48
SOI
550 mil
26
—
—
In volume
production
—
—
In volume
production
QFP
7×7
48
—
—
—
—
—
10 × 10
56
In volume
production
Under
development
64
14 × 14
—
44
In volume
production
64
In volume
production**
80
Under
development
100
14 × 20
54
60
In volume
production
In volume
production**
—
—
—
In volume
production
—
—
—
64
80
100
20 × 20
88
112
144
24 × 24
176
28 × 28
136
168
208
28 × 40
256
40 × 40
232
304
QFP-G
24
In volume
production
64
—
80
262
In volume
production
—
—
Packing Specifications
Surface Mount IC Package Specifications (cont)
Tray
Abbreviation
Nominal Number
Magazine
Dimensions of Pins
QFP-G
Taping
Hard
Soft
Not HeatResistant
HeatResistant
Adhesive
Embossed
132
—
—
Under
development
—
—
—
HQFP
7×7
28
—
—
—
In volume
production
—
In volume
production
TQFP
12 × 12
80
—
—
—
—
—
14 × 14
44
In volume
production
In volume
production
—
—
—
—
In volume
production
64
80
100
120
160
SOJ
300 mil
20
24
28
32
350 mil
20
400 mil
28
In volume
production
32
In volume
production
In volume
production
36
In volume
production
In volume
production***
40
QFJ
—
42
—
44
In volume
production***
18
In volume
production
—
—
—
—
32
—
44
In volume
production
52
68
Under
development
84
QFJ-G
—
In volume
production
44
68
84
—
—
—
—***
—
Under
development
—
In volume
production
—
263
Packing Specifications
Surface Mount IC Package Specifications (cont)
Tray
Abbreviation
QFI
Nominal Number
Magazine
Dimensions of Pins
(300 × 300)
18
(430 × 460)
28
In volume
production
Soft
Not HeatResistant
HeatResistant
Adhesive
Embossed
—
In volume
production
—
—
In volume
production
44
(500 × 600)
—
44
56
HQFI
QFN
264
Taping
Hard
In volume
production
(800 × 800)
68
(300 × 300)
18
(430 × 460)
28
7.37 × 10.8
20
7.39 × 12.45
22
7.62 × 10.16
24
In volume
production
8.6 × 11.8
28
—
9.45 × 12.65
28
9.55 × 15.35
28
12.19 × 12.19
40
29.92 × 29.92
84
—
In volume
production
—
In volume
production
—
—
—
In volume
production
—
—
—
—
—
—
In volume
production
Packing Specifications
4.4 IC Packages
4.4.1 Magazines for IC
(1) DIP
Board thickness : 1±0.3mm
Length : 500±3mm
Board thickness : 1±0.3mm
Length : 495±3mm
4.0
5.0
12.2
6.2
6.5
12.5
4.6
5.2
7.0
14.3
17.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-8
48 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-16
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-18
21 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-28S
17 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 1±0.3mm
Length : 500±3mm
Dimensional tolerance : ±0.3mm
(16.8)
(6.2)
Board thickness : 1±0.3mm
Length : 495±3mm
6.5
6.5
13
13
6.2
10.3
20.9
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-24
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-28
13 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-32
11 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-36
10 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-40
9 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-42
9 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-42S
12 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
10.3
20.9
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-56S
9 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
265
Packing Specifications
Board thickness : 0.5±0.3mm
Length : 500±3mm
8.4
Board thickness : 1±0.3mm
Length : 500±3mm
6.5
5.2
13.0
13.3
6.2
14.4
4.3
24.8
15.3
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-64S
8 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-16
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-18
20 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-20N
18 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-22N
16 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-24N
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-28N
12 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-16
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-18
20 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-20N
18 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 0.5±0.3mm
Length : 500±3mm
Board thickness : 0.5±0.3mm
Length : 525±3mm
8.0
12.1
12.1
4.0
4.0
8.0
6.0
6.0
15.0
15.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-18
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
266
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DG-16
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Packing Specifications
Board thickness : 0.55±0.3mm
Length : 500±3mm
Board thickness : 0.5±0.3mm
Length : 500±3mm
10.0
12.5
6.5
(6.2)
7.0
15.0
14.3
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-16
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-18
20 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-20N
18 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-22N
16 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-24N
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-28N
12 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-16
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-18
20 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-20N
18 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-22N
16 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
6.5
5.6
12.5
5.5
8.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-24A
16 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-28S
13 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 0.65±0.3mm
Length : 500±3mm
17.0
15.6
15.6
6.3
6.3
Board thickness : 0.8±0.3mm
Length : 500±3mm
17.0
12.7
12.7
22.3
22.3
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-24
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-28
13 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-32
11 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-24
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-28
13 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-40
9 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DP-42
9 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
267
Packing Specifications
Board thickness : 0.65±0.3mm
Length : 500±3mm
18.0
14.3
14.3
5.3
5.3
Board thickness : 0.8±0.3mm
Length : 500±3mm
18.0
12.7
12.7
22.3
22.3
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DG-24
14 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-28
12 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-32
10 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-40
8 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 0.8±0.3mm
Length : 495±3mm
15.6
5.0
(25)
16.4
30.8
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DP-64
5 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
268
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
DG-28
12 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-32
10 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
DG-40
8 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Packing Specifications
(2) ZIP
7.6
16.8
15.0
4.5
5.5
3.9
1.9
9.4
Board thickness : 0.8±0.3mm
Length :495±3mm
5.5
3.9
6.0
Board thickness : 0.8±0.3mm
Length : 495±3mm
1.9
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
ZP-16
23 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
ZP-20
18 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
ZP-24
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
ZP-28
13 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 0.8±0.3mm
Length : 495±3mm
11.3
7.5
18.7
5.5
3.9
1.9
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
ZP-24A
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
ZP-32
11 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
ZP-40
9 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
269
Packing Specifications
(3) SIP
Board thickness : 1±0.3mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
Board thickness : 1±0.2mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
17.4
8
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
SP-5T
48 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 1±0.3mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
29.4
(4–R1)
3
(6–R0.5)
(15)
16.2
1.4
6.6
(4.6)
(10.8)
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
SP-12T
16 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
270
1.5
2.4
1.0
8.8
7.6
(4.6)
8.8
32.4
8.0
1.5
1.5
2
1.7
13.3
4.0
3.2
13.6
0.8
8.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
SP-7
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
SP-8
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Packing Specifications
Board thickness : 0.89±0.13mm
Length : 500±1.5mm
Dimensional tolerance : ±0.4mm
18.67
5.1
11.43
Transparentness
2.54
7.62
8.64
1.52
3.81 4.3
13.21
10.16
20.45
36.32
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
SP-15TA
24 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
SP-15TB
24 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
14.5
4.2
10
Board thickness : 1±0.2mm
Length : 500±1mm
Dimensional tolerance : ±0.5mm
1.2
9.2
7
24
(5.6)
7.6
8.4
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
SP-23TA
16 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
271
Packing Specifications
(4) SOP
Board thickness : 0.5±0.3mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
9.1
5.9
5.2
4.6
5.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FP-8D
96 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 0.5±0.3mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
10.6
7.0
6.3
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FP-14D
47 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
FP-16D
47 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 0.5±0.3mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FP-14DA
47 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
FP-16DA
47 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
FP-20DN
38 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
1.5
3.3
4.5
4.5
1.5
3.3
13.4
8.0
7.3
3.6
4.0
272
1.5
3.3
4.5
13.4
8.0
7.3
1.4
3.2
4.2
2.6
3.0
Board thickness : 0.5±0.3mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
4.6
5.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FP-18D
38 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
FP-20D
38 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Packing Specifications
Board thickness : 0.8±0.3mm
Length : 500±3mm
2.0
6.0
8.5
8.5
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FP-28DA
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 0.8±0.3mm
Length : 500±3mm
22.8
11.5
22.6
12.9
11.3
5.8
2.0
2.0
6.0
2.0
Board thickness : 0.8±0.3mm
Length : 500±3mm
2.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FP-24D
30 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
FP-28D
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
2.85
20.0
8.7
2.0
2.85
2.0
2.0
5.4
2.85
20.0
8.7
Board thickness : 0.8±0.3mm
Length : 500±3mm
11.3
9.3
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FP-32D
22 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FP-40D
18 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
273
Packing Specifications
22.6
14.7
2.0
25.3
14.2
6.0
2.85
6.0
2.0
13.1
Board thickness : 0.8±0.3mm
Length : 500±3mm
2.0
Board thickness : 0.8±0.3mm
Length : 500±3mm
11.1
14.0
Package code Maximum Storage No.
––––––––––––––––––––––––––––––––––––––––
FP-44D
16 IC/Magazine
––––––––––––––––––––––––––––––––––––––––
Package code Maximum Storage No.
––––––––––––––––––––––––––––––––––––––––
FP-48D/48DA
22 IC/Magazine
––––––––––––––––––––––––––––––––––––––––
274
Packing Specifications
(5) FPG
Board thickness : 1±0.2mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
22.5
(4.5)
19.0
(4.5)
(2.25)
8.5
7.0
1.5
(2.25)
10
20.5
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FG-20D
19 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 1.5±0.2mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
Board thickness : 1.0±0.2mm
Length : 500±3mm
Dimensional tolerance : ±0.5mm
37.0
37.0
34.0
15.0
(13)
34.0
(15.2)
(14)
12.0
9.0
9.0
12.0
14.0
(10)
17.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
FG-24
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
10.0
(13)
(17)
10.0
Remarks
The FG-24 package is shipped in line up state
after inserted in its carrier.
275
Packing Specifications
(6) SOJ
Board thickness : 0.85±0.3mm
Length : 495±3mm
Board thickness : 0.85±0.3mm
Length : 495±3mm
5.3
7.7
7.7
Board thickness : 0.85±0.3mm
Length : 495±3mm
5.9
4.2
13.4
11.7
7.0
7.5
5.9
4.2
4.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-20D
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
CP-24D
29 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
CP-28DN
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
CP-32DN
22 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
6.6
7.7
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-24DA
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
CP-28D/28DA
25 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
CP-32D/32DB
22 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
CP-36D
19 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
CP-40D
17 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
CP-44D
16 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
276
12.0
10.3
7.0
7.5
5.9
4.2
7.5
10.8
9.1
7.0
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-20DA
27 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Packing Specifications
(7) QFJ
Board thickness : 0.85±0.3mm
Length : 495±3mm
Board thickness : 0.8±0.3mm
Length : 495±3mm
Dimensional tolerance : ±0.5mm
10.5
8.8
7.0
7.1
5.5
3.8
4.0
5.6
7.6
9.2
14.8
7.7
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-18
35 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-32
30 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 0.8±0.3mm
Length : 495±3mm
Board thickness : 1.1±0.3mm
Length : 495±3mm
23.3
13.8
9.8
7.6
5.4
7.0
5.4
9.2
20.1
13.8
14.5
18.5
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-44
26 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
14.9
21.1
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-52
23 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
277
Packing Specifications
32.9
5.4
7.0
13.8
7.0
5.4
9.2
27.85
13.8
Board thickness : 0.8±0.3mm
Length : 495±3mm
Dimensional tolerance : ±0.5mm
9.2
Board thickness : 0.8±0.3mm
Length : 495±3mm
14.9
26.25
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-68
18 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
278
31.3
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CP-84
15 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Packing Specifications
(8) QFN
Board thickness : 1.0±0.4mm
Length : 510±2mm
Dimensional tolerance : ±0.5mm
Board thickness : 0.7±0.3mm
Length : 495±3mm
Dimensional tolerance : ±0.5mm
26.0
3.0
5.5
4.7
10.1
4.6
6.0
8.6
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CG-20
40 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CG-22A
38 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 1.0±0.3mm
Length : 500 +0
–1 mm
Dimensional tolerance : ±0.5mm
0.5
5.5
3.0
26.0
4.6
(4.0)
(8.7)
5.0
8.6
(8.7)
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
CG-24
47 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
279
Packing Specifications
(9) QFI
11.3
8.5
12
0.4
3
1.2
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
MP-18, 18A
100 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
MP-18T
100 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Board thickness : 1.75±0.3mm
Length : 240±1mm
Dimensional tolerance : ±0.5mm
20
16.2
12
0.8
18
1.2
13.6
0.45
0.4
1 0.4
6
3
0.45
3
3
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
MP-44, 44TA
100 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
MP-56S
100 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
280
3
1.2
8.5
0.4
16
0.8
16
12.5
8
0.35
12
Board thickness : 1.75±0.3mm
Length : 240±1mm
Dimensional tolerance : ±0.5mm
0.3
Board thickness : 1.75±0.3mm
Length : 240±1mm
Dimensional tolerance : ±0.5mm
Package code Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––
MP-28, 28A
100 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
MP-28T, 44S
100 IC/Magazine
–––––––––––––––––––––––––––––––––––––––––
Packing Specifications
4.4.2 Trays for IC
4
×
227
41 = 164
31.5
(1) PGA
PT-749
12
28
5 × 41 = 205
36
277
Tray type
: PT749
Package code
Maximum Storage No.
Material
: Carbon PVC
PC-68
Thickness
: 0.7 mm
30 IC/Tray
30 IC/Inside box
Heat resistant temperature : 40°C
: less than 1 × 1010Ω
42 = 168
4
×
227
29.5
Surface resistance value
PT-750
14
31
5 × 42 = 210
277
33.5
Tray type
: PT750
Package code
Maximum Storage No.
Material
: Carbon PVC
PC-72
Thickness
: 0.7 mm
30 IC/Tray
30 IC/Inside box
Heat resistant temperature : 40°C
Surface resistance value
: less than 1 × 1010Ω
281
51 = 153
227
37
Packing Specifications
3
×
PT-751
14.5
36.1
4 × 51 = 204
277
36.5
Tray type
: PT751
Package code
Maximum Storage No.
Material
: Carbon PVC
PC-120
Thickness
: 0.7 mm
20 IC/Tray
20 IC/Inside box
Heat resistant temperature : 40°C
: less than 1 × 1010Ω
41
3
×
227
51 = 153
37
Surface resistance value
15
4 × 51 = 204
36.5
277
Tray type
: PT723
Package code
Maximum Storage No.
Material
: Carbon PVC
PC-135
Thickness
: 0.7 mm
20 IC/Tray
20 IC/Inside box
Heat resistant temperature : 40°C
Surface resistance value
282
: less than 1 × 1010Ω
51 = 153
227
37
Packing Specifications
3
×
PT-752
10.5
41.1
4 × 51 = 204
277
36.5
Tray type
: PT752
Package code
Maximum Storage No.
Material
: Carbon PVC
PC-179
Thickness
: 0.7 mm
20 IC/Tray
20 IC/Inside box
Heat resistant temperature : 40°C
: less than 1 × 1010Ω
61 = 122
227
52.5
Surface resistance value
2
×
PT-753
14.5
46.4
3 × 61 = 183
47
277
Tray type
: PT753
Package code
Maximum Storage No.
Material
: Carbon PVC
PC-240
Thickness
: 0.7 mm
12 IC/Tray
12 IC/Inside box
Heat resistant temperature : 40°C
Surface resistance value
: less than 1 × 1010Ω
283
62 = 124
227
51.5
Packing Specifications
2
×
PT-754
18
51.7
3 × 62 = 186
45.5
277
Tray type
: PT754
Package code
Maximum Storage No.
Material
: Carbon PVC
Thickness
: 0.7 mm
PC-257
PC-401
12 IC/Tray
12 IC/Inside box
Heat resistant temperature : 40°C
: less than 1 × 1010Ω
2
×
227
62 = 124
51.5
Surface resistance value
PT-776
18
53.8
3 × 62 = 186
45.5
277
Tray type
: PT776
Package code
Maximum Storage No.
Material
: Carbon PVC
PC-299
Thickness
: 0.7 mm
12 IC/Tray
12 IC/Inside box
Heat resistant temperature : 40°C
Surface resistance value
284
: less than 1 × 1010Ω
Packing Specifications
(2) SOP
315.8
9 × 31 = 279
18.4
18.4
*
*
*
*
*
25
*
13.7
67.9
4
×
135.8
*
25 = 100
*
17.9
31
*
17.9
*
20
HEAT PROOF indication
2.3
10 positions without holes (*)
6
10.5
160
157.9
Tray type
: PT743B
Package code
Maximum Storage No.
Material
: Carbon PP
FP-20D
Thickness
: 1.2 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C, 24h
: less than 1 × 106Ω
315.8 ± 1.5
9 × 31 = 279
18.4
2.5
2
31
*
*
*
*
*
20 = 100
*
67.9
25
16.7
4
×
135.8 ± 1.5
*
*
*
HEAT PROOF indication
6.5
10 positions without holes (*)
7.6
27.8
2.5
17.9
*
25
Surface resistance value
75
75
160
157.9
Tray type
: PT783
Package code
Maximum Storage No.
Material
: Carbon PPE
FP-40D
Thickness
: 1.8 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 107Ω
285
Packing Specifications
315.8 ± 1.5
9 × 31 = 279
18.4
2.5
2
31
*
*
*
*
67.9
25
16.5
4
×
25
*
20 = 100
*
135.8 ± 1.5
*
*
*
HEAT PROOF indication
6.5
10 positions without holes (*)
7.6
28.3
2.5
17.9
*
75
75
160
157.9
Tray type
: PT784
Package code
Maximum Storage No.
Material
: Carbon PPE
FP-44D
Thickness
: 1.8 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 107Ω
315.8
9 × 31 = 279
18.4
135.8
25 = 100
15.8
20.2
6.7
4.1
17.9
4
×
Tray type
: PT762
Package code
Maximum Storage No.
Material
: Carbon PVC
FP-48DA
Thickness
: 0.7 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 40°C
Surface resistance value
286
: less than 1 × 106Ω
Packing Specifications
315.8
9 × 31 = 279
31
*
*
*
*
*
*
15 = 75
*
×
*
16.31
2.5
HEAT PROOF indication
75
7.6
30.4
*
67.9
6.36
5
*
15
*
*
25
12 positions without holes (*)
135.8
18.4
75
160
157.9
Tray type
: PT741
Package code
Maximum Storage No.
Material
: Carbon PP
TFP-20D/20DR
Thickness
: 1.2 mm
60 IC/Tray
600 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
315.8
9 × 31 = 279
31
*
*
*
*
*
*
×
25
*
15 = 75
*
*
*
2.5
20.37
HEAT PROOF indication
75
7.6
30.4
*
67.9
5
8.52
*
135.8
12 positions without holes (*)
15
18.4
75
160
157.9
Tray type
: PT767
Package code
Maximum Storage No.
Material
: Carbon PP
Thickness
: 1.2 mm
TFP-20DA/20DAR
TFP-32D/32DR
60 IC/Tray
600 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
287
Packing Specifications
315.8
9 × 31 = 279
31.0
12 positions without holes (*)
*
*
*
*
*
×
25
*
15 = 75
*
*
HEAT PROOF indication
75
7.6
14.26
2.5
30.4
*
67.9
5
*
15
*
8.28
*
135.8
18.4
75
160
157.9
Tray type
: PT740
Package code
Maximum Storage No.
Material
: Carbon PP
TFP-32DA/32DAR
Thickness
: 1.2 mm
60 IC/Tray
600 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
315.8
11 × 25.15 = 276.65
19.575
25.15
*
*
*
*
*
25
*
135.8
*
*
×
17.4
HEAT PROOF indication
67.9
12 positions without holes (*)
75
17.9
*
2.5
*
7.6
9.34
5
*
20.0 = 100.0
20.0
*
75
160
157.9
Tray type
: PT785
Package code
Maximum Storage No.
Material
: Carbon PPO
Thickness
: 1.5 mm
TTP-20D
TTP-20DR
72 IC/Tray
720 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
288
: less than 1 × 106Ω
Packing Specifications
* *
6.8
1.5
* *
1.5
20
12 13.9
27.9
1.8
315.8
13× 20 = 260
25
* *
7.15
1.5
67.9
* *
135.8
9 ×12 = 108
section A-A'
* *
* *
B
section B-B'
12 positions without holes (*)
A
B'
A'
Tray type
:—
Package code
Maximum Storage No.
Material
:—
140 IC/Tray
Thickness
:—
TTP-14DA
TTP-16DA
TTP-20DA
TTP-24DB
Heat resistant temperature : —
Surface resistance value
:—
315.8
11 × 25.15 = 276.65
19.575
25.15
*
*
*
*
*
25
*
135.8
*
20.0 = 100.0
*
×
21.28
HEAT PROOF indication
67.9
12 positions without holes (*)
17.9
*
2.5
*
7.6
11.9
5
*
20.0
*
75
75
160
157.9
Tray type
: PT810
Package code
Maximum Storage No.
Material
: Carbon PP
Thickness
: 1.5 mm
TTP-32D
TTP-32DR
TTP-32DA
72 IC/Tray
720 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
289
Packing Specifications
315.8
11 × 25.15 = 276.65
19.575
25.15
*
*
*
*
*
*
18.8
17.9
*
67.9
*
25
*
12 positions without holes (*)
75
2.5
HEAT PROOF indication
75
7.6
*
5 × 20.0 = 100.0
135.8
11.9
20
*
*
160
157.9
Tray type
: PT809B
Package code
Maximum Storage No.
Material
: Carbon PP
Thickness
: 1.5 mm
TTP-24D, TTP-24DR
TTP-28D, TTP-28DR
TTP-40DA, TTP-40DAR
TTP-44DA, TTP-44DB
TTP-44DBR
72 IC/Tray
720 IC/Inside box
Heat resistant temperature : 125°C
Surface resistance value
: less than 1 × 106Ω
(3) QFP
315.8
9 × 31 = 279
(18.4)
(17.9)
31
19
*
*
*
*
×
2.5
*
*
67.9
4
*
25
*
25 = 100
*
135.8
18.4
HEAT PROOF indication
17.9
*
75
75
7.6
2.5
10 positions without holes (*)
160
157.9
Tray type
: PT397B
Package code
Maximum Storage No.
Material
: Carbon PP
Thickness
: 1.2 mm
FP-44A
FP-64A
FP-80A
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
290
: less than 1 × 108Ω
Packing Specifications
315.8
9 × 31 = 279
(17.9)
(18.4)
31
17.8
*
*
*
*
25 = 100
*
×
67.9
4
*
25
*
2.5
*
135.8
18.4
*
75
7.6
2.5
10 positions without holes (*)
17.9
*
75
160
157.9
Tray type
: PT704A
Package code
Maximum Storage No.
Material
: Carbon PS
Thickness
: 1.2 mm
FP-44A
FP-64A
FP-80A
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 70°C
Surface resistance value
: less than 1 × 106Ω
315.8
31
17.9
9 × 31 = 279
18.4
25 = 100
135.8
×
6.7
3.6
4
20.6
25
26.6
Tray type
: PM308
Package code
Maximum Storage No.
Material
: Carbon coated PVC
Thickness
: 0.7 mm
FP-54, FP-60
FP-64, FP-80
FP-100
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 40°C
Surface resistance value
: less than 1 × 106Ω
291
Packing Specifications
315.8
9 × 31 = 279
(18.4)
(17.9)
27
31
*
25
*
135.8
25 = 100
25
18.4
*
67.9
4
21
×
17.9
*
75
7.6
2.5
4 positions without holes (*)
75
160
157.9
Tray type
: PT308A
Package code
Maximum Storage No.
Material
: Carbon PS
Thickness
: 1.0 mm
FP-54, FP-54A
FP-60, FP-60A
FP-64, FP-64B
FP-80, FP-80B
FP-100, FP-100A
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 70°C
Surface resistance value
: less than 1 × 106Ω
314.1
30.8
67.9
4
×
25
24.9 = 99.6
*
135.8
*
24.9
21
27
(17.9)
9 × 30.8 = 277.2
18.45
*
HEAT PROOF indication
17.9
*
75
75
160
7.6
2.5
4 positions without holes (*)
157.9
Tray type
: PT308B
Package code
Maximum Storage No.
Material
: Carbon PC
Thickness
: 1.0 mm
FP-54, FP-54A
FP-60, FP-60A
FP-64, FP-64B
FP-80, FP-80B
FP-100, FP-100A
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
292
: less than 1 × 106Ω
Packing Specifications
315.8
31
(17.9)
9 × 31 = 279
18.4
25 = 100
135.8
×
3.9
6.7
4
19.4
25
25.4
Tray type
: PM308S
Package code
Maximum Storage No.
Material
: Carbon coated PVC
Thickness
: 0.7 mm
FP-54A, FP-60A
FP-64B, FP-80B
FP-100A
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 40°C
: less than 1 × 106Ω
Surface resistance value
315.8
13 × 20.0 = 260.0
(27.9)
(17.9)
27.9
20.0
12.4
*
25
*
135.8
*
25.0 = 100
25.0
*
*
6 positions without holes (*)
75
75
7.6
2.5
HEAT PROOF indication
17.9
*
67.9
4
×
160
157.9
Tray type
: PT518B
Package code
Maximum Storage No.
Material
: Carbon PP
FP-64C
Thickness
: 1.2 mm
70 IC/Tray
700 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 106Ω
293
Packing Specifications
315.8
9 × 31 = 279
18.4
18.4
17.9
31
*
25
17.9
67.9
4
×
135.8
25
*
25 = 100
*
*
16.6
160
157.9
7.6
75
2.5
75
4 positions without holes (*)
Tray type
: PT716A
Package code
Maximum Storage No.
Material
: Carbon PS
FP-100B
Thickness
: 1.2 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 70°C
Surface resistance value
: less than 1 × 106Ω
315.8
9 × 31 = 279.0
18.4
18.4
17.9
31
*
*
*
×
25
*
135.8
*
17.9
*
67.9
4
*
25
*
25 = 100.0
*
*
16.6
HEAT PROOF indication
10 positions without holes (*)
160
7.6
75
2.5
75
157.9
Tray type
: PT492C
Package code
Maximum Storage No.
Material
: Carbon PPO
FP-100B
Thickness
: 1.4 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
294
: less than 1 × 109Ω
Packing Specifications
315.8
13 × 20.0 = 260.0
(27.9)
(17.9)
27.9
20.0
13.2
*
25
*
135.8
*
25.0 = 100
25.0
*
*
6 positions without holes (*)
75
7.6
2.5
HEAT PROOF indication
17.9
*
67.9
4
×
75
160
157.9
Tray type
: PT491
Package code
Maximum Storage No.
Material
:—
FP-56
—
Thickness
:—
FP-64C
Heat resistant temperature : —
Surface resistance value
:—
315.8
9 × 31 = 279
(21.4)
(18.4)
31
67.9
3
×
25
31
*
31 = 93
*
135.8
18.4
*
*
24
4 positions without holes (*)
75
75
(160)
7.75
2.5
HEAT PROOF indication
21.4
20.45
157.9
Tray type
: PT711B
Package code
Maximum Storage No.
Material
: Carbon PP
Thickness
: 1.2 mm
FP-88
FP-112
40 IC/Tray
400 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
295
Packing Specifications
315.8
7 × 37.9 = 265.3
25.3
37.9
55
67.9
2
×
135.8
*
40.8
*
40.8 = 81.6
27.1
32.2
*
*
3
8.7
4 positions without holes (*)
HEAT PROOF indication
75
160
157.9
Tray type
: PT766M
Package code
Maximum Storage No.
Material
: Carbon PC
Thickness
: 1.5 mm
FP-120
FP-136
FP-160
FP-168
24 IC/Tray
240 IC/Inside box
Heat resistant temperature : 125°C, 24h
: less than 1 × 106Ω
Surface resistance value
315.8
9 × 31 = 279
(18.4)
(21.4)
18.4
31
*
*
19.5
HEAT PROOF indication
8 positions without holes (*)
75
75
160
6.55
2.5
22.4
21.4
*
×
25
*
67.9
*
135.8
*
3
*
31 = 93
31
*
157.9
Tray type
: PT761M
Package code
Maximum Storage No.
Material
: Carbon PP
FP-144A
Thickness
: 1.5 mm
40 IC/Tray
400 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
296
: less than 1 × 106Ω
Packing Specifications
315.8
7 × 37.9 = 265.3
25.3
37.9
27.1
26.3
*
55
135.8
40.8
×
67.9
2
*
40.8 = 81.6
*
*
HEAT PROOF indication
6 positions without holes (*)
6.5
2.5
*
*
75
160
157.9
Tray type
: PT772
Package code
Maximum Storage No.
Material
: Carbon PC
FP-176
Thickness
: 1.5 mm
24 IC/Tray
240 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
315.8
7 × 37.9 = 265.3
25.3
37.9
*
55
*
135.8
*
40.8
*
40.8 = 81.6
27.1
30.3
*
6 positions without holes (*)
3
HEAT PROOF indication
8.7
*
67.9
2
×
75
160
157.9
Tray type
: PT771M
Package code
Maximum Storage No.
Material
: Carbon PC
FP-208
Thickness
: 1.5 mm
24 IC/Tray
240 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
297
Packing Specifications
315.8
5 × 50 = 250
32.9
32.9
55
*
36.5
67.9
*
135.8
*
62.9
*
36.5
50
4 positions without holes (*)
HEAT PROOF indication
75
160
3.4
75
9.5
43.8
157.9
Tray type
: PT724B
Package code
Maximum Storage No.
Material
: Carbon PP
FP-304
Thickness
: 1.2 mm
12 IC/Tray
120 IC/Inside box
Heat resistant temperature : 125°C, 24h
: less than 1 × 106Ω
315.8 ± 1.5
5 × 50 = 250
32.9
2.5
2
43.1
*
37.6 = 75.2
*
*
*
7
6 positions without holes (*)
7.6
HEAT PROOF indication
2.5
30.3
*
67.9
2
×
135.8 ± 1.5
31.1
*
50
Surface resistance value
75
75
160
4
157.9
Tray type
: PT790
Package code
Maximum Storage No.
Material
: Carbon PP
FP-256
Thickness
: 1.5 mm
18 IC/Tray
180 IC/Inside box
Heat resistant temperature : 125°C
Surface resistance value
298
: less than 1 × 106Ω
Packing Specifications
(4) TQFP
(18.4)
31
16
25
*
*
17.9
67.9
4
×
55
135.8
25 = 100
*
(17.9)
315.8
9 × 31 = 279
18.4
2.5
*
75
7.6
4 positions without holes (*)
HEAT PROOF indication
75
160
157.9
Tray type
: PT773M
Package code
Maximum Storage No.
Material
: Carbon PC
Thickness
: 1.0 mm
TFP-44
TFP-64
TFP-80
TFP-100
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
315.8
9 × 31 = 279
18.4
13.9
31
*
*
*
*
*
67.9
4
×
55
*
135.8
*
25 = 100
25
*
*
17.9
*
HEAT PROOF indication
75
160
7.6
75
2.5
10 positions without holes (*)
157.9
Tray type
: PT789
Package code
Maximum Storage No.
Material
: Carbon PS
TFP-80A
Thickness
: 1.5 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C, 24h
Surface resistance value
: less than 1 × 106Ω
299
Packing Specifications
315.8
9 × 31 = 279
18.4
18.4
17.9
31
*
*
*
×
55
*
135.8
*
*
17.9
67.9
4
*
25
*
25 = 100
*
*
14.98
160
157.9
7.6
75
2.5
75
10 positions without holes (*)
Tray type
: PT828B
Package code
Maximum Storage No.
Material
: Carbon PPE
TFP-80C
Thickness
: 1.5 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C
: less than 1 × 109Ω
Surface resistance value
315.8
9 × 31 = 279
18.4
18.4
17.9
31
*
*
*
×
55
*
135.8
*
17.9
*
67.9
4
*
25
*
25 = 100
*
*
17.2
160
157.9
7.6
75
2.5
75
10 positions without holes (*)
Tray type
: PT815B
Package code
Maximum Storage No.
Material
: Carbon PPE
Thickness
: 1.5 mm
TFP-80F
TFP-100B
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 125°C
Surface resistance value
300
: less than 1 × 106Ω
Packing Specifications
(5) QFN
315.8
7 × 38 = 266
24.9
135.9
40.05 = 80.1
40.05
27.9
38
32
2
×
φ 20
32
3.5
6.5
Tray type
: PT703
Package code
Maximum Storage No.
Material
: Carbon PS
CG-84
Thickness
: 1.3 mm
24 IC/Tray
192 IC/Inside box
Heat resistant temperature : 70°C
Surface resistance value
: less than 1 × 106Ω
(6) QFJ-G
315.8
9 × 31 = 279
18.4
18.4
17.9
31
135.8
25
18.7
4 positions without holes (*)
75
9.5
*
2.5
*
17.9
67.9
4
×
25
*
25 = 100
*
75
160
157.9
Tray type
: PT725
Package code
Maximum Storage No.
Material
: Carbon PS
CC-44
Thickness
: 1.2 mm
50 IC/Tray
500 IC/Inside box
Heat resistant temperature : 70°C
Surface resistance value
: less than 1 × 106Ω
301
Packing Specifications
(7) SOI
18.7
25 × 4 = 100
135.8 ± 1.5
315.8 ± 1.5
15.5 × 19 = 294.5
12.5
75.0
2.5
7.6
160.0
75.0
Tray type
:—
Package code
Maximum Storage No.
Material
:—
MP-26DT
100 IC/Tray
Thickness
:—
Heat resistant temperature : —
Surface resistance value
:—
(8) QFI
206.0 ± 0.8
200.0
D'
125.0
170.0 ± 0.8
Cross-section D-D'
4 – φ 3.5
R3.0
12.5
16.54
C
20 – φ 2.5
6
100 – φ 4
18.8 ± 0.3
18.8 ± 0.3 9 = 169.2 ± 0.6
D
63.56 67.96
Cross-section C-C'
2.80
4.0
C'
+
6.0 3.5 15.25 ± 0.3
15.25 ± 0.3 +9 = 137.25 ± 0.6
3.0
Tray type
:—
Package code
Maximum Storage No.
Material
:—
100 IC/Tray
Thickness
:—
MP-18, 18T
MP-28, 28T
MP-44
MP-56S
Heat resistant temperature : —
Surface resistance value
302
:—
Packing Specifications
4.4.3 Taping for IC
4.0
φ 1.5
2.0
1.75
Emboss tape: Tape width 12 to 24 mm
Cover
Tape
K0
W
B0
F
A0
P
Tape withdraw direction
D1
Unit: mm
Package Code
W
P
Ao
Bo
Ko
F
D1
Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-8D
12
8
6.9
5.3
2.3
5.5
1.5
2500 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-14D
16
12
8.8
10.6
2.5
7.5
1.6
2000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-14DN
16
8
6.5
9.5
2.1
7.5
1.5
2500 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-16D
16
12
8.8
10.6
2.5
7.5
1.6
2000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-16DN
16
8
6.5
10.3
2.1
7.5
1.5
2500 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-18D, 20D
24
12
10.5
13.1
2.5
11.5
2.2
2000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-20DA
24
12
8.8
13.1
2.5
11.5
2.2
2000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-24D
24
16
12.5
16.3
3.2
11.5
2
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-28DA
24
16
12.4
18.5
3.1
11.5
2
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-32D, 32DA
24
12
8.6
14.4
1.65
11.5
2.05
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TTP-14D, 16DA
16
8
6.8
5.4
2max 7.5
1.6min 2500 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TTP-20D, 20DR,
24
12
9.5
17.65 1.65
11.5
2.05
1000 IC/reel
TTP-24DA
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TTP-20DA
16
12
6.9
10.6
2max 7.5
1.6min 2000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-18
24
12
8.5
13.8
3.6
11.5
1.5min 1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-20D
24
12
8.8
17.8
3.7
11.5
2.05
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-20DA
24
12
10.35 17.7
4.3
11.5
2
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-24D
24
12
8.9
16.3
4.15
11.5
2
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-28DN
24
12
9.0
18.6
4.2
11.5
2
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-28D, 28DA
24
16
11.6
18.65 4.2
11.5
2.05
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
303
Packing Specifications
(cont)
Package Code
W
P
Ao
Bo
Ko
F
D1
Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-18, 18A, 18T
16
12
8.5
9.0
2.9
7.5
2.0
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-28, 28A, 28T
24
16
11.8
13.0
2.9
11.5
2.0
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-44S
24
16
11.8
13.0
2.9
11.5
2.0
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-44, 44T
24
16
13.2
16.6
2.9
11.5
2.0
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-56S
24
16
13.2
16.6
2.9
11.5
2.0
1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
304
Packing Specifications
2.0
4.0
W
B0
K0
S
F
Cover
Tape
1.75
Emboss tape: Tape width 32 to 44 mm
D1
P
A0
Tape withdraw direction
S
0.20 ± 0.05
φ 1.5
0.75
Unit: mm
Package Code
W
P
Ao
Bo
Ko
F
S
D1
Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-32D
32
16
14.65 21.15 3.55 14.2 28.4 2.05 1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-40D
44
24
14.7 26.3 3.1
20.2 40.4 2.0
750 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-44D
44
24
16.6 28.8 3.5
20.2 40.4 2.0
750 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-32D, 32DB
32
16
11.55 21.45 4.05 14.2 28.4 2.05 1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-32DN
32
12
8.9
21.35 4.15 14.2 28.4 2.05 1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-36D
32
16
11.55 23.85 4.15 14.2 28.4 2.05 1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-40D
44
16
11.7 26.75 4.2
20.2 40.4 2.05 750 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-44
32
24
17.85 17.85 4.95 14.2 28.4 2.05 500 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-44D
44
16
11.65 29.2 4.05 20.2 40.4 2.05 750 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-52
32
24
20.55 20.5 5.35 14.2 28.4 2.05 500 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-68
44
32
26.0 25.9 4.9
20.2 40.4 2.05 250 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-84
44
36
30.9 30.8 5.0
20.2 40.4 2.05 250 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-20DA/20DAR 32
12
8.5
20.4 1.75 14.2 28.4 2.05 1000 IC/reel
TFP-32D/32DR
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
305
Packing Specifications
(cont)
Package Code
W
P
Ao
Bo
Ko
F
S
D1
Maximum Storage No.
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TTP-24D
32
16
12.05 18.95 1.65 14.2 28.4 2.05 1000 IC/reel
TTP-28D/28DR
TTP-28DA
TTP-40DA/40DAR
TTP-44D
TTP-44DB/44DBR
TTP-44DE
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TTP-32D/32DR
32
16
12.2 21.75 1.85 14.2 28.4 2.05 1000 IC/reel
TTP-32DB
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TTP-48D
32
24
15.95 20.30 1.65 14.2 28.4 2.05 1000 IC/reel
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
2.0
306
Tape width
W1
W2
24
28.4
24.4
32
36.4
32.4
44
48.4
44.4
W2
φ 330 ± 10
φ13.0 ± 0.5
W1
2.0
Packing Specifications
4.5 Transistors and Diodes
Hitachi discrete device packages are provided with various packing forms suited to automatic mounting.
The forms of packing are classified by packing specification codes indicated by the final element in the
product type number. (The product type number consists of the type number + the mark or grade + the
packing specification code.)
Table 4-1 Packing Specifications of Discrete Device Packages
Package
Packing
Packing
code
Form of packing
unit
specification code
Remarks
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CMPAK
Taping
3,000/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
(Mark face above)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MPAK
Horizontal magazine
50/magazine -01
(except diodes)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Taping
3,000/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
HITACHI
(Mark face above)
––––––––––––––––––––––––––––––––––––––––––––––––––––––
12,000/reel
UR
TR withdrawal direction→
(Ultra taping to Right)
––––––––––––––––––––
UL
(Ultra taping to Left)
TL withdrawal direction→
(Mark face above)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
307
Packing Specifications
Table 4-1 Packing Specifications of Discrete Device Packages (cont)
Package
Packing
Packing
code
Form of packing
unit
specification code
Remarks
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MPAK-4
Taping
3,000/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
(Mark face above)
––––––––––––––––––––––––––––––––––––––––––––––––––––––
12,000/reel
UR
TR withdrawal direction→
(Ultra taping to Right)
––––––––––––––––––––
UL
(Ultra taping to Left)
TL withdrawal direction→
(Mark face above)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
UPAK
Horizontal magazine
25/magazine
—
No partition code
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Taping
1,000/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL
withdrawal direction→
(Mark face above)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FPAK
Bulk
100/bag(small) F4 (4 Lead forming)
––––––––––––––––––––
500/bag(large)
F3
(3 Lead forming)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Taping
3,000/reel
TF4
TR withdrawal direction→
(4 Lead forward taping)
TR4
308
Packing Specifications
Table 4-1 Packing Specifications of Discrete Device Packages (cont)
Package
Packing
Packing
code
Form of packing
unit
specification code
Remarks
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DPAK
Bulk
100/bag
—
No classification code
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Taping
3000/reel
TR
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
LDPAK
Bulk
50/bag
—
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Taping
1,000/reel
TR
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
LLD
Taping
2,500/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
HITACHI
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SRP
Taping
3,000/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
HITACHI
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
URP
Taping
3,000/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
HITACHI
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
309
Packing Specifications
Table 4-1 Packing Specifications of Discrete Device Packages (cont)
Package
Packing
Packing
code
Form of packing
unit
specification code
Remarks
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ERP
Taping
4,000/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
HITACHI
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MOP
Taping
3,000/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
LRP
Taping
1,500/reel
TR
TR withdrawal direction→
(Taping to Right)
––––––––––––––––––––
TL
(Taping to Left)
TL withdrawal direction→
–––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
310
Packing Specifications
4.5.1 Magazines for Transistors and Diodes
(1) MPAK
Unit: mm
• Horizontal Type
178.2 ± 0.2
17.5
17.5
17.5
17.5
17.5
17.5
17.5 17.5
19.1
5.0 ± 0.1
X
Counter mark
3.35 ± 0.1 3.5 ± 0.1 3.5 ± 0.1
10.0 ± 0.2
19.1
Expanded view of ‘X’
0.7 ± 0.1
1.9 ± 0.1
311
Packing Specifications
(2) UPAK
178.2 ± 0.1
Counter mark
0.75 ± 0.07
2.5
0.5
1.91.6
2.8
3.15 3.85 ± 0.07
Expanded view of ‘X’
312
5±0.1
Y
2.8
0.5
3.5 ± 0.07 3.5 ± 0.07 3.35 ± 0.07
0.5
2.8
34.8
10.0 ± 0.1
0.5
3.35 ± 0.07 3.5 ± 0.07 3.5 ± 0.07
35
1.25 ± 0.1
± 0.07
(3.2) 2.7 4.1 ± 0.07
X
35
2.6 ± 0.1
35
1.45 ± 0.1
34.8
1.45 ± 0.1
• Horizontal Type
2.8
Expanded view of ‘Y’
Packing Specifications
4.5.2 Taping for Transistors and Diodes
4.0 ± 0.1
(2.95 )
φ1.5 +0.1
–0.05
(3.15 )
3.6 ± 0.1
8.0 ± 0.2
0.2 ± 0.05
1.75 ± 0.1
(1) Tapes and Reels for MPAK, MPAK-4
(φ1.1 )
2 1
2.0 ± 0.08
(1.5)
1 Carrier tape
2 Cover tape
3 Reel
4.0 ± 0.1
10 ± 1.5
( ) : reference only
2 +0.5
–1.0
2.0 ± 0.5
φ 21.0 ± 0.8
φ 13 ± 0.5
φ 178 ± 2
3
Unit : mm
HITACHI
Label
Type No. and Taping type
Shipping contents
Lot No.
φ 330 ± 2
φ 13 ± 0.5
3,000/reel
0
2.
±
0.
5
2.0 ± 0.5
12,000/reel
10 ± 3
313
Packing Specifications
(2) Tapes and Reels for UPAK
4.0 ± 0.1
12.0 ± 0.2
5.1
2.3 Max
1.5
8.0 ± 0.1
5.65
φ1.5 +0.1
–0
4.7
9.5 ± 0.1
2.0
2.0 ± 0.5
2
314
φ 80 ± 1
φ178 ± 2
φ13
4.0 ± 0.5
0.3
2
14±1.5
Packing Specifications
4.0 ± 0.1
2.35 ± 0.2
(1.85)
(0.9)
8.0 ± 0.2
φ 1.5 +0.1
–0.05
8.5 ± 0.1
0.25 ± 0.05
1.75 ± 0.1
(3) Tapes and Reels for CMPAK
2.4 ± 0.2
(1.4)
2.0 ± 0.05
φ18 ± 0.5
2.00.5
±
(1)
φ178 ± 2
φ 1.1 ± 0.1
4.0 ± 0.1
(1)
9.5 ± 1.5
315
Packing Specifications
(4) Tapes and Reels for CMPAK-4
TR Tape withdraw direction
(1.1)
4.0 ± 0.1
2.0 ± 0.05
4.0 ± 0.1
φ1.5 +0.1
–0.05
3.5 ± 0.1
2.6 ± 0.2
(0.7)
(2.0)
8.0 ± 0.2
1.75 ± 0.1
0.2 ± 0.05
φ1.1 ± 0.1
2.20 ± 0.2
TL Tape withdraw direction
(1.1)
4.0 ± 0.1
2.0 ± 0.05
4.0 ± 0.1
(2.0)
(0.7)
2.20 ± 0.2
Note) Reel: same as CMPAK
316
2.6 ± 0.2
φ1.5 +0.1
–0.05
3.5 ± 0.1
8.0 ± 0.2
1.75 ± 0.1
0.2±0.05
φ1.1 ± 0.1
Packing Specifications
(5) Tapes and Reels for FPAK
Adhesive tape
1.17 ± 0.1
12.7
15.8 ± 0.5
45 ± 10°
Tape withdraw direction
φ 380 ± 2
φ 65
32 ± 3
φ 20 ± 2
More than 300 mm
from tape end
25.4 ± 0.5
3.95
21.1 ± 0.2
Aluminium tape
for end mark
317
Packing Specifications
(6) Tapes and Reels for DPAK
0.3 ± 0.05
φ1.5
4.0 ± 0.1
+0.1
–0
10.6 ± 0.2
7.5 ± 0.1
13.5 ± 0.2
16.0 ± 0.3
1.75 ± 0.1
6.8 ± 0.2
3.4 Max
φ 1.6 ± 0.1
8.0 ± 0.1
±
5
0.
(2)
(2)
17.5 ± 3
318
φ 330 ± 2
φ 80 ± 1
0
2.
φ 13 ± 0.5
2.0 ± 0.1
Packing Specifications
(7) Tapes and Reels for LDPAK
10.8 ± 0.2
4.0 ± 0.1
0.4 ± 0.05
13.9 ± 0.2
5.5 Max
12.0 ± 0.1
2.0 ± 0.1
2.0
φ100 ± 2
φ 330 ± 2
φ 2.0 ± 0.1
φ13 ± 0.5
1.75
11.5 ± 0.1 ± 0.1
21.0 ± 0.2
24.0 ± 0.3
φ 1.5 +0.1
–0
±
0.5
(2)
(2)
25.5 ± 3
319
Packing Specifications
(1.9 )
φ1.5 ± 0.1
(4.1 )
( φ1.1 )
8.0 ± 0.2
4.0 ± 0.1
0.2 ± 0.05
3.55 ± 0.05
1.55 ± 0.1
(8) Tapes and Reels for SRP
1 Carrier tape
2 Cover tape
3 Reel
2 1
2.0 ± 0.1
(1.45)
4.0 ± 0.1
Unit: mm
( ) : Reference only
10 ± 1.5
2
+0.5
–1.0
2.0 ± 0.5
φ 21.0 ± 0.8
HITACHI
Label
Type No. and Taping type
Shipping contents
Lot No.
320
φ178 ± 2
13 ± 0.5
3
Packing Specifications
(9) Tapes and Reels for URP
1.75 ± 0.1
4.0 ± 0.1
(1.5 )
0.2 ± 0.05
2
(1.3)
8.0 ± 0.2
3.5 ± 0.1
(2.85 )
φ1.5 ± 0.1
1 Carrier tape
2 Cover tape
3 Reel
1
(2.0)
4.0 ± 0.1
Unit: mm
( ) : Reference only
10 ± 1.5
+0.5
2 –1.0
2.0 ± 0.5
φ 178 ± 2
φ13 ± 0.5
3
φ 21.0 ± 0.8
HITACHI
Label
Type No. and Taping type
Shipping contents
Lot No.
321
Packing Specifications
1.75 ± 0.1
(10) Tapes and Reels for LLD
4.0 ± 0.1
0.25 ± 0.5
φ1.5 ± 0.1
(1.7 )
2
(1.7)
1
8.0 ± 0.2
3.5 ± 0.5
(3.7 )
(φ1.1 )
1 Carrier tape
2 Cover tape
3 Reel
2.0 ± 0.05
4.0 ± 0.1
10 ± 1.5
2.0 ± 0.5
2.0 ± 0.5
φ 21.0 ± 0.8
HITACHI
Label
Type No. and Taping type
Shipping contents
Lot No.
322
φ 178 ± 2
φ13 ± 0.5
3
Section 5 Sockets for Evaluation of Characteristics
The sockets indicated below have been prepared as evaluation sockets. Those wishing to know the details
concerning the sockets for each package may contact the socket manufacturers.
5.1 Sockets for IC Packages
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP
DP-8
IC37F-0803-G4HT
Yamaichi
DG-8
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-14
IC-24-21 #2
DG-14, DG-14A
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-16, DP-16A
IC37NRB-1603-G4
––––––––––––––––––––––––––––––––––––
IC-31-8 #2
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2160311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-16, DG-16A
IC37NRB-1603-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-18A
IC37NRB-1803-G4
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
CQT3718-21SA
Texas Instruments
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2180311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-18
IC37NRB-1803-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-16-2
IC37NRB-2003-G4
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
CQT3718-21SA
Texas Instruments
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2180311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-20
IC37NRB-2004-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2200311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-20N
CQT3720-21SA
Texas Instruments
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2200311
Welcon
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC37NRB-2003-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-20N
IC37NRB-2003-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2200311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-22
IC37NRB-2204-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2220311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-22N
IC37NRB-2203-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2220311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-22N
IC37NRB-2203-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2220311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
323
Sockets for Evaluation of Characteristics
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP
DP-24
IC37NRB-2406-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-8240311-001
Welcon
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
CT3724-21SA
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-24A
CQT3724V-21SA
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC37NRB-2404-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-24, DG-24A, DG-24B IC37NRB-2406-G4
Yamaichi
DC-24
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-24N
IC37NRB-2403-G4
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2240311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-24N
IC37NRB-2404-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2240311
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-24TS
IC59-3004-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
CQ3724V-22SA
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-28
IC37NRB-2806-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
CT3728-21SA
Texas Instruments
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-8280311-001
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-28
IC37NRB-2806-G4
Yamaichi
DC-28
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-28N
633-2280311
Welcon
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
CQT3728A-21SA
Texas Instruments
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC37NRB-2803-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-28N
IC37NRB-2804-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-2280311
Welcon
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
CQT3728V-21SA
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-28S
IC-7620-2804-G4
Yamaichi
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
623-1280316-004
Welcon
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
CQT3728V-21SA
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-30S
IC59-3004-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-32
CT3732-21SA
Texas Instruments
–––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-8320311-001
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
324
Sockets for Evaluation of Characteristics
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DIP
DP-32
IC37F-3206-G4HT
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-32N
CQT3732A-21SA
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-36
IC37F-3606-G4HT
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-40
IC37NRB-4006-G4
––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-8400311-001
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CT3740-21SA
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DG-40
IC37NRB-4006-G4
Yamaichi
DC-40
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-42
IC37NRB-4206-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
633-8420311-001
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CT3742-21SA
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DC-42
IC37NRB-4206-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-42S
IC7620-4206-G4
––––––––––––––––––––––––––––––––––––––––––––––––––––––
623-7420316-004
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CM3742-22SBN
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-48
633-8480311-001
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC37NRB-4806-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-56S
IC121-5606-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-64
IC8620-6409-G4
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DC-64
IC8620-6409-G4
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-64S
IC121-64075-G4
––––––––––––––––––––––––––––––––––––––––––––––––––––––
623-9640316-005
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CM3764-22SBN
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DP-90S
IC121-9009-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZIP
ZP-16
IC39-1612-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CB3716-22SD
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZP-20
CB3720-22SD
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC118-2002-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZIP-20-2.54-04
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
325
Sockets for Evaluation of Characteristics
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZIP
ZP-24
CB3724-22SD
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC118-2403-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZIP-24-2.54-05
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZP-28
CB3728-22SD
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC118-2804-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZIP-28-2.54-01E
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZP-32
CB3732-22SD
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ZP-40
CB3740-22SD
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC118-4006-G4
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SIP
SP-5TA
SMT-26320
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SP-7
IC-66-7#2
––––––––––––––––––––
SP-8
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SP-12T
IC-125-1
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SP-15TA
IC39-1511-G4
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SP-15TB
IC39-1505-G4
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOP
FP-8D
IC51-0162-272-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-14D, FP-14DA
CFPHO16-37-01
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-14DN
IC51-0162-272-3
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-16D, FP-16DA
CFPHO16-37-01
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-16DN
IC51-0162-272-3
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-18D
CFPHO20-37-01
Texas Instruments
––––––––––––––––––––
FP-20D
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-20DN
IC51-0202-164
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-24D
IC51-0282-153
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-28D
FP-28-1.27-17
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0282-153
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSP028-008
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-28DA
FP-28-1.27-17
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
326
Sockets for Evaluation of Characteristics
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOP
FP-28DA
IC51-0282-153
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSP028-008
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-32D
FP-32-1.27-10
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0322-667-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSP032-019
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-40D
IC51-0402-1197
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-44D
IC51-0442-1208
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-48D
FP-48-0.8-03
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-48DA
IC51-0482-1009-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TSOP(I)
TFP-20D
IC51-0242-1006
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-28D
FP-28-0.5-01
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-32DA
OTS-32-0.5-01
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-32D
IC174-0322-001N
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
OTS-32-0.5-03
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TSOP(II)
TTP-20D
IC162-0202-037N
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
OTS-20(26)1.27-01A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TTP-28D
IC162-0282-045N
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
OTS-28-1.27-08A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TTP-32D
IC162-0322-039N
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
OTS-32-1.27-09A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
FP-28T
IC51-0404-1511
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-44A
FPQ-44-0.8-09D
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0444-954-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-54
IC51-0544-517-3
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-54A
IC51-0544-517-3
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-56
IC51-0564-680
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-60
IC51-0604-497-3
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-60A
IC51-0604-497-3
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-64
FPQ-64-1.0-08V
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
327
Sockets for Evaluation of Characteristics
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
FP-64
IC51-0644-472-3
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-64A
FPQ-64-0.8-10A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0644-692-3
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-64B
FPQ-64-1.0-08A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0644-472-3
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-80
FPQ-80-0.8-13A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0804-394-3
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-80A
FPQ-80-0.65-02A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0804-956-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-80B
FPQ-80-0.8-13A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0804-1200-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-88
FPQ-88-0.8-01A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0884-999-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-100
FPQ-100-0.65-11A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-1004-552-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-100A
FPQ-100-0.65-11A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-1004-552-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CQF100-025
Nippon T.I
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-100B
FPQ-100-0.5-01
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-1004-958-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-112
IC51-1124-1036-2
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-136
FPQ-136-0.8-02
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-136A
OTQ-136-0.8-02
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-144A
IC166-1414-006N
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-160
IC51-1604-845-4
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-168
FPQ-168-0.65-02
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-208
IC51-2084-1052-6
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-232
CQF-232-007
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TQFP
TFP-44
IC51-0444-889-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
328
Sockets for Evaluation of Characteristics
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TQFP
TFP-64
IC51-0644-1240-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-80
FPQ-80-0.65-05A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0804-1311-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-80F
FPQ-80-0.65-09A
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-80A
IC51-0804-808-5
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
OTQ-80-0.5-01
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC201-0804-020N
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-80C
IC51-0804-808-4
––––––––––––––––––––––––––––––––––––––––––––––––––––––
FPQ-80-0.5-04
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC201-0804-014N
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
OTQ-80-0.5-02
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-100
FPQ-100-0.5-03B
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-100B
FPQ-100-0.5-11
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-1004-809
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
OTQ-100-0.5-03
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC201-1004-008N
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
TFP-120
IC51-1204-1657
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP-G
FG-20D
IC53-0202-075
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FG-22D
FP-22-0.76-01
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FG-24
IC53-0244-033
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FG-28D
FP-28-1.27-12
Enplas
FP-28-1.27-12A
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FG-64
FPQ-64-1.0-08V
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FG-80
FPQ-80-0.8-13V
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0804-394-3
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FG-132
FPQ-132-0.635-04
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOJ
CP-20D
SOJ-20(26)1.27-02C
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC100-2603-20G
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSJT020-37-14
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
329
Sockets for Evaluation of Characteristics
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOJ
CP-20DA
SOJ-20(26)1.27-03C
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSJT020A37-14
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC100-26035-20G
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-24D
SOJ-24-1.27-02
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC100-2403G
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSJT024-37-15B
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-28D
SOJ-28-1.27-02C
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC100-2804-G
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSJT028B37-04
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-28DN
SOJ-28-1.27-06AC
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSJT028-37-04
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC100-2803-G
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-32D
SOJ-32-1.27-01C
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC100-3204-G
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
644-2320312
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CSJT032B37-04
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-40D
CSJT040B37-04
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC100-4004-G
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOJ-40-1.27-03
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFJ
CP-18
PLCC18-1.27-04
Enplas
(PLCC)
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0184-398
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
636-0181912-001
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-32
PLCC32-1.27-02
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0324-453
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
647-03201912
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-44
PLCC44-1.27-04
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0444-400-1
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
647-1441912
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CPL044-004
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
330
Sockets for Evaluation of Characteristics
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFJ
CP-52
PLCC52-1.27-01
Enplas
(PLCC)
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0524-411-1
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
647-1521912
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CPL0052-008B
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-68
PLCC68-1.27-04
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0684-390-1
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
647-1681912
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CPL068-006B
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CP-84
PLCC84-1.27-04
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-08844-401-1
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
647-1841912
Welcon
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CPL084-009B
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFJ-G
CC-44
IC51-0444-400
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––
CPL044-004
Texas Instruments
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
SOI
MP-26DT
IC51-0442-1070
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFI
MP-18, MP-18T,
MSPAK-18-1
Takachiho
(MSP)
MP-18A
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0184-1050
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-28, MP-28T,
MSPAK-28-1
Takachiho
MP-28A
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0284-1100
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-44, MP-44T
FPQ-44-1.016-02
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0444-550
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-44S
FPQ-44-0.762-01
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0444-739
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MP-56S
FPQ-56-0.762-0
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC51-0564-1226-2
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PGA
PC-68
PPS68-AG2D
AUGAT
––––––––––––––––––––––––––––––––––––––––––––––––––––––
NP89-10007-KS-8019
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PC-72
NP35-11207G4-2BF
––––––––––––––––––––––––––––––––––––––––––––––––––––––
PPS72-AG2D
AUGAT
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
331
Thermal Resistance of IC Packages
Sockets for IC Packages (cont)
Package
Package code
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PGA
PC-120
NP35-16008-G4-2BF
Yamaichi
KS-5594
––––––––––––––––––––––––––––––––––––––––––––––––––––––
PPS-120-AG1D
AUGAT
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFN
CG-20
IC53-0204-073
Yamaichi
(LCC)
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CG-22A
LCC-22-1.27-01
Enplas
––––––––––––––––––––––––––––––––––––––––––––––––––––––
IC53-0224-132
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CG-24
224-5315
TEXTOOL
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CG-40
240-5084-00-1102
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CG-84
IC51-0844-1005
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFP
FP-64A
IC149-064-*08-*5
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-80B
IC149-080-*12-*5
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FP-80A
IC149-080-*17-*5
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
QFJ-G
CC-44
PCS-044A-1
AUGAT
(pin insertion type)
––––––––––––––––––––––––––––––––––––––––––––––––––––––
PCC05-044-3227
KEL
––––––––––––––––––––––––––––––––––––––––––––––––––––––
244-7230-90-1157
Sumitomo 3M
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
CC-44
PCS-044SMU-1
AUGAT
(surface mount type)
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
5.2 Sockets for Transistors
Package
Socket No.
Name of Maker
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
FPAK
SMT-7514
Yamaichi
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
DPAK
SMT-6012-HT
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
5.3 Precautions for Handling Sockets
1. The intervals of the leads of dual in-line packages extend depending on the board dimensions (300 mil,
400 mil, 600 mil, 900 mil) (except for ceramic DIP). Sometimes, the mouth of the socket and the tip of
the lead do not conform and insertion is difficult. A suitable jig should be used for inserting ICs and for
withdrawing them.
2. When soldering must be performed with the IC inserted in the IC socket, use a soldering iron with high
insulation resistance. Caution should be exercised so that the IC is not damaged by the leakage current
of the soldering iron.
3. The IC socket should be used within its heat resistance temperature (125°C).
332
Sockets for Evaluation of Characteristics
4. The QFJ-G mounting socket recommended by Hitachi, which is listed in the IC package socket table,
may cause outer lead deformation, depending on the insert/extract method used by the customer and the
number of insert/extract cycles. The socket should be evaluated in advance for the expected number of
cycles, using the customer's insert/extract method.
Use an extractor to extract the IC from the socket. If the tip of the extractor is not inserted far enough
into the socket groove, it may catch on the seal and pry the cap loose when the IC is extracted (see the
drawing below). Choose an extractor that fits the socket, and when extracting the IC, make sure the tip
of the extractor is fully inserted.
Tip of extractor
Ceramic cap
Ceramic cap
Tip of extractor
Seal
Seal
Ceramic base
Ceramic base
(Wrong)
(Right)
5.4 Methods of Purchasing Sockets
If you want more detailed information about each socket and the purchase of sockets, please inquire at one
of the following agencies.
Contacts:
1. Yamaichi Electronics Co., Ltd.
Tel: 03-3778-6121 (Japan)
Fax: 03-3778-6181
2. Enplas Corporation
Tel: 0482-25-7233 (Japan)
Fax: 0482-57-0191
3. General Bussan Co., Ltd. (T•I)
Tel: 03-3383-1711 (Japan)
Fax: 03-3383-1719
4. Wells Electronics, Inc., (Welcon)
Tel: 219-287-5941 (U.S.A.)
Fax: 219-287-0356
5. MMM Co., Ltd (Textool)
Tel: 800-328-7732 (U.S.A.)
6. Takachiho Denki K.K
Tel: 0485-24-9900 (Japan)
7. Augat Inc.,
Tel: 617-222-2202 (U.S.A.)
333