Standard Packages and Features for
DIPIPM™ in Small Motor Drive Applications
Eric R. Motto
Powerex Inc., Youngwood, Pennsylvania, USA
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ECCE 2013
Presentation Outline
 Applications & Requirements for small
inverters: 0.2kW ~ 16kW (0.25HP ~ 21HP)
 The DIPIPM™ concept
 Development direction
 New Features
 The Complete DIPIPM™ Family
 Summary & Conclusions
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ECCE 2013
Typical Applications
–White Goods (Appliances)
•Washing Machines, Refrigerators,
Air Conditioners
–Fitness Equipment
•Treadmills, Stationary Bicycle
– Commercial HVAC &
Refrigeration
• Package Air Conditioner
– Pumps
• Water & fuel in residential and
commercial applications
– Small Industrial Drives
• General purpose & Servo
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ECCE 2013
Requirements for Small Inverter
Designs
 Reduced Total Cost
 Short Design Cycle
 Simplified Manufacturing
 Small Size
 High Efficiency
 Consistent High Reliability & Dependability
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ECCE 2013
The DIPIPM™ Concept
First introduced by
Mitsubishi in 1998
►Combine the discrete IGBTs, free wheel diodes and HVIC gate drivers
for a small motor drive into a single component:
Reduced component count – One part replaces more than ten
Improved manufacturabily – No Need to Mount & Isolate multiple devices
Small size – Increased integration yields compact finished equipment
Increased reliability – IGBTs and HVICs designed and tested together
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ECCE 2013
DIPIPM™ Key Technologies:
 Low cost packaging transfer molded lead
Transfer-mold
package
frame (Original Mitsubishi concept introduced 1998)
Bare
HVIC die
 Isolated mounting to heatsink with UL
recognized insulation and low thermal impedance.
(TCIL technology with internal heat spreader)
 Low loss IGBT and soft recovery free wheel
diode chips (Mitsubishi 5th 6th 7th  SiC )
 HVIC (High Voltage Integrated Circuit) for level-
Leadframe
IGBT chip
Ultra fast recovery
diode chip
shift and gate drive (Mitsubishi original designs)
New HVIC with 1200V level shift
using divided RESURF structure
600V HVIC using conventional
level shifting structure
High Voltage
Floating
Circuits
High Voltage
Level
Shifters
6
Al wire
Molded resin FWDi, IGBT
IC
Insulated resin sheet
Au wire
Cu frame
Al heat spreader
ECCE 2013
New DIPIPM™ Development Directions

Adopt 3 standard packages
(1) Super Mini DIPIPM, (2) Mini DIPIPM, (3) Large DIPIPM

Include Built-in Bootstrap Diode
Less components to select, test, populate
Relieves many critical spacing requirements on PCB
Will not interfere with other power supply schemes

Provide accurate analog temperature sensor
Linear feedback, not logarithmic

Make open emitters standard
Easily connected together externally if not needed

Update and Improve 1200V Line-Up.
Adopt latest generation chip technology & add new smaller package
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ECCE 2013
Standard Packages
Covering: 3A-75A@600V, 5A-50A@1200V
Super Mini DIPIPM™
Mini DIPIPM™
Large DIPPM™
38mm X 24mm X 3.5mm
52.5mm X 31mm X 5.6mm
79mm X 31mm X 8mm
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ECCE 2013
Super Mini DIPIPM™ Package Cross Section
Cu Frame
Al Wire
Mold
resin
FWDi
IGBT
Au Wire
IC
Insulated thermal radiating sheet
(Cu foil + insulated resin)
3A – 30A, 600V
Optimized of lowest cost and compact size the
Super Mini DIPIPM uses a high thermal
conductivity insulating resin sheet (TCIL)
between its lead frame and copper mounting
surface to provide UL recognized 1500VRMS
isolation. The heat of the transfer moulding
process causes the resin sheet to cure
simultaneously with the epoxy resin. The result
is stable high reliability electrical insulation with
low thermal impedance.
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ECCE 2013
Direct wire bonding
Simplified lead frame – Smaller Size
Optimized HVIC and Power chip layouts along with direct wire bonding eliminates
the need for intermediate lead frame islands.
Previous DIPIPM™
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New DIPIPM™
ECCE 2013
New DIPIPM™ Internal View
Highly optimized internal structure = Smallest Size & Lowest Cost
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ECCE 2013
Technology Comparison
POWEREX/Mitsubishi – DIPIPM™:
Optimized HVICs + Optimized power
chips + Direct wire bonding technology
+ Simple lead frame + Proprietary
TCIL insulation = Efficient, Highly
reliable, Low cost design
A Competitor’s approach:
Standard packaged ICs + Power
chips designed for discrete
packages + intricate IMS or FR4
patterned substrates = Complex
assembly, difficult to control
quality, long noise prone signal
paths, reduced power cycling
life
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ECCE 2013
Mini DIPIPM™ Package Cross Section
20A, 30A, 50A 600V NEW: 5A, 10A 1200V
The Mini DIPIPM™ has a thicker copper
heat spreader to provide the improved
thermal performance required for
demanding industrial applications. The
package also has a thicker profile with an
undercut backside to provide the
clearances needed for 2500VRMS isolation.
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ECCE 2013
Large DIPIPM™ Package Cross Section
Al wire Molded resin
FWDi, IGBT
IC
Insulated resin sheet
Au wire
Cu frame
Al heat spreader
75A, 600V & 5A-50A 1200V
The large DIPIPM™ combines TCIL (Thermally
Conductive Insulating Layer) technology with a
heavy aluminum heat spreader to provide low
cost and excellent thermal performance.
Heavier power pins and increased mechanical
strength allows use of this package at ratings of
up to 75A at 600V. The thicker body and
undercut backside provides the spacing and
clearance needed for 1200V devices up to 50A.
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ECCE 2013
Typical DIPIPM™ Analog
Temperature Feedback Signal
Typical Temperature Sensor Characteristic
4.5
4
Output Voltage (V)
The DIPIPM™ operating
temperature is monitored by
a circuit on the custom LVIC
that provides gate drive for
the IGBTs. Adding the
sensor to the gate drive IC
provides low cost
implementation and
accurate linear voltage
feedback
3.5
3
2.5
2
1.5
1
20
40
60
80
100
120
140
Temperature (C)
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ECCE 2013
DIPIPM™ Linear feedback versus NTC
16
Typical Output Voltage Characteristic
4.5
4
Output Voltage (V)
The DIPIPM™ linear
temperature feedback
provides superior
resolution in the critical
range of 80C to 120C. In
this range the DIPIPM™
provides an output
change of 1V while the
NTC provides a change of
only about 0.2V. This
makes implementation of
over temperature
protection easier and
more reliable with the
DIPIPM™.
DIPIPM™
3.5
NTC
3
2.5
2
1.5
1
20
40
60
80
100
120
140
Temperature (C)
ECCE 2013
DIPIPM™ Integration of Bootstrap Circuit
The new DIPIPM™ includes integrated bootstrap circuits. This eliminates
the need for external components a relieves critical voltage spacing on the
PCB. This leads to a more compact and simplified final design.
PS21963-4
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PSS10S92F6
ECCE 2013
Typical New Generation DIPIPM™ Application Circuit
Built-In Boot
strap diodes
Fault Status
feedback signal
Analog linear
temperature
feedback signal
Single Power
Supply
Operation
18
Open Low
Side Emitters
Short Circuit
Protection
ECCE 2013
Large DIPIPM™ Current Mirror CSTBT Technology
for Reduced Power Loss Current Sensing
CSTBT with current
mirror
This technique used in the large DIP-IPMs so that the current sensing
resistor can be reduced from a several watt rating to a fraction of a watt.
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ECCE 2013
DIP-IPM Product Line-Up (For new designs*)
Product Series
Super Mini‐DIP
Mini‐DIP
Large DIP
Current
600V
5A
10A
15A
20A
30A
35A
5A
10A
20A
30A
50A
5A
10A
15A
25A
35A
50A
75A
PSS05S92F6
PSS10S92F6
PSS15S92F6
PSS20S92F6
PSS30S92F6
PSS35S92F6
1200V
PSS05S72FT**
PSS10S72FT**
PSS20S71F6
PSS30S71F6
PSS50S71F6
PS21A79
PS21A7A
PSS05SA2FT
PSS10SA2FT
PSS15SA2FT
PSS25SA2FT
PSS35SA2FT
PSS50SA2FT
* This table does not include older types that are still in mass production. This does not imply impending obsolescence of these types.
** Does not meet UL840 or IEC60335-40 spacing. Use large DIP is this is required.
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ECCE 2013
Sinusoidal Inverter Loss Simulation
(Available from Powerex website: www.pwrx.com)
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ECCE 2013
NEW: Hybrid/Full SiC DIPPFC
(Featuring Super Mini DIPIPM package)
Features:
•
•
•
•
•
Low loss, High frequency
operation using SiC
Over Current, Under Voltage
and Over Temperature
protection
Fault feedback signal
1500VRMS Isolation
RoHS Compliant
Line-Up: 20ARMS, 600V
Hybrid (SiC SBD) – PSH20L91A6
Full SiC – PSF20L91A6
Si IGBT
or
SiC
MOSFET
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ECCE 2013
SiC DIPPFC same height as Super Mini DIPIPM
Simplified mechanical layout – height adjustment not needed
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ECCE 2013
NEW: MOSFET DIPIPM™
(Featuring Super Mini DIPIPM™ package)
Features:
•
•
•
•
•
•
Improved losses at low currents
compared to IGBT
Pin compatible with Super Mini
DIPIPM™
Over Current, Under Voltage and
Over Temperature protection
Fault feedback signal
1500VRMS Isolation
RoHS Compliant
Power Loss improvement compared to
IGBT Super Mini DIPIPM™
Target Application:
Consumer Refrigerator
Conditions: 2-phase modulation, Io=0.25ARMS,
Vcc=260V, fc=2.7KHz, PF=0.8
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ECCE 2013
Conclusion: DIP-IPM Family Features and Benefits:
 Wide Line-Up: 3A-75A 600V, 5A-50A 1200V with
common functionality for easy scaling of designs.
 Highest Reliability: fully tested module with HVIC gate
drivers, six IGBTs and free wheeling diodes delivers
consistent performance and improved reliability.
 Lowest cost: transfer molded package technology
provides the advantages of an isolated module at a cost
comparable to discrete components.
 Unsurpassed Efficiency: Low loss 6th generation IGBT
and soft recovery free wheel diode chip technology
provides 30% lower losses than competitive modules.
 Reduced Parts Count: one module replaces fifteen or
more discrete components.
 Smallest size: Use of bare die and simplified lead frame
cuts footprint to less than half of equivalent discrete
components.
Miniature 3KW
Three-Phase Inverter
Using 15A Super Mini-DIP
 Simplified Assembly: isolated base module eliminates
the need for insulation materials and requires only two
mounting bolts.
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ECCE 2013
Questions?
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ECCE 2013