T N O Int e r n ation a l C e nt r e f o r C onta m in ation C ont r o l
Facilities
room in the Van Leeuwenhoek Lab
in Delft. We apply our 15 years of
knowledge and experience in the
field to develop the newest, most
innovative, most reliable solutions
possible.
UV/Ozone
aning Equipme
nt
Cle
Industrial
cleaning
setup
Facility of ICCC at TNO.
lysis Tool
Ana
UHV bakeout setups
INTERNATIONAL
CENTRE FOR
CONTAMINATION
CONTROL
lar Conta
mi
lecu
na
Mo
ti
Plasma
cleaning
APMON
ticle Contami
na
Par
tio
on
CO2 snow
Optical
Detection
Ticker
tool
n
As Moore’s Law dictates, the
number of transistors on the
surface of semiconductors nearly
doubles every year. With shrinking
nodes, particles of as small as
10 nm as well as molecular
contamination can lead to defects.
TNO International Centre for
Contamination Control (ICCC)
is dedicated to developing the
highest standards and practices
in contamination control. This
centre is equipped with the most
advanced facilities, including
ultra-clean handling equipment for
e.g. EUV masks, diagnostic tools
for both particle and molecular
contamination, inspection and
analysis tools as well as various
cleaning equipment. The facilities
are located in the 6000 m2 clean-
EUV beam
line/XPS
Outgassing
setup
SEM/XPS
HIM
T N O Int e r n ation a l C e nt r e f o r C onta m in ation C ont r o l
Rapid Nano.
Equipment for
particulate
contamination
This platform will be upgraded in the near
future with a loadlock, which is a ‘particle
free’ atmospheric to vacuum transfer for
EUV masks.
Particles of 20 to 50 nanometres on an
pellicle free extreme ultraviolet (EUV) mask
can disturb the process and render the chip
useless. EUV mask handling has to comply
with very strict cleanliness requirements.
The handler must ensure that the mask is
brought from the atmospheric environment
to the vacuum of the EUV machine as
particle-free as possible. We have built a
dedicated ultra-clean handling platform
for inspecting particles down to 20 nm
on critical surfaces such as EUV masks.
The optical scanner Rapid Nano as well as
a high throughput SPM will be developed
within this setup in the future. This platform
will be used for the qualification of the
ultra-clean parts and systems from our
partners.
Rapid Nano particle scanner
The Rapid Nano is suitable for scanning
the complete surface of a blank reticle
in a protective scanbox. The inspection
system makes use of a double dark-field
concept whereby information is recorded
by a high-definition camera. The data is
stored as raw image format and made
available for off-line data processing and
reviewing. The Rapid Nano is currently
equipped with a stage which can measure
full reticle (152 × 152 mm) using the
scanbox protective environment
(EP1434094A1) or any surface up to
200 × 200 mm by using a customised
holder. It is capable of detecting particles
down to 35 nm and the upgrade to 20 nm
is currently on-going. This scanner has
been used in the cleanliness qualification
of ASML EUV ADT and the HamaTech Mask
Track Pro system.
EUV mask handler platform
In the past few years, we have developed
EUV mask handlers for the ASML EUV ADT
(in vacuum) as well as the HamaTech Mask
Track Pro system (atmospheric). For our
centre, an atmospheric EUV mask handler
platform has also been setup, meeting the
cleanliness requirement of 0.01 particles
per reticle pass for particle sizes >50 nm
(0.01 PRP/PS >50 nm).
APMON particle deposition
detector
APMON is a real time measurement of
deposition of particles >25 µm, it is
used to monitor the cleanliness of the
cleanroom. The technology of APMON
is innovated at ICCC and commercialised
by a Dutch company Technology of Sense.
Ticker Tool
The ticker tool is a tool designed for the
evaluation of particle generation and
substrate damage by tapping and small
sliding contacts. The tool is capable of
repeating contact between a pin and a
flat surface at a well-defined speed,
contact force (between 1 and 100 N),
sliding speed and length. The pin and
the contacting surfaces can be analysed
with SEM and EDS/WDS on damage and
particles. By changing materials, shape
and contact settings, combinations with
minimal particle generation can be
selected.
The ticker tool can be operated under both
atmospheric and vacuum environment.
In addition to Rapid Nano, a high throughput
SPM will be developed also in order to be
able to review the defects and performing
root cause analysis.
This platform contains:
–Flip unit for backside reticle inspection
– Switch unit, to switch from an inner POD
to a Rapid Nano scan box
– Interface with Rapid Nano and AFM
– Dual POD or SMIF loader, for clean
loading of the reticle blank
–Reticle safety system
– Ultra clean controlled environment.
EUV mask handler.
T N O Int e r n ation a l C e nt r e f o r C onta m in ation C ont r o l
Ticker tool.
Vacuum Tribometer
The ultra high vacuum (UHV) tribometer
is designed to study friction and wear
phenomena under vacuum conditions.
The disk motion can be continuous as
well as reciprocal. Measurements will be
performed at room temperature, however,
the surrounding medium can be changed.
The UHV Tribometer is designed for
measurements under vacuum conditions,
but after having reached vacuum, gas can
be introduced up to a pressure of 1 bar.
During the measurement the friction force
will be monitored. Since the normal load
is known, the coefficient of friction can be
calculated. After a measurement the
amount of wear and material transfer can
be assessed using optical microscopy,
scanning electron microscopy, atomic
force microscopy and optical profilometry.
Using the UHV tribometer and the
afore-mentioned analysis techniques,
the entire tribological system (materials,
load, environment) can be evaluated.
Equipment for
molecular
contamination
analysis
High energetic photons, ions or electrons
induce carbon growth in the vacuum
systems which is caused by residual
hydrocarbons. In order to minimise the
carbon growth we need to keep the system
as clean as possible, hence the ultraclean
vacuum (UCV). To be able to predict the
growth of carbon we need to know at the
designing phase what to be expected on
residual hydrocarbons.
Hence outgassing measurement of
materials and components has been
setup. At ICCC, we look into natural
outgassing in ultraclean vacuum as well
as EUV induced outgassing.
Outgassing measurement setup.
EUV Beam Line
EUV used for the next generation
lithography has a wavelength of 13,5
nanometres and it can only be transmitted
in an ultra-clean vacuum. Because of the
highly energetic photons, the EUV can
ionise the residual gasses and elements in
the vacuum and cause irreversible damage
to surfaces. It is found that the presence
of EUV radiation can significantly increase
the outgassing effects. Therefore each
material used in an EUV system should be
tested and qualified on its robustness
against EUV and its ultra-clean environment.
Currently our centre has one EUV beam
line installed, in close operation with Carl
Zeiss. It is used for research, lifetime
testing and materials analysis.
The main features include:
–Realistic EUV radiation from a pulsed
EUV source
– State-of-the-art vacuum diagnostics:
a high dynamic range RGA monitors
vacuum quality during exposures
– In vacuum surface analysis: irradiated
samples can be transferred through
vacuum for XPS surface analysis
– In vacuum cleaning of samples
–A gas delivery system to simulate
vacuum conditions in tool.
Together with our partners, we are planning
to install a second EUV beam line in order
to increase the capacity for qualification of
materials and components for EUV systems.
Outgassing setups
Outgassing of components and materials
can introduce a variety of contaminants into
the vacuum environment and impact the
processes. ICCC has developed several
outgassing measurement setups, see table
below, where LDL refers to low detection
limit for 10 hours of measurement time.
Since there is no industry standard for
quantifying outgassing performance, we
have partnered with SEMATECH in order
to develop a standardised method for
characterising outgassing rates of
components and material for semiconductor processing applications.
Analysis equipment
Optical microscope
Automatic surface scanning for particles
in the range of 1 µm up to 100 µm, which
is used for determination of the place and
size of the particles.
Confocal Laser Scanning
Microscope
Sub-micron imaging, with outstanding
120 nm resolution and accurate threedimensional measurement capability.
Scanning electron microscope
(SEM) and Energy-dispersive X-ray
spectroscopy (EDX)
Inspection and elemental analysis of the
defects on large substrate (up to 8 inch
in diameter).
X-ray photoelectron spectroscopy
(XPS)
A surface-sensitive quantitative
spectroscopic technique that measures
the elemental composition.
SystemLoadlockRGALDLCxHy>100 (mbarl/s)LDLtotal (mbarl/s) Volume (cm)
OTS-MKIIY
QMG4222·10 –115·10 –810·10·10
∅10·35
DN100NMKS 1·10 –93·10 –7
∅20·100
DN200-1NMKS 2·10 –92·10 –6
∅20·100
DN200-2NMKS 4·10 –92·10 –6
T N O Int e r n ation a l C e nt r e f o r C onta m in ation C ont r o l
Helium Ion Microscope (HIM)
A new and very accurate surface
characterisation technique that allows
direct viewing and surface analysis of
(sub-)nanometre structures, which uses a
beam of helium ions to scan the surface.
It can be used for high resolution imaging
including non-conductive samples as well
as nanofabrication due to integration of a
pattern generator and a gas injection
system.
Cleaning equipment
Cleaning substrates, masks, equipment
and parts comes with the challenge of
removing ever smaller particles without
damaging the increasingly delicate surfaces
(e.g. patterned masks and optics). ICCC
develops new cleaning technologies and
equipment as well as provides a wide
range of world- class cleaning services for
both particle and molecular contamination,
such as shielded microwave induced
remote plasma (SMIRP) that can be used
for the molecular cleaning of a range
of contaminants on extremely gentle
to surfaces. To clean materials and
assemblies prior to the final assembly
of production equipment, TNO also uses
several industrial cleaning tools:
Industrial cleaning setup
The components produced in workshops
must be cleaned prior to assembly.
Stainless steel and aluminum parts can
be cleaned in the industrial cleaning setup.
This cleaning setup consists of a series of
cleaning baths with cascade overflow
system. In the first bath a manual
cleaning/rinsing is carried out. In the next
steps the components are cleaned in
detergent baths with ultrasonic agitation.
At the end of the setup a series of rinsing
baths is placed. These baths are
connected by a cascade over flow system
in order to keep the water consumption
at a low level. The components are
transferred from on bath to the next by
a mesh basket on a transport rail. After
rinsing, the components are dried by a
nitrogen flow and finally they are baked
out in a vacuum oven.
BAKE OUT FACILITIES
Besides the low vacuum bake out furnaces
available at the wet cleaning facilities we
also have the option to bake out
components and parts in the outgassing
setups at ultra high vacuum conditions,
after bake the cleanliness can be verified
by the outgassing measurement with a
residual gas analyser.
Microwave & RF (vacuum) plasma
cleaning
Plasma cleaning can be used to molecularly
clean a wide variety of substrates from a
wide variety of contaminants, from
cleaning delicate optics up to sterilisation
of medical equipment.
The setup we have is equipped with
extensive plasma creation and analysing
facilities. SMIRP makes cleaning of very
delicate and EM sensitive substrates
possible. The analysing equipment can be
used to monitor the plasma and/or the
surface of the substrate during the plasma
cleaning process. The system itself is
equipped with a load lock and an operator
friendly interface. Before and after plasma
exposure the system can be pumped to
Ultra High Vacuum (UHV), which is a very
clean environment.
CO 2 snow
CO2 snow cleaning is a method for
removing sub-micron and nano-particles
from sensitive substrates. Gaseous or
liquid CO2 is released through a nozzle.
Because of the adiabatic cool down
sub-micron CO2 crystals are formed which
are directed towards the substrate surface
with a high velocity. Particles are removed
by the impact of the snow crystals.
clean masks
and optics using
plasma cleaners
developed by
TNO.
Special attention is needed to avoid
excessive cool down and cross
contamination by hydrocarbons.
UV/ozone
In ambient air, the UV generates ozone
which is activated by the UV radiation on
the surface. The activated ozone oxidises
organic compounds present on the
substrate surface. Therefore, it is
dedicated to the removal of molecular
organic contamination. Furthermore, it can
be used for surface activation. The
UV-Ozone increases wetting properties of
the exposed surface and it can be used as
a pre-treatment for coating and adhesive
bonding. UV-Ozone is an oxidative cleaning
method. Materials that are sensitive to
oxidation are likely not suitable with this
method.
Süss cleaner
The Süss cleaner is a tool for cleaning flat
substrates with wet techniques. It contains
a spinning table for a substrate and arms
with several cleaning nozzles. This way
cleaning techniques as megasonic
cleaning, high pressure jet cleaning and
organic rinsing can be tested. Furthermore,
experimental techniques as nano spray
and PVA brushing can be used.
TNO.NL
We welcome you to visit ICCC at TNO and
look forward to collaborating with you on
this topic.
Contact
TNO International Centre
for Contamination Control
Stieltjesweg 1
2628 CK Delft
The Netherlands
T +31 88 866 56 12
Eiccc@tno.nl
TNO.NL/ICCC
JRV140204-01
Ellipsometry
An optical technique for investigating the
dielectric properties of thin films. It can
be used to characterise composition,
roughness, thickness (depth), crystalline
nature, doping concentration, electrical
conductivity and other material properties.