p. 6Editor’s Foreword
VPX eyes new
frontiers
p. 18 Hall of Fame
VITA technology 2015
inductees
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and a 1500-watt AC-to-DC VPXtra™ 6U Power Supply.
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used in airborne, ground mobile, naval and industrial
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inverters, AC, DC-DC, AC-DC, DC-AC, and UPS).
See them at www.behlman.com.
VME HMC-B
VPX HMC-A VPX HMC-B
VME RTM
VPX RTM
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Open VPX is a trademark of VITA.
VPXtra is a trademark
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SUMMER 2015 | VOLUME 33 | NUMBER 2
@VitaTechnology
On the cover
This issue of VITA Technologies explores how the newly ratified VITA 78
SpaceVPX Systems specification is opening new possibilities for the critical
embedded computing industry. Also in this issue, the 2015 Resource Guide
highlights technologies based on VITA standards, including rugged boards,
systems, and related components, such as the 985023ANANWF1 for
Meritec’s Hercules HDR 10Gb/s Interconnect System size 23 right angle
to right angle with test head. Also featured on the cover: Annapolis
Micro Systems’ Wild40 Seven Slot OpenVPX 3U Chassis and Mercury
Computer Systems’ OpenVPX Ensemble.
DEPARTMENTS
SpaceVPX: Ready to launch
»» p. 12
By Jerry Gipper,
Editorial Director
6 Editor’s Foreword Jerry Gipper
VPX eyes new frontiers
8 Defining Standards Jerry Gipper
AUVSI: Unmanned systems at the crossroads
10 VITA Standards Update Jerry Gipper
VITA Standards Organization activity updates
26 Primetime Choices VITA Technology Hall of Fame
2015 Inductees
»» p. 18
By Jerry Gipper,
Editorial Director
29 Resource Guide Advertiser Index
3
2
23
7
20
9
55
6
5
21
Product teardown:
Maximizing functionality
through dual-node processing
»» p. 24
By Jerry Gipper,
Editorial Director
2
56
17
28
11
Annapolis Micro Systems, Inc. – WILDSTAR OpenVPX Ecosystem
Behlman Electronics – Higher 6U power
Creative Electronic Systems – Optimizing SWaP is our passion
Dawn VME Products, Inc. – Rugged, Reliable and Ready
Elma Electronic – Reduce, Save, Improve
Excalibur Systems, Inc. – mil-1553.com
GE Intelligent Platforms, Inc. – Rugged Capability Without Compromise
Highland Technology, Inc. – Continuing our long term commitment to VME
Interface Concept – Build your own VPX system
LCR Embedded Systems – Rugged Systems Engineered for Your Application
Orbit Electronics Group and Orbit Power Group – Higher 6U power; higher 6U health
monitoring performance
Pentek, Inc. – Got Tough Software Radio Design Challenges
VadaTech Inc. – Pssst ... Can you keep a secret?
Vector Electronics & Technology, Inc. – VME/VXS/cPCI Chassis, Backplanes & Accessories
VEROTEC Electronics Packaging – Verotec Integrated Packaging
All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners.
™VPX and its logo is a registered product/trademark of VITA.
© 2015 OpenSystems Media © 2015 VITA Technologies
enviroink.indd 1
4 | VITA Technologies Resource Guide Summer 2015 10/1/08 10:44:38 AM
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VITA Technologies Resource Guide Summer 2015 |
5
Editor’s Foreword
By Jerry Gipper, Editorial Director
@VitaTechnology
jgipper@opensystemsmedia.com
VPX eyes new frontiers
On my way home from the March VSO meeting held in Melbourne, Florida, and
hosted by the Harris Corporation, I took some time to stop by the Kennedy Space
Center. VITA Technical Director Jing Kwok and I boarded the bus to tour around
the space center for the afternoon. I have taken this tour two previous times,
first in 2000 and most recently in January 2012 as part of the Embedded Tech
Trends media tour. In 2000, when I went with my family, the center was bustling
with activity, wrapping up the day with the nighttime launch of the Opportunity
Mars rover.
During my 2012 tour, the space center was quiet. The shuttle program had recently
Highland Technology
shut down, and they were in the process of relocating the shuttles to their permanent
VITAinSummer
insert
resting places
museumsIssue
around
the country. There was still launch activity, but the
04/01/15
energy level was down, and SpaceX renovations were in the early stages.
NOTE:
KEYLINE
DOES
NOT
PRINT
Fast-forward
to March
2015 and
you can
easily
see the changes. The energy is back!
Pads 39ATRIM
and 39B
of
shuttle
fame
are
in
varying
stages of rebuilding. 39A is nearly
as shown
done, and 39B is ready for the new launch frame to be installed. NASA has been
busy issuing contracts for services to
further study, rehabilitate, modernize,
and develop new and existing civil
infrastructure and facilities at Kennedy
Space Center, Cape Canaveral Air
Force Station in Florida, Vandenberg
Air Force Base in California, and other
NASA assets, including launch or
landing sites worldwide.
We stopped by the new Atlantis shuttle
display at the Kennedy Space Center.
This was my first up-close encounter
with a shuttle, having only seen it from
afar sitting on its 747 carrier at Edwards
Air Force Base in 1982. It is an amazing,
must-see exhibit.
Continuing our long term commitment to VME
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fax: 1-415 551-5129
6 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
“WITH COMMERCIAL
SPACE TRAVEL RAMPING
UP AND THE SPACEVPX
SYSTEMS SPECIFICATION
NOW PUBLISHED, WE MAY
SOON GET A CHANCE TO
SEE VPX IN ACTION ON AN
What is even more exciting is the fact that other segments of the defense industry are
looking at a VPX base platform for their mobile applications. VITA’s newest sponsor
member, the Communications-Electronics Research, Development and Engineering
Center, more commonly known as CERDEC, is interested in developing specifications
for a converged architecture during the FY14-17 timeframe. This promises to be innovative times for VPX applications.
Also in this edition of VITA Technologies is the announcement of the latest round of
inductees into the VITA Technologies Hall of Fame. Read how these innovators and
technologies are contributing to the success of our industry. Be sure to submit your
own nominees for consideration in 2016.
Jerry Gipper
jgipper@opensystemsmedia.com
UPCOMING MISSION.”
We had the chance to talk to a docent
working the shuttle display. While examining the Canadarm we wondered about
the extension that was mounted to the
cargo bay. The docent explained that
NASA had added the extension after the
Columbia explosion so that the shuttle
could undergo an extensive Flight Day 2
self-inspection of the external tiles and
heat shields. This led to a discussion on
the whole incident with our guide who
was on the team assigned to gather data
for the report.
If you like space travel, this report makes
for great reading. The level of detail in
the report is amazing, especially if you
like space science. You will learn a lot
about the incident and how NASA works
in general. For more information, see
www.nasa.gov/columbia/home/CAIB_
Vol1.html.
This all brings me back to one of our
features in this issue, SpaceVPX: Ready
to launch. While Jing and I were admiring Atlantis, we started discussing
what a SpaceVPX system might look
like and what it might do on space missions. With commercial space travel
ramping up and the SpaceVPX Systems
specification now published, we may
soon get a chance to see VPX in action
on an upcoming mission. Read the feature to get a better understanding of
what has been accomplished. We are
already making plans to return to the
Kennedy Space Center after the March
2016 VSO meeting.
www.vita-technologies.com
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VITA Technologies Resource Guide Summer 2015 |
7
Defining Standards
By Jerry Gipper
AUVSI: Unmanned systems at the crossroads
I attended the Association for U­nmanned Vehicle Systems International (AUVSI)
Unmanned Systems 2015 show in Atlanta in May. It was my first visit to this event,
which is much heralded by VITA members. From what I could tell, I came to the conference at an inflection point for the industry of unmanned vehicle systems.
AUVSI is an international nonprofit organization dedicated to promoting and supporting the unmanned systems and robotics industry. For most of the 40-plus-year
history of this organization, the driving market was military applications of unmanned
vehicles, primarily because it was one of the few industries that had both the need and
resources to spearhead the development that was possible with available electronics
technology. But now all of that has changed, with electronics becoming so ubiquitous
and inexpensive, a whole new wave of capabilities has emerged.
The members of AUVSI recognized and acknowledged this shift by renaming the event
XPONENTIAL. In a press release at the show, AUVSI stated, “We are at an exciting
inflection point today, where advancements in technology are allowing us to build upon
our noble heritage of protecting citizens around the world. XPONENTIAL captures the
potential of this industry, and defines our commitment to you – now and into the future.
Serving as the intersection for commercial and defense applications, and advancing all
domains collectively, XPONENTIAL is committed to serving as your ultimate industry
brand experience.”
I ran into a longtime associate, David French of GE Intelligent Platforms, who acknowledged the changing atmosphere at this year’s event. In a post on the GE website
(www.geautomation.com/blog/auvsi-day-3-sparking-unmanned-evolution), he commented that, “It is remarkable to see the unmanned systems market shift from what
had traditionally been the purview of the military to a fast and growing commercial
must-have capability. Commercial unmanned system suppliers and technology providers at this year’s AUVSI event now represent probably 80 percent to 90 percent of
the show floor real estate.”
He also pointed out that the demonstrated applications were varied but tended
to revolve around agribusiness, critical infrastructure inspection, news surveillance,
search and rescue, entertainment, basic science, and other applications. The majority
of platforms displayed were unmanned aerial systems (UAS), and the overwhelming
form factors were relatively small UAS platforms.
AUVSI is excited about the future for unmanned systems of all types, announcing that
the market is poised for explosive growth. The industry and regulators have opened
unprecedented dialogue. Speakers at the opening keynote agreed that there is a
potentially huge market for unmanned aircraft, and they are able to fly and accomplish
more than what was possible just a few months ago.
While the industry is mobilizing to explore the seemingly endless possibilities
­available, many obvious challenges still exist. The Federal Aviation Association (FAA)
has been developing rules for the operation and certification of small, unmanned
­aircraft systems. According to the FAA, “this rulemaking would adopt specific rules
for the operation of small unmanned aircraft systems in the National Airspace
System. These changes would address the classification of small unmanned aircraft,
certification of their pilots and visual observers, registration, approval of operations,
8 | VITA Technologies Resource Guide Summer 2015 and operational limits in order to increase the safety and efficiency of the
National Airspace System.”
Agencies in countries around the world
are frantically addressing the issues of
unmanned vehicles of all types. After
recent intrusions by drones, police
departments are studying technology to
detect and capture drones. For example,
the Tokyo police department has plans
to study whether it is possible to capture suspicious drones using police
drones carrying nets. Other agencies
are studying the use of security cameras
that detect the heat of drone batteries
and motors, and are employing technologies for identifying flight sounds,
even looking at a method of blocking
drone radio control by jamming signals.
Some states are studying or passing legislation giving landowners the right to
shoot down drones, though this is not a
realistic option due to technical difficulty
and safety concerns.
What does this mean for VITA technology suppliers? First, the demand for
unmanned vehicles of any type is just
beginning and will remain significant
long into the future, requiring a strategy
rethink for many companies. Second,
given that size, weight, and power
(SWaP) sensitivity is critical to success,
small form factors are a must. Third,
devices must be as autonomous as
possible with onboard intelligence and
sensing to make them as safe as possible, demanding more processing and
better sensor performance. And finally,
although the defense market remains
a major player, it is starting to take a
secondary role to commercial applications that have less stringent demands
on reliability and performance, leading
to reconsideration of target markets for
some suppliers. To me, this indicates
that there is still much work to be done
in the creation of standards for critical
embedded systems.
www.vita-technologies.com
VITA Standards Update
By Jerry Gipper
jgipper@opensystemsmedia.com
VITA Standards Organization activity updates
The Harris Corporation hosted the March VITA Standards Organization (VSO) meeting in Melbourne, Florida. After an
especially harsh winter in the Northeast, several attendees arrived early and stayed for the weekend. Many were reluctant to
return to the snow still on the ground. More than 40 people were in attendance to participate in status updates and several
working group discussions. This update is based on the results of that meeting.
Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website (www.vita.com) for
details on upcoming VSO meetings.
ANSI accreditation
VITA 17.1: Front Panel Data Port (FPDP)
Accredited as an American National Standards Institute (ANSI)
developer and a submitter of Industry Trade Agreements to
the IEC, the VSO provides its members with the ability to
develop and promote open technology standards. The VSO
meets every two months to address embedded bus and board
industry standards issues.
Objective: This standard defines a multi-drop synchronous parallel non-addressable bus connection between multiple boards
in a single chassis. Extension specifications define protocols for
specific use cases.
VSO study and working group activities
Standards within the VSO may be initiated through the formation of a study group and developed by a working group.
A study group requires the sponsorship of one VITA member,
and a working group requires sponsorship of at least three
VITA members.
Status: ANSI/VITA 17.1 was opened up for minor edits and has
completed the process for re-accreditation. A VITA 17.3 working
group was formed recently to incorporate the Interlaken protocol for packet transfers scaling from 10 Gbps to 100 Gbps.
ANSI/VITA 42.0: XMC Switched Mezzanine Card Base
Specification
Objective: This standard defines a PMC form factor with open
standard switch fabric interconnects.
Work in progress
Several working groups have current project work underway;
the following roundup summarizes those projects.
E-CAST
Keeping it cool:
Solving military electronics thermal
management challenges
Presented by Kontron
This presentation focuses on the principle techniques
for thermal management, their relative efficiencies, and
examples of real world solutions. Some rules of thumb
will be presented that can be used by the non-expert
for estimating maximum system temperatures under
various conditions.
GO TO E-CAST:
ECAST.OPENSYSTEMSMEDIA.COM/550
10 | VITA Technologies Resource Guide Summer 2015 Status: Currently being modified to allow the use of solder ball
XMC connectors.
VITA 46.11: System Management on VPX
Objective: This standard defines a system management architecture for VPX systems.
Status: Currently in “VITA Draft Standard for Trial Use” status. The
specification was approved for submission for ANSI accreditation.
ANSI/VITA 49.x: VITA Radio Transport (VRT)
Objective: The VITA Radio Transport (VRT) standard defines
a transport-layer protocol designed to promote interoperability between radio frequency receivers and signal processing
equipment in a wide range of applications. The VRT protocol
provides a variety of formatting options allowing the transport
layer to be optimized for each application. The ANSI/VITA 49.1
VITA Radio Link Layer (VRL) standard specifies an optional
encapsulation protocol for VITA 49.0 (VRT) packets.
Status: The working group has completed revisions to
VITA 49.0 and VITA 49.1; both were approved to be submitted for ANSI accreditation. The VITA 49a working group
has completed a document for control packet and spectrum
analyzer packet specifications and has voted to submit for
ANSI accreditation.
www.vita-technologies.com
VITA 57.4: FMC
Objective: The goal of this project is to develop a next-­
generation specification calling for a new set of connectors to
support higher-speed serial interfaces.
Status: The working group has reviewed connector options and
is working on a draft specification.
ANSI/VITA 65: OpenVPX Architectural Framework
for VPX
Objective: The OpenVPX architectural framework specification
is a living document that is continuously being updated with
new profile information and corrections.
Status: The working group is currently receiving input on
new profiles for the next edition. A proposal was presented
to enable the working group to incorporate profiles into the
specification faster and more effectively.
VITA 66: Optical Interconnect on VPX – Half Width MT
Objective: The VITA 66 base standard defines physical features
of a stand-alone compliant blind mate Optical Interconnect for
use in VPX systems. This standard defines a Half Width MT style
contact variant.
Status: The working group has submitted VITA 66.4 for ANSI
balloting, the final step to an approved specification.
VITA 67.3: VPX: Coaxial Interconnect, 6U,
Four Position SMPM Configuration
Objective: This specification details the configuration and interconnect within the structure of VITA 67.0, enabling a 6U VPX
interface containing multi-position blind mate analog connectors with up to four SMPM contacts.
Status: The working group has begun work on the draft
specification.
family and the commercial infrastructure that supports these
standards.
Status: Approved by ANSI and posted to the VITA store for
purchase.
VITA 79-Embedded Photonics
Objective: This working group is chartered with developing
a standard based on work done by the JEDEC 13.6 subcommittee for photonics. This is the first step in preparing a series
of projects to address using optical backplane technology in
the future.
Status: The working group is currently working on developing
an environmental qualification document that encompasses
complimentary features from various U.S. and European
standards.
Participating in these working groups is a great way to influence
the direction of the next generations of technology important
to the critical embedded computing industry. Contact VITA
if you are interested in participating in any of these working
groups, and for details on upcoming VSO meetings.
Copies of all specifications reaching ANSI recognition
are available from the VITA website. For a more
complete list of VITA specs and their status, go to
www.vita.com/Specifications.
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VITA 68: VPX: Compliance Channel
Objective: This standard defines a VPX compliance channel
including common backplane performance criteria required to
support multiple fabric types across a range of defined baud
rates. This allows backplane developers to design a backplane
that supports required Bit Error Rates (BER) for multiple fabric
types. This also allows module developers to design plug-in
modules that are interoperable with other modules when used
with a compliant backplane.
Status: The working group has developed a simulated model
and is now collecting actual performance data to help refine
the models when the specification goes to “Trial Use” status.
Shielded and unshielded front panels and modules
Card cages 3U to 9U
VITA 78-NGSIS: SpaceVPX Systems
Objective: This document describes an open standard for
creating high-performance, fault-tolerant, interoperable backplanes and modules to assemble electronic systems for spacecraft and other high-availability applications. Such systems
will support a wide variety of use cases across the aerospace
community. This standard leverages the OpenVPX standards
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VITA Technologies Resource Guide Summer 2015 |
11
MAIN FEATURE
SpaceVPX: Ready to launch
By Jerry Gipper
The Sentinel-1 satellite carries advanced
radar instrumentation that provides allweather, day-and-night images of Earth’s
surface. Photo courtesy of the European
Space Agency (ESA)/ATG medialab.
In April, VITA announced that VITA 78 SpaceVPX Systems had reached ANSI recognition as ANSI/VITA 78.00-2015.
The working group dedicated to the development of VITA 78 completed the VITA and ANSI processes, reaching full recognition
under guidance of the VITA Standards Organization (VSO). What is this new specification? What does it mean for the critical
embedded computing industry? Let’s take a look at how this specification originated.
More than three years ago, a group
of industry and government representatives focused on providing high-­
performance and highly efficient critical
embedded computing solutions for
customer needs launched the effort
to define the Next-Generation Space
Interconnect Standard (NGSIS). The initiative aimed to leverage existing commercial open standards to provide cost
savings across the life cycle of space
programs.
VITA 78 SpaceVPX was initiated to
change the paradigm by which the
space community conducted its acquisition of new technologies and systems.
VITA 78 adopted OpenVPX (VITA 65) as
its baseline architectural framework to
develop an enhanced set of module and
backplane specifications based upon
existing commercial standards with
added features required for the space
community and its applications. It also
focused on increasing interoperability
and compatibility between manufacturers and integrators, while simultaneously
boosting affordability through the use of standard sets of hardware.
Driving factors
Before VITA 78, the industry was struggling with how to move forward with certain
embedded computing platform issues that had presented challenges for many years.
Industry leaders asked themselves, “Is it cost-effective to continue using legacy space
electronics?” Systems had been developed and deployed in space via the same
methods for many years; why not just keep doing it the same way?
Several factors posed concerns to the architects of these complex systems:
›› Legacy space systems were often point solutions, designed for very
specific missions with no real intention of meeting additional goals of other
existing programs.
›› Reuse was not a priority because of precise mission design goals. The platforms
could not be readily reconfigured for new or changing missions.
›› Systems did not have the full range of redundancy options (dual-string, M-of-N,
etc.) built in as part of the overall architecture. As a consequence of this failure to
engineer redundancy and resiliency initially, the provider was forced to add these
features in a piece-by-piece fashion.
›› Internal interfaces were often proprietary and application-specific, leading to
additional costs and development time. Commercially and commonly available
interfaces often were not considered due to concerns about reliability or
availability.
12 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
›› Modules were not designed
to interoperate at either the
hardware or software level.
Silos of technology that prevented
programs from sharing platforms,
mission requirements, and schedules
were different enough that no one
wanted to take the time to look into
where components might be used
in the future.
Many if not all of these factors were
tolerated given the alternatives. Development schedules were set with systems
that agencies expected to be delivered
mission-capable and on time. In the
background, pressure was mounting to
reduce overall cost through reduction in
development and acquisition. Deployed
experiments with inexpensive computing elements were starting to have
successes. Cost reductions and time-tomarket pressures were relentless.
Enter VPX
The VPX concept was proposed in 2003.
It was originally intended to be a small
form factor blade using the current
switch serial fabric interconnects. Even
at the launch, the forefathers were not
sure where the efforts were going to
lead.
Even more improvements and enhancements emerged as systems were deployed,
with the most recent example being work nearing completion on system management
(VITA 46.11) and a modular power supply standard (VITA 62).
Slowly, to use a space themed cliché, “the stars were starting to align.” VPX had been
evolving with improvements to the overall framework, system management, interoperability, and functionality. In the background were industries ready to take advantage
of this alignment. Visionaries working on space and other critical embedded systems
needing a high degree of fault tolerance saw what VPX had to offer. The small size
made it a great choice for size, weight, and power (SWaP)-limited platforms. The
topology flexibility meant that they could conceive a configuration that more closely
met their application goals.
Fault-tolerant configurations were possible with various mesh topologies that
enabled various types of redundancy either with dual strings and multiple levels of
backup components. The open systems/open markets approach of VITA members
meant that new efforts would be embraced that leveraged the best that VPX and
VITA had to offer.
Goals and attributes
The SpaceVPX effort was initiated to develop an enhanced set of backplane specifications that were based upon existing commercial standards with added features
required for space applications. Another objective was to expand interoperability and
compatibility between manufacturers and integrators, while also increasing affordability through the use of standard sets of hardware.
The developmental goal of SpaceVPX Systems was to achieve an acceptable level of
fault tolerance while maintaining reasonable compatibility with the OpenVPX architectural framework and VPX components, including connector pin assignments. For
the purposes of fault tolerance, a module was defined to be the minimum redundancy
element.
The major fault-tolerance attributes for the target high-reliability applications included:
The specification was extremely open,
leaving room for nearly any existing or
future switch serial fabric to be implemented as an interconnect structure.
This meant that numerous configurations were possible, which quickly
led the implementers to launch the
OpenVPX effort to develop an architectural framework that could help
provide topology guidance to system
architects.
The nearly infinite number of configuration combinations, while attractive to
a system architect who was not sure of
the best topology for their needs, was
dragging down the board and system
supply chain that could not determine
the moving sweet spot of configurations. No one supplier was big enough
to drive an industry-wide accepted set
of configurations, and no demand-side
user wanted to step up and drive the
industry. The OpenVPX architectural
framework provided the much-needed
configuration focus.
www.vita-technologies.com
›› Dual-redundant power distribution (bussed), where each distribution is supplied
from an independent power source
›› Dual-redundant utility plane signal distribution (point-to-point cross-strapped),
where each distribution is supplied from an independent system controller to a
module that selects between the A and B system controllers for distribution to
each of the slots controlled by the module
›› Card-level serial management
›› Card-level reset control
›› Card-level power control
›› Dual-redundant data planes
›› Dual-redundant control planes
›› Fault-tolerant utility plane selection (bussed)
›› Power-feed profile with unique keying
›› Timing/synchronization/clocks, matched length, low-skew differential timing
As a result of analyzing these factors, the VITA 78 Working Group successfully ­executed
the focus of the SpaceVPX effort and composed a specification to fulfill its purpose.
What is SpaceVPX?
ANSI/VITA 78 defines an open standard for creating high-performance, fault-tolerant,
interoperable backplanes and modules to assemble electronic systems for spacecraft
and other high-availability applications. Such systems support a wide variety of use
cases and potential markets across the aerospace and terrestrial communities. The
standard leverages the OpenVPX standards family and the commercial infrastructure
that supports these standards.
VITA Technologies Resource Guide Summer 2015 |
13
MAIN FEATURE
Typical use case and essential
elements
Figure 1 captures the essence of a
SpaceVPX system. Each box represents
one module function. The main data
flow in most space systems is shown by
the blue boxes, typically implemented
as payload modules. Any of the four
functions can be combined into a specific payload implementation. The properties of this use case follow the circled
letters in the figure.
A) Data enters the system through a
data in module. The next four letters
represent potential data transfers
between the main payload functions
within a SpaceVPX system.
I
A
›
F
Primary
Power Module
Data In Module
Processing Module
Storage Module
Data Out Module
Controller Module
Control Switch Module
Data Sync Module
G
SpaceUM Module
SpaceUM Module
SpaceUM Module
Data Sync Module
Controller Module
Data Out Module
Storage Module
Processing Module
Data In Module
B
Control Switch Module
C
Power Module
›› Address not only interoperability,
as OpenVPX does, but also space
application needs that are not a part
of OpenVPX.
›› Define payload, switch, controller,
and backplane module profiles to
meet space application needs.
›› Add features to the utility plane for
fault tolerance:
– Point-to-point not bussed
to tolerate faults: A failure of
a module does not affect the
entire system. The meshed
network of modules provides
multiple strings to eliminate path
failures. The system also can be
scaled with redundant modules
to the degree necessary to gain
acceptable fault tolerance for
the mission at hand.
– Space Utility Management
(SpaceUM) module provides
a dual-redundant source for
utility plane implementations.
›› Define use of SpaceWire for
the control plane instead of
Ethernet, the preferred choice
for OpenVPX. SpaceWire is a
standard for high-speed links and
networks for use onboard spacecraft
(www.spacewire.esa.int/content/
Home/HomeIntro.php).
›› Promote standard components,
interoperability, accelerated
development, and deployment
for the space market.
E
D
SpaceUM Module
SpaceVPX bridges VPX standards to the
space market by accomplishing the following purposes:
H
Redundant
Figure 1 | SpaceVPX system use case
B) Data from the data in module can be transmitted to the processing module.
Processed data from the processing module can be stored in the storage
module. Data from the storage module can be routed to the data out module.
C) The processor module can access data from the storage module.
D)Data from the data in module can be routed directly to the storage module.
Data from the processing module can be routed directly to the data out module.
E) Data from the data in module can be routed directly to the data out module.
F) Data routed to the data out module can then be transmitted out of the system.
G)For fault tolerance, there is at least one spare of each function. These redundant
payloads have the same data routing as the primary payloads so that errors will
not reduce capabilities. Though not shown, more than one of each function type
can be present, and M-of-N sparing (minimum 1 of 2) can be implemented for
any payload type.
H) Redundant external inputs and outputs are available to and from the SpaceVPX
system. These are typically cross-strapped between redundant elements.
I) Cross-strapping is available between the primary and redundant payload groups
so that any one payload can fail and the remaining payloads can operate with
sufficient interconnect for any combination of primary and redundant elements.
Fault tolerance
The SpaceUM module facilitates the fault-tolerance capability in SpaceVPX. A traditional VPX system controller controls utility plane signal distribution to all the logic
modules. As shown in Figure 2, each system controller routes identical copies of
utility plane signals (for example, resets, reference clocks, and so on) to each active
SpaceUM module.
Since each SpaceUM module supports the utility plane selection of up to two (3U)
or eight (6U) logic modules, a SpaceVPX system supports up to four SpaceUM modules. The SpaceUM modules then select which set of utility plane signals to route to
each logic module. The default OpenVPX routing of these utility plane signals are via
busses, which introduce single-point failures between the modules. Fault tolerance is
enhanced with the separate radial distribution of the selected utility plane signals to
each module. The SpaceUM module is unique to SpaceVPX.
Utility plane power connections are also routed through the SpaceUM modules in a
SpaceVPX system. The utility plane power connections consist of at least dual power
modules to provide power to the SpaceVPX system. The SpaceUM modules individually select and separately route the resulting module power selection for each logic
module. The A/B selection can be internal (autonomous) or external.
14 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
C
A
E
C
A
E
Primary
›
B
Power Module
Data In Module
Processing Module
Storage Module
Data Out Module
Controller Module
Control Switch Module
Data Sync Module
SpaceUM Module
SpaceUM Module
SpaceUM Module
SpaceUM Module
Data Sync Module
Control Switch Module
Controller Module
Data Out Module
Storage Module
Processing Module
Data In Module
Power Module
D
Redundant
Figure 2 | SpaceVPX system use case showing system controller and utility plane
connections
Fault tolerance is provided by fault containment between redundant sections of each
SpaceUM module. OpenVPX supports a single power mode for each plug-in logic
module. SpaceVPX maintains this by moving the power selection into the SpaceUM
module.
As shown Figure 2, the system controller manages the utility plane signals in a
SpaceVPX system.
A) SYS_CON* and SYS_CONP* provide a fault-tolerant selection for plug-in
modules that could be system controllers.
B) Controller modules distribute copies of the system control and reference clocks
to each active SpaceUM module.
C) SpaceUM modules use the system controller select signals (either external or
internally generated) to select which set of system control and reference clocks
to distribute to logic modules.
D)SpaceVPX supports switching of up to 32 6U logic modules using up to four
SpaceUM modules, each handling eight logic modules. In this figure, only two
SpaceUM modules are needed to support the 14 logic modules. If more than two
logic modules were added to this system, the third SpaceUM would be required
for the 17th through 24th module, and the fourth SpaceUM would be required
for the 25th through 32nd modules. A 3U SpaceUM module supports only
two logic modules. Since the SpaceUM modules are simply extensions of the
controller, payload, and power modules, no redundancy is required.
E) The SpaceUM module distributes the utility signals to all other logic modules
including payloads, data switches, and control switches.
Benefits to customers and vendors
Performance
SpaceVPX provides significantly higher data rates and topology configurability supported by NGSIS through a standard engineered product compared to traditional
space interconnect architectures such as MIL-STD-1553, SpaceWire, serial RapidIO,
and CompactPCI. The standard also allows implementers to trade off redundancy for
performance in accordance with their specific system needs.
Flexibility
Based on the highly configurable Modular Open System Approach (MOSA) architecture, SpaceVPX supports both common 3U and 6U form factors with a wide range of
modules and configuration options to allow mission-specific customization.
Affordability
Leveraging and extending existing modern standards provides a significant pay
down of technical debt compared to more traditional approaches for space systems
www.vita-technologies.com
development (and other recent space
standards efforts) based on custom and
proprietary architectures. The maturity of the base standards significantly
reduces the cost, risk, and schedule for
the non-recurring engineering efforts
associated with the development of
custom modules.
Furthermore, designers have the
capacity to leverage existing reference
designs and intellectual property components in custom implementations. The
approach potentially enables the use of
ruggedized commercial off-the-shelf
modules in future space systems with
appropriate environments, resulting in
a corresponding reduction in development costs and schedules.
Interoperability
The a priori definition of the interface
specifications contained in the standard offers several interoperability benefits. This breaks down the traditional
stovepipe and associated challenges
of interface management by providing
a well-defined common interface that
allows for conformance verification
without a complete system.
Additional potential benefits include:
›› Specific design profiles upon
which vendors can base their
designs and integrators can specify
as requirements.
›› Reduced integration issues
resulting in faster development and
deployment time.
›› Higher board volumes that produce
economies of scale.
›› Higher velocity of technology
upgrades.
›› Support for higher backplane
signaling speeds as technology
matures.
Addressing market needs
These benefits demonstrate how
SpaceVPX addresses the aforementioned driving factors propelling the
development of an open standard for
backplanes and modules used in space
applications.
Systems were originally tightly coupled
with proprietary integration schemes,
and changes were costly and involved
high risk. Open system architecture
VITA Technologies Resource Guide Summer 2015 |
15
MAIN FEATURE
guidelines and the SpaceVPX standard
deliver a loose coupling between hardware and software, making changes
easier at a much lower risk. Systems can
now be designed for change. Table 1
compares some of the significant differences between the VPX and SpaceVPX
specifications.
Hardware reuse was less attractive
because system cost was dominated
by non-recurring engineering costs that
were much greater than the hardware.
A SpaceVPX open architecture strategy
drives these costs down because system
integration is much easier and entails
lower risk.
Prime contractors had a central role
for the life of the system, which limited design and mission flexibility. Sole
sourcing also stifled competition, keeping
costs high. An open architects/open markets approach provides more solutions to
choose from a competitive supplier base.
A large and robust ecosystem of suppliers and users ensures that the technology moves forward with the best of
the best capabilities. SpaceVPX brings
traditional make versus buy advantages to what was previously a closed
community (other industries embraced
the buy decision years ago).
compared to the SpaceVPX base standard that results in a smaller SWaP-C
footprint for deployment.
SpaceVPX current status
The ratification of VITA 78 SpaceVPX
Systems was a huge milestone for the
working group members. Now begins
the work of building an ecosystem of
suppliers and users. Multiple VPX vendors have shown interest in supplying
products based on the SpaceVPX specification. Though public announcements
have yet to be made, rumors are circulating that prototype products could be
available as early as Q3 or Q4 of 2015.
Demand is very active. Multiple large
programs are developing SpaceVPX
strategies. Multiple NASA centers have
evaluations underway for adoption of
both 6U and 3U formats. The European
Space Agency (ESA) has shown interest,
as well as multiple tier I and tier II vendors.
Additional work is still needed with
SpaceVPX. The VITA 78 Working Group
has already started work on SpaceVPX
Lite, which defines a lightweight implementation with significant advantages
in SWaP-C for 3U module systems.
It is “lightweight” with respect to
the reduced scope of requirements
Systems developers often implement 3U
modules when confronted with driving
SWaP-C constraints. The SpaceVPX
base standard implementation for 3U
results in a much larger ratio of support
modules to payload modules than for a
6U implementation. The SpaceVPX Lite
specification defines a reduced support
module to payload module ratio by
removing some base standard features
while retaining critical requirements
necessary to deploy a single-point
­
failure-tolerant system.
SpaceVPX Lite has the following differences with SpaceVPX:
›› SYSRESET*, AUX_CLK±, and REF_
CLK± are driven from redundant
controller modules directly to
payload modules.
›› SpaceVPX defined REF_CLK1±
and REF_CLK2± pins on payload
modules are used as secondary
AUX_CLK± and REF_CLK±,
respectively. OpenVPX Maskable
Reset* on payload modules are
used as secondary SYSRESET*.
VPX
VPX with VITA 46.11
SpaceVPX 6U
SpaceVPX 3U
Clocks generation
2 bussed
2 bussed
4 radial
2 radial
Clocks receipt
2 inputs
2 inputs
4 inputs
4 inputs
4 pins bussed
4 pins – either bussed or radial
4 pins radial
4 pins radial
SM I/F receipt
4 pins
4 pins – IPMC single or
dual port
4 pins IPMC or DAP
single port
4 pins IPMC or DAP
single port
SM I/F extensions
none
none
reset, status for recovery
reset, status for recovery
Power switching
on/off on card
under SM control
on/off on card
under SM control
on/off on card
under SM control
on/off on card
under SM control
A/B and on/off on SpaceUM
under SM control
A/B and on/off on SpaceUM
under SM control
SM I/F generation
Power supplies
Logic module
system
›
VITA 62
VITA 62
VITA 62 A&B or
MOD6-PSC-10T-12.7.1 A&B
VITA 62 A&B
SM interface
SM interface
SM interface
SM interface
1 PS
2 controller
1 PS
2 controller
2 PS
2 controller
2 PS
2 controller
6 logic
6 logic
6 logic
1 SpaceUM
6 logic
4 SpaceUM
9 slots
Limited fault tolerant
9 slots
Limited fault tolerant
11 slots
Full fault tolerant
14 slots
Full fault tolerant
SM = System Manager
Table 1 | Key differences between VPX and SpaceVPX specifications
16 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
›› Redundant controller modules
provide eight sets of two new userdefined differential pairs that can
be driven to each of eight payload
modules. These can be defined
as controls to switch in redundant
power sources, additional clocks, or
specific application-defined signals.
›› Power supply on/off, primary/
secondary controls are not defined
in SpaceVPX Lite.
›› Radially distributed system
management is not defined in
SpaceVPX Lite.
›› SpaceVPX Lite does not define
a SpaceUM module, but it does
support the use of a similar
power-only module and system
management bus communication
with the system controller module
using the SpaceVPX Direct Access
Protocol or VITA 46.11 System
Management.
A SpaceVPX Lite-compliant system
meets the basic requirements of providing radial and redundant OpenVPX
utility signals SYSRESET*, AUX_CLK±,
and REF_CLK± to achieve single fault
tolerance. Implementation of single
fault-tolerant power distribution to
the modules is deferred to the user to
define, but the standard does provide
radially distributed user-defined signals
to enable redundant power control.
These signals can be used with new or
high TRL existing power distribution
modules and/or sources.
A standard for building open
platforms
“We are pleased that SpaceVPX Systems
has received VITA/ANSI recognition,” said
Patrick Collier, senior electrical research
engineer, Space Communications Program, AFRL Space Vehicles and VITA 78
Working Group chair. “We were able to
pull together the minds of engineers from
companies around the world that have a
vested interest in developing this specification for the space industry.”
Other application segments are looking
at this model to determine the best
steps forward. Rugged ground vehicles
have many of the same requirements,
yet they have unique needs. VPX and the
VITA process are just the technology and
support system that the industry needs
to develop variations of their own.
www.vita-technologies.com
The openness of VPX originally scared people, but in reality, it is providing a proven
alternative for custom solutions. Mass customization is the use of well-defined modules, either hardware or software, that enables a system architect to develop an integrated platform that is both unique and commercial. A modular mass-customization
strategy combines the best of an open-modular approach with the ability to tune the
architecture to meet a wide variety of very specific or custom needs – all while being
cost-effective.
We all look forward to attending the first launch of a space system based on SpaceVPX
systems!
Copies of the specification are available for purchase
at the VITA Online Shop (http://shop.vita.com/).
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VITA Technologies Resource Guide Summer 2015 |
17
SPECIAL FEATURE
Eike Waltz
Kim Clohessy
VITA Technology Hall of Fame 2015 Inductees
Kim Clohessy
Kim Clohessy was a founding vice president of Dy 4 Systems in Ottawa, where he was recruited from
Bell Northern Research. Dy 4 Systems, which was formed in 1979, specialized in the design and manufacture
of high-end VMEbus open architecture computer systems for the aerospace and defense industry.
Kim helped Dy 4 Systems grow successfully before leaving in 1992 to move to Scottsdale, Arizona, as
a consultant for Ottawa-based Object Technologies and as vice president of Embedded Systems at IBM.
In 2000 he transferred to Perth, Australia, where he soon resigned from IBM to form a new company.
During the early 1990s, Kim did much of the heavy lifting in terms of editing the work being done on
the second generation of the VMEbus specification. He was an avid sailor and diver who enjoyed sailing and
racing on the Swan River and the Indian Ocean.
Kim passed away in 2006 at 52 years of age, after a short battle with melanoma.
Key contributions
›› 1990: Kim joined Doug Patterson as Mil-Spec Study Group co-chair.
›› 1991: VME64 (1014 Rev. D) was introduced and submitted to IEEE, raising the theoretical bus speed
from 40 MBps to 80 MBps. The IEEE granted project authorization request (PAR) for P1014R (revisions to
the VMEbus specification). Kim co-chaired the activity with Ray Alderman, technical director of VITA.
›› 1992: Additional enhancements to VMEbus (A40/D32, Locked Cycles, Rescinding DTACK*, Autoslot-ID,
Auto System Controller, and enhanced DIN connector mechanicals) required more work to complete
this document. The VITA Technical Committee suspended work with the IEEE and sought accreditation
as a standards developer organization (SDO) with the American National Standards Institute. The IEEE
subsequently withdrew the original IEEE PAR P1014R. The VITA Technical Committee returned to using the
public domain VMEbus C.1 specification as its base-level document, to which it added new enhancements.
Kim carried out the tremendous undertaking of the document editing with assistance from Frank Hom,
who created the mechanical drawings, and with exceptional contributions by each chapter editor.
18 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
Eike Waltz
Eike Waltz was a familiar face at VITA Technical Committee meetings in the early days. He was passionate
about the mechanical aspects of VMEbus and served as the driving influence in many of the decisions made to
guide the development of the mechanical specifications for VMEbus.
Eike received special recognition for his extensive contribution to the mechanical chapter (Chapter 7), which
was incorporated into Revision C, ANSI/IEEE Std 1014-1987, and ANSI/VITA 1-1994 (S2011).
Eike was a technical sales manager at Schroff, an English company headquartered in Warwick, Rhode
Island. He was a representative of the British Standards Institute committee on IEC 48D from 1976 to 1983.
He also was a member of the IEEE P1014 (VMEbus) committee, as well as a coordinator for the central IEEE
mechanical (IEC 297-3/3A) specification. Eike was instrumental in evangelizing VMEbus at the beginning of
the standard’s development.
Key contributions
›› 1984: Eike directed VMEbus mechanical design effort and documentation.
Tom Hall
Tom Hall spent numerous years in the VMEbus COTS industry selling and marketing
military-spec VMEbus computer products to leading defense contractors and government departments throughout the world. He was a leading force in the development
of technologies and major market segments while working at Plessey Microsystems,
Radstone Technology, PEP Modular Computers, and Thales Computers.
Tom was responsible for the operation and major sales of Radstone Technology’s military products division. He also was president and CEO of PEP Modular Computers in
Pittsburgh, where he was responsible for restructuring the German-based company’s
U.S. operation. Tom later became the president and CEO of Thales Computers in
Raleigh, North Carolina, a supplier of PowerPC and Pentium-based VME computing
hardware, software, and system solutions.
Key contributions
›› 1985: Tom promoted DIN connectors for defense applications.
›› Started and shepherded the 1101.2 IEEE specification (conduction cooling)
while working at Radstone Technology.
›› 1997 to 2000: Member of VITA Board of Directors representing PEP Modular
Computers.
PCI Mezzanine Cards
In the mid-1990s the embedded computing industry became entrenched in a heated
debate over mezzanine card standards for 3U and 6U boards. At one point, 22 different proposals were on the table, not to mention at least as many more proprietary
options. S-bus, advocated by Sun Microsystems, was gaining traction.
That all changed when a handful of industry-leading companies placed their bet on
the emerging efforts led by Force Computers and Digital Equipment Corporation to
marry S-bus mechanicals with the PCI bus.
In 1994 a number of companies joined together to launch the “We Agree … It’s PMC!”
campaign, including Concurrent Technologies, Digital Equipment Corporation, Force
Computers, Heurikon, Intel, Interphase, Mercury Computer Systems, Molex, Motorola
Computer Group, Newbridge Microsystems, Schroff, Themis Computer, and Vigra.
Architectures supporting PMC included VMEbus, VME64, Futurebus+, Multibus I, and
Multibus II.
A PCI Mezzanine Card or PMC is a printed circuit board manufactured to the IEEE
P1386.1 standard (chaired by VITA Technologies Hall of Famer Wayne Fischer). This
standard combines the electrical characteristics of the PCI bus with the mechanical
www.vita-technologies.com
›
Figure 1 | The PMC standard
unites the electrical characteristics
of the PCI bus with the mechanical
dimensions of the CMC format and
defines the connector pins to be
used for specific PCI signals.
dimensions of the Common Mezzanine
Card or CMC format (IEEE 1386 standard, see Figure 1).
A PMC can have up to four 64-pin bus
connectors. The first two (P1 and P2) are
used for 32-bit PCI signals; a third (P3) is
needed for 64-bit PCI signals. An additional bus connector (P4) can be used
for non-specified I/O signals. In addition, arbitrary connectors can be supplied on the front panel or bezel.
The PMC standard defines which connector pins are used for which PCI signals. It also defines the optional 64 P4
connector pins for use of arbitrary I/O
signals.
Carrier cards that accept PMCs are usually made in the Eurocard format, which
includes single-, double-, and tripleheight VMEbus cards, CompactPCI
cards, and more recently, VPX cards.
One PMC fits on a standard 3U carrier
VITA Technologies Resource Guide Summer 2015 |
19
SPECIAL FEATURE
card, while 6U models (typical for VMEbus cards) can carry up to two PMCs. Lowprofile motherboards also can take advantage of the PMC architecture.
The PMC specification evolved into Processor PMC (PrPMC), which added extensions
so the PMC could act as a bus master, making it possible for it to be the host processor
card in a system.
Key milestones
›› 1994: PMC (IEEE P1386.1) emerged out of efforts led by Force Computers
and Digital Equipment Corporation to combine S-bus mechanicals with the
PCI bus.
›› 1994: DEC demonstrates PMC on an Alpha VME board.
›› 2000: PMC P4 (ANSI/VITA 35) provides pin assignments for PMC P4 connector
to VME P0 and P2 connectors.
›› 2001: Conduction-Cooled
PMC (ANSI/VITA 20) – Defines
the mechanical requirements for
compliance with conduction-cooled
PMC modules.
›› 2003: PrPMC (ANSI/VITA 32) –
Incorporates a set of extensions to
the PMC standard, which creates
a new class of PrPMC cards.
›› 2003: PCI-X for PMC and PrPMC
(ANSI/VITA 39) – Integrates the
PCI-X bus capability from PCI bus
to PMC-based products.
›› 2008: XMC: Switched Mezzanine
Card base specification was
introduced, bringing switch fabric
interconnection to mezzanine
cards for 3U and 6U.
VME64
VMEbus started on its path to significant
performance improvements while still
remaining backwards compatible with
legacy systems with the introduction of
the VME64 concept. In 1989, John Peters
of Performance Technologies developed the initial concept of VME64: multiplexing address and data lines (A64/
D64) on the VMEbus. The concept was
demonstrated the same year and submitted to the VITA Technical Committee
in 1990 as a performance enhancement
to the VMEbus specification.
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Key milestones
›› 1989: John Peters and
Bill Mahussen (Performance
Technologies) developed the
use of 64-bit multiplexed block
transfer (MBLT) cycles and
presented the VME64 concept
to the VITA Technical
Committee.
›› 1990: Newbridge Microsystems
released DARF 64 VME64 silicon.
›› 1990: Performance Technology
won the BUSCON Product of the
Year award for VME64.
›› 1991: VME64 (1014 Rev. D) was
introduced and submitted to IEEE,
raising the theoretical bus speed
from 40 MBps to 80 MBps. The
IEEE granted project authorization
request (PAR) for P1014R (revisions
to the VMEbus specification).
Kim co-chaired the activity with
Ray Alderman, technical director
of VITA.
www.vita-technologies.com
“VMEBUS STARTED ON ITS PATH TO SIGNIFICANT
PERFORMANCE IMPROVEMENTS WHILE STILL REMAINING
BACKWARDS COMPATIBLE WITH LEGACY SYSTEMS WITH
THE INTRODUCTION OF THE VME64 CONCEPT.”
›› 1992: Additional enhancements proposed to the VME64 specification were
placed in VITA subcommittee: the VME64 Extensions Document. Two other
activities began in late 1992: (1) VMEbus Board-Level Live Insertion specifications
(BLLI), and (2) VMEbus System-Level Live Insertion with fault tolerance (VSLI).
›› 1992: Newbridge Microsystems marketed the SCV64 single-chip VME64
interface.
›› 1993: VITA subcommittees completed VME64.
›› 1994: VERO Electronics offered a VME64 backplane.
›› 1994: VME64 (ANSI/VITA 1) became the first VITA specification to receive ANSI
approval. It defines the main body of the VMEbus specification and includes both
32- and 64-bit usage models.
›› 1996: IP I/O Mapping to VME64x (ANSI/VITA 4.1) was approved, defining the pin
assignments from IP modules to the VME64x P0 and P2 connectors.
›› 1997: VME64 Extensions (ANSI/VITA 1.1) was approved as an extension to the
VME64 specification, including the 160-pin connector, geographical addressing,
and added power pins.
›› 1997: VME64x 9U x 400 mm Format (ANSI/VITA 1.3) – Defines a 9U x 400 mm
board layout for use within the VMEbus framework.
›› 1998: VMEbus International
Physics Association (VIPA, which
includes CERN, Fermilab, and
labs in Japan) rolled out VME64
Extensions for Physics (ANSI/
VITA 23), which defines a series
of recommended practices for
the use of VMEbus in the physics
community.
›› 2000: Keying for ConductionCooled VME64x (ANSI/VITA 1.6)
was approved for VMEbus
technology.
›› 2003: Gigabit Ethernet on VME64x
Backplanes (ANSI/VITA 31.1) –
Defines a pin assignment and
interconnection methodology for
implementing a 10/100/1000BASE-T
Ethernet switched network on a
VME64x backplane.
2eSST – ANSI/VITA 1.5-2003
(R2009)
This specification is an extension of the
ANSI/VITA 1-1994, VME64, and ANSI/
VITA 1.1-1997, VME64x specifications. It
defines a transfer protocol based upon
source-synchronous concepts that permits the VMEbus to operate at rates
LCR Embedded System’s complete line of integrated rugged
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www.vita-technologies.com
VITA Technologies Resource Guide Summer 2015 |
21
SPECIAL FEATURE
to at least 320 MBps. As technology
improves, this rate can be extended to
higher levels. The 2eSST specification
emerged out of the MBLT and 2eVME
concepts that extended the performance
of VMEbus data transfers. Figure 2 compares the VME64 and 2eSST standards.
Thales Computers designed the Alma2e
bridge supporting the 2eSST protocol
in 2002. Tundra Semiconductor, working
with Motorola, brought the Tsi148 PCI/Xto-VME2eSST bridge to market in 2004,
making the 2eSST protocol available to
the entire industry. Concepts exist to
enhance VME2eSST that could increase
performance to more than 1 GBps.
The 2eSST protocol requires low skew
between signals and monotonic rising
and falling edges on the signals. To
meet these requirements, limited length
backplanes, special backplane topologies, and/or enhanced transceivers
are required. The specification calls for
enhanced bus transceivers with controlled rise and fall times, tightly defined
thresholds, low part to part skew, and
low-voltage transistor-transistor logic
(LVTTL) levels. During the development of this standard, specific transceivers were developed to meet these
requirements.
As a source-synchronous protocol, the
performance of 2eSST is determined
not by the propagation delay from
source to destination, but by skew – the
variation in propagation delay through
the drivers, backplane, and receivers. As
VME64 Protocol
1
Master: Data
Master: Strobe
Slave: Acknowledge
2eSST Protocol
Sender: Data
1
2
3
4
5
6
7
8
Sender: Strobe
›
Figure 2 | This iconic image illustrates a comparison of the VME64 and 2eSST standards.
the skew decreases, system bandwidth can increase. In theory, a source-synchronous
protocol is virtually unlimited in its potential transfer rate. This standard provides for
transfer rates of 160, 267, and 320 MBps with a 21-slot backplane. New transfer rates
can be defined as the technology improves.
In developing the 2eSST protocol, several important objectives were considered:
›› Maximize performance: Performance was the driving impetus for this new
protocol. To meet this objective, the protocol was designed to ensure that all
devices involved in the transfer would operate as fast as possible.
›› Minimize complexity: The 2eSST protocol was designed to minimize the
amount of logic that would be required to implement the protocol.
›› Minimize application limits: The 2eSST protocol can be used in 3U, 6U, and
9U environments.
›› Maintain compatibility: The 2eSST protocol was designed to be compatible
with legacy VMEbus products.
Key milestones
›› 1996: 2eVME protocol was proposed for VMEbus, allowing data transfers on
both clock edges, thus doubling the VMEbus bandwidth.
›› 2003: 2eSST (ANSI/VITA 1.5) – Defines VME protocol that allows data transfers
up to 320 MBps.
Official nomination process
The VITA Standards Organization has developed a simple nomination and selection process that is loosely based
on the NFL Hall of Fame process.
Any “fan” may nominate any qualified individual, team of individuals, company, product, or technology to
the VITA Technologies Hall of Fame via the nomination form on the Hall of Fame website. The only restriction
is that the nominee must have made a significant impact on the critical and intelligent embedded computing
industry.
This is a great way for the industry to show our appreciation for the contributions that have made this industry
such a success. Be sure to submit your nominations now for consideration in the class of 2016.
Links
›› Main page: http://opensystemsmedia.com/hall-of-fame/vita-technologies
›› Nomination guidelines and nomination form: http://opensystemsmedia.com/hall-of-fame/vita-technologies/
nomination-guidelines
22 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
Optimizing SWaP
is our passion.
MEET A BRAND NEW CES AT CES-SWAP.COM
THE SWISS RUGGED COMPUTERS COMPANY HAS A NEW LOOK!
We design and manufacture rugged embedded computers engineered to meet
the most demanding performance requirements with optimal Size, Weight and
Power (SWaP) considerations.
CES-SWAP.COM
TECHNOLOGY FEATURE
Product teardown:
Maximizing functionality
through dual-node processing
By Jerry Gipper
Aerospace and defense applications must support higher-bandwidth sensor input, more complex intersystem
communications, and greater security for certain operations and related custom algorithms, all while contending with budget
and schedule pressures. In addition to these broad challenges, application areas such as mission computing face the added
difficulty of designing systems that meet restrictive size, weight, and power (SWaP) constraints. Increasing function density
within a current space envelope is a common way of addressing these challenges.
Curtiss-Wright offers a VPX SBC – the
VPX6-195 – that presents some interesting solutions to enabling today’s
complex applications. One major characteristic about the VPX6-195 that
makes it stand out from other boards is
its dual-node SBC architecture. The dual
processing nodes are completely independent of each other, helping address
SWaP constraints and performance
challenges in ways that are not possible with a traditional single-node SBC.
In essence, the VPX6-195 is two independent processor nodes in a single 6U
slot package.
How is this done?
Curtiss-Wright designed the VPX6-195
right from the start to operate as two
nodes. It has two Freescale T2080 quadcore 64-bit CPUs. Each processor has
its own independent memory and I/O
subsystems with backplane access. The
VPX6-195 supports a rich I/O complement per processing node, which includes two
GbE ports (one 1000BASE-BX and one 1000BASE-T), four serial channels, discrete and
differential digital I/O, USB 2.0 ports, and an XMC site.
THE DUAL PROCESSING NODES ARE COMPLETELY
INDEPENDENT OF EACH OTHER, HELPING ADDRESS SWAP
CONSTRAINTS AND PERFORMANCE CHALLENGES IN WAYS THAT
ARE NOT POSSIBLE WITH A TRADITIONAL SINGLE-NODE SBC.
Where the board starts to be distinctive is with the addition of a dedicated Xilinx
Kintex FPGA and XMC slot to each node. The standard product comes equipped
with a Kintex K70T FPGA, but can also be ordered with a larger Kintex K325T FPGA.
The only common elements are system-level functions including intelligent platform
management interface (IPMI), real-time clock (RTC), and temperature sensors.
The VPX6-195 provides four 10GBASE-BX4 ports for the VPX data plane fabric, two
ports from each processing node to the VPX P1 connector. The processing nodes are
also connected by two 10GBASE-KR ports for internode communication. For red/
black (unencrypted/encrypted) applications, this can be disconnected.
24 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
Each processing node has a PCI Express
(PCIe) connection to the expansion plane
on the VPX P2 connector. Depending on
the variant, the expansion plane connection can either be a four PCIe Gen2 port,
two x4 Gen2 ports, or a single x8 PCIe
Gen2 port.
SBC 1
FPGA
VPX6-195
XMC
SBC 1
Processor
FPGA
To cost-effectively address a diverse
range of military/aerospace applications, the VPX6-195 is available in a
range of ruggedization levels, both airand conduction-cooled. All versions are
functionally identical, with air-cooled
versions available in Curtiss-Wright ruggedization Levels 0 and 100, and conduction-cooled versions in Levels 200
and 300 with line replacement module
(LRM) covers.
Since each node on the VPX6-195 is
independent of its mate, each can run a
different operating system and applications. The card is supported by a suite
of U-Boot, real-time operating system
(RTOS) BSPs, communication libraries,
and signal processing libraries. Throw
on a hypervisor-enabled OS, and you
can start to see some interesting ways
to split the system.
Applications
SWaP-C optimization
The dual-node architecture means
that two slots can be consolidated
into one (see Figure 1). The impact on
size is a reduction in card slots from
two to one, with a possible reduction
in mezzanine slots from four to two if
the previous boards had mezzanine
capability. Weight per slot is immediately reduced by 50 percent. Power
dissipation is approximately the same,
assuming the power on the SBCs being
replaced is the same as a single node
on the 195, but a higher performance/
watt can be assumed. At the slot level,
a VPX6-195 has power requirements
as low as 80 W. System robustness has
potential for improvement by reducing
modules; however, it may remain nearly
unchanged if the gained space is utilized. The cost impact is variable and
dependent on the specific costs of
boards that are being replaced and the
utilization of the added capability of
the FPGAs.
www.vita-technologies.com
FPGA
XMC
SBC 1
Processor
FPGA
SBC 2
XMC
Processor
XMC
Processor
›
Figure 1 | Transformation from two slots to one slot
Red/black processing
Secure separation of red/black processing elements within a computing system is
increasingly important for both commercial and defense system applications. Recent
systems have taken advantage of hypervisor OS software to isolate systems, but with
the VPX6-195, two truly independent hardware systems can also occupy the same VPX
slot ­– the most secure and easiest to validate.
On the VPX6-195 any link between the two nodes can be disconnected by assembly
population option, configuring the 195 as two independent SBCs on a single card.
Curtiss-Wright has included other protections to ensure trusted computing and secure
boot. Each node’s FPGA has space for customer specific security functionality. The
T2080 processor supports Freescale’s Secure Boot architecture, with the ability to
boot encrypted images so external key storage is not needed.
Mission computer applications
Many applications place the highest priority on processing performance. With the two
Freescale T2080 quad-core 64-bit CPUs, the user gets the performance of the processors plus that of the Kintex FPGAs. Mission-specific IP can be loaded into the FPGAs
to add functionality or offload application-specific processing.
ISR applications
Intelligence, surveillance, and reconnaissance (ISR) applications are specific cases that
often need intense processing performance and complex I/O processing. The Xilinx
Kintex FPGA comes in two sizes – the largest possible – to meet the most demanding
ISR applications.
Advancements expand possibilities
Technology has evolved to enable configurations that were simply not possible a few
years ago. Putting the functionality of a single processing node in a single 6U slot was
a major challenge 10 years ago. Today you can put two on a single-slot 6U board and
still have plenty of space for custom functionality in a large FPGA. Processor performance, FPGA density and performance, high-speed serialized I/O, and great strides
in power utilization continue to make it possible to do the impossible.
Curtiss-Wright has posted a white paper titled “Enabling Complex Applications with a Dual Node Single Board Computer” with more details on using the
VPX6-195 (see www.cwcdefense.com/products/single-board-computers/6u-ppc-sbc/
vpx6-195.html).
VITA Technologies Resource Guide Summer 2015 |
25
PRIMETIME CHOICES
Deployment in scalable subsystems right to the tactical edge
Taking the server on 3U VPX a step further, Mercury Systems is adding a Xilinx FPGA.
The rugged OpenVPX Ensemble LDS3506 processing module integrates an Intel Xeon
processor D system-on-chip (SoC) with Xilinx’s UltraScale FPGA in a size, weight, and
power (SWaP)-constrained 3U package. This dense union of best available commercial
item general processing and FPGA resources produces a highly versatile, affordable, and
interoperable building block for embedded, high-performance computing applications
with additional low-latency, refresh, and mission capabilities.
The Ensemble LDS3506 leverages Mercury’s fourth generation of highly SWaP-efficient packaging technology to securely deliver the
Intel Xeon processor D product family for reliable deployment in scalable subsystems right to the tactical edge. The Ensemble LDS3506 is a
dense, powerful combination of general server-class and low-latency front-end FPGA processing in an open systems architecture module.
“With over 256 peak GFLOPS of general processing power from the Intel processor alone, the Ensemble LDS3506 represents a disruptive
force in the 3U embedded market space,” said Ian Dunn, VP of Mercury Systems’ Embedded Products group. “It is the unique combination
of this latest Intel technology combined with the low-latency and versatile FPGA resources that delivers a potent compute solution for
multidimensional SWaP-constrained applications, particularly those that are sensitive to performance and latency, such as electronic
warfare (EW), electro-optical/infrared (EO/IR), image intelligence (IMINT), and other mission or sensor processing applications.”
Mercury Systems, Inc. • www.mrcy.com • www.vita-technologies.com/p372704
High-performance DSP and FPGA board for harsh environments
DSP, ARM, and FPGA all on one board! The VPX-D16A4-PCIE from CommAgility is a rugged,
high-performance DSP- and FPGA-based module in the 3U OpenVPX form factor. The module
is ideal for electronic warfare (EW), software radio, imaging, or radar applications that require
very high signal processing performance in the robust VPX form factor for deployment in
harsh environments.
The VPX-D16A4-PCIE is based on a Texas Instruments (TI) TCI6638K2K KeyStone-based
system-on-chip (SoC) and a TMS320C6678 SoC, which between the two chips contain
16 C66x DSP cores and four ARM Cortex-A15 cores, as well as baseband and networking
accelerators. The two SoCs are closely coupled with TI’s HyperLink bus as well as Gigabit Ethernet. Each device has its own 2 GB DDR3
memory bank. The VPX-D16A4-PCIE includes a 10 Gbaud 2x PCI Express interface to the VPX backplane for each of the two onboard SoCs.
For additional I/O or coprocessing, the main DSP is connected via PCI Express and the AIF2 CPRI interface to a Xilinx Kintex-7 K325T FPGA,
which also has Gigabit Ethernet and its own backplane MGT connections. The FPGA has multiple LVDS, GPIO, and serial connections to the
P2 connector to enable interfacing to an RTM with specialized I/O such as multichannel RF or high-speed ADC/DAC interfaces.
CommAgility • www.commagility.com • www.vita-technologies.com/p372606
Server-class processing on 3U VPX
Processor technology advances have made it possible to put server-class
processing power into a 3U VPX module that is designed for size, weight, and power
(SWaP)-constrained applications. The XPedite7670 3U OpenVPX REDI SBC and its
6U VPX companion, the XCalibur4640, from Extreme Engineering Solutions are both
based on the Intel Xeon D processor family. A rich feature set as well as native extended
temperature support in the processor eliminate the need for advanced individual unit
screening and provide enhanced reliability in extreme environments.
The XPedite7670 maximizes network performance and connectivity with two 10 Gigabit
Ethernet interfaces and four Gigabit Ethernet interfaces. Local storage of up to 64 GB of
SLC NAND flash allows an operating system and application to be installed directly onto
the XPedite7670.
The XCalibur4640 extends functionality to the 6U VPX form factor. System memory capacity increases to 16 GB of DDR3-1600 ECC
SDRAM and local storage increases to 128 GB of SLC NAND flash. Two additional 10 Gigabit Ethernet interfaces provide a total of four
interfaces to the backplane. Sixteen lanes of PCI Express 3.0 routed to the backplane can be configured to support multiple peripherals.
Four SATA 6 Gbps ports on the backplane allow for storage expansion in the system. Two XMC/PMC sites, each with a dedicated x8
PCI Express 3.0 link, enable additional expansion options.
Extreme Engineering Solutions, Inc. (X-ES) • www.xes-inc.com • www.vita-technologies.com/p372624 & www.vita-technologies.com/p372737
26 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
PRIMETIME CHOICES
Enable huge swaths of bandwidth to be scanned for
signals of interest
Signal processing is all about signals and bandwidth. The CHAMP-WB OpenVPX
board family, a rugged VPX board set from Curtiss-Wright Controls Defense
Solutions, raises the product’s sampling rate from 12.5 GSps to 25 GSps. The
CHAMP-WB can be configured as a single-channel (25 GSps) or dual-channel
(two 12.5 GSps) ADC engine to address the most demanding wide-spectrum
communications applications.
These board sets enable direct RF sampling of bandwidths up to 15 GHz using open
architecture COTS modules. The board sets speed and simplify the design of very
high-performance wideband signals intelligence (SIGINT), electronic warfare (EW), and satellite communications (SATCOM) applications
for deployed platforms such as manned and unmanned aircraft, ground vehicles, ships, and base stations.
The ultra-high sampling rates enable huge swaths of bandwidth to be scanned for signals of interest. In dual-channel mode, the
CHAMP-WB A25G eliminates the need for a second CHAMP-WB to provide a second independent channel. Curtiss-Wright and Tektronix
Component Solutions jointly developed the ADC and DAC modules on the CHAMP-WB board. The ADC module hosts two multichip modules
(MCMs), each of which contains an ADC and dual demultiplexer (DEMUX) silicon.
Curtiss-Wright Controls Defense Solutions • www.curtisswrightds.com • www.vita-technologies.com/p370959
VNX bringing a solution to SWaP challenges
Size does matter, and smaller is a good thing in applications that are challenged with
available space for electronics. The ROCK-3210 is the first member of the ROCK-3 family
of rugged VNX mission computers from Creative Electronic Systems (CES). Based on
VPX technologies, VNX is a small form factor standard for conduction-cooled modules.
The base VNX 2+1 system consists of a chassis supporting two double-wide 19 mm and
one single-wide 12.5 mm VNX modules. One 19 mm site hosts an SBC, initially an AMD G-Series
system-on-chip (SoC) quad-core processor with two independent GPUs. The second 19 mm
site can host an SBC, image processor, or video conversion module.
The 12.5 mm site is configured to hold either an inertial measurement unit (IMU) with GPS
and optional selective availability anti-spoofing module (SAASM) capability, or a dual Mini
PCI Express I/O carrier with a variety of mezzanine modules for data bus, discrete, and analog
I/O functions including MIL-STD-1553, CAN, and ARINC 429. An I/O transition panel supports
MIL connectors for power and I/O connectivity. A rear transition panel supports mSATA storage, as well as optional external high-speed
optical interfaces. Internal to the chassis, all modules are conduction cooled. External chassis options include convection, conduction,
and forced-air conduction cooling, as well as various mounting features.
Creative Electronic Systems SA (CES) • www.ces-swap.com • www.vita-technologies.com/p372738
Tiny footprint makes big impact
Small form factors are opening new doors to many applications. One of the newest
form factors on the market is the VITA 75 rugged small form factor. The military-grade
HPERC-IBR-H Series of rugged systems for mission and payload computing from ADLINK
leverages the company’s extensive experience in small and rugged computing modules.
The highly integrated, compact, VITA 75-compliant HPERC-IBR-H Series is almost
30 percent smaller than similar products on the market. The HPERC-IBR-H Series meets
size, weight, and power (SWaP) requirements for modern military applications, with a focus
on sensor data display, command, and control for mission computing in military ground or naval vehicles and mass image acquisition and
processing for payload computing in UAVs.
“The HPERC-IBR-H Series offers intense capabilities in a compact form factor, leveraging high-performance graphics capabilities and
a wealth of I/O support for camera and vehicle data buses,” said Yong Luo, general manager of ADLINK’s Embedded Computing Product
Segment. “This tightly integrated solution offers equivalent or better performance than competitive systems in a smaller footprint, with
space requirements being a critical component of any successful in-vehicle military applications.”
ADLINK • www.adlinktech.com • www.vita-technologies.com/p372741
www.vita-technologies.com
VITA Technologies Resource Guide Summer 2015 |
27
2015 RESOURCE GUIDE INDEX
Company
CategoryPage
Company
CategoryPage
ADLINK Technology, Inc.
Small Form Factor
41
LCR Embedded Systems
VPX
50
Aitech Defense Systems
VME/VPX
49
Mercury Systems
OpenVPX
38
Alphi Technology Corporation
PMC/XMC
42
Meritec
FMC29
Annapolis Micro Systems, Inc.
OpenVPX
30
Meritec
OpenVPX39
Annapolis Micro Systems, Inc.
OpenVPX
31
Meritec
PMC/XMC42
Annapolis Micro Systems, Inc.
OpenVPX
32
Meritec
VME47
Annapolis Micro Systems, Inc.
OpenVPX
33
Meritec
VPX51
Annapolis Micro Systems, Inc.
OpenVPX
34
North Atlantic Industries
VPX
51
Annapolis Micro Systems, Inc.
OpenVPX
35
Orbit Electronics Group and Orbit Power Group
OpenVPX
39
Annapolis Micro Systems, Inc.
OpenVPX
36
Orbit Electronics Group and Orbit Power Group
VPX
52
Annapolis Micro Systems, Inc.
OpenVPX
37
Orion Technologies Inc.
VPX
52
Artesyn Embedded Technologies
VME
45
Parsec/Sundance Multiprocessor Technology
OpenVPX
40
Artesyn Embedded Technologies
VME
46
Pixus Technologies
Systems
45
Dawn VME Products, Inc.
OpenVPX
38
Pixus Technologies
VPX
53
Dawn VME Products, Inc.
VPX
50
Schroff Pentair
OpenVPX
40
Highland Technology, Inc.
VME
46
Schroff Pentair
OpenVPX
41
Innovative Integration
Systems
43
TE Connectivity
VPX
54
Innovative Integration
Systems
44
Themis Computer
VPX
53
Intermas, Inc.
VME
47
Vector Electronics & Technology, Inc.
VME
48
Compression-Docking Connector
Meritec has always been a leader in providing innovative solutions to a
customer's specific interconnection problems. By combining our unique
blend of engineering talents along with our manufacturing processing
capabilities, we have designed and built custom interconnect products
that are now being designed in as standard products at a number of
OEMs. Because we are a vertically integrated company, our time from
design to fabrication to market is measured in weeks, not months. If you
have a problem with an interconnection requirement (cable or connectors)
contact us today.
Visit our newly-designed website
http://www.meritec.com
for your Direct Connection to the Xtreme High-Speed Xperts!
FEATURES
ĄĄ Ideal for rugged PC and tablet applications
ĄĄ Robust way to connect portable devices, mobile-internet devices to
charging stations
ĄĄ Compression-contact design provides spring-loaded force and
rated travel
ĄĄ High-mating cycle life, low-insertion force
ĄĄ Capable of operating RF & differential signals
ĄĄ Excellent electrical-signal performance
vita.opensystemsmedia.com/p372748
Meritec
www.meritec.com
www.vita-technologies.com
www.facebook.com/pages/Meritec/142140812492429
 www.linkedin.com/company/meritec-inc.
 888-MERITEC (637-4832)
 info@meritec.com
VITA Technologies Resource Guide Summer 2015 |
29
VITA Technologies Resource Guide
FMC
VITA Technologies Resource Guide
OpenVPX
Wild40 Seven Slot OpenVPX 3U Chassis
The Wild40 Seven Slot OpenVPX 3U Chassis is an OpenVPXcompatible chassis capable of accepting up to six 3U tall by
160mm OpenVPX Payload Front Plug-in Modules (FPMs) and one
3U tall by 160mm OpenVPX Switch FPM and up to seven 3U tall
by 80mm Rear Transition Modules (RTMs). Plug-in Module slot
spacing is 1″VITA 48.1.
This chassis is equipped with a very high performance backplane
FEATURES
which is capable of Serial I/O signaling at rates up to 10Gbps on
ĄĄ
6U High with Front Mounted OpenVPX Card Cage
is connected to adjacent slots with one Fat Pipe connection. The
ĄĄ
7 Slot OpenVPX 40Gb+ Mesh Backplane with RTM Support
Expansion Plane is a 3 slot star with two Fat Pipes connecting
ĄĄ
1534 Watt Power Supply
slots.
ĄĄ
the Data and Expansion Planes. The Data Plane of the backplane
The Wild40 Seven Slot OpenVPX 3U Chassis includes a Chassis
Monitoring system which displays DC voltages, slot temperatures
ĄĄ
and fan Revolutions Per Minute (RPMs) on the front panel of the
chassis and can be used to set fan speed. The Chassis Monitor
can be accessed and controlled remotely via the Serial or Ethernet
ĄĄ
Radial clocking for AUXCLK and REFCLK with chassis input
SMAs
Payload Profile: SLT3-PAY-2F1F2U-14.2.1 and
SLT3-PAY-2F4F2U-14.2.11
Switch Profile: SLT3-SWH-2F24U-14.4.3 or
SLT3-SWH-2F4T16U-14.4.11
interfaces.
The card cage is recessed from the front of the chassis so that
cabling can be used between Plug-in Modules and be contained
within the frame of the chassis.
Annapolis is famous for the high quality
of our products and for our unparalleled
dedication to ensuring that the customer’s
applications succeed.
We offer training and exceptional special
application development support, as well
as more conventional support.
vita.opensystemsmedia.com/p372672
Annapolis Micro Systems, Inc.
www.annapmicro.com
30 | VITA Technologies Resource Guide Summer 2015  wfinfo@annapmicro.com
 410-841-2514
www.vita-technologies.com
Wild40 12-Slot OpenVPX 6U Chassis
11U Rack mountable, 12-slot OpenVPX chassis with OpenVPX
switched topology backplane capable of 10Gbps+ signalling compromising of 2 switch and 10 payload 1" slots. Option of additional
secondary 4-slot OpenVPX power-only (Shown) or 5-slot VME/VXS
backplane.
The Wild40 12-Slot OpenVPX 6U Chassis is an OpenVPX-compatible
(VITA 65) chassis capable of accepting up to ten 6U tall by 160mm
OpenVPX Payload Front Plug-in Modules (FPMs) and two 6U tall by
160mm OpenVPX Switch FPMs and up to twelve 6U tall by 80mm
Rear Transition Modules (RTMs) in its Primary Backplane. Plug-in
Module slot spacing is 1″VITA 48.1.
The Wild40 12-Slot OpenVPX 6U Chassis’ Primary Backplane is a very
high performance backplane which is capable of Serial I/O signaling at
rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expansion Plane. The Data Plane of the backplane is arranged in a dual-star
configuration with two Fat Pipe connections from each Switch Slot to
each Payload Slot. The Expansion Plane is a chain connecting adjacent
Payload Slots.
In addition to the Primary Backplane there is also an option for a Secondary 4-Slot VPX Power-Only or 5-slot VME/VXS Backplane. The
4-slot VPX backplane supports four OpenVPX VITA65 slots with a 1″
VITA 48.1 slot spacing. These slots are not connected to each other
on the Data or Expansion Planes, instead all of their connections go
straight through the backplane to the RTM backplane connectors.
These slots are ideally suited for Clock Distribution boards, Tuners or
other non-IO intensive FPMs.
The chassis includes a Chassis Monitoring system which displays DC
voltages, slot temperatures and fan Revolutions Per Minute (RPMs)
on the front panel of the chassis and can be used to set fan speed.
The Chassis Monitor can be accessed and controlled remotely via the
Serial or Ethernet interfaces.
The card cage is recessed from the front of the chassis so that cabling
can be used between Plug-in Modules and be contained within the
frame of the chassis.
FEATURES
ĄĄ
ĄĄ
ĄĄ
10U High with Front Mounted OpenVPX Card Cage
Primary 12 Slot OpenVPX High Speed Switched Backplane with
RTM Support
Optional Secondary 5 Slot VME/VXS or 4 slot VPX Backplane
for Power Only Payload Cards
ĄĄ
Up to 3200 Watt Power Supply
ĄĄ
Backplane Profile: BKP6-CEN12-11.2.X
ĄĄ
Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1
ĄĄ
Switch Profile: SLT6-SWH-16U20F-10.4.2
Annapolis is famous for the high quality
of our products and for our unparalleled
dedication to ensuring that the customer’s
applications succeed.
We offer training and exceptional special
application development support, as well as
more conventional support.
vita.opensystemsmedia.com/p372673
Annapolis Micro Systems, Inc.
www.annapmicro.com
www.vita-technologies.com
 wfinfo@annapmicro.com
 410-841-2514
VITA Technologies Resource Guide Summer 2015 |
31
VITA Technologies Resource Guide
OpenVPX
VITA Technologies Resource Guide
OpenVPX
WILD Data Storage Solution
When Storage capability is needed, Annapolis offers the highest
density OpenVPX storage solutions on the market with up to 9.3
TB of capacity in a single 1" slot with up to 4.5 GB/s of write bandwidth. It also features a removable hot swappable canister with a
connector rated for 10,000+ mating cycles. The WILD Data Storage
Solution comes with standard images to support XAUI, 40GbE and
AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control
protocol ideal for inter-FPGA communication).
The WILD Data Storage Solution is comprised of two pieces fitting in
a single 1" OpenVPX slot, the “storage canister” which holds up to
12 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX
backplane and holds the disk canister.
The Storage Carrier/Canister is specifically designed to support 10,000+ insertion cycles of the disk canister for frequent
drive removal. Both the canister and the entire assembly (Storage
Canister + Storage Carrier) are also hot swappable for minimum
system down time and highest reliability. This OpenVPX compliant
payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to
support four channels of 40GbE (proper backplane required for faster
rates).
To ensure safe and reliable processing, WILD Data Storage Solution
boards come equipped with a proactive thermal management system.
Sensors across the board monitor power and temperature, with automatic shutdown capability to prevent excessive heat buildup. WILD
Data Storage Solution boards are built with a rugged, durable design.
Sensors can be accessed with a chassis manager (ChMC).
New heatsinks have been tested with great success on WILD Data
Storage Solution boards. These larger heatsinks also act as stiffeners
for the boards, making them sturdier.
FEATURES
ĄĄ General Features
• 9.3 TB of Storage Per Each 6U VITA 65 Compliant OpenVPX Slot
• Up to 4.5 GB/s Write and Up to 5 GB/s Read Bandwidth (write
bandwidth determined by system environmentals)
• Scalable Depth and Bandwidth
• Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot
Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem)
ĄĄ Backplane I/O
• Up to 40Gb Ethernet on each of Four Fat Pipes on P1, for a total of
20GB/s on P1
• 1 Additional Fat Pipe on P4 providing QSFP+ connection via RTM
• 1Gb Ethernet Connection on P4
ĄĄ System Management
• Client/Server Interface for WILDSTAR FPGA Boards and Linux and
Windows-based CPU systems
• Extensive System and Drive Diagnostic Monitoring and
Configuration over 1 Gb Ethernet via P1 and P4 Ethernet
• Standard Intelligent Platform Management Interface (IPMI) to
Monitor Current, Voltage and Temperature
• Front Panel Status LEDs for all 12 SSDs and all Backplane Control
and Data Plane Connections
ĄĄ Physical Features
• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing
• Supports OpenVPX Payload Profile:
MOD6-PAY-4F1Q2U2T-12.2.1-n
• Integrated Heat Sink
• Air Cooled with Product Path to Conduction Cooling
vita.opensystemsmedia.com/p372456
Annapolis Micro Systems, Inc.
www.annapmicro.com
32 | VITA Technologies Resource Guide Summer 2015  wfinfo@annapmicro.com
 410-841-2514
www.vita-technologies.com
WILDSTAR 7 for OpenVPX 3U
The WILDSTAR 7 for OpenVPX 3U contains one VX690T or VX980T
Virtex 7 FPGA per board with up to 2 GB of DDR3 DRAM for 12.8 GB/s
of DRAM bandwidth and up to 32 MB of QDRII+ SRAM for 8 GB/s
of SRAM bandwidth. It has up to 1 million logic cells and 1.6 million
multiplier bits per board.
These FPGA boards include a Xilinx Virtex 7 FPGA with 64 High Speed
Serial connections performing up to 13.1 Gbps. There are two 36-bit
QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit
DDR3 DRAM ports clocked at up to 800 MHz.
With included High Speed Serial (HSS) FPGA cores (including
40GBASE-KR), there is up to 10 GB/s of bandwidth on the VPX data
plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is up to 20 GB/s of
bandwidth on the VPX Expansion Place. When using 40GBASE-KR,
there is the added reliability of Forward Error Correction (FEC) to
achieve a much lower Bit Error Rate (BER).
If IO is required, Annapolis offers extraordinary density, bandwidth
and analog conversion choices. Each 3U card has 1 mezzanine IO sites
which can support up to 2 WILDSTAR Mezzanine cards as well as a
QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+
transceivers per slot. These options can be mix and matched to meet
customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single
IO Site).
WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for
more system reliability. This feature is unique to Annapolis and was
developed because our experience with OpenVPX systems has shown
it invaluable so a whole chassis does not need to be shutdown to
remove a single board.
Annapolis OpenVPX FPGA cards include an on-board dual core
1.2 GHz PowerPC with direct FPGA 4x PCIe connection which can
be used by customers for application requirements. It is also used to
query board health like FPGA temperature and power. It is connected
to the OpenVPX control plane via 1GbE.
There are also plenty of user backplane signals available on the
Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA
HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps
signalling and supports multiple channels of 40GbE.
FEATURES
ĄĄ General Features
• One Xilinx Virtex 7 VX690T or VX980T FPGA
• Up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth
• Up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth
ĄĄ Backplane I/O
• 24x High Speed Serial IO lanes to VPX Backplane (P1/P2) for 30 GB/s of Full
Duplex Bandwidth
• Two PCIe Gen3 8x Connections to VPX Backplane (P1)
• Eight LVDS lines to P2
• Backplane Protocol Agnostic connections support 10/40Gb Ethernet,
SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols
• External clock and IRIG-B Support via Backplane
• Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK
and REFCLK
– Allows points-to-point, very high quality backplane connections to payload cards
– Allows 10MHz clock and trigger from backplane to synchronize and clock
compatible ADC/DAC mezzanine cards without front panel connections needed
– Allows 1000s of analog channels across many backplanes/chassis to be
synchronized via backplane
ĄĄ Front Panel I/O
• Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide
variety of WILDSTAR ADC and DAC Mezzanine Cards
• Three optional built-in Front Panel QSFP+ Transceivers running at up to
52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth
• Simultaneous QSFP and Mezzanine Card use
• QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet,
SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols
ĄĄ Dual Core Processor APM86290
• Host Software: Linux API and Device Drivers
• Each core runs up to 1.2 GHz
• 2 GB of DDR3 DRAM
• 4 GB SATA SSD and 16MB NOR Boot Flash
• 4x PCIe Gen2 connection to Virtex 7 FPGA
ĄĄ Application Development
• Full CoreFire Next™ Board Support Package for Fast and Easy Application
Development
• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included
• Open VHDL Model including Source Code for Hardware Interfaces
• Open VHDL IP Package for Communication Interfaces
• Chipscope Access through RTM
ĄĄ System Management
• System Management using Intelligent Platform Management Interface (IPMI)
• Diagnostic monitoring and configuration
• Current, Voltage and Temperature Monitoring Sensors
• Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)
ĄĄ Mechanical and Environmental
• 3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing
• Supports OpenVPX payload profile: MOD3-PAY-2F4F2U-16.2.10-n
• Integrated Heat Sink and Board Stiffener
• Available in Extended Temperature Grades
• Air Cooled with Conduction Cooled path
• RTM available for additional I/O
vita.opensystemsmedia.com/p372457
Annapolis Micro Systems, Inc.
www.annapmicro.com
www.vita-technologies.com
 wfinfo@annapmicro.com
 410-841-2514
VITA Technologies Resource Guide Summer 2015 |
33
VITA Technologies Resource Guide
OpenVPX
VITA Technologies Resource Guide
OpenVPX
WILDSTAR 7 Conduction Cooled for OpenVPX 6U
WILDSTAR 7 Conduction Cooled for OpenVPX 6U boards provide up to
two Xilinx Virtex 7 FPGAs per board with VX690T or VX980T FPGAs,
up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up
to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth. Up to
1.9 million logic cells and 3.3 million multiplier bits per board. Air or
Conduction Cooled.
These FPGA boards include two Xilinx Virtex 7 FPGAs with 64 High
Speed Serial connections performing up to 13.1 Gbps. The IO Processing Element (IOPE) FPGA has a choice of QDRII+ SRAM or DDR3
DRAM. The DRAM option has four 32-bit DDR3 DRAM ports clocked
at up to 800 MHz while the SRAM option has two 72-bit QDRII+
SRAM interfaces clocked up to 500 MHz.
With included High Speed Serial (HSS) FPGA cores (including
40GBASE-KR), there is up to 20 GB/s of bandwidth on the VPX data
plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is 16 GB/s of PCI Express
Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3
connection to each FPGA through a non-blocking PCIe switch. When
using 40GBASE-KR, there is the added reliability of Forward Error
Correction (FEC) to achieve a much lower Bit Error Rate (BER).
If IO is required, Annapolis offers extraordinary density, bandwidth
and analog conversion choices. Each 6U card has 2 mezzanine IO
sites which can support up to four WILDSTAR Mezzanine cards as
well as a QSFP+ option (on WS7 and WS A5 board) that allows for six
QSFP+ transceivers per slot. These options can be mix and matched
to meet customer needs. Some configurations utilize a second slot (for
example the QSFP+ option and WILDSTAR Mezzanine card used in a
single IO Site).
WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for
more system reliability. This feature is unique to Annapolis and was
developed because our experience with OpenVPX systems has shown
it invaluable so a whole chassis does not need to be shutdown to
remove a single board.
Annapolis OpenVPX FPGA cards include an on-board dual core 1.2
GHz PowerPC. This also has a connection to PCIe infrastructure (which
includes FPGAs) and can be used by customers for application requirements. It is also used to query board health like FPGA temperature
and power. It is connected to the OpenVPX control plane via 1GbE.
There are also plenty of user backplane signals available on the
Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS,
IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.
FEATURES
ĄĄ One or Two XILINX VIRTEX 7 FPGAS
• VX690T or VX980T
• Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB
of QDRII+ SRAM for 32 GB/s of SRAM bandwidth
• PCIe Gen3 8x from each FPGA to on-board PCIe switch
ĄĄ Backplane I/O
• 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full
Duplex Bandwidth
• 16x High Speed Serial FPGA connections to P5
• 8x High Speed Serial IO lanes to P4
• Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2)
• 24 LVDS and 8 Single Ended lines to P3
• Backplane Protocol Agnostic connections support 10/40Gb Ethernet,
SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols
ĄĄ Front Panel I/O
• Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide
variety of WILDSTAR ADC and DAC Mezzanine Cards
• Three or six optional built-in Front Panel QSFP+ Transceivers running at up to
52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth
• 1 Gb Ethernet RJ45 connector for Remote Host Access
• External clock and IRIG-B Support via Front Panel SMA
• QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet,
SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols
ĄĄ Dual Core Processor APM86290
• Host Software: Linux API and Device Drivers
• Each core runs up to 1.2 GHz
• 2 GB of DDR3 DRAM
• 4 GB SATA SSD and 16MB NOR Boot Flash
• 4x PCIe Gen2 connection to on-board PCIe Switch
ĄĄ Application Development
• Full CoreFire Next™ Board Support Package for Fast and Easy Application
Development
• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included
• Open VHDL Model including Source Code for Hardware Interfaces
• Open VHDL IP Package for Communication Interfaces
• Chipscope Access through RTM
ĄĄ System Management
• System Management using Intelligent Platform Management Interface (IPMI)
• Diagnostic monitoring and configuration
• Current, Voltage and Temperature Monitoring Sensors
• Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)
ĄĄ Mechanical and Environmental
• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing
• Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n
• Integrated Heat Sink and Board Stiffener
• Available in Extended Temperature Grades
• Air Cooled with Conduction Cooled path
• RTM available for additional I/O
vita.opensystemsmedia.com/p372742
Annapolis Micro Systems, Inc.
www.annapmicro.com
34 | VITA Technologies Resource Guide Summer 2015  wfinfo@annapmicro.com
 410-841-2514
www.vita-technologies.com
WILDSTAR A5 for OpenVPX 6U
WILDSTAR A5 for OpenVPX 6U boards provide up to three Altera Stratix®
V FPGAs per board with choice of GX parts up to 5SGXAB or GS parts up
to 5SGSD8, up to 96 MB of QDRII+ SRAM for 59 GB/s of SRAM bandwidth and up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth.
Up to 2.8 million logic elements and 4.3 million multiplier bits per board.
Air Cooled Only.
These FPGA boards include 3 Altera Stratix V FPGAs with 48 High
Speed Serial connections performing up to 14.1 Gbps. On each Compute
Processing Element (CPE) FPGA there is six 72-bit QDRII+ SRAM interfaces clocked up to 550 MHz. The IO Processing Element (IOPE) FPGA
has four 32-bit DDR3 DRAM ports clocked at up to 800 MHz.
With included High Speed Serial (HSS) FPGA cores (including
40GBASE-KR), there is up 20 GB/s of bandwidth on the VPX data plane
which can go directly to other VPX cards or to a switch, depending on
backplane topology. In addition, there is 16 GB/s of PCI Express Gen 3
bandwidth on the VPX Expansion Plane with an 8x Gen3 connection
to each FPGA through a non-blocking PCIe switch. When using
40GBASE-KR, there is the added reliability of Forward Error Correction
(FEC) to achieve a much lower Bit Error Rate (BER).
If IO is required, Annapolis offers extraordinary density, bandwidth and
analog conversion choices. Each 6U card has 2 mezzanine IO sites which
can support up to 4 WILDSTAR Mezzanine cards as well as a QSFP+
option (on WS7 and WS A5 board) that allows for 6 QSFP+ transceivers
per slot. These options can be mix and matched to meet customer needs.
Some configurations utilize a second slot (for example the QSFP+ option
and WILDSTAR Mezzanine card used in a single IO Site).
WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for
more system reliability. This feature is unique to Annapolis and was
developed because our experience with OpenVPX systems has shown it
invaluable so a whole chassis does not need to be shutdown to remove
a single board.
Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz
PowerPC. This also has a connection to PCIe infrastructure (which
includes FPGAs) and can be used by customers for application requirements. It is also used to query board health like FPGA temperature and
power. It is connected to the OpenVPX control plane via 1GbE.
There are also plenty of user backplane signals available on the
Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS,
IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.
FEATURES
ĄĄ One, Two or Three ALTERA STRATIX® V FPGAS
• Up to three Altera Stratix® V FPGA Processing Elements: 5SGSD6, 5SGSD8,
5SGXA7, 5SGXA9, 5SGXAB
• Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth
• Up to 96 MB of QDRII+ SRAM for 48 GB/s of SRAM bandwidth
• PCIe Gen3 8x from each FPGA to on-board PCIe switch
ĄĄ Backplane I/O
• 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full
Duplex Bandwidth
• Up to 16x High Speed Serial FPGA connections to P5
• 8x High Speed Serial IO lanes to P4
• Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2)
• 32 LVDS and 8 Single Ended lines to P3
• Backplane Protocol Agnostic connections support 10/40Gb Ethernet,
SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols
ĄĄ Front Panel I/O
• Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide
variety of WILDSTAR ADC and DAC Mezzanine Cards
• Three or six optional built-in Front Panel QSFP+ Transceivers running at up to
56.4 Gbps each for 42.3 GB/s of Full Duplex Bandwidth
• 1 Gb Ethernet RJ45 connector for Remote Host Access
• External clock and IRIG-B Support via Front Panel SMA
• QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet,
SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols
ĄĄ Dual Core Processor APM86290
• Host Software: Linux API and Device Drivers
• Each core runs up to 1.2 GHz
• 2 GB of DDR3 DRAM
• 4 GB SATA SSD and 16MB NOR Boot Flash
• 4x PCIe Gen2 connection to on-board PCIe Switch
ĄĄ Application Development
• Full CoreFire Next™ Board Support Package for Fast and Easy Application
Development
• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included
• Open VHDL Model including Source Code for Hardware Interfaces
• Open VHDL IP Package for Communication Interfaces
• SignalTap Access through RTM
ĄĄ System Management
• System Management using Intelligent Platform Management Interface (IPMI)
• Diagnostic monitoring and configuration
• Current, Voltage and Temperature Monitoring Sensors
• Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)
ĄĄ Mechanical and Environmental
• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing
• Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n
• Integrated Heat Sink and Board Stiffener
• Available in Extended Temperature Grades
• Air Cooled with Conduction Cooled path
• RTM available for additional I/O
vita.opensystemsmedia.com/p372743
Annapolis Micro Systems, Inc.
www.annapmicro.com
www.vita-technologies.com
 wfinfo@annapmicro.com
 410-841-2514
VITA Technologies Resource Guide Summer 2015 |
35
VITA Technologies Resource Guide
OpenVPX
VITA Technologies Resource Guide
OpenVPX
WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC
Mezzanine Card
This ultra low latency Dual 1.5GSps ADC/DAC card is specifically
designed for DRFM applications with 24ns latency from SMA to SMA.
The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card
was designed from the ground up for latency sensitive DRFM applications. The Board Support Interface, which is available in VHDL or
CoreFire Application Design Suite, was also designed from the beginning to be suited for DRFM applications. This interface provides a
Digital Bypass Mode to achieve the lowest possible latency and
a Fabric Space Mode to allow the user to do additional processing
and manipulation of the ADC data before returning it out the DAC.
The Fabric Space Mode adds only 14ns of latency. The Board
Support Interface also includes a built-in Bypass Delay which can be
controlled to be from 0 to 62 ADC sample clock periods. This allows
the user to “walk” the latency out from the minimum Digital Bypass
Mode latency to slightly beyond the Fabric Space Latency, providing
for a smooth latency transition between the two modes.
The CoreFire Next Design Suite, Annapolis’ FPGA Design Tool, allows
the user to design a 24ns latency DRFM-optimized application in
minutes.
The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card
is shipped with a custom heatsink which enables proper cooling of the
ADC. An on-board temperature monitor is also supplied which allows
for real-time monitoring of the ADC’s internal die temperature.
The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine
Card provides high fidelity and high speed analog-to-digital conversion along with a rugged design. This card is compatible with
WILDSTAR 7 and WILDSTAR A5 mainboards.
FEATURES
ĄĄ General Features
• Dual Channel ADCs and DACs running at up to 1500MSps each
at 12-bits
• Ultra Low latency from ADC SMA input to DAC SMA output
• Digital Bypass Mode (SMA-to-SMA): < 24ns
• Fabric Space Mode (SMA-to-SMA): < 39ns
• Digital Bypass Mode has built-in run-time adjustable delay
providing additional delay from 0ns up to 62 Sclk periods
• Capability to have four ADC channels and four DAC channels in
one 6U OpenVPX slot when plugged into WILDSTAR OpenVPX
FPGA cards
• Support for WILDSTAR 7 (Xilinx Virtex™-7) and WILDSTAR A5
(Altera Stratix® V) PCIe and OpenVPX mainboards
• Firmware and Software Board Support Interface provided in
CoreFire Next and VHDL source
ĄĄ ADC and DAC and Performance
• Sample Rate: 300 – 1500MHz
• ADC and DAC Resolution: 12 bits
ĄĄ SMA I/O
•
•
•
•
•
•
•
Two Analog Inputs
Two Analog Outputs
One High Precision Trigger Input
One External Clock Input
Mechanical and Environmental
Integrated Heatsink and EMI / Crosstalk Shields
Commercial and Industrial Temperatures Available
ĄĄ Mechanical and Environmental
• Integrated Heatsink and EMI/Crosstalk Shields
• Commercial and Industrial Temperatures Available
ĄĄ Clock Synchronization
• Software-selectable external clock input or onboard clock
• All ADCs on a mezzanine card are synchronized to the same sample
• All ADCs across multiple mezzanine cards can be synchronized to
the same sample using
• WILDSTAR Clock Distribution Boards
• Provides capability to configure 40+ ADC and DAC channels in one
COTS Annapolis 19" OpenVPX Chassis
vita.opensystemsmedia.com/p372675
Annapolis Micro Systems, Inc.
www.annapmicro.com
36 | VITA Technologies Resource Guide Summer 2015  wfinfo@annapmicro.com
 410-841-2514
www.vita-technologies.com
WILDSTAR G2 Dual 1.6/2.7/4.0GSps 12-Bit ADC
Mezzanine Card
The Dual 4.0/2.7/1.6 GSps 12-Bit A/D Mezzanine Card provides
high fidelity and high speed analog-to-digital conversion along with a
rugged design. The Dual 4.0/2.7/1.6 GSps 12-Bit A/D Mezzanine
Card is shipped with a custom heatsink which enables proper
cooling of the ADCs. An on-board temperature monitor is also
supplied which allows for real-time monitoring of the ADC’s internal
die temperatures.
FEATURES
ĄĄ Provides two channels of synchronized high bandwidth, high
performance ADC channels.
ĄĄ ADCs have built-in DDC/NCO/Decimation features which reduces
FPGA resources
ĄĄ Maximum Sample Rate up to: 1.6, 2.7 or 4.0GSps
ĄĄ Minimum Sample Rate: 1.0GSps
ĄĄ ADC Resolution: 12 bits
ĄĄ Eight High-Speed JESD204B Serial Data Lanes per ADC
ĄĄ Six 50Ω SMA Front Panel Connectors
Annapolis is famous for the high quality
of our products and for our unparalleled
dedication to ensuring that the customer’s
applications succeed.
We offer training and exceptional special
application development support, as well as
more conventional support.
•
•
•
•
Two Analog Inputs
High Precision Trigger Input
Differential Clock Input (can be driven single ended)
Optional PLL 10MHz Reference Input
ĄĄ Software selectable Clock Source:
• External clock provided on Clock Input SMAs
• Optional Internal Fixed Frequency Ultra Low Phase Noise VCO/PLL
with Software selectable 10MHz source:
– Internal 10MHz source sourced by on board 10MHz source
– External 10MHz source provided on Reference Input SMA
ĄĄ Analog Input Options
• Low Band (offers best dynamic performance in the First
Nyquist Zone)
• Mid Band (offers best dynamic performance in the Second
Nyquist Zone)
• High Band (offers widest bandwidth)
ĄĄ High Precision Trigger Input Manufacturing Options:
• 1.65V LVPECL
• 2.5V LVPECL
• 3.3V LVPECL
ĄĄ Integrated Heatsink/Shield
ĄĄ On-Board Temperature Sensors for ADCs
vita.opensystemsmedia.com/p372744
Annapolis Micro Systems, Inc.
www.annapmicro.com
www.vita-technologies.com
 wfinfo@annapmicro.com
 410-841-2514
VITA Technologies Resource Guide Summer 2015 |
37
VITA Technologies Resource Guide
OpenVPX
VITA Technologies Resource Guide
OpenVPX
Fabric Mapping Modules
Dawn OpenVPX backplane Fabric Mapping Modules simplify topology
customization. Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topologies. Newly patented
FMM microoverlays quickly customize off-the-shelf OpenVPX backplanes
to mission requirements.
Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required
for new backplane designs, a critical advantage when schedules are
compressed by late system changes. Dawn engineers have successfully
used Fabric Mapping Modules to solve many OpenVPX application
problems in the design phase.
Fabric Mapping Modules provide a natural migratory development
environment for moving from the lab to the field with high speed
OpenVPX backplanes.
FEATURES
ĄĄ Off-the-shelf backplanes can be quickly customized to mission
requirements
ĄĄ Optimize the communication topology between slots within a system’s
backplane
ĄĄ Customize inter-slot communications to meet unique system
requirements
ĄĄ Improve signal integrity between system cards beyond requirements of
PCI Express, Serial Rapid I/O and 10Gbit (XAUI) Ethernet standards
ĄĄ Directly connect PCI Express or SerialRapid I/O to multiple cards or
cards and switches
ĄĄ Link SATA from a CPU card to a Solid State Drive (SSD) carrier
ĄĄ Enable XMC cards to talk to other XMC cards or other I/O like
PCI Express links
ĄĄ Facilitate rear backplane I/O connections and low profile connector
interface systems when normal transition modules do not fit the
system application envelope
vita.opensystemsmedia.com/p372452
 sales@dawnvme.com
 510-657-4444
Dawn VME Products
www.dawnvme.com
OpenVPX
LDS3506
Mercury’s OpenVPX™ Ensemble® LDS3506 processing module seamlessly integrates Intel’s Xeon® D-series processor (formerly codenamed
“Broadwell DE”) with Xilinx’s UltraScale™ FPGA in a SWaP-constrained
3U package. This dense union of best available commercial-item general
processing and FPGA resources produces a highly versatile, affordable and interoperable building block for embedded, high-performance
compute applications with additional low-latency, refresh and mission
capabilities.
The module’s latest Xilinx FPGA hosts Mercury’s Protocol Offload
Engine Technology (POET™) to give each module the ability to refresh its
mission capability, provide information assurance abilities, or even refresh
or upgrade its switch fabric itself without affecting any hardware.
FEATURES
ĄĄ 3U OpenVPX™ compliant VITA 65/46/48 (VPX-REDI) module
ĄĄ 8-core Broadwell DE Intel® Xeon® D family server-class processor
ĄĄ Xilinx® UltraScale™ FPGA with dual x4 PCIe data plane and Ethernet
control plane
ĄĄ 256 GFLOPS peak processing power in a single slot
ĄĄ Dual 10 Gigabit Ethernet interfaces for sensor I/O or inter-processor
communication
ĄĄ x8 PCIe expansion plane for additional I/O or offload
ĄĄ Mercury MultiCore Plus® software infrastructure support
vita.opensystemsmedia.com/p372704
Mercury Systems
www.mrcy.com/LDS3506
38 | VITA Technologies Resource Guide Summer 2015  866-627-6951
www.linkedin.com/company/mercury-systems


twitter.com/mrcy
www.vita-technologies.com
HERCULES® 10 Gbs Ruggedized COTS High-Density
Interconnect System
FEATURES
Meritec’s Hercules Multi-Protocol Interconnect System provides cost-effective
reliability, density and speed necessary to support C51SR for battlefield-ready
critical command. Embedded in the rugged MIL-DTL-38999L Series III circular
shell, Hercules is both a durable and high-bandwidth interconnect system suitable for Mil/Aero/Marine and harsh environment commercial/industrial applications not previously accommodated by Industry standard interconnects. The
rapid emergence of high-speed switched serial-fabric backplanes in the ruggedembedded computer market has created a need for a connector system capable
of supporting serial I/O at full bandwidth between platforms. Hercules supports
throughput-link speeds demonstrated in excess of 10 Gbs per lane. Hercules is
currently the VITA 76 Draft Standard and, while readily accepted over five (5) years
as a proven high-speed copper interconnect, establishing the viability of Hercules
as an active optic-connector platform rounds out the V-76 Standards for both
copper and optic cabling consideration. Follow the link for interactive flipbook and
technical data – http://meritec.com/wp-content/flipbooks/hercules/
ĄĄ Up to 145 total contacts with 44 differential pairs in a #23 circular shell
ĄĄ Rugged light-weight aluminum MIL-38999 Series III Size 9, 13, 17 & 23
threaded-coupling circular shells.
ĄĄ Shell plating: CAD and PTFE plating standard, others available special order
ĄĄ Keying: “N” (standard) “A”, “B”, “C”, “D”
ĄĄ Available as Plug-Cable Assemblies and Jam-Nut or Flange-Mount
Receptacles for Solder Tail, Press-Fit or Pigtail
ĄĄ Jacket types available LSZH, PVC, FEP & Halar Expando
ĄĄ Cable types available in 24, 26, 28, 30 AWG, high bandwidth, Custom
lengths built to order
ĄĄ Supports data rates in excess of 10 Gbs & differential-pair signaling
w/low-skew pairs & shielding for EMI/RFI protection
ĄĄ Compatible with the following protocols:
SAS/USB/PCIexpress/Serial I/O/Ethernet/SATA as well as InfiniBand
ĄĄ Matched impedance design of 100 Ohm
ĄĄ Fully electrically tested interconnect systems, made In The USA
Visit our newly-designed website http://www.meritec.com
for your Direct Connection to the Xtreme High-Speed Xperts!
vita.opensystemsmedia.com/p372489
www.facebook.com/pages/Meritec/142140812492429
Meritec
www.meritec.com
 www.linkedin.com/company/meritec-inc.
 888-MERITEC (637-4832)
 info@meritec.com
OpenVPX
VPXtra™ Power Supplies (6U and 3U)
Setting new higher power standards.
Behlman broke through the 6U VPX power ceiling with their
1000-Watt DC-DC VPXtra™ Power Supply. Today Behlman also offers
a 700-Watt, multiple-output, DC-DC VPXtra™ 6U Power Supply, and
a 1500-Watt AC-DC VPXtra™ 6U Power Supply. Behlman also provides a 550-Watt DC-DC VPXtra™ 3U Power Supply, and a wide range
of VME power supplies used in airborne, ground mobile, naval and
industrial applications.
FEATURES
ĄĄ OpenVPX VITA compliant
ĄĄ Wide input range
ĄĄ High power DC output
Behlman also manufactures a broad line of modified standard, custom
and COTS power supplies (frequency converters, inverters, AC, DC-DC,
AC-DC, DC-AC, and UPS).
ĄĄ Efficiency of 90% typical at full load
Behlman Electronics is an ISO 9000:2008 company.
ĄĄ Behlman is a Subsidiary of Orbit International (www.orbitintl.com)
ĄĄ Conduction cooled at card edge
ĄĄ Conformal coating on PWB
and the basis of the Power Group.
VME-VPX Held to a Higher Standard.
vita.opensystemsmedia.com/p372755
Behlman Electronics
www.behlman.com
www.vita-technologies.com
sales@behlman.com
 +1 631 435-0410

VITA Technologies Resource Guide Summer 2015 |
39
VITA Technologies Resource Guide
OpenVPX
VITA Technologies Resource Guide
OpenVPX
Stratix®V FPGA Module
with DSP and FMC for
demanding computation
and I/O applications.
FEATURES
VF360
ĄĄ Stratix V GX and GS FPGA variants
The VF360 is a 3U OpenVPX module that leverages on Altera Stratix V
FPGA and Texas Instruments KeyStone Multicore DSP technology to provide
an ultra-high bandwidth processing platform, ideally suited for computation
and bandwidth intensive applications such as Radar, Networking, SIGINT,
EW, SDR and Video.
®
The VF360 acts as an FMC carrier to provide a modular solution that
accommodates a wide range of I/O requirements. The VF360 eliminates
the requirement for a OpenVPX-SBC Host Controller, as replaced by the
KeyStone DSP that will run Linux and provide Ethernet connectivity.
Both air-cooled and conduction cooled versions, for rugged applications,
are available.
ĄĄ TI KeyStone Multicore C667x family of DSP’s
ĄĄ 4GB DDR3 plus 32MB QDRll+
ĄĄ High pin count VITA 57 FMC site
ĄĄ OpenVPX MOD3-PAY-3F2U-16.2.12-2 module profile
ĄĄ FPGA configurable User I/O on P2
ĄĄ BSP for Windows and Linux
ĄĄ FPGA firmware reference design
ĄĄ FM500 (FMC) and VR300 (RTM) companion modules
vita.opensystemsmedia.com/p372757
Sundance Multiprocessor Technology Ltd
www.sundance.com/vpx

Flemming.C@sundance.com
 +44 1494 793167
 uk.linkedin.com/pub/flemming-christensen/0/987/649/en  @OneCrazyDane
OpenVPX
Express Programs
Express Programs: When product is needed fast
Need systems, subracks, cases or front panels quickly for prototyping
or small projects? Express service provides rapid delivery turnarounds
for solutions engineered to meet your design requirements – in a matter of days.
FEATURES
Systems Express
• ATCA, MicroTCA, CompactPCI, and CompactPCI Serial models available
• Shipped in as few as 15 days
Subrack & Cases Express
ĄĄ Conform to specifications
ĄĄ Standard and customized solutions available
ĄĄ Local and global design and product support
• EuropacPRO subrack kits, parts and accessories
• RatiopacPRO case kits, parts and accessories
• Delivered in as few as 15 days
ĄĄ Drawings and models available
ĄĄ Part and quantity restrictions may apply
vita.opensystemsmedia.com/p367481
Schroff
http://www.pentairprotect.com
40 | VITA Technologies Resource Guide Summer 2015 AskSchroff@pentair.com
 1-800-525-4682

www.vita-technologies.com
System Configurator
VME, VME64X AND VPX SYSTEMS CONFIGURED
TO YOUR SPECIFICATION
Pentair is an active participant on the VITA standards board and has
one of the broadest offering of VITA products in the industry ranging
from specialized VITA hardware to sophisticated systems that incorporate cooling, power supply and system management capabilities.
All our products meet or exceed VITA standards.
Configure a system chassis to your specific needs in a few simple
steps using the online Schroff Systems Configuration from Pentair.
Reach out to the experts today and request a quote on a product
tailored to your specific requirements!
FEATURES
Configure Online:
ĄĄ Configure system chassis products to your specific needs
ĄĄ Select from hundreds of options
ĄĄ Add notes and specifications for your custom needs
ĄĄ Engage Schroff’s expert chassis design and manufacturing
capabilities
vita.opensystemsmedia.com/p372759
Schroff
http://www.pentairprotect.com
 AskSchroff@pentair.com
 1-800-525-4682
Small Form Factor
HPERC-IBR-H Series Extreme Rugged System
ADLINK’s HPERC-IBR-H Series is a tightly integrated military grade
system offering advanced performance in a compact footprint.
Certified for MIL-STD-810G and IP67, the HPERC-IBR-H is a SWaPefficient system that provides high performance graphics capabilities
and a wealth of I/O support for cameras and vehicle data busses
required for mission and payload computing platforms.
The HPERC-IBR-H Series is a follow-on to ADLINK’s HPERC-IBR-M
Series and features two models, the HPERC-IBR-HC coldplate mount
system and the HPERC-IBR-HH finned-convection systems. At just
63.5mm x 150mm x 203mm, the compact system is almost 30%
smaller than other leading competitive products.
FEATURES
ĄĄ SWaP-efficient, sealed SFF system
ĄĄ Dual- or quad-core Intel® Core™ i7 processor
ĄĄ VITA 75 mount with passive cooling
ĄĄ Soldered DDR3L-1333 8GB – Up to 16GB RAM
ĄĄ Quad Gigabit Ethernet
ĄĄ Available GPGPU on 16-lane 3rd generation PCI Express
ĄĄ Triple display (DP/HDMI/DVI) support
ĄĄ Extreme Rugged™ operating temperature: -40°C to +85°C
vita.opensystemsmedia.com/p372741
ADLINK
www.adlinktech.com/Extreme-Rugged-System/
www.vita-technologies.com
angela.torres@adlinktech.com
 408-360-0200

VITA Technologies Resource Guide Summer 2015 |
41
VITA Technologies Resource Guide
OpenVPX
VITA Technologies Resource Guide
PMC/XMC
XMC-1553
DUAL UTMC 1553 SUMMIT CONTROLLER PROGRAMMABLE BC, RT AND
BM MODES
The ALPHI XMC-1553 is a conduction cooled XMC (VITA-42) board. It uses
the UTMC/AEROFLEX communication device as its 1553 bus controller,
remote terminal, or BUS monitor terminal. Each single controller has a
dual redundant channel with built in transceivers and external transformers for channels A and B. Each channel can be configured for Short Stub
and Long Stub. Two independent memory blocks of 128KB RAM for each
1553 channel. Each 1553 can be configured for internal or external clock
for its time tag clock. The board is supported in Windows™, Linux™ and
VxWorks™. This is a perfect solution for a wide array of 1553 Communication applications such as:
•
•
•
•
Industrial and Military
Test equipment supporting evaluation, simulation
Monitoring and analysis
Operational equipment such as avionics, space satellite systems,
aircraft onboard systems
• Commercial systems, and many others
FEATURES
ĄĄ
ĄĄ
ĄĄ
ĄĄ
ĄĄ
◆ VITA 42 compliant
◆ 1x Lane PCI Express
◆ Aeroflex SUMMIT MIL-STD-1553
◆ 2 Channels Dual Redundant
◆ Long/Short stub
TECHNICAL SPECS
ĄĄ ◆ Conduction Cooled
ĄĄ ◆ Single wide XMC 2.92” x 5.87”
ĄĄ ◆ Industrial Temperature: -40°C to +85°C
APPLICATION AREAS
ĄĄ Satellite, Avionics and Ground vehicle
VITA.opensystemsmedia.com/p372455
 Support@Alphitech.com
 480-838-2428
ALPHI Technology Corporation
www.Alphitech.com
PMC/XMC
PCI Express 100-Ohm and 85-Ohm Card-Edge
Connectors
Pictured in gray box: 25° 5V/32-Bit Connector, 5V/64-Bit Right-Angle,
5V/32-Bit Right-Angle, and 2x25 Right-Angle Card-Edge Connector.
FEATURES
All Meritec PCI connector footprints are identical to the vertical mount
versions for joint compatibility in the PCB design.
ĄĄ Parallel daughter-card mating for low-profile applications
ĄĄ Plastic cover protects connectors from dust and debris, and supports
The Right-Angle Through-Hole Mount PCIe connectors (shown at the top
right) solve the space problem in applications where a card-edge connector is needed and where low clearance above PCB prohibits use of vertical
configurations.
ĄĄ Compliant board-locating posts
ĄĄ Card-slot heights 5.84mm to 11.17mm for 85 ohm, meets PCIe 3.0
Visit our newly-designed website
ĄĄ Insert molded using liquid-crystal polymer for stability in hybrid board
http://www.meritec.com
for your Direct Connection to the Xtreme High-Speed Xperts!
connector for hybrid soldering applications requiring convection/IR heating
Specification
ĄĄ Card-slot heights 5.84mm to 16.68mm for 100 ohm, meets PCIe 2.1
Specification
applications involving surface-mount components requiring convection or
IR heating
ĄĄ Offers PCB design flexibility
ĄĄ Designed to mate with .062"-thick daughter card
vita.opensystemsmedia.com/p372750
Meritec
www.meritec.com
www.facebook.com/pages/Meritec/142140812492429
 www.linkedin.com/company/meritec-inc.
42 | VITA Technologies Resource Guide Summer 2015  888-MERITEC (637-4832)
 info@meritec.com
www.vita-technologies.com
Digital Receiver Instrumentation Series
The Digital Receiver is a turnkey solution providing an integrated data
logger, digital down conversion (DDC), and a spectrum analyzer (FFT) in
a compact system. The solution consists of three parts: An FPGA-based
analog digitizer module and a PC-based host controller plus an optional
firmware development kit to allow customization.
A development kit is available to support creation of advanced custom
firmware by logic developers. Netlist versions of the IP cores used to build
the Digital Receiver are provided, so developers can integrate with their
own custom cores to create an enhanced receiver design.
Existing Innovative XMC module owners need only purchase the software/firmware to achieve full Digital Receiver functionality.
Download data sheets and pricing now!
FEATURES
V61x Series (Air Cooling)
ĄĄ Dual XMC I/O Module Sites
ĄĄ Xilinx Virtex-6 SX475T-2 FPGA
ĄĄ Intel i7 Quad Core, 16GB RAM, SSD
K70x Series (Conduction Cooling)
ĄĄ Dual FMC I/O Module Sites
ĄĄ Xilinx Kintex-7 XC7K410T-2 FPGA
ĄĄ Intel i7 Quad Core, 16GB RAM, SSD
vita.opensystemsmedia.com/p372747
 sales@innovative-dsp.com
 805-383-8994
Innovative Integration
www.innovative-dsp.com/products.php?product=DIG-RX-Overview
Systems
ePC-Duo
The ePC-Duo is a user-customizable, turnkey embedded instrument that
includes a full Windows/Linux PC and supports a wide assortment of
ultimate-performance XMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the ePC-Duo reduces time-to-market
while providing the performance you need.
Distributed Data Acquisition – Put the ePC-Duo at the data source and reduce
system errors and complexity. Optional GPS-synchronized timing, triggering and
sample control is available for remote I/O. Limitless expansion via multiple nodes.
Up to 4 HDD for data logging.
Uniquely customizable – Dual XMC sites for I/O, user-programmable FPGA for I/O
interfaces, triggering and timing control, USB ports.
Remote or Local Operation – Continuous data streaming up to 2000MB/s (quad
local SSDs or dual 10 GbE LAN). Optional, stand-alone, autonomous operation
with GPS or network-synchronized sampling.
Rugged – SSD boot drive support in a compact, rugged 250x195mm footprint
that is ready for embedded operation.
8-36V DC-Only Operation – Perfect for portable or automotive data loggers or
waveform generators.
Download data sheets and pricing now!
Innovative Integration
www.innovative-dsp.com/products.php?product=ePC-Duo
www.vita-technologies.com
FEATURES
ĄĄ Combines an industry-standard COM Express CPU module with dual XMC I/O
modules in a compact, stand alone design
ĄĄ Small form factor: 3.3" H x 7.7" W x 9.8" D
ĄĄ Stand-alone operation: Able to operate diskless and headless
ĄĄ Windows, Linux and RTOS support
ĄĄ Dual PCI Express XMC I/O module sites. Add anything from RF receivers to
industrial control modules.
ĄĄ PCI Express I/O sites (VITA 42.3) deliver >3400MB/s to CPU memory**
ĄĄ Integrated timing and triggering support for I/O includes optional GPS,
IEEE-1588 or IRIG-disciplined clock
ĄĄ Supports Innovative X3, X5, and X6 I/O module features for private data
channels, triggering and timing features
ĄĄ USB3, 10 Gb Ethernet, SATA3 x4, DisplayPort, HD audio
ĄĄ System expansion supported with dual 10 GbE ethernet links
ĄĄ FPGA for custom I/O and interfaces
**Data rate dependent on the COM Express module capabilities.
vita.opensystemsmedia.com/p372450
 sales@innovative-dsp.com
 805-383-8994
VITA Technologies Resource Guide Summer 2015 |
43
VITA Technologies Resource Guide
Systems
VITA Technologies Resource Guide
Systems
ePC-K7
The ePC-K7 is a user-customizable, turnkey embedded instrument that
includes a full Windows/Linux PC and supports a wide assortment of ultimate-performance FMC modules. With its modular I/O, scalable performance,
and easy to use PC architecture, the ePC-K7 reduces time-to-market while
providing the performance you need.
Distributed Data Acquisition – Put the ePC-K7 at the data source and reduce system
errors and complexity. Optional GPS-synchronized timing, triggering and sample control
is available for remote I/O. Limitless expansion via multiple nodes. Up to 4 HDD for
data logging.
Uniquely customizable – Dual FMC I/O module sites – add anything from RF receivers
to industrial control modules. User-programmable FPGA for I/O interfaces, triggering
and timing control, USB ports.
Remote or Local Operation – Continuous data streaming up to 1000MB/s or 2 x
Gb/s Ethernet. Optional, stand-alone, autonomous operation with GPS-synchronized
sampling.
Rugged – SSD boot drive support in a compact, rugged 8x11" footprint that is ready
for embedded operation.
8-36V DC-Only Operation – Perfect for portable or automotive data loggers or waveform generators.
FEATURES
ĄĄ Combines an industry-standard COM Express CPU module with dual FMC I/O
modules in a compact, stand alone design
ĄĄ Programmable Kintex 7 325/410 and Spartan 6 FPGAs
ĄĄ Small form factor: 5" H x 8" W x 11" D
ĄĄ Conduction cooled design: Fins or cold-plate
ĄĄ Stand-alone operation: Able to operate headless, booting from SSD
ĄĄ Windows, Linux OS support
ĄĄ Dual VITA 57 FMC I/O module sites. Add anything from RF receivers to
industrial control modules.
ĄĄ I/O sites (VITA 42.3) deliver >3000MB/s to CPU memory
ĄĄ Integrated timing and triggering support for IO includes GPS, IEEE1588 or
IRIG-disciplined clock
ĄĄ Supports Innovative and third-party FMC modules for private data channels,
triggering and timing features
ĄĄ USB3.0 x6, Gb Ethernet x2, SATA x4, DisplayPort, Touch Screen
ĄĄ Up to 4 SSD or HDD (2.5 in) AC or DC operation
Download data sheets and pricing now!
vita.opensystemsmedia.com/p371726
 sales@innovative-dsp.com
 805-383-8994
Innovative Integration
www.innovative-dsp.com/products.php?product=ePC-K7
Systems
mini-K7
The mini-K7 is a user-customizable, turnkey embedded instrument that
includes a full Windows/Linux PC and supports a wide assortment of
ultimate-performance FMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the mini-K7 reduces time-to-market
while providing the performance you need.
Distributed Data Acquisition – Put the mini-K7 at the data source and reduce
system errors and complexity. Optional GPS or IEEE1588-synchronized timing,
triggering and sample control is available for remote I/O. Limitless expansion
via multiple nodes. Up to 4 SSD for data logging.
Uniquely customizable – Dual FMC sites for I/O, user-programmable FPGA for I/O
interfaces, triggering and timing control, USB ports.
Remote or Local Operation – Continuous data streaming up to 3200 MB/s to
SSD or Gb/s Ethernet. Optional, stand-alone, autonomous operation with GPSsynchronized sampling.
Rugged – SSD boot drive support in a compact, rugged footprint that is ready for
embedded operation.
9-18V DC-Only Operation – Perfect for portable or automotive data loggers or
waveform generators.
Download data sheets and pricing now!
Innovative Integration
www.innovative-dsp.com/products.php?product=Mini-K7
44 | VITA Technologies Resource Guide Summer 2015 FEATURES
ĄĄ Combines an industry-standard COM Express CPU module with a single FMC
I/O module in an extremely compact, stand alone design
ĄĄ Programmable Kintex 7 325/410 and Spartan 6 FPGAs
ĄĄ Small form factor: 4" H x 7" W x 10" D
ĄĄ Conduction cooled design: Fins or cold-plate
ĄĄ Stand-alone operation: Able to operate headless, booting from SSD
ĄĄ Windows, Linux OS support; RTOS availability
ĄĄ Single VITA 57 FMC I/O module site. Add anything from RF receivers to
industrial control modules.
ĄĄ Integrated timing and triggering support for I/O includes GPS or
IEEE1588-disciplined clock
ĄĄ Supports Innovative and third-party FMC modules for private data channels,
triggering and timing features
ĄĄ 4 USB ports, 1Gb Ethernet, SATA (up to 4), DisplayPort Touch Screen
ĄĄ Up to 2 SSD (1.8 in); AC or DC operation
vita.opensystemsmedia.com/p372228
sales@innovative-dsp.com
 805-383-8994

www.vita-technologies.com
FEATURES
ATCA & MicroTCA Systems
Pixus Technologies’ ATCA® shelves and backplanes support a wide range
of applications in telecom, LTE, enterprise, military/aerospace, and HPC
environments. All shelves are designed to meet NEBS.
Pixus provides 3U, 5U, 6U, 8U, and 13U ATCA shelves with AC and DC
power options. Full redundancy is provided with dual shelf managers,
dual or quad cooling units, dual Hubs, and dual power modules. Pixus
40GBASE-40KR4 backplanes are monolithic with a high level of signal
integrity in dual star, full mesh, or replicated mesh.
Pixus Technologies’ MicroTCA® chassis and systems are based on the
PICMG® MicroTCA.0 R1.0 specification. With support for AC and DC input
power, the 19" rackmount mTCA systems support a range of applications
at the edge of the network in telecom, industrial, and military environments. Applications include network appliances, deep packet inspection,
surveillance, protocol conversion, and SIGINT.
PXS1340 13U ATCA Shelf
ĄĄ 40GBASE-KR4 Dual-Star or Full-Mesh 14-Slot Backplane
ĄĄ Front-to-Rear airflow supporting over 270W/Slot cooling performance
ĄĄ Full redundancy with dual ShMCs, Hubs and, PEM and squad CUs
PXS0640 Slot Saver 6U ATCA Shelf
ĄĄ 40GBASE-KR4 Dual-Star, Full-Mesh 6-Slot Backplane
ĄĄ Integration of Hubs with ShMCs adds 2 node slots
PXS1PXS0108 1U MicroTCA® Chassis
ĄĄ Low cost MicroTCA platform
ĄĄ Active backplane removes the need for expensive Power Entry Modules
(PEMs)
ĄĄ Side-to-side push-pull cooling removes the need for expensive Cooling
Units (CUs)
ĄĄ Supports up to 6 mid-height AMCs and 2 MCHs
PXS0309 3U ATCA Hybrid Chassis with 8 AMCs
ĄĄ 19" rackmount 3U ATCA Hybrid AMC Chassis
ĄĄ 1 ATCA slot and 8 mid-size AMC slots
vita.opensystemsmedia.com/p372778
Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components
 sales@pixustechnologies.com
 519-885-5775
Pixus Technologies
www.pixustechnologies.com
VME
MVME2500 Series
Artesyn’s MVME2500 Series makes a perfect migration path for older
generation MVME3100, MVME4100, MVME5100 and MVME5110.
On-board memory includes up to 2GB DDR3 memory and 512KB
non-volatile MRAM. The MVME2502 variant has 8GB soldered
eMMC solid state memory for additional rugged, non-volatile storage.
Connectivity includes Gigabit Ethernet, USB 2, serial ports, SATA port
and either one or two PMC/XMC sites with the MVME2500 and
MVME2502 respectively. A hard drive mounting kit is available for Serial
ATA or solid state hard drives. Extended temperature, rugged variants
and conformal coating are available. The MVME2500 Series is ideal for
automation, medical, and military applications such as railway control,
semiconductor processing, test and measurement, image processing,
and radar/sonar.
FEATURES
ĄĄ VME SBC with Freescale QorIQ P2010 or P2020 processor
ĄĄ Processor delivers an impressive performance-to-power ratio with
single- or dual-core frequencies up to 1.2 GHz at less than 8W
ĄĄ Up to 2GB DDR3 and 512KB non-volatile MRAM
ĄĄ Connectivity includes Gigabit Ethernet, USB 2, serial, SATA
ĄĄ Single PMC/XMC site on MVME2500 variant
ĄĄ MVME2502 variant has 8GB soldered eMMC and two PMC/XMC sites
ĄĄ Conformal coating available
ĄĄ Optional rear transition module
ĄĄ Optional hard drive mounting kit
vita.opensystemsmedia.com/p372745
Artesyn Embedded Technologies
www.artesyn.com/computing
www.vita-technologies.com

computingsales@artesyn.com
 linkedin.com/company/artesyn
 +1 (888) 412-7832
twitter.com/artesynembedded

VITA Technologies Resource Guide Summer 2015 |
45
VITA Technologies Resource Guide
Systems
VITA Technologies Resource Guide
VME
MVME8100 Series
MVME8100 Series is a high performance 6U VME/VXS SBC: The
MVME8100 features the Freescale QorIQ P5020 processor with up
to 8GB DDR3-1333MHz ECC memory, 512K NVRAM, and 8GB eMMC
NAND Flash; while the more MVME8110 variant features the Freescale
QorIQ P5010 processor supporting up to 4GB high speed DDR3-1200
MHz ECC memory, 512KB MRAM, and 8GB eMMC NAND Flash, for more
cost-sensitive applications.
The MVME8100 Series is offered in commercial and fully rugged
variants for extreme environments with extended shock, vibration,
temperatures and conduction cooling. It is designed for a range of high
end industrial control such as SPE and photo lithography and C4ISR,
including radar/sonar. It will provide technology insertion to prolong
current programs while providing more computing performance and
data throughput. Supported operating systems include Linux, Wind River
VxWorks, and Green Hills INTEGRITY.
FEATURES
ĄĄ VME/VXS SBC with Freescale QorIQ P5020/P5010
ĄĄ MVME8100: Up to 8GB DDR3-1333MHz ECC Memory, 512KB NVRAM
ĄĄ MVME8110: Up to 4GB high speed DDR3-1200 MHz ECC memory,
512KB MRAM
ĄĄ Embedded NAND Flash (8GB eMMC)
ĄĄ Extended temperature and conduction cooled variants
ĄĄ Conformal coating available
vita.opensystemsmedia.com/p372746
Artesyn Embedded Technologies
www.artesyn.com/computing

computingsales@artesyn.com
 linkedin.com/company/artesyn
 +1 (888) 412-7832
twitter.com/artesynembedded

VME
V120 VME PCI Express Crate Controller
The V120 is a VME bus master usable as a crate slot 1 arbiter or as a
secondary controller. Standard PCI Express cable driver boards allow any
PC to drive one or two V120s over PCI Express cable assemblies up to
7 meters long.
Designed for long-term availability, the V120 contains no proprietary
VME chips. Clean, simple architecture means no jumpers and no setup
needed for basic VME I/O. The V120 is supported by Highland’s free
open source Linux driver and library.
VME module registers are directly mapped into PC address space. The
V120 provides 8192 remapping registers, each controlling a 16 kbyte
PC-to-VME translation page with flexible timing and endian controls.
DMA and VME64 support are optional.
Ethernet and USB ports provide additional ways to access VME and
V120 intervals. Bus cycle analysis, power supply and temperature
monitoring are standard. The V120 is 100% software compatible with
the VXI format V124.
FEATURES
ĄĄ PC memory-mapped VME Crate Controller in single-wide 6U format
ĄĄ Cabled PCIe connects to PC over up to 7 meter PCI Express cable
ĄĄ Provides 8192 16kB VME mapping pages; individual page descriptors support address mapping/modifiers, speed options, dynamic endian swapping
ĄĄ Includes concurrent Ethernet and USB ports
ĄĄ Diagnostics: power supply and temperature
ĄĄ Reads back DTACK speed, address/data, and errors for any transaction
ĄĄ Front panel LEDs and bus signal scope monitors are provided
ĄĄ Optional DMA and VME64 support
ĄĄ No proprietary VME chips: designed for long-term availability
ĄĄ Clean, simple architecture: no jumpers and no setup needed for basic VME I/O
vita.opensystemsmedia.com/p372487
Highland Technology, Inc.
www.highlandtechnology.com/DSS/V120DS.shtml
46 | VITA Technologies Resource Guide Summer 2015 info@highlandtechnology.com
 415-551-1700

www.vita-technologies.com
Intermas – InterRail
Intermas develops electronic enclosure systems:
Cabinets, housings, subracks, and an extensive range of accessories
for the 19" rack systems used in the fields of PCI, VME/VME64x, cPCI,
IEEE, and communication applications with state-of-the-art EMI- and
RFI-shielded protection.
Intermas has an extensive product range of more than 10,000 separate
components and more than 30 years’ experience.
FEATURES
ĄĄ InterRail® products meet tough physical demands and vibration
proofs used for railway engineering, traffic engineering, and power
station engineering.
ĄĄ 19" subracks and housings with flexible internal layout.
Go to
ĄĄ EMI- and RFI-shielded protection using stable stainless steel
contact springs ensuring permanent and reliable bonding.
www.Intermas-US.com
ĄĄ Connectors and wiring accessories.
for our new catalog.
ĄĄ Customization available.
vita.opensystemsmedia.com/p372664
Intermas US LLC
www.Intermas-US.com
 intermas@intermas-us.com
 800-811-0236
VME
2mm High-Performance Metric (HPM) Cable Assemblies
Meritec HPM cable assemblies are a modular solution for highperformance backplane interconnect requirements. They are designed to
mate and work reliably with standard 2mm connector shrouds. The interlocking stackable wafers match the popular IEC-61076-4-101 types A,
B, and C housings, as well as the popular B22 shroud utilized for rP2/rP5
CompactPCI I/O applications. The shroud system is well suited for rugged
applications due to its unique retention system. B, the cable assembly
will lock tightly in place. This finished system securely retains the cable
connector against the strain of a cable bundle. The self-latching action of
the design is particularly convenient for hard-to-reach locations.
Visit our newly-designed website
http://www.meritec.com
for your Direct Connection to the Xtreme High-Speed Xperts!
FEATURES
ĄĄ Compatible with: Framatome Millipac 1, Berg Metral, Cannon Tempus,
Ceco FX-1, Amp Z-Pack FB, Other IEC 1076-4-102, Compliant
Backplane Connectors
ĄĄ 2mm x 2mm Spacing
ĄĄ 4 Contacts per row, Polarized, Shielded, Stackable Wafers
ĄĄ Individual Wafers can be Stacked up to 25
ĄĄ Second end Terminations include BNCs, SMAs, D-Subs, 38999,
Circulars, RJ45, Sata/E-Sata, USB and more …
vita.opensystemsmedia.com/p372749
Meritec
www.meritec.com
www.vita-technologies.com
www.facebook.com/pages/Meritec/142140812492429
 www.linkedin.com/company/meritec-inc.
 888-MERITEC (637-4832)
 info@meritec.com
VITA Technologies Resource Guide Summer 2015 |
47
VITA Technologies Resource Guide
VME
VITA Technologies Resource Guide
VME
cPCI, PXI, VME, Custom Packaging Solutions
VME and VME64x, CompactPCI, or PXI chassis are available in
many configurations from 1U to 12U, 2 to 21 slots, with many
power options up to 1,200 watts. Dual hot-swap is available in
AC or DC versions. We have in-house design, manufacturing
capabilities, and in-process controls. All Vector chassis and
backplanes are manufactured in the USA and are available with
custom modifications and the shortest lead times in the industry.
Series 2370 chassis offer the lowest profile per slot. Cards are
inserted horizontally from the front, and 80mm rear I/O backplane
slot configuration is also available. Chassis are available from 1U,
2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis
are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC
power options.
Our Series 400 enclosures feature side-filtered air intake and rear
exhaust for up to 21 vertical cards. Options include hot-swap,
plug-in AC or DC power, and system voltage/temperature monitor.
Embedded power supplies are available up to 1,200 watts.
Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is
available in 3U, 4U, and 5U models up to 7 horizontal slots.
All Vector chassis are available for custom modification in the
shortest time frame. Many factory paint colors are available and
can be specified with Federal Standard or RAL numbers.
For more detailed product information,
FEATURES
ĄĄ
Made in the USA
ĄĄ
Most rack accessories ship from stock
ĄĄ
Modified ‘standards’ and customization are our specialty
ĄĄ
Card sizes from 3U x 160mm to 9U x 400mm
ĄĄ
System monitoring option (CMM)
ĄĄ
AC or DC power input
ĄĄ
Power options up to 1,200 watts
please visit www.vectorelect.com
or call
1-800-423-5659 and discuss your application
with a Vector representative.
vita.opensystemsmedia.com/p371649
Vector Electronics & Technology, Inc.
www.vectorelect.com
48 | VITA Technologies Resource Guide Summer 2015  inquire@vectorelect.com
 800-423-5659
www.vita-technologies.com
Freescale T4-based Single-slot 6U VME/VPX SBCs
Aitech Defense Systems Inc. has enhanced the C111 and C112, two
of its Freescale T4-based single-slot 6U SBCs to include the new,
low power, multi-core, multi-processor T4080 QorIQ with AltiVec
technology.
The T4080 processor significantly enhances computing performance
and optimizes energy efficiency for lower power, high-end, floating
point computing applications. Like the 12-core T4240 and 8-core
T4160 also available on the SBCs, the 4-core T4080 QorIQ processor
features on-chip high speed L1 and L2 caches as well as an integrated
bus, a high speed memory switch fabric and I/O controllers.
The Aitech C111/C112 family fully supports Freescale’s Trust
Architecture 2.0. The entire T4xxx series of QorIQ processors provides
secure boot and debug, tamper detection, volatile hash key storage, alternate image and image revocation functionality in addition
to secure virtualization and hardware support for hypervisors. These
features address key issues in providing a highly secure processing environment for sensitive data security and supervisory control
typically found in manned and unmanned air and ground vehicles.
With their exceptional resistance to thermal shock and mechanical
shock and vibration, the 6U VME C111 and 6U VPX C112 SBCs are
ideal for use in high-end commercial, rugged industrial and defense
applications where board performance and costs can be uniquely
tailored to the application.
The new SBCs are equipped with two PMC/XMC sites to support
PCI/PCIe for high-speed functions and to expand board functionality.
Available in either conduction- and air-cooled versions, the boards can
be used in a diverse set of applications, limited only by the imagination of the software developers.
Ideal for legacy VMEbus applications, the C111 supports backplane
pin-out compatibility with previous generations of Aitech PowerPC
SBCs – including the popular Aitech C102 dual processor SBC –
eliminating costly system backplane changes.
The C111’s variety of standard I/O interfaces includes four Gigabit Ethernet ports as well as a SATA 2.0 port, dual USB 2.0 ports
and two optional, dual-redundant MIL-STD-1553 interface ports,
multi-protocol serial ports and multiple discrete I/O lines to enable
maximum data storage, inter-system communications and other
on-board accommodations.
The C112 supports VPX (VITA 46.0) and OpenVPX (VITA 65)
platforms and offers the same I/O as the C111, only more,
including up to six Gigabit Ethernet ports and multiple backplane
switch fabric options.
The C111 and C112 each provide 4 GB of high speed DDR3
SDRAM divided into two separate memory channels for efficient
processor-to-memory or memory-to-memory message passing
and data transfers. Additional memory resources include 256 MB
of NOR flash memory, up to 16 GB of Flash disk mass storage
and 512 kB of NVRAM (MRAM).
FEATURES
C111 Technical Features:
ĄĄ
ĄĄ
ĄĄ
ĄĄ
6U VME64x single-slot SBC
Low-power Freescale QorIQ multicore SoC processor (T4080)
with Altivec
4 GB high speed DDR3 SDRAM with ECC
Multiple I/O interfaces: four Gb E; two USB 2.0, one SATA 2.0,
10 serial ports and 16 discrete I/O lines
C112 Technical Features:
ĄĄ
ĄĄ
ĄĄ
ĄĄ
ĄĄ
6U VPX single-slot SBC (VITA 46.0 & VITA 65)
Low-power Freescale QorIQ multicore SoC processor (T4080)
with Altivec
4 GB high speed DDR3 SDRAM with ECC
Multiple I/O interfaces: six Gb E; two dual-redundant
MIL-STD-1553B, two USB 2.0, one SATA 2.0, 10 serial ports
and 16 discrete I/O lines
Multiple switch fabric options – PCIe, 10G, SRIO
vita.opensystemsmedia.com/p371908
Aitech Defense Systems, Inc.
www.rugged.com
www.vita-technologies.com


sales@rugged.com
https://www.linkedin.com/company/Aitech
 888-Aitech-8
http://twitter.com/AitechDefense

VITA Technologies Resource Guide Summer 2015 |
49
VITA Technologies Resource Guide
VME/VPX
VITA Technologies Resource Guide
VPX
Universal AC Input VITA 62 3U Power Supply
Dawn VME Products PSC-6236 universal AC input VITA 62 compliant
3U power supply for air or conduction cooled OpenVPX systems. True
6 channel supply with up to 400 watts output. Mission critical wide
temperature range at high power. Input 85 VAC to 264 VAC, 47 Hz to
400 Hz. Can be special ordered to support high current single channel
applications. Embedded RuSH™ technology actively monitors voltage,
current and temperature, and provides protective control. Ruggedized –
VITA 47 compliant. Rugged, Reliable and Ready. Current share compatible
with additional PSC-6236 units.
FEATURES
ĄĄ Universal AC input VITA 62 3U 400W AC/DC power supply with full
OpenVPX support
ĄĄ Air cooled, bulkhead conduction cooled and reverse side wedge lock
conduction cooled models
ĄĄ AC input: Single phase 85 VAC to 264 VAC, 47 Hz to 400 Hz
ĄĄ DC output PO1: +12V/16.7A, PO2: +5V/40A, PO3: +3.3V/30A,
Can be special ordered to support high current single channel applications.
Applications: Dawn’s PSC-6236 supports virtually any mission critical
application where universal AC input VITA 62 compliant 6 channel power
output with precision monitoring and control is required. Dawn offers
application-specific VITA 62 compliant power supply design, manufacturing and production through modifications to its PSC-6236 platform,
and can incorporate requirements into a customized power management
solution for prototyping and development.
+3.3V_Aux/4A, +12V_Aux/4A, -12V _Aux /3A
ĄĄ High power mission critical wide temperature range up to -40 °C to
+85 °C at the thermal interface
ĄĄ Microprocessor technology actively monitors voltage, current and
temperature, and provides protective control
ĄĄ Over voltage, over current and over temperature protection
ĄĄ I2C status and control user and IPMB interface
vita.opensystemsmedia.com/p372468
 sales@dawnvme.com
 510-657-4444
Dawn VME Products
www.dawnvme.com
VPX
6U Universal Chassis/Backplane Assembly
The LCR-ES 6U Universal Chassis/Backplane Assembly provides our
customers with an ideal, customizable solution for open-standards
application development. Able to support 6U VPX, VME, cPCI, or
custom backplanes, it provides between 2 and 21 slots depending
on the specific standard.
FEATURES
The three managed tubeaxial fans provide over 500 CFM with a
low-noise profile, and the Assembly can support two AC/DC power
supplies with universal AC inputs and a wide variety of DC outputs
to meet your specific needs. Power supplies include health monitoring of voltage, current, and temperature with local and remote
status available.
ĄĄ 19" rackmount or bench-top, IEEE 1101.10 compliant,
lightweight aluminum frame
ĄĄ Forced-air convection, bottom-to-top cooling
ĄĄ 4 x 120mmx120mmx25mm fans, 171 CFM each
ĄĄ 85/264VAC, 1 or 3 phase, 47-440 Hz
ĄĄ Optional DC input, up to 24 custom outputs
ĄĄ Optional input connectors, fuses or circuit breakers
vita.opensystemsmedia.com/p372777
LCR Embedded Systems
www.lcrembeddedsystems.com
50 | VITA Technologies Resource Guide Summer 2015 sales@lcrembedded.com
 1-800-747-5972

www.vita-technologies.com
VPX PLUS™ Design | Test | Deploy
Meritec’s VPX PLUS™ is today’s most versatile VPX MULTIGIG RT compatible
cabling system, allowing users to access and expand upon the traditional
VPX backplane. When bringing out VITA 46 and Open VPX I/O, developers
can utilize eSATA, Display Port, USB, Serial Rapid I/O, InfiniBand, Ethernet,
Meritec’s HERCULES® and other MIL-38999 connectors. Meritec’s VPX Plus
System, along with its I/O capabilities, is designed for full bandwidth testing
and can be adapted for deployment.
The standard VPX cabling terminology applies to Meritec’s VPX Plus cabling
system. Fat pipes, thin pipes, ultra-thin pipes are all available in multiple
lengths as COTS products; and thanks to Meritec’s unique stacking of wafers,
up to eight (8) wafers can be stacked to achieve final results, thus creating
a wide variety of development options. Your link to The Xtreme High-Speed
Xperts – http://meritec.com/wp-content/flipbooks/vpx-plus/
Visit our newly-designed website http://www.meritec.com
for your Direct Connection to the Xtreme High-Speed Xperts!
FEATURES
ĄĄ The Meritec VPX Plus is a cost effective and flexible alternative to
expensive rear-transition modules.
ĄĄ VPX Plus has less electrical losses than both backplane and rear-transition
module circuitry.
ĄĄ Provides a connection method allowing backplane circuit rerouting with
small electrical losses and low investment.
ĄĄ Adds functionality and flexibility to any system
ĄĄ 6U and 3U housing kits allow you to maintain complete control from test
to deployment.
ĄĄ Deployment rails, supplied with capped screws, enhance the ruggedness
and security of the system when deployed into real-world environments
ĄĄ COTS and standard pricing
ĄĄ Made In The USA
vita.opensystemsmedia.com/p372490
Meritec
www.meritec.com
www.facebook.com/pages/Meritec/142140812492429
 www.linkedin.com/company/meritec-inc.
 888-MERITEC (637-4832)
 info@meritec.com
VPX
6U VPX – 700 Watt AC/DC Power Supply
NAI’s VPX56-6 power supply supports VITA 46.0 and VITA 65 systems
with an off-the-shelf solution. The 700-Watt AC/DC power supply
plugs directly into a standard 6U VPX chassis with a VITA 62 power
supply slot (1.0” slot).
FEATURES
ĄĄ Ideal for rugged 6U VPX power applications
The conduction-cooled VPX56-6 accepts both a 3Ø AC or +270Vdc
input compliant with the input transients of MIL-STD-704F. It provides
six outputs and I/O per the VITA 62 standard.
ĄĄ Standard VPX-compatible connectors and I/O per VITA 62
The COTS power supply is specifically designed with NAVMAT component derating for rugged defense and industrial applications. It is
also designed to meet the many harsh environmental requirements of
military applications.
ĄĄ Operates at full load through the entire -40°C to +85°C
ĄĄ Supports VITA 46.0 and VITA 65 systems
ĄĄ Integrated EMI filtering per MIL-STD-461F
ĄĄ Input transient protection per MIL-STD-704F
ĄĄ
ĄĄ
ĄĄ
ĄĄ
temperature range
Remote error sensing
BIT
User programmable
Current share is available
Made in the USA
Certified Small Business
vita.opensystemsmedia.com/p372753
North Atlantic Industries, Inc.
www.naii.com/700-Watt-AC-DC-Power-Supply-6U-VPX/P279
www.vita-technologies.com
www.naii.com
 631-567-1100

VITA Technologies Resource Guide Summer 2015 |
51
VITA Technologies Resource Guide
VPX
VITA Technologies Resource Guide
VPX
VME-VPX System Health Monitors
Stand-off and 6U System Health Monitors with RTMs:
VME and VPX 6U System Health Monitors from the Orbit Electronics
Group are among the most advanced such components available today.
A companion rear transition module is available for extended I/O.
The HMC-A has 20 analog sensors (4 onboard and 16 external), plus
8 digital sensors. Voltage monitoring accepts 8 inputs: +3.3 VDC, +5
VDC, +12 VDC, and -12 VDC, plus four user-defined positive voltages
from 0 VDC to +28 VDC.
Also available in 3U form factor with highly customizable GUI.
VME-VPX Held to a Higher Standard.
FEATURES
ĄĄ Unique, proprietary Graphical User Interface (GUI) that enables
system designers to quickly and easily establish a broad range of
operating parameters.
ĄĄ Ethernet; USB and/or RS 232 interfaces; set-up; data logging; field
upgradable firmware; and data password protection.
ĄĄ Stand-alone form factor sizes are 80 x 120 mm and 51 x 51 mm
(see complete specs at www.vmevpx.com).
ĄĄ ICS is a Subsidiary of Orbit International (www.orbitintl.com) and a
member of the Orbit Electronics Group.
vita.opensystemsmedia.com/p372756
 info@vmevpx.com
 +1 866 319-8085
Integrated Combat Systems
www.vmevpx.com
VPX
3U VPX 4th Generation Intel i7 Single Board Computer –
VPX7664
Orion Technologies introduces its new small form-factor rugged
computer. Drawing its processing power from a new 4th generation
Intel Haswell processor, our 3U VPX design makes it ideal for high
performance small form factor applications.
Orion Technologies has taken advantage of the significant speed
increase of PCIe 3.0 by offering three PCIe 3.0 fatpipes. Along with
two 10G Ethernet ports (auto negotiate 10G/1G/100M) we offer
one of the highest performance processors on the market. Our configurable "personality module" allows for maximum flexibility and
configuration options. With I/O expansion and an XMC site this high
performance processor is ideal for multiple applications.
We can couple this with one of our high speed backplanes which are
capable of supporting PCIe 3.0 at full speed, making our solution one
of the highest performance systems available in the market.
FEATURES
ĄĄ Multi-Core 4th Generation Intel® CoreTM i7
ĄĄ Up to 16GB of soldered DDR3 SDRAM with ECC and Up to 64GB of
on-board NAND Flash
ĄĄ Trusted Platform Module
ĄĄ One 8-lane PCIe 3.0 XMC slot (Vita 42.3)
ĄĄ Three 4-lane PCIe v3.0 ports on VPX P1 (Vita 46.4)
ĄĄ Two 10GbE Base-T ports (auto negotiate 10G/1G/100M)
ĄĄ Anti-Tamper features available
vita.opensystemsmedia.com/p372700
Orion Technologies
www.oriontechnologies.com
 sales@oriontechnologies.com
 twitter.com/OrionEmbedded  www.facebook.com/OrionTechnologies
 www.linkedin.com/company/orion-technologies-llc  407-476-2120
52 | VITA Technologies Resource Guide Summer 2015 www.vita-technologies.com
VPX & OpenVPX Systems and Backplanes
Pixus Technologies provides VPX and OpenVPX packaging solutions
for a range of military and aerospace applications.
The Pixus VPX packaging solutions include subracks, enclosures,
backplanes, chassis, and integrated system platforms. In addition,
Pixus provides components and accessories such as fans, power supplies, card guides, guide rails, front panels, filler panels, and handles.
VPX systems from Pixus leverage over 20 years of superior cooling,
backplane, and packaging innovation with proven Pixus and Rittal
technologies. VPX chassis and systems can be modified to meet
customer requirements without NRE.
FEATURES
VPX & OpenVPX
ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VPX
and OpenVPX backplanes
ĄĄ Complies with VITA 46, VITA 48, VITA 65, VITA 1, VITA 1.1,
IEC 60 297-3 and IEEE 1101.1/1101.10/1101.11
VME & VME64x
ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VME
and VME64x backplanes
ĄĄ Complies with VITA 1, VITA 1.1, IEC 60 297-3 and IEEE
1101.1/1101.10/1101.11
vita.opensystemsmedia.com/p372779
Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components
 sales@pixustechnologies.com
 519-885-5775
Pixus Technologies
www.pixustechnologies.com
VPX
Themis High-Density Servers
Suited for computing environments where server Size, Weight, and
Power (SWAP) is important, Themis RES High Density (HD) servers are
designed for virtualization, ISR, Big Data Analytics, radar processing,
image processing, large Hadoop clusters, and a multitude of applications
that require high-compute density and low latency access to large-data
storage. RES HD Servers double compute density, enable a 50% savings
in rack space, and reduce system weight by nearly 50% with per server
weights as low as seven pounds.
Available in a 2RU (four bay) or 3RU (six bay) chassis, RES-HD servers
provide maximum system configuration flexibility and functionality with
processor, storage, high-speed switch, and system management module
options. Combining leading-edge components that include Intel® Xeon®
E5-2600 v3 Series processors and SuperMicro motherboards, RES
servers feature expansion slots, extensive high-speed front or rear I/O,
storage, and enhanced reliability options.
FEATURES
ĄĄ SWAP-C Ready
ĄĄ 2RU or 3RU Chassis Options
ĄĄ Intel® Xeon® E5-2660 v3 Series processors, and Supermicro
X9DRT-IBFF motherboards
ĄĄ Supports up to three 56 Gb/sec Infiniband (IB) or 40 Gb Ethernet ports
to provide industry leading I/O bandwidth
ĄĄ Maximum system configuration and expansion flexibility with processor,
ĄĄ
ĄĄ
ĄĄ
ĄĄ
ĄĄ
storage, high-speed switch, and system management modules options
Enhanced reliability for shock, vibration, and extended temperature
0° C to 55° C operating temperature range
8% to 90% operating humidity (non-condensing)
Operating vibration: 4.76 Grms, 5Hz to 2000Hz (SSD)
MIL-STD 810F, EN60000, CE Mark
vita.opensystemsmedia.com/p372688
Themis Computer
www.themis.com/hd
www.vita-technologies.com

www.themis.com/headquartersandsales
 linkedin.com/company/17952
 510-252-0870
 twitter.com/Themis_Computer
VITA Technologies Resource Guide Summer 2015 |
53
VITA Technologies Resource Guide
VPX
VITA Technologies Resource Guide
VPX
te.com/VPX
Rugged to the Core
TE Connectivity’s (TE) Fortis Zd, Mezalok and MULTIGIG RT 2-R
connectors provide extreme ruggedness and reliability in harsh
environments.
Fortis Zd
Fortis Zd Connector
• Modular, backplane connector systems
• 10 Gb/s+
• 4-point contact redundancy
• Ruggedized for harsh environments
Mezalok Connector
Mezalok
• 5 GHz+
• 500 mating cycles
• 4-point contact redundancy
• Available in 60, 114 and 320 positions and stack
heights options 10, 12, 15 and 18 mm
Multigig RT 2-R
MULTIGIG RT 2-R Connector
• Quad-redundant contact system
• Rugged survivability – High level shock and vibration
beyond VITA 47
• Backward compatibility to VITA 46 connector system
• “Pinless” interface tested to 10,000 mating/unmating
cycles
vita.opensystemsmedia.com/p372780
TE Connectivity Ltd.
te.com/VPX
54 | VITA Technologies Resource Guide Summer 2015  1-800-522-6752
www.vita-technologies.com
RUGGED
CAPABILITY WITHOUT
COMPROMISE.
You need embedded solutions that work where
you work. Brilliant enough to exceed your
performance expectations. Rugged enough to
take a beating in the process. Now you can have
it all … from a team that knows how to make things
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Embedded brilliance.
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Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 • Phone: 201.818.5900 • Fax: 201.818.5904 • e-mail:info@pentek.com • www.pentek.com
Worldwide Distribution & Support, Copyright © 2013 Pentek, Inc. Pentek, Onyx, ReadyFlow, GateFlow & GateXpress are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.