Computer Systems
General Overview
Computer Systems
ADLINK provides system products that deliver quality, reliability, durability, compatibility, high performance and long product lifecycle.
The heart of every one of our systems is a reliable, field-proven single board computer (SBC).
HPERC™
Sealed Extreme Rugged™ COTS computing platform in a tiny VITA-75 footprint, ideal for
ground, air, and sea deployments. Based on 3rd generation Intel® Core™ i7 CPU and optional
GPGPU parallel processing engine. Easily configured application-ready platform for fast
integration of custom rugged embedded applications. A wide array of fast IO provided on
uniquely-keyed MIL-DTL-38999 connectors.
MilSystem™
Designed for tight integration into military vehicle and other platforms. MIL-STD-D38999
connectors, rugged-by-design internal components, and completely passive cooling maximize
reliability for operations in harsh conditions. MilSystems™ provide shock and vibration immunity
exceeding MIL-STD-810G standards, and operate at full CPU speed over a wide temperature
range of -40 to +75°C.
RuffSystem™
Designed to tolerate the harshest environments, ADLINK’s RuffSystem™ products are truly
rugged by design. These Extreme Rugged™ systems provide passive convection cooling, use
ADLINK Extreme Rugged™ system boards, and meet MIL-STD-810G requirements for shock
and vibration over wide temperature and humidity ranges.
ReadySystem™
ReadySystem™ embedded computers accelerate time-to-market by providing a complete,
application-ready solution. The ReadySystem™ features an EPIC form factor ReadyBoard™
with all electronics in a compact housing for limited space applications. Each system can be
configured with various memory, hard disk and/or CompactFlash options.
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Computer Systems Selection Guide
HPERC™
MilSystem™
RuffSystem™
ReadySystem™
HPERC™-IBR
MilSystem™ 840
MilSystem™ 735
RuffSystem™ 840
RuffSystem™ 735
ReadySystem™ 850
EPIC Express with
AHD
COM 840 with rugged
EBX Carrier
LittleBoard™ 735
COM 840 with rugged
EBX Carrier
LittleBoard™ 735
ReadyBoard™ 850
EPIC Express
EBX with
COM Express
EBX
EBX with
COM Express
EBX
EPIC
CPU
Gen3 Intel®
Core™ i7 + GPGPU
Up to 1.66GHz
Intel® Core™ 2 Duo
1.6GHz Intel®
Atom™ N270
Up to 1.66GHz
Intel® Core™ 2 Duo
1.6GHz Intel® Atom™
N270
2.26GHz Intel® Core™ 2
Duo (Socket P)
Maximum Memory
16GB DDR3L 1333
4GB DDR2 667
2GB DDR2 533
4GB DDR2 667
2GB DDR2 533
4GB DDR3
PCI/104 Express, PCIe
MiniCard, MXM3.1
Mini PCI,
PCIe Mini Card
PC/104-Plus,
PCIe Mini Card
Mini PCI,
PCIe Mini Card
PC/104-Plus,
PCIe Mini Card
No
1TB SSD
128GB SSD
128GB SSD
128GB SSD
128GB SSD
HDD dependent
SDHC
CompactFlash
CompactFlash
CompactFlash
CompactFlash
CompactFlash
2x 2.5” Removable
Single 2.5”
Single 2.5”
2x 2.5”
Single 2.5”
Single 2.5”
TBC
2x GbE
2x GbE
1x GbE
2x GbE
2x GbE
3x DP/DVI/HDMI, 4x
2x RS-232
2xRS-232/422/485
4x USB, Parallel,
Audio, 1x PS/2 KB
2x RS-232
2x RS-232/422/485
4x USB, Parallel,
Audio, 1x PS/2 KB
2x RS-232
2xRS-232/422/485
4x USB, Parallel,
Audio, 1x PS/2 KB/MS
2x RS-232
2x RS-232/422/485
4x USB, Parallel,
Audio, 1x PS/2 KB/MS
2x RS-232/422/485
Windows® 7, Linux
(Windows® CE,
QNX, and VxWorks
supported)
Windows® XP or
Ubuntu Linux®
(Windows® CE,
QNX, and VxWorks
supported)
Windows® XP or
Ubuntu Linux®
(Windows® CE,
QNX, and VxWorks
supported)
Windows® XP or
Ubuntu Linux®
(Windows® CE,
QNX, and VxWorks
supported)
Windows® XP or
Ubuntu Linux®
(Windows® CE,
QNX, and VxWorks
supported)
Windows® XP Embedded
MIL-STD-1275
Wide-range 14 to 32
or 12 to 25 VDC
Wide-range 14 to 32
or 12 to 25 VDC
Wide-range 14 to 32
or 12 to 25 VDC
Wide-range 14 to 32
or 12 to 25 VDC
12 VDC
Conduction,
Convection Cooled
Convection Cooled
Convection Cooled
Convection Cooled
Fan Cooled
Sealed, Extreme Rugged™
Extreme Rugged™
Extreme Rugged™
Extreme Rugged™
Extreme Rugged™
Rugged
Standard Operating Temp.
-20°C to +65°C
-20°C to +65°C
-20°C to +65°C
-20°C to +65°C
-20°C to +65°C
0°C to +55°C
Extended Operating Temp.
-40°C to +75°C
-40°C to +75°C
-40°C to +75°C
-40°C to +75°C
-40°C to +75°C
--
Coldplate -
8.2” x 10” x 3.68”
8.2” x 10” x 3.68”
8.2” x 10” x 3.68”
8.2” x 10” x 3.68”
8.66” x 8” x 1.75”
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Internal Board
Form Factor
Expansion
Maximum Storage
Optional Drive
Internal Drive Bay
Ethernet
I/O
RS-232/422, 4x USB2, 2x
USB3.0, Audio In/Out
Standard OS
Power Supply
Cooling
4x USB, Audio,
1x PS/2 KB/MS
(Linux, Windows® CE 6.0,
VxWorks 6.6, QNX 6.4
supported)
Free Air Convection
Environment
Size (WxDxH)
63.5 x 150 x 203.4 mm
Heatsink 100 x 150 x 203.4mm
Page Number
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HPERC-IBR
High Performance Extreme Rugged™ Computer
System with 3rd Generation Intel® Core™ i7 CPU
Features
Computer Systems
3rd Generation Intel® Core™ i7 Processor
Soldered DDR3L-1333 8GB – Up to 16GB RAM
Quad Gigabit Ethernet
Ultra-Fast 12GB/s Solid-State-RAID with Secure
Erase
16-lane 3rd Generation PCI Express to optional
GPGPU
Small SWaP-efficient Sealed Enclosure
Three Digital DisplayPort/HDMI/DVI
Simple Expansion and Configuration
Sealed rugged COTS computing platform
Standard I/O
Inside the tiny footprint of HPERC™ lives the power of
3rd generation Intel® Core™ i7 processor and optional
GPGPU parallel processing engine. Dual removable secure
erase RAID-0 SSDs provide 12Gb/s throughput and security
for deployment in hostile environments.
Video Audio LAN Chipset LAN Speed eSATA USB Serial GPIO Easy configuration and expansion allows for fast
integration of custom rugged embedded applications.
HPERC™ reserves connector pins for expansion interfaces.
The GPGPU sits on a 16-lane 3rd generation PCI Express
interface. Uniquely-keyed MIL-DTL-38999 connectors
provide a wide array of fast IO.
Built with proven Ampro reliability, the rugged capabilities
of HPERC™ are ideal for ground, air and sea deployments.
HPERC™ systems survive shock, resist corrosion and
galvanic oxidation, and perform in the humid jungle, the
heat of the desert, and the bitter cold of frozen mountain
passes.
Core System
Processors
Chipset GPGPU Memory BIOS Expansion Busses 39
Internal Storage
Removable SATA
RAID
Removable 3rd Generation Intel® Core™ i7
Intel® Core™ i7-3517UE 1.7GHz, Dual Core
Intel® Core™ i7-3555LE 2.5GHz, Dual Core
Intel® Core™ i7-3612QE 2.1GHz, Quad Core
Intel® QM77 Express Chipset
Nvidia or AMD via MXM
16GB DDR3L-1333 ECC
8GB soldered down, 8GB SODIMM
AMI EFI
MXM (3rd Generation PCIe)
PCI/104 Express® (Gen2 PCIe)
PCI Express Mini Card (Gen2 PCIe)
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2 - 2.5” SLC SSD on SATA 3 Gb/s (Up to 1 TB)
0/1 supports up to 12Gb/s
SD 1 - SLC SDHC (Up to 64 GB)
Security
TPM Secure Erase Atmel AT97SC3204-U1A190
Hardware input triggered
Software triggered
Power
Input Performance Specifications
3x HDMI/DP/DVI
1x VGA/NTSC
1x Amplified Stereo output
1x Mono Mic input
4x Intel® I210 Ethernet controller
10/100/1000 Mbps
2x SATA 3Gb/s (non-powered)
4x 3.0
6x 2.0
4x RS-232/422
8x digital IO
9-36VDC
P-States 0-16 (Speedstep & Turbo)
S-States S3, S4, And IFFS
Thermal
Internal Transfer Storage Temperature HPERC-IBR-MC HPERC-IBR-M Passive conduction to body
-55°C to +85°C
Operating temperature: -40°C to +85°C
Coldplate conduction
VITA-75.22 mount
Operating temperature: -40°C to +75°C
Heatsink (free air convection)
VITA-75.20 or 21 mount
Mechanical
Environmental
Immersion Humidity Shock Vibration EMI/EMC Temperature Form Factor HPERC-IBR-MC HPERC-IBR-M IO Connectors IEC 529 - IP-67
MIL-STD-810G - 512.5 Procedure I
95% at 60°C non-condensing
MIL-STD-810G - 516.6 Procedures I and V
MIL-STD-810G - 514.6 Procedure I
Categories 4, 7-9, 13-15
MIL-STD-461F
FCC EN55022 ClassB
MIL-STD-810G - 501.5 Procedure II,
Method 1 and 3
MIL-STD-810G - 502.5,
Procedure 1 and 2
VITA-75.20/21/22 SFF mount
Coldplate - 2.5 x 5.9 x 8 inches 4.6 Lbs
(63.5mm x 150mm x 203.4mm 2.0 Kg)
Heatsink - 3.9 x 5.9 x 8 inches 6.7 Lbs
(100mm x 150mm x 203.4mm 3.0 Kg)
MIL-DTL-38999 (uniquely-keyed)
Functional Diagram
8/16GB ECC
DDR3 RAM
SDHC
GPGPU
(Nvidia or
AMD)
Intel PCH
QM77
PC-104
Express
SSD
Mini PCI
Express
User Expansion slots
Removable Media
SSD
Intel
3rdGeneration
I7 CPU
Ordering Information
Model Number
Description/Configuration
HPERC-IBR-M
Model Number
Description/Configuration
HPERC-IBR-MC
HPERC-IBR-M-R17
HPERC™ System with Intel® Core™
i7-3517UE, 2C, 17W, 8GB solder down
DDR3L-1333 RAM, D38999
HPERC-IBR-MC-R17
HPERC™ System with Intel® Core™
i7-3517UE 1.7GHz, 2C, 17W, 8GB solder
down DDR3L-1333 RAM, D38999
HPERC-IBR-M-L17
Quick-start kit including: HPERC™-IBR-MR17,
HPERC-X-01, and USB stick with
BSP/drivers and manuals
HPERC-IBR-MC-R25
HPERC™ System with Intel® Core™
i7-3555LE 2.5GHz, 2C, 25W, 8GB solder
down DDR3L-1333 RAM, D38999
HPERC-IBR-MC-R35
HPERC™ System with Intel® Core™
i7-3612QE 2.1GHz, 4C, 35W, 8GB solder
down DDR3L-1333 RAM, D38999
HPERC-IBR-MC-L17
Quick-start kit including: HPERC-IBRMCR17, HPERC-X-01, and USB stick
with BSP/drivers and manuals
HPERC-IBR-MC-L25
Quick-start kit including: HPERC-IBRMCR25, HPERC-X-01, and USB stick
with BSP/drivers and manuals
HPERC-IBR-MC-L35
Quick-start kit including: HPERC-IBRMCR35, HPERC-X-01, and USB stick
with BSP/drivers and manuals
HPERC Accessories
HPERC-X-01
HPERC™ breakout cable kit including all
IO and AC Adapter
DDR3L
HPERC™ 16GB RAM option
CC-DDR3
Comformal Coating option for HPERC 16GB
RAM option
CC-HPERC-IBR
Conformal Coating option for HPERCIBR
1553-HPERC
PC-104 Express MIL-STD-1553 option
429-HPERC
PC-104 Express ARINC-429 option
E6760-HPERC
AMD® E6760 600 MHz GPGPU with
800MHz 128-bit 1GB GDDR5 Memory
(All options ship installed, not all options are available in all systems,
not all options/systems can be combined)
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MilSystem™ 840
Extreme Rugged™ Intel® Core™ 2 Duo
COTS Military Computer
Features
Computer Systems
Passive convection-cooled chassis
Intel® Core™2 Duo processor
Uniquely-keyed D38999 connectors
Tested to MIL-STD-810G standards
Internal expansion for Mini PCI and PCIe Mini Card
Wide range input: 12 to 32 VDC
Windows® XP Professional or Ubuntu Linux®
Preinstalled
Windows® CE, QNX®, and VxWorks® supported
Specifications
Ordering Information
Core System
Model Number
Description/Configuration
MIL840W-02010-1101
MilSystem™ 840, 1.6GHz Core 2 Duo L7500, 32GB
SSD, 2GB RAM, WinXP Professional, 14-32VDC,
RoHS
MIL840W-02010-A101
MilSystem™ 840, 1.6GHz Core 2 Duo L7500, 32GB
SSD, 2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
MIL840W-03030-1101
MilSystem™ 840, 1.6GHz Core 2 Duo L7500, 128GB
SSD, 4GB RAM, WinXP Professional, 14-32VDC,
RoHS
MIL840W-03030-A101
MilSystem™ 840, 1.6GHz Core 2 Duo L7500, 128GB
SSD, 4GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
MIL-ACC-US
MilSystem™ Starter Kit: MC1, MC2, MC3 breakout
cables, AC adapter, software, and documentation
MIL-ACA-US
MilSystem™ AC adapter (19VDC output), power cord
CPU
Intel® Core™ 2 Duo L7500, 1.60 GHz, 4M L2 Cache, 800MHz
FSB, 17 W TDP
Intel® Core™ 2 Duo U7500, 1.06 GHz, 2M L2 cache, 533MHz
FSB, 10 W TDP
Intel® GME965 GMCH and ICH8-M
GME965 integrated Mobile Intel® GMA X3100
Dual Channel DDR2-667 SODIMM, up to 4GB
Chipset Graphics
Memory
Multi I/O and Storage
Expansion Slots
CompactFlash
Storage
VGA
LVDS
Ethernet
USB
Serial
Parallel
Floppy
PS/2
Audio
1x Mini PCI, 1x PCI Express Mini Card
1x CF socket accessible via rear panel
1x 2.5” SATA SSD (32, 64, 128GB), 1x External
supports up to 2048 x 1536 resolution
2x GbE (Intel® 82566, 82572EI controllers)
4x USB 2.0 ports (4 root hubs)
2x RS-232, 2x RS-232/422/485
1x EPP/ECP bidirectional port
Supported by USB (bootable)
Keyboard
Mic-in, Line-in, Line-out
Power
DC Input
14~32 VDC (standard)
12~25 VDC (optional)
Mechanical
Dimensions
Weight
208 x 254 x 93.4mm (8.2 x 10 x 3.68”) W x D x H
4.8 kg (10.6 lbs)
Environmental
Operating Temperature Standard: -20°C to +65°C
Extended: -40°C to +75°C
Storage Temperature -40°C to +85°C
Certifications
CE, FCC Class A, IP50 rated
Complies with MIL-STD-810G military standards for shock and vibration
Operating Systems
Standard Support
Windows XP Professional or Ubuntu Linux pre-installed
Extended Support (BSP)Windows CE, QNX or VxWorks
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Other configurations available. Please contact your salesperson.
Dimensions
Units: mm
RuffSystem™ 840
Extreme Rugged™ Intel® Core™ 2 Duo
Computer System
Features
Passive convection-cooled chassis
Intel® Core™ 2 Duo processor
Internal expansion for Mini PCI and PCIe Mini
Card
Tested to MIL-STD-810G standards
Wide range input: 12 to 32 VDC
Windows® XP Professional or Ubuntu Linux®
pre-installed
Windows® CE, QNX®, and VxWorks® supported
Specifications
Ordering Information
Core System
Model Number
Description/Configuration
RUF840W-02010-1101
RuffSystem™ 840, 1.6GHz Core™ 2 Duo L7500,
32GB SSD, 2GB RAM, WinXP Professional,
14-32VDC, RoHS
RUF840W-02010-A101
RuffSystem™ 840, 1.6GHz Core™ 2 Duo L7500,
32GB SSD, 2GB RAM, Ubuntu 8.04 LTS, 14-32VDC,
RoHS
RUF840W-03030-1101
RuffSystem™ 840, 1.6GHz Core™ 2 Duo L7500,
128GB SSD, 4GB RAM, WinXP Professional,
14-32VDC, RoHS
RUF840W-03030-A101
RuffSystem™ 840, 1.6GHz Core™ 2 Duo L7500,
128GB SSD, 4GB RAM, Ubuntu 8.04 LTS,
14-32VDC, RoHS
RUF-ACC-US
RuffSystem Starter Kit: AC adapter, software, and
documentation
RUF-ACA-US
AC adapter (19VDC output), power cord
CPU
Chipset Graphics
Memory
Intel® Core™ 2 Duo L7500, 1.60 GHz, 4M L2 Cache, 800MHz
FSB, 17 W TDP
Intel® Core™ 2 Duo U7500, 1.06 GHz, 2M L2 cache, 533MHz
FSB, 10 W TDP
Intel® GME965 GMCH and ICH8-M
GME965 integrated Mobile Intel® GMA X3100
Dual Channel DDR2-667 SODIMM, up to 4GB
Multi I/O and Storage
Expansion Slots
CompactFlash
Storage
VGA
Ethernet
USB
Serial
Parallel
PS/2
Audio
1x Mini PCI, 1x PCI Express Mini Card
1x CF socket accessible via rear panel
2x 2.5” SATA SSD (32, 64, 128GB)
1x DB15 connector, supports up to 2048 x 1536 resolution
2x GbE (Intel® 82566, 82572EI controllers)
4x USB 2.0 ports (4 root hubs)
2x RS-232, 2x RS-232/422/485
1x EPP/ECP bidirectional port
1x Keyboard/Mouse
3x 3.5mm jacks for Mic-in, Line-in, Line-out
Other configurations available. Please contact your salesperson.
Dimensions
Units: mm
Power
DC Input
14~32 VDC (standard)
12~25 VDC (optional)
Mechanical
Dimensions
Weight
208 x 254 x 93.4mm (8.2 x 10 x 3.68”) W x D x H
4.9 kg (10.8 lbs)
Environmental
Operating Temperature Standard: -20°C to +65°C
Extended: -40°C to +75°C
Storage Temperature -40°C to +85°C
Certifications
CE, FCC Class A, IP50 rated
Complies with MIL-STD-810G military standards for shock and vibration
Operating Systems
Standard Support
Windows XP Professional or Ubuntu Linux pre-installed
Extended Support (BSP)Windows CE, QNX or VxWorks
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ReadySystem™ 850
1U Computer System with Core™ 2 Duo
EPIC ReadyBoard™850 SBC
Features
Computer Systems
Specifications
Ordering Information
Core System
CPU
Intel Core™ 2 Duo Processor P8400
(2.26GHz, 3MB L2 cache, 1066MHz FSB, 25W TDP)
Intel® Celeron® Processor T3100 (dual-core, 1.9GHz,
1MB L2 cache, FSB 800MHz, 35W TDP)
Intel® GM45 Express Chipset (GM45 GMCH, ICH9-M)
Integrated Intel® GMA 4500MHD
Dual Channel DDR3 800/1066 SODIMM up to 4GB
®
Chipset Graphics
Memory
Multi I/O and Storage
CompactFlash
Serial
USB
Ethernet
VGA
PS/2
Audio
Serial ATA
Intel® Core™ 2 Duo Processor
Intel® GM45 Express Chipset
Dual Channel DDR3 SODIMM up to 4GB
Dual Gigabit Ethernet
1x CompactFlash type II socket
2x RS-232/422/485
4x USB 2.0 ports
2x Intel® 82574L GbE controllers
1x DB15 connector
1x PS/2 for Keyboard/Mouse
3x 3.5mm jacks for Mic, Line In, Line Out
1x internal HDD or SSD
Model Number
Description/Configuration
RB1-S85A-R-T31M1G160-00
ReadySystem™ 1U, ReadyBoard™ 850, T3100
1.9GHz CPU, 1GB RAM, 160GB HDD, 75W AC/DC
adapter
RB1-S85A-R-T31M4G160-00
ReadySystem™ 1U, ReadyBoard™ 850, T3100
1.9GHz CPU, 4GB RAM, 160GB HDD, 75W AC/DC
adapter
RB1-S85A-R-T31M4G160-02
ReadySystem™ 1U, ReadyBoard™ 850, T3100
1.9GHz CPU, 4GB RAM, 160GB HDD, 75W AC/DC
adapter, Window 7
RB1-S85A-R-P84M4G160-00
ReadySystem™ 1U, ReadyBoard™ 850, P8400
2.26GHz CPU, 4GB RAM, 160GB HDD, 75W AC/DC
adapter
Dimensions
Units: mm
Back View
Power
Input
Mode
12V DC from AC/DC adapter
AT power
220 x 203 x 44mm (8.66 x 8.00 x 1.75”) W x D x H
0°C to +55°C (AC/DC adapter 40°C only)
-20°C to +75°C
CE, FCC Class A
10% to 90%, non-condensing
1.7 kg net (3.7 lbs)
Left View
Top View
224
220
44
52
Dimensions
Operating Temperature
Storage Temperature
Certifications
Relative Humidity
Weight
203.2
Mechanical and Environmental
Operating Systems
Windows 7 installed (optional)
Other OS Support: Linux, Windows CE 6.0, VxWorks 6.6, QNX 6.4
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Front View
Right View
Bottom View