Electric and Magnetic Field Coupling to PCB
Transmission Lines and IC Packages
Tvrtko Mandic
Department of electronics, microelectronics, computer and intelligent systems
Faculty of Electrical Engineering and Computing
University of Zagreb
E-mail: tvrtko.mandic@fer.hr
Abstract—Electromagnetic compatibility (EMC) analysis of
high-speed circuits is mandatory due to the rapid increase in
operating frequencies, RF interference and PCB layout density.
Radiated emission and immunity tests of electronic circuits and
ICs are an important part of the overall EMC analysis and they
have become a growing concern in prediction of an electronic
system reliability. These tests are performed by a transverse
electromagnetic (TEM) cell or IC-Stripline according to the
standardized procedures. Depending on the layout of the trace
connected to the IC and EM field intensity, induced voltages
and currents can severely degrade signal integrity and system
performance, and potentially even permanently damage sensitive
components. The performance of the IC can be also compromised
by induced voltages and currents on the IC package and onchip transmission lines. Thus, an accurate and fast analysis of
electromagnetic coupling between the DUT and the TEM cell or
IC-Stripline is of great importance.
Index Terms—coupling models, transverse electromagnetic
(TEM) cell, IC-Stripline, transmission lines, package models,
lumped element model, 3D EM simulations.
I. I NTRODUCTION
The parts of IEC standards IEC-61967 [1], [2] and IEC62132 [3], [4] describe procedures for performing radiated
emission and immunity tests of electronic circuits and ICs,
respectively. In order to avoid costly design cycles resulted
from DUT inability to comply with maximum predefined
levels of radiated emission or immunity, the DUT EMC performance must be predicted in early design stages. Therefore,
accurate models used by standard circuit simulators that enable
simulation of radiated emission and immunity tests will result
in significant cost reduction and increase of overall system
reliability.
The PCB or on-chip transmission lines (e.g. clocks, reset,
watchdog, high-speed I/O, RF lines, etc.) are often considered
as sensitive elements in terms of EMC. Their poor radiated
emission or immunity performance can have negative effect on
overall system EMC performance. The characterization of the
coupling between the transmission lines and radiated EM fields
is performed at two different levels: PCB and IC level (Fig. 1).
The PCB level coupling measurements are carried out by a
commercially available TEM cell [5], while the measurements
of the coupling at the IC level require an IC-Stripline setup in order to generate EM fields [6]. The IC-Stripline setup is defined in the emerging procedure for measuring EMC
PCB level
immunity
TEM cell
emission
IC level
IC-Stripline
Fig. 1. Radiated emission and immunity tests are performed on PCB and IC
level. PCB level tests utilize TEM cell, while IC level test utilize IC-Stripline.
of ICs and it is not commercially available. Therefore, inhouse design of IC-Stripline is required in order to perform
measurements.
The circuit simulation of EMC tests requires circuit models
of each element included in EMC test set-up. This means
that circuit models for TEM cell and IC-Stripline should be
proposed. Furthermore, the transmission lines models and IC
package models including the fixtures are also included in
such circuit simulation. Finally, the models of TEM cell and
IC-Stripline EM field coupling to the PCB and IC package
structures, respectively, have to be proposed.
The paper is structured as follows. Section II presents the
motivation and requirements for building the circuit models
related to the PCB level EMC tests. Section III provides the
same for the IC level EMC tests. For both levels preliminary
results are presented in Section IV. Section V brings the
conclusion.
II. M ODELLING OF PCB L EVEL EM F IELD C OUPLING
This section presents the overview of the recently performed
research for the PCB level EM field coupling modelling
between the TEM cell and the PCB transmission lines. Furthermore, the motivation and directives for future research are
given.
and inductance with the correction regarding to the loss in
the hybrid. The same measurement set-up is used to estimate coupling capacitance and inductance values in order to
characterize radiation from the structures with attached cables
[23], [24]. The coupling modelling presented in [25] has been
presented only up to 1 GHz with limited accuracy.
A. TEM Cell Modelling
D. Motivation
Design of the TEM cell has gained a lot of attention since
the first paper about generation of EM fields in the TEM
cell [7]. The focus of subsequent research was mainly on
increasing the TEM cell cut-off frequency by suppressing
the higher order modes of propagation and on mapping of
the EM field inside the TEM cell [8]–[11]. Modelling of
the symmetrical TEM cell can be performed by a lumped
element cascaded LC model [12]. As the operating frequency
of the TEM cell increases, the model based on the cascaded
LC lumped elements becomes less suitable. In [13], [14]
simplicity of used TEM cell models can compromise accuracy
of emission or immunity spectrum recorded by spectrum
analyser.
Goal of this work is to propose circuit model for TEM
cell. This model should be valid for frequency range of
commercially available TEM cell [5]. Furthermore, the TEM
cell model must take into account construction related TEM
cell asymmetries which may be present.
This work will extend previous research [22], [25] by
taking into account the conductor-backed coplanar waveguides
(CPW-CB). The CPW-CB and MS lines most common transmission lines used in PCB design. In order to verify the
coupling models transmission lines will be designed having
various:
• substrate heights
• parameters (width, gap)
o
o
o
o
o
• orientations (0 , 30 , 45 , 60 and 90 )
• layouts (meander-like structures).
The low-cost FR-4 substrate will be used for line processing
as it is most interesting substrate for manufacturers of the
electronic equipment.
The model parameters that describe coupling between the
transmission lines and TEM cell septum can be calculated by
using the Method of Lines (MoL) [26]. This method is very
efficient for solving partial differential equations and can be
easily applied to the analysis of planar microwave structures
[27]. Simple 2k MoL experiment (set of MoL calculations)
can be performed in order to derive closed-form equations
by linear regression for coupling parameters calculation. The
2k MoL experiment parameters are geometrical parameters of
transmission line and PCB,
• PCB height
• PCB dielectric constant
• transmission line parameters
– width for MS line
– gap and width for CPW-CB line.
The MoL experiment for e.g. CPW-CB transmission lines
needs four parameters to be varied which results 24 = 8 MoL
simulations to be performed. This number of MoL simulations
can be carried out very fast.
The calculated coupling parameters are directly related to
the lumped element coupling model which enables physical
interpretation of the coupling phenomena, which is not evident
in [28]. Furthermore, presented methodology enables tuning of
the line parameters in order to obtain better EM immunity
of the transmission lines. Since the MoL input parameters
are the cross-sectional dimensions of the whole structure,
this procedure can be easily applied to the TEM cells of
different geometry, i.e. IC-Stripline structure for measuring
EMC performance of ICs [6]. In [22]–[24] a hybrid is used to
B. Modelling of PCB Structures
The models for conductor-backed coplanar waveguides
(CPW-CB) and microstrip (MS) lines are very well covered
by literature and embedded in almost every SPICE-like circuit
simulator [15], [16]. Since the de-embedding of the connectors
used for lines to the measurements equipment connection cannot be easily performed without introducing the error (when
inserted in TEM cell whole line length is exposed to EM-field,
and de-embedding includes also a section of the transmission
line just after the connector), they have to be considered as
intrinsic part of the transmission line. The lumped-element
perpendicular SMA connector models presented in [17]–[19]
are not accurate enough in the frequency range of the TEM
cell. In [12] SMA connector model based on the connector
physical parameters is presented, but the model validation
in time domain has not been demonstrated. The lumped
element model presented in [20] includes frequency dependent
parameters and therefore does not give physical interpretation
nor ability of transient simulations. The model presented in
[21] is applicable only to special multilayered substrates for
coaxial-to-microstrip transition. Since the goal of research is
to characterize coupling for simple two-layer PCB and also
for CPW-CB lines, new connector model should be proposed.
C. Coupling Modelling Between TEM Cell and PCB Transmission Lines
The coupling mechanism between the TEM cell septum
and the MS lines is explained in [22]. Presented TEM cell
measurement set-up utilizes centrally positioned microstip line
with respect to the TEM cell opening and a hybrid which
generates sum and the difference of the voltages at either
end of the TEM cell in order to distinguish between the
magnetic and electric field coupling. The equations based on
measurements are proposed to calculate coupling capacitance
2
2k Experiment
distinguish between the electric and magnetic field coupling.
This work will use transmission lines lying in different directions to give rise to the electric or magnetic field coupling,
thus avoiding the use of the hybrid and the requirement
for symmetric positioning of the PCB lines. Furthermore,
coupling models based on MoL can be used to avoid TEM
cell measurement step in radiation estimation procedure from
the structures with attached cables [23], [24].
Parameters:
width,pitch,
distance...
Simulator:
2D or 3D EM
Structure:
lead frame,
paddle, bond
wires
III. M ODELLING OF IC L EVEL EM F IELD C OUPLING
Extraction of circuit model
parameters
e.g. lead frame circuit model
L1
LEAD1
M12
C13L C12L
C1/2
M13
L2
C1/2 C12R C13R
Closed form
equations
e.g.
L1 [nH/mm] = 0,732 –
0,036w1c + 0,002p1c +
0,002p2c – 0,006 Δp2c +
0,008 d1c – 0,036 w2c
LEAD2
Fig. 2. Response surface methodology (RSM) used for IC package modelling.
The IC-Stripline measurement set-up is emerging procedure
for characterization of radiated emission and immunity performance of ICs [29], shielding [30], etc. This research employs
IC-Stripline set-up to quantify level of the EM field coupling
to the IC package and on-chip transmission lines.
of EM simulation that has to be performed. Therefore, it
is of great importance to keep number of parameters as
low as possible to maintain short simulation time. After the
completion 2k EM experiment extraction of model parameters
takes place based on every EM simulation performed within
2k EM experiment. The lumped model parameter values are
optimized in order to obtain fit between the lumped model and
EM simulation results. The geometrical parameters represent
independent variables, while extracted per-unit-length (p.u.l.)
parameters of the lumped model represent responses. The
expected response as a function of the independent variables
is called a response surface. The relationship between the
response and independent variables is usually unknown. The
first step of the response surface methodology (RSM) is to
find an suitable approximation for the relationship between
the response and the independent variables. For the response
surfaces with negligible curvature this can be done by using
first-order model. This results in linear closed-form expressions for values of lumped element model parameters with the
physical dimensions of the lead frame as the input variables.
A. Design and Modelling of IC-Stripline
The construction of IC-Stripline and maximum frequency
of 3 GHz for testing the ICs is proposed in [6]. In [31]
impact of the different height, differences between the open
and closed version and the maximum dimension of the IC have
been analysed. Nevertheless, the presented results for the open
versions of IC-Stripline [6], [31] do not meet the requirement
that VSWR should be less than 1,2 over the frequency range up
to 3 GHz. Since the IC-Stripline is not commercially available
product, it is necessary to design and produce it.
B. Response Surface Methodology for Package Modelling
The package modelling procedure is based on the Response
Surface Methodology (RSM) [32]. The RSM is often considered as a collection of mathematical and statistical techniques
useful for the modelling and analysis of problems in which a
response of interest is influenced by several variables and the
objective is to optimize this response. In terms of package
modelling, RSM is used to assess the impact of statistical
variations of geometrical and structural parameters on performance (package resonances, insertion loss, etc.).
Each family of IC packages (e.g. [33]) can be subdivided
in groups according to the pin number, and each group can
have a number of different lead frame and wiring layouts.
In order to be able to build models for each layout, the
individual modelling of each layout should be performed,
which is expensive and very time consuming. This work is
motivated by the need of designers to have scalable models
which could be easily applicable on various lead frame and
wiring layouts.
Fig. 2 presents the RSM workflow proposed for modelling
the IC packages. The 2k EM experiment is set of EM simulations performed on parts of the IC package structures. The lead
frame, bond wires and paddle are basic parts of IC package.
These parts are simplified in order to keep complexity of
simulated structures lower, and to make them more generic and
applicable to wide range of real assembled package structures.
The 2k EM experiment is carried out by varying geometrical
parameters of simulated structures. The number of parameters
used in 2k EM experiment directly determines the number
C. Coupling Modelling Between IC-Stripline and IC Package
Structures
The modelling of the coupling between the IC-Stripline and
the IC package structures as well as on-chip transmission lines
will be performed. The coupling characterization between the
IC-Stripline and the IC packages will be performed on the
various packages having:
• substrate thickness variations
• different wiring configurations
• elevated or grounded paddle
The coupling mechanism at IC level is the same as at PCB
level. Therefore, the modelling methodology developed for
the coupling of the EM field to the PCB transmission lines
should be applicable in some extent to the IC-Stripline EM
field coupling to the IC package structures.
D. Motivation
The motivation for this work is to design an IC-Stripline
which will meet the VSWR requirement. The 3D EM simulators will be used to tune the IC-Stripline geometrical
parameters in order to obtain the VSWR less than 1,2 in the
frequency range up to 3 GHz. The VSWR is necessary to keep
below 1,2 in order to obtain magnitude of standing waves
3
at reasonably low level. VSWR value higher than 1,2 can
introduce standing waves which can compromise uniformity of
the EM field distribution and also increase amount of reflected
power back to the source. The prototype of the IC-Stripline
will be modelled in both 3D EM and in SPICE simulator. After
performing the IC-Stripline sensitivity analysis with respect to
the geometrical and fixture parameters, the final model will
be proposed. The tapers as the part of IC-Stripline with nonuniform cross-section will be shaped carefully in order to keep
characteristic impedance as close as possible to 50 Ω over
the whole frequency range of interest. The open version of
IC-Stripline will be designed as it presents the cheaper and
simpler set-up comparing to the closed version.
The final goal of the RSM based models are scalable
lead frame, bond wire and paddle models which are easily
applicable on various package layouts. The RSM based models provide closed-form equation for lumped element model
calculation with respect to the package geometrical parameters
only.
An accurate characterization of the IC-Stripline electric
and magnetic field coupling to the package and on-chip
transmission lines requires modelling of each segment related
to the coupling path. The models developed for PCB level EM
field coupling will be used and scaled down for the IC level
coupling.
attenuation cannot be neglected. The transition from the Ntype connector to the beginning of the septum, which is a short
junction, is modelled by two TLIN components. Furthermore,
each taper is divided into three sections to accurately model the
change in the characteristic impedance along the taper length.
It is possible to use more than three TLIN components in
order to model more accurately the shape of the septum [34],
but the improvement in accuracy is not so pronounced for the
frequency range discussed in this paper. The central section
of the septum is modelled by only one TLINP component,
although it is 140 mm long, because it has a uniform crosssection.
SXX Magnitude [dB]
0
Fig. 4.
LEFT TAPER
3
CENTRAL
SECTION
N-CONNECTOR
TO SEPTUM JUNCTION
PORT 2:
50 Ω
Fig. 3.
12
10
5
4
9
8
Meas
Model
0.2
0.4
S11
0.6
0.8
1
Frequency [GHz]
−1000
1.2
1.4
1.6
TEM cell model built by using generic transmission lines.
In Fig. 4 the measurements and modelling results are
compared for the reflection parameters Sxx . The TEM cell
asymmetry is only apparent in the phase of the reflection
S-parameters, and that is the reason why the characteristic
impedances of the left and right taper are optimized independently.
The coupling results between the septum of the TEM cell
and meander MS line are presented in Fig. 5. These results
are obtained in circuit simulator. Simulation is performed on
circuit that is built by using TEM cell model, transmission
line model including the SMA connectors and lumped element
model for coupling. The coupling parameters are obtained
by MoL. More detailed explanation of performed work is
published in [35]–[37]. The journal paper is submitted for
review [38].
A. Modelling of EM Field Coupling at the PCB level
2
S11, S22
0
This section presents the preliminary results related to the
PCB level EM field coupling. Furthermore, preliminary results
related to the modelling of the IC packages using RSM are
also presented as well as the results related to the design of
the IC-Stripline.
1
−20
−40
IV. P RELIMINARY R ESULTS
PORT 1:
Signal
input
S22
SXX Phase [deg]
0
6
7
RIGHT TAPER
TEM cell model built by using generic transmission lines.
The TEM cell model presented in Fig. 3 is built by using
generic TLIN and TLINP transmission line models available in
Agilent ADS circuit simulator [15]. The TLIN component represents an ideal transmission line and is fully characterized by
only two parameters: characteristic impedance and electrical
length. The TLINP component represents a lossy transmission
line characterized by the characteristic impedance, length,
dielectric and metal losses. The TLINP component can be used
for the modelling of each section as it represents a transmission
line more accurately, but for the sake of simplicity it is
used only to model the central section of the TEM cell. The
central section of the TEM cell is the longest section and its
Fig. 5. Measurements and modelling of the coupling for the meander MS
line (w = 2.6 mm, h = 1.55 mm FR-4) for two different orientations.
4
for IC packages are based on response surface methodology
(RSM) which enables statistical analysis of package performance and also applicability of such models to the wide range
of packages.
Next steps in the research are focused on measurements
of various IC packages having different wiring layouts. This
will enable verification of package models obtained by RSM.
As the final step, the accurate IC package models will enable
modelling of the EM field coupling between the IC-Stripline
and IC package. These models will help designer to predict
EMC behaviour of critical PCB and on-chip transmission lines
in early design stage.
B. Modelling of EM Field Coupling at the IC level
The design of the IC-Stripline is performed. The goal is to
keep VSWR below 1,2 up to the 3 GHz. This is feasible only
if the taper shape is optimized. Fig. 6 presents the comparison
between the measured VSWR for the IC-Stripline with and
without optimized shape of the taper. The improvement is
significant for the whole frequency range, and VSWR reaches
the maximum value of 1,16 at 1,3 GHz. More details on
performed research can be find in [39].
1.5
1.4
Magnitude
R EFERENCES
1.3
Smooth taper
Notched taper
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Frequency [GHz]
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Fig. 7.
Coupling between first two leads of TQFP100 package.
V. C ONCLUSION
This work presents an overview of performed research
related to the PCB level and IC level EM field coupling to
the transmission lines and IC package structures. Furthermore,
directives for future work are given. The final goal of this
research are circuit models for EM field coupling to both PCB
and on-chip transmission lines. This requires accurate models
of the TEM cell and IC-Stripline as well as models of the
IC packages and EM field coupling mechanism. The models
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6