ECE606: Solid State Devices Lecture 17 Schottky Diode Gerhard Klimeck gekco@purdue.edu 1 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Presentation Outline 1) Importance of metal-semiconductor junctions 2) Equilibrium band-diagrams 3) DC Thermionic current (simple derivation) 4) Intermediate Summary 5) DC Thermionic current (detailed derivation) 6) AC small signal and large-signal response 7) Additional information 8) Conclusions Reference: Semiconductor Device Fundamentals, Chapter 14, p. 477 Klimeck – ECE606 Fall 2012 – notes adopted from Alam 2 Metal-semiconductor Diode Symbols M N ND Metal Wire N 3 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Applications of M-S Diode …. STM(scanning tunneling microscope) Detectors on semiconductor CNT(carbon nanotube) Original Bipolar Transistors www.fz-juelich.de/ibn/index.php?index=674 Originally, Gelena (PbS), Si as semiconductor and Phospor Bronze for metal (cat’s whisker) Klimeck – ECE606 Fall 2012 – notes adopted from Alam 4 Presentation Outline 1) Importance of metal-semiconductor junctions 2) Equilibrium band-diagrams 3) DC Thermionic current (simple derivation) 4) Intermediate Summary 5) DC Thermionic current (detailed derivation) 6) AC small signal and large-signal response 7) Additional information 8) Conclusions 5 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Topic Map Equilibrium DC Small signal Large Signal Circuits Diode Schottky BJT/HBT MOS Klimeck – ECE606 Fall 2012 – notes adopted from Alam 6 Drawing Band Diagram in Equilibrium… ∇ • D = q ( p − n + N D+ − N A− ) Equilibrium ∂n 1 = ∇ • J N − rN + g N ∂t q J N = qnµ N E + qDN ∇n DC dn/dt=0 Small signal dn/dt ~ jωtn Transient --- full sol. ∂p 1 = − ∇ • J P − rP + g P ∂t q J P = qp µ P E − qDP ∇p 7 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Band-Diagram 1. EF flat in equilibrium 2. EC/EV in Metal 3. Vacuum level in Metal 4. Ec/Ev in semiconductor 5. Vacuum level in semiconductor ND 6. Connect vacuum levels Vacuum level ΦM 7. duplicate the connections down to Ec/Ev χ EC EV EF Since NA is large, xp is negligible .. N A x p = N D xn Charge(metal) = charge(semiconductor) Klimeck – ECE606 Fall 2012 – notes adopted from Alam 8 Built-in Potential: bc @Infinity neglect qVbi ΦM χ ΦB ∆ qVbi = ( Φ M − χ ) − ∆ ≡ Φ B − ∆ ∆ + χ + qVbi = Φ M = Φ B − k BT ln ND nondegenerate NC 9 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Analytical Solution (Simple Approach) Depletion Approximation ρ qND Actual Xn QM =-QD E integrate Xn x x Q qN x Emax = D = − D n K ε K sε 0 Area negligible s 0 QD = NDXn integrate φ qφB Φmax=qVbi EC x Xn EV Xn x Klimeck – ECE606 Fall 2012 – notes adopted from Alam φmax = − Emax xn 2 Notice how we neglect xp here, is 10 there a proof? Complete Analytical Solution Charg e x + - n Position x E ( 0+ ) = qN D xn k sε 0 E ( 0− ) = qN M x p ksε 0 ? ⇒ N D xn = N M x p p E-field Position Potentia l qVbi = = E ( 0− ) xn 2 2 + E ( 0+ ) x p 2 qN M x p 2 qN D xn + 2k s ε 0 2k sε 0 Position 11 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Depletion Regions ND xp xn N D xn = N M x p qVbi = 2 qN D xn 2 qN M x p + 2k s ε 0 2k s ε 0 xn = 2k sε 0 NM 2k s ε 0 1 Vbi → Vbi q ND ( NM + ND ) q ND NM ∞ 2k sε 0 ND xp = Vbi → 0 q NM ( NM + ND ) This is why we can neglect xp Klimeck – ECE606 Fall 2012 – notes adopted from Alam 12 Presentation Outline 1) Importance of metal-semiconductor junctions 2) Equilibrium band-diagrams 3) DC Thermionic current (simple derivation) 4) Intermediate Summary 5) DC Thermionic current (detailed derivation) 6) AC small signal and large-signal response 7) Additional information 8) Conclusions 13 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Topic Map Equilibrium DC Small signal Large Signal Circuits Diode Schottky BJT/HBT MOS Klimeck – ECE606 Fall 2012 – notes adopted from Alam 14 Band Diagram with Applied Bias… ∇ • D = q ( p − n + N D+ − N A− ) ∂n 1 = ∇ • J N − rN + g N ∂t q J N = qnµ N E + qDN ∇n Band diagram … This works for doping-modulated Semiconductors. ∂p 1 = − ∇ • J P − rP + g P ∂t q Does not work for heterostructures (when the conduction band is not continuous) J P = qp µ P E − qDP ∇p Metal-Semiconductor is a HS Need theory of thermionic Klimeck – ECE606 Fall 2012 – notes adopted from Alamemission 15 Depletion Regions with Bias ND xp xn xn = 2k sε 0 NM 2 k sε 0 1 Vbi → (Vbi − VA ) q ND ( NM + ND ) q ND xp = 2 k sε 0 ND Vbi → 0 q NM ( NM + ND ) Klimeck – ECE606 Fall 2012 – notes adopted from Alam Forward bias: xn decrease Reverse bias: xn increase 16 Band-diagram with Bias Forward Bias qVbi-V EC-EF VA qVbi EC-EF Reverse Bias VA EC-EF 17 Klimeck – ECE606 Fall 2012 – notes adopted from Alam I-V Characteristics Forward Bias Ec EF VA I Metal EF ESF EV M N-type Semi. 1,2,3 4 – generation current 5 – impact ionization I 6,7 Reverse Bias EF 4 M Ec EF ESF EV Klimeck – ECE606 Fall 2012 – notes adopted from Alam 5 1 – diffusion control 2 – ambipolar 3 – resistance drop 6 – defects – trap assist 7 – Esaki 18 Current Flow Concept Barrier The same! M=>S current unchanged! Partition problem in 2 currents M=>S S<=M Barrier smaller M<=S increased ΦB qVbi-VA EC-EF Forward Bias VA qVbi ΦB EC-EF Barrier The same! M=>S current unchanged! ΦB Barrier bigger M<=S decreased q(Vbi+VA) VA In Equilibrium: and are equal M=>S current Independent of bias! EC-EF Reverse Bias 19 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Left Boundary Condition We use thermionic emission because: 1. EC is not continuous here 2. There’s no minority carriers! J T (VA = 0) = 0 = J m → s (0) − J s → m (0) ⇒ J m → s (0) = J s → m (0) J T (VA ) = J m→ s (VA ) − J s →m (VA ) = J m→ s (0) − J s → m (VA ) q(Vbi-VA) E C VA (detailed balance) M=>S current independent of bias J T (VA ) = J s → m (0) − J s → m (VA ) Klimeck – ECE606 Fall 2012 – notes adopted from Alam 20 Semiconductor to Metal Flux V ns − q kTbi J s →m (0) = − q e υth = J m→ s (0) J m→ s (0) = 2 V −V qΦ ns − q bikT A nm − kT υth J m→ s (VA ) = − q e υth M J s → m (VA ) = − q e 2 2 qV qVA nsυth − kTbi Only the ones = −q e × e kT Only half of above the 2 them goes to barrier goes to qV B the right = J s → m (0) e the right q(Vbi-VA) EC-EF VA = J m → s (0) e qVA kT nυ − = −q m th Me 2 qnmυthM − qkTΦΦm J T = J s → m (0) − J s →m (VA ) = e 2 B Klimeck – ECE606 Fall 2012 – notes adopted from Alam A kT qΦ B kT e qVA kT qVkTA e − 121 Diffusion vs. Thermionic Emission ∆n Fp Fn Check that both gives the same result for a diode… Fn Fp Klimeck – ECE606 Fall 2012 – notes adopted from Alam Thermionic Emission theory is a more general approach, can be used for device so small that no scattering occur (can’t use diffusion!). 22 Intermediate Summary Schottky barrier diode is a majority carrier device of great historical importance. There are similarities and differences with p-n junction diode: for electrostatics, it behaves like a one-sided diode, but current, the drift-diffusion approach requires modification. The trap-assisted current, avalanche breakdown, Zener tunneling all could be calculated in a manner very similar to junction diode. 23 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Presentation Outline 1) Importance of metal-semiconductor junctions 2) Equilibrium band-diagrams 3) DC Thermionic current (simple derivation) 4) Intermediate Summary 5) DC Thermionic current (detailed derivation) 6) AC small signal and large-signal response 7) Additional information 8) Conclusions Klimeck – ECE606 Fall 2012 – notes adopted from Alam 24 Energy Resolved Thermionic Flux Energy < 1 * 2 m υ min 2 will be bounced back ∞ ∞ −υ min J s→m = −q ∫ ∫ ∫ −∞ −∞ −∞ Occupation (non-denegerate) ~ DOS Ω dk x dk y dk z e −( E − EF ) β υ x 3 4π υ Only movement in the x direction will contribute to the current flux min q(Vbi-VA) VA EC-EF x 25 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Thermionic Flux from Semi to Metal .. ∞ ∞ −υmin −∞ −∞ −∞ J s →m = −q ∫ ∫ ∫ E E − E F = ( E − EC ) + ( EC − E F ) = = qe − ( Ec − EF ) β ∞ ∞ −υ min −∞ −∞ −∞ ∫ ∫ ∫ qΩ ( m* ) 4π 3 ℏ3 e 1 * 2 1 * 2 1 * 2 m υ x + m υ y + m υ z + ( EC − E F ) 2 2 2 * * * ( mυx + mυ y + mυ z ) β Ω d ( m υx ) d ( m υ y ) d ( m υz ) − 2 e υx 4π 3 ℏ ℏ ℏ 3 J s→m = EC EF Ω − E−E β dk x dk y dk z e ( F ) υ x 3 4π − ( Ec − EF ) β 2 2 2 m*υ x2 ∞ − m*υ y2 β ∞ − m*υ z2 β −υmin − β e 2 dυ e 2 dυ 2 d υ e υ y z x x ∫ ∫ ∫ −∞ −∞ −∞ Klimeck – ECE606 Fall 2012 – notes adopted from Alam 26 Thermionic Current … υmin = J s →m = q Ω ( m* ) 4π 3 ℏ3 3 e − ( Ec − E F ) β m*υ x2 ∞ − m*υ y2 β ∞ − m*υz2 β −υmin − β 2 e 2 dυ e 2 dυ υ υx d e y z x ∫ ∫ ∫ −∞ −∞ −∞ π J s →m 2q (Vbi − VA ) m* π 1 − q (Vbi −VA ) β e 2 4π qm*k 2 2 ( EF − EC − qVbi ) β qVA β = T e e = A0 e qVA β 3 h J T = J s →m − J m → s = A0 ( e qVA β − 1) 27 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Some insight of the Thermionic Current … Compare to the current of p-n diodes… J T = J s →m − J m→ s = A0 ( e qVA β − 1) Schottky diode D n2 D n2 J T = − q n i + p i ( e qVA β − 1) W p N A Wn N D p-n diode Both of them depends exponentially on VA, however current of p-n diodes depends more on temperature (since ni depends strongly on Eg), where the Schottky diode doesn’t have that dependence. However, Eg hides in… J s →m 4π qm* k 2 2 ( EF − EC − qVbi ) β qVA β = T e e = A0 e qVA β 3 h The information of material hides in m* The information of doping concentration hides in EF-EC Klimeck – ECE606 Fall 2012 – notes adopted from Alam 28 Recombination/Generation/Impact-ionization EF M EF M Ec EF ESF EV SAME technique as in p-n junction except integrate to xp only 29 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Presentation Outline 1) Importance of metal-semiconductor junctions 2) Equilibrium band-diagrams 3) DC Thermionic current (simple derivation) 4) Intermediate Summary 5) DC Thermionic current (detailed derivation) 6) AC small signal and large-signal response 7) Additional information 8) Conclusions Klimeck – ECE606 Fall 2012 – notes adopted from Alam 30 Topic Map Equilibrium DC Small signal Large Signal Circuits Diode Schottky BJT/HBT MOS 31 Klimeck – ECE606 Fall 2012 – notes adopted from Alam AC response Conductance Junction Capacitance Diffusion Capacitance Series Resistanc e We will not have Diffusion Capacitance here… Klimeck – ECE606 Fall 2012 – notes adopted from Alam 32 Forward Bias Conductance m depends on which operation regime you are ( I = Io e ln q (V A − RS I ) β / m gFB ) −1 RS I + Io = q (VA − RS I ) β / m I0 1 m = RS + g FB qβ ( I + I 0 ) m dV = A − RS qβ ( I + I o ) dI 33 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Junction Capacitance (Majority Carriers) Junction Capacitance CJ = CJ = Response time – dielectric Very fast propagation Klimeck – ECE606 Fall 2012 – notes adopted from Alam κ sε 0 A W κ sε 0 A 2κ s ε 0 qN D (Vbi − V A ) 34 No Diffusion Capacitance in Schottky Diode p-n Diode n Schottky diode When electrons reach the metal side, they quickly scatter and join the majority carriers there. Nothing is diffusing… x VA No minority carrier transport and therefore no diffusion capacitance .. 35 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Reducing diffusion capacitance in p-n diode p-n Diode Schottky diode n x Provide lots of traps VA Short minority carrier lifetime in p-n junction diode equivalent to rapid energy relaxation in SB diode. Klimeck – ECE606 Fall 2012 – notes adopted from Alam 36 Presentation Outline 1) Importance of metal-semiconductor junctions 2) Equilibrium band-diagrams 3) DC Thermionic current (simple derivation) 4) Intermediate Summary 5) DC Thermionic current (detailed derivation) 6) AC small signal and large-signal response 7) Additional information 8) Conclusions 37 Klimeck – ECE606 Fall 2012 – notes adopted from Alam Ohmic Contact vs. Schottky contacts .. What if we just want the p-n junction? How to reduce the barrier of Metal-Semiconductor? Metal n+ n-Si Low Doping Moderate Doping Klimeck – ECE606 Fall 2012 – notes adopted from Alam Oxide For majority carriers: there’s not barrier For minority carriers: high doping allows them to tunnel through Metal will just act like Ohmic Contact High Doping 38 Lowering of Schottky Barrier E qφ1 qφB Metal qφ1 qφB Semi Metal Semi SurfaceCharge - Image Charge Electron The fields on the metal must be perpendicular (otherwise there will be tangential current flow which is impossible) as if there’s an image charge (positive) in the metal, results in lowering the barrier height x x Klimeck – ECE606 Fall 2012 – notes adopted from Alam Ref. Sze/Ng., p. 143 39 Fermi-level Pinning Density of States E c E Full f Ev Metal Full Semiconduct or f Full Full Ev A Metal Shift in the Band edge E c E Metal Why sometimes we don’t get conductance at all? B surface states bends EC/EV so that the Fermi level is at the center of the bandgap, they exchange carriers with metals, blocking the bulk semiconductor inside no modulation in potential barrier even you connected to different metals. Regardless the workfunction, no modulation in potential. (e.g. Modern high-k dielectrics) Metal Klimeck – ECE606 Fall 2012 – notes adopted from Alam 40 Conclusion 1) Schottky diodes have wide range of applications in practical devices. 2) The key distinguishing feature of Schottky diode is that it is a majority carrier device. 3) We use a different technique to calculate the current in a majority carrier device. => thermionic emission. 4) Elimination of diffusion capacitance make the response of the diodes very fast. Klimeck – ECE606 Fall 2012 – notes adopted from Alam 41