3D Hall probe integrated in 0.35 µm CMOS technology for

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3D Hall probe integrated in 0.35 µm CMOS
technology for magnetic field pulses measurements
Joris Pascal, Luc Hébrard, Vincent Frick, Jean-Philippe Blondé
Institut d'Électronique du Solide et des Systèmes (InESS), ULP Strasbourg – CNRS - UMR7163
BP20 – 23, rue du Loess, 67037 Strasbourg Cedex - France
joris.pascal@iness.c-strasbourg.fr
compatible with conventional VHD structures [3]. The new
type of VHD proposed in [4] allows to integrate VHD in
standard 0.35 µm CMOS technology and exhibits similar
performances as the conventional VHD of [3], especially in
terms of resolution, that is 79 µT over a [5 Hz – 1.6 kHz]
bandwidth. Associating two new VHDs orthogonally
oriented one from each other, with a well known HHD such
as described in [5], we designed a 3D Hall probe in a
0.35 µm CMOS technology. Section 2 deals with the Hall
devices design, while section 3 explains the design of the
instrumental chain. Finally, section 4 exposes the prototype
that has been sent to fabrication and the first experimental
results are discussed in section 5.
Abstract—This paper presents a 3 dimensional magnetometer
based on Hall effect sensors integrated without any post
processing in a standard low cost 0.35 µm CMOS technology.
The system is dedicated to magnetic pulses measurements
under a strong static field. Two vertical Hall devices (VHD) are
sensitive to the components of the magnetic field oriented in
the plane of the chip, while a horizontal Hall device (HHD) is
sensitive to the component of the magnetic field orthogonally
oriented to the plane of the chip. 3 identical instrumental
chains are integrated to perform amplification of the 3 Hall
voltages. The system implements a compensation of the static
magnetic field and allows to measure magnetic fields pulses
with a resolution of 79 µT over a [5 Hz – 1.6 kHz] bandwidth.
Pulses are in the range from hundreds of µT to tens of mT in
the frequency range from 1 Hz to 10 kHz. The static field is
compensated up to 1.5 T. The spatial resolution is 44 µm. The
system power consumption has been optimized to 15 mW.
II. HALL DEVICES
To measure a magnetic field along the 3 dimensions of
space with silicon Hall devices integrated on the same
substrate of a planar CMOS technology, we must implement
two different kinds of Hall devices. Indeed, two vertical
Hall devices measure the magnetic field components
oriented in the plane of the chip, while a horizontal Hall
device measures the field component orthogonally oriented
to the plane of the chip [6].
I. INTRODUCTION
Magnetic pulses measurement with a high spatial
resolution requires tight constraints in electronics design
since any wire exposed to a magnetic pulse turns out to be an
inductive loop that generates non desirable currents. CMOS
integrated system with dimensions in the µm scale gives the
best answer to this constraint. Hall effect devices can be
integrated in CMOS technology without any post processing
and do not use any magnetic materials that could be driven
into saturation within a strong magnetic field. Conventional
Hall probes usually feature one horizontal Hall device
(HHD). But measuring magnetic fields with only a single
dimensional sensor can be quite tenuous, since one must
guaranty an orthogonal orientation of the chip to the
magnetic field to be measured. When such an orientation is
difficult to achieve in the measurement environment, a 3D
Hall probe has to be used. Recently, a 3D Hall probe with 3
HHDs packaged in a custom developed package that insures
orthogonal alignment of the 3 Hall devices has been
demonstrated [1]. Manufacturing such a system necessitates
non standard packaging processes that increase complexity
and cost. The first monolithic CMOS-integrated 3D Hall
probe has been demonstrated in [2]. Nevertheless it has been
integrated in a high voltage CMOS technology to be
978-1-4244-2332-3/08/$25.00 © 2008 IEEE
A. The Vertical Hall Device: VHD
The conventional 5-contacts vertical Hall device is
depicted in figure 1 [7]. It is based on the structure devised
more than 20 years ago in [8].
Ip
Ip
2
2
Figure 1. The conventional 5-contacts vertical Hall device
The biasing current flows from contacts C1 to contacts
C2 and C3. The Hall voltage VH settles between the sensing
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contacts CS1 and CS2, and is proportional to the magnetic
field component in the plane of the chip, and orthogonal to
the biasing current lines. The sensitivity in V/T is given by:
S=
VH
G ⋅ rH
= GV
⋅ IP = SI ⋅ IP
B
n ⋅q ⋅t
(1)
where t is the plate thickness and Ip the biasing current. G is
the geometrical factor (G < 1) which models the reduction of
VH due to the short circuit of Ip by the sensing contacts CS1
and CS2, as well as the short circuit effect induced by the
biasing contacts C1, C2 and C3. GV ≈ 0.70 is a factor that
models the intrinsic lower sensitivity of a VHD compared to
a HHD of same thickness and doping level [4]. SI is the
current related sensitivity. SI only depends on the plate
doping level n and on the thickness t. Thus, whatever the
plate geometry is, the theoretical maximum sensitivity
remains the same as long as G = 1. In particular, this is the
case if biasing and sensing contacts are point like, which is
not possible in practice because of the finite size of the
contacts.
Figure 3.
B. The Horizontal Hall device: HHD
The design of horizontal Hall devices has been well
described in [6]. Integrated in standard 0.35 µm CMOS
technology, this devices can reach a resolution of 20 µT [5].
In order to measure the 3rd magnetic field direction which is
orthogonal to the plane of the chip, we choose to implement
the well known cross like Hall plate as depicted in figure 4.
Unfortunately, the conventional VHD of figure 1 is not
efficient when it is integrated in a 0.35 µm CMOS
technology, since such a technology has a very shallow Nwell which is about 2 µm deep. In that configuration the
biasing current partly flows through the sensing contacts
where the Hall effect is negligible because of the highly
doping level of the N+ contacts that induces short circuit
effect. In that configuration G < 1. The sensitivity is
therefore strongly reduced. In addition to this, we want to
measure magnetic fields in the frequency range of 1 Hz to 10
kHz. In this low frequency bandwidth, the 1/f noise limits the
resolution of such a structure. Experimental results show that
the conventional VHD exhibits a resolution of only 719 µT
when it is manufactured in 0.35 µm CMOS technology [4].
In order to improve the resolution by one order of
magnitude, the solution proposed in [4] consists of
measuring the Hall voltage outside the active area which is
defined as the area where the current flows. This new device
is illustrated in figure 2.
Ip
Ip
2
2
The 2D Hall device, top view
Figure 4. The Horizontal Hall device, top view
In the layout, the 2 devices of figure 3 and figure 4 are
located closed one to each other leading to a spatial
resolution nearly equal to the sum of the 2 devices lengths.
The spatial resolution is then 44 µm.
Figure 2. The new 5-contacts vertical Hall device
III. INSTRUMENTAL CHAIN
Three identical instrumental chains are integrated to
amplify the Hall voltages produced by the 3 components of
the magnetic field. Figure 5 gives the architecture of the
complete system.
This new structure drastically reduces the 1/f noise at the
sensing contacts leading to a much better resolution of 79 µT
in spite of a low intrinsic sensitivity.
In order to measure the magnetic field in the two
directions oriented in the plane of the chip, we placed two
VHD orthogonally oriented one to each other (see figure 3).
98
compared, and PCB1 immunity against the non desirable
parasitic currents can be evaluated.
IV.
PROTOTYPING
An individual HHD has already been integrated , and the
results have been published [5]. The resolution of a 3D Hall
probe is limited by the resolution of the VHDs. Individual
VHDs have been manufactured and characterised with the
modulation technique within the perturbing environment.
These results lead us to dimension a monolithic version of
the 3D Hall probe as described in figure 5. A prototype has
been sent to fabrication, and the results will be available for
the final paper. Next section presents the preliminary
experimental results obtained on isolated VHDs integrated in
0.35 µm CMOS technology. These results allow us to
evaluate the expected performances for the 3D Hall probe.
V.
PRELIMINARY EXPERIMENTAL RESULTS
In order to lower the power consumption of the final
system, which is intended to be supplied by a battery, we
determined the lower VHD biasing current that provides the
required resolution of 100 µT. Measurements of the
resolution for increasing current values have been carried
out. From figure 6, we see that setting the biasing current to
600 µA ensures the expected resolution of 100 µT.
Figure 5. Complete 3D Hall probe system
The chip which contents the 3D Hall sensor and the
instrumental chains is mounted on PCB1 which is located
where the magnetic field operates. PCB2 is located outside
this environment and receives the signals through an optical
fibre transmission. We implemented an instrumental
amplifier (IA) with a differential voltage to current converter
as described in [9]. Chopper stabilization is performed to
suppress the 1/f noise of the instrumental amplifier. As
mentioned in the introduction, measuring magnetic pulses
induces electro magnetic compatibility issues. Any piece of
wire on the PCB which features the chip is a loop that can
generate parasitic currents in the bandwidth of the magnetic
pulses [1 Hz – 10 kHz]. The magnetic pulse is both the
perturbing signal and the signal to be measured. That is the
reason why we extract the modulated Hall voltage VHMOD
at the chopper frequency 100 kHz. By this mean the useful
signal can be transmitted out of the environment where
magnetic pulses operate, without being spoiled by the
parasitic currents induced on PCB1. A demodulation is
performed outside the magnetic environment and the
perturbations, as well as the 1/f noise of the IA, are
suppressed by a low pass filter. Within the chip, we also
demodulate the signal and filter it in order to suppress the 1/f
noise of the instrumental amplifier. Then a compensation of
the strong static magnetic field is achieved by storing the
static value on an external capacitance through a 1st order
low pass filter with a -3 dB cut-off frequency of 0.3 Hz. The
output signal is amplified and transmitted to PCB2 in the
baseband. Signal VH and VH’ (figure 6) can thus be
1000
900
800
Resolution (uT)
700
600
500
400
300
200
100
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Biasing current (mA)
Figure 6. VHD resolution versus biasing current
In figure 7, we plot the response of the single VHD
depicted figure 2.
These results allow us to determine the different gains to
apply to the integrated amplifiers. The VHD exhibits
6.40 V/AT, and we minimized the biasing current of the
device to 600 µA. Thus S = 3.84 mV/T is the sensitivity of
the VHD. To measure magnetic field pulses of 20 mT within
a static field up to 1.5 T, we settle the gain for the IA to
GIA = 50, and the gain for the output amplifier OA to
GAout = 100.
99
50
−0.07
40
−0.08
30
Hall Voltage (V)
Hall Voltage (uV)
−0.09
20
10
0
−10
−0.1
−0.11
−0.12
−20
−0.13
−30
−0.14
−40
−50
−8
−6
−4
−2
0
2
4
6
−0.15
16.8
8
Magnetic Field (mT)
16.81
16.82
16.83
16.84
16.85
16.86
16.87
16.88
16.89
time (s)
Figure 7. Response of the VHD, biasing current I p = 1.12 mA, offset is
nullified
Figure 8. Magnetic pulse measurement carried out over 1 dimension with
a VHD
The VHD architecture that is used in the final design has
been tested experimentally with an instrumental chain
implemented with discrete electronics. In the integrated
version we switch the Hall voltage at the output of the Hall
plates to perform modulation. This solution respects electro
magnetic compatibility constraints since the small
dimensions of the connections between the switches and the
sensing contacts of the Hall plates do not allow parasitic
currents to settle. The chain implemented with discrete
electronics is similar to the integrated one described in
figure 5. Nevertheless, instead of switching the Hall voltage
at the output of the plates we implemented a periodic
switching of the biasing current in the VHD at a 100 kHz
frequency. As a result, the Hall voltage VH is also modulated
since VH is proportional to the current (1). This is different
than switching VH at the output of the Hall plate as
implemented in the integrated version of the system. Indeed,
when switching the biasing current, the parasitic voltages
that settle by induction between the switches and the biasing
contacts of the Hall device are negligible by comparison with
the voltage across the biasing contacts of the VHD, which
varies over a large dynamic (0 V to 3.3 V). On the contrary,
VH varies only over a small magnitude of 6.4 µV,
corresponding to a field of 1 mT and a biasing current in the
VHD of 1 mA. By switching the biasing current in the Hall
plate we propose a discrete version of the system which also
respects electro magnetic compatibility constraints. With the
discrete version of the system we carried out measurements.
A magnetic pulse of 2.9 mT superimposed with a static field
of 1.5 T has been measured (figure 8). The magnetic pulse
has a bandwidth of 500 Hz and the pulse width is 20 ms. It is
interesting to see that no perturbation appears, especially
during the rising and falling times. Nevertheless, the
resolution is slightly altered by the thermal noise of the
discrete electronics.
VI. CONCLUSION
A first 3D Hall probe integrated in standard 0.35 µm
CMOS technology has been proposed. It is based on a
conventional HHD associated with 2 new VHDs. Its
resolution is limited by the resolution of the VHD and can
reach 79 µT. Magnetic pulses measurement specificities
have been discussed. First experimental results on isolated
Hall devices describe the expected final performances of the
system. A complete prototype has been sent to fabrication
and experimental results will be available in the final paper.
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