TS
SO
P64
SOT646-1
Terminal position code
Package type descriptive code
Package type industry code
Package style descriptive code
Package style suffix code
Package body material type
JEDEC package outline code
Mounting method type
Issue date
Table 1. Package summary
Symbol Parameter
D package length
E
A
A
2 n
2 package width seated height package height actual quantity of termination
Min
16.9
6
[tbd]
-
0.85
D (double)
TSSOP64
TSSOP64
TSSOP (thin shrink small outline package)
NA (not applicable)
P (plastic)
MO-153
S (surface mount)
18-2-2003
-
-
-
-
-
Typ Nom
17
6.1
1.2
0.9
64 -
Max
17.1
6.2
1.2
1.05
Unit mm mm mm mm

NXP Semiconductors SOT646-1 plastic thin shrink small outline package; 64 leads; body width 6.1 mm
TSSOP64: plastic thin shrink small outline package; 64 leads; body width 6.1 mm SOT646-1
D c
E
HE
A
X v M A
64
Z y
1 pin 1 index
33 bp
32 w M
A
2
A
1 detail X
L
L p
θ
A e
0 2.5
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A max.
A
1
A
2
A
3 b p c mm 1.2
0.15
0.05
1.05
0.85
0.25
0.27
0.17
0.2
0.1
D
(1)
17.1
16.9
E
(2)
6.2
6.0
e
0.5
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT646-1
IEC JEDEC
REFERENCES
JEITA
MO-153
H
E
8.3
7.9
5 mm
L
1
L p
0.75
0.45
v
0.2
w
0.08
y
0.1
Z
0.89
0.61
EUROPEAN
PROJECTION
θ
8
0 o o
ISSUE DATE
00-08-21
03-02-18
Fig. 1. Package outline TSSOP64 (SOT646-1)
SOT646-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved
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NXP Semiconductors
Footprint information for reflow soldering of TSSOP64 package
SOT646-1 plastic thin shrink small outline package; 64 leads; body width 6.1 mm
SOT646-1
Hx
Gx
P2
(0.125) (0.125)
Hy Gy
C
D2 (4x) P1 D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
By Ay solder land occupied area
DIMENSIONS in mm
P1 P2
0.500 0.560
Ay By C D1 D2 Gx Gy
8.900 6.100 1.400 0.280 0.400 16.270 7.000
Hx
17.900
Hy
9.150
Fig. 2. Reflow soldering footprint for TSSOP64 (SOT646-1)
SOT646-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016 sot646-1_fr
© NXP Semiconductors N.V. 2016. All rights reserved
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NXP Semiconductors
Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
SOT646-1 plastic thin shrink small outline package; 64 leads; body width 6.1 mm
SOT646-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved
4 / 5

NXP Semiconductors
1. Package summary........................................................1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
© NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 February 2016
SOT646-1 plastic thin shrink small outline package; 64 leads; body width 6.1 mm
SOT646-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved
5 / 5