MM3ZxxxT1G Series, SZMM3ZxxxT1G Series Zener Voltage

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MM3ZxxxT1G Series,
SZMM3ZxxxT1G Series
Zener Voltage Regulators
300 mW SOD−323 Surface Mount
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 300 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
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SOD−323
CASE 477
STYLE 1
Specification Features:
• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V
• Steady State Power Rating of 300 mW
• Small Body Outline Dimensions:
•
1
Cathode
2
Anode
MARKING DIAGRAM
xx
M
•
•
•
•
0.067” x 0.049” (1.7 mm x 1.25 mm)
Low Body Height: 0.035” (0.9 mm)
Package Weight: 4.507 mg/Unit
ESD Rating of Class 3 (> 16 kV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices*
G
G
Mechanical Characteristics:
CASE: Void-free, Transfer-Molded Plastic
FINISH: All External Surfaces are Corrosion Resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
xx = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
260°C for 10 Seconds
LEADS: Plated with Pb−Sn or Sn Only (Pb−Free)
POLARITY: Cathode Indicated by Polarity Band
FLAMMABILITY RATING: UL 94 V−0
MOUNTING POSITION: Any
ORDERING INFORMATION
Device
MAXIMUM RATINGS
Rating
Total Device Dissipation FR−4 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
Symbol
Max
Unit
300
2.4
mW
mW/°C
PD
Thermal Resistance, Junction−to−Ambient
RqJA
416
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−65 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2.
Package
Shipping†
MM3ZxxxT1G
SOD−323
(Pb−Free)
3,000 /
Tape & Reel
SZMM3ZxxxT1G
SOD−323
(Pb−Free)
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 11
1
Publication Order Number:
MM3Z2V4T1/D
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
ELECTRICAL CHARACTERISTICS
Symbol
I
Parameter
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
QVZ
C
IF
VZ VR
V
IR VF
IZT
Maximum Temperature Coefficient of VZ
Zener Voltage Regulator
Max. Capacitance @VR = 0 and f = 1 MHz
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
Zener Voltage (Note 2)
Zener Impedance
Device
Marking
@ IZT
ZZT
@ IZT
Min
Nom
Max
mA
W
MM3Z2V4T1G
MM3Z2V7T1G
MM3Z3V0T1G
MM3Z3V3T1G
MM3Z3V6T1G
00
01
02
05
06
2.2
2.5
2.8
3.1
3.4
2.4
2.7
3.0
3.3
3.6
2.6
2.9
3.2
3.5
3.8
5
5
5
5
5
MM3Z3V9T1G
MM3Z4V3T1G
MM3Z4V7T1G
MM3Z5V1T1G
MM3Z5V6T1G
07
08
09
0A
0C
3.7
4.0
4.4
4.8
5.2
3.9
4.3
4.7
5.1
5.6
4.1
4.6
5.0
5.4
6.0
MM3Z6V2T1G
MM3Z6V8T1G
MM3Z7V5T1G
MM3Z8V2T1G
MM3Z9V1T1G
0E
0F
0G
0H
0K
5.8
6.4
7.0
7.7
8.5
6.2
6.8
7.5
8.2
9.1
MM3Z10VT1G
MM3Z11VT1G
MM3Z12VT1G
MM3Z13VT1G
MM3Z15VT1G
0L
0M
0N
0P
0T
9.4
10.4
11.4
12.4
14.3
MM3Z16VT1G
MM3Z18VT1G
MM3Z20VT1G
MM3Z22VT1G
MM3Z24VT1G
0U
0W
0Z
10
11
MM3Z27VT1G
MM3Z30VT1G
MM3Z33VT1G
MM3Z36VT1G
MM3Z39VT1G
VZ (Volts)
Leakage Current
ZZK @ IZK
IR @ VR
QVZ
(mV/k)
@ IZT
C
@ VR = 0
f = 1 MHz
W
mA
mA
Volts
Min
Max
pF
100
100
100
95
90
1000
1000
1000
1000
1000
0.5
0.5
0.5
0.5
0.5
50
20
10
5
5
1.0
1.0
1.0
1.0
1.0
−3.5
−3.5
−3.5
−3.5
−3.5
0
0
0
0
0
450
450
450
450
450
5
5
5
5
5
90
90
80
60
40
1000
1000
800
500
200
0.5
0.5
0.5
0.5
0.5
3
3
3
2
1
1.0
1.0
2.0
2.0
2.0
−3.5
−3.5
−3.5
−2.7
−2.0
−2.5
0
0.2
1.2
2.5
450
450
260
225
200
6.6
7.2
7.9
8.7
9.6
5
5
5
5
5
10
15
15
15
15
100
160
160
160
160
0.5
0.5
0.5
0.5
0.5
3
2
1
0.7
0.2
4.0
4.0
5.0
5.0
7.0
0.4
1.2
2.5
3.2
3.8
3.7
4.5
5.3
6.2
7.0
185
155
140
135
130
10
11
12
13.25
15
10.6
11.6
12.7
14.1
15.8
5
5
5
5
5
20
20
25
30
30
160
160
80
80
80
0.5
0.5
0.5
0.5
0.5
0.1
0.1
0.1
0.1
0.05
8.0
8.0
8.0
8.0
10.5
4.5
5.4
6.0
7.0
9.2
8.0
9.0
10
11
13
130
130
130
120
110
15.3
16.8
18.8
20.8
22.8
16.2
18
20
22
24.2
17.1
19.1
21.2
23.3
25.6
5
5
5
5
5
40
45
55
55
70
80
80
100
100
120
0.5
0.5
0.5
0.5
0.5
0.05
0.05
0.05
0.05
0.05
11.2
12.6
14.0
15.4
16.8
10.4
12.4
14.4
16.4
18.4
14
16
18
20
22
105
100
85
85
80
12
14
18
19
20
25.1
28
31
34
37
27
30
33
36
39
28.9
32
35
38
41
2
2
2
2
2
80
80
80
90
130
300
300
300
500
500
0.5
0.5
0.5
0.5
0.5
0.05
0.05
0.05
0.05
0.05
18.9
21.0
23.2
25.2
27.3
21.4
24.4
27.4
30.4
33.4
25.3
29.4
33.4
37.4
41.2
70
70
70
70
45
MM3Z43VT1G
MM3Z47VT1G
MM3Z51VT1G
MM3Z56VT1G
21
1A
1C
1D
40
44
48
52
43
47
51
56
46
50
54
60
2
2
2
2
150
170
180
200
500
500
500
500
0.5
0.5
0.5
0.5
0.05
0.05
0.05
0.05
30.1
32.9
35.7
39.2
37.6
42.0
46.6
52.2
46.6
51.8
57.2
63.8
40
40
40
40
MM3Z62VT1G
MM3Z68VT1G
MM3Z75VT1G
2A
1F
1G
58
64
70
62
68
75
66
72
79
2
2
2
215
240
255
500
500
500
0.5
0.5
0.5
0.05
0.05
0.05
43.4
47.6
52.5
58.9
65.6
73.4
71.8
79.8
88.6
35
35
35
Device*
*Includes SZ-prefix devices where applicable.
2. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
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2
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
1000
TJ = 25°C
IZ(AC) = 0.1 IZ(DC)
f = 1 kHz
IF, FORWARD CURRENT (mA)
Z ZT , DYNAMIC IMPEDANCE ( Ω )
1000
100
100
IZ = 1 mA
5 mA
10
150°C
10
75°C
3.0
10
VZ, NOMINAL ZENER VOLTAGE
80
0.4
Figure 1. Effect of Zener Voltage on Zener Impedance
0°C
0.5
0.6
0.7
0.8
0.9
1.0
VF, FORWARD VOLTAGE (V)
IR, LEAKAGE CURRENT ( μ A)
0 V BIAS
100
1 V BIAS
BIAS AT
50% OF VZ NOM
10
100
10
1.0
+150°C
0.1
0.01
0.001
+ 25°C
0.0001
−55°C
0.00001
1.0
4.0
10
VZ, NOMINAL ZENER VOLTAGE (V)
70
0
Figure 3. Typical Capacitance
10
20
30
40
50
60
VZ, NOMINAL ZENER VOLTAGE (V)
100
TA = 25°C
IZ , ZENER CURRENT (mA)
TA = 25°C
10
1.0
0.1
10
1
0.1
0.01
0
2.0
4.0
6.0
8.0
VZ, ZENER VOLTAGE (V)
70
Figure 4. Typical Leakage Current
100
I Z , ZENER CURRENT (mA)
1.2
1000
TA = 25°C
0.01
1.1
Figure 2. Typical Forward Voltage
1000
C, CAPACITANCE (pF)
25°C
1.0
1.0
10
12
10
30
50
70
VZ, ZENER VOLTAGE (V)
90
Figure 6. Zener Voltage versus Zener Current
(12 V to 75 V)
Figure 5. Zener Voltage versus Zener Current
(VZ Up to 12 V)
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3
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
100
POWER DISSIPATION (%)
80
60
40
20
0
0
25
50
75
100
TEMPERATURE (°C)
125
Figure 7. Steady State Power Derating
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4
150
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
HE
D
b
1
2
E
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1 0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C 0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
HE
2.30
2.50
2.70
A3
A
C
NOTE 3
L
A1
NOTE 5
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN
0.031
0.000
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MM3Z2V4T1/D
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