Integrated Device Technology, Inc.
6024 Silver Creek Valley Road, San Jose, CA 95138
PRODUCT/PROCESS CHANGE NOTICE (PCN)
PCN #: A0701-01
DATE:
Product Affected:
ICS932S309CK
Date Effective:
Contact:
Title:
Phone #:
Fax #:
E-mail:
01-May-2007
01-Feb-2007 MEANS OF DISTINGUISHING CHANGED DEVICES:
Product Mark
Back Mark
Date Code
Starting from date code 0703
Other
Geoffrey Cortes
Manager, Corporate Quality & Reliability
(408) 284-8321
(408) 284-1450
Geoffrey.Cortes@idt.com
Attachment:
Yes
No
Samples: Available on request
DESCRIPTION AND PURPOSE OF CHANGE:
This notification is to advise our customers that IDT has standardized lead frame type
Die Technology
from double row pad leadframe to single row pad leadframe and exposed pad
Wafer Fabrication Process
dimension from 6.7mm x 6.7mm to 5.9mm x 5.9mm after completing qualification.
Assembly Process
There is no change to the moisture performance of this package.
Equipment
Material
The data sheet will be revised to include the new package drawing.
Testing
Manufacturing Site
Data Sheet
Attachment I details the qualification result for this change.
Other
Attachment II shows the package drawing.
RELIABILITY/QUALIFICATION SUMMARY:
Refer to qualification results shown on Attachment I.
CUSTOMER ACKNOWLEDGMENT OF RECEIPT:
IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail
to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice
it will be assumed that this change is acceptable.
IDT reserves the right to ship either version manufactured after the process change effective date until the inventory
on the earlier version has been depleted.
Customer:
Approval for shipments prior to effective date.
Name/Date:
E-Mail Address:
Title:
Phone # /Fax #:
CUSTOMER COMMENTS:
IDT ACKNOWLEDGMENT OF RECEIPT:
RECD. BY:
DATE:
IDT FRA-1509-01 REV. 00 09/18/01
REFER TO QCA-1795
Page 1 of 3
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road, San Jose, CA 95138
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT I - PCN #: A0701-01
PCN Type:
Assembly Material Change
Data Sheet Change: Yes. Data sheet will be revised to include the new package drawing. Please see attachment II for
package drawing.
Detail of Change:
This notification is to advise our customers that IDT has standardized lead frame type from
double row pad leadframe to single row pad leadframe and exposed pad dimension from
6.7mm x 6.7mm to 5.9mm x 5.9mm after completing qualification. There is no change to
the moisture performance of this package.
The data sheet will be revised to include the new package drawing.
Description
From
To
Lead Frame Type
Double row pad lead frame
Single row pad lead frame
Exposed Pad
Dimension
6.7mm x 6.7mm
5.9mm x 5.9mm
Qualification Plan #: P06-01-03R1
Test Vehicle:
8mm x 8mm VFQFP-N-56, 10mm x 10mm VFQFP-N-72
Qualification Test Plan and Result:
Test Method
Number of Lot
Test Results
(SS/Rej)
J-STD-020
2
90/0
* Temperature Cycling (Cond B, 1000 cycles)
JESD22-A104
2
90/0
Auto Clave (121°C, 100% RH, 168 hours)
JESD22-A102
2
90/0
2
154/0
Test Description
Moisture Sensitivity Classification, L1
High Temperature Stabilization Bake (150 °C,
JESD22-A103
1000 hours)
* Test requires moisture pre-conditioning sequence per JESD22-A113C.
Notes:
Page 2 of 3
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road, San Jose, CA 95138
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT II - PCN #: A0701-01
Package Drawing
New package drawing (Single row pad)
PSC-4111
Old package drawing (Double row pad)
ICS932S309
Page 3 of 3
ICS932S309
Advance Information
-C-
C
//
0.15
0.10
0.900±0.100
Exposed
Active Metal
2X
10.000 BSC
0.350
0.400±0.050
R FULL
5.000±0.050
6.700±0.025
8.500 BSC
10.000 BSC
6.700±0.025
Thermal
Pad
PIN#1 (LASER MARKED)
2X
0.15
0.250
C
Integrated
Circuit
Systems, Inc.
72
1
C
0.050
0.000
0.200 REF
0.230 +0.070
-0.050
0.10 M C A B
C
0.500
0.08
BARE COOPER
TOP VIEW
BOTTOM VIEW
THERMALLY ENHANCED, VERY THIN, FINE PITCH
QUAD FLAT / NO LEAD PLASTIC PACKAGE
Ordering Information
ICS932S309yKLF-T
Example:
ICS XXXX y K LF- T
Designation for tape and reel packaging
Annealed Lead Free (optional)
Package Type
K = MLF
Revision Designator (will not correlate with datasheet revision)
Device Type
Prefix
ICS = Standard Device
0935—02/17/05
15
0.10 MAX