Product Specification
Contactless modules Open Tool
Document number:
Rev:
Date:
OTN-01
F
July 2, 2012
NedCard
Product specification
Contactless Modules
Open Tool
July 2, 2012
Rev: F
Status: Released
Doc: OTN-01
ProductDoc_contactless OTN-01 rev F.doc
Page 1 of 31
Product Specification
Contactless modules Open Tool
Document number:
Rev:
Date:
OTN-01
F
July 2, 2012
Contents:
Document history
1 GENERAL INFORMATION
1.1 Purpose
1.2 Scope
1.3 Reference documents
2 NEDCARD PACKAGING PROCESS
2.1 Production flow
2.2 Process conditions
2.3 New chip qualification
2.4 Standard electrical test flow
2.5 Traceability
3 RECEIVING WAFER QUALITY
3.1 Wafer saw/grind and frame/foil requirements
3.2 Die lay-out requirements
3.3 Wafermap/inkdot requirements
3.4 Wafer handling information
4 DATASHEETS
4.1 Product types descriptions
4.2 Product NOA3
4.3 Product NOA3T
4.4 Product NOA3TL
4.5 Product NOA3S
4.6 Product NOA3ST
4.7 Product NOA6XT
5 GENERAL SPECIFICATIONS
5.1 Lead frame properties
5.2 Splices
5.3 Leader and trailer tape
5.4 Reject holes
6 PACKING SPECIFICATION
6.1 Shipping reels
6.2 Winding direction
6.3 Labeling finished goods
6.4 Packing method
6.5 Shipping box
7 STORAGE AND HANDLING FINAL PRODUCT
7.1 Storage recommendations
7.2 Reel handling recommendations
8 PRODUCT QUALITY
8.1 Reliability standards
8.2 General control plan
8.3 Yield data
8.4 Good/bad criteria
9 AQL TESTING
9.1 AQL sampling by NedCard
9.2 Acceptance testing by customer
10 MISCELLANEOUS
10.1 Major change procedure
ProductDoc_contactless OTN-01 rev F.doc
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Product Specification
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Document number:
Rev:
Date:
OTN-01
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July 2, 2012
Document History
Version Date
Rev A
Oct 08
Rev B
May, 09
Rev C
Rev D
Rev E
Rev F
Description
Complete new specification
Add cap dimensions and height tolerances; adding stripe plating
NOA5
July 10
Drawing NOA3T error corrected (§4.3), Updated storage max. RH
(60% -> 70%), updated AQL-sampling (§ 9.1)
June, 11 NOA4 deleted, NOA5 deleted; Transparent leader tape deleted
(§5.3); Dimensions/tolerances shipping reel added (§6.1)
Feb, 12 Change minimum yield from test yield 80% to total yield 80%
Test flow ISO 15693 changed, splice drawing updated
July 12
NOA3S, NOA3ST and NOA6XT added. Several small corrections
ProductDoc_contactless OTN-01 rev F.doc
Checked by
J. Smeets
J. Smeets
J. Smeets
J. Smeets
j. Smeets/
E. Wit
E. Wit
Page 3 of 31
Product Specification
Contactless modules Open Tool
Document number:
Rev:
Date:
1
General information
1.1
Purpose
OTN-01
F
July 2, 2012
This document defines NedCard’s Open Tool Smartcard Module packages for non_contact cards based on
Super 35mm Film. It describes the general requirements with respect to the receiving wafers and it describes
the manufacturing of the packaging process by NedCard including the product specific specifications of the
final product.
NedCard follows this specification unless otherwise agreed with the customer.
1.2
Scope
This document describes in detail all relevant specifications of the assembly and testing process of open-tool
non_contact modules for SmartCards.
1.3
Reference documents
External references
ISO/IEC 7810 Identification cards- Physical characteristics
ISO/IEC 7816-1 Identification cards – Integrated circuit(s) cards with contacts: Part 1: Physical characteristics
ISO/IEC 10373-1 Identification cards- Test methods = Part 1: General characteristics tests
ISO/IEC 10373-3-Annex A Identification cards- Test methods Part 3: Integrated circuit(s) cards with contacts
and related interfaces device: Annex A: 3 wheel test.
ISO 2859-1974 Sampling procedures and tables for inspection by attributes.
MIL-STD-883E, method 2019.5 Die shear strength
MIL-STD-883E, method 2011.7 Bond strength (destructive bond pull strength)
JEDEC STD-22-B116 Wire bond shear test method
Mastercard CQM, 1.9 Card Quality Management, Infrastructure Quality requirements
JESD 46B Customer notification of product/process changes
NedCard references(1):
CP-00 NedCard standard Control plan
SF030 Wafer saw/grind and frame/foil requirements
SF041 NedCard wafermap specification
GBC-NC-01 Good Bad visual Criteria for Contactless products, NedCard
(1)
: Available on request
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2
NEDCARD Packaging Process
2.1
Production flow
OTN-01
F
July 2, 2012
Wafer receipt
Optional
SLA
CP-03
CP
DA
backlapping/
wafersaw by
subcontractors
Die attach and
curing process
DA
Tape
Adhesive
CP
WB
CP-05
CP
GT
CP-07
CP
VI
CP-04
Wire bond process
Encapsulation process
CP-08
CP
ET
Gold-Wire
GT UV or
thermal
molded
Visual inspection
& Good Bad Catalog
NedCard
= Process
= Inspection step
100% Electrical test
CP= control plan,
SLA = Service Level
Agreement
CP-09
CP-10
CP
CP
QA
QA-Gate inspection
P&S
Packing and Shipment
Optional dropshipment
=Materials
CP
CP-11 Reliability
testing
Every process step is controlled by an internal control Plan (CP-xx). A generic control plan can be found in
document CP-00 NedCard standard control plan.
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Process conditions
Cleanroom specification: The saw and thinning of wafers is performed in a clean room of class ISO 7 (10.000
class). The assembly of dies into modules is performed in a clean room of class ISO 8 (100.000 class).
Humidity specification during assembly: 50 ± 20%.
ESD specification: Precautions are taken to assure that any IC shall not be exposed to electrostatic charges
more than 2 kV (ESD human body model).
Reference: MasterCard CQM.
2.3
New chip qualification
Each new chip device has to pass a qualification process as follows:
Step 1 to 3 has to be performed before assembly process is started.
1. An incoming wafer inspection is performed on the first batch of wafers (see also wafer quality for the
specifications).
2. A bonding diagram has to be supplied by the customer.
3. The electrical test will be done according to the NedCard standard test flow, unless a deviating test
flow has been agreed between the customer and NedCard.
4. Start assembly process under special supervision.
5. Verification of the results and, if OK, product release by engineering.
2.4
Standard electrical test flow
Standard test flow for 13.56 MHz devices:
-
Standard test flow for other frequencies:
- open/shorts
- leakage
- functional test, if possible needs to be verified.
2.5
open/shorts
leakage
capacitance measurement (on request)
REQ A/B – ATQ A/B (ISO14443 A/B)
ATTRIB (ISO14443 A)
SELECT (ISO 1444 A)
IINVENTORY (ISO15693)
Traceability and customer property
At all times, there is a one-to-one relation between the customer’s wafer batch and NedCard batch number.
Starting with the NedCard batch number and NedCard reel number, all Q-records are traceable.
The traceability is guaranteed for a period of 5 years.
The standard procedure concerning rest-wafers and rest chips is that these will be destroyed under supervision. On special request, all materials can be sent back to the customer.
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Receiving wafer quality
3.1
Wafer saw/grind and frame/foil requirements
OTN-01
F
July 2, 2012
Wafer ring and wafer foil requirements: See document SF030 “wafer saw/grind and frame/foil requirements”.
Changes in the received wafer characteristics must be communicated with NedCard.
3.2
Die lay-out requirements
Die dimensions: see datasheets
Bond-pad size: min. 75 x 75 microns (smaller possible, on request)
Bond-pad pitch: min. 150 microns (smaller possible, on request)
3.3
Wafer map/inkdot requirements
Bad devices can be marked either by inkdots or by using wafermaps. The specification for the standard
wafermap is documented in SF041 NedCard wafermap specification.
Any change in the wafer map design is considered as a major change and must be communicated with
NedCard prior to shipment.
3.4
Wafer handling information
All receiving wafers remain in their original packing/container (unopened) at normal room conditions until
production starts under controlled clean room conditions. The original packing should provide for protection
against mechanical shock, ESD charges and environmental degradation. The temperature and humidity in
the storage facility for packed wafers is monitored.
4
Data sheets
4.1
Product types descriptions
The open tool contact modules are divided into several types, depending on the tape lay-out and the Glob
tope type. The different product types are listed in the table below:
Product type
Tape type
NOA3
NOA3T
NOA3TL
NOA3S
NOA3ST
NOA6XT
Pitch (mm)
9.5
9.5
9.5
9.5
9.5
9.5
Preferred die
thickness
(μm)
150
100
100
150
100
50
Maximum die
size (X x Y)
(mm)
3.0 x 3.1
3.0 x 3.1
3.2 x 3.4
2.8 x 3.1
2.8 x 3.1
2.8 x 3.1
Maximum
module height
(µm)
380
330
330
380
330
250
nominal
encapsulation
X/Y size (mm)
4.80 x 5.10
4.80 x 5.10
4.80 x 5.10
4.80 x 5.10
4.80 x 5.10
4.80 x 5.10
Further details are listed in the data-sheets per product type.
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Data sheet NOA3 (only available until Q1 2013)
Data Table and module drawing
Lead frame format
Lead frame material
Size of antenna area
X-pitch
Nedcard NOA3, super 35 mm film, modules in 3-row matrix
80 μm CuSn6 tape, Ag plated
Approx. 5.0 mm x 1.3 mm
9.5 mm
Die Attach Epoxy
Preferred die thickness
Maximum die size
Minimum die size
Non conductive, Thermoset
150 μm
x = 3.0 mm
y = 3.1 mm
x = 0.8 mm
y = 0.8 mm
Wire bonding process
Wire material
Ultrasonic Ball Wedge Bonding
Gold, >99.9% Au; diameter 23-25μm
Encapsulation material
Encapsulation dimensions
Total product height
Epoxy based filled mold compound, black
(4.80 ±0.05) mm x (5.10 ±0.05) mm
(380 + 0/ - 35) μm
Products per reel
Rejecthole positions
Reject hole size
Typical 20’000 units
Type “E” (see also § Rejectholes --> Type “E”)
2.0 mm
Disconnect punch: max. 50 μm
Reject punch: max. 100 μm
At begin of reel typically 10 modules
At end of reel typically 4 modules
Metal punching burrs
# defect punched modules at
begin/end of reel
Specs on request
z = 160 μm
z = 90 µm
Specs on request
Specs on request
NOA3 Module
(All dimensions are in mm.)
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Drawing NOA3 package
Module Dimensions: NOA3 Package
(All dimensions are in mm.)
Back Side
ProductDoc_contactless OTN-01 rev F.doc
Chip Side
Crossection
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Data sheet NOA3T (only available until Q1 2013)
Data Table and module drawing
Lead frame format
Lead frame material
Size of antenna area
X-pitch
Nedcard NOA3, super 35 mm film, modules in 3-row matrix
80 μm CuSn6 tape, Ag plated
Approx. 5.0 mm x 1.4 mm
9.5 mm
Die Attach Epoxy
Preferred die thickness
Maximum die size
Minimum die size
Non conductive, Thermoset
100 μm
x = 3.0 mm
y = 3.1 mm
x = 0.8 mm
y = 0.8 mm
Wire bonding process
Wire material
Ultrasonic Ball Wedge Bonding
Gold, >99.9% Au; diameter 23-25μm
Encapsulation material
Encapsulation dimensions
Total product height
Epoxy based filled mold compound, black
(4.80 ± 0.05) mm x (5.10 ± 0.05) mm
( 330 + 0/ - 35) μm
Products per reel
Rejecthole positions
Reject hole size
Typical 20’000 units
Type “E” (see also § Rejectholes --> Type “E”)
2.0 mm
Disconnect punch: max. 50 μm
Reject punch: max. 100 μm
At begin of reel typically 10 modules
At end of reel typically 4 modules
Metal punching burrs
# defect punched modules at
begin/end of reel
Specs on request
z = 130 μm
z = 90 µm
Specs on request
Specs on request
NOA3T Module
(All dimensions are in mm.)
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Drawing NOA3T package
Module Dimensions: NOA3T Package
(All dimensions are in mm.)
Back Side
ProductDoc_contactless OTN-01 rev F.doc
Chip Side
Crossection
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4.4
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July 2, 2012
Data sheet NOA3TL (limited availability)
Data Table and module drawing
Lead frame format
Lead frame material
Size of antenna area
X-pitch
Nedcard NOA3, super 35 mm film, modules in 3-row matrix
80 μm CuSn6 tape, Ag plated
Approx. 5.0 mm x 1.4 mm
9.5 mm
Die Attach Epoxy
Preferred die thickness
Maximum die size
Minimum die size
Non conductive, Thermoset
100 μm
x = 3.2 mm
y = 3.4 mm
x = 2.0 mm
y = 2.0 mm
Wire bonding process
Wire material
Ultrasonic Ball Wedge Bonding
Gold, >99.9% Au; diameter 23-25μm
Encapsulation material
Encapsulation dimensions
Total product height
Epoxy based filled mold compound, black
(4.80 ± 0.05) mm x (5.10 ± 0.05) mm
( 330 + 0/ - 35) μm
Products per reel
Rejecthole positions
Reject hole size
Typical 20’000 units
Type “E” (see also § Rejectholes --> Type “E”)
2.0 mm
Disconnect punch: max. 50 μm
Reject punch: max. 100 μm
At begin of reel typically 10 modules
At end of reel typically 4 modules
Metal punching burrs
# defect punched modules at
begin/end of reel
Specs on request
z = 130 μm
z = 90 µm
Specs on request
Specs on request
NOA3TL Module
(All dimensions are in mm.)
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Drawing NOA3TL package
Module Dimensions: NOA-3TL Tape
(All dimensions are in mm.)
Contact Side
ProductDoc_contactless OTN-01 rev F.doc
Globtop Side
Crossection
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4.5
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June 20, 2012
Data sheet NOA3S
Data Table and module drawing
Lead frame format
Lead frame material
Size of antenna area
X-pitch
Heraeus XOA2, super 35 mm film, modules in 3-row matrix
80 μm CuSn6 tape, Ag plated
Approx. 5.0 mm x 1.4 mm
9.5 mm
Die Attach Epoxy
Preferred die thickness
Maximum die size
Minimum die size
Non conductive, Thermoset
150 μm
x = 2.8 mm
y = 3.1 mm
x = 0.8 mm
y = 0.8 mm
Wire bonding process
Wire material
Ultrasonic Ball Wedge Bonding
Gold, >99.9% Au; diameter 23 μm
Encapsulation material
Encapsulation dimensions
Total product height
Epoxy based filled mold compound, black
(4.80 ±0.05) mm x (5.10 ±0.05) mm
(380 + 0/ - 35) μm
Products per reel
Rejecthole positions
Reject hole size
Typical 20’000 units
Type “E” (see also § Rejectholes --> Type “E”)
2.0 mm
Disconnect punch: max. 50 μm
Reject punch: max. 100 μm
At begin of reel typically 10 modules
At end of reel typically 4 modules
Metal punching burrs
# defect punched modules at
begin/end of reel
Specs on request
z = 160 μm
z = 90 µm
Specs on request
Specs on request
NOA3S Module
(all dimensions in mm)
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Module dimensions: NOA3S package
(all dimensions in mm)
LF Side
ProductDoc_contactless OTN-01 rev F.doc
OTN-01
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June 20, 2012
Drawing NOA3S package
Chip Side
Crossection
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4.6
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June 20, 2012
Data sheet NOA3ST
Data Table and module drawing
Lead frame format
Lead frame material
Size of antenna area
X-pitch
Heraeus XOA2, super 35 mm film, modules in 3-row matrix
80 μm CuSn6 tape, Ag plated
Approx. 5.0 mm x 1.4 mm
9.5 mm
Die Attach Epoxy
Preferred die thickness
Maximum die size
Minimum die size
Non conductive, Thermoset
100 μm
x = 2.8 mm
y = 3.1 mm
x = 0.8 mm
y = 0.8 mm
Wire bonding process
Wire material
Ultrasonic Ball Wedge Bonding
Gold, >99.9% Au; diameter 23 μm
Encapsulation material
Encapsulation dimensions
Total product height
Epoxy based filled mold compound, black
(4.80 ±0.05) mm x (5.10 ±0.05) mm
(330 + 0/ - 35) μm
Products per reel
Rejecthole positions
Reject hole size
Typical 20’000 units
Type “E” (see also § Rejectholes --> Type “E”)
2.0 mm
Disconnect punch: max. 50 μm
Reject punch: max. 100 μm
At begin of reel typically 10 modules
At end of reel typically 4 modules
Metal punching burrs
# defect punched modules at
begin/end of reel
Specs on request
z = 110 μm
z = 90 µm
Specs on request
Specs on request
NOA3ST Module
(all dimensions in mm)
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Product Specification
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Document number:
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Module dimensions: NOA3ST package
(all dimensions in mm)
LF Side
ProductDoc_contactless OTN-01 rev F.doc
OTN-01
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June 20, 2012
Drawing NOA3ST package
Chip Side
Crossection
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4.7
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June 20, 2012
Data sheet NOA6XT
Data Table and module drawing
Lead frame format
Lead frame material
Size of antenna area
X-pitch
Heraeus XOA2, super 35 mm film, modules in 3-row matrix
80 μm CuSn6 tape, Ag plated
Approx. 5.0 mm x 1.4 mm
9.5 mm
Die Attach Epoxy
Preferred die thickness
Maximum die size
Minimum die size
Non conductive, Thermoset
50 μm
x = 2.8 mm
y = 3.1 mm
x = 0.8 mm
y = 0.8 mm
Wire bonding process
Wire material
Ultrasonic Ball Wedge Bonding
Gold, >99.9% Au; diameter 23 μm
Encapsulation material
Encapsulation dimensions
Total product height
Epoxy based filled mold compound, black
(4.80 ±0.05) mm x (5.10 ±0.05) mm
(250 + 0/ - 35) μm
Products per reel
Rejecthole positions
Reject hole size
Typical 20’000 units
Type “E” (see also § Rejectholes --> Type “E”)
2.0 mm
Disconnect punch: max. 50 μm
Reject punch: max. 100 μm
At begin of reel typically 10 modules
At end of reel typically 4 modules
Metal punching burrs
# defect punched modules at
begin/end of reel
Specs on request
z = 55 μm
z = 45 µm
Specs on request
Specs on request
NOA6XT Module
(all dimensions in mm)
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Module dimensions: NOA6XT package
(all dimensions in mm)
LF Side
ProductDoc_contactless OTN-01 rev F.doc
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Drawing NOA6XT package
Chip Side
Crossection
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5
General specifications
5.1
Lead frame properties
Length:
Type
X-pitch
OTN-01
F
June 20, 2012
Endless
Super 35 mm film, three row modules
9.5 mm
Picture:
Thickness dimensions Material
CuSn6
Basic material
Ag
Plating material
Thickness
80 ± 5 μm
Overall plating: min. 1 μm
Optional spot plating (die-pad + inner
antennas): min. 3 μm
Total thickness (incl.
overall plating)
X/Y dimensions
Film width
Sprocket hole pitch
Sprocket hole size
Film edge to sprocket hole center
Sprocket hole center distance
Cumulative pitch 24 x 9.5 mm
82 ± 5 μm
Value
35.000 mm
4.750 mm
1.42 x 1.42 mm
1.585 mm
31.830 mm
228.000 mm
Tolerance
± 30 μm
±20 μm
+ 40/ -0 μm
+30/ -0 μm
± 20 μm
± 30 μm
The Ag spot-plating is on the die-pad and the two antennas.
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June 20, 2012
Splices
Number of splices
Distance between 2 slices
Splicer tape
Dimension splicer tape
Gap in X distance without tape
Overlap in Y at both tape sides
Sprocket hole pitch across splice
Max. 10 per 10 meter
Min. 0.5 meter
Polymide (Kapton)
width: (15 ± 1) mm
Min. 0 (no overlap)–Max. 0.2 mm
Max. 0.2 mm
9.5 ± 0.1 mm
On both sides
Thickness: (60 ± 10) μm
See drawing
Splice tape remains
See drawing
Drawing of the NedCard splice:
Splices XOA2 tapes
(all dimensions in mm)
Chip Side
The position of the rejecthole type “E” is shown in this drawing (see also chapter reject holes)
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5.3
Leader and trailer tape
Type of leader/trailer tape
FCI 199-01 opaque white PET tape
5.4
OTN-01
F
June 20, 2012
length
Min. 2.1 m;
thickness
125 ±10 micron
Reject holes
All rejected modules (including splices) are identified by a rejecthole. Dependent on the tape type, the
position of the rejecthole is different.
Position code
tape type
Hole size
Position (mm)
see splice drawings
X/Y Position tolerance (see *)
Type “E”
All
2.0 mm ±
0.3 mm
4.625 mm (X)
2.515; 12.165; 21.815 mm (Y)
⊕ ∅ 0.4 (M)
(*): The X/Y position tolerance of the NedCard rejecthole is based on the Maximum Material Condition
(MMC, indicated by symbol M in the drawings). This means that the tolerance increases with increasing hole
diameter. When hole diameter = 1.7 mm (minimum), the position tolerance is ± 0.20 mm. When hole
diameter = 2.0 mm (optimal), the position tolerance is ± 0.35 mm.
Some rejected modules might be completely cut out from the lead frame (see also the splice drawing).
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6
Packing specification
6.1
Shipping reels
OTN-01
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June 20, 2012
The product is wounded on standard anti-static shipping reels, together with an anti-static interliner tape.
Reels have an inner core diameter of 200 mm. The outer dimension is 330 mm. See figure below.
Reel type: TX36-08-A2.
ESD Surface resistivity: 108 - 1011 Ohms/SQ
Outer diameter: 330 m +0.3/-0.4 mm
Total thickness of reel: 45.2 max.
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Winding direction
Winding description:
Encapsulation-side: Outside;
Triangles points towards leading side.
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Labeling finished goods
Each finished reel contains a self adhesive label.
Content of the finished good label contains information in text format as well as in bar-code format.
The information on the label is as follows:
Customer product name: xxxxxxxxxx
<barcode customer product name>
Finish date: xxxxxxxx
Customer product no.: xxxxxxxxxx
<barcode customer product no.>
NedCard product no.: xxxxxxx
<barcode Nedcard product no.>
NedCard Reel lot no.: ABC081215.C5 ; see (*) below
<barcode reel lot no.>
Wafer Batch no.: xxxxxxxx
<barcode wafer batch no.>
Total units: xxxxxx
<bar code total units>
Total good units: xxxxxxxxx,
<bar code total good units
* Explanation of the code used for the NedCard lot no.:
12345AB/6
12345 Reference to the order
AB
Reference to the waferbatch in this order
6
Reel no. 6 in this waferbatch.
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June 20, 2012
Packing method
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Product Specification
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6.5
OTN-01
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June 20, 2012
Shipping Box
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7
Storage and handling final products
7.1
Storage recommendations
OTN-01
F
June 20, 2012
Chip card modules on reels should be kept in their original packing when not in use. Breakage of the
packing will result in faster degradation of the modules on the reels.
Storage temperature:
Relative humidity:
Storage duration:
7.2
15 °C to 30 °C
Max 70% and no condensation allowed.
Max 1 year when kept in original unbroken packing.
Reel handling recommendations
The reel is (partly) open at the two sides (left/right sides). Be careful that part of the tape can be damaged
when placing a reel on an (uneven) surface. The leader-and trailer tape are not anti-static and might attract
dust. Special precautions are required for handling reels with molded encapsulation bodies: the stiff plastic
guard band is essential for protection against cracks in the mold caps. See reel handling instruction below.
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8
Product Quality
8.1
Reliability standards
Item
Method and condition
OTN-01
F
June 20, 2012
Specification
Level: Modules
1
Die shear strength
MIL–STD-883E,
method 2019.5
For die–size < 4,1 mm2
Die shear: > 0,6 kg/mm2
For die–size > 4,1 mm2
Die shear: > 2,5 kg
2
Ball shear strength
Jedec STD-22,
method B116
Ball shear: Min. 21 g
3
Wire pull strength
MIL-STD-883E,
method 2011.7
Wire pull: Min. 3 g
4
Temperature cycling test
Mastercard CQM Version 1.9,
- 40 0C/ + 125 0C,
transfer time < 1 min
no fails at 100 cycles
5
Temperature/Humidity
test
Mastercard CQM Version 1.9,
850C/ 85%RH
No fails after 500 h
Level: Integrated circuit cards
6
Dynamic bending test
ISO/IEC 10373-1
ISO 7816-1,
no rejects at 2000 cycles
7
Dynamic torsion test
ISO/IEC 10373-1
ISO 7816-1,
no rejects at 1000 cycles
8
3 Wheel mechanical test
ISO/IEC 10373-3, A-1,
tested with a force of 8N
no rejects at 100 cycles
9
Wrapping mechanical test
Mastercard CQM Version 1.9
R=25 mm
no rejects at 10 cycles
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8.2
OTN-01
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June 20, 2012
General control plan
An overview of the control plan during the assembly/test processes is given in document CP00 Nedcard
standard Control plan. On special request, data is available.
8.3
Yield data (1)
Test yield: The number of good modules divided by the number of devices in one reel.
The test yield per reel is typically > 99.0 %.
The minimum test yield per reel is 80%. Hence the maximum amount of all defect marked modules will not
exceed 20 %. Reels with a yield lower than 80 % (either total yield or test yield) will not be released for
shipping before approval of the customer.
Total batch yield: The number of total pass modules divided by the total number of received good devices.
The total yield per batch is typically > 98.5 %.
(1)
Assembly related yield
8.4
Good/bad criteria
The definition of the visual good/bad criteria is outlined in details in the document GBC-NC-01 “Good Bad
visual Criteria for Contactless products, NedCard”.
9
AQL testing
9.1
AQL sampling by NedCard
As is shown in the production flow, the assembly/test flow is finalized by a QA-gate procedure. The QA-gate
inspection is organized according to the AQL system, ISO 2859, single sampling, normal inspection.
Batch size: 300.000 pcs
AQL level II, code Q: sample size 1250
defect category AQL
accept reject
Critical defect 0.015 %
0
1
Major defect
0.065%
2
3
Minor defect
0.65 %
14
15
Critical defects:
Critical defects are cracks in mold cap, delaminations, singulation punchings touches the cap,
damaged splices, wrong winding direction.
Major defects:
Major defects are deep scratches (exposed metals), damaged leadframe/antennas, mold flash on
antennas, exposed die/wire, partial fills, mechanically damaged mold cap.
Minor defects:
Minor defects are fingerprints, dents, pinmarks, stains, corrosion, metal burr, pinholes, strange
particles.
The sample is taken from one reel (selected at random in the batch). A reject at the QA-gate leads to two
actions:
- A correction of the assembly process.
- The rejected reel is subject to a re-inspection and is resubmitted at the QA-gate.
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June 20, 2012
Acceptance testing by customer
Acceptance testing by the customer can be organized in-line with the AQL sampling by NedCard. The
inspection can be organized per shipping batch or per individual reel.
Note: It is crucial that the sample is representative for the batch under evaluation. Hence the modules in the
samples must be distributed at random in the batch.
Alternatively, the customer may select an individual reel/batch and perform a 100 % inspection. The
accept/reject criteria are then defined by the AQL-level. This leads to the following accept/reject criteria per
reel (assuming 20.000 modules) in terms of number of defects per reel.
Defect category
Critical defects
Major defects
Minor defect
Accept
3 defect
13 defects
130 defects
reject
4 defects
14 defects
131 defects
The accept/reject criteria per effect category (critical/major/minor) are valid for the sum of all fails in one
category.
10
Miscellaneous
10.1 Major change procedure
According to JEDEC 46-B.
Customer will be notified a minimum 90 days before the scheduled shipment of the identified product.
Shipment may occur upon approval by the customer.
Customer should accept receipt of the change notification within 30 days of delivery of the change
notification. Lack of acknowledgement of the change notification with 30 days constitutes acceptance of the
change.
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