2013
Innovative industrial solutions
CHIP 2013
CONTENTS
CONT 1.0
2.0
ENTS 3.0
Editor in Chief Sven E. Jarby
Managing Editor Beatrice Eichmüller
Editor Peter Kraus, REMCOM GmbH (USA/Switzerland)
Editor Sara Ver-Bruggen (UK)
Design/Layout Darren Stacey, Doubletake Design Ltd. (UK)
Published by Oerlikon Systems, P.O.Box 1000, FL-9496 Balzers, Liechtenstein
Printed by Südostschweiz Print (Chur, Switzerland)
Photography Peter Fuchs (Buchs/Switzerland) / Michael Reinhard Photography (Herrliberg, Switzerland) / Oerlikon Photography unless stated
Comments & Information Please contact us at info.systems@oerlikon.com or for more information visit www.oerlikon.com/systems
4.0
5.0
6.0
03
Introduction
Andreas Dill: A Formula for Success
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
04
Oerlikon Systems Business News
VLSI Awards Go to Oerlikon
Asia - the Eastern Promise Working at the Frontiers of Innovation
SEMI: Moving to 450mm in U.S.A.
How to Craft a Strong Global Brand Message
Oerlikon Balzers: A “Green” PVD Coating
Oerlikon Leybold Vacuum: Hidden Champ for Thin Films
06
08
10
12
16
18
20
22
2.0Semiconductor
2.1 The Goal is Speed with HEXAGON
2.2 LLS Sports New Robot Handling
2.3 New Materials for Advanced Memory Devices
2.4 Power Device Production Goes to 300mm
2.5 Rotary Cathode Reduces Running Costs
2.6 Collaborating on TSVs for 2.5D Interposers
24
26
28
30
32
34
36
3.0
3.1
3.2
3.3
3.4
3.5
Technology and R&D
High-Quality PZT Thin Films Meet Productivity
Lightbulb Moment: Lower Cost LED Production
Market Heats Up for Thermoelectric Converters
SOLARIS: Lab to Fab with High Efficiency PV Cells
Driving Down The Cost of Directional PVD
40
42
44
46
50
52
4.0
4.1
4.2
4.3
Advanced Nanotechnology
56
Breakthrough “Anti-Smudge” Coating for Touch Panels
58
SOLARIS Shines in Semi Production
60
PV Coatings on CLUSTERLINE®62
5.0 Customer Service
5.1 Making Customers Happier
5.2 Getting Spare Parts Quickly & Easily
64
66
68
6.0 Worldwide Sales & Service Network
6.1 Woowon Scores New Opportunities 6.2 How & Where to Find Oerlikon
70
72
74
CHIP 2013
INTRODUCTION
05
INNOVATION +
RELIABILITY =
FORMULA FOR
SUCCESS
Dear readers,
Welcome to our 2013 edition of Chip.
Innovation is a prerequisite in our
business – it is in our DNA. Of equal
importance is how to turn innovation
into reliable production tools and
the ability to meet the needs and
requirements of our customers as they
meet the challenges of their respective
industries. These three factors, each
given equal emphasis and weight
within Oerlikon Systems, are reflected
again this year by our company’s
achievement as a consecutive winner
in the annual VLSI awards. For this
year these are: ‘10 BEST Focused
Suppliers of Chip Making Equipment’,
‘THE BEST Suppliers of Silicon Wafer
Fab Equipment’ and ‘RANKED 1st in
Deposition Equipment’.
Our success can be attributed to our
acute awareness of what it takes to be
a reliable partner to both our customers
and our supply chain partners.
This approach is exemplified by
the continued enhancement of our
CLUSTERLINE® family of tools with
new process modules and respective
process capabilities and the HEXAGON,
our most productive deposition tool
for advanced semiconductor chip
packaging applications.
NanoSmooth™, a new process
created by Oerlikon Systems, has been
qualified by our partner and customer.
This process has been developed to
augment the light output of LEDs and
to make the production of LEDs more
cost-efficient, as demand for solid
state lighting technologies for general
lighting grows. It is another prime
example of our approach of establishing
a partnership with a key partner and
customer to develop a production
solution through close, trust-based
cooperation, which ultimately reduces
cost of ownership, optimizing the
customers’ operating costs.
Oerlikon Systems continues to work
on innovations in the Advanced
Nanotechnology sector, transferring
the know-how and expertise gained
from the semiconductor industry to
develop novel production solutions for
exciting emerging mobile electronics
applications such as e-paper and
touch panels. An important field within
Oerlikon Systems continues to be
energy applications, including energy
storage, thermoelectric generators
and photovoltaics, where in the
latter’s case our innovative approach
is helping to enhance high-efficiency
silicon heterojunction solar panels,
a photovoltaic technology that is
expected to see demand growth from
2014 onwards.
Despite a positive start to the year,
macroeconomic conditions ensure that
prudent investment decisions prevail in
the semiconductor industry. However
Oerlikon Systems is in a position to
respond rapidly when investments to
ramp capacity, made at shorter notice,
pick up again in the mid-term.
At this point it is important to emphasize
that we are committed to meeting
the requirements of local customers,
strengthening our focus on Asia, which
is the most important growth region for
Oerlikon Systems, as well as the Group
as a whole, while balancing this with
our ongoing commitment to serve the
established, innovation-led markets in
the US, Europe and other developed
economies.
Innovation, reliability and consistency,
these are our core strengths and we
continuously strive to be “Best-in-class
(BiC)”, in all economic “weathers”
and market cycles. This is why we
constantly re-evaluate the after-sales
service we provide all of our customers
with. We are confident that by the
end of this year the majority of our
customers will be able to benefit from
our Catalogue Creator designed to
provide access to parts and spare parts
even more quickly.
In my last editorial I mentioned that our
drive to innovate is a big part of who
we are and how we work, but we also
understand the value and importance
in being a reliable partner and supplier.
We hope you enjoy reading about our
commitment to these maxims in our
2013 issue of Chip.
Sincerely,
Andreas Dill
CEO Oerlikon Advanced Technologies
1.0
2.0
3.0
4.0
5.0
6.0
CHIP 2013
1.1 OERLIKON SYSTEMS BUSINESS NEWS
09
“Very solid, reliable, and excellent
support; by far the very best
supplier we have…“
ANOTHER VOTE OF
CONFIDENCE
“Oerlikon has the best technology
available with the best support staff.”
“Oerlikon has always, and continues
to outperform its competitors in every
aspect.”
Building on the successful upward trend
of recent years, Oerlikon Systems has
– once again – won high honors in the
annual VLSIresearch customer survey.
The company won awards in three
different categories: “10 BEST” Focused
Suppliers of Chip Making Equipment,
“10 BEST
Focused Suppliers
of Chip Making
Equipment” for the
4th year in a row.
“THE BEST” Suppliers of Silicon Wafer
Rated “THE BEST Suppliers of
Silicon Wafer Fab Equipment”
for the 5th year in a row.
Fab Equipment, and “RANKED 1st” for
Deposition Equipment.
“There’s a saying in sports: ‘you never
get tired of winning,’” remarks Colm
Connell, Head of Global Customer
Support at Oerlikon Systems. “And
so it is with the VLSIresearch results.
Being voted as one of the world’s best
suppliers in the VLSIresearch customer
survey is a great honor – and a
remarkable achievement for our teams!
We sincerely thank our customers for
this important recognition.”
“Congratulations to Oerlikon for a
well-deserved award,” adds G. Dan
Consecutive winner
Vote of confidence for Oerlikon Systems
Amazingly, this is Oerlikon’s 13th consecutive appearance
The latest VLSIresearch survey results underline the growth
in the 10 BEST and THE BEST Suppliers lists. Overall,
trends for the company as well. Oerlikon Systems is on
Oerlikon Systems won the following awards:
track for another year of solid growth despite a highly
ƒƒ 10 BEST Focused Suppliers of Chip Making Equipment
ƒƒ THE BEST Suppliers of Silicon Wafer Fab Equipment
ƒƒ Ranked 1st in Deposition Equipment
Oerlikon, a consecutive winner in the annual VLSIresearch
surveys, rated in the “THE BEST Suppliers of Silicon Wafer
Fab Equipment” for the 5th year in a row. The company
cyclical market.
“To repeat as a winner in the VLSIresearch survey results
is very encouraging for all the Oerlikon customer support
teams,” says Albert Koller, Head of Semiconductors at
Oerlikon Systems. “It also confirms that we’re meeting
customer expectations. However, we also realize that there
is still room for improvement.”
Hutcheson, CEO of VLSIresearch. “Your
also won a “10 BEST Focused Supplier of Chip Making
“We’ve worked extremely hard to be the best at what we do,
customers voted Oerlikon to the top of
Equipment” award for the 4th year in a row. This category
and to build on trust with all our customers,” adds Andreas
covers all sectors of the semiconductor industry: wafer
Dill, CEO of Oerlikon Advanced Technologies. “We’re
processing, assembly, packaging, testing, etc. And last but
thrilled with the excellent VLSIresearch survey rankings; it’s
rankings of the past two years – a
not least, Oerlikon was ranked #1 outright for “Deposition
a positive market response to all our innovative solutions.
remarkable result!”
Equipment,” a highly competitive sector.
Congratulations to everyone at Oerlikon Systems!”
our survey by repeating the impressive
CHIP 2013
1.2 OERLIKON SYSTEMS BUSINESS NEWS
11
Asia 60%
China 22%
I
n 2012 over 55% of Oerlikon Systems’
revenue came from Asia, with China
alone accounting for more than 20%
of this portion, which will increase
year-on-year for the foreseeable future.
Asia has traditionally attracted offshore
supply of high-volume memory devices
and provided foundry services to
semiconductor manufacturers. The
back-end assembly and testing of these
devices has moved to the best cost
countries as regions have developed.
Looking back, the trend was for
the industry to move technology
manufacturing to Japan in the early
1980s, then to South Korea in
the early 1990s. Next, we
saw a large investment
into Taiwan as we broke
the new millennium. In
support of the world’s
largest growing
consumer market,
China is building its
infrastructure by
rapidly adopting
technology that
Trevor Norman,
Head of Global Sales,
Oerlikon Systems
en
ue
TODAY A SIGNIFICANT PART OF OERLIKON SYSTEMS’ REVENUE COMES
FROM CUSTOMERS IN CHINA RAMPING UP LOCAL SEMICONDUCTOR
PRODUCTION, SO THE COMPANY’S STRATEGY IN THE CHINESE MARKET
IS KEY TO ITS SUCCESS IN THE FUTURE.
ev
Oerlikon
supports energy efficiency, connectivity
and mobile devices and applications.
Oerlikon recognized the same pattern of
movement and development occurring
in China. Early deployment of legacy
processes transferring from existing
semiconductor regions help to build and
attract the infrastructure necessary to
enable more advanced semiconductor
manufacturing capabilities.
In 2009 Oerlikon decided to move to
an agency model in Asia. Oerlikon,
through its agencies, is established
in five regions supporting Japan,
South Korea, Taiwan, south-east Asia
(Singapore, Malaysia, Philippines,
Thailand) and China. Originally from the
UK, Trevor Norman spent 20 years in
California’s Silicon Valley before moving
to Singapore, then to Taiwan and is now
supporting the growth in China out of
Oerlikon’s Corporate Headquarters in
Shanghai. The agencies are managed
through regular business reviews
and the collective role is to act as the
interface between the Swiss factory
and the ‘opportunity’. The agencies are
exclusively responsible for providing
pre- and post-sales support, together
with the technical support for installation,
commissioning and warranty. In China, Oerlikon saw a need for
investment into supporting the
developing needs of the region and
r
s’
m
te
Sys
Trevor Norman helped steer the
company’s agency, DKSH, to become
more proactive in the region. As a result
China is now the biggest independent
region when compared to on a global
basis.
In recognition of his efforts for executing
one of the most successful China market
strategies in the global semiconductor
industry, he was inducted into VLSI’s Chip
Insider 2012 All Stars and Hall of Fame.
VLSI describes his efforts as: “A classic
blue-ocean strategy of finding new
markets where sharks won’t go, tailoring
products for the required needs and
reorganizing operations to support this”.
Markets
“We continue to focus on markets that
match our core competencies,” says
Trevor Norman. Specifically, the growth
opportunities for technologies that are
inherently important to sustaining China’s
growth are: advanced packaging,
energy efficiency – especially power
devices, energy harvesting and
energy storage. Oerlikon Systems’
core competency is providing leading
solutions for the back-end assembly and
power device manufacturing markets,
such as advanced packaging for smart
phones, tablets, ultra-thin laptops and
system-on-chip electronics.” We have
unique capabilities in providing solutions
in energy efficiency such as LEDs for
lighting, IGBTs for power distribution and
control (high-speed trains, refrigeration,
A/C, infrastructure), energy harvesting
(wind, solar, etc.) and energy storage
(lithium batteries, etc.),” he explains.
Outside of the semiconductor industry,
Oerlikon will also promote its exclusive
capabilities to provide solutions to other
markets that are key within China’s
official on-going development plans. “Our
Five-Year technology roadmap supports
growth of all our core competencies
in thin-film deposition and supports
applications in semiconductor, touch
panel, energy harvesting, energy storage
and efficiency,” says Trevor Norman.
“Taking into consideration the different
cultural aspects of what essentially
amounts to a Europe-headquartered
business brand in China and, therefore,
ensuring that Oerlikon’s objectives are
aligned with those of our customers in
China, is one of the most challenging
aspects of what I do,” he adds. Each
region is unique, and China has its own
requirements that differ from Oerlikon’s
experience in Asia.
“Rapid growth and large geographical
regions are synonymous with the general
view of China, and so bring with it
challenges that we need to continue to
work on. We started by leveraging our
experience and proven best-in-class
performance with customers in other
regions who are looking to move into
China. Riding on the coattails of foreign
investment is not enough, so we have
tailored our support, spare parts and
products for a bespoke application
specific to the needs of each market
within China.
“Traditionally the value that a Swiss
manufacturer, such as Oerlikon, brings is
a high quality product that contributes to
the lowest cost-of-ownership. My job is
about successfully translating the needs
of the customer back to our organization
and, together, we are able to influence
the decisions made at the customer
with offerings that match their needs by
confidently supplying the best cost-ofownership specific to the market. China
is very loyal to labels/branding, and once
you prove your capability you tend to be
rewarded by becoming a key supplier.
“The success of our partnership with
China requires Oerlikon to capitalize on
China’s proven ability to implement and
deploy in rapidly changing markets while
safeguarding Oerlikon’s reputation as a
best-in-class solution organization.”
CHIP 2013
1.3 OERLIKON SYSTEMS BUSINESS NEWS
At the
frontiers of
innovation
HOW BUSINESS DEVELOPMENT IS IDENTIFYING NEW
MARKETS FOR GROWTH FOR OERLIKON SYSTEMS
T
echnology is a powerful enabler of enhanced
living conditions and offers opportunities
across industries for diversification and
growth. In the semiconductor, mobile
communication, energy and advanced nano markets
that Oerlikon Systems serves, continuous investments
into leveraging and enriching core competences
provide a solid basis for long-term market success.
To be able to identify what thin film equipment
solutions customers are going to require is a key part
of the role of business development within Oerlikon
Systems. Business development acts as an internal
partner to the corporate-level team and business
units on strategic matters, from organic growth to
partnerships, regional market development and
business planning.
As Oerlikon Systems grows in terms of serving the
most innovative, technologically challenging and
growing end-user markets, including MEMS, LED,
advanced packaging and touch panels, business
development leads market entry, development and
growth in partnership with Oerlikon Systems’ business
units, the sales force and the technology department.
For example, PVD processes that run on the
CLUSTERLINE® production platform are an Oerlikon
Systems specialty and business development
supports business units in defining market entry
strategy. The introduction of the MEMS piezo
materials manufacturing solution is in response to
the increasing opportunities that such materials
have to offer to customers and end users. Business
development helps align technological innovation
in deposition and characterization of piezoelectric
materials with the market requirements of emerging
applications such as autofocus lenses, infrared
sensors and microspeakers. This is achieved
through the early identification of emerging players,
establishment of new solid business relationships and
development of market strategy to bring to market lab
innovations.
13
Antonio Calvosa,
Head of Business
Development,
Oerlikon Systems
CHIP 2013
1.3 OERLIKON SYSTEMS BUSINESS NEWS
15
China, especially, is driving Asia’s growth in electronics
manufacturing. This requires working closely with teams
there, in order to be able to establish where the market
is heading in the future and liaising with the rest of the
centralized business development team within the
Oerlikon Group. This allows us to be able to share best
practices in order to maximize the opportunities that
emerging markets are providing.
Market identification and development involves
extensive liaising and interfacing with customers in
different markets and, also, with analysts to keep
abreast of both macro- and microtrends. Solutions,
such as HEXAGON, have come to fruition as a result
of a strong focus on tracking the evolution of existing
markets that our customers are active in and analyzing
and monitoring competitor markets. Factors that
initiated the development of MEMS PZT were driven
by Oerlikon’s continued focus on customers’ success,
which, fundamentally, was based on understanding of
megatrends and relating these to product solutions,
customer roadmaps and research-driven innovation.
In order to do this, establishing strong relationships,
based on trust, with customers on their most innovative
projects is key. For our customers we are the partnerof-choice for speed, reliability, productivity and cost-ofownership.
Business planning activity
Where business planning activities are concerned, we
are faced with some big challenges but we are well
prepared to identify the strategic opportunities that these
present. We are readily embracing the accelerated shift
by Oerlikon Systems’ revenue base to Asia. In Europe
we are committed to building on our strength in line with
the European Commission’s New European Industrial
Strategy for Electronics. This initiative involves better
targeted support to mobilize €100 billion in new private
investments, in order for European chip production to
effectively double to around 20% of global production.
We are in a strong position to support this ambition
with our partners in the European semiconductor
and microelectronics industry. Equally, we are also
committed to enabling efforts by the US semiconductor
industry that are directed at strengthening its own
production base and others that maximize its position as
a global leader in semiconductor and microelectronics
design capability.
China is investing in developing a complete local
supply chain. Oerlikon receives several requests for
partnerships and business development analyses and
selects best opportunities for regional growth. The new
China Five Year Plan is putting additional emphasis on
competitiveness through manufacturing. Being able
to work together, and grow, with local companies is
key in order to ensure industry growth and meet target
development objectives.
In other emerging markets, such as the case of Russia,
pilot manufacturing programs have potential to establish
a strong local manufacturing industry. In addition, local
R&D programs, from ‘Skolkovo’ to VC- funded activities,
are paving the way for innovation in nanomaterials
with applications in energy, health and resource
management.
THIN FILM
ELECTRONICS
PRODUCTION
IS ALWAYS
EVOLVING AND,
TODAY, OERLIKON
SYSTEMS IS
SUPPLYING
BEST-IN-CLASS
SOLUTIONS SUCH
AS HEXAGON,
CLUSTERLINE®,
LLS AND SOLARIS.
New technology trends
In some cases, technologies find their way
Technologically, some new markets can take
a long time to develop such as organic LEDs
(OLED) and thermoelectric generators. In these
cases, business development keeps abreast of
industry developments, establishing connections
with startups, corporate innovation departments
and venture capital arms as well as seed and
growth capital investors. Finally, information and
partnerships are created and R&D is leveraged for
accelerated industry access.
more rapidly to the market. This is the case, for
OLED technology, for example, has begun to
establish itself as an alternative to LCD displays in
the smart phone market, but has the potential to
replace LCD in large-area display segments such
as computer devices and flat panel televisions
and, even, lighting. We are actively engaging
in OLED and other emerging nanomaterial thin
film technologies and processes, in order to be
able to develop new equipment, accordingly, in
response to our customers’ demand as these new
technologies become more established.
best-in-class solutions such as HEXAGON,
example, with nanowire technologies in touch
panels. A key task of business development is
the monitoring of emerging trends in thin film
materials, nanomaterials and related technologies
in order to keep abreast of new advances and to
provide competitive manufacturing solutions to the
industry.
Thin film electronics production is always evolving
and, today, Oerlikon Systems is supplying
CLUSTERLINE®, LLS and SOLARIS.
It is vital that Oerlikon Systems continues to
provide best-in-class production solutions for the
semiconductor and electronics industry today,
and in the future. Business development exists to
support this, by tracking trends and new growth
opportunities, by analysis of market intelligence,
and by maintaining trust-based relationships with
customers, agencies, as well as R&D partners.
CHIP 2013
1.4 OERLIKON SYSTEMS BUSINESS NEWS
17
Special SEMI Report to CHIP
U.S. SEMICONDUCTOR
BY KAREN SAVALA
PRESIDENT,
SEMI AMERICAS
MARKET TRANSITIONS TO
450MM
NEW TECHNOLOGIES
NOT TOO LONG AGO, MANY IN THE U.S. MICROELECTRONICS INDUSTRY WERE
CONCERNED ABOUT THE TREND TOWARDS MANUFACTURING IN ASIA. BUT
TODAY, THE NORTH AMERICAN MARKET HAS REBOUNDED: IT IS, ONCE AGAIN,
ONE OF THE LARGEST AND FASTEST GROWING MARKETS IN THE WORLD FOR
ADVANCED SEMICONDUCTOR EQUIPMENT AND MATERIALS.
Leading this rebound are chip giants Intel and
GLOBALFOUNDRIES, but robust equipment and
material spending will also occur at Micron, TI and
Maxim. In addition to spending on advanced nodes,
the U.S. market benefits from the emergence of
G450C, the new consortia responsible for 450mm
wafer processing development, and the continuing
strength of leading fabless chip companies like
Qualcomm, NVIDIA, Broadcom, and others. Higher up
the food chain, companies like Apple, Cisco, HP and
Oracle further reinforce North American chip prospects
for the future.
U.S. market spending growth
Not so long ago, many saw U.S. competitiveness
in chip manufacturing to be on the wane, as China,
Korea, Taiwan and Japan all pursued leading-edge
manufacturing. In 2007, the U.S. market had about
15% of the world’s spending on semiconductor
equipment. By 2012, the U.S. market share jumped
to 22%. Five years ago, Intel was busy establishing
its first China fab and AMD production was centered
in Dresden, Germany. This year, Intel will spend
about $3-$3.5 billion, primarily at its Fab 42 in Arizona
and Dx1 fab in Oregon; and GLOBALFOUNDRIES
will invest $1.2-$1.8 billion on equipment at the
company’s new fab in New York. In addition, Micron,
CNSE (NanofabX for G450C), IBM and Maxim may
collectively spend $1.0-$1.5 billion in equipment this
year. According to the SEMI World Fab Forecast, over
$8 billion will be spent in equipment in the U.S. in
2013, nearly as much as South Korea and well over
double the spending in China, Europe or Japan. And
2014 will see a further increase.
In materials, we project a 3% spending increase
in North America to $4.85 billion. This number is
dominated by front-end materials sets, as back-end
operations are overwhelmingly located in Asia. In
photomask materials, for example, the U.S. represents
approximately 20% of the world’s demand.
450mm a key trend
Ensuring critical technology needs
The emergence of 450mm wafer processing will
help sustain North America’s central role in the
industry. Currently, U.S.-based pilot lines for 450mm
manufacturing are scheduled for 2015 and 2016 with
high-volume manufacturing targeted for 2018. The
knowledge infrastructure for 450mm manufacturing
in the U.S., and the challenges of bringing larger
wafers online synchronously, with an advanced node,
indicates the first generation 450 mega fabs will be
located in North America, and not just by Intel.
With so many novel technology challenges, the
innovation pipeline in the U.S. is undergoing rapid
change. The strategic investor arms of leading
companies are taking a more active role with key
suppliers and emerging companies, working closer
with the venture capital community and other
investors. They are also working more closely with
global supply chain managers to ensure critical
technology suppliers around the world are financially
secure and closely aligned with the future needs of
industry.
Another key trend in the U.S. microelectronics industry
is the evolving role of semiconductor R&D and supply
chain readiness. Never before have the technical
challenges facing our industry been so diverse and
complex. In addition to the planned transition to
450mm wafer processing, the industry is also dealing
with new transistor architectures, new materials, 3D
stacked ICs and uncertain lithography scaling through
multi-patterning and, eventually, extreme ultraviolet
technology. Increasingly, these challenges are being
addressed through new collaboration models with
leading fabless chip firms like Qualcomm and NVIDIA
and top EDA companies such as Synopsys and
Mentor Graphics. These new collaboration models
extend to key subsystem and component suppliers
and new technology companies that are just emerging.
These are challenging, but exciting times for the U.S.
semiconductor industry: a time where R&D and capital
spending is growing, where innovation is critical for
next generation processes, and where the role of the
supply chain has never been more important.
South Korea
$8b+
USA
Over $8 billion
will be spent in
equipment in 2013
Japan
China
Europe
CHIP 2013
1.5 OERLIKON SYSTEMS BUSINESS NEWS
HOW A GLOBAL COMPANY
CONVEYS A STRONG
GLOBAL BRAND MESSAGE
19
Sven E. Jarby (left) and
Alex Sauber inspect
the Sauber C32 race
car at the Sauber
development center in
Hinwil, Switzerland.
TARGETED SPORTS SPONSORSHIP PLAYS A PROMINENT ROLE IN
OERLIKON’S COMMUNICATIONS STRATEGY. SVEN E. JARBY, HEAD
OF GLOBAL MARKETING AND BRANDS AT OERLIKON, EXPLAINS HOW
SPONSORSHIP COMMITMENTS IN MOTORSPORTS AND ALPINE SKIING
REFLECT THE COMPANY’S OWN UNIQUE APPROACH.
It’s no longer news to the industry and the high-tech
sector: Oerlikon is back. Operational and strategic
measures – including a comprehensive refinancing
and streamlined divisional portfolio – were successfully
implemented. A renewed focus on innovation based on
core technology strengths was a further factor in the
company’s stand-out financial results of the past years –
and a global sponsorship campaign also played a role.
“At Oerlikon, we look at sponsorship as a key part of our
communications strategy,” explains Sven E. Jarby. “Our
partnerships with recognized motorsports and skiing
organizations, for example, help us position our brand
and grow relationships within established and growth
markets around the world.”
Oerlikon is all around us
A closer look at the company and sponsorship partners
reveals the logic – and marketing potential – of the
sponsorship strategy. Oerlikon Systems provides
technologically innovative production solutions
for machine and plant engineering applications to
companies around the world. The built-in know-how
from Oerlikon enables clients to successfully develop
and manufacture a range of high-tech end products.
Countless objects that we use every day are based
on this know-how: in our clothing, carpets, cars,
mobile devices, electronic tools, communications,
tires, watches, tools, even energy systems. Oerlikon
technology can be found everywhere around us.
“With such a range of high technology applications –
and the resulting end products just for Oerlikon Systems
alone – this shows we have a lot to tell the world,” adds
Sven E. Jarby.
A STRONG PARTNERSHIP:
Sauber F1 Team & Oerlikon Group
Present and future innovations
The story being told through sponsoring includes not only
production equipment for ultra-compact semiconductor
components used in cell phones, navigation systems
and consumer electronics, but also LED technologies.
That’s the present; the future looks even busier, with
emerging technologies to serve growth markets (many are
described in this issue of Chip) that are only now taking
shape:
ƒƒ Mobile communications: specialized processes and
equipment to produce ever smaller and more powerful
semiconductor components for yet unheard-of mobile
devices
ƒƒ MEMS and nanotechnology: high performance sensors,
actuators, micro-fluid and thin-film read/write heads, all
unimaginably small… and powerful
ƒƒ “Green” technology: high-efficiency applications such
as brighter and cheaper LEDs, vastly more powerful
batteries, energy conversion systems (thermoelectric,
solar cells) and applications to increase energy
efficiency (power semiconductors)
This technology roadmap underlines the importance of
relevant and understandable sponsoring activities that can
illustrate the Oerlikon story in a clear and credible way –
today and tomorrow – and not only for our B2B audience
but for professionals as well as the end customer.
“Our sponsoring partnerships contribute to our business
success by strengthening Oerlikon brand recognition;
positioning the brand as innovative and successful, and
helping to cultivate relationships across all our markets,”
adds Sven E. Jarby. “Sponsoring is natural to our
corporate culture. Our commitments accurately reflect
and communicate our core values: integrity, team spirit,
excellence and innovation.”
The Swiss Sauber Formula One team founded
in the 1970s by Peter Sauber has been a firm
fixture in Formula One racing since the early
1990s. The team originally gained recognition
in hill climbing races and winning the World
Sportscar Championship in 1989 and 1990. After
partnerships with Mercedes and BMW, Sauber
currently uses the Ferrari 2.4-liter V8 motor.
An obvious and excellent match
Oerlikon products are an integral part of the
automotive world. The company’s Textile division
supplies tire cord, technical fibers for lightweight
components and special yarns for racing gear.
Oerlikon Drive Systems provides high-performance
gearing systems for sports cars. Oerlikon Vacuum
has solutions for paintwork. Oerlikon Coating
provides a process to make high-stress engine
components last longer. Production solutions from
Oerlikon Systems stand behind manufacturers
of computer chips used in engine control, safety
electronics, sensors, navigation and mobile
communication systems. These technological links
make the partnership between Sauber and Oerlikon
an obvious and optimal match.
Oerlikon has been a Premium Partner of the Sauber
F1 Team since 2012. Alex Sauber, Marketing
Director of the Sauber F1 team comments:
“With the extreme demands in performance
and endurance, Formula One racing has always
been a hotbed of technological innovation. And,
with Oerlikon, we now have the ideal technology
partner. Recently, we expanded our partnership
to help improve our organization’s environmental
performance; we already see great potential for
numerous know-how transfers in the future.”
Counting the points
Last year was a very good year for the Sauber
F1 Team, with four podium finishes, with 126
World Championship points and sixth place in the
constructors’ standings – another improvement
over the previous year. During the 2013 racing
season, the Oerlikon logo is displayed prominently
on the engine cover of the new Sauber C32, and
on the team outfits. The race is on!
CHIP 2013
1.6 OERLIKON SYSTEMS BUSINESS NEWS
“GREEN” PVD COATING MAKES
PLASTICS LOOK LIKE CHROME
NEW PLASTIC METALLIZATION FOR HIGH-VOLUME PRODUCTION ADDS
FUNCTIONALITY AND DESIGN FLEXIBILITY AT AN ATTRACTIVE COST
Top
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at (
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Advantages for the end user and manufacturer
ePD™ also allows new functions:
Figure 1: The new embedded PVD (ePD™) process developed
by Oerlikon Balzers features a thinner coating compared
with electroplating (40-60µm vs. 25-40µm) and meets EU
environmental regulations.
ƒƒ Radar transparency – integrates capacity sensing
technologies into metallized car parts, such as door handles
that respond to touch, lane departure control sensors in the
exterior trim, or safety distance meters in the front grill
ƒƒ Light transparency – for light-emitting buttons with laseretched letters or icons
Benefits of embedded PVD
Plastic parts coated with a chrome finish are widely used
as design elements on cars, electric devices and also
for bathroom and kitchen fixtures. A new PVD coating
process – “Embedded PVD” (ePD™) – developed by
Oerlikon Balzers provides a substantial upgrade in
environmental compatibility, cost and flexibility over
conventional electroplating or galvanization processes.
Plastic metallization coatings give a “chrome look” to anything
from bathroom faucets to a car’s front grill. The combination
of a high-quality metallic look with the light weight and the
lower cost of plastic makes these high-tech coatings extremely
popular.
But the dark side to the production of all these shiny plastic
parts is the use of environmentally harmful tri- and hexavalent
chromium (Cr3+ and Cr6+) and nickel (Ni), needed for
the electroplating process. In addition, the need to acidtreat the substrate in a chromic acid-based solution to
promote adhesion by etching dramatically limits the choice
of substrates that can be metallized (only few plastics can
withstand this treatment). And now, recent EU regulations
require authorization to use chromium trioxide in electroplating.
the end of World War II and built an R&D facility in Balzers.
Specializing in thin film technology, his new company quickly
began to develop innovative applications and it has continued
to since then.
One of the resulting companies, Oerlikon Balzers, launched a
business model based on coating services at localized centres
around the world. Today the company is a global supplier of
industrial coatings. With 92 coating centres in 33 countries
worldwide, Oerlikon Balzers is a leading specialist in surface
technologies, which are designed to improve the performance
and durability of precision components and tools for the metal
and plastics processing industries.
The other company, Oerlikon Systems, offered various vacuum
systems to many industries. The company had notable
success with optical disc metallizers in the early 1980s and
soon began focusing on semiconductor applications, adding
photovoltaic and nanotechnology applications over the past
two decades.
Today, both companies can be found in adjacent buildings and
have a long and productive history of technology cooperation
and innovation.
Electroplating also employs conductive metals which can limit
use in electric vehicles and other applications where grounding
or electrical isolation is required.
High-tech cluster – made in Liechtenstein
The new “embedded PVD” technology that combines
sustainable production with cost savings and a great-looking,
chrome-like result is the latest innovation from the ‘high-tech
cluster’ in Balzers, Liechtenstein. It all started modestly in
1946, when a gifted scientist left a bombed-out Germany after
DR. RÜDIGER SCHÄFER,
GENERAL MANAGER,
OERLIKON BALZERS
HARTEC GMBH
Under the technology brand ePD™, Oerlikon Balzers develops
integrated services and solutions for the chrome-look
metallization of plastic parts. The new, environmentally friendly
PVD process not only eliminates the use of the toxic chromium
ingredients, but also avoids the etch treatment of the plastic
substrate, increasing the range of plastic substrates that are
suitable for metallization.
The ePD™ process sandwiches the metallization effect
between two layers of UV lacquer. The first layer is the base
coat, which helps equalize irregularities on the surface of
the injection-molded plastic substrate. The PVD coating is
deposited on top by magnetron sputtering, to produce an
exceptionally stable coating with high microstructure density,
without harmful ions. To protect the metallized coating, a final
UV coating (an extremely durable, stable and fast-drying top
coat) is applied.
The environmental benefits add up: the coated parts are
recyclable, and thanks to a thinner metal coat, material
requirements for embedded PVD are considerably lower,
conserving both energy and resources. In fact, the entire PVD
metallization process consumes substantially less energy.
ƒƒ Many more colours and other optical effects are possible,
from mirror chrome to dark chrome and coloured PVD
ƒƒ Performance advantage – the PVD coating is completely
non-conductive and suitable for use in electrical vehicles
ƒƒ Corrosion resistance – particularly important for exterior
applications, proven by the “Russian Mud Test”, which uses
highly corrosive salts typically used to thaw ice on roads in
Russia and Canada
For the manufacturer, an advantage of ePD™ is the integration
of the process into fully automated inline production. This
allows high volume coating with comparably low costs. The
higher productivity is important for industries with large volume
and time-sensitive “just-in-time” production, such as the
automotive industry.
Ready to shine
The first high-volume ePD™ metallization system for
automobile interior and exterior parts is planned in 2014. The
solution is focussing on 3D parts and will have an estimated
metallization capacity of 250,000m2 per year (on only 600m2 of
space), equivalent to approx. 8-9 million meters of decorative
trim.
Pick your plastic substrate
Further advantages include a wider selection of plastic
substrates that can be electroplated (beyond PC/ABS, PC/
PBT, and ABS substrates) and many other polymers can also
be coated, such as PC, PPE, PA and ASA. Flexible polymers,
which can be bent or stretched without fracturing, can be
coated also. To provide an example of why this is an important
development, if a pedestrian is hit by a car’s metallized front
grill, even if it breaks, dangerous splinters or sharp edges,
which can cause further injury, will not be produced.
Flexibility also means that metallized parts do not have to be
pre-shaped with a curvature. For example, a car’s decorative
trim does not need to be coated in its end form, which is much
more time- and cost-intensive, but can be metallized first in a
straight form and shaped later.
Figure 2: A series of colorful start buttons for automotive interiors.
CHIP 2013
1.7 OERLIKON SYSTEMS BUSINESS NEWS
:
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THE LEYBOLD VACUUM DIFFERENCE
Leybold Vacuum’s proprietary software tools (and its team of experts) calculate what pressures can be achieved
as a function of gas loads and pump time, which is important when you need to design a tool. Such gas loads
are why production platforms like the large-area SOLARIS feature pumps that provide extra performance.
“For the product development teams at Oerlikon Systems, the best vacuum pump is a pump you never notice
and that runs for years and years,” adds Gebhard Strittmatter, Head of Sales and Services at Oerlikon Leybold
Vacuum. “Our long, maintenance-free run times in continuous operation – with reliable back-up options if
necessary – has helped to optimize the new generation of production platforms at Oerlikon Systems.”
1.0
2.0
3.0
4.0
5.0
6.0
CHIP 2013
2.1 SEMICONDUCTOR
27
SPEED IS OF
THE ESSENCE
LAUNCHED IN 2012, THE HEXAGON PLATFORM REPRESENTS
THE NEXT GENERATION IN HIGH-THROUGHPUT PRODUCTION
Today’s consumer electronics products such as smartphones,
the tool is typically configured with four modules: degas,
tablets and wireless devices, in general, are driving the everincreasing need for higher manufacturing capacity and reduced
ICP etch, Ti PVD, and Cu PVD performed sequentially. For
these applications the ICP module is also configured with
costs. This is particularly true for PVD equipment for advanced
packaging. With this in mind Oerlikon embarked on the
development of the HEXAGON tool.
Arctic Technology for good control of wafer and chamber
temperatures.
The objective behind HEXAGON was always to deliver a tool
During production, running UBM and RDL processes, the
HEXAGON has achieved throughputs that for some products
almost double that achieved with similar processes on
CLUSTERLINE® 300II and other cluster tools, resulting in a
significant reduction in cost-of-ownership (CoO) of around 30%.
capable of significantly higher throughput and productivity,
compared with existing cluster-based PVD toolsets that are
used by the advanced packaging industry. Released for
300mm advanced packaging applications, such as under
bump metallization (UBM) and redistribution layers (RDL),
multiple HEXAGON tools are now running production for these
applications.
A key feature of the HEXAGON is the handling concept
(indexing) that runs without a central vacuum robot, which
offers a significant improvement in handling speed relative to
a cluster tool. Replacing the central vacuum robot with our
innovative indexing system reduces the overall tool footprint by
almost half, compared with competing tools.
The HEXAGON can be configured with
up to five process modules with each
module visited sequentially. For UBM
and RDL packaging applications
Highest throughput
Higher throughput presents certain challenges. Processes
must be optimized to improve productivity. Higher throughput
requires certain improvements such as better control of wafer
or chamber temperatures or control of particles, for example.
For the UBM and RDL applications, where we are required
to deposit Ti and Cu over underlying PI (Polyimide) or PBO
(Polybenzoxazole) layers, a particular challenge is temperature
control and removal of by-products in the degas and etching
processes. Both of these materials are temperature-sensitive
and out-gas heavily during processing. Our Arctic Technology
takes care of the temperature issues and an optimized chamber
design for ICP helps with the removal of by-products.
Applications
ƒƒ UBM and RDL metallization
ƒƒ For UBM and RDL films Ti-Cu, TiW-Cu, that are commonly
used in today’s advanced packaging industry
Wafer size
“THE OBJECTIVE BEHIND HEXAGON
WAS ALWAYS TO DELIVER A TOOL
CAPABLE OF SIGNIFICANTLY HIGHER
THROUGHPUT AND PRODUCTIVITY.”
ALBERT KOLLER,
HEAD OF SEMICONDUCTORS,
OERLIKON SYSTEMS
To accommodate customers’ requests to also
process smaller wafer formats, the product
offering has been extended to include 200mm
capability.
CHIP 2013
2.2 SEMICONDUCTOR
29
AUTOMATE &
ACCELERATE
THE NEW CASSETTE-TO-CASSETTE ROBOT HANDLING UPGRADE
FOR OERLIKON LLS EVO AND LLS EVO II SYSTEMS PROVIDES
NOTICEABLY QUICKER AND ACCURATE HANDLING AND A HIGH
DEGREE OF RELIABILITY. FOR OUR CUSTOMER THAT MEANS
HIGHER THROUGHPUT AND IMPROVED COST OF OWNERSHIP.
The new robot handling system helps erase a
previous shortcoming of the LLS handling system:
handling speed and precision. It also helps maintain
one of the main LLS strengths – a high degree
of flexibility to process any substrate size, either
automatically or manually. Because the handling
system is modular, it can be configured for all wafer
sizes. The improved handling capabilities also
provide added flexibility to expand with additional
modules, such as mask handling or new and
emerging applications.
“Our new robot handling system makes the LLS
platform a lot faster, more precise and more reliable,”
explains Albert Koller, Head of Semiconductors at
Oerlikon Systems. “It’s a big jump in performance
over the previous solution and transforms the LLS
into a state-of-the-art automated system.”
The updated handling system on the LLS EVO ll
features a six-axis robot cassette-to-cassette
configuration with two cassette buffers. Additional
This automated handling system provides a
number of performance improvements for semi
manufacturers running the LLS EVO II system:
ƒƒ User-friendly – handling control fully integrated into
the GUI
ƒƒ Speed – higher degree of automation improves
throughput (e.g. full batch of 132 2” substrates is
loaded and unloaded within 9 minutes)
ƒƒ Easy operation – teaching of the robot can be
done via GUI (no teach-pendant needed)
ƒƒ Accessibility – cassette buffers (1 and 2) and GUI
are accessible from the same location
ƒƒ Simplified setup – six-axis configuration makes
setup and alignment of the robot handler much
easier than the previous wafer handling system
ƒƒ Versatile – flat/notch aligner 0°–360° (recipe
parameter)
ƒƒ Service & footprint – new sliding rail design
improves service access and reduces overall
footprint
robot features include:
ƒƒ Automatic or manual mode – handling can be
reset quickly for manual loading of substrates
ƒƒ Absolute encoders for easy calibration
ƒƒ Optional Barcode reader
ƒƒ High-resolution encoders ensure high precision
and superior slow speed tracking
ƒƒ Proven design provides high reliability
ƒƒ Robot rated for cleanroom applications (class 10)
Oerlikon offers different set-ups for full face
deposition on 100mm, 125mm, 150mm 200mm
substrate diameters, and also for 2” and 3”
substrate diameters.
“Our new robot handling system makes the LLS platform a lot
faster, more precise and more reliable… it transforms the LLS
into a state-of-the-art automated system.”
Albert Koller, Head of Semiconductors at Oerlikon Systems.
Happy customer
Recently, the Analog Devices wafer fabrication
facility in Limerick, Ireland took delivery of the first
LLS EVO II outfitted with the new robot handler
to process 200mm substrates.
Analog Devices engages in the design, manufacture, and marketing of analog, mixed-signal
and digital signal processing integrated circuits
(ICs) for use in industrial, automotive, consumer,
and communication markets worldwide. The
company also offers micro-electro mechanical
systems (MEMS) technology based sensors with
accelerometers to sense acceleration, gyroscopes to sense rotation, inertial measurement
units to sense multiple degrees of freedom, and
microphones for audio. The company is headquartered in Norwood, Massachusetts, and has
design and manufacturing facilities around the
world.
“The robotic handling system on the LLS has
exceeded our expectations in both form and
functionality,” says Mike Morrissey, Materials &
Deposition Manager at Analog Devices. “It provides excellent reliability, enables quick setups
and can be relocated quickly. This gives us increased flexibility with all our processes. Overall,
it’s a sublime piece of engineering.”
Robot handling retrofits are now available for the
hundreds of LLS EVO & EVO II systems in use.
New robot handling
for the LLS provides a
jump in performance
and throughput.
Hubert Breuss, Product Line
Manager Semiconductors,
Oerlikon Systems
CHIP 2013
2.3 SEMICONDUCTOR
31
Square Resistance Rs (Ohm)
Resistivity vs
temperature for
C-doped GeTe.
108
GeTe
GeTeC 4%
GeTeC 7%
GeTeC 15%
GeTeC 21%
GeTeC 24%
106
104
102
0
100
200
300
400
Temperature T (ºC)
Atomic concentration (%)
(C)
EDX profile of
a GeS2(Sb)/Ag
stack
S
Sb
Ge
100
Ag top
electrode
solid electrode
GeS2(Sb)
10
ENGINEERING NEW MATERIALS
FOR ADVANCED MEMORY DEVICES
CLUSTERLINE 200 II IS THE OPTIMAL R&D PLATFORM FOR MATERIALS DEVELOPMENT
®
Hans Auer,
Product Marketing
Manager
Semiconductors,
Oerlikon Systems
1
0
10
Targeted
% Sb
Measured
% Sb (RBS)
20
x (nm)
30
40
2%
3%
10%
20%
1,6%
2,9%
8,2%
18,2%
GeS2 Sb-doped thin films:
doping concentration
(targeted and measured
by RBS)
Oerlikon Systems and LETI have been working
together on both phase-change random access
memory (PCRAM) and conductive bridge
random access memory (CBRAM) technologies
for use in next generation memory devices. The
CLUSTERLINE® 200 II platform outfitted with an
MSQ co-sputtering source has proven an ideal
R&D partner.
Innovative partner for advanced
memory devices
An ideal R&D platform
All about speed and flexibility
“The recent work done by the LETI team on the
CLUSTERLINE® 200 II system has looked at
engineering materials to enhance PCRAM cell
performance and improve the overall reliability of
CBRAM,” explains Anne Roule, Senior Process
Engineer at CEA LETI Minatec (France).
In order to support – and accelerate – LETI’s
research into alternative new materials to be
used in memory devices, Oerlikon Systems
installed and supports a CLUSTERLINE® 200 II
system that features an MSQ multi-source with
four targets and other process modules.
Both phase-change random access memory
and conductive bridge random access memory
technologies are alternative non-volatile
memory technologies that are the subject of
intense research efforts. PCRAM devices are
considered one of the most promising solutions
to replace standard floating gate devices such
as flash memory. The main advantages of
PCRAM technology are low voltages, fast read/
write, good scalability and low cost. CBRAM is
receiving widespread interest as an emerging
low-power memory technology. It is particularly
good for back-end fabrication, CMOS scalability,
and low operating voltages.
LETI, an Oerlikon innovation partner, is part of
CEA, a French R&D organization with activities
in energy, IT, healthcare, defense and security.
LETI specializes in nanotechnology applications:
wireless devices, biology, healthcare and
photonics. With over 1,700 employees, LETI
facilitates the transfer of new technologies
– chiefly in the area of advanced CMOS
technologies, NEMS and MEMS – to its industrial
partners.
In addition, the flexible generator configuration
of the CLUSTERLINE® 200 II allows deposition
of huge variety of materials: dielectric, metallic,
chalcogenides, etc. This allows the LETI R&D
team to rapidly adjust and change deposition
process parameters, sputter alloys and
doping materials, as well as enable immediate
engineering and optimization of the interfaces.
LETI is now working on improving the thermal
stability of the CBRAM and PCRAM layers and
improving their performance in the devices.
John Whyte,
Sales Manager
Northern Europe,
Oerlikon Systems
“The co-sputtering capability of the MSQ, with
up to 4 targets and a combination of DC, pDC
and RF generators, gives our team immense
flexibility and process reliability. The quick and
reliable MSQ chamber openings help us speed
up our R&D work too,” says Anne Roule.
“For new memory devices it’s really all about
developing low voltage capabilities, fast read/
write, good scalability and all at low cost for
either PCRAM or CBRAM,” summarizes Anne
Roule.
CHIP 2013
2.4 SEMICONDUCTOR
33
THE CLUSTERLINE ® 300 II RECENTLY COMPLETED SUCCESSFUL
QUALIFICATION FOR POWER DEVICE PRODUCTION PROCESSES ON
THIN 300MM WAFERS. THE PLATFORM HAS BEEN INSTALLED IN THE
FIRST 300MM PRODUCTION LINE OF A LEADING MANUFACTURER,
WITH THE CHIPS PRODUCED ALREADY SHIPPING WORLDWIDE.
POWER DEVICE
PRODUCTION
MAKES THE
LEAP TO 300MM
CLUSTERLINE 300 II is the
qualified sputter tool in
production for power devices
®
Hans Auer, Product Marketing Manager
Semiconductors, Oerlikon Systems
With the significant gains that are
achievable in productivity and lower cost
per unit, the semiconductor industry’s
shift to 300mm wafer production has
already taken place in most highvolume applications. The step up from
200mm to 300mm wafer processing
for power devices requires numerous
major changes in production processes,
with the addition of higher degrees of
automation and sophisticated wafer
handling capabilities.
productivity along with improved
In addition to the challenge of qualifying
processes on the larger wafer format,
ensuring reliable handling of 300mm
thin wafers involved major development
efforts. From standard thin wafers to
TAIKO wafers thinned down to 90
microns, to wafers on glass carriers,
everything needed to run on the same
wafer handling solution. Unlike 200mm
production, a wafer flip unit had to be
included to avoid wafer sorting steps
to present the wafers face down in the
FOUP carriers.
Oerlikon strength
Nonetheless, the CLUSTERLINE®
product team reported success after
12 months of testing and the final
qualification procedures at the customer
facility, crowning efforts to move the high
volume manufacturing of power devices
from 200mm to 300mm wafers.
wafer size comes at a time when 300mm
The processes designed to run on the
Oerlikon CLUSTERLINE® 300 II platform
include:
performance of the frontside processes,”
says Dr. Hans Hirscher, Senior Scientist
at Oerlikon Systems.
“We worked closely with the customer’s
process scientists to qualify the tool
along with the required processes and
ramp up the 300mm production on
the CLUSTERLINE®,” adds Kai Wenz,
Project Manager for the CLUSTERLINE®
300 II at Oerlikon Systems.
Staying in the lead with sputtering
platforms for power device metallization
of thin wafers, the CLUSTERLINE® 300 II
system’s qualification for the 300mm
power device production confirms the
experience and know-how of Oerlikon’s
product and process support teams
for processing technology on 200mm
wafers, a traditional Oerlikon strength for
over a decade.
Successfully migrating power
semiconductor production to the next
wafer manufacturing is still growing,
parallel to the emergence of the next
wafer size (450mm). The success with
the 300mm wafer production process,
together with a leading customer,
represents a sizeable leap ahead in
power device production.
“Based on the long term experience
we have with 200mm power device
ƒƒ TiN barrier process for trenches on the
wafer frontside
production processes, we were able to
ƒƒ Thick Al deposition with good step
coverage on the wafer frontside
milestones,” says Albert Koller, Head of
ƒƒ Ar/ H2 etch, Al, Ti, NiV, Ag process on
the backside of thin wafers
“Now, other power device manufacturers
Cooperative development effort
“Of course, there were substantial
technical challenges in scaling up the
processes from 200mm to 300mm
wafers, while still achieving the expected
move along quickly to meet the project
Semiconductors at Oerlikon Systems.
can migrate their production processes
to the 300mm format faster with less risk
and effort.”
A promising future
The customer, a global leader in power
device production, can now manufacture
devices on 300mm wafers at its
European factory in larger volumes and
at a lower cost.
The first chip family being produced
by the CLUSTERLINE® 300 II is
already being shipped to end product
assemblers around the world.
The continuous growth of the power
device market is likely to trigger
additional 300mm production lines in the
future.
“After qualifying 200mm wafer
production at customer sites more than
10 years ago, we were pleased to do
the same now for 300mm wafers,” says
Andreas Dill, CEO Oerlikon Advanced
Technologies. “Our goal is to support
cooperative and continuous efforts by the
customer and Oerlikon teams to innovate
and increase production efficiency. This is
the most successful model we’ve found
to cope with the challenges from the
semiconductor industry.”
“Our customers will now be able to
work more efficiently and at lower cost
to meet the growing demand for power
devices and take advantage of market
opportunities in energy management
applications,” adds Trevor Norman, Head
of Global Sales at Oerlikon Systems.
CHIP 2013
2.5 SEMICONDUCTOR
35
MOVING COST-CRITICAL PRODUCTION PROCESSES ON THE LLS
EVO II SPUTTER SYSTEM FROM A PLANAR TO A ROTARY CATHODE
LAYOUT CAN BRING DRAMATIC SAVINGS IN SPUTTER MATERIAL
COSTS AND A NUMBER OF OTHER PROCESS ADVANTAGES.
Looking at the success of large-area coating systems that were
Also the process quality can be improved by the rotary cathode
transitioned from planar cathodes to running rotary cathodes
ƒƒ Reduced particle generation by suppressed re-deposition on
led the Oerlikon development team to start working on an
upgrade for the well-known LLS sputtering platform. The
LLS is used for a variety of applications like LED, Wireless,
MEMS, advanced packaging and hard disk read/write heads.
This platform is renowned for process flexibility (DC, RF, RF/
the target
ƒƒ Low damage deposition by reduced sputter voltage enabled
by increased magnetron fields, without enhanced redeposition risk or loss of target utilization
ƒƒ Higher sputter power and more deposition rate enabled
DC combined, DC-pulsed and co-sputtering), excellent
especially for materials of low thermal conductivity – perfect
reproducibility, and reliability and easy conversion to different
target cooling and sequential sputtering on small sectors on
substrate sizes.
the target circumference
Looking at material costs
HARTMUT ROHRMANN
Principal Scientist R&D,
Oerlikon Systems
Fundamentally, these advantages
deliver higher productivity,
improved production quality, less
need for personnel on the line,
The Oerlikon development team tapped Sputtering
which all results in lower overall
Components, Inc. (SCI) for cooperation in the new rotary
production costs. These are
cathode design and process for the LLS EVO II platform. SCI
tangible advantages, but the
uses innovative designs to build reliable, high quality rotatable
most compelling progress, with
cathodes. Their experience helped ensure the success of our
respect to expensive coatings, is
upgrade efforts for the LLS system.
Move the sputter target, not the magnets
Processes using planar targets in linear cathodes, as used in
the reduction of material cost per
processed substrate although in comparison to planar targets
the investment for the rotary target is substantially higher.
dynamic sputter processes with moving substrates, depend
“It’s a matter of what you get out of every target,” says Hubert
for high target utilization and low re-deposition on a moving
Breuss, Product Line Manager Semiconductors at Oerlikon.
magnet configuration. However, these moving magnet designs
“Simply compare the target utilization. For planar targets
create technological and mechanical issues. A more effective
you can expect 25-45% utilization on the LLS. With our new
approach is a system configuration that moves the target over
rotary targets which provide 3x target surface, we can expect
a static array of magnets. This layout is the basis for a “rotary
utilization rates anywhere from 75-90%. That’s remarkable.
cathode” where the target is a barrel (or rotary target) plated
In general, the more expensive the material, the quicker and
with the sputter material, which turns around the now stationary
higher the payback from switching from planar to rotary targets”
RY S
E
TA C G
U
RO D NIN
RE N TS
RU S
O
C
magnet array positioned inside the barrel.
There are numerous process and cost-of-ownership
advantages for an LLS with a rotary cathode when compared to
a planar cathode:
ƒƒ Substantially enhanced target utilization to 75-90%
ƒƒ Increased available target area – rotary targets about 3x
larger than planar targets (circumference is Ø × π)
ƒƒ The points above lead to increased target life – 5-10x more
substrates processed
ƒƒ Reduced maintenance frequency – less pump-down times,
less target burn-in (conditioning) periods needed and
therefore reduced personnel cost
ƒƒ Improved productivity results in reduced costs
MARTIN BLESS
Technical Project Manager LLS,
Oerlikon Systems
The ongoing long-term test on the upgraded LLS EVO II system
indicate that rotary cathodes can deliver sizeable savings in
material costs over time, often in just a few months, depending
on the process.
Rotary cathode upgrades will soon be available for all LLS EVO
and LLS EVO II systems.
2
5D
VISION
CHIP 2013
2.6 SEMICONDUCTOR
37
WORKING TOGETHER, OERLIKON AND FRAUNHOFER IZM-ASSID HAVE DEVELOPED
AN IMPROVED PVD PROCESS FOR BARRIER/ SEED LAYERS IN THROUGH-SILICONVIAS (TSVs) WITH ASPECT RATIOS UP TO 10:1 BASED ON OUR UNIQUE HIGHLY
IONIZED SPUTTERING (HIS) TECHNOLOGY. THIS IS AN ESPECIALLY ATTRACTIVE
SOLUTION FOR 2.5D INTERPOSER APPLICATIONS. THIS TECHNOLOGY APPEARS
TO BE EXTENDABLE TO ASPECT RATIOS OF 15:1 AND ABOVE.
C O L L A B O R AT I N G O N
THROUGH-SILICON-VIAS
FOR 2.5D INTERPOSERS
KAY VIEHWEGER,
PROCESS ENGINEER,
FRAUNHOFER IZM, ASSID R&D
The semiconductor
landscape is
changing. In the
near future, mobile
phones and tablets will overtake personal
computers as the primary applications for
integrated circuits (ICs). There has always
been a demand for increased speed and
reduced cost per transistor with every
new technology generation but for mobile
electronic devices, small form factor and
MIPS/W (millions of instructions per second
per watt) are key performance indicators.
In order to incorporate more features into a
small space, improve device performance
and reduce power consumption, IC
manufacturers have explored the use of
new “More-than-Moore” architectures. The
idea to stack chips vertically and to connect
them with metal vias that extend all the way
through the device wafers (TSVs) has gained
considerable traction in recent years with the
ultimate goal of combining logic and memory
dies in a 3D stack. However, fabricating
Cu-TSVs with diameters of 2-5 µm in close
proximity to transistors with gate widths and
metal half-pitches on the order of 20 nm is
costly and difficult. Stresses in regions of the
silicon immediately surrounding the TSVs
and thermal issues associated with the high
volumetric packing density of active devices
provide additional challenges.
In the interim, the industry is paving the way
for true 3D integrated circuits (3D-ICs) with
the increasing use of so-called “2.5D-IC”
interposers, where TSVs are fabricated in
silicon or glass substrates that also contain
redistribution layers (RDLs) formed by
techniques similar to those used for onchip wiring in the back-end-of-line multilevel
metallization steps (Figure 1). Electrical
connections between chips through the
DR. JUERGEN WEICHART,
SENIOR SCIENTIST R&D,
OERLIKON SYSTEMS
CHIP 2013
2.6 SEMICONDUCTOR
39
facilities. GLOBALFOUNDRIES FAB1 and Fraunhofer
IZM-ASSID (All Silicon Systems Integration Dresden)
are located close to each other in Dresden, Germany,
enabling an efficient and flexible working relationship
(Figure 2). Fraunhofer IZM-ASSID has also established
partnerships with equipment and material suppliers and,
in 2011, bought a CLUSTERLINE® 300 PVD platform
from Oerlikon. As part of the purchase agreement, the
two companies signed a joint development agreement
(JDA) aimed at qualifying Oerlikon’s HIS source for
depositing barrier/seed layers into TSVs for interposers
and related applications.
Figure 2. Fraunhofer IZM-ASSID
RDLs on the interposers are very fast and I R losses are
Interposers can also incorporate integrated passive
minimized: bandwidth per watt is boosted by as much
devices and even active circuits. These second
as 100x compared to conventional interconnecting
generation interposers blur the distinction between
methods. The use of interposers also helps address the
2.5D-IC and true 3D-IC integration. According to Yole
problem caused by the increasing ratio of the number of
Développement, over the next five years the market for
logic gates to available I/O, which is predicted to grow
devices containing interposers is predicted to have a
by a factor of 15 by the year 2020.
compound annual growth rate (CAGR) of 100%.
Incorporating different kinds of devices (e.g. logic,
In 2012, TSMC announced plans to put its CoWoS
memory and analog) on interposers facilitates
(chip on wafer on substrate) interposer technology
heterogeneous integration (in effect, a system on an
into production. Other foundries have been quick to
interposer is now the equivalent of a system-on-a-chip).
offer similar capabilities: GLOBALFOUNDRIES has
Interposers can also be used to connect identical small
embraced a collaborative model, choosing to work with
dies together to form one large one. Since smaller chips
various complementary organizations to develop and
have higher yields and a faster yield ramp in production
manufacture interposers and 3D-ICs. The company’s
than larger ones, this approach can cut development
partners include three major European semiconductor
costs and reduce time-to-market: a critical consideration
research houses (Fraunhofer, CEA-Leti and IMEC) and
for products with life-cycles measured in months.
the leading Outsourced Assembly and Test (OSAT)
2
Encapsulation
2.5D
Interposer
Die 1
Die 2
Die 3
Die 4
TSVs
Solder Bumps
Substrate
Solder Bumps
Figure 1. Schematic of
Chip Package Using 2.5D
Interposer With TSVs
Because of the complexity and costs associated with
2.5D device fabrication, the technology is still considered
too expensive for many high volume consumer
electronic products. Two ways to increase performance
and decrease cost are (i) to reduce the diameter of
the TSVs, and (ii) to reduce the final die thickness.
This reduces the TSV capacitance and the size of the
highly stressed region around the copper via. It is also
less expensive to etch and electrofill smaller features.
However, there are limits to the minimium die thickness
that can be handled. Another factor limiting the minimum
practical die thickness is that extremely thin silicon slices
do not spread heat from hot-spots well. The desire to
scale the TSV diameter faster than the die thickness
causes the aspect ratio of the vias to increase and this
presents a challenge for line-of-sight physical vapor
deposition (PVD) techniques. Potentially depositing TSV
barriers and seed layers using conformal techniques,
such as chemical vapor deposition (CVD), could work
but overall process cost is significantly increased. A
switch to CVD could also lead to integration issues:
ideally, a cost-effective PVD solution for high aspect ratio
TSVs is required.
via sidewall (Figure 3). This proved sufficient to ensure
the successful electrofilling of 10:1 aspect ratio TSVs
across a 300 mm wafer. HIS has also demonstrated
the ability to provide suitable barrier/seed layers for
TSVs that extend through the full thickness of a wafer:
not all applications require thin interposers. Oerlikon
and Fraunhofer were so satisfied with the outcome of
the JDA that a follow-on agreement was signed earlier
this year to further lower the overall cost-of-ownership
to manufacture state-of-the-art TSVs. Goals include
extending our process capabilities to smaller diameter
features with higher aspect ratios (15:1 and beyond)
and investigating more cost-effective materials that
offer equivalent-or-better adhesion, wetting and barrier
properties.
Oerlikon’s HIS source deposits sufficiently thick Ti and
Ta films to meet adhesion, wetting and barrier layer
requirements in 10:1 aspect ratio TSVs. However, Cu
is somewhat more challenging due to the fact that
Cu atoms are more difficult to ionize in a plasma and
the specific sputtering rate of Cu is higher (sputtered
metal atoms have the effect of decreasing the plasma
density). For robust electrofilling across the whole wafer,
a minimum thickness of ~20 nm of Cu on the TSV
sidewalls is necessary. The
initial equipment and process
recipes provided to Fraunhofer
showed insufficient sidewall
coverage at ~75% of the
TSV depth. Working together,
we were able to modify
the hardware and process
conditions to deposit ≥ 20 nm
Bottom: 76nm
of Cu at all positions on the
Figure 3.
SEM cross section
of a 10:1 via
100x10 µm with
Cu deposition.
Top
58nm (2,6%)
25µ depth
23nm (1,0%)
50µ depth
27nm (1,2%)
75µ depth
39nm (1,7%)
100µ depth
(3,5%)
Sidewall thickness profile of Cu- seed
1.0
2.0
3.0
4.0
5.0
6.0
CHIP 2013
3.1 TECHNOLOGY AND R&D
43
OERLIKON PZT THIN FILMS –
QUALITY MEETS PRODUCTIVITY
Figure 1: piezoVolume
piezoMEMS devices fabricated
by SINTEF. Courtesy of
Hannah Tofteberg (SINTEF)
ONE YEAR ON AND OERLIKON SYSTEMS PREPARES TO REFINE
ITS PZT THIN FILMS PROCESS FOR MEMS MANUFACTURING.
Lead zirconate titanate (PZT) is a piezoelectric ceramic material commonly used in micro-electro
mechanical systems (MEMS) devices to achieve highest coupling between electrical and mechanical
energy. In recent decades, devices based MEMS processes, which developed out of the integrated
circuit (IC) industry, have found their way into several applications, including accelerometer and
pressure sensors for the automotive industry and heads for inkjet printers. More recently, MEMS
devices have begun to unlock potentially high-volume applications such as autofocus lenses for
cameras embedded in smart phones and RF MEMS switches for the electronics industry.
Customer interest and growth of the MEMS market, coupled with a growing demand for
MEMS fabrication processes by physical vapour deposition (PVD), which is Oerlikon’s
core competence, initiated efforts to develop hardware and processes for 6 and
8 inch PZT films based on the CLUSTERLINE® 200 platform. Widely used in the
semiconductor industry the platform combines high quality deposition technology
and high reliability. In conjunction with a robust deposition process it provides a fully
automated solution to produce PZT thin films at high volume and quality.
A key advantage of the Oerlikon PVD solution for PZT films for MEMS device
production is the continuous in-situ growth of the perovskite crystal structure.
This means that the production is not interrupted by repetitive annealing steps as
required by other technologies, such as sol-gel (CSD) for example. New hardware,
the so-called Very Hot Chuck, had been designed and optimized to allow the
high temperature deposition process at 600°C, or higher, and with an excellent
uniformity. It is also applicable for various ferroelectric ceramic materials like BST.
A further substantial advantage of the CLUSTERLINE® 200 tool platform is the
fabrication of a complete MEMS stack – bottom electrode, PZT, top electrode – in
one run, whereas competing fabrication technologies need separate equipment for
the electrode deposition.
A fundamental step towards Oerlikon’s development
of a high volume 8” PZT process on the
CLUSTERLINE® 200 was the participation in the
‘piezoVolume’ project (2010-12), funded by the
European Commission’s Seventh Framework
program (covered in depth in Chip 2012,
pp 38). Collaborating with the EPFL Ceramics
Laboratory, a world-leading research
institute in the field of piezoelectric film R&D
and Fraunhofer ISIT, in Itzehoe, Germany,
which has one of Europe’s best equipped
applied R&D facilities for microelectronics and
microsystems, established a strong alliance to
develop a high quality in-situ PZT process
by PVD. Whereas in the beginning the
focus was on the piezoelectric
performance of the films
the productivity attracted more attention
towards the end of the project. Therefore
great value has been set last year on the
uniformity of the film properties across
the 200mm wafer.
A piezoelectric coefficient e31,f in the
range of 16 – 18 C/m2 with remarkable
maximum values in excess of 20C/m2
and d33,f values up to 150pm/V are
examples for the high piezoelectric
performance of Oerlikon PZT films.*
The film thickness uniformity below
±4%, the homogeneity of the strong film
texture, either (100) or (111), and the
constancy of dielectric and piezoelectric
Martin Kratzer,
Senior Scientist R&D,
Oerlikon Systems
parameters within ± 5% across the wafer
are excellent values. In combination with
a deposition rate greater than 3.6 µm/
hour, these results are the cornerstone of
the high productivity that Oerlikon’s PVD
solution is capable of.
Future development efforts
Although the piezoelectric performance
of the PVD films is already excellent
there is still room for improvement of
particular properties. One goal for the
current development is the doubling of
the breakdown strength to values of 1
MV/cm, a very high level already attained
at particular films in the piezoVolume
project. This further requires a strong
scientific support and therefore Oerlikon
continues its close collaboration with
EPFL Lausanne within a national Swiss
CTI project. Due to this collaboration
Oerlikon can leverage EPFL’s expertise in
analysis of material properties to further
improve the device reliability.
As well as research institutes, the
installed base of CLUSTERLINE® 200
for piezoelectric thin films for MEMS
applications includes government labs
and some commercial customers.
However, the focus, going forward,
mainly concerns high-volume
manufacturers and this requires a robust,
uniform production process to ensure
lowest cost of ownership (CoO) in future.
We are tackling these challenges by
focusing on manufacturing costs, by
making the film deposition faster and
increasing the tool’s ‘up-time’ and by
focusing on improving film quality by
increasing the break down strength of
the PZT at appropriate piezoelectric
performance. This ultimately benefits the
end user with a more robust product
with a longer lifetime.
www.piezovolume.com
* The research leading to these results has received funding from the European Community’s
Seventh Framework Programme (FP7/2010-2013) under grant agreement no. 229196
CHIP 2013
3.2 TECHNOLOGY AND R&D
LIGHTBULB
MOMENT
45
Quality white LED lamps have a
useful life of potentially 50,000
hours. 24/7 that equates to an
amazing 5 years and 8 months.
Lower cost production solution for LED
lighting, in the form of the NanoSmooth™ AIN
deposition process, comes to fruition
DR. ROB MAMAZZA, CHIEF TECHNOLOGY OFFICER & DR. BERND HEINZ, PROCESS R&D MANAGER
Solid state lighting is widely used today in a variety of
markets, from automotive to home appliances. Solid state
lighting has also been gaining traction in the general lighting
industry, replacing incandescent bulbs, because of the
numerous advantages of the technology. LED lamps, for
instance, can provide more aesthetic lighting in different
formats and colours, are more robust with longer lifetimes,
and can reduce energy use for lighting by 25% or more. In
a recent market report, Navigant Research forecasts that
revenue from LED lamp sales will rise to $8.7 billion by
2021, growing at a compound annual growth rate (CAGR) of
23.2%.
But in order to compete with conventional illumination
technologies in the general lighting market, LED
manufacturers face enormous pressure to reduce production
costs. To support LED manufacturers and to extend its
presence in the solid state lighting industry Oerlikon Systems
has developed a new approach to producing LED layer
stacks. Today’s manufacturing processes deploy GaN
nucleation on sapphire substrates, a difficult and expensive
process. Oerlikon has optimized aluminum nitride (AIN) in
a PVD deposition process to enhance nucleation of GaN.
The NanoSmooth™ AlN film, when deposited on a sapphire
wafer – the standard substrate for LED manufacturing
– enhances both production and the quality of the LED
device that is subsequently grown. These factors contribute
to lower manufacturing costs. The integration of Oerlikon
Systems’ thin sputtered films, less than 100 nm, with the
GaN replaces an expensive MOCVD intermediate layer in
LED chip production.
To develop the NanoSmooth™ AIN application meant that
we had to achieve the required epitaxial (perfect) crystalline
growth of the AIN layer on the sapphire substrate and
heating of the sapphire substrate to required temperature
(precise, fast, homogeneous, without stress).
NanoSmooth™ is also an effective solution for another
important trend in LED manufacturing, which is the gradual
thinning of the GaN layer, to drive down costs. GaN is
expensive and every effort to reduce the amount at micronlevels is rewarded by a lower bill of materials.
Infrared (IR) irradiation is used to heat the substrate. This
approach, which has been used in previous products within
Oerlikon Systems, provides minimum heat load to other
parts in the chamber and the heater is able to maintain a
high intrinsic stability. In addition we are developing an extra
temperature characterization to be able to detect any longterm drift for high process stability and security.
LED LIGHTING HAS THE POTENTIAL TO REDUCE
TOTAL ELECTRICITY FOR LIGHTING CONSUMPTION
BY 50% BY 2025, SAVING $100 BILLION DOLLARS IN
ANNUAL WORLDWIDE ENERGY COSTS*.
Compact
fluorescent
bulbs burn out
within 10,000 hours.
24/7 that equals 13
months on average.
In developing this application Oerlikon Systems can meet
demand from manufacturers that are working across all
substrate sizes. Today we are talking about 2-inch up to
6-inch sapphire substrate sizes and both MOCVD and
HVPE GaN growth methods. In time, we will also be able to
process substrate sizes from 4 to 8-inch, as the LED chip
industry transitions from sapphire to more inexpensive silicon
substrates.
Incandescent bulbs burn
out after 2500 hours.
24/7 that equates to
just 3 months.
In the case of silicon, growing GaN directly upon the
substrate is not an option due to the formation of SiN and
poor transfer, or templating, of the requisite crystal structure
within the GaN. Therefore AIN is absolutely required.
To further broaden our solution’s range of applications, we
have worked with Soitec, the leading French manufacturer
of engineered substrates, to adapt our NanoSmooth™
technology to the HVPE method of growing GaN. HVPE
has the advantage over conventional MOCVD of higher
deposition rates, which can be used advantageously to
grow the buffer region of an LED. Soitec has developed an
attractive HVPE technology that will soon be commercialized
by GTAT. Oerlikon’s NanoSmooth™ will be a key enabler to
the adoption of this solution.
But, it is not simply enough to have a process or a tool
that claims to reduce production costs without a proven
track record in excellence. The PVD sputter process, which
NanoSmooth™ AIN exploits, is already a proven production
process in other semiconductor applications supplied by
Oerlikon Systems. This is critical as manufacturers, when
adopting new solutions to reduce production costs, need to
be able to trust that their equipment partner can provide a
reliable and robust alternative to a mature technology. This is
why continual innovation is at the core of Oerlikon Systems.
According to a goal set by the US Department of Energy (DoE),
CHIP 2013
3.3 TECHNOLOGY AND R&D
47
Emerging new planar designs are
enabling the development of higher
efficiency thermoelectric converters
(TECs) for waste energy harvesting.
Oerlikon Systems continues to develop
scalable and mass-producible
multi-layer technologies – based
on sputtered films in a planar
design – to enable a new
generation of TECs.
H T
SPOT
THE MARKET IS HEATING UP FOR
THERMOELECTRIC CONVERTERS
DR. ROBERT MAMAZZA,
CHIEF TECHNOLOGY OFFICER,
OERLIKON SYSTEMS
W
ANTONIO CALVOSA,
HEAD OF BUSINESS DEVELOPMENT,
OERLIKON SYSTEMS
hy target thermal energy? When we look at the US
market as an example, the latest statistics show
that waste energy is the largest single source of
energy. According to the U.S. Energy Information
5% Nuclear
Administration (EIA), the approximate annual consumption of electric
energy in the US is in excess of 4,100,000,000,000 (or 4.1
5% Other
trillion) kWh. Nearly 42% (1,700,000,000,000 kWh)
comes from coal. Using a conversion efficiency
of about 39%, the remaining 61% can be
distributed between thermal, mechanical and
electrical losses. Of these, the thermal
14% Coal
losses are the greatest, approximately
53%, or 2.3 trillion kWh is lost, which
has a commercial value of US$222
billion (based on average electricity
costs in the US for 2013). And
this is just coal used for electricity
37%
Waste
Figure 1
USA energy
by source.
generation. If we look to all forms
of energy consumed (electricity,
transportation, heating, etc.), we can
15% Natural Gas
extend these already large numbers
much further. When all inefficiencies are
summed up, waste energy (37%) is the
single largest source of energy (see Figure
24% Petroleum
1). Quantifying this energy over the course of a
year, one gets 16.7 trillion kWh at a value of US$ 1.5
trillion. And this is just a single market. Factor in the rest of
the world and the results are staggering.
Figure 1 – USA energy consumption by source.
CHIP 2013
3.3 TECHNOLOGY AND R&D
Looking at miles per gallon
Why thin film?
Looking at a specific sector – the transportation industry
The thermoelectric converter (TEC) module designs for
continues to focus on how to better manage and improve
energy generation are based on concepts created for
fuel economy. This is due to fuel price volatility, increased
thermoelectric cooling and have numerous drawbacks:
demand from emerging markets, climate change
implications and environmental sustainability. When looking
ƒƒ Rigid form factor – the heat must be concentrated on one
side and distributed on the other side
at oil consumption by end-use, most of the additional
ƒƒ Expensive to produce – high degree of manual assembly
demand is from transportation; where alternatives to
ƒƒ Not easily miniaturized – mechanical and heat boundary
limitations
petroleum are still limited and fuel efficiency remains low (a
gasoline internal combustion engine has thermal efficiency
between 25% and 30%).
As regulatory pressure increases and consumer demand
Basically, current TEC technologies perform poorly as
generators (with comparatively low device efficiency) and
have only low production scalability, making them practical
for more efficient transportation matures, multiple new
only in niche applications.
technologies are under development to improve fuel
In addition to scaling issues, the temperature levels of waste
efficiency. Adoption of new technologies will be based on
heat factors into the challenges faced by TEC designs. For
the required performance, cost, robustness, scalability and
standard TECs, the higher the temperature level, the more
integration targets. Two major trends include:
economically waste heat can be converted into electricity.
ƒƒ Technologies that decrease energy consumption
ƒƒ Technologies that allow waste energy recovery from heat
losses
49
Working with O-Flexx Technologies
Using the manufacturing technology from Oerlikon, O-Flexx Technologies can
now produce long, thin and flexible thermoelectric devices (“Power Straps”)
But waste heat, for example, is available at different
that are stacked to cover large areas and produce considerable electrical
temperature levels – anywhere from ambient temperatures
power – around 1 kW per m2 (depending on the heat source).
to >1,000°C. TEC technology is now being optimized for
low grade heat scenarios, i.e. exploiting temperatures below
Oerlikon technology and equipment improve the shortcomings of currently
Research and development of thermoelectric generators
200°C, where the heat flux density is distributed over a
available TECs and pave the way for more efficient and cost-effective thin-
provides opportunities both for heat recovery and fuel
large area. No practical technology with sufficient cost and
film TECs. Working together with EU consortia and O-Flexx Technologies,
efficiency improvement in vehicle comfort elements.
conversion efficiency exists today.
we employ our core competence in thin films and precision manufacturing
Production costs and efficiency are issues
From a manufacturing perspective, production issues
to deliver the fundamental ingredients of next generation generators. The
Today, adoption of thermoelectric generators remains limited
to specific markets due to their high production costs and
low efficiency. Efficiency above 10% and systems’ cost
below 3 Euro/watt are needed for mass adoption, especially
for automotive applications. IDTechEx, a market analyst
firm specializing in emerging technologies has identified
military and aerospace as short term markets, with potential
growth coming from wireless networks applications where
thermoelectric power is preferred over optimized battery
reliability and lifetime.
current devices described here are only the first step; more is yet to come.
included the planar layout, choice of substrates, definition
of electrical and thermal contacts, and packaging. While
Oerlikon has already developed deposition processes to
cost-effectively sputter thick films (with Bi, Te, Se materials),
the limits of only low sputter power, homogenous alloy
concentration on the wafers, and growth of suitable
microstructure in the films, had to be overcome.
New generation TECs have the potential to fill this gap.
Oerlikon is working together with development partner
Picture courtesy of
O-Flexx Technologies
O-Flexx Technologies; the research is also supported by the
NanoHiTEC EU research project (see “Thermoelectrics
Go Nano” in Chip 2012).
A micro-level solution
In order to be practical, TECs used for converting waste heat into electricity must:
ƒƒ Use distributed and low-grade heat
ƒƒ Be mass-produced
ƒƒ Have low production costs per unit
The most promising technology for cost-efficient TECs is based on:
HARTMUT
ROHRMANN,
PRINCIPAL
SCIENTIST R&D,
OERLIKON
SYSTEMS
ƒƒ Planar technology using existing production facilities; including wafer dicing, pick and
place, soldering (SMD technology)
ƒƒ Sputtering of relatively thick layers of thermoelectric materials (Bi, Te, Se alloys and
multi-layer systems of Si/SiGe or B4C/B9C ) on high-throughput deposition systems
ƒƒ Cheap substrates, similar to printed IC boards
This planar technology can help to:
ƒƒ Reduce the internal losses compared to state-of-the-art devices
ƒƒ Provide increased energy output at low temperature differences
Above: The SOLARIS platform
ƒƒ Provide improved conversion efficiency
CHIP 2013
3.4 TECHNOLOGY AND R&D
51
BRIDGING
LAB TO FAB
A unique advantage of the SOLARIS tool is that it is a single
wafer deposition tool, applicable for both lab environments as
well as industrial production due to the high throughput that
can be achieved, of up to 1200 wafers an hour. This allows
for the immediate transfer of lab results to the production line.
In competing batch production processes the uniformity
of ITO layers can vary slightly from cell to cell. However,
THE SOLARIS TOOL FOR HIGH-EFFICIENCY SILICON SOLAR
CELL APPLICATIONS IS A FLEXIBLE SYSTEM, APPLICABLE
FOR LAB R&D AS WELL AS PRODUCTION
the SOLARIS process, which coats each cell one after
Dr. Heiko Plagwitz, Senior Scientist R&D, Oerlikon Systems
amorphous and crystalline silicon.
the other in the same vacuum chamber, achieves a high
uniformity of optical and electrical properties. Crucial for
silicon heterojunction solar cells, SOLARIS minimizes any
sputter-induced damage to the delicate junction between the
Used in labs the SOLARIS platform saves companies time
Forecasts suggest that after 2015 investment in production
in development, and reduces wafer wastage because of the
tools by the solar photovoltaic (PV) industry will commence
high levels of reproducibility achieved.
in earnest as the current shakeout this sector is experiencing
concludes. There will be increasing pressure on the
The SOLARIS tool for ITO deposition for high-efficiency silicon
manufacturers left to distinguish themselves; by not only
heterojunction solar cells can help achieve a very favourable
minimizing production costs, but also supplying demand for
cost of ownership (CoO) of 9.1€€ct/wafer for 80 nm ITO,
high performance modules based on high-efficiency silicon
which translates to 1.8 €ct per Watt (peak) even at a
solar cells.
moderate efficiency of 21%.
The SOLARIS tool, originally designed as a high-throughput
tool for coating of silicon PV cells with silicon-nitride
antireflective coatings (ARC), has been developed further
so that it can be used for the deposition of more advanced
functional indium tin oxide (ITO) layers for making transparent
contacts on PV cells. Specifically the application Oerlikon
Systems is targeting is the deposition of ITO layers on
heterojunction silicon solar cells, which are able to achieve
energy conversion efficiencies above 24%, as shown in recent
publications by PV manufacturers.
2
Mobility (cm
Mobility
/Vs) (cm2/Vs)
60
50
40
40
30
30
20
20
10
10
0
1.E+21
0
0.0%
2.5%
0.0%
2.5%
5.0%
Figure 2: Effective charge carrier recombination velocity at the
interface between crystalline and amorphous silicon, after deposition
of the ITO film. The recombination velocity is a measure for the
number of efficiency-limiting crystal defects at this interface. Soft x-ray
radiation from the sputter plasma usually creates such defects, thus
increasing the recombination velocity. However, carefully optimizing
the substrate temperature during ITO deposition enables an in-situ
annealing of radiation-induced defects. The optimum performance is
found at 200°C substrate temperature.
Effective surface
Effective surface
-3
recombination
velocity (cm/s)
velocity (cm/s)
Carrier density
Carrier
(cm
density
)
(cm-3) recombination
60
50
Figure 1: Charge carrier mobility and charge carrier density of typical
ITO layers deposited on the SOLARIS tool, as a function of the oxygen
content in the process gas. The substrate temperature was 200°C.
The optimum conductivity results at 5×1020 charge carriers per cm3.
5.0%
7.5%
100
9.E+20
9.E+20
80
80
7.E+20
7.E+20 60
60
5.E+20
5.E+20 40
40
3.E+20
3.E+20 20
20
1.E+20
1.E+20
7.5%
10.0%
O2/Ar flowOratio
/Ar (%)
flow ratio (%)
2
1.E+21100
10.0%
25
S eff
100
25
S
ITO, 80 nm
eff
(i) a-Si:H
c-Si, 3 Ωcm
ITO, 80 nm
(i) a-Si:H
c-Si, 3 Ωcm
(i) a-Si:H
(i) a-Si:H
200
100
300
200
300
Substrate Substrate
temperature
temperature
(°C)
(°C)
CHIP 2013
3.5 TECHNOLOGY AND R&D
53
HOW OERLIKON IS ENABLING
THE COMING 3D-IC REVOLUTION
Ideal for packaging of 3D-ICs by all the major foundries and OSATs, Oerlikon’s
HIS technology uses a conventional PVD module with relative close target-tosubstrate spacings and an inexpensive standard planar target. Together,
these ensure better target utilization, longer target lifetime and lower
energy consumption while providing dense and directional high quality
films. By Glyn Reynolds, Principal Scientist, R&D, Oerlikon Systems
“3D” seems to be everywhere these days: we see and hear
references in the media to 3D movies, 3D TVs, 3D printers, etc.,
and the semiconductor industry is no exception. One cannot
attend a technical conference or trade show or open a trade
magazine without encountering an article on “3D-ICs.” So what
exactly are “3D-ICs”? Why is so much attention being given to
them? And how is Oerlikon participating in this upcoming “3DIC revolution?”
THE COST OF
DOWN
DRIVING
DIRECTIONAL PVD
“3D-ICs” or 3D integrated circuits are very simple, conceptually,
but are not easy to manufacture at an affordable cost. A 3DIC merely consists of chips stacked vertically on top of one
another. Interconnects between the chips can be fabricated by
inserting “dummy” silicon interposers between the chips and
using traditional wirebonding techniques but there are significant
advantages to be realized by connecting ICs directly to those
above and below them in the 3D stack using through-silicon
vias (TSVs) (see Figure 1).
Encapsulation
Stacked Die
TSVs
TSVs
Solder Bumps
Substrate
Solder Bumps
Figure 1. Schematic of 3D Integrated Circuit
using Through Silicon Vias (TSVs)
3D-ICs reduce latency, increase bandwidth, decrease power
consumption and allow heterogeneous integration, all within
a small form factor, so it’s understandable why the electronics
industry is eager to incorporate these architectures into many
new product lines.
Looking for a cost-effective 3D-IC solution
However, as is often the case with revolutionary new chip
designs, the biggest obstacle to their widespread adoption
is finding cost-effective ways to address the many technical
challenges that they present. There are demonstrated solutions
to 3D chip design issues, sorting and testing “known good die,”
thin wafer temporary bonding and debonding, processing the
TSVs, etc. Even the high temperatures experienced by devices
buried deep within the stack, caused by the increased power
densities found in most 3D-ICs, can be mitigated by judiciously
adding actively cooled interposers.
But unless the whole manufacturing process can be done
affordably, 3D-ICs will not find their way into most of the high
volume consumer electronics products sold today.
An Oerlikon tradition
As the established industry leader in physical vapor deposition
(PVD) for advanced packaging applications, Oerlikon is very well
acquainted with the need to provide best-in-class performance
at the lowest possible cost-of-ownership (CoO) and this
principle has guided our development efforts. Our platforms
play a key role in 3D-IC manufacturing, enabling critical steps
such as under-bump metallization (UBM), re-distribution layers
(RDL) and barrier/seed layers for copper pillars, all performed
at a lower overall CoO compared to competitive 300mmcompatible high volume manufacturing (HVM) equipment.
Extending this philosophy to the lining of TSVs with metal
barriers and copper seed layers required an innovative
approach. Oerlikon first started working on the process
technology required for 3D-ICs in 2005. At the time, we
were using our well-received and industry-proven Advanced
Directional Sputtering (ADS) source to deposit a Ta(N)/Ta
barrier and Cu seed onto the bottom and sidewalls of deep
vias etched into silicon wafers. ADS combined a long throw
chamber (target-to-wafer spacing ~300 mm) with our patented
asymmetric unbalanced magnetron source. We were able to
CHIP 2013
3.5 TECHNOLOGY AND R&D
55
provide sufficient coverage into features with aspect ratios as
high as 5:1 to allow subsequent electrofilling.
Nevertheless, it was very apparent that while long throw
hardware designs might be adequate to line vias encountered in
multilevel metallization schemes for complementary metal-oxide
semiconductor (CMOS) back-end-of-line (BEOL) processing,
they were not ideal for depositing the much thicker layers that
would be required for lining TSVs, especially if this needed to
be performed in the very cost-conscious Outsourced Assembly
and Test (OSAT) foundries.
Conceptually, Oerlikon Systems’ HIS is a very simple source
(Figure 3). It mates a standard planar magnetron target with
a very high peak power pulsed DC supply to generate a
region of extremely high plasma density close to the target’s
surface. As atoms sputtered from the target traverse the high
density plasma, they are ionized by direct electron impact.
This mechanism results in the production of high metal ion
fractions (up to 90%) in a compact volume, allowing target-towafer spacings more typical of conventional (non-directional)
magnetron sputtering.
Watching out for costs
Ion-enhanced long throw sources such as Oerlikon’s ADS
(Figure 2) can line deep vias by combining two effects. First is
the creation of metal ions in a high density plasma; these ions
are then accelerated across the plasma sheath perpendicular
to the wafer surface. The second involves the intentional loss to
the shields of sputtered metal atoms traveling obliquely to the
major axis of the chamber. If too many of these oblique atoms
are allowed to deposit on the wafer, they create overhang at
the top corners of the vias, shadowing the sidewalls below and
causing voids during electrofilling.
A HIS source can be mounted onto a standard PVD chamber
and is currently installed on a number of our flagship
CLUSTERLINE® 200 II and 300 II platforms in the field. With
its best-in-class CoO for directional sputtering, manufacturers
looking to line TSVs for packaging or MEMS applications will
be especially interested in a configuration that includes one or
more HIS sources (Figure 4).
Confirmation from Fraunhofer
Asymmetric Unbalanced Magnetron
DC Power Supply
HIS has proven able to deposit continuous copper seed
layers and metal barriers of Ti/TiN and Ta(N)/Ta in deep vias
with aspect ratios up to 10:1. Our development partners
at Fraunhofer IZM All Silicon System Integration Dresden
(ASSID) have successfully electrofilled 10:1 features using HIS
and have confirmed its superiority over ion-enhanced long
throw sputtering both in terms of better coverage and lower
CoO. Another advantage of HIS is the capacity to coat larger
diameter features that extend all the way through a silicon
wafer (Figure 5); this is difficult to do with long throw sputtering
sources.
Sputtered Atoms
Tubus,
Tubus Shields
and Coils
Directional ions and
neutrals at wafer
Figure 4: Oerlikon Systems’ CLUSTERLINE® 300 II
can be configured with one or more HIS sources.
Wafer pedestal
RF Power Supply
Whether you need to line high aspect ratio TSVs with barrier
metals and copper, or you require more cost-effective
directional PVD apparatus for MEMS, power devices or
similar applications, Oerlikon’s HIS source offers an extremely
competitive solution. For cost-challenged 3D-IC manufacturers,
it could be the only effective solution.
Figure 2. Schematic of Oerlikon’s ADS Source
(Ion-enhanced Long Throw)
However, the deliberate loss of a high fraction of the metal
atoms sputtered from the target has some significant
disadvantages: low specific deposition rate (leading to low
overall throughput), poor target utilization and the need for
frequent target changes. Low specific rates can be mitigated
to a certain extent by increasing power to the target but at the
cost of additional (and expensive) power supplies and increased
power and coolant consumption. All of these drawbacks have
one thing in common: they add cost. A much better approach
is to locate the target closer to the wafer and to achieve the
necessary directionality for lining deep vias by generating higher
ion fractions; this is precisely what Oerlikon’s Highly Ionized
Sputtering (HIS) source was designed to do.
V
I
Magnetron cathode
Sputtered atoms/ions
Directional ions
at wafer
Wafer Pedestal
Figure 3. Schematic of Oerlikon’s HIS Source
Figure 5. Example of 4:1 AR full wafer TSV with connection on backside.
The barrier/seed layers were deposited by HIS and subsequently
electroplated. (Picture courtesy of Fraunhofer IZM-ASSID)
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CHIP 2013
4.1 ADVANCED NANOTECHNOLOGY
59
More pain, more gain
Taking the technological leap to single substrate processing
meant a larger development effort, but also promised an
anti-smudge coating with superior properties and durability
compared to the standard processes used on batch
evaporation systems. The hardware enhancements for the
SOLARIS included a completely new source that would enable
an extremely quick evaporation process (in seconds instead of
the usual minutes on a batch tool).
etter
than
atch
Some of the most notable performance improvements include:
ƒƒ Higher throughput: with single substrate handling rather than
more cumbersome batch evaporation systems
ƒƒ Fully compatible with automated production lines: lower
costs/unit
ƒƒ Easy integration of the process into current automated fab
production processes
ƒƒ Continuous processing: avoids process interruption of batch
processes
ƒƒ Superior process stability from substrate to substrate: with
single substrate handling
ƒƒ Flexibility: integrating AR layer processes on the same tool
configuration is possible
Any SOLARIS system currently out in the field can be easily
upgraded to run the new anti-smudge process, as with all
process technologies available on the SOLARIS.
OERLIKON LAUNCHES HIGH-THROUGHPUT “ANTISMUDGE” COATING PROCESS FOR TOUCH PANELS
Creating an anti-smudge coating for touch panels is a
logical improvement for mobile devices but difficult to
implement. The technical challenge was to transform a
slow evaporation process into something that takes only
seconds. But the Oerlikon development team and our
SOLARIS system were up to the challenge.
Today touch panels are everywhere. Once limited to
primordial ATM screens, they now dominate in devices
such as game consoles, all-in-one computers, tablet
computers, and smartphones. And the number and
type of devices seem to be expanding daily – from lowly
household appliances to high-tech consumer electronics.
Finally, the latest news of the rapid decline in PC sales
only confirms the trend that consumers are shifting their
dollars to smartphones and tablets rather than PCs.
This trend is set to grow even more in the near future.
With this booming market and the universal enthusiasm
for smartphones and all mobile devices, the product
development team at Oerlikon realized that the time
had come for a high-performance coating with superior
cleaning properties durability and seamless “touch”
capabilities.
Taking the leap to a new technology
However, similar to the popular anti-reflective
coatings for eyeglasses, an anti-smudge coating
meant developing a completely new technology
– an evaporation process adapted to a single
substrate system. Until now, evaporation
processes were slow and unwieldy and usually
run on batch systems, with manual loading and
unloading of substrate cassettes. This was an
unacceptable concept for the extremely dynamic
mobile device markets (and beyond).
That made development and optimization of a
process with high throughput and the capability
of running on an automated production platform
– such as Oerlikon’s SOLARIS single substrate
systems – a priority.
LOOKING GOOD:
Similar to the hydrophobic effect
of Oerlikon’s new “anti-smudge”
coating for smartphones and
tablets, the lotus effect refers to
a high level of water repellence
shown by the leaves of the lotus
flower. The flower’s surface
uses water droplets to pick up
and carry off dirt particles. This
is possible due to the plant’s
complex surface structure that
minimizes adhesion. Oerlikon
now brings this capability to your
electronic devices.
SEM image of the surface of a lotus leaf
“Our new anti-smudge coating is the ideal solution
for high end products and new applications,”
explains Stephan Voser, Strategic Project Manager.
“This process will allow the manufacturer to
eliminate batch evaporation tools – the average
throughput of our SOLARIS platform can handily
beat four batch tools, on less floor space.”
Stephan Voser,
Strategic Project Manager, Oerlikon Systems
CHIP 2013
4.2 ADVANCED NANOTECHNOLOGY
61
DR. VOLKER WÜSTENHAGEN,
HEAD OF ADVANCED NANOTECHNOLOGY,
OERLIKON SYSTEMS
SHINES IN SEMI PRODUCTION
NEW APPLICATION FOR OERLIKON’S COMPACT, HIGH-THROUGHPUT SPUTTER SYSTEM
“The SOLARIS is a reliable tool that has
helped the client increase throughput
and lower costs. That’s innovation!”
Emerging semi star
These devices can now be produced more efficiently
and often, more economically. The materials that can be
processed include:
Configured with the MSQ cathode, the SOLARIS can be
ƒƒ Metals (Al, Al alloys, NiV, Ti, Ag, AuGe, etc.)
used as either an R&D tool or for production of complex
ƒƒ SiN, SiN:H, SiO2, Al2O3
multi-layer systems. The MSQ cathode holds up to
ƒƒ SiC, TCO layers (ITO), etc.
four different cathodes arranged for co-sputtering. This
ƒƒ Various alloys
ORIGINALLY CONCEIVED AS A HIGH-THROUGHPUT, SMALL FOOTPRINT PRODUCTION SYSTEM FOR NANOTECHNOLOGY
process module can process up to four target materials
APPLICATIONS FOR CLEAN ENERGY PRODUCTION, SOLARIS RECENTLY FOUND A NEW APPLICATION: PRODUCTION
and substrate sizes with minimal modification costs.
OF HIGH POWER SEMICONDUCTORS. THE SYSTEM’S IMPRESSIVE THROUGHPUT, EASY OPERATION AND HIGH
Helping lower costs
semiconductor manufacturing, SOLARIS is open to a wide
SPUTTER RATE ARE HELPING A KEY CLIENT TO SUBSTANTIALLY REDUCE COST OF OWNERSHIP.
Currently running 24/7 on the client’s production line, a
range of new applications:
single SOLARIS tool can replace up to four evaporation
Power semiconductors monitor electrical voltage to produce maximum effect with
the least use of energy. This helps improve power conversion efficiency, generate
clean energy and improve automation for transportation, medical and telecom
MARKUS FREI,
PRODUCT MANAGER
ADVANCED
NANOTECHNOLOGY,
OERLIKON SYSTEMS
applications. Our key client, with design and production centers in Europe and
Asia, was impressed with the unprecedented process flexibility of the SOLARIS
platform, which has optimized production and saves on costs per wafer.
The main system configuration features are:
systems for Al deposition. Obviously, the savings in clean
room footprint space, maintenance time and operator
Combined with the system’s renowned high throughput,
small footprint and, now, flexibility to process wafers for
ƒƒ Power devices
ƒƒ NEMs & MEMs
shifts are substantial. Outfitted with an automated
ƒƒ Microchips
cassette-to-cassette handling system, the SOLARIS
ƒƒ LEDs
also bumps wafer yield up to a higher level. In addition,
ƒƒ OLEDs
different wafer sizes (including TAIKO and thin wafers) can
ƒƒ Micro-sensors
also be processed.
ƒƒ Micro fluidic devices (MFD), etc.
The SOLARIS is doing double-sided deposition of
“The devices being produced on the SOLARIS are used
ƒƒ Six process chambers with the ARQ 151 cathode
for PVD (DC, DC pulsed, RF) sputtering
aluminum on silicon wafers with an automated cassette-
for high power semiconductors and refined power MCUs
to-cassette handling system, independently processing
to inverter components for wind/solar energy,” adds
ƒƒ Multi-source (MSQ) cathode
four cassettes of 25 (5” and 6”) wafers each. Throughput
Gotthard Kudlek, Sales Manager at Oerlikon Systems.
ƒƒ Heating station
ranges from ≥70 wafers/h for double-sided deposition and
“The SOLARIS is a reliable tool that has helped the client
ƒƒ Cooling station
≥140 wafers/h for single-sided deposition.
increase throughput and lower costs. That’s innovation!”
CHIP 2013
4.3 ADVANCED NANOTECHNOLOGY
63
G R E AT
S TA R T
CLUSTERLINE® GOES TO SWISS
TECHNOLOGY CENTER IN NEUCHÂTEL
By Dr. Nicolay Sylvain, Head of PV Coating Center / CSEM
Chosen as the ideal R&D platform by the EPFL’s Institute
Got to be more flexible
for Microengineering (IMT) and the Swiss Center for
A key focus for the CLUSTERLINE® is currently on
Electronics and Microtechnology (CSEM) in Neuchâtel,
the CLUSTERLINE® system will be a key research tool for
the “Swiss MicroCity,” the new EPFL microtechnologies
site in Neuchâtel. The R&D goals for the EPFL and CSEM
researchers include development of contact electrodes for
high-efficiency PV solar cells, optimizing new materials for
LED and OLED applications, and developing new classes of
MEMS devices.
The CSEM is an R&D company specialized in micro- and
nanotechnology, system engineering microelectronics
and communications technologies. The IMT is part of
the renowned EPFL and develops devices and microcomponents for integration into functional microsystems.
Both institutions work together on a range of advanced
technologies and production processes and collaborate
closely with private industry, including Oerlikon.
A growing microtechnology site
This year, all EPFL laboratories in Neuchâtel will move to
the new Swiss Microcity building adjacent to the CSEM.
Combining the strengths of the EPFL’s IMT and the CSEM
will make it one of the largest centers for microtechnology
in Europe. Part of the City’s R&D work focuses on energyefficient and resource-efficient production, or “green
photovoltaics, more specifically, optimizing deposition
processes for transparent and conductive layers used in thin
film and high efficiency crystalline PV solar cells. The main
processes used today include:
ƒƒ ZnO by chemical vapor deposition or sputtering
ƒƒ ITO, ZnO and several other materials such as metals and
dielectric deposited by sputtering
However, because of various cost issues, work has recently
begun on looking for alternatives to ITO layers and the
development of new transparent conductive oxide (TCO)
materials (notably with reduced indium content). Last
year, when the EPFL took delivery of the CLUSTERLINE®
platform, the centre worked with the CSEM team to look
for ITO-free materials and more flexible films for flexible
electronics.
“THE CLUSTERLINE® WILL SUPPORT
OUR DEVELOPMENT OF NEW TCO
MATERIALS FOR PV APPLICATIONS
AND WE’LL ALSO BE USING IT
TO RESEARCH ON NEW ENERGY
EFFICIENT TECHNOLOGIES.”
manufacturing.” This area encompasses numerous fields
An important part of this research is finding alternatives to
including information technology, electronics, photovoltaics,
ITO layers for flexible lighting sources, as ITO films can be
robotics, and clean technologies (cleantech).
damaged when bent. This work is part of the “Flex-O-Fab”
“The CLUSTERLINE® will support our development of
new TCO materials for PV applications and we’ll also be
using it to research new energy-efficient technologies such
as OLED, next generation thin film transistors and smart
windows,” explains Prof. Christophe Ballif, Director of the
EU initiative, a collaborative research project with experts
from 12 European companies and organizations. The
overall goal is to develop a reliable manufacturing process
for OLED lighting foils, essentially taking flexible OLEDs
‘from the lab to the fab.’
EPFL PV-Labs and the new CSEM PV Center, a center
Meeting cost and performance goals
dedicated to rapid PV technology transfer.
Beyond finding a flexible application, a further technical
challenge is finding and optimizing new materials (from
abundant and cheap raw materials) that deliver the same
high transparency, conductivity and flexibility performance
(or better) as ITO. Better materials may also result in layers
with transparency/conductivity ratios superior to ITO, which,
in turn, can help create higher-efficiency PV solar cells.
MSQ helps avoid a lot of extra effort when scaling up a
successful process on a smaller substrate. For example,
while the team works to take the processes from sheetto-sheet to roll-to-roll deposition, an added benefit of the
CLUSTERLINE® is its ability to produce sheet-to-sheet
anodes for OLEDs.
“There are important cost and performance issues
here,” adds Markus Frei, Product Manager Advanced
Nanotechnology at Oerlikon Systems. “If the R&D teams
develop a material with performance similar to ITO, but
which also provides better flexibility at lower production
costs, then it could open up the whole organic-based
electronics industry as a market. And it will be an important
technology boost for the numerous flexible electronic
development projects, such as the “Flex-O-Fab” EU
initiative.”
Markus Frei sees the CLUSTERLINE® as the ideal platform
for the research efforts: “Outfitted with the MSQ source, the
R&D team can use the tool’s flexibility to deposit and develop
many different materials at the same time. In addition, the
deposition process is fast and reliable, which is helpful if you
want to make a lot of variations on one layer in one day.”
Versatile tool: CLUSTERLINE®
With the CLUSTERLINE®, any cross-talk issues between
deposition electrodes (found with competitive solutions)
were completely eliminated. The research team can exploit
the layout of a proven production tool and still utilize the
individual process modules configured with the MSQ source.
With four smaller targets (each with different materials), the
Within only a few months, the CLUSTERLINE®, with its
exceptional R&D productivity, has become a key tool for
the EPFL and CSEM teams. For instance, thanks to recent
success in TCO material development, alternatives to
replace ITO in PV solar cells and OLED flat panels are now
being shown to industrial partners within various institutional
projects. And that’s only the beginning.
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5.1 CUSTOMER SERVICE
67
1.Speed: It’s all about timing
Improved
customer
satisfaction
By Colm Connell, Head of Global Customer Support, Oerlikon Systems
We concentrate on our most valuable resource,
our staff, as well as our spare parts.
People: We continually invest in our staff in order to
strengthen the knowledge within our frontline field service
teams so that they can complete interventions and resolve
issues quickly. Here are some examples of initiatives.
I. At the beginning of each year the skills and
knowledge of all field teams are assessed.
Individual training schedules are drawn up so that
our engineers are able to perform their jobs to the
best of their abilities and, importantly, at a higher
level than the previous year. We work on safety,
transferring best known methods, knowledge of
new features, software diagnostics etc.
II. In addition we send our engineers out for
specialized training to OEM sites for example for
advanced robotics training.
Principles of customer service
Within the customer service group, we have set a clear goal,
which is built upon a set of three principles to enable us to
offer a superior level of service that improves with each year.
Spare parts: We focus on having the right mix of parts
locally in our regional spare hubs, which is supported
by our global stock. We are able to send these to our
customers quickly and responsively. Our recent initiatives
include:
I. All our regional hubs stock all parts categorized as high
risk. In addition we have all parts with a usage over 3
consecutive years.
II. We have strengthened our support presence in Asia
by adding a spares hub in Singapore and will open a
spares hub in China later this year.
III.We have implemented various solutions to find faster
ways to expedite spares. A major improvement was
implemented in May with a special carrier service
that slashes the delivery time to a record level in our
industry.
IV.We have set up local agreements with suppliers who
hold emergency stock on our behalf and also commit
to open up priority slots to manufacture at short notice.
2. Quality: Demonstrate highest quality every time
“Continuous improvement for us means a neverending effort to expose and eliminate root causes
of problems. Our goal is zero defects.”
Some examples of initiatives begun this year include:
I. We have further developed our Corrective Action
Reporting (CAR) system with new features
and have made it easier to use. We have now
integrated this process into our SAP system to
achieve a complete closed loop quality process.
II. We have also started a comprehensive training
program for our cross-functional teams on 8D
problem solving in order to transfer “best-inclass” skills and methodology to analyze root
causes and eliminate repeat issues.
III.We have increased awareness within our groups
by sharing KPI trends and have scheduled regular
steering committee meetings attended by the
entire management team to review status on all
CARs to drive closure.
3. Customer satisfaction: Strive continuously to exceed
expectations
We work in a rapidly changing technology
environment that requires the service
infrastructure to develop and innovate in
parallel to address changing needs.
Some examples of how we work with customers
closely include:
I. Customer Improvement Projects (CIP) are an
integral part of how we support our existing
customers and the extensive installation base,
both young and old.
II. Customer / supplier face-to-face surveys are
completed annually to attain a more detailed
customer feedback. In these discussions we
speak openly together about ways to improve.
III.Taking part in VLSI surveys, which provide
independent feedback from customers.
After-sales support is a key differentiator in
today’s markets and Oerlikon, as a leading
innovative and customer-focused technology
company, understands this better than most.
An important part of our success is built upon
the long term relationships we have with our
customers. It is through our combined efforts
that we develop innovative solutions so that
we all stay ahead.
CHIP 2013
Year on year Oerlikon Systems has
significantly increased customer
satisfaction as reflected in VLSIresearch’s
annual customer survey results. Measured
on a 10-point-ranking scale overall
customer satisfaction has increased, each
consecutive year, from 7.55 to 8.33 in the
period 2009 to 2013.
3
QUICK
COMPREHENSIVE
COMFORTABLE
Configured for Oerlikon production tools, the
CATALOGcreator® online spare parts catalog offers
quick search and location of any part – even for the
most complex production system layouts.
By Robert Slepicka, Technical Editor, Oerlikon Systems.
T
ime is money, especially for service and maintenance teams,
and process engineers that need to keep production running
24/7. That’s why CATALOGcreator®, the new online spare
parts catalog, offers a simple and intuitive search menu along
with numerous key enhancements over previous inventory and process
management tools (see sidebar on right).
Just launched worldwide and available to all Oerlikon system customers,
the CATALOGcreator® has already earned positive reviews from both
customer maintenance teams and Oerlikon Field Service specialists
working on-site at customer installations: “It’s not just a question of giving
the customer access to quick and accurate information, but it also gives
our service personnel teams the confidence that everything is under
control,” explains Mike Iha, Oerlikon Field Service Specialist for the US
and Asia region.
Maintaining up-to-date system documentation and maintenance
schedules with CATALOGcreator® has also become easier for Oerlikon.
Now, the Oerlikon Systems teams can update information with a single
key stroke when logged into the “administrator mode.”
Best user experience – today and tomorrow
By providing a seamless user experience for customers, Field Service
personnel and technical administrators, CATALOGcreator® helps
minimize costs and risks by improving overall efficiency with a quick
and intuitive identification of parts, schedules and documentation. The
online catalog also supports up to 16 languages, including the desktop
navigation and (if available) system documentation. Another notable
update is the online maintenance schedule list where system information
is linked to each corresponding task.
Automatic updates
Forward-looking aspects include ongoing optimization of the online
spare parts catalog functions, updating 3D catalogs and maintenance
schedules with a single button and the integration of 3D-animated
system models for fast and unique location of spare parts. Also, the
implementation of an online shopping cart for spare parts will streamline
and automate parts identification and the order process.
OERLIKON’S NEW ONLINE SPARE PARTS
CATALOG PROVIDES INSTANT ACCESS
“Compared to industry standards and other system providers,
CATALOGcreator® is an extremely powerful tool with leading edge
functionality. It’s sure to be an important differentiator for us and a
significant value for our customers,” concludes Colm Connell, Head of
Global Customer Support at Oerlikon Systems.
Everything under control
Oerlikon’s new CATALOGcreator® gives the
customer instant access to a comprehensive
and accurate source of information on spare
parts and other key data:
ƒƒ Secure access to system data through a
personal account / password
ƒƒ 24/7 availability worldwide via Internet
ƒƒ Access to complete maintenance
instructions, schedules and system diagrams
for Oerlikon production systems (includes
instructions for maintenance and cleaning)
ƒƒ Access to all system operating instructions
and OEM documentation
ƒƒ Review and ordering of retrofit packages for
Oerlikon production system retrofits
ƒƒ Access to all release notes and customer
support information
ƒƒ Access to the latest anti-virus software, with
weekly updates
ƒƒ Quick and easy location of spare parts, with
integrated 3D animated models (coming
soon)
ƒƒ Online shopping cart for spare parts
identification and order placement
1.0
2.0
3.0
4.0
5.0
6.0
CHIP 2013
6.1 WORLDWIDE SALES & SERVICE NETWORK
73
SECURING NEW
OPPORTUNITIES
IN SOUTH KOREA
By Dr. Hwan Oh, President & CEO, Woowon Technology, Seoul, Korea
The long-established partnership
with Woowon Technology
is helping Oerlikon Systems
establish new sources of demand
for its tools in South Korea, one
of the most dynamic regions for
semiconductor manufacturing.
Woowon Technology has been supplying the semiconductor
The relationship between the two companies originally goes
Future opportunities
manufacturing industry in Korea with production tools and
back to 2002, so with the post-global downturn in 2009,
The CLUSTERLINE® platform is currently the most popular
equipment for the past 23 years. Today the business also
Oerlikon Systems naturally contacted Woowon for marketing,
Oerlikon System product that Woowon offers customers in
serves other microelectronics and semiconductor-related
sales and support activities for existing and new customers
Korea. As Korea’s largest agency Woowon is combining its well-
industries, such as light-emitting diodes (LED), flat panel
alike. Oerlikon Systems has chosen to work exclusively with
known sales and support reputation together with Oerlikon’s
displays (FPD), printed circuit boards (PCB) and micro-
agency partners like Woowon and DKSH (profiled in Chip 2012),
strong performance reputation to launch and supply the newer
electromechanical systems (MEMS), which have become more
to leverage business opportunities through a well-established
HEXAGON sputtering tool. “We see it is a highly productive
established in the region over the past 15 years.
network of contacts within the Asian semiconductor and
tool and typical of Oerlikon Systems’ focus on developing
microelectronics industry. Thanks to global brand names, South
The global economic downturn in 2008 and portfolio alignment
production tools in response to what the customers need,” says
Korea has become synonymous with cutting-edge mobile
prompted Oerlikon Systems to reorganize its sales and support
Dr. Oh. Together with the sustainable traditional PC market,
electronics, home appliances and other products that exploit
operations in Asia. A result of this effort has been to partner
the ever-growing demand for mobile electronic devices, like
the latest advances in semiconductor and related technologies.
smartphones, tablet PCs, netbooks and laptops, means new
with Woowon Technology. The company has seven locations
“Oerlikon Systems has been in this business for many years
customers in the development of their production processes.
and has a strong background in developing reliable innovative
Woowon has about 60 staff and is currently hiring new staff as
production tools for the hi-tech industries, and its commitment
part of expansion plans.
to aftersales customer service is second-to-none.” says Dr. Oh.
Close relations
provide a genuine solution helps when competing in a market
Most of Woowon’s offices are within close proximity – in
with very large multinational suppliers as well as smaller more
At the same time technology giants are outsourcing more of
some cases within walking distance – to the main facilities
local suppliers, which have traditionally supplied the Korean
their semiconductor and microelectronics fabrication activity
of customers manufacturing memory FLASH, SRAM, DRAM
semiconductor and microelectronics industries,” adds Dr. Oh.
as it is so costly for one company to do it all under one roof.
and other semiconductor devices, including Samsung
Semiconductor and Hynix,. “Where we can, we try to base
ourselves as close to our customers as possible. This is a
strength of ours, as it means we can support our clients
extensively, providing around-the-clock support, seven days a
Above: The Woowon Strategic Sales & Marketing Team for Oerlikon
innovations in chip packaging and memory device designs are
in Korea, including an R&D facility, which it set up to assist its
“Its strong commitment to working with us and customers to
At least once a week Oerlikon Systems and Woowon hold
conference call-based meetings, so there is also a lot of
communication on a more daily basis between the respective
companies’ sales teams.
enabling more features inside smaller thinner formats. Woowon
sees these new production formats as being essential to the
continued market growth in the Korean semiconductor industry
in the coming years, and expects this to drive demand for the
smaller and faster HEXAGON tool.
As a result the semiconductor and microelectronics supply
chains are becoming more complex with more subcontractors
entering, specialising in specific component assembly. “There
are good synergies between Woowon and Oerlikon Systems
that we can exploit in order to capture some of the exciting
week,” explains Woowon Technology’s President and CEO,
opportunities that are emerging from the Korean semiconductor
Dr. Hwan Oh.
and microelectronics industries,” observes Dr. Oh.
CHIP 2013
6.2 WORLDWIDE SALES & SERVICE NETWORK
77
AND HOW YOU
CAN MEET US
OUR WORLDWIDE SALES & SERVICE NETWORK SPANS THE
GLOBE AND IS OPEN 24/7. TO CONTACT OERLIKON SYSTEMS
D I R E C T LY F O R C U S T O M E R S E R V I C E A N D T E C H N I C A L
SUPPORT, PLEASE CONTACT THE LOCATION NEAREST YOU.
WHERE YOU
WILL FIND US
OVER THE COURSE OF HIS BUSINESS TRIPS, OUR OERLIKON MAN MEETS
NUMEROUS EVERYDAY OBJECTS AND SITUATIONS WHICH CONTAIN
TECHNOLOGIES OF OERLIKON. THEY ENABLE HIS MOBILITY, ALLOW HIM TO
CONDUCT BUSINESS, HELP HIM COMMUNICATE, STAY HEALTHY, MAKE HIM
SMILE, AND LET HIM TRAVEL AROUND THE WORLD QUICKLY AND EFFICIENTLY.
Balzers
Liechtenstein
Aschheim-Dornach
Germany
St. Petersburg
Americas
HEADQUARTERS
Oerlikon Advanced Technologies Ltd.
Iramali 18, P.O. Box 1000
9496 Balzers
Liechtenstein
REGIONAL OFFICE
Oerlikon Deutschland Vertriebs GmbH
Karl-Hammerschmidt-Strasse 34
85609 Aschheim-Dornach
Germany
REGIONAL OFFICE
Oerlikon USA Inc
970 Lake Carillion Dr, Suite 300
St. Petersburg FL 33716
United States
T: +423 388 4770
info.systems@oerlikon.com
S: sales.systems@oerlikon.com
CS: service.systems@oerlikon.com
T: +49 89 75 505 100
S: sales.systems.mn@oerlikon.com
CS: service.systems.mn@oerlikon.com
T: +1 877 948 0260
S: sales.systems.sp@oerlikon.com
CS: service.systems.sp@oerlikon.com
Shanghai
China
Tokyo
Japan
Singapore
Singapore
DKSH China Ltd.
1801 Hongmei Road
Innov Tower / Block A Unit 2208
Shanghai
China
Hakuto Co., Ltd.
1-13. Shinjuku 1-Chome
Shinjuku-ku
Tokyo 160-8910
Japan
ZMC Technologies (Singapore) Pte Ltd
10 Ubi Crescent #05-92/93/94/95
Lobby E
Ubi Techpark
Singapore 408564
T: +86 21 5383 8811
S: christy.liu@dksh.com
S: +81-3-3225-8992
CS: +81-3-3225-8992
S: HKT-oerlikon@hakuto.co.jp
T: +65 6285 1161
S: steven_ho@zmc.net
CS: jiang_ez@zmc.net
STL: carmen_leong@zmc.net
Hsinchu
Taiwan (ROC)
Penang
Malaysia
Bundang
South Korea
Central Hub
DKSH Taiwan Ltd.
13F-1, No.100, Sec. 1, Jiafong 11th Rd.
Jhubei City, Hsinchu County 302
Taiwan (R.O.C.)
ZMC Technologies (Malaysia) Sdn Bhd
No. 1-3-23 Krystal Point 2
Lebuh Bukit Kecil 6
Penang 11900
Malaysia
Woowon Technology Co., Ltd
1903 Parkview Office Tower
6 Jeongja-dong, Bundang-gu Seongnam-si,
Kyeonggi-do
463-863 South Korea
T: +886 3 657 8788
S: jason.chen@dksh.com
CS: ben.lin@dksh.com
T: +60 4 646 4586
S: yf_lau@zmc.net
CS: pf_lau@zmc.net
STL: julie_khoo@zmc.net
T: +82 31 783 4770
S: jskim@wwtech.co.kr
CS: hongson@wwtech.co.kr
CHIP 2013
6.2 WORLDWIDE SALES & SERVICE NETWORK
2000
76
ARRIVING IN LONDON
MORNING EXERCISE
For testing purposes, the first taxis
in London have been equipped
with electric drives using special
gearboxes of Oerlikon Graziano.
Mobile entertainment devices for music or games
need ultra-compact semiconductor elements – a
core competence of Oerlikon Systems.
Trains and buses use transmission
components from Drive Systems
– the coatings of Oerlikon Balzers
come into play in their production.
Surveillance cameras are
made possible with a variety of
Oerlikon Systems technologies.
1201
1045
Large gear systems (as for the London Eye), e.g.
for mining, oil platforms, trucks and tractors are
manufactured by Drive Systems.
Yarns for functional sportswear are made out
of chemical fibers produced on Oerlikon Textile
machines.
0701
1055
GETTING READY
0625
A LITTLE
DISTRACTION
Manmade fibers
gain importance,
even in fashion
– produced
on Oerlikon
machines.
0810
1110
Steel, used for window frames, is degassed with
Oerlikon Leybold Vacuum solutions.
WHERE YOU
WILL FIND US
OVER THE COURSE OF HIS BUSINESS TRIPS, OUR OERLIKON MAN MEETS
NUMEROUS EVERYDAY OBJECTS AND SITUATIONS WHICH CONTAIN
TECHNOLOGIES OF OERLIKON. THEY ENABLE HIS MOBILITY, ALLOW HIM TO
CONDUCT BUSINESS, HELP HIM COMMUNICATE, STAY HEALTHY, MAKE HIM
SMILE, AND LET HIM TRAVEL AROUND THE WORLD QUICKLY AND EFFICIENTLY.
Yarns for home
textiles, such
as curtains or
carpets, are often
produced on
Oerlikon Textile
machines.
Nearly 50 % of all the hard disks and
read/write heads originate from an
Oerlikon Systems machine.
The Financial Times at the table:
Oerlikon has been listed on the stock
exchange for 40 years.
Luxury goods, like watches, use
coatings from Oerlikon Balzers for
functional and design purposes.
1145
1524
0905
FIRST REFRESHMENTS
25 % of all plastic bottle caps
worldwide are produced with
Oerlikon Balzers-coated molds.
WAITING FOR CUSTOMERS
Refrigerators and coffee caps
need vacuums to function and
also in their production processes.
Infrastructure: Oerlikon Fairfield
produces drive systems for earth
moving equipment, construction
cranes and aerial lifts.
TV sets are produced under
vacuum, provided by Oerlikon.
0620
1342
USB and handheld devices have
Oerlikon Systems technology inside.
HAVING BREAKFAST
2321
WAKING UP
TALKING TO CUSTOMERS
You switch the light on and energy flows:
its production is supported by Oerlikon
Systems.
LEDs are the future of lighting:
Oerlikon Systems provides crucial
technology for their production.
LED devices need compound
semiconductors in order to work; that’s
what Oerlikon Systems is for.
The production of eyeglass lenses and
drying of leather belts take place under
vacuum conditions.
There is vacuum technology in every new
generation of energy-saving light bulbs.
Manmade fibers capture more
and more applications for
infrastructure, e.g. geotextiles.
2000
1640
BACK TO THE AIRPORT
Around 50 % of the
worldwide tire cord
demand is produced on
Oerlikon machines.
PRESENTATION TO INVESTORS
0640
AT THE HOTEL
Clever food packaging exists because
of vacuum technology.
Architectural glass is coated using
Oerlikon vacuum technology to optimize
the climate inside the building.
Touch panels function with conductive layers which
are produced on the SOLARIS machine from
Oerlikon Systems.
Automotive power electronics, pressure
and acceleration sensors, LED lighting,
wireless transmission, GPS and control
logic systems are all manufactured with
Oerlikon Systems thin-film technology.
About 500 billion aluminum beverage
cans are bottled and closed with a lid.
About half of all these cans are closed
using an Oerlikon Balzers-coated tool.
WALKING TO A RESTAURANT
EVENING ENTERTAINMENT
Safety belts and interior elements need
manmade fibers: modern cars contain
20 kg of such fibres.
Food production: Drive Systems
supplies transmission solutions for
agricultural equipment.
HEADING TO THE NEXT APPOINTMENT
2205
SAFETY FIRST
LUNCH WITH CUSTOMERS
Oerlikon Graziano is the market leader for
innovative gear solutions in sports cars.
Your electrical shaver is full
of Oerlikon technologies,
e.g. coatings, to increase
durability.
1527
ON THE ROAD AGAIN
The Aston Martin DBS
driven by James Bond
in the movies “Casino
Royal” and “Quantum
of Solace” uses an
Oerlikon Graziano
gearbox.
Every diesel injection
pump contains a DLC
(diamond-like carbon)
coated part. In order to
meet the standards for an
environmentally friendly car, the injection pressure is
increased over 2 000 bar. This is only possible with
coated mechanical parts.
Numerous automobile parts are hardened under
vacuum conditions to ensure performance and
durability.
1815
CHECKING IN
About one-third of all
cell phones see, hear
or transmit through
thin films produced
with Oerlikon
Systems technology.
BACK IN ZURICH
The gangways at your
airport are likely to use
components produced by
Oerlikon Fairfield.
Most of the tow tractors
used at airports use
Oerlikon Graziano
automatic transmission
to get your luggage the
baggage claim area.
Air conditioners, airport
security scanners, and
automotive hydraulic
systems all need a vacuum
to function.
Learn more at
www.oerlikon.com/systems/