Electrical Package Characterization Data Sheet

ServiceSolutions
Electrical Characterization
Electrical Co-Design and Modeling
Amkor’s electrical team members are experienced in the latest
simulation tools and packaging technology. This allows our world class
electrical team to reduce design cycle times and provide expert advice
and services to customers.
Amkor plays a leading role in supporting customers in the
development of next generation packages and electronic technology
for existing and emerging products. Our unparalleled level of electrical
design expertise provides the following “best in class” electrical
services:
• Highly trained and experienced staff members
• High quality, reliable and accurate designs
• Design for Performance (DFP), Design for Cost (DFC) and Design
for Manufacturing (DFM)
• Excellent customer design collaboration to meet electrical, thermal
and mechanical requirements
Going Beyond the Basics
With rapidly increasing data transfer rates, the need to optimize
package layout and electrical performance is ever more crucial.
Delivering an optimum package design requires more than just a
robust layout and post-layout electrical simulation; it requires close
interaction with customers and substantial engineering support during
the entire layout phase. Amkor’s electrical engineering team works
closely with customers and package designers to make sure the
package layout meets the required signal integrity (SI) and power
integrity (PI) performance specifications. Our electrical analysis tools
are tightly integrated with package layout tools and the assistance of
our design automation team. As a result, electrical constraints can be
passed to the design team during the design process, thus minimizing
electrical design rule violations. This allows for quicker design
turnaround times while delivering a reliable and cost effective solution.
Comprehensive design optimization is possible by using electrical,
thermal and mechanical characterization. With Amkor’s co-design
methodology, signal and power integrity issues can be predicted in a
timely manner and fixed well before expensive prototypes are built.
Amkor’s experts can also help identify and optimize cost-effective
thermal and mechanical solutions that satisfy our customers’ operating
conditions and reliability expectations.
mechanical
solutions
that
satisfy
our
customers’
operating
conditions
and
reliability
mechanicalsolutions
solutionsthat
thatsatisfy
satisfyour
ourcustomers’
customers’operating
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andreliability
reliability
mechanical
expectations.
expectations.
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Design
Electrical
Thermal
Mechanical
Signaland
andPower
PowerIntegrity
Integrity
Signal
With
every
shrinking
silicon
node,
faster
I/O
buffers
and
decreasing
operating
margins,
Withevery
everyshrinking
shrinkingsilicon
siliconnode,
node,faster
fasterI/O
I/Obuffers
buffersand
anddecreasing
decreasingoperating
operatingmargins,
margins,
With
signal
and
power
integrity
critical
element
of
package
design.
Voltage
fluctuations
signaland
andpower
powerintegrity
integrityisis
isaaacritical
criticalelement
elementof
ofpackage
packagedesign.
design.Voltage
Voltagefluctuations
fluctuationsinin
in
signal
Visit Amkor Technology online for locations and
to
view
the most
current product
information.
the
power
distribution
network
due
to
IR
drop,
Ldi/dt
noise,
or
LC
resonance
seriously
the
power
distribution
network
dueto
toIR
IRdrop,
drop,Ldi/dt
Ldi/dtnoise,
noise,or
orLC
LCresonance
resonanceseriously
seriously
the
power
distribution
network
due
SS03H
Rev Date: 11/15
impact
package
performance.
At
Amkor,
we
have
highly
integrated
signal
and
power
impactpackage
packageperformance.
performance.At
AtAmkor,
Amkor,we
wehave
havehighly
highlyintegrated
integratedsignal
signaland
andpower
power
impact
integrity
analysis
capabilities.
Packages
are
characterized
with
multiple
simulations
by
integrityanalysis
analysiscapabilities.
capabilities.Packages
Packagesare
arecharacterized
characterizedwith
withmultiple
multiplesimulations
simulationsby
by
integrity
Questions? Contact us: marketing@amkor.com
exercising
various
buss/signal
channels
with
their
respective
driver/receiver
and
exercisingvarious
variousbuss/signal
buss/signalchannels
channelswith
withtheir
theirrespective
respectivedriver/receiver
driver/receiverand
and
exercising
Service
Solutions
Electrical Characterization
Signal and Power Integrity
Eye Diagram
With every shrinking silicon node, faster I/O buffers and decreasing
operating margins, signal and power integrity is a critical element of
package design. Voltage fluctuations in the power distribution network
due to IR drop, Ldi/dt noise or LC resonance seriously impact package
performance. At Amkor, we have highly integrated signal and power
integrity analysis capabilities. Packages are characterized with
multiple simulations by exercising various bus/signal channels with
their respective driver/receiver and associated power/ground domains.
Amkor uses highly accurate, industry-standard 2D, 3D, quasi-static
and full-wave field solvers.
Package Layout, Electrical Modeling
and Simulation Tools
Cadence APD and SiP
Cadence/Sigrity UPD
Mentor xPedition
AutoCAD
Ansys Q3D
Ansys HFSS
Ansys SIwave
Ansys Designer
Ansys Sentinel-NPE
Keysight ADS
Keysight Momentum
Cadence/Sigrity Tool Suite - PowerSI, BBSpice, Speed2000,
PowerDC, XtractIM, 3D-EM, T2B, System SI
• Synopsys HSPICE
Simultaneous Switching Noise
Power Bounce
4
3
Voltage (V)
•
•
•
•
•
•
•
•
•
•
•
•
I/O Supply
Switching Signal
2
1
Ground Bounce
0
0
2
4
Time (ns)
6
8
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not
be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s
warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name
and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2015, Amkor Technology Incorporated. All Rights Reserved.
SS03H
Rev Date: 11/15
Questions? Contact us: marketing@amkor.com