Rochester Institute of Technology
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Thesis/Dissertation Collections
1991
Electrostatic discharge - understanding and
controlling the phenomenon: A Handbook for
packaging professionals
Deanna Jacobs
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ELECTROSTATIC DISCHARGE-UNDERSTANDING AND CONTROLLING
THE
PHENOMENON:
A HANDBOOK
FOR
PACKAGING
PROFESSIONALS
By
Deanna M.
Jacobs
A Thesis
Submitted to
Department
College
in
of
partial
of
Applied
Packaging
Science
fulfillment
for
of
Science
and
Technology
the requirements
the degree
MASTER OF
Rochester
the
of
SCIENCE
Institute
1991
of
Technology
Department of Packaging Science
College of Applied Science and Technology
Rochester Institute of Technology
Rochester, New York
certificate of Approval
M.S. DEGREE THESIS
The M.S. Degree thesis of Deanna M. Jacobs
has been examined and approved
by the thesis committee as satisfactory
for the thesis requirements for the
Master of Science Degree
David L. Olsson
John M. Fin
Daniel L. Goodwin
May 15, 1991
ELECTROSTATIC DISCHARGE-UNDERSTANDING AND CONTROLLING
THE PHENOMENON: A HANDBOOK FOR PACKAGING PROFESSIONALS
I, Deanna M. Jacobs, hereby grant permission to the
Wallace Library of the Rochester Institute of Technology to
reproduce my thesis in whole or in part. Any reproduction
will not be for commercial use of profit.
Deanna M. Jacobs
May 2, 1997
Electrostatic Discharge
Controlling the
A Handbook
Understanding
and
Phenomenon:
for Packaging
Professionals
By
Jacobs
Deanna M.
1991
ABSTRACT
This
of
thesis
electrostatic
is designed to be
discharge
electrically-sensitive
handling
of
sensitive
(ESD)
and
electronic
devices
a
handbook
its
devices.
occurs
at
the
on
phenomenon
deleterious
effects
Packaging
every step
on
and
in the
Once the hardware is designed (and
assembly of such devices.
this may include some ESD-protective mechanisms) , it is the
packaging of ESD-sensitive devices that determines their ultimate
or
fate: being 100% reliable, being among the "walking
useless.
being completely
wounded,"
Electrostatic discharge is a phenomenon experienced in many
industries from foods to pharmaceuticals, aerospace to
communications, medical packaging to
most predominantly
the
optics, and
of
understanding
in
critical
This
ESD
is
electronics
essential
in
some
industries,
others.
handbook
industry.
phenomenon
military to
industry.
An
explosives,
is
focuses
on
the
problems
of
the
electronics
others, and it is
problems
the
of
ESD.
There is a
plagued,
critically,
general lack of understanding of the problems caused by
electrostatic discharge.
The unfortunate side effects of this
It
an
industry
often
lack
and
touches
all
with
of understanding are the purchase of inappropriate materials
little impact on rising damage to electrically-sensitive
components.
play
that
an
knowledgeable packaging
Competent,
important
role
in ensuring the
professionals
successful
manufacture,
transport of sensitive electronic
devices.
It is the purpose of this handbook that packaging
professionals have knowledge of this subject prior to
being faced
with all the challenges of ESD control.
handling, packaging,
and
CONTENTS
Certificate
of
Instructions
n
Approval
iii
Regarding Copying
iv
Abstract
Table
v
Contents
of
1
Preface
Chapter
1
Chapter
2
Chapter
3
Chapter
4
-
-
-
-
of
The Nature
of
Electricity
Generating
Static
Prime
and
Chapter
5
Chapter
6
Chapter
7
Glossary
-
-
-
of
ESD-Related Damage
The Magnitude
Sources
of
Damage,
19
Failure
Models
Mechanisms
ESDCP:
3
12
Electricity
30
Electrostatic
Discharge
Control
Program
45
ESD
75
Protective Materials
Evaluating
ESD
Protective Materials
Terms
.
.
.90
94
References
Additional
...
98
Works
Consulted
99
Appendices
104
v
PREFACE
Why
(ESD)
discharge
devices
texts
manuals
include
may
be
to be
fate:
ultimate
isn't
packaging
is
that
foods
that
100% reliable,
a
useless
and
handbook
on
professional.
to
in
to be
training
with
work
became
every
clear.
in
step
is designed
(and
is
the
it
mechanisms)
aids
the
of
their
determining
"walking
or
wounded",
to
to
essential
should
.
ESD
many
the
there
be
and
handbook
its
effect
types
to
to
critical
the
1
a
phenomenon
industries
of
optics,
understanding
in
others.
of
devices
from
medical
and
An
phenomenon
sensitive
on
is
communication,
industry.
on
specifically for the
discharge
military
industries,
a
written
aerospace
electronics
some
.is
different
explosives,
in
(ESD)
that
Electrostatic
pharmaceuticals,
predominantly,
discharge
in
experienced
packaging
Why
Once the hardware
devices
who
at
occurs
few
few
the
general
reviewing
"dead-on-arrival"
completely
There
is
devices
a
by
respond
After
question
ESD-protective
some
sensitive
of
packaging
the
to
sensitive
devices.
those
of
in
people
answer
To
reading
studying
after
and
at
aimed
the
after
subject,
electronic
sensitive
trite.
seem
may
the
on
electrostatic
of
professional?
one"
subject
handling
and
assembly
this
the
devices,
sensitive
on
phenomenon
effects
packaging
isn't
handbooks
and
Packaging
the
there
on
the
on
its deleterious
article
upon
existing
handbook
a
for
written
article
the
and
"because
saying
be
there
should
most
of
ESD
electrostatic
written
for the
be.
handbook
This
industry.
is
It
often
plagued,
information
who
are
its
with
the
is
There
professionals
unfortunate
are
the
the
rising damage
of
effects
side
for
estimates
directed
be
to
materials
sensitive
fundamental
information
foundation
for
Competent,
knowledgeable
important
and
transport
knowledge
control
the
role
is
right
prior
more
developing
in
to
sensitive
being
efficient
expertise
the
while
successful
with
quality
being
faced
the
all
It
the
the
with
on
the
solid
a
of
ESD.
a
very
handling,
Having
challenges
that
by
is hoped
play
manufacture,
oriented
with
impact
control
devices.
of
understanding
build
to
(ESD)
caused
little
professionals
electronics
faced
and
in
is
you
dearth
professional
which
expertise
packaging
insuring
of
on
of
components.
that this handbook will provide the packaging
correct
and
of
discharge
problems
lack
this
those
to
real
a
the
with
working
inappropriate
of
purchase
seems
and
ESD.
electrostatic
about
should
electronics
others
all
of
problems
there
the
of
touches
that
and
one
not
problems
included in this text
ramifications.
The
the
on
industry
just beginning to learn
knowledgeable
ESD.
an
focus
critically,
The
and
will
is
there
Because
professional?
packaging
trying
challenges.
of
to
this
ESD
gain
1
CHAPTER
The
magnitude
not
well
two
known
are
warranted.
the
a
major
need
The
for
In
the
that
order
impart
field.
of
at
sites
electronic
cannot
to
begin
This
some
to
devices
one
failure
handling
inception
case
starling truths
critical
as
the
3
some
in
the
wafers
to
but
who
used
and
greater
as
the
parts.
failure
quantities.
created
metal
damage
their
it
of
the problem.
problems
and
ESD.
The
parts,
great
the
environments
ordered
complimentary
scenario,
about
in
those
well
as
sensitive
achieved
hundred
safe
are
users
presently
failure.
more
(microcircuits)
worst
static
to
consistent
not
are
industries,
understand
from their
a
in
possibly be
consider
is
the
1%
and
controls
equipment
reliability,
procedures
low
them
illustrate
The
end
primary
components
where
communications
and
proper
(CMOS)
to
the
are
for these devices.
equipment
electrostatics,
silicon
who
There
interest
particular
electronic
as
look for approximately
military,
rates
such
source
aerospace
-Without
those
many individuals.
of
are
who
be implemented
even
not
by
is
industry
electronics
decrease ESD-related damage
to
may
damage in the
understood
individuals
protection
industry
ESD is
well
devices
delicate
provide
related
professional:
packaging
in
nor
of
groups
ESD
of
DAMAGE
ESD-RELATED
OF
MAGNITUDE
THE
-
will
oxide
ESD
use
by
can
in the
quickly
to
From wafers
the time the
By
CMOS
a
the
device,
silicon
of
critical.
As will
percentage
of
of
of
failure.
the
as
of
the
by
life
damaged
the
'zinged'
or
The
latently
'walking
of
happen?
the
great
How
36
leaving
damaged
completely
at
intermittent:
any
will
moment
out
of
commission.
damaged, has
or
never
one
'zapped'
to
to
The
fail.
ten
catastrophic
material
circuits
to total
have been
reliable
have joined the
unpredictable
as
far
When will failure
material
may fail
Failure may be
is unquestionably
it
point
onset,
malfunctioning the
moment,
make
is
Latent failure imposes the
A chip that has been
the potential
testing system, only
the
Will failure happen?
working fine
chip that has been
lead to
microcircuits
failure be?
and
to the
the
potentially
rendering them
wounded*
unknown.
severe
will
the remaining 90
of
At
cycle.
'zapped'
ESD damage has
damaged
for
high
a
scenario,
are
produced
microcircuits
percent
('slicers
ESD damage
to
following
performing their intended functions.
fear
A
damage to
Sixty
microcircuits.
ranks
seen
microcircuits
This means
destruction.
latently
be
alone
medium
silicon
medium
or
substrates
assemblers
affecting their total
severely
percent
the
the basic
wafers,
the microship
reach
loss
the
dicers')
field
'zinged',
all
eventually fail
and
next.
permanently
or
latently
the way through
in the field.
the
failures
Latent
chip is
the
cause
for the
responsible
is dimmer than usual,
chip
is
part
of
part
such
of
an
the
intermittent behavior
The remaining
will
become
will
be
IC's
packages)
to
approximately
At
22
'stuff
the
burn-in
station,
the
replacements.
This
84%
it
worst
of
is
the
not
case
A
be
at
may
10
-
From
be
a
the
be
work
3
DIP
forwarded
loss
a
1%
to
a
sub-assembly
15%
scenario
loss
has
a
failed
how many,
if
be
can
final
(see
any,
is
yield
chart
of
typically
to
1-A)
those
16
of
16
.
only
for
pack
leaving
station
as
the
this
field
field.
devices;
working
Keep in
devices
who
to
At
seen.
the
25
in-line
storage
in
yield
populators
work
expected
wafers
occur,
board
or
this
(dual
can
From the
stations.
of
they
where
overall
an
loss
to
30%
tubes
into
10%
-
or
such
shuttle,
stage
100
original
in
aircraft,
problems.
Another
.
than
go
space
formatting
packaged
stage
to
devices have
known
(IC's)
If that
critical.
military
the
as
the
at
a
on
light
PC and the
your
critical
packaged
will
IC's
less
boards
now
circuits
this
boards
lead to
are
to
they
where
computer
damage.
ESD
survive
distribution.
point
wafers
on
latently damaged
a
is far from
applications
could
integrated
lost
will
36
light
situation
on-board
aerospace
"on"
red
If
concern.
greatest
mind
are
that
LOSS
YIELD
100*
ZAP
10%
90!
ZING
60%
LOSE
30%
LOSE
3-10%
DIP
LOSE
2-20%
POPULATION
LOSE
1%
BURN-IN
LOSE
10-15%
36^
TO
SLICE
AND
DICE
25%
TO
DISTRIBUTION
22%
BOARDS
20%
TO
18%
16%
FINAL
84%
FAILED
YIELD
DEVICES
1-A
CHART
6
IN
THE
FIELD
7
latently
failure
1%
a
manufacturers
an
to
attempt
field
data,
losses
The
produce
on
few
a
loss
low
of
earth
in
great
any
capital
orbit
if
dollars; and,
the
"housecall"
Why do the
than
and
they
a
smaller
sensitivity,
The
some
a
is
faster
it may
some
real
significant
very
the
cost
associated
with
be
of
If
and
of
this
be tens
dollars.
from
1500
less
voltage
to
less
voltage
to damage
"turn
on"
one
angstroms
an
as
of
of
Now
in
millions
of
repair
it,
dollars.
ESD seen to be more urgent now
have become
geometries
more
capacity
to
800
means
(1)
.
(IC)
.
smaller
greater
less
with
and
area.
thinner
.
It
It
will
angstroms)
integrated chip
well
is
fails
board
launched to
millions
Smaller
switching,
and
cent,
If a board carrying the
Cell geometries
ago?
time.
could
could
hundreds
1/2
maybe
thousands
cost
alarming.
shuttle
cost
small,
Or is it?
becoming
years
with
is
concern.
space
would
ten
cases
from
statistics
Metallization and oxide thicknesses are getting thinner
(in
quality,
many failed devices in
produce
ones.
good
chip
satellite,
problems
were
will
for
demands
those
in industry.
chip fails catastrophically,
the
the industries that look for
1-A, indicate that
chart
involved
worth
a
mind
meet
of microcircuits
seen
are
To
rate.
seen
capital
hardly
Also, keep in
damaged.
takes
take
INFORMAL
SUMMARY
OF
STATIC LOSSES
MIN
BY
LEVELS*
MAX
%
%
AVE
%
COMPONENT MANUFACTURER
4
96
16-22
SUB-CONTRACTOR
3
70
9-15
CONTRACTOR
2
35
8-14
USER
5
70
27-33
(FIELD)
CHART
*
STEVE
ESD
HALPERIN
PROBLEMS"
-
"FACILITY
1-B
EVALUATION:
ISOLATING
ENVIRONMENTAL
"At McDonnell-Douglas
to
continue
less
to
sensitive
become
Not
and
more
damage
interference
well
a
40%
of
all
ESD
up
to
are
electronic
70%
the
plentiful.
and
people
everyday
only
a
the
of
sources
The
worst
become
movement
few
furniture,
of
the
parts
As
see,
will
apply
failures
for
generators
sources
of
static
cigarette
bins,
is very
of
simple
highly
all
of
electricity:
to build up
30
and
Normal
clothing,
cups,
static
.
insulators,
following
walking
-
to
(4)
common
static.
styrofoam
in transit,
EOS"
are
the
short
sensitive
as
are
charges
a
for
average
generated
and
wrappers,
vibration
the
Sources
static
any
on
in
device
are
results
melted
or
that
categorized
charges?
of
the
as
Electrical
.
puncture
Place
For parts
often
facilitator
with
and
accounts
are
later)
subject
device.
current
static
combined
it
the
intermittent
to
microscopic
failures.
part
devices
as
electromagnetic
an
creates
this
actual
within
to
regard
(a mini-lightning bolt)
contribute
may
on
in
.
also
overstress
the
plastics,
containers,
you
and
"Electrical
circuit.
What
spark
equipment
of
piece
(More
may be the
the
by
caused
which
pulse
engineer
packaging
environments
discharge
spark
a
will
technologies
challenges
work
safe
spark
or
failures.
(EOS)
overstress
area
(EMI)
hard
as
but
device,
a
The
are
components
avionic
Newer
.
more
(3)
sensitive
more
(2)
and
static
and
the
of
sensitivities.
more
the current
can
only
face
to
protection
component
the
60%
-
volts"
100
than
accentuate
continue
will
50%
over
are
shoes,
packaging
and
sitting.
charges
high
enough
table
to damage sensitive
1-C)
devices,
assemblies,
and equipment
.
'
ikil
A
highly
t
\
magnified
closeup showing damage
10
caused
by ESD.
(see
TABLE C
TYPICAL CHARGE GENERATORS
TYPE
ITEM
Formica*
Finished Wood
Synthetic Mats
Work Surfaces
Ungrounded Metal
Glass
or
Fiberglass
Fiberglass
Vinyl, Other Plastics
Ungrounded Metal
Finished Wood
Chairs
Clean-Room Garments
Finger Cots
Gloves
Wool
Clothing
Synthetics
Shoes and Boots
Carpeted
Vinyl
Waxed
Floors
Polyethylene Bags
Bubble Pack Material
Foam
Packaging Materials
Packaging Pellets
Plastic Trays and Boxes
Conveyors
Drive Belts
Machinery
Manufacturing Processes
Nylon Scrub Brushes
Nonconductive Liquids
High
Velocity
Air Flow
Temperature Chambers
Environmental Ovens
Trademark
of
L. E. Carpenter & Co.
1-C
11
CHAPTER
2
THE
-
blocks
building
particles:
of
of
The
of
nucleus
Fundamentally,
these
the
are
revolving
around
the
19
C.
atom
negate
A
.
in the
neutral
energy
is
electrons
mass
The
of
mass
an
of
electron
to the
equal
protons.
and
orbits
concentric
of
1.7
or
in
electron
electrons
(9.1
10"27
charge
charge
2000
times
KG.
The
of
because
and
of
larger
proton
is
10"
x
protons
the
an
10"19
x
is +1.6
it
number
balance,
10Ci^/KG)
x
(-1.6
except
the
electrons
charge
about
x
equals
in
or
neutral,
is
of
number
electric
of
amount
proton
a
The
orbit.
valence
existing
considered
each
very
smallest
When the number
is
small
a
mass
numerically
same
have
the
C)
the
Electrons
loosely held
in
found
.
nucleus.
contains
are
or
are
atom
protons.
coulomb
Electrons
2-A)
positive,
are
protons
neutral,
the
various
and
neutrons
of
composed
an
state
and
is
the
is
are
negative.
natural
electron
atom
diagram
(see
elements
our
us
give
are
subatomic
The
neutrons.
and
protons,
three basic
of
composed
are
Atoms
space.
occupies
and
mass
and
neutrons
electrons
its
matter
electrons,
combinations
than
ELECTRICITY
is anything that has
Matter
In
OF
NATURE
the
charges
other.
atom
is
equal
occupy
stable
to
the
and
sum
concentric
has
of
a
the
rings,
certain
energies
or
12
amount
of
shells,
the
of
energy.
electrons.
around
the
This
The
nucleus
13
each
and
ring
from
has
atom
an
is the
quota
losing
lose
If
the
has
a
atom
net
net
gains
charge
materials.
that
up
.
less
gives
and
A material
conductive
up
is
is
on
always
is
called
a
are
more
key
a
the
is
or
gain
material
readily
its
may
resistant
a
about
some
conductivity.
that
take
reversing
Keep
in
(see
mind
chart
materials
material
a
conductive
property
than
the
has
readily
state.
relative
it
,
it
,
If
Materials
called
are
neutral
a
ion.
protons)
ion.
negative
conductive
to
atoms
electrons)
positive
outnumber
very
How
outer
gaining
which
outnumber
electrons
to
others.
the
now
(insulative)
but
by
electrons
If the
of
capable
process
ring around
many
inert.
High
.
now
insulativity
than
electrons
is
called
returning
or
the
2-B)
and
take
electrons,
conductivity
is
is
so
is
electrons
levels.
Each
by
to be
it
(protons
Non-conductive
activity
that
3-A)
give
and
said
The
energy
orbit.
an
level
energy
nucleus.
occupied
electrons,
(electrons
or
up
is
atom
diagram
charge
electrons
give
only be
electrons
positive
negative
or
(see
loses
atom
the
This
greatest
to maintain
can
of
the
the
Ionizations
electrons
easily
on
quota
electrons.
or
and
is filled,
its
from
have
required
quota
level.
energy
distance
nucleus
are
a
lacks
shell
the
levels
energy
different
a
its
to
proportional
farther
has
takes
on
and
or
Nucleus
Electrons
Electrons
and
nucleus
of
an atom
DIAGRAM
2 -A
Nucleus
Energy
shells and
the quota of electrons
each shell
DIAGRAM
14
2-B
for
15
The
outermost
These
gain
they
occurred
excited
state
keep in
mind.
Valence
held
is
free
lose
form
that
other
to
to
a
with
the
atom,
is
and
charges
charged.
repel
diagram
no
2-C)
each
one
If
(It
in
a
The
other;
of
which
-
an
concept
to
(a)
Like
+
external
will
actually
is this
movement
conductor)
have
some
a
A
exists.
one
electric
repel
tendency
Unlike
charges
of
of
are
states
attract
charges attract
<c>
charges
pair
positive,
charges
(6)
Force between
Some
.
distribution
equal
and
unlike
charges
the
to
enough
.
charges repel
this
in
atom
2-C
Like
energy
opportunity to transfer
an
longer
law
An
electrons
negative
The
Because
attraction
of
electrons;
another.
in
atom
important
atom.
current
positive,
charges,
an
electrons.
electrons
to
is
light,
higher
state.
valence
gain
give
object
unlike
the
the
to
an
heat,
"a
to
An
.
amount
of
become free
This
be oppositely
(see
nucleus
tendency
negative
This
.
least
the
that
or
(5)
atom)
electrons.
externally.
move
excited
an
the
and
orbit
have
like
DIAGRAM
within
material
charges,
said
have
electrons.
one
objects
unstable"
electrons
materials
to
is
in
be
to
said
applied
leave their
of
is
the
of
center
to
valence
example,
applied
want
electrons
from the
electrons
protons
energy
the
energy
for
are
energy
by
occupied
when,
energy
electrical
(farther
level
has
or
is
atom
an
gain
electrons
friction,
of
ring
each
16
The
determines the
(Q)
is
the
;
than
electrons.
more
electrons
As
than
decreases
found
the
the
A
distance
basic
exert
polarity
are
the
is
object,
static
Because
moving
no
the
brought
near
is
has
another
a
is
(4)
be
small
the
(B)
10-e
between
it
balance
bodies
charged
force is
inversely
and
was
is
proportional
proportional
present
in
in
When
other,
two
the
charged
objects
This
of
to
(see
to
is
has
a
field
field
field
diagram
or
a
from
charge
to
opposite
electrostatic
electrons
retained.
ability
electrostatic
object
field
the
of
the
its
is
charge
electric
Every
transfer
will
around
3-B)
a
at
is
.
If
charged
rest
or
work
of
.
force,
charge
an
present
immediate
charge
x
.
each
between them
force
(C)
object.
charged
electricity
it
of
(6)
two
them;
charges;
force
This
any
concentrated
there
joining
them"
between
force.
a
and
the
of
6.25
force
the
this
investigating
between
force
the
increases,
charges
Upon
characteristic
surrounding
it
the
rapidly.
product
protons
protons.
directed along the line
to
are
charge
positive
more
x
there
means
coulomb
negative
One
.
1018
6.25
of
protons
for
symbol
(C)
coulombs
charge
a
contains
between
"(A)
that:
in
expressed
One
distance
the
them
body
a
means
coulomb
is
unit
of
number
The
charge.
electric
of
magnitude
the
with
compared
electrons
of
number
by
an
electric
attraction
or
charge
can
repulsion.
do
the
This
ability to
17
do
is
work
from
different
for
unit
the
object
before
the
breakdown)
The
Air
.
current
ampere
of
Charge
a
of
electrons.
I
=
movement
(I)
Q/T
The
.
is
conductor
or
electrons
for
as
during
by
current
the
one
is the
second
current
10
x
of
in
is the
of
would
so
much
v/m.
(A)
=
IT
I
=
coulomb
past
(Halperin)
is
charge
intensity
current
Q
=
charge
T
=
time
in
is
"One
.
of
the
in
in
flow
ampere
coulombs
seconds
.
an
Where:
Q
an
(dielectric
one
that
body
only
ampere
time"
.
difference
potential
movement
(I)
charged
3
The
because
conductive
about
at
current
and
become
a
on
is
charge
(v)
volt
happen
not
become
electrons
unit
from
does
one
potential.
charge
a
of
could
conductive
of
is the
voltage
This
to
defined
differs
(Q)
accumulation
of
becomes
current
of
forced
in
difference
buildup
insulator)
is
a
or
infinite.
(an
air
subsequent
point
indefinite
an
air
called
any
difference,
potential
in the
is
there
When
potential.
charge's
another,
potential
Theoretically,
make
the
called
18
In
a
conductor,
where
field
means
cannot
that
electrostatic
as
is
it
is
on
protected
Electrostatic
information
materials.
on
exist
from
field
from
"Electrons
No
charge
unbroken.
can
is
be
exist
a
on
is
coming
presented
to
"a
(2)
static
Free
.
accumulate
and
basis
for
is
This
called
flow
will
nullify the field.
cannot
Whatever
objects
shielding
will
charges
or
a
to
mass"
conductive
formed.
be
charged
shielding
a
by
ease
potential
Therefore,
and would neutralize
cannot
and
negative
(5).
within
conductor
a
shielding.
continuous
lowest"
is
ease
differences
potential
flow
relative
with
move
Why is this true?
energy
electrons move with
This
Electrons
potential.
electron
electric
electrons
difference.
potential
positive
free
a
the
shield
inside the
near
Faraday
the
Cage.
later in the
as
long
shield
shield.
More
chapter
on
3
CHAPTER
-
GENERATING
STATIC ELECTRICITY
TRIBOELECTRIFICATION
Tribo is Greek for friction.
of
by friction,
electricity
The
materials.
influenced
by
(smoothness)
characteristics
lubricity
ambient
and
humidity
(RH) )
opposite
charge
electricity is
surface
If
the
of
the
cannot
on
an
a
the
The
is
charge
is
neutralize
insulator
neutralized
neutralize
by
on
not
all
surfaces
some
it
it
of
and
mobile
retains
insulator because the
will
means
insulators,
remain
other
immobile
than
ionization,
chapter.
19
the
be
are
the
One
to
the
on
(2)
.
until
charge
charge.
until
Static
object
the
and
equal
accumulate
charges
grounding.
will
an
"travels"
the
relative
and
material.
only
retains
separation,
of
(T)
each
through
surface
contact,
separated,
charges
way
then becomes
and
and
the
conductive,
insulative,
is
separation
speed
are
materials
the
triboelectricity
(temperature
surface phenomenon;
object,
surface
two
two
of
pressure,
,
conditions
develops
material
grounded.
If
When
.
intimacy
factors:
many
of
magnitude
or
amount,
generation
of
and
contact
rubbing,
the
means
Triboelectricity
ground.
Grounding
not
mobile
insulator
method
discussed
in
used
a
is
to
later
20
is
It
tupe
(positive
polarity
depends
3 -A)
chart
the chart)
it
is
the
If
.
and
lower
on
other
the
that
exist
degree
by many
one
air
becomeing
more
Movements
of
charge
charge:
and
as
is
material
a
their
of
in the
the
through
The
with
materials
(See
series.
the
wool,
glass
is higher up
steel
rod
with
relationship
wool,
to
farther
of
magnitude
the
on
(since
charge
that the
possible
greater
each
apart
charge
Magnitude is influenced to a greater
such
is
accepted
contacting
rubbing the
factors
two
by
a more negative
rubbed
are
as
intimacy
of
surface
contact,
etc.
triboelectrically
shoes
the
between them.
be
must
is
it
Also,
other
you
materials
materials.
(since it
charge
because
the chart,
characteristics,
What
happen
rod
glass
a
acquire
If
.
other
each
rub
would
chart)
chart.
on
to
two
any
generated
charge)
positive
more
would
are
to
were
a
the
materials
will
you
the wool
on
opposite
negative
or
of
separation
without
accumulate
can
charges
static
relationship
acquire
would
rod
their
on
and
contact
of
Whether
chart.
series
liquids,
or
solids,
gases,
any
triboelectric
a
mentioning
triboelectrif ication
discuss
to
possible
not
you
masses
is
At
walk.
becoming
accumulation
skin
two
any
on
rubbing
separating from the carpet,
negatively
air
your
that
more
all
times
when
positively
surfaces
your
clothes,
your
and
there
charged
can
your
clothing
is movement,
and
one
is
charged.
will
great
discharge
enough.
a
lightning
Fuel
bolt
when
running through
a
the
hose
TABLE A
TRIBOELECTRIC SERIES
MATERIALS
POLARITY (+ OR
Asbestos
Acquires
Acetate
-)
a more positive charge
Glass'
Human Hair
Nylon
WooJ
Fur
Lead
Silk
Aluminum
Paper
Polyurethane
Cotton
Wood
Steel
Sealing Wax
Hard Rubber
Acetate Fiber
i^ylar*
Epoxy Glass
Nickel, Copper, Silver
401
Epoxy Resist
UV Resist
Brass, Stainless Steel
Synthetic Rubber
Acrylic
Polystyrene Foam
Polyurethane Foam
Saranf
Polyester
Polyethylene
Polypropylene
PVC (vinyl)
KelF*
TEFLON*
Viton*
Silicone Rubber
*
Acquires
Trademark
of
E.I. du Pont de Nemours
t Trademark
of
Dow Chemical U.S.A.
t Trademark
of
3M.
21
a more negative charge
22
fill
to
needed
in
this
It
is
jet
a
charge
a
generate
to
easy
very
devices.
Once
develops.
potential
between
or
breaks
down the
object
at
insulative
or
is,
the
You
have
for
a
static
had
the
doorknob,
doorknob.
is
The
body
Let's
is
a
the
of
and
break
this
capacitor.
by
contact
of
a
and
(or
shock
across
separation
the
in
conductor
a
ground),
field
from
another
is
there
,
(how
resistance
determines
is,
becomes
the
a
an
the
slower
material
mobile
it is
electricity!
across
your
down
means
static
electric
conductive)
charge
on
a
e.
object
material
more
walking
This
a
dynamic
scenario
walking
its
discharge
of
Once the
getting
(i.
The
event.
path
less insulative
experience
that
charged
insulative
more
electricity but
accumulated
repeated
ESD
an
sensitive
charged
a
to
easy
difference
the
(dielectric breakdown)
voltage
or
damage
potential
charged
separating the
medium
the
highly
so
is
When
different
at
as
accumulated,
potential
objects.
faster the discharge.
longer
charge
is
conductive)
discharge;
Your
conductor
discharge.
of
two
has
just
is
to
magnitude
charge
static
discharge
the
no
the
different
a
electrostatic
rate
A
insulator
an
when
enough
disaster.
avoiding
it
and
charge,
electrical
an
another
has
that
thus
grounded,
a
generate
potential
contacts
is
hose
the
situation
Fortunately,
charge.
a
accumulate
also
will
and
your
a
fingertips
see
what
body
carpet.
between
carpet,
reaching
from
happens.
will
store
Remember,
your
the
feet
the
there
and
the
23
As
carpet.
if
doorknob,
insulative
becomes
which
without
between
shock
you
being
charge
electrons
to
differ
caused
startling
the
shock
in
due
lack
conductive
its
and
existence
influence the
this
chapter
does
is
a
(i.e.
it is
(The
fairly
felt.)
good
There
the
of
intimacy
Late
at
of
great
to
Ambient
(wintertime)
moisture
job
not
was
the
dissipating any
are
also
charge
the
listed
contact,
folic electricity.
the
smoothness,
night, and wtthoul pefmiulon. Reuben wouM
nwMfy and conduct experiment] In
often enlef the
other
on
enough
of
though
not
feel
enough.
the
cause
are
conditions
high
of
doorknob
a
did
you
event
How many
even
and,
down,
ESD
see.
store
potential
example?
The drier
magnitude
in
difference
not
the
the
enough,
and
touched
knob,
difference
above
and/or
and
the
to
body
moisture.
feel
doorknob
the
large
reach
doorknob breaks
body did
your
from
potential
the
responsible.
of
your
large
the
largely
to
Simply,
you
you
experience
you
carpet
a
across
greatly
from
that
spark
the
and
and
When
body is
your
fingers
conductive,
walked
passed
in
stored
and/or
is building.
charge
your
shocked?
anything because
What
charge
momentarily
have
this
walk,
the
air
is the
times
a
you
more
shocks
humidity
charge
before
factors
first
etc).
is
that
page
of
INDUCTION
Triboelectrification,
a
static
a
charged
charge
A
that
charged
iron
object
it.
and
proximity to the
same
The
Remember
filings
positive
has
object
surrounding
and
effect
be
the
a
on
field
is
uncharged
similar
experiments
The
poles.
uncharged
electrostatic
the
not
you
only way
means
can
make
to
the
one
as
only had to
that
induce
(see
diagram
field between two
DIAGRAM
24
of
a
a
youth
come
fields
3-B)
force
surrounding
.
force
charges of opposite polarity
3-B
of
can
a
using
close
themselves
them orient
electromagnetic
object
lines
or
performed
magnet
The
object
field
Electrostatic lines
The
is
touching it.
even
iron filings to
an
an
electromagnetic
magnet?
negative
contact,
Charging by induction
to
close
without
an
by
charging
generated.
brought
object
on
magnet.
can
charge
or
in
along
have
25
When
an
through
moves
lined
(6)
activity
being
object
will
flow
the
object
object
charged
will
a
is
together
longer
return
even
the
failure
and
the
object
negative
the
are,
thus
them,
the
escalating
its
contact
"stick"
of
charge
field
of
an
will
a
the
net
charges
other,
and
together
forces.
present.
will
If
the
redistribute
and
charge.
the electromagnetic
if they
will
But
electrons
state.
induction
It
If
objects.
excess
positive
unpolarized
each
the
field.
own
-its
ungrounded
polarized,
with
alone,
to
electrostatic
any type
separated
The
may
by
repelled
establish
polarizes
while
Polarization
collapse.
materials
uncharged
between
are
charges
field,
materials
polarity
will
object
left
If the two objects do
will
ground
the
leaving
polarized
opposite
of
induction charging
touches
object
fields
the
and
the
closer
like
.
Electrostatic
the
The
other;
the
and
induced in the
is
the
field
a
or
is to the
repel,
side
one
other.
charges
more
attracting
The
forces
the
stronger
charges
on
each
object
uncharged
lineup
the
on
up
the
Since like
charges
positive
charges
closer
field.
the
stronger
has
The
repel.
field,
a
current
attract
will
charges
through
moved
electrical
an
conductor,
Opposite
conductor.
will
a
is
conductor
uncharged
are
are
the
The
completed.
light
appear
once
field
that
two
held
enough,
there
is
materials
no
are
reappear.
electronic
part
can
occur
due
to
the
flow
of
26
current
This
induced
happens
often
uncharged
damage
when
microscopic
crater
Four
to
charges
(6)
3.
As
long
as
The
is
they
It
charged
of
a
induced
and
all
around
exist
martials
insulator
passes
speed
the
on
or
a
induced
and
for
having
devices.
by
conductive!)
use
strength
current
of
the
of
damage
is
not
amount
easily detected.
fields
electrostatic
hold
and will
used
the
greatest
and
imperative that
to
charge
a
movement
everywhere
materials
is
induce
conductor
field,
a
for causing the
made
a
near
depends
of
grounded
is
to
conductor
sensitive
packaging
insulative
They
necessary
through
exists
be
not
current
notorious
cannot
in the vicinity
a
It
accumulate.
flexible
of
responsible
are
because they
the
the
and
products.
Insulators
field
a
in
amount
field
is
passes
flow
will
end
fields
static
invisible.
are
contact
conductor
to
blows
actually
materials
Physical
Induction
(Voltage induced
component.)
regarding
fields
2.
.
an
:
charged
4
a
remember
Static
1.
into
spark
a
touches
person
(non-grounded)
from
arc
induction.
electromagnetic
induced damage.
current
the
when
occurs
during
part
charged
a
is
This
part.
things
that
within
on
to
whatever
insulators
(It
the
One
ionization.
is
not
be
interesting
industry
method
present
are
of
charge
allowed
that
the
basically
neutralizing
27
There
the
are
numerous
of
scope
information
(2)
other
this
to
charge
They
are
ways
text.
Charging by freezing
2.
Spray charging
through
Thermionic
4
Photoelectric
electrons
Corona
-
listed
electrification
mechanical
3.
5.
object
which
here
are
for
beyond
your
own
.
1.
.
an
charging
particles
particles
-
-
light
increasing
quanta
temperature
ejecting
surface
material
-
through
predominate
charging
charging
a
sprayed
atomizers
emission
from
of
ionized
a
polarity
corona
plasma
and
gas
containing
becoming
charged
with
POLARIZATION
is
Polarization
field
electrostatic
is
charged
it is
the
(6)
device.
will
or
happens
when
puts
the
destroy
say the
proximity
of
stationary.
mobile
they
it
will
not
If
the
until
charge
will
up the
give
material
field.
insulator it
an
hold
charge
to
cup
is
another
The
electrons
can
the
(6)
is
to
a
insulator.
cup
near
comes
It
gives
Let's
charged.
stay positively
styrofoam
a
greedy
sensitive
a
3-D)
the
as
charged
prefers
cup
it
down
(See
part.
the
on
by
a
the
device
in the
is
in
This
process
finally resting
sensitive
the
sensitive
induction)
But
bench
the
current
and
a
conductive
.
28
field
device
created
move
as
current
not
stop
is
in the
by
the
close
the
may damage
device for the first time.
the
freely
through
device
does
bench
is
cup
triboelectrically
charges
passes
cup
be induced to flow.
Let's
as
and
electrons
up
even
and
an
a
when
only hold the
is
object
(styrofoam)
diagram
(See
If
air.
time
will
and
conductor
electrostatic
an
it
charged
long
easily
worker
giving
by
a
when
Remember,
stationary.
conductor,
If the
occurs
.
electrons
the
a
polystyrene
what
both
are
surrounded
long,
a
charge
see
is
object
Expanded
up
is
grounded.
ground
As
it
charged,
that
phenomenon
a
to
here.
near
Both are
cup
the
and
cup
29
Remember,
other
and
is
as
are
charges
fast the
is
heat may be
may
completely damaged
ground
when
a
may
are
a
by
protons
electrons
attracting;
out
ground,
to melt
created
more
are
like
polarized.
cause
by
The
positive.
with
The
moved
touch
weakened
charge
now
and
generated
been
have
is
up
should
to
charges
device
picked
it
If
discharge
enough
device
Unlike
The
repelling.
A
very
charged.
positively
should.
they
charged.
discharge.
The
more
instant the device
becomes
is
cup
device away from the cup is left
the
therefore
behaving
The
of
end
the
and
attract
opposites
of
the
it
will
to
electrons
parts
initial
of
field it
the
move
so
device.
induction
polarization
then
and
is finally
discharged.
It
can
is
easy
be
to
create
avoided
information
on
will
charges
be
at
a
discussed
workbench.
in
the
grounding.
Polarization.
How
section
these
problems
that
includes
4
CHAPTER
There
are
prime
sources
OF
SOURCES
-PRIME
essentially
two
damage to
of
1.
Electrostatic
2.
Waveform
families
Interference
(EMI)
Radio
Interference
(RFI)
frequency
Pulse
ELECTROSTATIC
discharge
another
ground
electrical
or
conductor
down the
a
determines
failure.
The
1
When
.
by
highly
rate
three
the
Human
charged
3.
Field
sensitive
Device
device
that
events
Model
electric
object
The
from
an
another
failure
cause
insulator
field
resistance
resulting
can
when
this
an
of
is
breaks
charged
the
path
thermal
failure
are
models:
(HBM)
Model
Model
is
.
The
charge.
ESD
Induced
(6)
its
as
potential
or
ground,
that
charged
voltage"
following
Body
Charged
of
to
conductor
charged
a
when
different
a
path
EVENTS
(ESD)
occurs
at
separating the
2.
a
(ESD)
resistive
different
the
represented
or
(EMP)
DISCHARGE
conductor
so
medium
at
object
is
are:
Events
Electromagnetic
"Electrostatic
the
Events:
Electromagnetic
contacts
(ESD)
Discharge
These
devices.
sensitive
constitute
that
events
of
MECHANISMS
AND
MODELS
DAMAGE:
(CDM)
(FIM)
in the
discharge
30
path
it may be damaged
31
(thermally degraded) by
one
1.
thermal breakdown
2
metallization
.
3.
of
melt
dielectric breakdown
three mechanisms
(7)
:
MODEL
BODY
HUMAN
We have
is
everyday
is
capacitance
1000-3000
120
device.
a
The
rating
of
charge
buildup during
sensitivity
can
of
Voltages
magnitudes.
For
that.
is
It
degrade
melt
(See
easy
fig.
device
for
4-D)
of
When
a
the
through
the
can
be
to
develop
charged
person
body
(a
device to
designed
give
satisfactory
create
touches
is
ground.
into
capability
most
.
32
in
in
the
device
some
1000
As
you
volts.
than
will
power
to
surface.
to
these
-
the
charge
some
Protection
of
and
that
enough
but,
of
4-C.
transferred
IC's
limits
protection
a
damage
less
diagram
potentials
craters
capacitor)
the
see
.
on
much
There may be
devices.
4-B)
50,000
-
levels
HBM
4-A)
effect
15,000
to
the
of
and
This
(3)
sensitive
the
magnitude
table
significant
exceed
the
table
(see
HBM
silicon
protection
all
a
circuit
have
in
have
are
generally
will
the
easily
sensitive
in
transfer
to
individual
an
volumes
stored
or
equivalent
destroy
or
small
energy
this
the
can
devices
that
mind
devices
show
(see
activities
certain
resistance
exceed
may
charge
a
equivalent
equivalent
and
tables
following
develop
body's
human
values
equivalent
conditions
ambient
see,
Keep in
select
(pf)
picofarads
These
human to
a
The
movements.
250
-
ohms.
is for
how easy it
seen
already
common
with
HBM
-
3000
operations
of
to
the
the
resist
designs
volts.
but
not
TYPICAL ELECTROSTATIC VOLTAGES
(VOLTS)
RELATIVE HUMIDITY
EVENT
10%
40%
55%
35,000
15,000
7,500
12,000
5,000
3,000
6,000
800
400
2,000
700
400
trays
11,500
4,000
2,000
Remove DIPs from Styrofoam
14,500
5,000
3,500
Remove bubble
26,000
20,000
7,000
21,000
11,000
5,500
Walking
across carpet
Walking
across vinyl
Motions
of
bench
floor
worker
Remove DIPs from
plastic
Remove DIPs from
vinyl
pack
tubes
from PWBs
Pack PWBs in foam-lined box
CHART
33
4-A
DEVICE SENSITIVITY
TO HUMAN-BODY MODEL
RANGE OF ESD
SENSITIVITY
DEVICE TYPE
(VOLTS)
VMOS
30
1,800
-
MOSFET
100-
200
GaAsFET
100-
300
EPROM
100
-
2,500
JFET
140
-
7,000
OP AMP
190
-
CMOS
250-3,000
Schottky Diodes, TTL
300
-
2,500
Film Resistors
300
-
3,000
2,500
(Thick, Thin)
BIPOLAR Transistors
380
-
7,000
ECL (PC Board
500
-
1,500
Level)
SCR
680
Schottky TTL
1,000
CHART
4-B
34
-
-
1,000
2,500
Grounded Surface
Body
Body
Capacitance Resistance
-if
Contact
Device
Resistance
1
j
AAAr
H4-W
AM
Current
Pulse
Equivalent Circuit
of
Human-Body
Model
DIAGRAM 4-C
OWOi.
0i0 0'
?<}!'. 0"Sin Jl
DamaRr
at
the input
human-body
of a
disrhnrxe
of
CMOS
circuit
From |5|.
DIAGRAM 4-D
35
due to
approximately 2 kV.
a
Capacitance
of
Device
Device
tt
nnnr4Jv\V
*-AM
Current
Pulse
Equivalent Circuit
of
Charged-Devjce Model
DIAGRAM
36
4-E
37
The HBM figure
lead is
a
that
HBM
an
The
device
discharge to
a
floating device.
MODELS
CDM
charged
device
and
then
flow
components
the
Devices
can
during
between
at
contact
some
a
time
ground
device
Acquired
across
A
operations.
assembly
charge
on
the
charge
is
on
and
first
failure
charges
from
(3)
the
work
charged
are
in
device
The
model
end
ways :
into
associated with
a
the
movement
insertion
charging
eventually
pins
For
.
and/or
will
and
represents
package.
4-E)
,
Charges
dielectrics,
tubes
shipping
paths)
pin.
one
several
surface,
discharge.
and
are
most
during
contact
likely
significant
a
to
number
.
may be
metal
a
the
diagram
(see
charge
unloading
and
charging
conductive
This
path.
ground.
damaging
device
junctions
damage
CDM
or
other
through
ground
devices
the
triboectrically
sliding
(and
to
more
much
the
around
up
in the discharge
are
shipping,
equipment,
to
can
and
representations
circuit
of
that
association
ground
die
the
set
is
ground
lead frame
the
discharged
quickly
through
is
model
on
triboelectrically
-
to
through
path
connected
not
or
a
DEVICE
CHARGED
floating
another
while
the discharge
through
discharge
HBM
An
leads
other
all
with
lead
single
a
Typically,
to ground.
connected
lead
discharge to
that
shows
mobile
lead
or
from
nonconductive
immobile.
and
to
A mobile
conductors.
portions
of
the
charge
An
is the
immobile
device.
The
38
immobile
but
device,
the
and
charge
and
device
a
ground
a
field.
may
charge
touches,
device to discharge.
be
kept
low
a
at
or
damage
resulting
time
the
and
whether
the
devices
contact,
of
(Mobile)
by
upon
The
first
the
cause
will
pin,
a
from
unloaded
dispensing.
damage,
charges
must
different
from
mobile
level.
from HBM.
resulting from CDM
The
floating
devices
and,
will
though
charge,
be
are
device
the
of
capacitance
threshold for damage will
are
by maintaining
usually
end
an
ESD
minimize
are
grounding determines the energy
the
the
Devices
damage
directly
cannot
device
the
damage
usually
failure thresholds
Damage
at
To
and
currents
indirectly
can
creating
shipping tubes
develop
cannot
charge
released
exceeded.
they may
the
having
ultimately
during
ESD
In
HBM
the
damaged
be
not
package
on
ability to
discharge.
"The
capacitance
plays
ESD
a
strong
and
Charging
a
the
and
Although
the
as
is
the
for
threshold
well
while
ground
will
inversely
it
will
is
be
near
more
ground.
storage
the
energy
damage
instant
the
to
be
will
near
effect
energy
The
of
released
positioned
damaging
proportional
energy
at
have the
increasing
as
discharged
device
package
determining
device
discharge
were
energy
in
it away from
The
device
device
the
the
packaged
potential
device.
role
whether
then moving
the
of
than
of
capacity is
during
it
the
exceeded.
and
ground
increasing
stored
the
on
would
increase in
the
grounding
be
if
potential
capacitance
ratio.
limited in the
CDM,
39
when
that
the
potential
strength"
through
of
the
device
mobile
can
across
occur
an
Second,
a
field
A
charges.
grounded
of
experience
a
having
potential
gradients
(For
a
a
more
would
(9)
fast
so
.
small
also
representation
of
an
through
current
can
into
a
of
the
in
The
"oxide
punch
event
may
or
the
which
FIM Model
"If
for
a
a
it
field,
lead"
(6)
cannot
diagram
of
gate
device
is
will
.
sustain
electrostatic
see
the
with
separation
develop
grounded
high
dielectrics
associated
field.
the
first break
would
electrostatic
a
common.
affecting the
geometries
fail
very
strength
First,
ways.
be below the
potential
inserted
very
common
two
not
by induction,
non-zero
of
"Devices
is
field before
in the influence
surge
threshold"
in
device
which
oxide
charging
device
a
while
is
damage
Increased field
.
device.
structure
(2).
can
reducing the
in
a
affect
air,
the
the
exceeds
occur
can
pulse
FIM
-
(2)
discharge
the
HBM,
breakdown
dielectric
down
MODEL
field
external
induced
the
density
power
INDUCED
FIELD
An
to
compared
field"
4-E.)
EU
OEJCmC UEAKDOWi
ELECTROSTATIC
rrm
ELECTROITATK
RELO
(E-
V/M)
'EM
,
jt
Equivalent Circuit
of
Field-Induced Model
DIAGRAM
MECHANISMS
FAILURE
"Failures
hard"
(2)
setting
direct
no
that
A
.
an
up
ESD
failure
soft
equipment
(e.
is
failures
failure
1.
or
electric
discharge
require
can
field,
magnetic
through
a
small
and
signal
equipment
in
changes
CMOS).
Soft
from
result
temporary distortion
as
g.
to an ESD pulse can be
exposure
hardware damage
affected
Hard
by
caused
characterized
is
4-F
to
can
switch
usually
failures
loss.
resume.
states
occur
or
pulse,
information
operation
failures
Soft
as
well
discharge
spark
ESD
and
path.
or
energy
a
as
soft
only
a
are
There
Devices
are
most
when
the
operating.
can
mechanisms
Thermal
at
occur
(for
any
time
and
semiconductors)
Breakdown
semiconductors,
or
Avalanche
bipolar
are
(2)
by
three
:
Degradation
integrated
40
represented
circuits
-
indiscrete
41
2.
Breakdown
Dielectric
discrete
-
integrated
MOS
MOS,
circuits
bipolar
THERMAL
BREAKDOWN
Thermal
breakdown
enough
"Hot
gradients.
DIELECTRIC
BREAKDOWN
Dielectric
breakdown
applied
across
its
puncture
latent
MELT
Metallization
melt
short
caused
first
Though
to
with
melt
the
the
event
of
portion
of
the
a
with
large temperature
junction
other
a
on
scope
of
a
due
shorts
to
this
a
which
is
greater
characteristics.
magnitude
the
of
failure
mechanisms
event.
mechanism.
may
junction
A
damage may be
Subsequent
The
difference
potential
structure
the
failure
as
a
secondary
metallization.
melt
of
results.
usually
by
is
breakdown
or
depending
metallization
beyond
ESD
an
melt
heat
there
region
dielectric
is
of
creating
when
strength
catastrophic
METALLIZATION
current
actually
by
4-E)
dielectric
a
through the
circuit
result
occurs
dielectric
or
to
duration
spots"
caused
circuit
short
a
diagram
(see
melting.
is
is little diffusion
There
both
integrated circuits,
all
-
MOS
and
and
magnitude
junction.
than
Melt
Metallization
3.
or
draw
A
enough
oxide
fails
result.
handbook,
a
list
of
other
failure
42
includes
mechanisms
(7)
to
Metallization
:
over
arc
metallization
breakdown
Surface
breakdown
Bulk
Surface
inversion
Surface
EVENTS
WAVEFORM
EMP
AND
RFI,
EMI,
interference
Electromagnetic
(RFI,
sensitive
device
example
holding
The
a
as
certain
This
magnitude
glass
of
failure
causes
the
(EMP)
,
but
interference
Frequency
differ
from
that
cannot
waveforms
FIM)
ESD
an
pass
frequency
actually
will
mechanism
There
which
the
goblet
and
for these
device the
is
one
the
to
soprano
a
in
event
through
couple
too
with
great
beyond
shatter.
crystal
the
the
a
singing
a
with
of
sound.
stiffness
certain
Stress
and
goblet.
frequency
the
as
vibrate
vibration
then
a
vibrating
same
becomes
prevent
stress
starts
is
note
be
would
coupling
vibration
will
sensitive
failure.
note
the
of
material
the material
a
frequency
of
frequency
goblet.
In
(such
are
Radio
,
device.
the
An
They
way.
(EMI)
Pulse
Electromagnetic
and
important
one
EVENTS
As
the
of
the
point,
cracking
the
and
is the
waveforms.
result
instance
of
when
stress
cracking
these models
can
is
mechanical
cause
thermal
43
failure.
the
If
The
heat may lead to degradation.
failure
is
heated
in
destroyed
"Sound
pulses.
passed
sound
through
the
right,
to
water
is
failure
is
way
thermal
ESD
waveform
.
by
up
of
speaker
picked
microphone
another
can
begins
and
can
microwave)
frequency
into
talk
picked
the
at
up
damaged
be
(6)
coupling
coupling occurring is
to
be
can
components
called
process
speaker
are
Throughout the
rail
the
the
those
and
magnitude
to
microphone
or
to
by
an
.
by
or
A
auditorium
an
microphone
ear
results.
picked
The
waves
speaker
speaker
wave
on
a
(radar,
frequency
of
screech
If
waves.
the
an
and
,
(microlightning)
components
example
piercing
microwave)
like
(much
through
frequencies
radio
as
a
origin
electrical
and
way
failure
thermal
COUPLING
FREQUENCY
common
in
cup
in
pinpoint
Certain
a
the
all
or
global
thermal
the
heat,
cause
difference between this
is that
ESD thermal failure
and
to
enough
great
are
vibrations
set
the
easily
microphone
the
by
up
and
the
the
in
placed
frequency
cycle
converted
of
pulses
keeps
a
back
the
sound
electric
amplifier,
position
and
is
to
the
by
converted
microphone,
electrical
entire
and
assembly,
is
are
is boosted
pulses
assembly
of
complex
a
to
where
distance
waves
generated
through
areas
the
from
just
are
by
the
repeating."
distribution system, transportation
pass
sound
where
damaging
by
truck
frequencies
44
and
As
and
airports,
a
transmitters
Microwave
exist.
passes
vehicle
frequency
"Actual
result.
systems
just
are
failures
been traced to
through
of
on
naval
to
aircraft"
unit
From
of
an
zero
adjacent
to
peak
damaged if the
peak
to
zero
ship
(rise
resulting
(decay time)
destroyed
if
waveforms
will
the
not
decay
pass
or
time)
voltage
is too
devices
time
is
that
too
sensitive
much
are
for
time
rapidly.
is
interference
shielding
(EMI)
and
can
guidance
aircraft
the
search
devices
the
have
radar
can
can
Fortunately,
voltage
as
such
and
be
the
aluminum
reduce
effectiveness
be
From
device.
sensitive
power
long.
peak
and
.
through barrier materials
Barrier materials should limit
electromagnetic
by
landscape.
components
military
caused
(6)
voltage
foil.
This
in
and
stations
distance
fire-control
computer
vessels
the
if
sensitive
coupling damage
frequency
dot
and,
waveforms
damage
right,
cases
the
tv
supporting
installations
radar
military
units
radar
to
and electromagnetic pulse
decay
both
(EMP)
.
CHAPTER
The
5
"envelope"
variables
and
that
grounding
to
part
practice
discharge
program
implementing
ESDCP,
steps
"envelope".
any
effort
at
successful,
to
Before
(ESDCP)
ESDCP,
an
and
ESD
control
must
are
Two
1
.
reasons
common
failed
reasons
that
static
is
generated.
A
can
be
put
electrostatic
an
incomplete
justifying
an
Without these
and
marginally
and
not
ESDCP
Too
put
to
phenomenon
much
defining
at
to
contribute
understanding the
the
of
ESDCP-
attempts
of
symptoms
2.
for
lack
A
handling
service
completed:
an
handling
safe
"envelope"
an
be
be
will
to
best.
many
practice.
personnel
field
auditing
JUSTIFYING AN
There
from
materials
proper
the
all
discharge
three major phases
successfully,
control
to
analysis
for
electrostatic
Everything
packaging
stations,
the
of
devices.
sensitive
failure
control
PROGRAM
buzzword
industry's
electronic
implemented to
to
work
procedures,
into
the
are
damage
the
become
is
CONTROL
DISCHARGE
ELECTROSTATIC
ESDCP:
-
effort
the
an
this
is
problem
failure
ESD
of
into
ESDCP
aimed
are:
and
how
at
the
by isolating
causes.
lack
of
failure.
diagnose,
conclusive
ESD
and
is
there
evidence
not
is
that
visible,
a
lack
45
of
ESD
can
was
be
expertise
the
cause
difficult
in
knowing
of
to
46
how
initiate
to
three phases
translated
a
figure
into
to
made
a
money to
to provide
thorough
loses
The
its
quality
on
of
approach
management
decision
of
In
and
to
the
problem
is
make
problem
If the
and
cost
the
looked
at
a
put
level
dollar
need
for
have
will
effort
is
to
not
quality impact for
for
need
be
the
with
management
money.
on
to
large
must
corporate
a
possible
words,
a
from ESD
is being
or
management
information
developed
was
static
the
on
which
the
requirements
profitable
static
controls
static
Stephen Halperin
control
of
"provides
complex
a
the
(7)
to
needs
ESD.
An
means
organization,
programs"
tracks
it
of
ESDCP
to
and
information
Stephen
to
approach
straightforward
for quantitative
control
analysis
a
by
information
the
regarding
analysis
is
It
with
managerial
Throughput
other
resulting
be
can
all
of
supportive
management
level,
it
effort
impress
and
Associates.
throughput
impact
provide
impact.
&
providing
and
complete
the
facility
a
money
analysis
following
Halperin
level,
save
damage
Whether
ESDCP.
an
the
of
dollars.
losses
the
Convincing top
All
information,
implementing
spend
ESDCP.
department
time,
with
an
in itself.
challenge
from
of
be
must
management
top
progress
effective
to
process
evidence.
conclusive
For
investigative
an
make
a
is based
evaluate
the
satisfy
the
which
lead to
.
quantity
and
flow
of
goods
in
47
When
production.
indicate
(9)
can
:
1.
Which
components
2.
Where
in the
3.
Estimate
4.
Highlight
the
important,
total
throughput
analysis
the
over
losses
attention,
short-term
foundation
the
provides
occurring
are
immediate
with
return
static
static
potential
of
that,
greatest
to
losses
the
of
most
cost
areas
the
failing due
may be
operation
the
yield
will
"Most
analysis
throughput
conducted,
accurately
for
program"
the
development
(Halperin)
The
an
ESDCP
has
three
phases
devices
Identification
of
between
purchased
volume
ESDS
(9)
and
:
and
of
device
utilization
3.
Definition
of
burden
costs
following
analysis
will
in this handbook is
be
part
a
broad
used
associated
of
a
difference
the
volume
Definition
process
control
static
organization's
2.
provided
STEP
the
.
Justifying
1.
of
class
ESDS
with
exercise.
devices
What
is
of
the
justification
components
and
determine
overview
.
ONE:
Identify
between
discrepancy
production
(9)
Obtain
contrast
static
the
sensitive
volume
purchased
and
actual
use
the
in
.
the
original
that
to
plan
actual
for
finished
production
goods
figures.
volume
If
and
actual
48
figures
production
volume.
The
reasons
problems
and
might
determine
less,
are
be
may
potential
for
reason
the
static
lower
related
include:
rework
parts
restricted
available
in-process
excessive
redesign
field problems
Determine
An
ESDCP
the
will
sensitivity
of
be
by
its
required
ESD
sensitivity
governed
protection
the
level.
information
most
There
(9)
chart
sensitive
are
three
5-A)
device
sources
.
and
for
:
Actual
sensitivity testing
Vendor
test
Generic
(see
the devices.
of
devices
information
device
sensitivity
Analysis
Reliability
listing
reference
Center,
Rome,
(IE.
NY.,
RAC
-
see
appendix)
(see
STEP
5-B,
TWO:
table
and
volume
unit
Document
1
.
The
to
2
.
The
and
cost
the
device
utilization,
including
location, requisitioning departments,
(9)
.
following information:
actual
support
unit
.
ESDS
Define
inventory levels
I)
number
the
cost
of
annual
of
each
each
ESDS
item
production
item
purchased
period
average
purchase
49
3.
The
4.
Location
5.
The
(see
STEP
table
Define
(9)
rework
by
to
and
the
cost
the
requisitioning
departments
who
-
.
burden
replace
power,
with
associated
costs
the
calculated.
the
and
deviant
(see
so
the
cost
devices
ESDS
and
burden
the
cost
chart
to
sum
of
III)
each
.
up
in
calculate
is
funds
of
to
all
of
labor
facility,
the
of
determined
cost,
actual
easiest
applied
is
the
cost
value
The
on.
units
5-D,
account
present
burden
total
into
item,
an
average
estimated
and
of
II)
inventory
of
storage
factor takes
estimated
cost
inventory
.
burden
lights,
level
devices
5-C,
required
inventory
identity
ESDS
assemblies
the
of
uses
THREE:
The
average
tied
items.
Once
and
then
the
material
item
can
be
the
multiplied
dollar
50
There
are
deviations do exist and
The ABC Analysis
Once
of
all
the
the
Potential
with
of
ESDCP has
static
the
control
The
point
is
the
that
ESD Loss
have been
largest
Also, the losses
of
deviations.
include ESDS devices.
calculations
value
an
-
inventory
identified.
for
reasons
many
has
completed
the
static
potential
can
be identified
been
established
been successfully
completed
smallest
by
and
(9).
portion
losses
can
department.
the
first
See
tables
be
The
phase
4-7.
Table 1
5-A
DEVICE UTILIZATION DATA FOR
ESD-SENSITIVE DEVICES USED IN
PRODUCTION
Item
ESDS'
*
(V)
1
60
500
2.000
5.000
2,500
200
1,100
1,500
4,200
6.000
2
3
4
S
6
7
8
9
10
ESDS:
Items/
Data
F/C
Source
test
vendor
RAC
10
vendor
RAC
test
test
RAC
RAC
,
ESD-sensitivity
Table 2
INITIAL REVIEW OF ITEM
NEEDS, INVENTORY, PURCHASES
ESDS
Units
Units
Item
ESDS*
Items/
Reqd/
Purch/
Unit
*
(V)
F/C
Year
Year
Cost
Invent
Each
2
4,700
10
2,000
4,000
6,000
10,000
1
1,000
2
6
2
2
2,000
4,000
6,000
2,000
2.000
J 10.60
$3.80
$2.25
$0.70
$1.10
$0.90
$1.40
$0.80
$0.40
$1.80
200
400
600
1,000
100
200
400
600
200
200
39
39,000
1
2
3
4
S
6
7
8
,2
10
|
60
500
2,000
5,000
2,500
200
1,100
1,500
4,200
6,000
4
6
4
Totals:
'ESDS:
Avg
7,200
8,000
12,000
1,400
4,600
6,300
8,800
2,600
2,300
57,900
3,900
AND USAGE
Deviations
Units
Cost x
Each
Units
Units
Units
Units
Req by
Mfg
Req by
Req by
Rework
Fid Svc
2,040
2,010
700
210
1,680
1,330
1,540
280
70
500
560
280
200
60
480
380
440
80
20
40,500
10,500
3,000
-2,500
($26,500)
2,250
1,750
-2,800
($10,640)
($3,150)
($700)
($330)
$2,160)
($2,660)
($1,760)
($160)
($180)
4,280
1,960
6,140
10,100
1,030
980
-1,400
-1,000
-300
-2,400
-1,900
-2,200
-400
-100
-15.000
($48,240)
2,240
'
4,190
6,220
ESD-sensitivity
Table 3
DEVICE DEVIATION WITH
BURDEN-LOSS ESTIMATE
Deviation
ESDS*
Item
*
T
2
3
4
5
6
7
8
9
10
'.
.
(V)
60
-2,500
500
2,000
5,000
2,500
200
1,100
1,500
4,200
6,000
-2,800
Totals:
ESDS:
Units
Each
-1,400
-1,000
-300
-2,400
-1,900
Cost x
Units
($26,500)
($10,640)
($3,150)
($700)
($330)
($2,160)
($2,660)
-2,200
($1,760)
-400
($160)
($180)
-100
-15,000
($48,240)
ESD-sensitivity
51
Estimated Lost Burden
@$ 14.S0
Material &
Each
Burden
($36,250)
($40,600)
($20,300)
($14,S00)
($4,350)
($34,800)
.
($62,750)
($51,240)
($23,450)
($15,200)
($4,680)
($36,960)
($30,210)
($27,550)
($31,900)
($5,800)
($1,450)
($33,660)
($5,960)
($217,500)
($265,740)
($1,630)
Table 6
1
PURCHASING ANALYSIS
Item
1
2
3
4
5
6
7
8
9
10
Totals:
'Includes
1
Units
Cost
Avg
Cost
Unit
Cost
Reqd/
to
of
Purch/
Year
Purch
Invent
Each
Invent
Year
$10.60
$3.80
$2.25
$0.70
$1.10
$0.90
$1.40
$0.80
$0.40
$1.80
2,000
4,000
6,000
10,000
1,000
2,000
4,000
6,000
2,000
$21,200
$15,200
$13,500
$7,000
2,000
$5,600
$4,800
$800
$3,600
200
400
600
1,000
100
200
400
600
200
200
$2,120
$1,520
S1.350
$700
$110
$180
$560
S480
$80
S360
7,200
8,000
12.000
1.400
4,600
6,300
8,800
2,600
2,300
39,000
$74,600
3.900
S/,460
57,900
$1,100
$1,800
Dercent of estimated units
lost
and percent ol
total
Units
4,700
dollars lost
52
Value
Unit
Purch
Deviations
Units
Cost x
Each
Units
of
$49,820
$27,360
$18,000
$8,400
$1,540
$4,140
$130,300
by
item
(S26,500)
($10,640)
($3,150)
($700)
($330)
($2,160)
($2,660)
-20.3%
-1.4%
-100
($1,760)
($160)
($180)
1 5,000
($48,240)
-37.0%
-2.500
-2,800
-1,400
-1,000
-300
-2,400
$8,820
$7,040
$1,040
$4,140
-1,900
-2,200
-400
-
Est % loss
of Total
ESDS Purch
-8.2%
-2.4%
-0.5%
-0.3%
-1.7%
-2.0%
-0.1%
-0.1%
Table 4
DATA SORT BY DEVIATION COST
Deviations
ESDS*
Item
(V)
Cost x
Units
Units
Each
($26,500)
($36,250)
($62,750)
16.7%
54.9%
Class A
($10,640)
($3,150)
18.7%
($2,660)
9.3%
12.7%
22.1%
6.5%
5.5%
Class B
($23,450)
-1,900
($40,600)
($20,300)
($27,550)
($51,240)
-1,400
($2,160)
($1,760)
($700)
($330)
($180)
($160)
($34,800)
($31,900)
($14,500)
($4,350)
($1,450)
($5,800)
60
-2.500
500
-2,800
2.000
1,100
6
8
200
-2,400
1,500
-2,200
4
5,000
-1,000
5
2,500
-300
10
6.000
-100
4,200
9
Totals:
ABC
% Material Loss
Est, lost Burden
Analysis
Material +
Cost
Units
Segment
Burden
Each
@$14.50
-400
-15,000
($30,210
($36,960)
($33,660)
($15,200)
($4,680)
($1,630)
($5,960)
($48,240) ($217,500) ($265,740)
16.0%
14.7%
6.7%
2.0%
0.7%
2.7%
4.5%
3.6%
1.5%
0.7%
0.4%
0.3%
(31.4%
of
loss)
Class C
(11.0%
of
loss)
100.0% 100.0%
ESD-sensitivity
ESDS:
Table 5
'
-
DATA SORT BY DEVIATION COST
Item
ESDS*
(V)
Deviations
Cost x
Units
Units
Each
($26,500)
($36,250)
($62,750)
16.7%
54.9%
Class A
($51,240)
18.7%
22.1%
($23,450)
9.3%
($30,210
12.7%
6.5%
5.5%
Class B
(31.4%
-1.900
($10,640)
($3,150)
($2,660)
($40,600)
($20,300)
($27,550)
200
-2,400
($2,160)
-2.200
($1,760)
($700)
($34,800)
($31,900)
($14,500)
($4,350)
($1,450)
($36,960)
1.500
($33,660)
($15,200)
($4,680)
($1,630)
16.0%
14.7%
6.7%
2.0%
3.6%
1.5%
0.7%
($5,800)
($5,960)
0.7%
2.7%
0.4%
0.3%
1
60
-2.500
2
3
7
500
2,000
1.100
-2.800
6
8
5.000
2.500
6,000
4.200
-1,000
4
5
10
9
Totals:
ESDS:
Est. Lost Burden
% Material loss
ABC
Material +
Analysis
Units
Cost
Burden
Segment
@$ 14.50
Each
-1,400
-300
-100
-400
-15.000
($330)
($180)
($160)
($48,240) ($217.5001 ($265,740)
ESD-sensitivity
53
of
loss)
4.5%
100.0% 100.0%
Class C
(11.0%
of
loss)
Table 7
INTERIM THROUGHOUT ANALYSIS REPORT
ESTIMATED ESD-LOSS SUMMARY
Estimated ESD-sensitive material losses:
Estimated ESD-sensitive-related burden loss:
$48,240
$217,500
Eslimated Total ESD Impact:
$265,740
ESD Loss Distribution
Based on ESDS Unit
Deviation by Class
Est
Burden
Costs
Est
Material
Costs
Class A
Class B
Class C
Totals:
Est
Total
Costs
$26,500
$16,450
$5,290
$36,250
$88,450
$92,800
$62,750
$104,900
$98,090
$48,240
$217,500
$265,740
ESD-Sensitive Device Purchasing Data
Required
Purchases
Units (ea):
Cost ($):
39,000
$74,600
Actual
Purchases
Avg
Invent
3,900
$7,400
57,900
$130,300
Notes:
1) Burden calculated as $14.50 per unit.
2) Areas requesting ESD-sensitive devices
Deviation
-15,000
($48,300)
and assemblies are:
Est % of
Deviation Use
Area
10.0%
70.0%
20.0%
Manufacturing
Rework Area
Field Service
54
%
Deviation
-25.9%
-37.1%
TUTORIAL
ESTIMATING ESD
HOW
LOSSES
LANGUAGE
AN EXERCISE
last
the
following
"How
THE
COMPLEX
OR
CONVINCE MANAGEMENT THAT THERE
TO
IN
In
IN
do
few
years
THEY
IS AN ESD-RELATED
PROBLEM
UNDERSTAND
FOR PACKAGING
packaging
ENVIRONMENT
PROFESSIONALS
engineers
had
have
face
the
affecting
the
to
question:
know
I
that
static
related
are
problems
operation?"
And
"How
do
I
define
the
impact
of
damage
to
the
satisfaction
of
management?"
The
_
following
available
dollars
so
in
a
tutorial
that
you
format
will
can
that
allow
you
to
effectively
management
will
information
the
organize
communicate
damage
the
in
understand.
You have identified the
following items as possible victims of ESD.
These items are part of the devices and subassemblies that are
manufactured
at
Organize
information
Item
1
Voltage
-
req'd
per
2
3
req'd
-
per
inventory
Item
4
req'd
-
Item 5
req'd
-
instructed in
1
used
unit
I-V.
2000
F/G,
$.90,
cost
100.
year,
Voltage sensitivity 12,500 V (RAC),
8800 purchased per year, unit
year,
600.
sensitivity 1200 V (test
6300 units purchased per
inventory 4 00.
year,
10
55
used
cost
info),
year,
Voltage sensitivity 3800 V (vendor info),
4600 units purchased per year,
year,
inventory 200.
per
average
using tables
class
sensitivity 100 V (vendor info) ,
2300 units purchased per year,
Voltage
per
average
as
sensitivity 1000 V (test info), 3 used F/G, 2000
2600 units purchased per year, unit cost
$.50,
inventory 200.
per
average
Item
facility.
Voltage
-
req'd
year,
inventory
average
Item
the
you
4
$.90,
used
unit
2
6000
average
F/G,
cost
used
unit
F/G,
F/G,
cost
4000
$1.50,
$1
2000
00,
56
Item 6
per
1400
year,
per
12,000 units
1000.
year,
8
-
average
Item 9
req'd
used
cost
1000
F/G,
$1.30,
req'd
average
(RAC),
per
purchased
year,
1
F/G,
used
unit
cost
10,000
$1.20,
req'd
average
sensitivity 2000 V (test info), 6 used F/G, 6000
cost
unit
$2.50,
8000
units purchased per year,
year,
600.
inventory
Voltage
sensitivity 1200 V (vendor info),
7200 units purchased per year,
inventory 400.
per
year,
2
used
unit
4000
F/G,
$3.90,
cost
sensitivity 40 V (vendor info), 2 used F/G, 2000
4700 units purchased per year, unit cost $12.50,
inventory 200.
10
req'd
Voltage
-
per
average
year,
Assignment #1
to table 1.
Assignment
Determine ESDS devices
-
#2
Perform
-
purchases
and
Determine
deviation
required
each
usage
year
initial
according
for
plus
each
the
used
of
review
to
item.
production
item
needs,
according
inventory,
II.
table
average
in
This is equal to the units
inventory minus units purchased
year.
Determine
units
8
unit
Voltage
-
average
each
(RAC),
year,
per
req'd
Item
per
purchased
sensitivity 5000 V
Voltage
-
inventory
Item
units
100.
inventory
Item 7
sensitivity 10,500 V
Voltage
-
deviation
multiplied
denote
dollars
This
cost.
the unit
by
is
cost
to
equal
Place
.
the
number
amounts
in
of
deviated
parenthesis
to
lost.
** *
Assignment #3
table
-
Determine deviation
Determine
per
Determine
estimated
units
los3
estimated
deviation
x
with
burden loss
estimate
using
III.
each
column
to
burden
by
$18.50
by
the
burden adding deviation
cost
multiplying
unit.
lost
material
estimated
loss
and
burden
column.
* * *
Assignment
#4
-
Using
table
IV sort
data
by
unit
deviation
material
57
from
cost
largest
% loss
Determine the
item is
the
of
Determine
item is
the
%
material
loss
total
amount.
smallest
total
the
of
to
material
deviation
Determine the ABC analysis
by finding
units
estimated
$
by finding
x
cost
each
what
percentage
each
units.
Generally,
segments.
percentage
what
$18.50.
@
burden
lost
the
(class
top 10%
80% of total ESDS dollar
listed account for 50
40% of
losses the next 30% (class B) account for approximately 20
total losses, and the remaining 60% (class C) account for less than
A)
of
items
the
-
-
10
-
20%
of
5
Assignment
item
is
%
%
Determine
each
item
expense
burden
the
ABC
units
estimated
and
total
table
IV
and
V
to
(from most
decreasing
by finding
lost
burden
material
analysis
by
sensitivity.
estimated
percentage
what
each
$18.50.
@
$ by finding
lost material
percentage
what
and
burden.
Top 10% represents ;lass
"B", and the remaining 60%
segments.
30% represents
class
"C".
class
see
how
dramatic
the
impact
of
burden
.
have
identified
contributing the largest
You
device
next
represents
Compare
of
the
the
material
V
Table
sensitive)
total
loss
is
Determine
"A",
loss
the
of
Rearrange
-
least
sensitive to
Determine
losses.
the
now
the
smallest
segment
of
portions
potential
of
the
static
inventory
losses.
CLASSIFICATION OF DEVICE SENSITIVITY
(DOD-STD-1686A)
CLASS
CLASS
CLASS
II
III
>
0
I
>
>
1000
TO
4000
<1000
V
V
TO <4000
TO
<
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100
58
V
V
15,000 V
(PROPOSED ADDITION)
CLASS
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63
Whether
is to
function
device
is
There
resides.
ESDCP.
At
the
Identification
an
ESDCP
program
ESDCP
the
sensitive
be
should
facility in
in
main
which
comprehensive
a
include:
should
devices
sensitive
of
to
components
several
least,
very
Protection
be
can
tailored
and
effective,
discharge
An
jeopardy.
in
(ESDCP)
Program's
electrostatic
an
placed
never
cost
that
sure
Control
ESD
the
complex,
make
(ESDS)
functional,
it
or
simple
ESDCP
AN
ESTABLISHING
devices
of
Grounding
Ionization
OF
IDENTIFICATION
A
ESDCP
successful
will
damage
foundation
determine
static
for
how
1.
The
.
the
in
Actual
devices is
one
of
DOD-HDBK-263,
though
the
a
of
or
best
knowing
its
will
(2)
device
other
method,
device
becomes
level
have to be.
process
are
how may volts
sensitivity
straightforward
ways
devices
which
(i.e.
sensitive
sensitive
most
program
three
testing
are
because
ESDCP
stringent
sensitive
accomplished
the
without
degree they
device)
a
exist
cannot
to what
and
sensitive
DEVICES
SENSITIVE
the
will
Identifying
which
can
:
sensitivity
standard
by DOD-STD-1686,
tests
it may be
(see
costly
appendix)
and
time
consuming
2.
Available
is
the
test
easiest,
data
but
on
may
similar
require
64
be
devices
-
this
substantiation
method
-
65
3.
devices
Generic
i.e.
-
reference
in
Center
Analysis
Reliability
the
listing
sensitivity
(see
NY
Rome,
appendix)
DEVICES
PROTECTION
OF
Sensitive
devices
and
manufacturing
the
at
beginning
While the
be
must
testing,
from
-
to
time
the
more
written
and
presented
can
understand
the
causes
everyone
the
so
the task
ESD
of
and
the procedures.
The
guidelines
countermeasures
to
employee
hand.
of
static
this
insure the
devices'
any
as
not
below)
safe
must
of
the
be
must
assembly
made
as
be
the
aware
of
role
of
Protection also includes
from
the
there
are
materials
generating
is
be
well
idea.
sensitive
level
should
control,
program.
ionization
(see
at
Employees
of
control
Sometimes
areas.
sensitive
personnel
more
methods
restriction
an
still
The
an
begins
program
devices.
that
at
involved in the
absolute
continue
stringent
is
device
is being established,
adequately trained to handle ESDS
device,
the
through
receiving,
ideal
The
shipping.
the
process
assembly
from
protected
possible,
that
but
can
be
taken
to
handling.
GROUNDING
Grounding is necessary
area
and
as
close
to
zero
handling devices,
humans
are
the
most
as
to
keep
the
possible.
grounding
common
of
source
potential
of
the
Besides grounding
personnel
of
static
work
work
station
stations
is imperative because
generation.
66
Personnel
the
stringent
common
that
form
are
damage
a
the
live
to
prime
sensitive
and
device.
Ankle
by
neutralize
the
operators
field
a
giving
can
effect.
any
charge
itself before it
leg
straps,
If
available.
by
heel
straps,
is
operator
how
most
human
A
devices.
or
sources
static
strap for
wrist
on
The
program.
control
discharge
depending
program
can
and
standing,
take place through conductive footwear and floormats.
is
people
currents
It
(one
protect
is
and
can
take
place
through
.
resistors
to
grounding
sitting,
(2)
stools
circuit.
verify
the
grounding is the
direct
also
limiting
grounding
in
are
to dissipate
a
operator
conductive
Current
are
can
grounding
to
very involved
a
proximity
by
place
damage
bootstraps
If
close
eliminates
generated
any
personnel
device
a
Grounding
do
procedures
of
in
be
can
grounding
also
to
megohm
them
from
important
insure
resistor)
shock
to
of
the
the
be
used
when
they
contact
system
often
should
check
compliance
must
grounding
a
to
system.
5no f
E
ilttnfi
ti-rioi
AMiqntni
Clin
AulomifC
Invito"
S~ Wv*
StorM
Storao*
IncOTHrtfl
Floo< Mai
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Floor Mai
Tib* Mti
Wrifl Sl'ap
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Bag,
Tote 601
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Sw Si'to
Bam
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fiint
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Anemo'v
Wrifl Si rap
Cotductrv* Foj
Turwt
ConduCIn* Foam
WlV
r*ntJ
Firul
Packaging t
Imoeciion
Snieoma
Grojrt
SokJ*f9
Floor Mai
Floor M1
Tabk Mat
Floor Mai
Floo. Mai
S>o< Sl'to
Bam
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Tabk Mai
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S><o< Si'ao
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Bagi
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Toie Bob
lonifcf
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lontfvf
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B"n
Rack!
Bm
Typical
Rackt
static problem areas and their solutions.
67
68
devices,
Handling
static
charge.
should
be
help
zero
be
kept
since
for
sensitive
parts
are
as
a
of
installed
work
station
levels
"Voltage
to
30%
of
devices
many
removed
(2)
.
from
That would
operators.
incoming
is
to
levels
the
to
anti-static
in
zap
is
Work
their
as
should
protective
can
equipment
PC
near
the
most
rework
failure
and
repeating
can
used
shipping
areas
lab
damage
whenever
and
sites:
analysis
should
and
inspection
packaging
area
threshold
25%)
be
of
damage
assembly
kitting
(auto/manual)
potential
that
packaging
include the following
inspection
soldering
below
voltage
(as low
stations
charge
cumulative,
final
wave
a
conveyors,
This
ESD-protected
an
single
voltage
keep
storage
insertion
of
belts which
build-up.
least
at
damage
ESD
below threshold
parts"
as
such
moving parts,
charge
build-up
and
be
should
clothing
generation
with
of
and
well.
voltage
25
application
equipment with
the possibility
part.
to
the
prevent
and
grounded
reducing
sensitive
be
grounded
function
The
Any
eliminate
should
to
enough
conductive
tablemats,
tabletops,
ESD-
ESDS
handled
by
IONIZATION
is
Ionization
holds
a
the
and
charge
neutralizing the
styles
environment
a
neutralize
can
be
cannot
By forming both
grounding.
(2)
operation
Ionization
grounded.
used
in
Ionizers
and
can
ions
there
are
an
three
in
with
ionizer
different
in
come
that
aid
also
conjunction
positive
and
negative
guns)
nozzles,
be
should
and
material
a
neutralizing
insulator.
charged
(blowers,
to
solution
only
methods
of
:
1.
Induction
2.
Radioactive
3.
High
voltage
INDUCTION
by induction
Ionization
When
placed
material
is
near
as
well
These
polarities.
charged
induce
to
tries
conductive
a
starts
as
with
material,
charge
a
grounded
on
grounded,
polarities
the
the
it
ionizes
neutralize
field
electrical
tinsel.
the
Since
the
tinsel.
cored
metal
charged
tinsel
the
air
the
of
with
both
material.
RADIOACTIVE
Ionization
Thus
Some
this
with
radioactive
method
radioactive
polarities
material
and
until
of
isotopes
ionization
materials
these particles
it
is
can
used
occur without
in
explosive
emit
charged
knock
loose
is balanced.
69
electricity.
environments.
particles
electron
from
of
a
both
charged
70
The
Commission
to
isotope is
radioactive
by license.
the
guarantee
The
of
control
is leased
equipment
the
Nuclear
S.
the U.
by
provided
replaced
and
hazardous
potentially
Regulatory
yearly
material.
HIGH VOLTAGE
High
ionization
voltage
static
comb
premise
(a
under
charge
static
is
free
having
surface
the
comb,
making
it
OF
RULES
As
needle
conductive
On
of
of
radius
that
approaches
sphere
it
concentrate
the
or
density
case
ionizes
a
charge
a
the
curvature
for
conductor,
sphere,
Charge
allowing
a
on
a
The
.
conductive
make
will
point.
and
a
radius
charge
least
the
sharp
flow.
the
the
of
self-repulsion
to
is
functions
points)
needle
of
series
a
with
this
which
evenly distributes.
a
bar
metal
to
signal
wave
square
a
with
starts
zero,
on
the
of
the
the
air,
dissipation.
charge
THUMB
*
Keep
*
Control
relative
reduces
peak
all
*
Work
*
Ground
static
sources
away
humidity
from
which
protected
may
not
areas
eliminate
but.
voltage
surfaces
should
personnel
not
in
triboelectrically
contact
or
in
close
charge
proximity
ESDS
*
Bond/ground
*
Keep floor
*
Personnel
*
Tools/test
any machinery that
surfaces
should
from
wear
equipment
generates
static
triboelectrically charging
anti-static
should
be
clothing
grounded
to
AUDITING AN ESDCP
An
between
cooperation
facility.
used
or
ESDCP
effective
to
Once
policy
has
been
methods
monitoring
Individuals involved
within
an
are
with the
functions
and
implemented,
are
complying
audit
organization
with
committee
such
an
as
(7)
audit
within
should
policy.
the
by
provided
and
coordination,
communication,
departments
the
all
that personnel
assure
department
requires
should
a
be
Auditing
DOD-STD-1686.
represent
each
:
Procurement
Design
Engineering
Reliability engineering
Quality
assurance
Manufacturing
Test/field
engineering
Packaging
ESD
operating
functions
in
a
procedures
facility.
can
These
apply
many
activities
Buying
Design
Inspection
Assembly
Rework/repair
Packaging
Storage
Transportation
Failure
to
Analysis
71
can
if
not
all
include (7)
of
:
the
72
An
ESDCP
audit
be
should
coverage
include
should
benches.
DOD-STD-1686
following
(7)
use
Program
protected
requires
program
and
monitoring
can
grounded
and
areas
should
certification
include
work
the
:
ESD
of
Personnel
Ionizing
The
ESD
of
the
of
aspect
every
periodically.
made
certification
The
cover
protective
grounding
systems
control
or
materials
systems
grounding
of
static
of
prime
for machinery
below the
level
of
sensitivity
of
ESDS
devices
The
absence
Grounding
ESD
of
tools
protective
Resistant
ESDCP
Design
audit
reviews
and
of
may
power
personnel
to
measurement
Effectiveness
An
static
ESD
safe
a
require
sources
equipment
apparel
assure
protection
areas/protective
formal
design
(during design/development
of
equipment
and
phase)
personnel
program
must
review.
include,
for
example :
Identification
of
ESD
documentation
Program
for
marking
review
of
ESDS
(designed
to
items
ESDS
production
example :
Precautionary
and
procedures
items
transition)
must
include,
73
ESD
awareness
Packaging
Problem
and
areas
training
labeling
and
of
proposed
ESDS
items
corrective
actions
STATIC CONTROL LAB
Ml-CKO
"...And this is
our
zeAo-
74
CHIP
CORP.
potential product
assembly
area.
CHAPTER
There
6
is
ultimate
factors
chain
to
contribute
device.
and
areas
two
practices
and
the
Though
grounding,
The
alone.
achievement
Packaging
of
handling
and
the
primary
for
every
and
ESD
and
delivery
and
is
achieved
elimination
of
static
are
prevent
ESD
really
damage
ESD.
are
of
by
a
safe
those
generators
possible.
not
also
many
by
provided
be
potential
protective
device to
a
cannot
key factors involved in controlling
ionization,
of
assembly,
protection
protection
total
an
manufacture
safe
zero
to
in
device
that
of
inception
from the
events
of
utilization
reliable
work
long
a
MATERIAL
PROTECTIVE
ESD
-
two
of
the
Grounding techniques,
materials
work
together
to
provide
contingency.
Selecting packaging
requirements
that
Mechanical
tear,
-
-
must
Transparency,
meet
consideration
such
puncture
(10)
resistance,
the many
:
abrasion,
tensile
strength,
attenuation,
rate,
as
of
triboelectrif ication,
resistivity
Corrosion,
chemical,
Performance
package
Decay
surface
Chemical
the
seal
Electrical-
involves the
material
outgassing,
contact)
,
requirements
compatibility
with
contaminates
biological
reactive
Durability,
-
the
product,
resistance
75
shelf
(ionic,
agents
life,
cleanability,
slough
76
The
focus
devices
ESDS
Remember,
fields
electrical
are
safe
materials
from
electrical
of
The
following
the
and
other
requirements.
electrical
on
in
two
of
one
triboelectrif ication
two basic type:
fields,
triboelectrif ication
damaged
are
from
and
been
has
handbook
this
of
type
one
type
from
ways:
ESD
Therefore,
.
the device
protects
protects
the
device from
.
questions
be
should
prior
answered
to
material
selection :
1.
How
sensitive
is
field effects,
2.
to
potentially harmful
Which
handling
material
are
the
5.
Are
the
clean
costs
plastics
conducting
with
entering
already
it may
in that
insulative.
electricity
and
are
materials.
cause
the
for
an
level
the
product?
with
the
environment
(i.
damage
of
to
a
e.
a
sensitive
environment?
are
highly
static
sources
They
prime
As
during
consistent
materials
product/package
where
the
and
package
product?
of
device?
occur
can
protection
the
are
other
the
of
value
room)
device
provide
device?
compatible
the
will
the
destroy
How
shock?
distribution?
the
How
Is
and
and
vibration,
events
of
4.
rubbed
take
What
projected
Most
it
does
ESD,
volts
sensitivity
6.
direct
triboelectrif ication,
to
product
many
product's
3.
the
insulators
resistant
to
they
are
when
they have high
surface
77
holding
resistivities,
achieve
must
add
offer
many
Some
desirable
the
of
important?
and
Conductivity
heat
anti-static
in
agents
one
1.
Topical
2.
Impregnation
3.
Metallization
To
reduce
2
To
increase
.
Topical
anti-stats
wiping,
brushing,
method
adding
hydrophilic
non-ionic
or
of
(on
the
surface
requirements
stated
toughened,
by
the
application
of
ways:
the
of
simple
surface)
the
volume
of
the
material)
friction
surface
dipping
anti-static
the
materials.
conductivity
approximately
on
plastics
surface
water-absorbing
groups
it
functions:
two
rolling,
for producing
involves
three
coefficient
are
enhanced
(throughout
serve
1.
be
can
of
the
other
is
etc.
application
Topical "anti-stats
Why
cleanability,
sealability,
cost,
material
a
in
by
to
possible,
plastics.
matched
not
listed
were
reasonable
of
and
materials
As flexible packaging materials,
attributes
availability,
insulative
necessary,
insulative
to
attributes
transparency,
above:
is
It
enhanced.
properties
conductive
necessary
be
essentially
To
generate.
they
charge
whatever
from
levels
performance
conductivity
to
on
surfaces
coatings
or
mopping.
properties
35%
of
anionic,
of
the
and
in
are
"The
commonest
synthetic
surfactant,
cationic,
material"
material
which
or
(6)
one
.
by
applied
is
of
a
the
78
While
by
they
decrease
can
their dependence on
thus
temporary,
surface
topical
humidity,
allowing
generation
static
anti-stats
to
material
a
and
resistivity
are
essentially
its
insulative
hygroscopic
consisting
to
return
state.
Topical
two
of
parts:
(e.
carrier
behind.
The
stats
to
are
the
not
subsequent
thus
Anti-stats
compounded
decreasing
that
can
into the
with
be 40
particle
carbon
to
is
When
hit
with
plastic
a
into
used
to
become
is then
is presently
charge,
Heat
they
to
causes
Some
anti-
moisture
attracting
as
increase
surface
the
a
Carbon
or
contaminant
The
will
vary
is distributed in the
is
method
to
the
tendency
sensitive
development
addressing the
conductive
powder
conductive-based material.
carbon
exposed.
been
have
material
Anti-static properties
this
a
a
processing.
how evenly the
and
of
moisture
layer.
moisture
Instead
during
often
disadvantage
processes
the
conductivity,
the volume.
and
off
of
anti-stat
the ability to charge triboelectrically.
plastics
of
size
flake
insulative
coating
55%
One
plastic.
The
-
loss
the
heat.
as
the
applied,
environmental
on
dissipated
impregnated
are
carbon-based material
It
dependent
increase
to
leaving
evaporates,
is
Once
anti-stat.
dependent.
humidity
surface
lubricity,
is
though,
energy,
and
evaporation
an
and
alcohol)
water,
anti-stat
Static
work.
carrier
a
g.
detergent-based and
are
anti-stats
carbon
for
devices.
of
better
the
charge
problem.
carries
79
the
along
must
charge
a
shield
is
heat
into
be
weakened,
(like
to
RFI
thus
These
ground.
EMI.
and
Also,
by
its
tear
decreasing
most
so
the
the
of
the
electrical
of
energy
do
materials
adding
to
material
dissipate
to
surfactants),
the
of
volume
insufficient
conducted
against
the
through
is
Resistance
ground.
energy
or
surface
a
provide
not
the material
carbon
and
resistance
puncture
resistance.
One
include
the
an
surface
off,
more
as
more
some
the anti-stat
to
films
which
migrates
to
migrate
the
on
surface
the
to
This
extruded.
are
to the surface,
anti-stat
is
conductive
more
foams
and
As the
conductive.
continues
insulator
an
rendering
anti-stat
suspends
method
of
method
other
making
surface
wears
replenishing
the
supply.
Laminating
a
metallized
of
conductivity
film
opaque
SURFACE
Surface
and
total
AND
(see
is
charges
ohms.
appendix
measuring
the
used
STATIC
is
a
over
D
structure
This
for
EMI
can
also
process
or
RFI
may
enhance
the
render
the
attenuation.
DECAY
material's
its
To measure
ASTM
a
material.
generally
resistivity
resistance
By
is
RESISTIVITY
electrostatic
use.
the
in
layer
257)
resistivity
surface.
surface
ability
The
unit
resistivity
dissipate
to
of
measure
ohms/square
for
is
.
of
a
material
to
the
flow
of
80
of
explanation
ESD
decay is
DOD
classified
free
FREE
Conductive
Conductive
the
quickest
decay
properties
section
that
charge
to
These
a
decay.
static
charged
material
specific
based
materials
decay.
shielding
of
of
on
level.
surface
classifications
Each
materials.
is
to
are
further
parts.
MATERIALS
material
105
with
a
classifies
and
are
ohms/sq
(MIL-P-82646
impregnated
have
which
at
materials
of
resistivities
also
static
an
.
will
263
into three
ELECTROSTATIC
or
level
and
electrostatic
seconds.
rate
Handbook
resistivity
1.
the
for
6-A
diagram
(See
conductivity-
materials
predetermined
The
its
ohms/square)
protective
Static
a
knows
one
electrons,
less
and
lists examples)
metal,
materials
or
defined
to
for
a
static
having
decay
rates
These materials
example.
dissipate
as
Conductive
charge.
are
surface
of
0.05
filled
materials
are
The
resistance of the aquare
dimension, feet, inch,
Is
constant, regardless of
yard. etc.
/
Two
5
+
5
=
Addition
Each
squares
side
by
side
become
a
series
connection:
10.
path carries
of a
third piece
only half the
provides
a second
current.
DIAGRAM
81
6 -A
(paraHel)
path.
82
Conductive
when
so
non-resistant,
materials
the
quickly
charge
2.
by
STATIC
a
charge,
Conductive
charge
allowing
depends
dissipated
can
on
materials
cause
to hit
it
to
the
allow
a
device
an
it
is exposed,
material
a
the
as
electrons
for
touches
it.)
drain.
material's
of
removal
MATERIAL
between
materials
105
and
109
defined
are
ohms/sq
and
as
having
static
decay
surface
of
rates
seconds.
Static
dissipative
conductive
sightly
preferred.
play
is
DISSIPATIVE
dissipative
resistivities
a
distribute
charge
beg
could
discharge
of
conductive
it
that
rapid
a
Charged-
the
on
product
conductive
That flow
if the
based
and
products
sensitive
grounding.
Static
0.2
be
very
damage
ESD
charged
will
resistivity.
electrical
shield
of
itself.
(Ironically,
Conductive
How
a
there
to neutralize
event.
may be
If
.
surface,
conductive
ESD
(CDM)
Model
attempts
to
used
is the possibility
there
Device
are
materials
and
materials
anti-static
but
slower,
(Keep in
in
protection
3.
ANTI-STATIC
Anti-static
of
a
materials.
safer
mind
are
rate.
that
devices)
all
welcome
Charge dissipation
Therefore,
three
between
compromise
these
materials
occurs
materials
have
a
role
.
MATERIALS
materials
have
surface
resistivities
between
at
are
to
83
109
and
1014
ohms/sq and
II
Type
B-81705C,
for hygroscopic
Materials with surface
insulative.
chart
6-B
Static
for
Anti-static
that
charges
are
materials
adequate
Anti-static
charged
The
conductive
Conductive
clean
the
for
material
off
room
materials
with
to
most
are
cannot
use
charged
is true
that
that
are
a
unless
of
any
purpose
anti-statics
loaded
contaminate
As
with
the
are
The
path
they
most
for
These
separating.
they
least
(See
surface.
conductive
charge.
a
applications,
serve
a
or
rubbing
considered
materials.
the
on
provides
dissipate
be
is
environment.
and
usually the
(This
and
layer
are
decay.)
static
and
during
materials
materials
apply to these
moisture
friction
slowest
materials
these
a
created
by induction.
reason
slough
have
1014
and
greater
MIL-
(see
seconds.
materials.)
antistatic
not
resistivity
reduces
protection
These
used.
surface
are
does
2
of
rates
resistivities
decay
plastics
layer
moisture
decay
static
provide
commonly
expensive.
they
are
isolated
conductive
that
are
carbon,
cannot
clean
material).
be
by
met
materials.
for example,
environment,
and
such
can
as
a
STATIC-FREE
CLASSIFICATION
CATEGORIES
RESISTIVITY
Polymer
Film
1014
or
Antistatic
109
-
Static Dissipative
10s
-
Conductive
Less
DISCHARGE
RATE
(SECONDS)
(OHMS/SQ)
Normal
STATIC
greater
NA
1014
Greater
than
2
109
Greater
than
0.2
than
CHART
84
10s
6-B
sec
sec
Greater than 0.05 sec
85
Anti-statics
charges
electric
materials
A
anti-static
Can
be
Resist
Depend
and
Do
lubricity
be
Are
everyday
fibers
static
develop
is
of
The
surface
add
are
hygroscopic
The
same
thing
could
rinsed
of
away!
handling,
be
base
the
lost,
generation
is
risked
separation
through
product
all
removes
so
Anti-static
be
will
charge
anti-static
resistances
attract
generation
charge
required
method
dryer
moisture
and
in
materials
problems
by
and
generated.
conditioners,
completely
all
influenced
laundry-
the
other
by humidity,
lubricity
may be
retreatment
example
with
prevent
be exposed,
will
solve
to
affected
their
or
aging
not
they:
contact
on
material
for
other
or
induction
by
triboelectrification
Should not
and
show
materials
charged
intimate
An
themselves
from
separation
upon
minimum
produce
and
.
of
review
triboelectrif ication
resist
moisture,
accomplished
conditioner
moisture,
high
agents,
a
is
that
via
soap-based
lessening
if the
and
large
synthetic
amounts
liquid
agent!
the
laundry
used
or
The
static
soap
of
sheet
agents
charge.
were
not
SHIELDING
MATERIALS
Shielding
materials
force
of
items
within
a
field,
the
materials
are
shielding,
EMI
must
have
are
so
surface
effect
of
the
the
field,
item
and
so
EMP/RFI
of
properties
and produce
its
free
(6)
.
do
reach
the
not
Shielding
ESD
parts:
These
materials
materials.
of
of
an
stored
or
function
of
selection
of
(See diagram
6-
attenuation
reach
not
Shielding is
(see DOD-HANDBOOK-2 63 for
resistivity,
the
three
capable
are
effects
damage"
in
lessening
them.
shielding.
static
materials
that
damage
classified
or
does
field
and
material
further
"Electrostatic shielding
contained
attenuating
shielding,
the
electrostatic
of
shielding
also
all
capable
proper
the
a
4
materials)
C)
(10)
1
.
Shielding is
.
10
or
less
ohms/square.
.
ESD
SHIELDING MATERIALS
ESD shielding materials have a
resistivity
of
attenuating
all
less
of
than
an
1
x
104
conductive
ohms/square
electrostatic
field.
86
layer
and
with
are
a
surface
capable
of
SHIELDING
ESD
Those
field,
Items
and
shall
than
10
that
so
1
are
which
materials
its
of
capable
effects
do
attKen^ati^nrapnde^C^^^5
gained
or
the
stored
reach
not
material
gelding
An electrostatic
damage.
less
of:
surface
resistivity
a
with
layer
conductive
less
of
than
resistivity
volume
produce
have
10
x
a
ohms/square,
or
a
ohms-cm.
EMI
Those
materials
electromagnetic
read
items
or
25%
of
field,
the
capable
are
which
so
that
is
field
SHIELDING
pulse
50 GHz
at
excluded
an
a
attenuating
attenuation
from the
stored
of
or
d^am^
25 db
is
contained
.
EMP/RFI
Those
of
materials
or
radio
which
are
frequency
capable
SHIELDING
of
attenuating an
interference
TABLE
6-C
field
in
any
electromagnetic
magnitude.
2.
EMI
EMI
SHIELDING MATERIALS
is
shielding
electromagnetic
3.
field
(where
50
25%
attenuating
of
capable
GHZ
db is
25
of
(EMP)
or
.
SHIELDING MATERIALS
EMP/RFI
EMP/RFI shielding is capable of attenuating
pulse
read)
dynamic
a
of
field
(RFI)
interference
frequency
radio
electromagnetic
an
in
any
magnitude.
Remember
two
the
main
triboelectrification
Conductive
and
device
"cage"
cage
be
must
is
charge
shield
a
the
of
will
but
material
a
keep
removed
station
A
be
not
in
mind
unless
It
that
in
will
the
is
a
whatever
swept
inside
a
complete
sensitive
The
material.
bag.
is
"cage"
because
the
surface
across
inside
necessary to
even
of
of
with
a
the
means
conductive
Whatever
is
induction
"cage"
be quickly
not
presence
That
metallized
penetrate
dissipated.
damaged.
with
field.
deal
materials
used.
charge:
static
a
electrostatic
an
conductive
conductive
is induced
and
be
must
by
surrounded
that
by
To adequately deal
An electrostatic field cannot
any
generating
anti-static
or
normally
of
induction
and
triboelectrification.
conductive
methods
the
completely
the
material
ground
"cage"
static
a
"cage"
cannot
free
be
work
.
Faraday
Cage
is
an
electrostatic
88
shield.
While
it
should
89
the
surround
of
continuous
electrically
pattern
EMI
or
shielding,
holes
unbroken
material
The
continuous.
instead
shielding
it is to protect,
object
(less
in the
of
on
than
10
shield
other
surface
hand,
ohms/sq)
(2)
.
long
as
conductive
covering the
the
it does
and
not
as
the
material
completely
requires
cannot
have
to
be
made
material
form
can
a
is
grid
-
highly
tolerate
conductive
large
spaces
CHAPTER
7
3
Chapter
presented
insulative
others
The
how
than
conductive
a
less
materials,
some
one
,
one.
relative
a
(chart 3-A)
The
charge.
static
is
insulativity
or
conductivity
to
relate
they
and
materials
conductive
on
to the triboelectric series
According
more
discussion
and
MATERIALS
PROTECTIVE
ESD
a
materials
of
concept
be
EVALUATING
-
material
can
conductive
than
devices
must
.
flexible
protect
those
fields.
In
it
qualify,
from
devices
for
order
be
must
to
used
materials
A
tested.
three
1.
Chemical
Analysis
2.
Mechanical
Analysis
3.
Electrical
Properties
of
the
scope
the
electrical
three
of
presented
this
abridged
in the
CHEMICAL
ANALYSIS
Chemical
analysis
In
electrostatic
and
shielding
primary
material
evaluation
to
of
:
Analysis
a
to
order
and
and
by
90
detailed
on
the
the
represent
mechanical
simplified
represented
long
center
will
chemical
following
is
(10)
represents
handbook
properties.
an
spectrum,
stages
complete,
stages
of
Each
or
static-free
a
sensitive
generation
charge
consists
materials
protect
analysis.
analysis
test
entire
analysis
will
terms.
the
following
tests
(10)
of
:
be
91
Solderability
Ion Analysis
Free
Corrosion
Corrosion
Contact
The
of
the
plus
to
chemical
of
essence
and
material
a
corrode,
the device.
new
whole
MECHANICAL
ANALYSIS
Mechanical
analysis
is
ascertain
If the
of
series
material
solder
with
problems
creates
additives)
is to
analysis
problems
represented
by
the
or
must
the compatibility
(a
complex
causes
the
be dealt
following
polymer
device
with.
tests
(1)
:
Tear
Puncture
Abrasion
Tensile
Elongation
Heat
Sealability
WVTR
If the material
used
characteristics,
puncture
yields
a
resistance
bag
poor
protecting
a
to protect
new
can
from
of
is
that
seals,
device
set
device has inappropriate
a
problems
too
disable
other
low,
a
or
will
heat
package
threats.
arise.
physical
Tear
sealability
and
prevent
it
and
that
from
ELECTRICAL
To
ANALYSIS
best
represent
electrical
be
separated
by
will
FOR ANALYSIS
Each
free
static
mentioned:
the
OF
Surface
2.
Static
3.
Triboelectrification
Resistivity
Decay
ASTM-D-257
-
FOR ANALYSIS
OF
1.
Surface
Resistivity
2.
Static
3.
Triboelectrification
4.
Capacitance
5.
EMI
Attenuation
test
and
performance
SHIELDING MATERIALS
Decay
-
-
INCLUDE:
ASTM-D-257
-
Method
FED-STD-101C,
Probe
Test
Faraday Cup
-
4046
Method
FED-STD-101C,
-
previously
INCLUDE:
MATERIALS
1.
materials
properties.
shielding
STATIC FREE
protective
characteristics
performance
and
ESD
analysis,
Test
EIA
Test
Faraday Cup
-
541
EIA
-
4046
541
standard
is
included in the
appendix.
QUANTUM ANALYSIS
Quantum
occurs
the
analysis
once
a
level
has been tested
scrutiny.
and
mechanical
for
a
specific
Keep
protecting the device
of
and
How
will
may
of
material
testing has been
analyzed,
this in mind:
properties
use.
level
secondary
the primary
material
deeper
is
knowing
be
not
critical
a
enough
role
determine how
92
it
must
completed.
be
to qualify
Once
to
chemical,
a
packaging
analysis
that
subjected
electrical,
the
much
testing
is
material
plays
in
required.
93
Quantum analysis
to the type
regard
lifetime.
between
chemical
Quantum
analysis
determine
changes
the
that
information
over
properties
could
time.
The
be
levels
would
be
studies
chemical
and
shock
yield
would
testing.
of
to
temperature
of
of
electrical
retested.
by
affected
adversely
storage.
any
testing,
solderability,
properties
relationships
record
abuse
in
in its
see
term
influence
physical
primary
the
weathering
and
acclerated
by
analysis,
physical
aging
secnarios
could
long
and
term
with
provided
are
accelerated
the
and
coupled
not
fundamental
these
occur
corrosion
addition,
long
of
humidity
all
vibration,
and
could
relative
and
include
would
effects
interest
life,
shelf
change,
case
worst
material
a
abuse
of
particular
of
to
material
degree
and
is
What
the
subjects
In
analysis,
Any
one
of
accelerated
testing.
Quantum
is
analysis
professional
packaging
would
in-depth testing is
more
be
professional
the
sensitive
right
device.
type
responsible
know
must
called
information that is
making
the
not
for
made
material
for
what
by
the
and
a
completing.
to
ask
needs
available,
choice
testing
of
the
of
packaging
But,
supplier
the
successfully
if
for
product.
the better the
the
chances
The
for
packaging
a
GLOSSARY
Alpha particle
two
that
neutrons
Ampere
(amp
-
or
is
6.24
A
1018
x
protons
and
molecules.
air
coulomb/second)
two
with
particle
charged
ionize
can
current
of
ampere
A positively
-
electrons
in
point
one
passing
One
current.
electrical
of
unit
a
second.
Anti-static
to
1014
more
Material
-
than
slowly
Bipolar
Device
Bonding
-
either
A
-
a
Capacitor/Capacitance
is
-
Charge
Measured
-
by
measured
charge)
(positive
A
-
of
number
charge)
Component
to
is
voltage
Current
period
the
-
of
electrons
it
is usually
per
second
Device
-
component
A
=
per
body
a
on
is
(negative
body
the
on
not
electrons
of
device
body
points.
failure
allows
it
current
a
it
through
or
Less
than
resulting
10s
of
when
.a
ohms/sq.
from
multiple
events.
electrons
second,
that
along
past
Measured in amperes.
stated
one
A
-
related
flow
time.
of
farad
picofarads
or
charge
static
material
continuously
across any two
Failure
to
exposures
A
-
travel
ESD
a
device.
semiconductor
applied
Cumulative
and
store
Since
used.
commonly
separated
to
material
.
Conductor/Conductive
electrons
grounded.
(millionths)
The
coulombs.
semiconductor.
the number of separated electrons on the
the
,
in
more
charges
off
materials.
in farads.
measured
microfarads
are
a
of
ability
Capacitance is
charge.
large number,
very
(millionths of millionths)
a
is
that
conductor
The
dissipative
sensitive
power
or
bleed
materials
or
conductive
current
Connected to
electric
Antistatic
square.
per
ohms
109
between
resistance
surface
exhibiting a
but
in terms
since
of
point
certain
a
is
Current
the
would
number
coulombs
per
in
a
measured
second.
be
specific
in terms
too
One
large,
coulomb
ampere.
package
of
electronic
.
94
circuitry;
a
semiconductor
or
a
95
Breakdown
Dielectric
where,
become
electrons
current
DIP
the
the
through
travel
medium
bound
medium,
a
as
medium
.
Usually
of
per
optimal
Overstress
dielectric
layer
or
Electromagnetic
(EOS)
prime
or
person
fast
too
neither
rate,
charged
exhibiting surface
Dissipative materials
square.
nor
May
-
junction
105
of
bleed
charge
off
1010
to
resistance
at
an
in
resulting
within
melt
a
puncture
a
of
a
device.
the
field
from
ESD
an
with
out
Electromagnetic
-
shield
circuits.
slow.
start
source
static
small
too
integrated
pins.
of
rows
Material
-
Electrical
two
with
for
housing
A
Package.
plastic
molded
Dissipative
ohms
dielectric
a
across
strength
and
in
effect
threshold
field
unbound
Duel-in-line
-
A
-
electric
some
at
from
results
a
field.
rapidly moving electric field and its associated
The shield is a housing placed around devices or circuits to
the effect of both electric and magnetic fields.
reduce
electrical
charge
magnetic
Electron
equal
to
-
A negatively
Electrostatic
which
1.6
about
Field
another
Shield
an
effects
of
good
Electromagnetic
lightning,
in
Protection
signals
special
not
or
air
radio
from
circuit
EMI
that
charged
and
between
prevents
offer
much
the
two
.
points
penetration
protection
(EMI)
in
object
experience
against
EMI
a
at
of
the
shields,
shields.
(EMI)
-
Sources
are
static
sparks,
etc.
transmissions,
By line
EMI can induce undesirable voltage
causing malfunction and/or damage.
tv
and
propagation,
electronic
gradient
interference
Interference
radar,
the
electrostatic
equipment
the
requires
use
of
shields,
filters,
and
design.
Electrostatic Discharge
two
May
electromagnetic
are
conduction
is
electrically
be induced
can
A barrier
field.
electrostatic
however,
-
an
charge
it
force.
Quantitatively,
different potentials.
Electrostatic
coulomb.
Surrounds
-
electrical
an
with
particle
charged
1019
x
(ESD)
-
A
sudden
transfer of charge between
objects.
Describes devices
Sensitive
(ESDS)
damage from electrostatic discharge
ESD
-
that
are
vulnerable
to
-
Faraday
which
Cage
-
provides
An
electrically
electrostatic
continuous,
shielding.
conductive
enclosure
96
Ground
A
-
or
potential
water
a
of
voltage
Insulator
A
-
ground,
or
to
earth
ground
any large
does
that
material
to
respect
with
power
any
building.
pipes,
the
with
connection
metallic
or
member
A
electricity.
conduct
not
Includes
structural
metal
zero
establish
earth.
nonconductor.
Integrated
Circuit
(IC)
transistors,
resistors,
Ionization
The process
as
-
a
acquires
air,
etc.
capacitors,
by
or
in
a
includes
which
package.
single
atom
neutral
a
which
positive
device
electronic
Any
-
or
such
molecule,
charge.
negative
unit of energy.
The energy of a static discharge is 1/2
voltage
C
capacitance or the discharging object and V
difference between the discharging object and the point to which it
discharged.
Joule
CV2
A
-
Latent
=
=
where
Failure
been previously
MOS
Device
A
-
Failure that occurs
and degraded
-
when
by
weakened
device
is
having
a
using
ESD
a
device that has
exposure.
metal-oxide
layer
semiconductor
be
damaged by a static discharge or by induction from an electrostatic
field.
Damage occurs as dielectric breakdown when the voltage or
electric field across the dielectric layer between two relatively
conductive layers exceeds the dielectric strength of that material.
structure
Ohm
one
A
-
a
to
unit
ampere
Package
wrap,
of
will
The
-
pouch,
perform
1
voltage-
which
one
electrical
flow
enclosure
bag,
or
2.
more
3.
of
of
electric-field
voltage
of
one
or
magazine,
the following
and
which
volt
devices,
products,
other
or
is
a
can
current
ci
applied
other
packages
in
form so
as
container
functions:
transportation,
of
protection
and
sensitive
through
resistance
for handling,
Preservation
life
of
slide,
Containment
.
a
when
or
the
and
use
contents
for
the
item
the
Identification
of
including quantity
contents,
and
manufacturer
4.
Facilitation
Packaging
process
such
as
-
of
In
circuits
printed
during
external
onto
connections
use
of
the
contents.
packaging refers to the
protecting various devices,
and
film
thin
fabrication.
elements
and
industry,
connecting,
easy-to-handle
convenient
dispensing
electronics
location,
interconnected
into
the
of
The
called
to
be
wafers
circuits
packages
made
to
it.
electrically
are
then
which
place
permit
97
Potential
from
in
Measured
-
base
a
point
Radio
-
includes
electronic
or
electrical
the
is
discharge
static
Resistance
through
a
bulk
a
resistance,
flow)
by
is the
resistance
Resistivity
a
-
conduct
current
unit
volume
of
Surface
a
of
measure
the
of
independent
the
where
usually
spark
from
a
measurement
The
is the
on
the
temperature,
and
depends
and
current
(electron
of
unit
practical
ohm.
Resistivity
materials
of
difficulty in passing
The
material
voltage.
given
of
resistivity is
across
passes
a
range
The
electrical
produced
operation
proper
resistivity,
dimensions,
Resistance of a material determines the
voltage.
being
of
capable
frequency
conductor.
or
property
material's
electromagnetic
of
spectrum.
encounters
current
circuit
electrical
an
work.
of RFI.
source
Electrical
-
The
electromagnetic
entire
the
do
to
able
signal
.
equipment.
is usually ground,
form
A
frequency interference.
interference
(EMI)
Any electrical
of
propagated
and
interfering with
RFI
is
Measured
kilovolts.
but
voltage
energy that
Stored
zero.
theoretically
be any
can
or
volts,
millivolts,
which
intrinsic ability of
the dimensions of the
current
The
ohm-cm.
The ratio
-
surface
to
material
a
material.
of
DC voltage
the
of
to the
is
conduction
current
that
for
Relevant
system.
only
on
only
virtually
the
Surface resistivity is not relevant for volume conductive
The unit of surface resistivity is ohms/ square.
materials.
surface.
Triboelectric
rubbing
-
Triboelectric
of
them
An
can
charge
electrical
series
two
of
separation
or
-
A
list
become positively
of
substances
charged
down the list, or negatively charged
The further apart the
up the list.
charge
generated.
Volt
(V)
-
the
One volt will
one
unit
send
This
of
a
voltage,
when
when
rubbed
a
firctional
one
with
with
the
so
that
any
further
one further
greater the
one
guide.
potential,
of
arranged
rubbed
substances,
is only
series
current
by
generated
surfaces.
ampere
and
electromotive
through
a
force.
resistance
of
ohm.
Volume
The ratio of DC voltage per unit of thickness,
two electodes in contact with or embedded in a
the amount of current per unit area passing through
Resistitivy
applied
-
across
specimen, to
the system.
Generally
geven
in
ohm-cm.
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1986,
"Static
H.,
Update,"
Safety
ESD
March
Engineering,
Evaluation
in
Mechanisms
ESD-Induced
of
Renaud,
90
1988,
-75.
Reich,
pp
in ESD
Deficiencies
December
Engineering,
"Failure Analysis
Circuits,"
Integrated
66
Evaluation
Alarming
Shows
"Study
95.
-
Raymond,
pp
J.,
Different
Technology,
R.,
and
D.
Materials'
February 1987,
pp
L.
Hart,
"Buried
Effectiveness,"
23
-27.
Shielding:
EOS/ESD
103
Chemelli,
Unger,
B.,
System
for Electrostatic
Communications
100
-
and
Ionization
"A Room
Control,"
A
Bell
Document.
Evolution
for
Performing ESD Control
June 1988,
Engineering,
M., "Protective Packaging for Electronics:
Packaging, April 1984, pp 50-54.
James
What's
Ahead?,"
Wynes,
T.,
Modern
Plastics
and
Antony Castro,
Encyclopedia,
"Antistatic
1975
James R. Huntsman,
Military Specification MIL-B-81705:
Simple Model for Static Protection,
Systems/3M Document.
D.
Dust
108.
Weatherall,
Yenni,
Bossard,
Peter
"Guidelines
Evaluations,"
Program
and
Charge
Research Inc.
Spyros A.,
Vrachnas,
pp
R.,
M.
Yenni,
D.
Prevention,"
M.
and
James
A
R.
"The
Deficiencies
Considerations
"
Huntsman,
Static
Reprint
-1976.
and
Damage
Agents,"
Control
Static
"Quality
in
and
a
Control
Through
Static
Systems/3M Document.
form
APPENDICES
A
body
of
literature
phenomena
as
they
substantial
electrostatic
packaging exists,
EIA
Standard
Sensitive
and
is
relate
regarding
to protective
incorporated herein by
reference.
Packaging Material Standards for ESD
(EIA-541) , (Washington, DC, Electronic
541:
Items
Industries Association),
MIL-STD-1686C
1988.
Department
of
Defense
Standard
Practice
Electrostatic Discharge Control Program for Protection
Electrical
and
Electronic
(Excluding Electrically
MIL-HDBK-2 63A
Handbook
for
Military
Protection
Assembles
and
Explosive
Devices)
MIL-B-81705C
Flexible,
Parts,
Assemblies
Initiated
Handbook
of
Explosive
-
and
and
(Excluding Electrically
1991.
(Metric)
Military
Electrostatic
.
1995,
Discharge
Electronic
Equipment
of
Equipment
Devices)
Electrostatic
Electrical
-
Parts,
Initiated
.
Specification
Protective,
104
-
Barrier
Heat
Materials,
Sealable.
1989.