TDA7269SA
10W+10W STEREO AMPLIFIER WITH MUTE & ST-BY
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FEATURES
Figure 1. Package
WIDE SUPPLY VOLTAGE RANGE UP TO
+20V
SPLIT SUPPLY
10+10W @THD = 10%, RL= 8Ω, VS = ±14V
Clipwatt11
NO POP AT TURN-ON/OFF
MUTE (POP FREE)
STAND-BY FEATURE (LOW Iq)
Table 1. Order Codes
SHORT CIRCUIT PROTECTION TO GND
THERMAL OVERLOAD PROTECTION
CLIPWATT 11 PACKAGE
)
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1µF
MUTE/
ST-BY
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IN (L)
1µF
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+5V
15K
18K
GND
)
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The TDA7269SA is pin to pin compatible with
TDA7269, TDA7269A, TDA7269ASA, TDA7265,
TDA7499, TDA7499SA.
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+VS
1000µF
3
5
7
Clipwatt11
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The TDA7269SA is class AB power amplifier assembled in the @ Clipwatt 11 package, specially de-
15K
Package
TDA7269SA
signed for high quality sound application as Hi-Fi
music centers and stereo TV sets.
DESCRIPTION
Figure 2. Block Diagram
Part Number
+
4
OUT (L)
8
IN- (L)
-
18K
4.7Ω
RL (L)
100nF
560Ω
9
µP
10
IN- (R)
560Ω
18K
1µF
IN (R)
11
-
2
+
1
6
-VS
OUT (R)
4.7Ω
RL (R)
100nF
1000µF
D94AU085
September 2004
Rev. 2
1/11
TDA7269SA
Table 2. Absolute Maximum Ratings
Symbol
Parameter
VS
DC Supply Voltage
IO
Output Power Current (internally limited)
Value
Unit
±22
V
3
A
20
W
Ptot
Total Power Dissipation (Tamb = 70°C)
Tamb
Ambient Operating Temperature (1)
0 to 70
°C
Tstg, Tj
Storage and Junction Temperature
-40 to 150
°C
Figure 3. Pin Connection (Top view)
11
IN+(1)
10
IN-(1)
9
GND
8
IN-(2)
7
IN+(2)
6
-VS
5
MUTE
4
OUTPUT(2)
3
+VS
2
OUTPUT(1)
1
-VS
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D03AU1506
Table 3. Thermal Data
Symbol
Parameter
Rth j-case
Thermal Resistance Junction-case Max.
Rth j-amb
Thermal Resistance Junction-ambient
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Figure 4. Single Supply Application
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R1
10K
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C1
1µF
PLAY
5V
0
MUTE
C2
100µF
C5
1000µF
MUTE
IN (L)
7
+
4
OUT (L)
8
IN- (L)
2
IN- (R)
-
9
C4 1µF
IN (R)
11
Value
Unit
3.9
°C/W
48
°C/W
C6
0.1µF
3
5
C3 1µF
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+VS
D1 5.1V
R3
15K
Q1
BSX33
R2
15K
(t s)
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C9 470µF
R4
30K
R5
1K
+
R8
4.7Ω
C7
0.1µF
OUT
(L)
C10 470µF
10
1
6
GND
OUT (R)
R6
30K
R7
1K
R9
4.7Ω
C8
0.1µF
D96AU444A
2/11
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OUT
(R)
TDA7269SA
Table 4. ELECTRICAL CHARACTERISTCS
(Refer to the test circuit VS = ±14V; RL = 8Ω; RS = 50Ω; GV = 30dB, f = 1KHz; Tamb = 25°C, unless otherwise
specified)
Symbol
Parameter
VS
Supply Voltage Range
Iq
Total Quiescent Current
VOS
Test Condition
Min.
RL = 8Ω;
RL = 4Ω;
±5
±5
60
Input Offset Voltage
-25
Ib
Non Inverting Input Bias Current
PO
Output Power
THD
Open Loop Voltage Gain
eN
Input Resistance
Ri
SVR
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Supply Voltage Rejection
(each channel)
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25
mV
RL = 8Ω; PO = 1W; f = 1KHz;
0.03
)
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0.7
0.02
%
%
%
1
%
50
70
60
dB
dB
6.5
10
V/µs
80
dB
A Curve
f = 20Hz to 22KHz
3
4
15
f = 100Hz; VR = 0.5V
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Tj
mA
7.5
7.5
(s)
ct
Total Output Noise
100
THD = 1%;
RL = 8Ω;
VS = ±12.5V; RL = 4Ω;
f = 1KHz;
f = 10KHz;
GOL
V
V
W
W
RL = 4Ω; VS = ±10V;
PO = 0.1 to 5W;
f = 100Hz to 15KHz;
Slew Rate
±20
±15
10
10
8
7.5
RL = 4Ω; PO = 1W; f = 1KHz;
SR
Unit
nA
RL = 8Ω; PO = 0.1 to 5W;
f = 100Hz to 15KHz;
Cross Talk
Max.
500
THD = 10%;
RL = 8Ω;
VS = ±12.5V; RL = 4Ω;
Total Harmonic Distortion
CT
Typ.
Thermal Shut-down Junction
Temperature
8
µV
µV
20
KΩ
60
dB
145
°C
MUTE FUNCTION [ref +VS] (*)
VMUTE
Mute /Play threshold
-7
-6
AMUTE
Mute Attenuation
60
70
-3.5
-2.5
-5
V
dB
STAND-BY FUNCTIONS [ref: +VS] (only for Split Supply)
VST-BY
Stand-by Mute threshold
AST-BY
Stand-by Attenuation
IqST-BY
Quiescent Current @ Stand-by
-1.5
110
3
V
dB
6
mA
(*) In mute condition the current drawn from Pin 5 must be ≤650µA
3/11
TDA7269SA
3
MUTE STAND-BY FUNCTION
The pin 5 (MUTE/STAND-BY) controls the amplifier status by two different thresholds, referred to +VS.
– When Vpin5 higher than = +VS -2.5V the amplifier is in Stand-by mode and the final stage generators
are off.
– When Vpin5 between = +VS -2.5V and VS -6V the final stage current generators are switched on and
the amplifier is in mute mode.
– When Vpin5 lower than = +VS -6V the amplifier is play mode.
Figure 5.
+VS
(V)
20
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-VS
-20
VIN
(mV)
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Vpin5
(V)
VS
VS-2.5
VS-6
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VS-10
Iq
(mA)
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0
VOUT
(V)
OFF
PLAY
STDBY
PLAY
OFF
STDBY
STDBY
MUTE
4/11
D94AU086
MUTE
MUTE
MUTE
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TDA7269SA
Figure 6. Test and Application Circuit (Stereo Configuration)
+VS
R2
C3
Q1
R1
7
+
C1
R4
4
OUT (L)
8
IN- (L)
-
R3
GND
C5
3
5
IN (L)
SW1
ST-BY DZ
C4
+VS
MUTE/
ST-BY
R5
R7
RL (L)
C8
R6
9
SW2
MUTE
10
R9
IN- (R)
R8
C2
IN (R)
-
11
2
OUT (R)
+
1
R10
6
-VS
C7
RL (R)
C9
C6
D94AU087B
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APPLICATION SUGGESTIONS
4.1 (Demo Board Schematic)
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The recommended values of the external components are those shown the demoboard schematic different values can be used, the following table can help the designer
Table 5. .
COMPONENT
SUGGESTION
VALUE
R1
10KΩ
Mute Circuit
R2
15KΩ
Mute Circuit
R3
18KΩ
PURPOSE
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LARGER THAN
RECOMMENDED VALUE
SMALLER THAN
RECOMMENDED VALUE
Increase of Dz Biasing
Current
Vpin #5 Shifted Downward
Vpin #5 Shifted Upward
Mute Circuit
Vpin #5 Shifted Upward
Vpin #5 Shifted Downward
Mute Circuit
Vpin #5 Shifted Upward
Vpin #5 Shifted Downward
Closed Loop Gain
Setting (*)
Increase of Gain
Danger of Oscillations
od
R6, R9
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R7, R10
4.7Ω
Frequency Stability
C1, C2
1µF
Input DC Decoupling
C3
1µF
St-By/Mute Time
Constant
C4, C6
1000µF
Supply Voltage Bypass
Danger of Oscillations
C5, C7
0.1µF
Supply Voltage Bypass
Danger of Oscillations
C8, C9
0.1µF
Frequency Stability
Dz
5.1V
Mute Circuit
R4
R5, R8
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15KΩ
18KΩ
560Ω
Decrease of Gain
Danger of Oscillations
Higher Low Frequency Cutoff
Larger On/Off Time
Smaller On/Off Time
(*) Closed loop gain has to be ≥25dB
5/11
TDA7269SA
4.2 PC Board
Figure 7. LC
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Figure 8. LS
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Figure 9. Component Layout
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6/11
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TDA7269SA
5
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (Pdmax)
– Max thermal resistance Junction to case (R Th j-c)
– Max. ambient temperature Tamb max
– Quiescent current Iq (mA)
5.1 Example:
VCC = ±14V, Rload = 8ohm, RTh j-c = 3.9 °C/W , Tamb max = 50°C
2
2V cc
Pdmax = (N° channels) · -------------------------- + I q ⋅ V c c
2
Π ⋅ R lo ad
Pdmax = 2 · ( 4.96 ) + 0.84 = 10.7 W
150 – T am b max
150 – 50
(Heat Sinker) R Th c-a = ----------------------------------------- – R T h j-c = ---------------------- – 3.9 = 5.4°C/W
10.7
P d max
In figure 7 is shown the Power derating curve for the device.
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Figure 10. Power derating curve
25
20
Pd (W)
15
10
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(t s)
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(a)
a)
(b)
Infinite Heatsink
b)
5.0 °C/ W
c)
7.0 °C/ W
(c)
5
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0
40
80
120
160
Tamb (°C)
7/11
TDA7269SA
6
CLIPWATT ASSEMBLING SUGGESTIONS
The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much
as possible in the plastic body center, as indicated in the example of figure 11.
A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink.
A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum
contact pressure of 15 Kg/mm2 between it and the plastic body case.
As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2
at least.
Figure 11. Example of right placement of the clip
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TDA7269SA
Figure 12. Clipwat11 Mechanical Data & Package Dimensions
mm
inch
DIM.
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
3.2
0.126
B
1.05
0.041
C
0.15
0.006
D
1.5
0.059
E
0.49
F
0.77
0.8
F1
0.55
0.019
0.88
0.030
Weight: 1.80gr
0.002
0.031
0.15
0.035
0.006
G
1.57
1.7
1.83
0.062
0.067
0.072
G1
16.87
17
17.13
0.664
0.669
0.674
H1
12
0.480
H2
18.6
0.732
H3
19.85
0.781
L
17.9
0.700
L1
14.55
0.580
L2
10.7
OUTLINE AND
MECHANICAL DATA
11
11.2
0.421
0.433
L3
5.5
0.217
M
2.54
0.100
M1
2.54
0.100
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0.441
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Clipwatt11
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0044448 G
9/11
TDA7269SA
Table 6. Revision History
Date
Revision
Description of Changes
May 2003
1
First Issue
Septembe 2004
2
Changed Status and the graphic aspect in compliant to the new rules
“Corporate Technical Pubblications Design Guide”
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TDA7269SA
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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