Lead-free/RoHS Compliance Roadmap
customer version, April 04
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Contents
Artesyn lead-free/RoHS compliance position
RoHS Overview (Restriction of Hazardous Substances)
Current status
Implementation strategy
Outline implementation plan
Implementation timeline
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Artesyn lead-free/RoHS compliance
position
Artesyn will actively pursue lead-free/RoHS compliance in direct
response to:
RoHS legislation enacted in Europe
Market forces
Customer requirements
RoHS implementation deadline is July 1, 2006, but customer
requirements dictate Artesyn compliance in advance of this date
Compliance goal – end 2005
Earlier compliance on some products, as required by customers
Artesyn lead-free definition:
A board mounted power product is defined to be lead-free if it contains no
more than 0.1% Pb by weight.
A stand-alone power product, shipped in a chassis, is defined to be lead-free if
each soldered assembly within the product contains no more than 0.1% Pb by
weight. The chassis and each mechanically attached component will be
evaluated individually and may contain no more than 0.1% Pb by weight.
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RoHS overview
RoHS legislation bans the following materials,
effective July 1, 2006:
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Pb – solder and component terminations
Cd – cables and insulation
Cr+6 – conversion coatings on sheet metal and hardware
Hg – maybe no problem
PBB & PBDE – brominated flame retardants in component
molding compounds
Exemption for Pb in solders exists for high-end
storage and telecom networking equipment
• but component terminations must be lead-free
• and most customers covered by the exemption are requiring leadfree assembly in advance of July 1, 2006
– some customers may use exemption to cover shipment of
existing products nearing end-of-life on July 1, 2006
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Status
Lead-free/RoHS compliance team formed 10/03
Mission:
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Identification of compliance issues throughout supply chain
Implementation of RoHS compliant components and materials
Development of lead-free assembly processes
Qualification of new components, materials and processes
Reliability testing to ensure product quality
Global participation with representation from all
manufacturing sites and all engineering disciplines
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Status
First lead-free customer samples built in ZhongShan Jan-04:
Existing BOMs used, approximately 45% of components leadfree/RoHS compliant
OSP and ENIG lead-free PWB finishes
2-sided SnAgCu reflow process with SnAgCu hand soldering
for remaining through-hole components
Reliability testing in progress
• Thermal shock, HASS screening completed with good results
• Solder joint cross-sectioning and element analysis in progress
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Status
First lead-free wave soldered customer samples built in
ZhongShan April-04
Through-hole-only product on single-sided PWB with OSP
lead-free coating
2 sided SMT product on 4 layer PWB with ENIG lead-free
coating and selective wave soldering for remaining throughhole components
Process development, sampling conducted with active
participation from Tatabanya, Redwood Falls and ZhongShan
manufacturing engineers
Reliability testing scheduled to begin in May
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Status
Component supply chain query under way
Summary by Component
90000
80000
77408
77408
77408
70000
60000
Total Components
50000
Contacted Components
40000
34899
30000
20000
10000
12955
8122
14336
13254
8360
6-Apr-04
24-Feb-04
28-Jan-04
0
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Returned Components
Implementation Strategy
Ensure backward/forward process compatibility
All finish choices must be compatible with both SnPb and
SnAgCu soldering processes
• Components: Sn with Ni barrier
• PWBs: OSP, probably Shikoku Glicoat and Entek Cu106A-HT
• No Bi finishes or materials
Reliability testing incorporated into implementation
plan
Single solder paste, wave flux for global use
Local input sought, but global control required
Implement lead-free components by QML change
Many vendors have substituted lead-free terminations
without part number change
Lead-free PCN to customers
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Implementation Plan
Three integrated, but parallel plans:
Components
• Identify, specify and procure RoHS-free components
• Implement lead-free parts when available – one way change
PWB finishes
• Identify, specify, qualify and procure RoHS-free PWBs
• Ensure solderability, reliability with both SnPb and SnAgCu
processes
• Implement lead-free PWB coatings by product after qualification
Lead-free processes
• Develop and qualify lead-free soldering processes
• Implement lead-free processes by product after successful
conclusion of reliability testing
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Implementation Plan - Components
Vendor query:
RoHS free? When? Part number change?
Specify termination finish in detail: metal content by %, plating
specification, including underplate thickness and annealing
process if matte Sn
Identify MSL changes by exception (vendor PCN)
• To date, all remain MSL 1
Implement RoHS-free components by QML change
FIFO control required
Single PCN to customers – implement as available
When RoHS-free available and implemented, old parts cannot
be used or reordered
Develop and qualify RoHS-free internally sourced magnetics
Lead-free terminations
Heat resistant packages (>260º C)
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Implementation Plan – PWB finishes
Customer input:
ENIG banned by many
Immersion Ag maybe
OSP preferred
OSP results to date:
Shikoku Glicoat OSP used for lead-free assembly trials to date
with good results
Entek Cu106A-HT will be tested soon
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Implementation Plan – PWB finishes
OSP controlled implementation:
Verify solder joint quality with SnPb and SnAgCu
processes
Verify solder joint quality with SnPb and RoHS-free
component terminations
HALT testing
Thermal cycling followed by electrical test, solder
joint cross-sectioning and metallurgical analysis
Implement by product
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Implementation Plan – Lead-free solder
Lead-free solder implementation: three parallel plans
SMT reflow
Wave and selective solder
Rework & repair
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Implementation Plan – Lead-free reflow
Lead-free SMT reflow
Select no-clean SnAgCu paste with distribution &
technical support in China, Europe, US
Optimize profiles
• Upgrade factory equipment where necessary
Verify solder joint quality, minimum voiding
Reliability testing by product
• HALT
• Thermal cycling
• Solder joint cross-sectioning and metallurgical analysis
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Implementation Plan – Lead-free wave
Lead-free wave and selective solder
Select no-clean, lead-free compatible flux with distribution &
technical support in China, Europe, US
Select bar solder alloy
• SAC305 used in recent trial
Upgrade or replace wave and selective solder equipment
Optimize profiles
• Verify solder joint quality, minimum solder balls
Reliability testing by product
• HALT
• Thermal cycling
• Solder joint cross-sectioning and metallurgical analysis
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Implementation Plan – Lead-free rework
Lead-free rework and repair
Select no-clean, lead-free SnAgCu wire and flux with
distribution & technical support in China, Europe, US
Upgrade or replace hand solder equipment
Develop process to segregate SnAgCu and SnPb rework
• Ensure that SnPb soldered assemblies are reworked with SnPb
• Ensure that SnAgCu soldered assemblies are reworked with SnAgCu
Reliability testing by product
• HALT
• Thermal cycling
• Solder joint cross-sectioning and metallurgical analysis
Implement lead-free rework and repair
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Implementation Plan – customer notification
Product level PCN sent to customers when:
Lead-free PWB finish implemented
Lead-free processes qualified and implemented
Product level qualification passed
• Actual or by similarity
Will not claim RoHS compliance until RoHS-free BOM can be
guaranteed
Reference “IPC Lead-free 2”
Final RoHS compliance statement still to be defined
Some customers will require a unique product TLA
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RoHS compliance verification
The following method is proposed for RoHS compliance
verification:
Product will be ground, aqua regia leached
Presence and concentration of Cd, Cr+6, Hg, Pb identified by
ICP-AES or ICP-SFMS and reported as a percentage of
product weight
Presence of PBB and PBDE identified by solvent extraction
and measurement by GC-MS
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Implementation Timeline
Task Name
2004
2005
2006
M J J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D J F M A M J J
Component: PCN to customer
Component: vendor RoHS query
Component: implement RoHS-free parts
PWB: evaluate & select coating
PWB: verify vendor capability
PWB: qualification testing
PWB: implement coating
Solder: reflow process development
Solder: reflow process qualification
Solder: reflow reliability testing
Solder: reflow process implementation
Solder: wave equipment upgrade
Solder: wave process development
Solder: wave process qualification
Solder: wave reliability testing
Solder: wave process implementation
Solder: rework process development
Solder: rework process qualification
Solder: rework reliablity testing
Solder: rework process implementation
Limited Engineering Samples to IPC Lead-free 2
Manufacturing to IPC Lead-free 2
RoHS implementation deadline
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Glossary
Bi – bismuth
Cd – cadmium
Cr+6 – hexavalent chromium
ENIG – electroless nickel, immersion gold
FIFO – first in, first out
GC-MS – gas chromatography- mass
spectrometry
HALT – highly accelerated life testing
HASS – highly accelerated stress
streening
Hg – mercury
ICP-AES – inductively coupled plasma –
optical emission spectrometry
ICP-SFMS – inductively coupled plasma
– sector mass spectrometry
MSL – moisture sensitive level
OSP – organic solder preservative
Pb – lead
PBB – polybrominated biphenyl
PBDE – polybrominated diphenyl ether
PCN – process change notification
PWB – printed wiring board
QML – qualified manufacturer list
RoHS – “Reduction of Hazardous Substances”
legislation
SAC305 – solder alloy containing Sn with 3%
Ag by weight, 0.5% Cu by weight
SMT – surface mount technology
SnAgCu – tin-silver-copper
SnPb – tin-lead
TLA – top level assembly
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Assistance
Please contact the following Lead-free/RoHS compliance
team members with questions, complaints and requests for
assistance:
Wayne Fitzgerald, Project manager, Youghal
Roger Brandt, CE, Tucson
Susan Johnston, Director component engineering, EDP
Kathy Teuber, ME, Westminster
Dave Widmer, Global Material System Manager/Commodity Manager, RWF
Susie Worden, Global Material System Coordinator, RWF
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