SGM8634 470μA, 6MHz, Rail-to-Rail I/O CMOS Operational Amplifier

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SGM8634
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
PRODUCT DESCRIPTION
FEATURES
The quad SGM8634 is a low noise, low voltage, and low
 Rail-to-Rail Input and Output
power operational amplifier that can be designed into a
wide range of applications. The SGM8634 has a high
gain-bandwidth product of 6MHz, a slew rate of 3.7V/μs,
and a quiescent current of 470μA/amplifier at 5V.
The
SGM8634
is
designed
to
provide
optimal
performance in low voltage and low noise systems. It
provides rail-to-rail output swing into heavy loads. The
input common mode voltage range includes ground,
and the maximum input offset voltage is 3.5mV. The
operating range is from 2.5V to 5.5V.
0.8mV Typical VOS








High Gain-Bandwidth Product: 6MHz
High Slew Rate: 3.7V/μs
Settling Time to 0.1% with 2V Step: 2.1μs
Overload Recovery Time: 0.9μs
Low Noise: 12nV/
Hz
Supply Voltage Range: 2.5V to 5.5V
Input Voltage Range: -0.1V to +5.6V with VS = 5.5V
Low Supply Current
470μA/Amplifier (TYP)
 Available in Green TSSOP-14 and SOIC-14
Packages
The quad SGM8634 is available in Green TSSOP-14
and SOIC-14 packages. It is specified over the extended
industrial temperature range (-40℃ to +125℃).
APPLICATIONS
Sensors
Audio
Active Filters
A/D Converters
Communications
Test Equipment
Cellular and Cordless Phones
Laptops and PDAs
Photodiode Amplification
Battery-Powered Instrumentation
SG Micro Corp
www.sg-micro.com
REV. C. 2
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
SGM8634
PACKAGE/ORDERING INFORMATION
MODEL
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
TSSOP-14
-40℃ to +125℃
SGM8634XTS14/TR
SOIC-14
-40℃ to +125℃
SGM8634XS14/TR
SGM8634
PACKAGE
MARKING
SGM8634
XTS14
XXXXX
SGM8634XS14
XXXXX
PACKING
OPTION
Tape and Reel, 3000
Tape and Reel, 2500
NOTE: XXXXX = Date Code and Vendor Code.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
OVERSTRESS CAUTION
Supply Voltage, +VS to -VS ................................................ 6V
Input Common Mode Voltage Range
.................................................... (-VS) - 0.3V to (+VS) + 0.3V
Storage Temperature Range ........................-65℃ to +150℃
Junction Temperature ...................................................160℃
Operating Temperature Range .....................-40℃ to +125℃
Lead Temperature (Soldering 10sec) ...........................260℃
ESD Susceptibility
HBM............................................................................. 1500V
MM................................................................................. 400V
Stresses beyond those listed may cause permanent damage
to the device. Functional operation of the device at these or
any other conditions beyond those indicated in the
operational section of the specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
PIN CONFIGURATION
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation
procedures can cause damage. ESD damage can range from
subtle performance degradation to complete device failure.
Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause
the device not to meet its published specifications.
DISCLAIMER
(TOP VIEW)
OUTA
1
14
OUTD
-INA
2
13
-IND
+INA
3
12
+IND
+VS
4
11
-VS
+INB
5
10
+INC
-INB
6
9
-INC
OUTB
7
8
OUTC
SG Micro Corp reserves the right to make any change in
circuit design, specification or other related things if
necessary without notice at any time.
TSSOP-14/SOIC-14
SG Micro Corp
www.sg-micro.com
2
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
SGM8634
ELECTRICAL CHARACTERISTICS
(At TA = +25℃, VS = 5V, VCM = VS/2, RL = 600Ω, unless otherwise noted.)
SGM8634
PARAMETER
CONDITIONS
TYP
MIN/MAX OVER TEMPERATURE
+25℃
+25℃
0.8
3.5
0℃ to
-40℃ to
-40℃ to
70℃
85℃
125℃
3.9
4.3
4.6
UNITS
MIN /
MAX
INPUT CHARACTERISTICS
Input Offset Voltage (VOS)
mV
MAX
Input Bias Current (IB)
1
pA
TYP
Input Offset Current (IOS)
1
pA
TYP
-0.1 to
V
TYP
dB
MIN
dB
MIN
dB
MIN
Input Common Mode Voltage Range
VS = 5.5V
(VCM)
+5.6
Common Mode Rejection Ratio (CMRR)
Open-Loop Voltage Gain (AOL)
VS = 5.5V, VCM = -0.1V to 4V
90
VS = 5.5V, VCM = -0.1V to 5.6V
83
73
87
70
86
65
RL = 600Ω ,VO = 0.15V to 4.85V
97
RL = 10kΩ ,VO = 0.05V to 4.95V
108
dB
MIN
2.4
μV/℃
TYP
Input Offset Voltage Drift (ΔVOS/ΔT)
90
70
79
OUTPUT CHARACTERISTICS
Output Voltage Swing from Rail
RL = 600Ω
0.1
V
TYP
RL = 10kΩ
0.015
V
TYP
Output Current (IOUT)
Closed-Loop Output Impedance
53
f = 200kHz, G = 1
49
45
40
35
3
mA
MIN
Ω
TYP
POWER SUPPLY
Operating Voltage Range
Power Supply Rejection Ratio (PSRR)
Quiescent Current/Amplifier (IQ)
2.5
2.5
2.5
2.5
V
MIN
5.5
5.5
5.5
5.5
V
MAX
VS = 2.5V to 5.5V
VCM = (-VS) + 0.5V
91
74
72
72
68
dB
MIN
IOUT = 0
470
650
727
750
815
μA
MAX
DYNAMIC PERFORMANCE
Gain-Bandwidth Product (GBP)
RL = 10kΩ
Phase Margin (φO)
6
MHz
TYP
60
degrees
TYP
Full Power Bandwidth (BWP)
<1% distortion, RL = 600Ω
250
kHz
TYP
Slew Rate (SR)
G = +1, 2V Step, RL = 10kΩ
3.7
V/μs
TYP
Settling Time to 0.1% (tS)
G = +1, 2V Step, RL = 600Ω
2.1
μs
TYP
Overload Recovery Time
VIN ·Gain = VS, RL = 600Ω
0.9
μs
TYP
Voltage Noise Density (en)
f = 1kHz
12
nV/
Hz
TYP
Current Noise Density (in)
f = 1kHz
3
fA/
Hz
TYP
NOISE PERFORMANCE
SG Micro Corp
www.sg-micro.com
3
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
SGM8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Closed-Loop Output Voltage Sw ing
6
V S = 5V
V IN = 4.9V P-P
TA = +25℃
RL = 10kΩ
G=1
4
3
2
1
0
10
100
1000
VS = 5V
120
Output Impedance (Ω)
5
Output Voltage (V P-P)
Output Impedance vs. Frequency
140
10000
100
80
60
40
G = 100
20
G=1
0
1
10
Frequency (kHz)
Positive Overload Recovery
100
1000
Frequency (kHz)
10000
Negative Overload Recovery
200mV
/div
0V
VIN
G = 10
VIN
200mV
/div
0V
VOUT
1V
/div
0V
VOUT
VS = ±2.5V
VIN = -200mVP-P
(RET to GND)
CL = 0pF
0V
RL = 10kΩ
G = 100
RL = 10kΩ
G = 100
Time (0.3µs/div)
Small-Signal Step Response
VS = 5V
G = +1
CL = 100pF
RL = 10kΩ
Voltage (50mV/div)
Voltage (1V/div)
VS = 5V
G = +1
CL = 100pF
RL = 10kΩ
SG Micro Corp
www.sg-micro.com
VS = ±2.5V
VIN = +200mVP-P
(RET to GND)
CL = 0pF
Time (0.3µs/div)
Large-Signal Step Response
Time (1μs/div)
1V
/div
Time (1μs/div)
4
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
SGM8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
CMRR vs. Frequency
PSRR vs. Frequency
120
120
VS = 5V
VS = 5V
100
CMRR (dB)
PSRR (dB)
100
80
60
40
80
60
40
20
20
0.01
0.1
1
10
Frequency (kHz)
100
0
0.01
1000
50
TA = +25℃
G=1
40
Channel Separation (dB)
VS = 5V
RL = 10kΩ
60
+OS
-OS
30
20
10
1
10
100
Load Capacitance (pF)
130
VS = 5V
RL = 620Ω
120
TA = +25℃
G=1
110
100
0.1
1000
1
10
Frequency (kHz)
100
1000
PSRR vs. Temperature
CMRR vs. Temperature
120
130
VS = 5.5V
VCM = -0.1V to 4V
VS = 2.5V to 5.5V
120
100
PSRR (dB)
CMRR (dB)
1000
90
0
90
80
70
100
140
70
110
1
10
Frequency (kHz)
Channel Separation vs. Frequency
Small-Signal Overshoot vs. Load Capacitance
Small-Signal Overshoot (%)
0.1
VCM = -0.1V to 5.6V
110
100
90
80
60
70
-50 -30 -10
10
30
50
70
Temperature (℃)
SG Micro Corp
www.sg-micro.com
90 110 130
-50 -30 -10
10
30
50
70
90 110 130
Temperature (℃)
5
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
SGM8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Output Voltage Swing vs. Output Current
Supply Current vs. Temperature
650
5
Sourcing Current
550
Output Voltage (V)
Supply Current (μA)
600
500
450
VS = 2.5V
400
VS = 3V
350
VS = 5V
300
4
+135℃
3
-50 -30 -10
2
+135℃
+25℃
-50℃
1
Sinking Current
10
30
50
70
0
90 110 130
10
20
30
40
50
60
70
80
Output Current (mA)
Temperature (℃)
Open-Loop Gain vs. Temperature
Small-Signal Overshoot vs. Load Capacitance
120
70
RL = 10kΩ
110
Small-Signal Overshoot (%)
Open–Loop Gain (dB)
-50℃
0
250
100
RL = 600Ω
90
80
70
-50 -30 -10
10
30
50
70
VS = 2.7V
RL = 10kΩ
60
50
TA = +25℃
G=1
40
+OS
30
-OS
20
10
0
90 110 130
1
Temperature (℃)
Output Voltage Swing vs. Output Current
10
100
Load Capacitance (pF)
1000
Channel Separation vs. Frequency
3
140
Channel Separation (dB)
Sourcing Current
Output Voltage (V)
+25℃
VS = 5V
VS = 3V
2
+135℃
+25℃
-50℃
1
VS = 2.7V
RL = 620Ω
130
TA = +25℃
G=1
120
110
100
Sinking Current
0
90
0
10
20
30
40
Output Current (mA)
SG Micro Corp
www.sg-micro.com
50
60
0.1
1
10
100
Frequency (kHz)
1000
6
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
SGM8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VCM = VS/2, RL = 600Ω, unless otherwise noted.
Output Impedance vs. Frequency
Closed-Loop Output Voltage Swing
140
3
Output Impedance (Ω)
100
80
60
40
G = 100
G = 10
G=1
20
Output Voltage (VP-P)
VS = 2.7V
120
2.5
2
1.5
VS = 2.7V
VIN = 2.6VP-P
1
TA = +25℃
RL = 10kΩ
G=1
0.5
0
0
1
10
100
1000
Frequency (kHz)
10
10000
Large-Signal Step Response
VS = 2.7V
G = +1
CL = 100pF
RL = 10kΩ
Voltage (50mV/div)
VS = 2.7V
G = +1
CL = 100pF
RL = 10kΩ
Voltage (500mV/div)
10000
Small-Signal Step Response
Time (1μs/div)
Time (1μs/div)
Offset Voltage Production Distribution
50
35
30
25
20
15
10
5
0
Input Voltage Noise Spectral Density
vs. Frequency
1000
Voltage Noise (nV/√Hz)
45
40
VS = 5V
100
10
Offset Voltage (mV)
SG Micro Corp
www.sg-micro.com
3
2
2.5
1.5
1
0
0.5
-0.5
-1
-2
-1.5
-3
1
-2.5
Percentage of Amplifiers (%)
100
1000
Frequency (kHz)
10
100
1000
Frequency (Hz)
10000
7
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
SGM8634
APPLICATION NOTES
Driving Capacitive Loads
Power-Supply Bypassing and Layout
The SGM8634 can directly drive 1000pF in unity-gain
without oscillation. The unity-gain follower (buffer) is the
most sensitive configuration to capacitive loading.
Direct capacitive loading reduces the phase margin of
the amplifier and this results in ringing or even
oscillation. Applications that require greater capacitive
driving capability should use an isolation resistor
between the output and the capacitive load like the
circuit in Figure 1. The isolation resistor RISO and the
load capacitor CL form a zero to increase stability. The
bigger the RISO resistor value, the more stable VOUT will
be. Note that this method results in a loss of gain
accuracy because RISO forms a voltage divider with the
RLOAD.
The SGM8634 operates from either a single +2.5V to
+5.5V supply or dual ±1.25V to ±2.75V supplies. For
single-supply operation, bypass the power supply +VS
with a 0.1µF ceramic capacitor which should be placed
close to the +VS pin. For dual-supply operation, both
the +VS and the -VS supplies should be bypassed to
ground with separate 0.1µF ceramic capacitors. 2.2µF
tantalum capacitor can be added for better
performance.
RISO
14
SGM8634
For the operational amplifier, soldering the part to the
board directly is strongly recommended. Try to keep the
high frequency current loop area small to minimize the
EMI (electromagnetic interfacing).
VOUT
VIN
Good PC board layout techniques optimize
performance by decreasing the amount of stray
capacitance at the op amp’s inputs and output. To
decrease stray capacitance, minimize trace lengths and
widths by placing external components as close to the
device as possible. Use surface-mount components
whenever possible.
CL
Figure 1. Indirectly Driving Heavy Capacitive Load
An improved circuit is shown in Figure 2. It provides DC
accuracy as well as AC stability. RF provides the DC
accuracy by connecting the inverting signal with the
output. CF and RIso serve to counteract the loss of
phase margin by feeding the high frequency
component of the output signal back to the amplifier’s
inverting input, thereby preserving phase margin in the
overall feedback loop.
+VS
+VS
10µF
10µF
0.1µF
0.1µF
Vn
Vn
14
SGM8634
VOUT
14
SGM8634
VOUT
Vp
10µF
Vp
CF
-VS (GND)
RF
14
0.1µF
RISO
SGM8634
VIN
VOUT
CL
Figure 2. Indirectly Driving Heavy Capacitive Load with
DC Accuracy
For non-buffer configuration, there are two other ways
to increase the phase margin: (a) by increasing the
amplifier’s closed-loop gain or (b) by placing a
capacitor in parallel with the feedback resistor to
counteract the parasitic capacitance associated with
inverting node.
SG Micro Corp
www.sg-micro.com
-VS
RL
Figure 3. Amplifier with Bypass Capacitors
Grounding
A ground plane layer is important for SGM8634 circuit
design. The length of the current path in an inductive
ground return will create an unwanted voltage noise.
Broad ground plane areas will reduce the parasitic
inductance.
Input-to-Output Coupling
To minimize capacitive coupling, the input and output
signal traces should not be in parallel. This helps reduce
unwanted positive feedback.
8
470μA, 6MHz, Rail-to-Rail I/O
CMOS Operational Amplifier
SGM8634
TYPICAL APPLICATION CIRCUITS
Differential Amplifier
Low-Pass Active Filter
The circuit shown in Figure 4 performs the difference
function. If the resistor ratios are equal (R4/R3 = R2/R1),
then VOUT = (Vp - Vn) × R2/R1 + VREF.
The low-pass filter shown in Figure 6 has a DC gain of
(-R2/R1) and the -3dB corner frequency is 1/2R2C.
Make sure the filter bandwidth is within the bandwidth
of the amplifier. The large values of feedback resistors
can couple with parasitic capacitance and cause
undesired effects such as ringing or oscillation in
high-speed amplifiers. Keep resistor values as low as
possible and consistent with output loading
consideration.
R2
R1
Vn
14
SGM8634
VOUT
Vp
R3
C
R4
R1
VREF
VIN
Figure 4. Differential Amplifier
R2
14
SGM8634
VOUT
Instrumentation Amplifier
The circuit in Figure 5 performs the same function as
that in Figure 4 but with a high input impedance.
R2
14
R3 = R1 // R2
Figure 6. Low-Pass Active Filter
R1
SGM8634
Vn
14
SGM8634
Vp
14
R3
VOUT
R4
SGM8634
VREF
Figure 5. Instrumentation Amplifier
SG Micro Corp
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9
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-14
D
E1
E
5.94
1.78
b
e
0.42
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
A
c
H
Dimensions
In Inches
MIN
MAX
1.200
0.047
A1
0.050
0.150
0.002
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
c
0.090
0.200
0.004
0.008
D
4.860
5.100
0.191
0.201
E
4.300
4.500
0.169
0.177
E1
6.250
6.550
0.246
0.258
e
L
0.650 BSC
0.500
H
θ
SG Micro Corp
www.sg-micro.com
0.026 BSC
0.700
0.02
0.25 TYP
1°
0.028
0.01 TYP
7°
1°
7°
TX00019.001
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-14
D
E
5.2
E1
2.2
e
b
0.6
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L1
R1
R
A3
A A2
h
L2
θ
A1
Symbol
h
L
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.25
1.65
0.049
0.065
A3
0.55
0.75
0.022
0.030
b
0.36
0.49
0.014
0.019
D
8.53
8.73
0.336
0.344
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
L
1.27 BSC
0.45
0.050 BSC
0.80
0.018
0.032
L1
1.04 REF
0.040 REF
L2
0.25 BSC
0.01 BSC
R
0.07
R1
0.07
h
0.30
0.50
0.012
0.020
θ
0°
8°
0°
8°
SG Micro Corp
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0.003
0.003
TX00011.001
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
W
P0
Q1
Q2
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
Q3
Q4
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel
Diameter
Reel Width
W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P0
(mm)
P1
(mm)
P2
(mm)
W
(mm)
Pin1
Quadrant
TSSOP-14
13″
12.4
6.95
5.6
1.2
4.0
8.0
2.0
12.0
Q1
SOIC-14
13″
16.4
6.6
9.3
2.1
4.0
8.0
2.0
16.0
Q1
SG Micro Corp
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TX10000.000
DD0001
Package Type
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
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DD0002
Reel Type
TX20000.000
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