Polyimide Laminate

Polyimide Laminate
i3 Electronics, Inc.:
i3’s Polyimide is an industry standard GPY equivalent polyimide and is
used as a dielectric prepreg or a laminate in printed circuit board and
laminate chip carrier fabrication. This material exhibits excellent performance in the field in a variety of high end applications, and is an ideal
solution for the medical, aerospace and defense and computing markets.
i3’s polyimide is also lead free compatible.
FEATURES
PERFORMANCE AT HIGH
TEMPERATURE

Compatible with MSA and lead free
bly
assem-
UL-94 HB FLAMMABILITY RATING
i3’s Polyimide prepregs and laminates are available in a wide range of
glass cloth styles, resin contents and copper weights.

Flammability meets the UL/ANSI GPY requirement
LOW MELT VISCOSITY / LONG GEL
TIME

Excellent rheological behavior assures void
free formation of thick, complex, multi-layer
printed circuit boards
HIGH RELIABILITY

Good performance in thermal cycling and
insulation resistance produces optimum
product reliability
ASSEMBLY FRIENDLY

Resists delamination
IPC4101C/40, 41
Meets industry standard requirements
i3’s Polyimide in a thick board with large thru vias
POLYIMIDE LAMINATE PROPERTIES
PROPERTY TESTED*
TEST METHOD
ELECTRICAL
Permittivity (Dielectric Constant @ 1 GHz)
3.89
ASTM-D-150-98
Loss Tangent (Loss Factor @ 1 GHz)
0.013
ASTM-D-150-98
Electrical Strength (kV/mm)
89.1
IPC-TM-650/2.5.6.2
Dielectric Breakdown (kV)
Arc Resistance (seconds)
>45kV
IPC TM-650/2.5.6
123
IPC TM-650/2.5.1
IPC-TM-650/2.5.17.1
VOLUME RESISTIVITY (megohm-cm)
8
After Moisture
3.8x10
At Elevated Temperature
2.5x108
IPC-TM-650/2.5.17.1
SURFACE RESISTIVITY (megohm)
After Moisture
1.6x105
At Elevated Temperature
1.6x106
THERMAL
Glass Transition Temperature (0C)
300
IPC-TM-650/2.4.25
392
IPC-TM-650/2.4.24.6
Time to Delamination (minimum @ 288C)
>120
IPC-TM-650/2.4.24.1A
Flammability
HB**
UL94
0
Decomposition Temperature ( C) (5%)
PHYSICAL
Polyimide
Resin Type
Pressure Vessel Test (8hr.)
Pass
IPC-TM-650/2.6.16
Moisture, % Gain (24 hr/RT)
.52
IPC-TM-650/2.6.2.1
Peel Strength (lb/in)
6.0
IPC-TM-650/2.4.8.2
IPC-TM-650/2.4.4
FLEXURAL STRENGTH (Kpsi)
Length Direction
83.1
Cross Direction
77.4
IPC-TM-650/2.3.4.3
Chemical Resistance, Methylene Chloride (%)
X CTE Below Tg (ppm/C)
18.7
IPC-TM-650/2.4.41
Y CTE Below Tg (ppm/C)
23.0
IPC-TM-650/2.4.41
Z CTE Below Tg (ppm/C)
65.0
IPC-TM-650/2.4.41
* All properties above are based on 56% resin content 1080 style
** The flame retardant is RoHS Compliant
1093 Clark St.
Endicott, NY 13760
Phone: 866 820-4820 Fax: 607 755-7000
www.i3electronics.com
The i3 Electronics, Inc. logo and i3 Electronics, Inc. are registered trademarks
of i3 Electronics, Inc.¨ Printed in the United States of America, 2014. All rights
reserved. The information provided is believed to be accurate and reliable.
i3 Electronics , Inc.¨ reserves the right to make changes to the product described
without notice. No liability is assumed as the result of its use nor any infringement
of the rights of others.