Presentation Material: RoHS supply chain management
advertisement
Green Manufacturing for RoHS and WEEE compliance ©Irina Stobbe, Germany 2006-05-12, FHKI The Experts RoHS WEEE Management Ecodesign RoHS Supply Chain Management p. 1 Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign 2006-05-12, FHKI Logistics and Supply Chain – Specific Requirements Components available and qualified for higher temperatures? Component suppliers shift to RoHS-conformity at different times! ©Irina Stobbe, Germany Special storage and processing conditions (dry, pre-bake, post- p. 2 bake…)? Organize your component storage and supply chain! Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign ©Irina Stobbe, Germany 2006-05-12, FHKI Do you Need All Components From All Suppliers? p. 3 Rethink what you‘ve „always“ done as you do it now – there might be better solutions! Opportunity to rationalize and restructure Example: Sony reduces component program globally for more than 90 % from 840,000 down to 100,000 Advantage: Less components to be qualified for lead-free, less logistics and data expenses Cheaper purchasing Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management 2006-05-12, FHKI Standards on Reporting Formats IPC website on lead-free soldering issues: http://www.leadfree.org ©Irina Stobbe, Germany Industry working on several approaches p. 4 IEC declaration of conformance: ISO-IEC 17050 (1S-1T-1D) Materials declarations with composition data Several - but not developed for RoHS Web-based business data exchange (e.g. Rosettanet) Free, easily accessible data http://www.rosettanet.org Ecodesign Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign 2006-05-12, FHKI How to Prove Compliance: Self-declaration?! Products presumed to be RoHS compliant Authorities conduct random checks Producers prove that they prove that they have taken “reasonable steps” to comply ©Irina Stobbe, Germany Analysis of every product and “material” unrealistic Source: ERA (modified) p. 5 Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign ©Irina Stobbe, Germany 2006-05-12, FHKI Communication – Documentation p. 6 Understanding and awareness very different in the supply chain! Contact your suppliers and customers (PERSONALLY)! Make sure they understand as you understand RoHS-conformity, lead-free, “Green” etc. in the context of RoHS! Ask them to sign a declaration of conformity! Try to agree on (standard) data formats! DOCUMENT your efforts! Start in time – which is yesterday! Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign ©Irina Stobbe, Germany 2006-05-12, FHKI Documentation template, proposed by UK DTI: p. 7 Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign 2006-05-12, FHKI Confidence and Control of Sharks Carry out selective analysis! ©Irina Stobbe, Germany Check accuracy of supplier declarations p. 8 Know and control the sharks in your supply chain! Check high risk items where there is doubt or no information Source: ERA (modified) Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign 2006-05-12, FHKI Some Creatures From the Component Label Jungle Change of Product Number Manufact. A: old: RoHS-compl: ©Irina Stobbe, Germany Manufacturer B: old: Q ##$$$$$01234// Q ##$$$$$11234// MAX220CSE or MAX241CWI-T RoHS-compl.: MAX220CSE+ or MAX241CWI+T Some More Labels: E / F / G / L / N / P / Z / LF / NL / PbF / .......... p. 9 Source: M. Herrnberger, Zollner Elektronik Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management ©Irina Stobbe, Germany 2006-05-12, FHKI Proposed Standards for Marking I p. 10 JEDEC Standard JESD97, May 2004: Marking for Identification of Lead-Free In Assemblies, Components, and Devices IPC-1066, June 2004: Marking for Identification of Lead-Free and Other Regulated Materials In Assemblies, Components and Devices Ecodesign Green Manufacturing for RoHS and WEEE compliance The Experts RoHS Management Ecodesign Only 2nd Level Interconnect Standard reflects only lead, only in solders, component finishes PWB finish assumed lead-free No mark for other RoHS-banned materials in solder system No mark for Pb or other RoHS-banned material in assembled PWB ©Irina Stobbe, Germany 2006-05-12, FHKI IPC-1066/ JESD97: WEEE p. 11 Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign ©Irina Stobbe, Germany 2006-05-12, FHKI Components in Reels, Rails, Trays, Bags, Sticks p. 12 IPC-1066/JEDEC: Terminal Finish and maximum soldering temperature On component (if space available) : e4 260 On packing material: e4 260 Lead-free Material Categories: e1 – SnAgCu e2 – other SnX, no Bi, no Zn e3 – Sn e4 – preplated (i.e. Ag, Au, NiPd, NiPdAu) e5 – SnZn, SnZnX, no Bi e6 – Bi e7 – low temp. solder (only JESD) or barcode-label with equivalent information Green Manufacturing for RoHS and WEEE compliance The Experts 2006-05-12, FHKI Boards RoHS WEEE Management Ecodesign IPC-1066 / JESD97: Assembled PWB Unassembled board assumed Pb-free JESD97: Position for mark regulated Pb-free Pb-free ©Irina Stobbe, Germany (Text or Logo alternatively) Package: Completely Pb-free, no lead in exempted applications HF/e2, e3/XY HF/e2, e3/XY p. 13 Only IPC Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign 2006-05-12, FHKI Additional: Board Material, Conformal Coatings IPC-1066: Halogen free and Lists with coatings Assembly: Pb-free Halogen free Æ Accidents, End-of-Life ©Irina Stobbe, Germany Information for Repair/Service: p. 14 Board material/ reflow mat./ wave mat./ conf. coating XY HF / e2,e3 / XY HF/e2, e3/XY Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign 2006-05-12, FHKI Proposed Standards for Marking II ETR-7021 (2004): withdrawn JEITA ET-7001 (2005) ©Irina Stobbe, Germany Un-assembled PWB assumed RoHS-compliant Presence and non-presence of all RoHS materials for component packages assembled PWBs p. 15 Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign ©Irina Stobbe, Germany 2006-05-12, FHKI Components in Reels, Rails, Trays, Bags, Sticks JEITA ETR 7001 Components labelled on innermost packaging Not RoHS-compliant because of the presence of - lead: [[Pb]] or Pb - several substances: [[Pb, Hg]] or Hg, Pb or Hg Pb RoHS-compliant: [[G]] or G because of non-presence of restricted materials G or: same symbols as barcode label Symbols for other banned substances: p. 16 Æ [[Cd]] [[CrVI]] [[PBDE]] [[PBB]] Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign Unassembled board assumed lead-free JEITA ET-7001 G ©Irina Stobbe, Germany 2006-05-12, FHKI Assembly or Hg, Pb Z40: SnZn4.0 solder Lists for different solders: A30C5, B57, C7 Abbreviations according to IEC 611901-3 or ISO 9453 rev. G Z40 p. 17 Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign 2006-05-12, FHKI The Queen of Labels: Life Cycle Unit (LCU) Life Cycle Units are integrated in (electronic) products : Design supports su p Manufacturing p or ts Repair, Refurbishment, Predictive Maintenance s rd co es re yz al & an ©Irina Stobbe, Germany improves Test Transportation p. 18 Reuse & Recycling Use SFB 281- gov. funded project Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign ©Irina Stobbe, Germany 2006-05-12, FHKI Comparison of Proposed Standards p. 19 Category Soldertec/ BeCAP Phase 2 no more required JEITA ET-7001 Solder symbol Lead presence: [[Pb]] or Pb 2nd l. i. label or barcode Phase 3A exemptions to be marked : Hg: #1 … #4 Pb: #5 … #7 Cd: #8 Cr(VI): #9 >>#7-2006<< or (if year is required) Phase 3 G Non-presence: [[G]] or Plus solder characteristic Component Assembly IPC-1066 / JESD97 #7-2006 A30C5 Presence of other materials from Annex 1 (equivalent to RoHS) [[Hg]], [[(PDPE)]], … Hg (PDPE) Solder symbol Totally 2nd level Pb-free interc. Label Recommended: MSL, MST None For components: Maximum safe temperature (MST) M aterial Declaration Not required, Recommended for solder ( z.B. Z80B30) and finishes For solder, terminals and board finishes with the chemical formula For substrates, solder material, conf. finish with categories Benefits Changes in exemptions are traceable, support to service Material declaration makes boards easier to recycle, all RoHS-Materials Other restrictions like Halogen-free (HF) (only IPC) included Process Parameters Green Manufacturing for RoHS and WEEE compliance The Experts RoHS WEEE Management Ecodesign ©Irina Stobbe, Germany 2006-05-12, FHKI Comparison of Proposed Standards p. 20 Category Soldertec/ BeCAP Lead-free, Mercury-free, … Tolerance up to maximum concentration Limitation value (MCV) < 0,1 (0,01) wt% in homogeneous material Exemptions Annex1, Scope Art. 2 (1) Phase 1 - LF processable Lead-free Phases Phase 2 - LF terminals and solder Phase 3 Æ 3A - RoHS compliance Phase 4 Æ 3 - LF at all Solder M aterial Board – Substrate JEITA ET-7001 IPC-1066 / JESD97 Non-presence means substance < 0,1 (0,01) wt% in the uniform substance or uniform material Pb-free means Pb < 0,1wt% in raw materials, reference to RoHS, process ready, Like RoHS without data Without reference - 2nd level interconnect - Totally Pb-free No more phases, only presence or non-presence of a (RoHS) substance from Annex I SnAgCu ÅÆ A40C5 SnZnBi ÅÆ Z80B30 SnAgCu ÅÆ A40C5 SnZnBi ÅÆ Z80B30 (see IEC 61190-1-3 or ISO 9453) It displays at the main unit and the wrapping material under the presence/non-presence sign Lead-free per order presumed Lead free presumed Solder symbol (e1, e2,..) for solder classes e1 - SnAgCu e2 - other SnX, no Bi, no Zn e3 - Sn e4 - preplated(Ag, Au, NiPd, NiPdAu) e5 - SnZn, SnZnX, no Bi e6 - Bi e7 - low temp. Solder (only JESD97) Pb free presumed IPC : HF = Halogen free
