MC3488A
Dual EIA−423/EIA−232D
Line Driver
The MC3488A dual is single−ended line driver has been designed to
satisfy the requirements of EIA standards EIA−423 and EIA−232D, as
well as CCITT X.26, X.28 and Federal Standard FIDS1030. It is
suitable for use where signal wave shaping is desired and the output
load resistance is greater than 450 W. Output slew rates are adjustable
from 1.0 ms to 100 ms by a single external resistor. Output level and
slew rate are insensitive to power supply variations. Input undershoot
diodes limit transients below ground and output current limiting is
provided in both output states.
The MC3488A has a standard 1.5 V input logic threshold for TTL or
NMOS compatibility.
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MARKING
DIAGRAMS
8
SOIC−8
D SUFFIX
CASE 751
1
3488A
ALYW
G
1
Features
•
•
•
•
•
•
•
•
PNP Buffered Inputs to Minimize Input Loading
Short Circuit Protection
Adjustable Slew Rate Limiting
MC3488A Equivalent to 9636A
Output Levels and Slew Rates are Insensitive to Power
Supply Voltages
No External Blocking Diode Required for VEE Supply
Second Source mA9636A
Pb−Free Packages are Available
8
PDIP−8
P1 SUFFIX
CASE 626
1
MC3488AP1
AWL
YYWWG
1
A
= Assembly Location
L, WL = Wafer Lot
Y, YY
= Year
W, WW = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
Wave 1
Shape
8
VCC
Input A 2
7
Output A
Input B 3
6
Output B
GND 4
5
VEE
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Wave Shape Control
MC3488A Driver
RS−423 Interface
TTL Logic
MC3486
Three−State Receiver
Figure 1. Simplified Application
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 5
1
Publication Order Number:
MC3488A/D
MC3488A
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
VCC
VEE
+ 15
− 15
V
IO +
IO −
+ 150
− 150
mA
Operating Ambient Temperature
TA
0 to + 70
°C
Junction Temperature Range
TJ
150
°C
Storage Temperature Range
Tstg
− 65 to + 150
°C
Power Supply Voltages
Output Current
Source
Sink
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Devices should not be operated at these values. The IElectrical CharacteristicsI provide conditions for actual device operation.
RECOMMENDED OPERATING CONDITIONS
Characteristic
Power Supply Voltages
Operating Temperature Range
Wave Shaping Resistor
Symbol
Min
Typ
Max
Unit
VCC
VEE
10.8
− 13.2
12
− 12
13.2
− 10.8
V
TA
0
25
70
°C
RWS
10
−
1000
kW
TARGET ELECTRICAL CHARACTERISTICS (Unless otherwise noted, specifications apply over recommended operating conditions)
Characteristic
Symbol
Min
Typ
Max
Unit
Input Voltage − Low Logic State
VIL
−
−
0.8
V
Input Voltage − High Logic State
VIH
2.0
−
−
V
Input Current − Low Logic State (VIL = 0.4 V)
IIL
− 80
−
−
mA
Input Current − High Logic State
(VIH = 2.4 V)
(VIH = 5.5 V)
IIH1
IIH2
−
−
−
−
10
100
Input Clamp Diode Voltage (IIK = − 15 mA)
VIK
− 1.5
−
−
Output Voltage − Low Logic State
(RL = ∞), EIA−423
(RL= 3.0 kW), EIA−232D
(RL= 450 W), EIA−423
VOL
− 6.0
− 6.0
− 6.0
−
−
−
− 5.0
− 5.0
− 4.0
Output Voltage − High Logic State
(RL = ∞), EIA−423
(RL.= 3.0 kW), EIA−232D
(RL = 450 W), EIA−423
VOH
5.0
5.0
4.0
−
−
−
6.0
6.0
6.0
Output Resistance (RL q 450 W)
RO
−
25
50
IOSH
IOSL
− 150
+ 15
−
−
− 15
+ 150
Output Leakage Current (Note 3) (VCC = VEE = 0 V, − 6.0 V p Vo p 6.0 V)
Iox
− 100
−
100
mA
Power Supply Currents (RW = 100 kW, RL = ∞, VIL p Vin p VIH)
ICC
IEE
−
− 18
−
−
+ 18
−
mA
mA
Output Short−Circuit Current (Note 2)
(Vin = Vout = 0 V)
(Vin = VIH(Min), Vout = 0 V)
V
V
V
W
mA
2. One output shorted at a time.
3. No VEE diode required.
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2
MC3488A
TRANSITION TIMES (Unless otherwise noted, CL = 30 pF, f = 1.0 kHz, VCC = − VEE = 12.0 V ± 10%, TA = 25°C, RL = 450 W.
Transition times measured 10% to 90% and 90% to 10%)
Characteristic
Symbol
Transition Time, Low−to−High State Output
Min
Typ
Max
ms
tTLH
(RW = 10 kW)
(RW = 100 kW)
(RW = 500 kW)
(RW = 1000 kW)
Transition Time, High−to−Low State Output
Unit
0.8
8.0
40
80
1.4
14
70
140
0.8
8.0
40
80
1.4
14
70
140
ms
tTHL
(RW = 10 kW)
(RW = 100 kW)
(RW = 500 kW)
(RW = 1000 kW)
ORDERING INFORMATION
Device
Operating Temperature Range
MC3488AD
MC3488ADG
MC3488ADR2
TA = 0 to +70°C
MC3488ADR2G
MC3488AP1
MC3488AP1G
Package
Shipping †
SOIC−8
98 Units / Rail
SOIC−8
(Pb−Free)
98 Units / Rail
SOIC−8
1000 / Tape & Reel
SOIC−8
(Pb−Free)
1000 / Tape & Reel
PDIP−8
50 Units / Rail
PDIP−8
(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
To
Scope
(Input)
To
Scope
(Output)
VCC
MC3488A
50
Pulse
Generator
RL
CL
(Includes
Probe and Jig
Capacitance)
RWS
f = 1.0 kHz
PW = 500 ms
VEE
Note: Input Rise
and Fall Times
(10% to 90%) p 10 ns
3.0 V
Input
0V
VOH
90%
90%
0V
Output
10%
VOL
10%
tTHL
tTLH
Figure 2. Test Circuit and Waveforms for Transition Times
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3
MC3488A
6.0
Vout , OUTPUT VOLTAGE (V)
WAVE SHAPE RESISTOR, Rw (kΩ )
1000
100
CL = 30 pF
4.0
0°C
TA = 25°C
70°C
2.0
0
− 2.0
10
VCC = 12 V
VEE = −12 V
RWS = 100 kW
RL = 450 W
− 4.0
− 6.0
1.0
0.1
1.0
10
100
TRANSITION TIMES, tTLH/tTHL (ms)
0
1000
Figure 3. Output Transition Times versus
Wave Shape Resistor Value
1.0
Vin, INPUT VOLTAGE (V)
Figure 4. Input/Output Characteristics
versus Temperature
Power−On
Power−Off
0.10
50
0.08
I out , OUTPUT CURRENT (mA)
40
I out , OUTPUT CURRENT (mA)
2.0
Vin = VIH(Min)
30
20
TA = 25°C
VCC = 12 V
VEE = −12 V
RWS = 100 kW
10
0
− 10
− 20
− 30
Vin = 0 V
− 40
− 50
− 10 − 8.0 − 6.0 − 4.0 − 2.0
0
2.0 4.0
Vout, OUTPUT VOLTAGE (V)
VCC = VEE = Vin = 0 V
TA = 25°C
(No diode required
at VEE Pin.)
0.06
0.04
0.02
0
− 0.02
− 0.04
− 0.06
− 0.08
− 0.10
6.0
8.0
10 − 8.0 − 6.0 − 4.0 − 2.0
0
2.0 4.0
Vout, OUTPUT VOLTAGE (V)
10
6.0
8.0
10
Figure 5. Output Current versus Output Voltage
100
12.0
10.0
8.0
6.0
4.0
2.0
0
− 2.0
− 4.0
− 6.0
− 8.0
− 10.0
− 12.0
t TLH t THL , RISE/FALL TIME (s)
μ
I xx , SUPPLY CURRENT (mA)
Vin = 0 V, Vin = VIH
ICC
VCC = 12V
VEE = − 12 V
RWS = 100 kW, RL = ∞
Vin = 0 V
IEE
Vin = VIH
0
10
20
30
40
50
60
70
80
TA, AMBIENT TEMPERATURE (°C)
90
VCC = 12 V
VEE = − 12 V
CL = 30 pF
TA = 0°C, 70°C
10
TA = 25°C
1
10 k
100
Figure 6. Supply Current versus Temperature
100 k
RWS, WAVE SHAPING RESISTANCE (W)
Figure 7. Rise/Fall Time versus RWS
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4
1M
MC3488A
PACKAGE DIMENSIONS
SOIC−8 NB
D SUFFIX
PLASTIC PACKAGE
CASE 751−07
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
S
B
1
0.25 (0.010)
M
Y
M
4
K
−Y−
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC3488A
PACKAGE DIMENSIONS
PDIP−8
P1 SUFFIX
PLASTIC PACKAGE
CASE 626−05
ISSUE L
8
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5
−B−
1
4
F
−A−
NOTE 2
L
C
J
−T−
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
−−−
10 _
0.76
1.01
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
−−−
10_
0.030
0.040
N
SEATING
PLANE
D
H
DIM
A
B
C
D
F
G
H
J
K
L
M
N
M
K
G
0.13 (0.005)
M
T A
M
B
M
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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6
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For additional information, please contact your local
Sales Representative
MC3488A/D