Professional Manufacturer in Copper Clad Laminates
Aluminum Base Laminate / Prepreg
UL Approval: E214381
Version: Rev. 4
PROCESS GUIDELINE
VT-44A / VT-4A1 / VT-4A2 Laminate and thermal management prepreg
Precautions in Handling
The aluminum base laminates should be very handled careful
in transportation, and manufacturing process to avoid scratches
and cuts by sharp metal edges on both aluminum and copper
surface.
The thermal management prepreg should be handled with care
and wearing rubber gloves to avoid contamination is strongly
recommended during processing.
Storage Condition & Shelf Life
Prepreg
Storage
Condition
Laminate
Temperature
Below 23ºC (73ºF)
Below 5ºC (41ºF)
Room
Relative Humidity
Below 55% RH
/
/
3 Months
6 Months
12 Months (airproof)
Shelf Life*
Drilling Process
Parameter
Condition
Spindle Speeds (KRPM)
20~35
Feed Rates (IPM)
Chip Load (inch/Rev)
35~40
0.001~0.002
Retract Speeds (IPM)
Stack Heights
Hit Counts
600~1000
1~3 stacks
800~1800
• Entry boards and backup boards are required to minimize burr and prevent from copper damage.
Ventec Electronics (Suzhou) Co., Ltd
168 Xiang Yang Rd
Suzhou New District
Jiangsu
P.R. China 215009
T: +86 512 6809 1810
F: +86 512 6808 1823
Email: sales@ventec.com.cn
www.ventec-europe.com
Page 1 of 4
Issued: Oct-2011
Professional Manufacturer in Copper Clad Laminates
Aluminum Base Laminate / Prepreg
PROCESS GUIDELINE
Image Process
Process
Recommendation
Dry Film
The lamination speed maybe needs slower than standard FR-4 to have
metal substrate approach proper lamination temperature.
Wet Film
Both aluminum and copper could be coated to protect aluminum during
etching process. Follow instruction details of manufacturers.
Developing
Masking or film protection on aluminum is better during developing. Follow
chemical manufacturer’s recommendation.
• Dry filming and wet filming are both applicable process on aluminum base laminate.
• Before filming, cleaning of panel surface is necessary.
• Wet film process options
• Curtain
• Screen
Wet Process
Process
Recommendation
Etching
Alkaline or acid solution (cupric chloride, ferric chloride) are both
applicable.
Alkaline etching is faster than acid etching and is fit for below 3oz copper.
The acid etching performs well on preventing of undercut and over etch.
Stripping
Ventec Electronics (Suzhou) Co., Ltd
168 Xiang Yang Rd
Suzhou New District
Jiangsu
P.R. China 215009
Apply sodium hydroxide solution to remove etch resist and conveying
process is preferred.
T: +86 512 6809 1810
F: +86 512 6808 1823
Email: sales@ventec.com.cn
www.ventec-europe.com
Page 2 of 4
Issued: Oct-2011
Professional Manufacturer in Copper Clad Laminates
Aluminum Base Laminate / Prepreg
PROCESS GUIDELINE
Wet Process
Process
Recommendation
Solder masking
Control the thickness between 1~2mil or depends on boards design.
Pre-heating
Follow manufacturer’s recommendation on the setting of temperature and
time. Having a filter system in oven is preferred.
Developing
Solution concentration, temperature and spray pressure need to be
controlled.
Curing
Follow the details of temperature and time of manufacturer’s.
• Roughness of board surface is necessary to get better adhesion between boards and solder mask.
• Both thermal cured and UV cured solder mask are applicable.
• Masking options
• Screen Printing
• Curain Coating
• Spray Coating
• Roller Coating
Surface Finishing Options
Process
Recommendation
HASL
The most popular surface treatment method. Peel off the protective film
from aluminum before HASL.
OSP
Follow details of manufacturer’s recommendation.
ENIG
Popular in wire bonding application. Follow chemistry recommendation to
avoid defects of black pad and brickle gold.
Silver Immersion
Silver immersion has a better soldering ability but has disadvantage of
silver migration.
Ventec Electronics (Suzhou) Co., Ltd
168 Xiang Yang Rd
Suzhou New District
Jiangsu
P.R. China 215009
T: +86 512 6809 1810
F: +86 512 6808 1823
Email: sales@ventec.com.cn
www.ventec-europe.com
Page 3 of 4
Issued: Oct-2011
Professional Manufacturer in Copper Clad Laminates
Aluminum Base Laminate / Prepreg
PROCESS GUIDELINE
Fabrication
Process
Recommendation
Routing
Router Bit Diameter
2.0~3.0 mm
Spindle speed
20~30 KRPM
Feed Rates
45~60 IPM
Chip Load
0.0015~0.003 in/Rev
Travel Speed
20~30 IPM
Spindle speed
3000~7000 RPM
Travel Speed
10~20 m/min
V-Scoring
Punch
Follow tooling instruction of tool and die manufacturer.
Prepreg Press Profile
Process
Normal build-up (Do not need
filling pattern space or holes)
Special build-up (Need filling
pattern space or holes)
1. Heating rate(Rise of Rate) of material
[Material Temperature]:
2.5-3.5ºC/min (3.5~5.0ºF/min).
4~8ºC /min (7.2~14.4ºF/min)
2. Curing Temperature & Time:
>60min at more than 180ºC (356ºF)
[Material Temperature]
3. Full Pressure:
≥400psi after 5~10 minutes from
the pressing beginning
≥400psi after 5~10 minutes
4. Vacuuming
should be continued until over
140ºC (284ºF)
[Material Temperature]
5. Cold Press condition:
Keep Plate @ Room Temperature
by water;
Pressure: 100psi; Dwell
Time: 60minutes
Baking Recommendation During PCB Process
Process
Purpose
Cycle
Potential risk without
bake
Before HASL, PCB should be separate ( not
stacked) and supported in a rack for this process.
HASL process should be finished within 24 hours
after baking finishing.
To eliminate moisture
2 hours @ 125ºC
Potential for measling,
blister and delamination.
Before shipment
If PCB stored for > 1 months, PCB should be
baked before packaging.
To eliminate moisture
2~4 hours @ 125ºC
Potential for measling,
blister and delamination.
Ventec Electronics (Suzhou) Co., Ltd
168 Xiang Yang Rd
Suzhou New District
Jiangsu
P.R. China 215009
T: +86 512 6809 1810
F: +86 512 6808 1823
Email: sales@ventec.com.cn
www.ventec-europe.com
Page 4 of 4
Issued: Oct-2011