CONNECTOR PRODUCT OVERVIEW
FOR ADVANCED INTERCONNECTS
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2
www.molex.com
TABLE OF CONTENTS
Connector Overview..........................................................................................................................6.
Wire-To-Board.................................................................................................................................. 10.
Wire-To-Board Microminiature....................................................................................................................................10
Wire-To-Board Signal..................................................................................................................................................12
Wire-To-Board Power..................................................................................................................................................14
Wire-To-Board Ribbon Cable / Wire Trap....................................................................................................................15.
Wire-To-Board Storage...............................................................................................................................................15.
Wire-to-Wire................................................................................................................................... 16.
Wire-to-Wire Power....................................................................................................................................................16
Wire-to-Wire Signal....................................................................................................................................................17.
Board-to-Board............................................................................................................................... 18.
Board-to-Board High Speed.......................................................................................................................................18.
Board-to-Board Microminiature.................................................................................................................................19.
Board-to-Board Power...............................................................................................................................................20.
Board-to-Board Signal...............................................................................................................................................21.
Board-to-Board Storage.............................................................................................................................................22
Power up to 5A................................................................................................................................ 22.
Power up to 20A.............................................................................................................................. 23.
Power up to 21A+........................................................................................................................... 24.
I/O Connectors................................................................................................................................ 26.
I/O Connectors Consumer/PC....................................................................................................................................26
I/O Connectors Networking/Telecommunications......................................................................................................27
I/O Connectors Mobile Products................................................................................................................................28
I/O Connectors Industrial Products............................................................................................................................29
Backplane....................................................................................................................................... 30.
Backplane Connectors High Speed...........................................................................................................................30
Backplane Connectors Cable Assemblies.................................................................................................................31
FFC/FPC.......................................................................................................................................... 32.
Modular Jacks.................................................................................................................................. 36.
Solderless Terminals........................................................................................................................ 37.
Terminal Blocks............................................................................................................................... 38.
RF Products.................................................................................................................................... 39.
Sealed Connectors.......................................................................................................................... 40.
Memory Module Sockets.................................................................................................................. 42.
Memory Card Sockets...................................................................................................................... 43.
Standard Antennas.......................................................................................................................... 44.
Solid State Lighting......................................................................................................................... 45.
Switch Products.............................................................................................................................. 46.
Custom Solutions / Application Tooling............................................................................................. 47.
www.molex.com
3
MOLEX SOLUTIONS
ALWAYS AHEAD OF THE CURVE
Molex is a leading global
supplier of innovative
interconnect solutions.
To meet the needs of
customers all over the
world, we have developed
one of the industry’s
largest product portfolios,
including over 100,000
connectors, interface
solutions, application
tooling and more.
4
www.molex.com
Connector Product
Overview
for advanced interconnects
Molex innovative portfolio is always growing. Every
year, we design and manufacture solutions that set
new standards and drive innovation in a wide array
of markets – from telecom and computer networking,
to transportation and consumer goods, to medical
and lighting. We’re committed to looking ahead and
anticipating the needs of our customers.
Innovation through intensive research
With our state-of-the-art product design centers, Molex
has made a serious commitment to research and
development. All of our products are designed to meet
the demands of next-generation applications and are
based on a deep understanding of industry trends.
At Molex, we use the latest systems and technology,
including advanced Computer Aided Engineering
software and predictive engineering tools. It’s all part
of our focus on delivering tomorrow’s technologies,
today.
A strong commitment to sustainability
We believe the global environment is an important
issue for everyone. That’s why we not only adhere
to all environmental regulations, but also insist on
ecofriendly and safety-focused business practices.
www.molex.com
5
Connector
Overview
Wire-to-Board Connectors
SL™ (Stackable Linear) Modular Connectors
Micro-Fit 3.0™ Power Products
KK® Power and Signal Connectors
Mini-Fit® Power Products
MLX™ Power Connectors
6
www.molex.com
Connector
Overview
Mini-Fit Sr.™ Power Products
SlimStack™Products
Mezzanine Products
Power Products
EXTreme Power™ Products
Consumer I/O Products
7
www.molex.com
Connector
Overview
Backplane Board-to-Board Products
Backplane Wire-to-Board Products
Orthogonal Backplane Products
FFC/FPC Products
Modular Jacks and Plugs
RF Products
www.molex.com
8
Connector
Overview
Memory Card Products
DDR3 and DDR4 DIMM Sockets
High-Speed I/O Connectors
iPass+™ HD Interconnects
QSFP+ Interconnect Solutions
zQSFP+™ Interconnect Solutions
www.molex.com
9
Wire-To-Board
Microminiature
Product Name
Description
Flexible, high-performance microminiature IDT coaxial
connectors feature a double-clamp wire grounding
method that provides both electrical and mechanical
grounding. This method offers a more reliable
termination than hand-soldering and up to 60% less
transmission (dB) loss at frequencies between 1-3MHz.
Pitch
Current
Rating
Circuits
Size
0.40mm
N/A
30-50
•Consumer
1.00mm
1.0A
2-15
20-50
•Consumer
1.20mm
1.5A
2-6
•Transportation
•Consumer
•Mobile Devices
1.25mm
1.0A
2-30
12-14
15-20
•Transportation
•Consumer
•Medical
•Mobile Devices
1.25mm
1.0A
2-15
•Transportation
•Consumer
•Industrial Automation
•Medical
1.25mm
1.0A
2-40
•Transportation
•Consumer
•Data/Communications
1.25mm
1.0A
1.50mm
2.0A
2.00mm
3.0A
1.25mm
1.0A
Applications
Micro IDT Coaxial
Connectors
Pico-Clasp™ is a compact wire-to-board system, offered
in both single and dual-row versions. Friction and
(inner and outer) positive locks are offered for various
application needs. Other features include mating guides,
solder tabs and footprint compatibility with some
competitive versions.
Pico-Clasp™
Pico-EZmate™ connectors are compact and low-profile;
ideal for miniature, tight packaging, wire-to-board
applications. Locking features and vertical mating
between the receptacle housing and header enables
secure and easy placement in tight spaces.
Pico-EZmate™
PanelMate™
PicoBlade™
Mini Mi II™
CLIK-Mate™
Duo-Clasp™
10
PanelMate™ offers the lowest profile of any fullyshrouded wire-to-board system from Molex. The series
features an SMT header with robust solder tabs and
solder-conducing SMT fillet tail design for secure PCB
retention. The housing includes a friction lock for secure
mating and housing lance for safe and secure terminal
retention.
PicoBlade™ is offered in wire-to-board and wire-towire options, single row, with both SMT and throughhole headers. The system saves about 45% of PCB
space versus typical 2.00mm wire-to-board systems
whilst providing the same amperes of current. (Semi-)
automatic and manual tooling is available to support
crimp harness assembly.
Mini Mi II™ is a compact multi-harness system available
in both wire-to-board and wire-to-wire options. Custom
lengths and wire configurations, single/ dual row and
SMT/ through-hole styles available. Other features
include APQP certified, internal positive lock for
secure retention, and IDT housings for cost effective
termination.
CLIK-Mate™ wire-to-board connectors are designed for
applications that require higher pin-count connectors
to carry more signal lines in less space. A tuning-fork
terminal design provides low insertion force and a
secure mating contact. Reinforced metal solder tabs
ensure a secure PCB retention and solder joint strain
relief. Note: * single row †dual row.
Duo-Clasp™ dual-row, SMT connectors offer secure
positive lock-system for superior mating retention
and gold plating for increased durability. The dual-lock
design prevents the housing from being dislodged from
the PCB connector in case the wires are pulled, thus
ensuring high signal contact. Suitable for high volume
pick-and-place production.
2-15
2-15*
16-34†
•Consumer
4-15
20-40
•Consumer
www.molex.com
Wire-To-Board
Microminiature
Product Name
Pico-Spox™
Pico-Lock™
Flexi-Mate™
www.molex.com
Description
The Pico-Spox™ system includes crimp terminal,
receptacle housings and PCB headers. The box style
terminal makes contact with the header pin via two
inward-facing dimples ensuring high reliability. Vertical
and right-angle headers offer design flexibility. Friction
lock and polarising features provide secure retention
and proper mating.
The Pico-Lock™ 1.50mm pitch wire-to-board system
offers a mated height of just 2.00mm combined with a
current carrying capacity of 3.0A per contact. Secure
mating is achieved by side positive locks and top friction
locks. Increased board retention is helped by way of
wide robust fitting nails. Headers and housings are
polarised to prevent mis-mating.
The Flexi-Mate™ connector system provides a full
range of co-planar wire-to-board, board-to-board
and terminator options for the lighting industry. Key
features include a dual-contact terminal design for
secure electrical contact and space-saving positive side
locks. Guide features help facilitate mating and protect
terminals.
Pitch
Current
Rating
Circuits
Size
Applications
1.50mm
3.0A
2-15
•Consumer
•Data/Communications
•Medical
1.50mm
3.0A
4, 6, 7, 8
and 10
3.70mm
2.0A
2
•Automotive
•Consumer
•Solid State Lighting
•Industrial
•Telecoms
•Consumer
11
Wire-To-Board
Signal
Product Name
Description
The Milli-Grid™ family saves up to 40% in PCB real
estate over traditional 2.54mm pitch connectors.
Suitable for wire-to-board, board-to-board and IDT
cable-to board connections. Features include early
entry (long wipe) terminals, center polarisation key
and locking ramps, SMT and through-hole headers.
Pitch
Current
Rating
Circuits
Size
2.00mm
2.0A
4 -50
•Automotive
•Consumer
•Networking
•Telecommunications
•Automotive
•Consumer
•Industrial
•Medical
•Smart Phones and
Mobile Devices
Applications
Milli-Grid™
iGrid™
DuraClik™
iGrid™ wire-to-board dual-row system comes with
an anti-tangle internal positive lock providing space
savings and secure mating retention, in a compact and
robust design to withstand rugged handling and high
vibration. Includes crimp terminals, receptacle housings
and fully shrouded PCB headers in straight and rightangle configurations.
DuraClik™ connectors meet various space constraints
and harness installation needs due to the right-angle
and vertical configuration options. Features include
wide solder tabs, positive inner-lock and an audible
mating sound, footprint compatibility, dust and damage
reppelent contact design and an open area for pick-andplace.
MicroClasp™ wire-to-board system includes a unique
inner positive lock that provides latch protection, secure
retention and an audible mating “click”. The terminal
design offers low insertion and withdrawal forces. Single
and dual-row crimp receptacles and PCB headers are
available in SMT and through-hole configurations.
2.00mm
2.0A
10-40
2.00mm
3.0A
2-12
•Automotive
•Commercial Vehicle
•Industrial Automation
2.00mm
3.0A
2-40
•Consumer
•Industrial
•Medical
2.00mm
2.0A
2-15
•Consumer
•Data/Communications
2.00mm
3.0A
4-15
•Consumer
•Data/Communications
2.00mm
2.0A
2-20
•Automotive
•Consumer
2.00mm
2.0A
2-15
•Automotive
•Consumer
Micro-Clasp™
MicroBlade™
Micro-Lock™
Sherlock™
Micro-Latch™
12
MicroBlade™ system offers a reliable box-type terminal
that provides secure electrical contact, optional IDT
receptacle and fully shrouded headers in straight, rightangle and bottom-entry versions. Features include a
low-profile mated height for space savings, user-friendly
friction lock with housing windows and polarisation
options to prevent mis-mating.
Micro-Lock™ connectors feature a wide mating latch
with two-point positive lock for secure mating retention.
The system provides the optimal combination of pin
protection, low profile and low-insertion force enabling
easy mating and unmating. ‘Crash Free’ mating design
protects housing terminals and header pins from
damage.
The Sherlock™ family consists of vertical and rightangle headers, crimp housings and reliable box-style
terminals. Key features include a positive locking latch
that withstands high vibration and permits unmating
only when activated, a low mated profile for space
saving, and polarised sidewalls that prevent mismating
and provide mating guidance.
Micro-Latch™ connectors ensure durable mating and
protection of the electrical circuits due to a friction-lock
mechanism where the noses on the latching receptacle
housing slide into the header wall openings. Throughhole versions are available for both right-angle and
surface-mount compatible vertical headers. Polarising
features help prevent mis-mating.
www.molex.com
Wire-To-Board
Wire-to-Board
Signal
Connectors
Product Name
Product Name
Product
Image
Mini-Lock™
Mini-Lock
Description
Versatile wire-to-board and wire-to-wire system
Description
including
terminals, crimp housings and fully-shrouded
straight and right-angle headers available in tray and
radial tape packaging. Features include a four-point
contact wire-to-board
design for electrical
reliability, system
guide walls and
Versatile
and wire-to-wire
pull tabsterminals,
for easy mating/unmating,
anti-fishhooking
including
crimp housings and
fully
contact for safe harness assembly.
shrouded straight and right-angle headers available
in tray and radial tape packaging. Features include:
four-point contact design for electrical reliability;
SPOXwalls
BMI™and
(Blind-Mate
Interface)
connectors offer
guide
pull tabs for
easy mating/unmating;
low-profile, dual-row,
and wire-to-board
anti-fishhooking
contactwire-to-wire
for safe harness
assembly.
Pitch
Pitch
2.50mm
2.50mm
Current
Rating
Current
Rating
3.0A
3.0A
Circuits
Size
Circuits
Size
2-15
2-15
Applications
Applications
•Consumer
•Industrial
Consumer
Industrial
solutions. Self-aligning features and mated stack
distance of only 11.00mm allow for secure use in both
Duplicate
Product
Image
SPOX BMI™
Spox BMI
Product
Image
SPOX™
horizontal and vertical directions. Multiple pin counts
permit design flexibility and provide solutions for both
power and signal applications.
The SPOX™ family features Mini-SPOX™, including
crimp and IDT housings, wire-to-wire and wire-to-board
options, and Macro-SPOX™, including unshrouded and
Duplicate
partially shrouded headers, along with board-to-board
options. The “spring box“-shaped terminals provide
multiple points of contact assuring excellent signal
integrity.
2.54mm
10.0mm
(0.393”)
2.505.08mm
10.0mm
(0.393”)
3.0A
30.0A
(Power
Blade)
3.0-7.0A
30.0A
(Power
Blade)
6-16
•Networking
•Telecommunications
2
2-16
1
•Transportation
•Consumer
•Data/Communications
•Industrial Automation
Spox
The 3rd generation C-Grid III™ system offers unique
design features including 3 different plating options - a
Duplicate
termination technique supporting discrete wire and
Product
Image
ribbon cable connectors, inter-mateability with Molex‘s
QF-50 product line and full compatibility with DIN41651, 2.54mm
10.0mm
HE-13/14 standard connector systems.
(0.393”)
C-Grid III™
C-Grid III
3.0A
30.0A
(Power
Blade)
2-130
1
•Transportation
•Consumer
SL™ (Stackable Linear) is a modular, single-row, wire-
Duplicate
to-wire and wire-to-board system including press-fit
Product
Image
SL Modular
SL
SL™
Connectors
Product
Image
XYZ product name
®
product
name
KK
Product
Image
XYZ product name
product name
Product
Image
XYZ product name
product name
Note: do not
change font size
in this template
www.molex.com
(compliant-pin), through-hole and SMT PCB termination.
Latching vertical/right-angle headers; discret wire, FFC
and IDT crimp housings are available. SL™ intermates
with CGrid® and KK® product families in same pitch to
provide design flexibility and configuration options.
10.0mm
2.54mm
(0.393”)
30.0A
3.0A
(Power
Blade)
Minctor
endisqu
aesequos
sandanim and
lat ant
qui vel
A versatile
single-row
wire-to-board
board-to-board
crimp contact
system.
Vertical
and right-angle PCB
magnam
qulaccus,
solorep,
blablablubbblubb,
headers withrem,
or without
polarisation
locks.
tatemolorum
Aceaque,
veni, vidi,and
vici,friction
endisqu
Right-angle
top- andlatbottom-entry
PCB connectors
aesequos
sandanim
ant qui vel magnam
mate with standard headers to facilitate board-to-board
qulaccus,
lat ant qui vel magnam Aceaque, veni, vidi,
configurations.
vici, endisqu aesequos sandanim lat ant qui vel
magnam qulaccus,
10.0mm
2.50mm/
(0.393”)
30.0A
(Power
4.0A
Blade)
Minctor endisqu aesequos sandanim lat ant qui vel
magnam qulaccus, solorep, blablablubbblubb,
tatemolorum rem, Aceaque, veni, vidi, vici, endisqu
aesequos sandanim lat ant qui vel magnam
qulaccus, lat ant qui vel magnam Aceaque, veni, vidi,
vici, endisqu aesequos sandanim lat ant qui vel
magnam qulaccus,
10.0mm
(0.393”)
30.0A
(Power
Blade)
3
Minctor endisqu aesequos sandanim lat ant qui vel
magnam qulaccus, solorep, blablablubbblubb,
tatemolorum rem, Aceaque, veni, vidi, vici, endisqu
aesequos sandanim lat ant qui vel magnam
qulaccus, lat ant qui vel magnam Aceaque, veni, vidi,
vici, endisqu aesequos sandanim lat ant qui vel
magnam qulaccus,
10.0mm
(0.393”)
30.0A
(Power
Blade)
3
2.54mm
2-25
3
3
2-28
•Transportation
•Consumer
•Data/Communications
•Industrial Automation
•Medical
•Networking
•Transportation
•Consumer
•Data/Communications
•Industrial Automation
•Medical
•Networking
13
Wire-To-Board
Power
Product Name
Mini-Fit Sr.™
RAST Connectors
KK® 396
Standard .093’’
Mini-Fit® Products
Description
Mini-Fit Sr.™ power connectors offer a compact wireto-wire and wire-to-board high-current system capable
of handling up to 50.0A per contact. This single- and
dual-row system is UL, CSA and TUV approved. Features
include integrally molded TPA’s on single-row products,
positive locking and polarised housings across all circuit
sizes.
Molex offers the full range of RAST IDT connectors and
headers. RAST 5 for indirect mating in either 10.0A or
16.0A versions. RAST 2.5 for direct and indirect mating
and RAST Power in both 6.0A and 10.0A versions
for direct or indirect mating. Multiple polarisation
and coding options are available as standard and all
products are Glow Wire compliant.
Able to handle up to 13.0A per contact when using
the MarKK terminal the KK® 396 wire-to-board and
board-to-board system is ideal for use in many varied
applications. RPC (reflow process compatible) headers
are also available in vertical and right-angle friction-lock
variations. UL 94V-0 and Glow wire compliant versions
are also available.
Industry standard .093” pin-and-socket power
connectors are suitable for wire-to-wire and wire-toboard configurations. Terminals can be used in both plug
or receptacle housings allowing for design flexibility.
PCB headers are also available. Features include panel
mount and free hanging housings with positive locks
and fully isolated contacts.
The Mini-Fit® family is designed for higher-current /
higher-density applications which require design
flexibility for wire-to-wire, wire-to-board and board-toboard configurations. Features include fully isolated
terminals, positive locking, low-engagement forces and
polarised housings and receptacles. Glow wire
compliant and Halogen free versions are available.
The MLX™ series is interchangeable, intermateable and
intermountable with industry standard products. This
allows greater flexibility in mating with existing wire
harnesses, connectors or PCB headers. The housings
are designed for both male and female terminals.
Housings are fully polarised and offer positive locking.
Pitch
Current
Rating
Circuits
Size
Applications
10.00mm
50.0A
2 – 14
•Commercial Vehicles
•Consumer
•Industrial Automation
•Medical
•Networking
2.50mm
5.00mm
4.0A
16.0A
1 - 20
•Home Appliance
•Consumer
•Automotive
3.96mm
Up to
13.0A
2-24
•Automotive
•Consumer
•Industrial
•Medical
5.03mm
17.0A
1-15
•Consumer
•Data/Communications
•Networking
4.20mm
13.0A
2 - 24
•Consumer
•Data/Communications
•Industrial Automation
•Networking
•Medical
•Automotive
•Commercial Vehicle
•Military/Aerospace
•Telecommunications
•Alternative Energy
Source
6.35mm
13.5A
1-15
•Commercial Vehicle
•Consumer
•Industrial Automation
Networking
MLX™
Micro-Fit™
Products
Mega-Fit
14
The Micro-Fit™ family is a wire-to-wire, wire-to-board
and board-to-bord connector system in single- and dualrow configurations. Features include blind mate (BMI),
compliant pin (CPI) and reduced mating force (RMF)
options. PCB-mount headers are available in straight and
right angle, SMT and through-hole types, halogen-free
and glow-wire compliant materials.
Mega-Fit Power Connectors deliver cutting-edge current
density at 23.0A per circuit; terminals provide six
independent contact points for long-term reliability in
virtually every industry and application. Available in
a wire-to-board configuration with vertical and rightangled headers along with UL94V-0 and glow-wire
compliant housings.
3.00mm
5.70mm
5.0A
23.0A
2-24
2-12
•Alternative Energy
Source
•Consumer
•Data/Communications
•Medical
•Military/Aerospace
•Telecommunications
•Consumer
•Home Appliance
•Commercial Vehicle
•Industrial
•Telecom
www.molex.com
Wire-To-Board
Ribbon Cable /
Wire Trap
Product Name
Picoflex®
Lite-Trap™
Description
The 8 versatile series of Picoflex® receptacles and
headers, including the reverse-footprint SMT headers in
standard and latched versions, enable maximum design
flexibility. Picoflex offers excellent polarisation to both
the PCB and between the female connector and header.
Plating options include tin and palladium nickel with
gold flash.
Lite-Trap™ is a low profile (4.20mm) SMT wire-to-board
connector ideal for the lighting industry. A stripped
wire is inserted into the connector and pushes open a
gate-style terminal that “traps” the wire. To unmate,
a button-style lever on the housing top is pushed
down to allow the wire to be removed. The connector
also features a compact industry standard PCB layout
pattern.
Pitch
Current
Rating
Circuits
Size
Applications
•Alternative Energy
Source
•Automotive
•Consumer
•Data/Communications
•Industrial Automation
•Medical
1.27mm
1.2A
4-26
4.0mm
9.0A
1 and 2
•Solid State Lighting
•Consumer
•Industrial
Wire-To-Board
Storage
Product Name
iPass™
Serial ATA
Micro SATA
Serial Attached
SCSI – SFF 8482
Description
The iPass™ Interconnect System offers both
connectors and cable assemblies that enable flexible
speed compatibility for applications ranging from 1.5
Gbps up through 10.0 Gbps. Cable assemblies provide
100 Ohm differential impedance with tight skew control
and low crosstalk, available in multiple standard /
custom cable lengths.
Molex leads the way with an ever growing family of
SATA interconnect solutions including latching cable
receptacles in both straight- and right-angle versions
for Parallel ATA to Serial ATA conversion, locking PCB
plugs that are backwards-compatible in right-angle and
vertical options, and combo external SATA and USB
receptacles for effective storage.
Low-Insertion-Force Micro SATA Revision 3.0
Specification-compliant interconnects deliver highspeed data at 6 Gbps with uncompromised quality
for 1.80” Solid State Drives, mobile computing and
consumer applications. Features include FMLB, guide
post and pockets, friction locks, solder tabs and high
temperature thermoplastic housings.
Also known as SAS Backplane Connector, this connector
has the same form factor as Serial ATA with the addition
of a “bump” to key it specifically for SAS. Features
include point-to-point topology, disk/ backplane
interoperability with Serial ATA, hot plug, blind-mate
connections, 3.0 Gbps transfer rate, compact cabling
and multiple receptacle options.
Serial Attach SCSI uses a point-to-point architecture
which works in conjunction with PCI Express and other
high-speed architectures on the market such as Serial
ATA. Molex offers a broad range of connectors ranging
from SAS Multi-Lane cable assemblies to SAS vertical
and right angle Internal Multi-Lane connectors.
Pitch
Current
Rating
Circuits
Size
Applications
0.75mm
0.80mm
1.27mm
N/A
Multiple
•Data/Communications
•Networking
•Telecommunications
Multiple
N/A
Multiple
•Consumer
•Networking
•Storage
1.27mm
1.32mm
5.08mm
1.5A AC
or DC
14, 16
•Consumer
•Data/Communications
0.80mm,
1.27mm
N/A
Multiple
•Data/Communications
•Networking
•Telecommunications
Multiple
N/A
Multiple
•Consumer
•Networking
Serial Attached
SCSI – SFF 8484
www.molex.com
15
Wire-To-Wire
Power
Product Name
MX150L™
Versablade™
Description
Offered in wire-to-wire, wire-to-panel and wire-toboard configurations, the IP67-rated MX150L™ system
provides design flexibility for low level signal to high
power applications. Key features include pre-assembled
connector housings, integral TPA and two-way mat seal
on mating connector, sealed panel-mount plugs and
proven blade-type terminals.
The Versablade™ wire-to-wire connector system
consists of wide flat blade tab terminals (1.78mm),
multi-configured modular housings and terminal position
assurance inserts for modularity and design flexibility in
various applications. Other features include positive lock
and TPA secondary lock, single-row system and spring
style mounting ears.
The MLX™ series is interchangeable, intermateable and
intermountable with industry standard products. This
allows greater flexibility in mating with existing wire
harnesses, connectors or PCB headers. The housings
are designed for both male and female terminals.
Housings are fully polarised and offer positive locking.
Pitch
Current
Rating
Circuits
Size
Applications
5.84mm,
7.62mm
Up to
18.0A
and
40.0A
2-16
•Commercial Vehicle
•Consumer
•Industrial Automation
Various
4.0A -15.0A
1-9
•Consumer
•Industrial Automation
1 - 15
•Commercial Vehicle
•Consumer
•Industrial Automation
Networking
6.35mm
13.5A
MLX™
Mini-Fit
Products
®
Standard .093’’
4.20mm
13.0A
2 - 24
•Consumer
•Data/Communications
•Industrial Automation
•Networking
•Medical
•Automotive
•Commercial Vehicle
•Military/Aerospace
•Telecommunications
•Alternative Energy
Source
5.03mm
17.0A
1-15
•Consumer
•Data/Communications
•Networking
The Industry standard 0.62“ pin-and-socket wire-to-wire
connector system provides a robust economical solution
to applications needing a current handling capability of
up to 5.0A. Housings will accept both male and female
terminals and are polarised to eliminate mismating.
3.68mm
5.0A
1-36
•Consumer
•Data/Communications
•Networking
Smallest pitch wire-to-wire connector system for 100
to 300 V signal and power applications when using
2.60mm diameter wire. The system features a positive
lock design for secure mating, fully shrouded contacts
and an optional TPA retainer.
3.30mm
4.0A
2-6
•Consumer
•Industrial Automation
6.35mm
10.0A
2-24
•Consumer
•Industrial Automation
The Mini-Fit® family is designed for higher-current /
higher-density applications which require design
flexibility for wire-to-wire, wire-to-board and board-toboard configurations. Features include fully isolated
terminals, positive locking, low-engagement forces and
polarised housings and receptacles. Glow wire compliant
and Halogen free versions are available.
Industry standard .093” pin-and-socket power
connectors are suitable for wire-to-wire and wire-toboard configurations. Terminals can be used in both plug
or receptacle housings allowing for design flexibility.
PCB headers are also available. Features include panel
mount and free hanging housings with positive locks
and fully isolated contacts.
Standard .062’’
Inertia Lock
3.30mm
Beau™ plug and socket blade-type connectors provide
superior durability over hollow-pin connectors, allowing
repetitive mating without any damage. Thermoplastic
backshells provide greater dielectric strength and
safety, uniform float contacts enable maximum surface
engagement, low contact resistance and easier mating.
Beau™
Power Connectors
16
www.molex.com
Wire-To-Wire
Power
Product Name
Micro-Fit™
Products
Description
The Micro-Fit™ family is a wire-to-wire, wire-to-board
and board-to-bord connector system in single- and dualrow configurations. Features include blind mate (BMI),
compliant pin (CPI) and reduced mating force (RMF)
options. PCB-mount headers are available in straight
and right angle, SMT and through-hole types, Halogen
Free and Glow Wire compliant materials.
Pitch
3.00mm
Current
Rating
5.0A
Circuits
Size
2-24
Applications
•Alternative Energy
Source
•Consumer
•Data/Communications
•Medical
•Military/Aerospace
•Telecommunications
Wire-To-Wire
Signal
Product Name
SPOX™
SPOX BMI™
Mizu-P25™
SL™ Modular
Connectors
www.molex.com
Description
The SPOX™ family features Mini-SPOX™, including
crimp and IDT housings, wire-to-wire and wire-to-board
options and Macro-SPOX™, including unshrouded and
partially shrouded headers, along with board-to-board
options. The “spring box“-shaped terminals provide
multiple points of contact assuring excellent signal
integrity.
SPOX BMI™ (Blind-Mate Interface) connectors offer
low-profile, dual-row, wire-to-wire and wire-to-board
solutions. Self-aligning features and mated stack
distance of only 11.00mm allow for secure use in both
horizontal and vertical directions. Multiple pin counts
permit design flexibility and provide solutions for both
power and signal applications.
Mizu-P25™ wire-to-wire connector system is IP67
certified. The family includes systems rated up to
125 V and 250 V. Due to their small dimensions both
systems are ideal for wire-to-wire applications in
confined spaces. Other features include positive locking,
polarisation and special terminal designs for high
vibration applications.
SL™ (Stackable Linear) is a modular, single-row, wireto-wire and wire-to-board system including press-fit
(compliant-pin), through-hole and SMT PCB termination.
Latching vertical/right-angle headers; discret wire,
FFC and IDT crimp housings are available. SL™
intermates with CGrid® and KK® product families
in same pitch to provide design flexibility and
configuration options.
Pitch
Current
Rating
Circuits
Size
Applications
2.505.08mm
3.0-7.0A
2-16
•Transportation
•Consumer
•Data/Communications
•Industrial Automation
2.54mm
3.0A
6-16
•Networking
•Telecommunications
2.50mm
3.0/4.0A
2-4
•Transportation
•Consumer
•Industrial Automation
2-25
•Transportation
•Consumer
•Data/Communications
•Industrial Automation
•Medical
•Networking
2.54mm
3.0A
17
Board-To-Board
High Speed
Product Name
Impact™
GbX I-Trac™
Description
The Impact™ backplane connector system for conventional, coplanar and mezzanine configurations
provides data rates up to 25 Gbps and superior signal
density up to 80 differential pairs per inch. Achieve low
cross-talk and high signal bandwidth while minimising
channel-performance variation across every differential
pair within the system.
GBX I-Trac™ system, available in standard backplane,
orthogonal midplane, high-current power modules,
inverted and coplanar configurations provides design
flexibility and enables future system performance
upgrades without requiring platform re-design. Capable
of supporting next-generation applications with data
rates of 12.5 Gbps or higher.
Speed
Density
Orientation
Applications
25 Gbps
80 diff
pair / sq inch
Conven
Coplanar
Mezz
•Data Communications
•Telecommunications
•Military/Aerospace
12.5 Gpbs
69 diff
pair / sq inch
Conven
Coplanar
Inverted
Orthog
•Networking
•Telecommunications
The Z-PACK TinMan’s press-fit, flexible, mono-block
based system can be stacked end-to-end to meet
customer pin-count requirements. The system delivers
integrated shielding, differential-pair density, 85 Ohm
66 diff
impedance and lower crosstalk and insertion loss versus 12.5 Gbps
pair / sq inch
100 Ohm backplane systems.
Z-PACK TinMan*
Conven
Mezz
•Data Communications
•Medical
•Networking
•Telecommunications
Conven
Coplanar
Orthog
•Data Communications
•Medical
•Networking
•Telecommunications
Conven
Coplanar
•Data Communications
•Industrial Automation
•Medical
•Military/Aerospace
•Networking
•Telecommunications
170 ckt.
•Medical
•Instrumentation
•Telecommunications
*Z-PACK and Z-PACK TinMan are trademarks of Tyco Electronics
GbX® backplane connectors deliver high-density and
high-speeds up to 10 Gbps and are custom-configurable.
Bifurcated contact beams in daughtercard receptacles
ensure greater reliability with 2 points of contact to
each header pin.
10 Gbps
GbX® is a registered trademark of Amphenol Corporation
69 diff
pair / sq inch
†
GbX
®†
Very High Density Metric connectors achieve highspeed signal integrity via interstitial signal and ground
shields between columns. Standard VHDM®* connectors
support data rates of 3.125 Gbps with less than 5%
crosstalk; H-series supports up to 6.25 Gbps.
*VHDM is a registered trademark of Amphenol Corporation
Up to
100 diff
6.25 Gbps pair / sq inch
VHDM®
MicroTCA delivers a low-cost, flexible and scaleable
solution with 10.0 Gbps data rate for a wide variety of
low to mid-range telecom applications. This press-fit,
vertical, edge-card connector provides 170 contacts on
0.75mm pitch and enables AdvancedMC (AMC) cards to
be plugged directly to a backplane.
10Gbps
1.5A
MicroTCA
18
www.molex.com
Board-To-Board
Microminiature
Product Name
SlimStack™
Description
Molex’s SlimStack™ family of board-to-board connectors
offers stacking heights from 0.70mm to 20.00mm. All
versions are gold-plated for high reliability over multiple
mating cycles. Other features include a durable bladeon-beam contact, SMT tails that create strong solder
fillets, and a friction locking feature for added mating
retention.
Standardised PCI mezzanine card connectors have a
fully shrouded leaf-style design which minimizes the
chance of damaging plug contacts. Receptacle contacts
feature a low mating force that reduces PCB stress.
Gold over Nickel contact plating enhances long-term
reliability. LCP housings enable SMT reflow processing.
Pitch
Current
Rating
Circuits
Size
0.40/0.50
0.635/
1.00mm
0.4/0.5A
6-140
1.00mm
1.0A
64-256
0.7mm 4.5mm
1.5-7.0A
2-10
3.70mm
2.0A
2
0.75mm
1.5A
170
Applications
•Transportation
•Consumer
•Consumer
• Networking
•Telecommunications
PMC
Compression
Connectors
Flexi-Mate™
Molex’s compression connectors offer design flexibility,
reduced component counts and a high degree of
manufacturability. The range includes parts with a
height above the board of 0.60mm and contact pitches
as small as 0.70mm. The high temperature materials
used in the manufacturing process enable the parts to
be IR reflow soldered.
The Flexi-Mate™ connector system provides a full
range of co-planar wire-to-board, board-to-board
and terminator options for the lighting industry. Key
features include a dual-contact terminal design for
secure electrical contact and space-saving positive side
locks. Guide features help facilitate mating and protect
terminals.
MicroTCA delivers a low-cost, flexible and scaleable
solution with 10.0 Gbps data rate for a wide variety of
low to mid-range telecom applications. This press-fit,
vertical, edge-card connector provides 170 contacts on
0.75mm pitch and enables AdvancedMC (AMC) cards to
be plugged directly to a backplane.
•Transportation
•Consumer
•Mobile Devices
•Consumer
•Medical
•Instrumentation
•Telecommunications
MicroTCA
www.molex.com
19
Board-To-Board
Power
Product Name
EXTreme
PowerMass™
EXTreme
Ten60Power™
EXTreme
ZPower™
Description
EXTreme PowerMass™ is a high-current, boardto-board, modular connector system, providing
customer-specific interconnect solutions for AC and
DC power requirements. The system offers a density
of up to 350.0A per inch while providing minimum
heat generation due to extremely low plane-to-plane
resistance.
EXTreme Ten60Power™ is easily configured to meet
special design requirements with no tooling costs! The
system is a modular high-current power and signal
connector system in a coplanar and right-angle boardto-board orientation. The low profile (10.0mm height)
helps to enhance the system airflow within the power
system.
EXTreme ZPower™ is a high-current, rigid, board-toboard and wire-to-board mezzanine style interconnect
designed to transfer power loads from one PCB to
another. The connector is press-fit into the PC base
board. The PC top board is then screwed down on top of
the EXTreme ZPower connector, forming a high-pressure
interface.
EXTreme PowerEdge™ is a one-piece vertical card edge
style connector, used with either gold finger pc boards,
or as a bus bar interconnect for power supply and power
distribution applications. Connectors are available in
power only, signal only and power/signal combinations
and can be configured for AC and DC power systems.
Pitch
Current
Rating
Circuits
Size
Various
150.0A,
80.0A,
40.0A
Multiple
power and
signal
Various
60.0A
Multiple
•Industrial Automation
•Networking
•Telecommunications
10.30mm
30.0A
1
•Industrial Automation
•Power Supplies
•Telecommunications
Various
40.0A
Multiple
•Networking
•Telecommunications
Various
40.0A
3.0A
Multiple
•Consumer
•Data Communications
•Industrial Automation
•Networking
•Telecommunications
Various
35.0A
3.0A
Multiple
•Data Communications
•Industrial Automation
•Networking
•Telecommunications
Various
30.0A
1.0A
Multiple
•Data Communications
•Industrial Automation
•Networking
•Telecommunications
2 - 24
•Consumer
•Data/Communications
•Industrial Automation
•Networking
•Medical
•Automotive
•Commercial Vehicle
•Military/Aerospace
•Telecommunications
•Alternative Energy
Source
Applications
•Networking
•Telecommunications
EXTreme
PowerEdge™
EXTreme PowerDock™ interconnects include guide pins
for blind mating, mounting ears option for mechanical
attachment to the PCB, power blades and signal pins
in multiple lengths and press-fit tails. This family can
be used as a drop-in replacement in many existing
applications due to its custom configurable nature.
EXTreme
PowerDock™
EXTreme
LPHPower™
The EXTreme LPHPower™ connector is a mixed, highcurrent power and signal connector system with power
blades parallel to the PC board. Its extremely lowprofile height of only 7.50mm allows greater system
airflow while taking up 53% less space than traditional
connectors with the same current rating. Right-angle,
coplanar or vertical configurations are available.
EXTreme PowerPlus™ series conforms to the Server
System Infrastructure (SSI) open specification. Features
include recessed signal-pins and sequential mating
(LMFB) that allows the hot-swapping of power supply
units on the male side, guide pockets (headers) or guide
posts (receptacles) and fully shrouded headers.
EXTreme
PowerPlus™
Mini-Fit®
Products
20
The Mini-Fit® family is designed for higher-current /
higher-density applications which require design
flexibility for wire-to-wire, wire-to-board and board-toboard configurations. Features include fully isolated
terminals, positive locking, low-engagement forces and
polarised housings and receptacles. Glow wire compliant
and Halogen free versions are available.
4.20mm
13.0A
www.molex.com
Board-To-Board
Power
Product Name
KK® 396
Description
Able to handle up to 13.0A per contact when using
the MarKK™ terminal the KK® 396 wire-to-board and
board-to-board system is ideal for use in many varied
applications. RPC (reflow process compatible) headers
are also available in vertical and right-angle friction-lock
variations. UL 94V-0 and Glow Wire compliant versions
are also availble.
Pitch
Current
Rating
Circuits
Size
3.96mm
Up to
13.0A
2-24
Applications
•Automotive
•Consumer
•Industrial
•Medical
Board-To-Board
Signal
Product Name
Description
The Milli-Grid™ family, saves up to 40% in PCB real
estate over traditional 2.54mm pitch connectors.
Suitable for wire-to-board, board-to-board and IDT
cable-to board connections. Features include early
entry (long wipe) terminals, center polarisation key
and locking ramps, SMT and through-hole headers.
Pitch
Current
Rating
Circuits
Size
2.00mm
2.0A
4 -50
•Automotive
•Consumer
•Networking
•Telecommunications
•Transportation
•Consumer
•Data/Communications
•Industrial Automation
•Medical
•Networking
Applications
Milli-Grid™
A versatile single-row wire-to-board and board-to-board
crimp contact system. Vertical and right-angle PCB
headers with or without polarisation and friction locks.
Right-angle top- and bottom-entry PCB connectors
mate with standard headers to facilitate board-to-board
configurations.
2.54mm
5.0A
2-36
2.54mm
3.0A
2-130
•Transportation
•Consumer
2-25
•Transportation
•Consumer
•Data/Communications
•Industrial Automation
•Medical
•Networking
KK® 254
The 3rd generation C-Grid III™ system offers unique
design features including 3 different plating options,
a termination technique supporting discrete wire and
ribbon cable connectors, inter-mateability with Molex‘s
QF-50 product line and full compatibility with DIN41651,
HE-13/14 standard connector systems.
C-Grid III™
SL™ Modular
Connectors
www.molex.com
SL™ (Stackable Linear) is a modular, single-row, wireto-wire and wire-to-board system including press-fit
(compliant-pin), through-hole and SMT PCB termination.
Latching vertical/right-angle headers; discret wire,
FFC and IDT crimp housings are available. SL™
intermates with CGrid® and KK® product families
in same pitch to provide design flexibility and
configuration options.
2.54mm
3.0A
21
Board-To-Board
Storage
Product Name
Serial ATA
Micro SATA
EBBI™ 50D
Description
Molex leads the way with an ever growing family of
SATA interconnect solutions including latching cable
receptacles in both straight- and right-angle versions
for Parallel ATA to Serial ATA conversion, locking PCB
plugs that are backwards-compatible in right-angle and
vertical options, and combo external SATA and USB
receptacles for effective storage.
Low-Insertion-Force Micro SATA Revision 3.0
Specification-compliant interconnects deliver highspeed data at 6 Gbps with uncompromised quality
for 1.80” Solid State Drives, mobile computing and
consumer applications. Features include FMLB, guide
post and pockets, friction locks, solder tabs and high
temperature thermoplastic housings.
Molex‘s versatile low-cost EBBI™ 50D series are
unshielded, high density, leaf-style connectors
available in vertical, right-angle, blind-mating and SMT
configurations. Housings are UL 94V-0 approved, the IDT
receptacles mate to standard .062 inch pc card edge
and terminals are plated with 30µ“ minimum gold in the
mating area.
Pitch
Current
Rating
Circuits
Size
Multiple
N/A
Multiple
1.27mm
1.32mm
5.08mm
1.5A AC
or DC
14, 16
1.27mm
1.0A
30 - 130
Applications
•Consumer
•Networking
•Storage
•Consumer
•Data/Communications
•Data communication
•Telecommunication
Power Connectors
Current up to 5A
Product Name
Micro-Fit™ 3.0
Description
The Micro-Fit™ family is a wire-to-wire, wire-to-board
and board-to-bord connector system in single and dual
row configurations. Features include blind mate (BMI),
compliant pin (CPI) and reduced mating force (RMF)
options. PCB mount headers available in straight and
right angle, SMT and T/H types. Halogen-free and glowwire compliant materials.
A versatile single-row wire-to-board and board-to-board
crimp contact system. Vertical and right-angle PCB
headers with or without polarisation and friction locks.
Right-angle top- and bottom-entry PCB connectors
mate with standard headers to facilitate board-to-board
configurations.
Pitch
3.00mm
Current
Rating
5.0A
Circuits
Size
Applications
2-24
•Alternative Energy
Source
•Consumer
•Data/Communications
•Medical
•Military/Aerospace
•Telecommunications
2.54mm
5.0A
2-36
•Transportation
•Consumer
•Data/Communications
•Industrial Automation
•Medical
•Networking
3.68mm
5.0A
1-36
•Consumer
•Data/Communications
•Networking
KK 245®
The Industry standard 0.62“ pin-and-socket wire-to-wire
connector system provides a robust economical solution
to applications needing a current handling capability of
up to 5.0A. Housings will accept both male and female
terminals and are polarised to eliminate mismating.
Standard .062’’
22
www.molex.com
Power Connectors
Current up to 20A
Product Name
Mini-Fit®
Products
Description
The Mini-Fit® family is designed for higher-current /
higher-density applications which require design
flexibility for wire-to-wire, wire-to-board and board-toboard configurations. Features include fully isolated
terminals, positive locking, low-engagement forces
and polarised housings and receptacles. Glow Wire
compliant and Halogen free versions are available.
The MLX™ series is interchangeable, intermateable and
intermountable with industry standard products. This
allows greater flexibility in mating with existing wire
harnesses, connectors or PCB headers. The housings
are designed for both male and female terminals.
Housings are fully polarised and offer positive locking.
Pitch
Current
Rating
Circuits
Size
Applications
4.20mm
13.0A
2 - 24
•Consumer
•Data/Communications
•Industrial Automation
•Networking
•Medical
•Automotive
•Commercial Vehicle
•Military/Aerospace
•Telecommunications
•Alternative Energy
Source
6.35mm
13.5A
1 - 15
•Commercial Vehicle
•Consumer
•Industrial Automation
Networking
5.03mm
17.0A
1-15
•Consumer
•Data/Communications
•Networking
5.00mm
10.0A,
16.0A
1-8
•Consumer
MLX™
Standard .093’’
RAST 5
Sabre™
KK™ 396
www.molex.com
Industry standard .093” pin-and-socket power
connectors are suitable for wire-to-wire and wire-toboard configurations. Terminals can be used in both plug
or receptacle housings allowing for design flexibility.
PCB headers are also available. Features include panel
mount and free hanging housings with positive locks
and fully isolated contacts.
RAST 5 IDT and crimp connectors are extremely reliable
power connectors meeting all industry standards and
testing requirements. Features include Glow Wire
compliant, low-insertion force, colour-coded polarisation,
multiple keying and latching configurations, vertical and
right-angle headers are also available in tin and silver
plating.
Sabre™ is a high-current wire-to-wire and wire-toboard connector family with a built-in TPA feature
that prevents terminal backout. Crimp terminals are
available to suit a wide range of wire guages and
insulation thicknesses and terminals are fully isolated.
The system is UL recognised, CSA approved, TUV
licensed.
Able to handle up to 13.0A per contact when using
the MarKK™ terminal the KK® 396 wire-to-board and
board-to-board system is ideal for use in many varied
applications. RPC (reflow process compatible) headers
are also available in vertical and right-angle friction-lock
variations. UL 94V-0 and Glow Wire compliant versions
are also available.
7.50mm
18.0A
2-8
•Alternative Energy
Source
•Consumer
•Industrial Automation
•Medical
•Military/Aerospace
•Networking
•Telecommunications
3.96mm
Up to
13.0A
2-24
•Automotive
•Consumer
•Industrial
•Medical
23
Power Connectors
Current up to 21A+
Product Name
EXTreme
PowerMass™
EXTreme
Ten60Power™
EXTreme
ZPower™
Description
EXTreme PowerMass™ is a high-current, boardto-board, modular connector system, providing
customer-specific interconnect solutions for AC and
DC power requirements. The system offers a density
of up to 350.0A per inch while providing minimum
heat generation due to extremely low plane-to-plane
resistance.
EXTreme Ten60Power™ is easily configured to meet
special design requirements with no tooling costs! The
system is a modular high-current power and signal
connector system in a coplanar and right-angle boardto-board orientation. The low profile (10.0mm height)
helps to enhance the system airflow within the power
system.
EXTreme ZPower™ is a high-current, rigid, board-toboard and wire-to-board mezzanine style interconnect
designed to transfer power loads from one PCB to
another. The connector is press-fit into the PC base
board. The PC top board is then screwed down on top of
the EXTreme ZPower connector, forming a high-pressure
interface.
EXTreme PowerEdge™ is a one-piece vertical card edge
style connector, used with either gold finger pc boards,
or as a bus bar interconnect for power supply and power
distribution applications. Connectors are available in
power only, signal only and power/signal combinations
and can be, configured for AC and DC power systems.
Pitch
Current
Rating
Circuits
Size
Various
150.0A,
80.0A,
40.0A
Multiple
power and
signal
Various
60.0A
Multiple
•Industrial Automation
•Networking
•Telecommunications
10.30mm
30.0A
1
•Industrial Automation
•Power Supplies
•Telecommunications
Various
40.0A
Multiple
•Networking
•Telecommunications
Various
40.0A
3.0A
Multiple
•Consumer
•Data Communications
•Industrial Automation
•Networking
•Telecommunications
Various
35.0A
3.0A
Multiple
•Data Communications
•Industrial Automation
•Networking
•Telecommunications
Various
30.0A
1.0A
Multiple
•Data Communications
•Industrial Automation
•Networking
•Telecommunications
11.00mm
80.0A
2 and 3
•Automotive
•Consumer
•Telecom
•Datacom
Applications
•Networking
•Telecommunications
EXTreme
PowerEdge™
EXTreme PowerDock™ interconnects include guide pins
for blind mating, mounting ears option for mechanical
attachment to the PCB, power blades and signal pins
in multiple lengths and press-fit tails. This family can
be used as a drop-in replacement in many existing
applications due to its custom configurable nature.
EXTreme
PowerDock™
EXTreme
LPHPower™
The EXTreme LPHPower™ connector is a mixed, highcurrent power and signal connector system with power
blades parallel to the PC board. Its extremely lowprofile height of only 7.50mm allows greater system
airflow while taking up 53% less space than traditional
connectors with the same current rating. Right-angle,
coplanar or vertical configurations are available.
EXTreme PowerPlus™ series conforms to the Server
System Infrastructure (SSI) open specification. Features
include recessed signal-pins and sequential mating
(LMFB) that allows the hot-swapping of power supply
units on the male side, guide pockets (headers) or guide
posts (receptacles) and fully shrouded headers.
EXTreme
PowerPlus™
EXtreme
Guardian™
24
Exceed high-current and reliability requirements in topend server and high-power applications with Molex’s
compact, EXTreme Guardian™ Power Connector System,
providing EMI/RFI shielding, overmolding and discretewire options for design flexibility. This wire-to-board
system also features ‘first mate, last break’ contact
arrangements.
www.molex.com
Power Connectors
Current up to 21A+
Product Name
Mini-Fit Sr.™
Mega-Fit
Sabre™
www.molex.com
Description
Mini-Fit Sr.™ power connectors offer a compact wireto-wire and wire-to-board high-current system capable
of handling up to 50.0A per contact. This single- and
dual-row system is UL, CSA and TUV approved. Features
include integrally molded TPA’s on single-row products,
positive locking and polarised housings across all circuit
sizes.
Mega-Fit Power Connectors deliver cutting-edge current
density at 23.0A per circuit; terminals provide six
independent contact points for long-term reliability in
virtually every industry and application. Available in
a wire-to-board configuration with vertical and rightangled headers along with UL94V-0 and Glow Wire
compliant housings.
Sabre™ is a high-current wire-to-wire and wire-toboard connector family with a built-in TPA feature
that prevents terminal backout. Crimp terminals are
available to suit a wide range of wire gauges and
insulation thicknesses and terminals are fully isolated.
The system is UL recognised, CSA approved, TUV
licensed.
Pitch
10.00mm
5.70mm
7.50mm
Current
Rating
50.0A
23.0A
18.0A
Circuits
Size
Applications
2-14
•Commercial Vehicles
•Consumer
•Industrial Automation
•Medical
•Networking
2-12
•Consumer
•Home Appliance
•Commercial Vehicle
•Industrial
•Telecom
2-8
•Alternative Energy
Source
•Consumer
•Industrial Automation
•Medical
•Military/Aerospace
•Networking
•Telecommunications
25
I/O Connectors
Consumer / PC
Product Name
Description
Industry standard USB connectors and cable assemblies
provide connection for power and data exchange
without the need for a host PC across a variety of
industries. Available in standard, mini and micro
versions.
Pitch
Current
Rating
Circuits
Size
2.00mm
2.50mm
1.5A
5
0.50mm
0.5A
20
•Consumer
•Data/Communications
0.40mm
0.50mm
0.8A
19
•Consumer
0.40mm
0.8A
19
•Automotive
•Consumer
•Smart phones and
Mobile Devices
0.80mm
2.00mm
1.5A
4, 6, 9
N/A
3.0A
29
Applications
•Consumer
•Medical
•Smart Phones and
Mobile Devices
USB Products
The DisplayPort solution consists of SMT external
receptacles with a polarised D-shape mating interface
and PCB retention features. Receptacles are mountable
on the device side and the overmolded plug connects to
the display device. The cable assemblies come in both
latching and non-latching versions.
DisplayPort*
*DisplayPort is a trademark of Video Electronics Standards
Association (VESA)
High Definition Multimedia Interface (HDMI*) Connectors
come in a compact, user-friendly fully shielded design.
A single cable bandwidth of 5 Gbps carries both
uncompressed audio and video. Other features include
backward compatible HDMI to DVI cables, mounting
flanges and triad signal layout.
HDMI*
*HDMI, the HDMI Logo, and High Definition Multimedia Interface
are trademarks or registered trademarks of HDMI Licensing LLC
in the US and other countries.
A 19-pin interconnect in a stainless steel shell, half the
size of the current Mini connector, offering all the advantages of the HDMI 1.4 specification. Available in full SMT,
through-hole shell tabs and hybrid SMT and through-hole
shell tab versions; receptacles offer friction lock and
terminal hold-down features. Cable assemblies available.
Micro HDMI*
*HDMI, the HDMI Logo, and High Definition Multimedia Interface
are trademarks or registered trademarks of HDMI Licensing LLC
in the US and other countries
IEEE 1394 (also named “Firewire” by Apple, and “i.Link”
by Sony) is a standard I/O interface, carrying video and
audio with assured quality, based on its high bandwidth
capabilities. This simple to use, peer-to-peer connection
system is keyed, electrically tested and fully integrated
to detect new nodes plugged in without powering down.
•Automotive
•Consumer
•Data/Communications
•Medical
IEEE 1394
MicroCross DVI
26
The Molex MicroCross DVI system provides a highbandwidth video interface for host and display
devices. The rugged LFH (Low Force Helix) contact
design provides two points of contact for optimal
signal integrity and reduces insertion force to ensure
high reliability. A full range of connectors, cables and
adaptors is available.
•Consumer
www.molex.com
I/O Connectors
Networking /
Telecomm
Product Name
iPass™
IPass+™ HD
IPass+™ High Speed
Channel (HSC)
QSFP+
Description
The iPass™ Interconnect System offers both
connectors and cable assemblies that enable flexible
speed compatibility for applications ranging from
1.5 Gbps up through 10 Gbps. Cable assemblies provide
100 Ohm differential impedance with tight skew control
and low crosstalk, available in multiple standard /
custom cable lengths.
iPass+™ HD, also named mini-SAS, improves system
airflow and signal integrity by eliminating midplane
connections. This low-profile system, meets SAS-3 nextgeneration speed and density requirements, with signals
enabling active copper and optical cable modules.
iPass+ HD connectors mate to all current miniSAS HD
cable assemblies.
The newest addition to the iPass+™ family enables
pluggable copper/optical options, thereby increasing
the flexibility of system-level hardware for end
users. Offered as one-piece press-fit connector and
cage assembly in both single and stacked dual-port
configurations. Adopted by Infiniband* CXP 12x QDR
and IEEE 802.3ba.
Pitch
Current
Rating
Circuits
Size
Applications
0.75mm
0.80mm
1.27mm
N/A
Multiple
•Data/Communications
•Networking
•Telecommunications
0.75mm
N/A
36, 62,
72, 144
•Data/Communications
•Networking
•Telecommunications
0.80mm
N/A
84, 168
•Networking
•Telecommunications
0.80mm
N/A
N/A
•Automotive
•Networking
•Telecommunications
1.27mm
(Matrix 50),
1.90mm
(Matrix 75)
1.0A
60-200
(Matrix 50);
96-130
(Matrix 75)
1.27mm
1.5A
•Consumer
18, 28, 38, •Data/Communications
48, 72
•Industrial Automation
•Medical
N/A
68, 136
•Data/Communications
•Industrial Automation
•Medical
•Networking
•Telecommunications
Various
•Consumer
•Data/Communications
•Industrial Automation
•Medical
•Networking
*Trademark of the InfiniBand Trade Association
The Quad Small Form-factor Pluggable Plus (QSFP+)
Interconnect system is designed for high density
applications. The QSFP+ connector, cage and cable
assemblies (copper and optical) and loopbacks are part
of a highly-integrated system that combines effective
use of space, power and port density for high-density
applications.
The patented Low Force Helix (LFH) male pin interfaces
with a split-beam receptacle contact giving a low
insertion force with 2-point contact reliability. The
system will accept various wire sizes and is available
in vertical and right-angle header versions. Optional
hardware for docking applications is also available.
•Data/Communications
•Medical
•Networking
•Telecommunications
LFH
TDP® (Triad™
Differential Pair)
Ultra+™ VHDCI
Modular Plugs Jacks
www.molex.com
TDP® connectors provide a shielded, dual-row, cableto-board interface offering mid-range speed (up to
5Gbps) and 100 Ohm controlled impedance. Fully
shielded vertical (through-hole) and right-angle (SMT)
receptacles plus fully shielded plugs and cable kits are
available. Overmolded cable assemblies complete the
range.
The Ultra+™ Very High Density Cable Interconnect
system features “blade on beam” style contact,
reduced size (27% smaller than SCSI-3), increased
robustness, improved electrical performance and
higher density. Superior leaf/ribbon style contact,
meets EIA, ANSI/SFF-8441and SPI-4 specifications to
ensure intermatability with conforming products.
Molex offers jacks in a variety of styles and
configurations, including right-angle, top- and bottomentry, through-hole and SMT, shielded and un-shielded
using gold or high durability palladium-nickel plating.
Modular jacks with integrated magnetics with or
without LED’s that support Power-over-Ethernet (PoE)
are also available.
0.80mm
Various
Various
27
I/O Connectors
Mobile Products
Product Name
Description
Molex has developed seven series of Micro-USB Type ‘B’
and Type ‘AB’ receptacles in a selection of top-, bottomand mid-mount versions, and a new series of USB ‘A’
to Micro-USB ‘B’ cable assemblies. These connectors
include a lead-in feature in the connector housing for
blind-mating of the receptacle to the plug.
Pitch
Current
Rating
Circuits
Size
0.65mm
1.0 (Signal),
1.8 (Power)
5
•Consumer
•Smart Phones and
Mobile Devices
0.80mm
1.0A
5
•Consumer
•Smart Phones and
Mobile Devices
0.60mm
0.5A
20
•Consumer
•Data/Communications
0.40mm
0.8A
19
•Automotive
•Consumer
•Smart phones and
Mobile Devices
16
•Aerospace and
Defence
•Automotive
•Consumer
•Data/
Communications
•Medical
•Smart Phones and
Mobile Devices
Applications
Micro USB
Key features of the USB OTG are compact and lightweight design (about 1/8th the size of standard USB-B
connectors), fully shielded, fully compliant with USB
2.0 specifications, detent lock and keying feature, 5-pin
design and high durability of 5,000 mating cycles, UL
certified. Cable assemblies available.
USB OTG
(On-The-Go)
Mini DisplayPort* is 50% of the size of standard
DisplayPort connectors, delivering pure digital
connections quickly and seamlessly to external
displays and offering plug-and-play performance while
supporting VGA, DVI and dual-link DVI connections.
Mini DisplayPort*
*DisplayPort is a trademark of Video Electronics Standards Association (VESA)
A 19-pin interconnect in a stainless steel shell, half the
size of the current Mini connector, offering all the advantages of the HDMI 1.4 specification. Available in full SMT,
through-hole shell tabs and hybrid SMT and through-hole
shell tab versions; receptacles offer friction lock and
terminal hold-down features. Cable assemblies available.
Micro HDMI*
*HDMI, the HDMI Logo, and High Definition Multimedia Interface
are trademarks or registered trademarks of HDMI Licensing LLC
in the US and other countries
The HandyLink™ USB 2.0 compatible family includes
a right-angle SMT receptacle, a wire and PCB version
of the plug, perpendicular and parallel mounted cradle
connectors for docking applications and a wide array of
cable assemblies. HandyLink wire-to-board solutions and
board-to-board docking solutions are RoHS compliant.
HandyLink™
28
0.80mm
1.5 – 3.0A
www.molex.com
I/O Connectors
Industrial Products
Product Name
Description
Molex’s CRC™ rectangular I/O connector system
provides a compact solution for small industrial robots
and factory automation equipment. The system includes
panel-mount and wire-to-wire versions, and takes up
only about 1/15th the space of industry-standard heavyduty connectors.
Current
Rating
Circuits
Size
Applications
Various
7.0, 15.0A
12, 20,
30, 50
(signal);
4, 15
(power)
•Aerospace and
Defence
•Automotive
•Data/Communications
•Industrial Automation
•Medical
•Telecommunications
N/A
6.0, 10.0,
12.0A
3.00mm
7.0A
Pitch
Circular Robotic
Connector - CRC™
Molex’s line of HMC™ Heavy Duty Rectangular
Connectors offer a unique new design and user-friendly
features compared to traditional-style heavy duty
connectors for robotic and other industrial applications.
Multi-module types allow gender interchanging of
housings, as well as hybrid configurations using
different terminal inserts.
12, 36, 40,
•Industrial Automation
48, 52, 72
Heavy Duty
Rectangular Connector HMC™ Connectors
Mini-HMC™
Commercial
Micro-D
www.molex.com
The compact sized Mini-HMC™ family incorporates
the same unique features of Molex’s standard
HMC™ connectors such as a one-touch lock and
interchangeable housings with the same solderless
crimp terminals as Molex’s CRC™ connectors. Other
features include a braided wire clamp for additional ESD
shielding and a hard-shell hood.
High-density Commercial Micro-D shielded
microminiature connectors provide 4 times the density
of standard D-sub connectors. Commercial versions
available in right-angle (single row and stacked) and
vertical configurations, cable assemblies in single- and
double-ended Commercial Micro-D to standard D-Sub
connectors.
1.27mm
1.0A
10, 40
•Data/Communications
•Industrial Automation
•Medical
Various
•Aerospace and
Defence
•Commercial Vehicle
•Data/Communications
•Industrial General
•Medical
29
Backplane
Connectors
High Speed
Product Name
Impact™
GBX I-Trac™
Description
The Impact™ backplane connector system for conventional, coplanar and mezzanine configurations
provides data rates up to 25 Gbps and superior signal
density up to 80 differential pairs per inch. Achieve low
cross-talk and high signal bandwidth while minimising
channel-performance variation across every differential
pair within the system.
GBX I-Trac™ system, available in standard backplane,
Orthogonal midplane, high-current power modules,
Inverted and Coplanar configurations provides design
flexibility and enables future system performance
upgrades without requiring platform re-design. Capable
of supporting next-generation applications with data
rates of 12.5 Gbps or higher.
Speed
Density
Orientation
Applications
25 Gbps
80 diff
pair / sq inch
Conven
Coplanar
Mezz
•Data Communications
•Telecommunications
•Military/Aerospace
12.5 Gpbs
69 diff
pair / sq inch
Conven
Coplanar
Inverted
Orthog
•Networking
•Telecommunications
The Z-PACK TinMan’s press-fit, flexible, mono-block
based system can be stacked end-to-end to meet
customer pin-count requirements. The system delivers
integrated shielding, differential-pair density, 85 Ohm
66 diff
impedance and lower crosstalk and insertion loss versus 12.5 Gbps
pair / sq inch
100 Ohm backplane systems.
Z-PACK TinMan*
Conven
Mezz
•Data Communications
•Medical
•Networking
•Telecommunications
Conven
Coplanar
Orthog
•Data Communications
•Medical
•Networking
•Telecommunications
Conven
Coplanar
•Data Communications
•Industrial Automation
•Medical
•Military/Aerospace
•Networking
•Telecommunications
*Z-PACK and Z-PACK TinMan are trademarks of Tyco Electronics
GbX® backplane connectors deliver high-density and
high-speeds up to 10 Gbps and are custom-configurable.
Bifurcated contact beams in daughtercard receptacles
ensure greater reliability with 2 points of contact to
10 Gbps
each header pin.
GbX® is a registered trademark of Amphenol Corporation
69 diff
pair / sq inch
†
GbX
®†
Very High Density Metric connectors achieve highspeed signal integrity via interstitial signal and ground
shields between columns. Standard VHDM®* connectors
support data rates of 3.125 Gbps with less than 5%
crosstalk; H-series supports up to 6.25 Gbps.
*VHDM is a registered trademark of Amphenol Corporation
Up to
100 diff
6.25 Gbps pair / sq inch
VHDM®*
HDM®*
The High Density Metric (HDM®*) connector system suits
applications that require high interconnect density and
high-speed signal integrity. Daughter card modules are
combined on a metal stiffner enabling very high circuit
count assemblies to be handled as one connector.
Power, guidance and coding function modules are also
available.
N/A
30 Contacts/ Right Angle
•Networking
CM
Vertical
*HDM is a registered trademark of Amphenol Corporation
MicroTCA™ delivers a low-cost, flexible and scaleable
solution with 10.0 Gbps data rate for a wide variety of
low to mid-range telecom applications. This press-fit,
vertical, edge-card connector provides 170 contacts on
0.75mm pitch and enables AdvancedMC (AMC) cards to
be plugged directly to a backplane.
10Gbps
N/A
Card Edge
•Medical
•Instrumentation
•Telecommunications
MicroTCA™
30
www.molex.com
Backplane
Connectors
Cable Assemblies
Product Name
GbX® Cable
Assemblies
Description
GbX® cable assemblies offer improved capabilities to
current backplane cable products, with impedance
matching, low pair-to-pair crosstalk, within-pair and pairto-pair skew control and a variety of raw-cable designs
to meet customer-specific loss budgets. Suitable for
existing / new generations of XAUI and InfiniBand*based systems.
Hard Metric Cable
Assemblies
Impact™ Cable
Assemblies
Circuits
Size
6 Gbps
55 diff
pair/inch
Contact
Molex
•Networking
3-5 Gbps
100 real
signals/inch
Contact
Molex
•Data/Communications
•Industrial Automation
•Networking
•Telecommunications
1.5 Gbps
Contact
Molex
Contact
Molex
•Data/Communications
•Industrial Automation
•Networking
•Telecommunications
2.5 Gbps
100 real
signals/inch
Contact
Molex
•Data/Communications
•Networking
•Telecommunications
25 Gbps
80 diff
pair/inch
Contact
Molex
•Data/Communications
•Telecommunications
800 MHz
Contact
Molex
Contact
Molex
•Data/Communications
•Industrial Automation
•Networking
•Telecommunications
Applications
*VHDM-HSD is a trademark of Amphenol Corporation
Offering high-speed differential pair or single
mode solutions for applications include backplaneto-backplane and cabinet-to-cabinet I/O signal
transmission. Molex’s advanced manufacturing
capabilities include computer-controlled laser wire
preparation, thermo-resistance welding, ultra sonic
welding, and insert molding.
The Very High Density Metric (VHDM*) system
comprises arrays of individual wafers that incorporate
the signal pins as well as strip-line shielding. The
shielding allows 100% of the signal pins to be used for
signal transmission. Accommodates micro coaxial, micro
twisted pair and micro twin axial cable constructions.
VHDM* Cable
Assemblies
Density
*InfiniBand is a trademark of the InfiniBand Trade Association
VHDM-HSD™* connectors comprise arrays of individual
wafers that incorporate the signal pins as well as the
strip-line shielding. The shielding allows 100% of the
signal pins to be used for signal transmission. Designs
can accommodate multi-wafer and custom backshell
solutions. In house test equipment is also available.
VHDM-HSD™ Cable
Assemblies*
Speed
*VHDM is a trademark of Amphenol Corporation
Impact™ cable assemblies use a low-impedance,
localised ground-return path in an optimised differentialpair array. Shielded and isolated, the pairs are tightly
coupled to, and surrounded by, ground structures,
leading to reduced cross-talk and increased overall
bandwidth performance, with minimal performance
variance across the system.
Engineered to match application requirements for
controlled impedance and propagation rates, Milli-Z™
cables help minimise crosstalk. Cables are compatible
with single, four, five and six row carrier systems for
industry standard backplane headers. They also mate
with single and dual row printed circuit board headers.
Milli-Z™ Cables
www.molex.com
31
FFC/FPC Connectors
Core Micro Products
Product Name
FFC/FPC
Connectors
Description
Ideal for tight-packaging applications,
Molex’s line of FFC/FPC connectors
come in various pitch options ranging
from 0.20mm pitch up to 1.00mm
and include features to meet a wide
variety of space and usage needs for
applications in all markets.
Molex’s FFC/FPC connectors are
available with push and flip-style
actuators, which are pre-assembled
covers that secure the connection
between the FFC/FPC and the
connector terminals. Molex is
continually developing lower-profile
and higher-density versions to meet
the downsizing needs of electronic
equipment makers.
Pitch
(mm)
Series
0.20
503419
0.25
Au
Au
0.9
Au
Au
1.0
Au
Au
1.65
-xx68
-xx60
-xx68
-xx60
-xx20
-xx91
-xx21
-xx92
503566
-xx08
-xx00
502598
-xx11
-xx91
503425
-xx11
-xx91
1.2
501912
-xx10
-xx90
1.8
502078
51281
54548
54550
503366
0.9
Au
Au
-xx09
-xx01
Au
Au
-xx08
-xx02
Au
Au
-xx09
-xx00
Au
Au
-xx30
-xx92
SnBi
SnBi
-xx40
-xx94
Au
Au
-xx19
-xx33
SnBi
SnBi
-xx29
-xx71
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx29
-xx71
Au
Au
0.95
1.15
0.8
1.0
1.2
1.2
1.2
-xx19
-xx11
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx29
-xx71
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx29
-xx71
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx59
-xx97
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx39
-xx71
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx29
-xx31
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx68
-xx62
Au
Au
502790
-xx11
-xx91
Au
Au
2.5
502611
-xx29
-xx21
Au
Au
3.9
-xx21
-xx80
-xx51
-xx81
SnBi
SnBi
-xx11
-xx90
-xx31
-xx91
Au
Au
-xx41
-xx92
52435
52437
52745
52746
54104
54132
501864
32
H
(mm)
-0xx0
503480
0.50
RA0.50
RA0.50
RA
Tail
Plating
-xx10
501461
Through-hole versions are available in vertical and right-angle
configurations, ZIF and non ZIF
versions and various pitch options
ranging from 1.00mm to 2.54mm.
Circuit sizes range from 1 to 50.
Contact
Plating
-0xx8
502250
Other features include Molex’s unique
BackFlip™ actuator design, which
provides easy cable insertion and
extraction even in tight packaging
applications, top, bottom and dual
contact versions are available.
T&R
(Tray)
-xx18
503320
0.30
Conn
2.0
2.0
2.0
2.0
2.0
2.0
2.0
4.85
www.molex.com
FFC/FPC Connectors
Core Micro Products
Depth
(mm)
FPC T
(mm)
Cable
Type
Contact
Pos.
Actuator
type
Voltage
(V)
Current
(A)
Temp.
(min.)
Temp.
(max.)
2.85
0.2
FPC
Bottom
Front flip
50
0.2
-40°C
+85°C
2.75
0.2
FPC
Bottom
Front flip
50
0.2
-20°C
+85°C
2.98
0.2
FPC
Bottom
Front flip
50
0.3
-40°C
+85°C
4.19
0.2
FPC
Dual
Back flip
50
0.2
-25°C
+85°C
2.85
0,2
FPC
Bottom
Front flip
50
0.2
-40°C
+85°C
3.8
0.2
FPC
Dual
Back flip
50
0.2
-40°C
+85°C
4.6
0.2
FPC
Dual
Back flip
50
0.2
-40°C
+85°C
3.85
0.2
FPC
Bottom
Front flip
50
0.2
-20°C
+85°C
3.2
0.12
FPC
Bottom
Back flip
50
0.3
-40°C
+85°C
4.0
0.3
FFC/FPC
Dual
Back Flip
50
0.5
-40°C
+85°C
4.05
0.3
FFC/FPC
Dual
Non ZIF
50
0.5
-20°C
+85°C
3.85
0.3
FFC/FPC
Bottom
Pull up
50
0.5
-20°C
+85°C
3.85
0.3
FFC/FPC
Top
Push pull
50
0.5
-20°C
+85°C
5.6
0.3
FFC/FPC
Bottom
Front flip
50
0.5
-20°C
+85°C
5.2
0.3
FFC/FPC
Top
Push pull
50
0.5
-40°C
+85°C
5.2
0.3
FFC/FPC
Bottom
Pull up
50
0.5
-40°C
+85°C
5.0
0.3
FFC/FPC
Top
Push pull
50
0.5
-20°C
+85°C
5.0
0.3
FFC/FPC
Bottom
Pull up
50
0.5
-20°C
+85°C
5.6
0.3
FFC/FPC
Top
Push pull
50
0.5
-20°C
+85°C
5.6
0.3
FFC/FPC
Bottom
Push pull
50
0.5
-20°C
+85°C
5.3
0.3
FPC
Bottom
Front flip
50
0.5
-20°C
+85°C
7.9
0.3
FPC
Bottom
Front Flip
100
0.3
-10°C
+100°C
Note
FPC with tabs
Low-Halogen
Longer actuator
FPC with notches
Low-Halogen
FPC with tabs
FPC with notches
FPC with notches
increased act lock F, 8ckt only
FPC with tabs
FPC with tabs, 2 contacts
FPC with tabs
Jacket:501783,
Cover:501784
8.0
0.3
FFC/FPC
Bottom
Jacket
50
0.3
-40°C
+85°C
Shield FFC
Sealing treat
www.molex.com
33
FFC/FPC Connectors
Core Micro Products
Pitch
(mm)
Series
Conn
T&R
(Tray)
Contact
Plating
Tail
Plating
H
(mm)
Depth
(mm)
FPC T
(mm)
0.20
503419
-0xx8
-0xx0
Au
Au
0.9
2.85
0.2
-xx18
-xx10
-xx68
-xx60
Au
Au
1.0
2.75
0.2
Au
Au
1.65
2.98
0.2
0.9
4.19
0.2
0.95
2.85
0.2
1.15
3.8
0.2
0.25
502078
503320
-xx68
-xx60
-xx20
-xx91
-xx21
-xx92
503566
-xx08
-xx00
502598
-xx11
-xx91
503425
-xx11
-xx91
1.2
4.6
0.2
501912
-xx10
-xx90
1.8
3.85
0.2
0.8
3.2
0.12
1.0
4.0
0.3
1.2
4.05
0.3
1.2
3.85
0.3
1.2
3.85
0.3
2.0
5.6
0.3
2.0
5.2
0.3
2.0
5.2
0.3
2.0
5.0
0.3
2.0
5.0
0.3
2.0
5.6
0.3
2.0
5.6
0.3
502250
0.30
501461
503480
51281
54548
54550
503366
52435
0.50
RA0.50
RA0.50
RA
52437
52745
52746
Au
-xx09
-xx01
Au
Au
-xx08
-xx02
Au
Au
-xx09
-xx00
Au
Au
-xx30
-xx92
SnBi
SnBi
-xx40
-xx94
Au
Au
-xx19
-xx33
SnBi
SnBi
-xx29
-xx71
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx29
-xx71
Au
Au
-xx19
-xx11
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx29
-xx71
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx29
-xx71
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx59
-xx97
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx39
-xx71
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx29
-xx31
Au
Au
-xx22
-xx33
SnAgBi
SnAgBi
-xx68
-xx62
Au
Au
502790
-xx11
-xx91
Au
Au
2.5
5.3
0.3
502611
-xx29
-xx21
Au
Au
3.9
7.9
0.3
SnBi
SnBi
4.85
8.0
0.3
Au
Au
54104
54132
501864
34
Au
-xx21
-xx80
-xx51
-xx81
-xx11
-xx90
-xx31
-xx91
-xx41
-xx92
www.molex.com
FFC/FPC Connectors
Core Micro Products
Cable
Type
Contact Pos.
Actuator
type
Voltage
(V)
Current
(A)
Temp.
(min.)
Temp.
(max.)
FPC
Bottom
Front flip
50
0.2
-40°C
+85°C
FPC
Bottom
Front flip
50
0.2
-20°C
+85°C
FPC
Bottom
Front flip
50
0.3
-40°C
+85°C
FPC
Dual
Back flip
50
0.2
-25°C
+85°C
FPC
Bottom
Front flip
50
0.2
-40°C
+85°C
FPC
Dual
Back flip
50
0.2
-40°C
+85°C
FPC
Dual
Back flip
50
0.2
-40°C
+85°C
FPC
Bottom
Front flip
50
0.2
-20°C
+85°C
FPC
Bottom
Back flip
50
0.3
-40°C
+85°C
FFC/FPC
Dual
Back Flip
50
0.5
-40°C
+85°C
FFC/FPC
Dual
Non ZIF
50
0.5
-20°C
+85°C
FFC/FPC
Bottom
Pull up
50
0.5
-20°C
+85°C
FFC/FPC
Top
Push pull
50
0.5
-20°C
+85°C
FFC/FPC
Bottom
Front flip
50
0.5
-20°C
+85°C
FFC/FPC
Top
Push pull
50
0.5
-40°C
+85°C
FFC/FPC
Bottom
Pull up
50
0.5
-40°C
+85°C
FFC/FPC
Top
Push pull
50
0.5
-20°C
+85°C
FFC/FPC
Bottom
Pull up
50
0.5
-20°C
+85°C
FFC/FPC
Top
Push pull
50
0.5
-20°C
+85°C
FFC/FPC
Bottom
Push pull
50
0.5
-20°C
+85°C
FPC
Bottom
Front flip
50
0.5
-20°C
+85°C
FPC
Bottom
Front Flip
100
0.3
-10°C
+100°C
Note
FPC with tabs
Low-Halogen
Longer actuator
FPC with notches
Low-Halogen
FPC with tabs
FPC with notches
FPC with notches
increased act lock F, 8ckt only
FPC with tabs
FPC with tabs, 2 contacts
FPC with tabs
Jacket:501783,
Cover:501784
FFC/FPC
Bottom
Jacket
50
0.3
-40°C
+85°C
Shield FFC
Sealing treat
www.molex.com
35
Modular
Jacks
Style
Right Angle
Vertical
Right Angle with
Magnetics
PoE / PoE+
Magnetic Jacks
PoE PD
Magnetic Jacks
36
Description
Available with and without shielding in through-hole or
SMT mounting. Optional integrated LED‘s or light pipes
also available. Mounting options include inboard or
outboard fitting nails. Inverted types and types with
RJ11 keep out features also available. Standard and low
profile versions and gold and palladium nickel / gold
flash plating is offered.
Available with and without shielding in through-hole or
SMT mounting with flush or flanged panel options. Low
profile (12.70mm height) versions and types with SMT
solder tabs for increased board retention.
A single port bottom entry type is also availabe for
space constrained applications. Gold or palladium nickel
/ gold flash plating is offered.
Magnetic modular jacks, available in single- and
multi-port versions, simplify customer board layouts
by reducing the number of components required. All
parts are IEEE 802.3 compilant and hence Ethernet
10/100/1000 compatible. Available with or without
integrated LED’s and also availabe in low-profile
13.45mm heights.
Molex offers a range of Integrated Jacks or ICMs that
provide a cost-effective, plug-and-play solution for
customers implementing PoE and PoE Plus (PoE+).
Available in single port (1-by-1), 8-port (2-by-4), and
12-port (2-by-6) configurations and with LED options,
the ICMs provide PoE+ Power Source Equipment (PSE)
capability.
PDJack™ with integrated ‘Power Device’ controller
circuitry plus Ethernet connectivity simplifies PoE Plus
implementation for any network device. The PDJack
supplies 54 V of power up to 25.5 watts. Two pins
output power and standard signal pins provide Ethernet
connectivity. Additional pins allow power-up of external
DC to DC converter.
Number
of Ports
Catagory
Circuits /
Contacts
3, 5, 5e, 6
4/2, 4/4,
6/2, 6/4,
6/6, 8/2,
8/4, 8/6,
8/8, 8/10
1
3, 5
4/2, 4/4,
6/2, 6/4,
6/6, 8/2,
8/4, 8/6,
8/8, 8/10
•Telecom
•Networking
•Medical
•Consumer
•Data/Computing
1, 8, 12
Gigabit
Magnetics
8/8
•Telecom
•Networking
•Medical
•Consumer
•Data/Computing
1, 8, 12
PSE PoE+
8/8
•Telecom
•Networking
•Medical
•Consumer
•Data/Computing
1
PD –
PoE+
8/8
•Telecom
•Networking
•Medical
•Consumer
•Data/Computing
1, 2, 3, 4,
5, 6, 8,
12, 16
Applications
•Telecom
•Networking
•Medical
•Consumer
•Data/Computing
www.molex.com
Solderless
Terminals
Product Name
Description
•An all-weather solderless terminal
•Provides waterproof crimp connections
•NiAc™ heat-shrinkable insulation
Perma-Seal™
•Solutions for splicing and tapping of magnet and aluminum wire
•Terminates magnet wire without removing insulation
•Open barrel permits easy access
MagKrimp™
•Wire AWG: 10 - 22
•Available in non-insulated, PVC insulated and nylon insulated wires
•Provides a reliable, vibration-proof connection
Wire Pins
•Wire AWG: 8 AWG - 250 MCM
•Available with or without tin plating
•For heavy-duty 600V applications
Battery Cable
Lugs
•Wire AWG: 22 AWG - 600 MCM
•Seamless crimp barrel
•Heavy-duty terminals with tin plating
VersaKrimp™
•High-quality, seamless-barrel metric ring terminals
•Insulated Avikrimp™ and un-insulated VersaKrimp™ seamless barrel types
•Suitable for terminations using metric studs up to 10mm in diameter and wire size up to 6mm²
Metric Ring
Terminals
•Designed for high-temperature applications from +343 to +649°C
•Nickle-plated copper
•Butt seamed and barrel styles
High Temperature
Terminals and Splices
www.molex.com
37
Terminal
Blocks
Product Name
Positive Locking
System
Beau™ EuroMate™
Pluggable
Description
•Current rating: 10.0A
•Wire Gauge: 12 to 30 AWG
•Voltage rating: 300V
•Circuits: 2 to 24
•Pitch: 4.00 to 5.00mm
•Operating temperature: -40 to +115°C
•UL File No.: E48521
•Current rating: 12.0 to 15.0A
•Wire Gauge: 12 to 22 AWG
•Voltage rating: 300V
•Circuits: 3 to 24
•Pitch: 3.81 to 5.08mm
•Operating temperature: -40 to +120°C
•UL File No.: E48521
•Current rating: 20.0 to 115.0A
•Wire Gauge: 11 to 30 AWG
•Voltage rating: 300V or 600V
•Circuits: 2 to 16
•Pitch: 5.08 to 15.00mm
•Operating temperature: -40 to +130°C
•UL File No.: E48521
Beau™ Eurostyle™
High-Power Fixed Mount
•Current rating: 85.0A
•Wire Gauge: 3 to 14 AWG
•Voltage rating: 600V
•Circuits: 2 to 12
•Pitch: 12.00mm
•Operating temperature: -40 to +130°C
•UL File No.: E48521
EuroMax™ Pluggable
High-Power
•Current rating: 20.0 to 63.0A
•Wire Gauge: 6 to 22 AWG
•Voltage rating: 300V or 600V
•Circuits: 2 to 12
•Pitch: 8.00 to 15.00mm
•Operating temperature: -40 to +105°C
•UL File No.: E48521
Eurostyle™ Two-Screw
Terminal Strips
Eurostyle™ PCB
Pluggable
•Current rating: 8.0 to 30.0A
•Wire Gauge: 12 to 30 AWG
•Voltage rating: 300V
•Circuits: 2 to 48
•Pitch: 3.50 to 9.53mm
•Operating temperature: -40 to +115°C
•UL File No.: E48521
•Current rating: 10.0 to 65.0A
•Wire Gauge: 8 to 30 AWG
•Voltage rating: 300V or 600V
•Circuits: 2 to 32
•Pitch: 6.37 to 17.48mm
•UL File No.: E48521
Beau™ Barrier
Strips
38
www.molex.com
RF Microminiature
& Subminiature
Products
RF Miniature,
Medium and
Large Products
www.molex.com
39
Sealed
Connectors
Product Name
Mini-Fit® H2O
Description
The Mini-Fit® H2O mid-range power connector is
designed for use in weatherproof applications that
require a sealed system. The Mini-Fit H2O connector
system is IP67-rated, which ensures connector integrity
when submersed in up to one meter of water. The MiniFit H2O connector has a small overall profile and can
handle up to 9.0A per circuit.
The pre-assembled, fully-submersible MX150™ family
is available with housing matte seals or cable seals. It
offers a reduced package size and is ideal for SAE- and
ISO-style wire in single- and dual-row configurations
supporting both signal and power applications up to
22.0A. Features include integral TPA and optional CPA.
Pitch
Current
Rating
Circuits
Size
Applications
•Alternative Energy
Source
•Commercial Vehicle
•Consumer
•Industrial Automation
•Medical
4.20mm
9.0A
2
3.50mm
22.0A
2- 20
•Automotive
•Commercial Vehicle
5.84mm,
7.62mm
Up to
18.0A
and
40.0A
2-16
•Commercial Vehicle
•Consumer
•Industrial Automation
2.54mm
25.0A
Max
56, 66,
73, 80,
N/A
N/A
4 - 64
•Industrial Automation
•Military/Aerospace
•Networking
•Telecommunications
N/A
N/A
N/A
•Data/Communications
•Industrial Automation
•Networking
•Telecommunications
N/A
N/A
N/A
•Industrial Automation
•Medical
N/A
13.0A
Max
14, 31
MX150™
MX150L™
MX123™
MXL38999™
Offered in wire-to-wire, wire-to-panel and wire-toboard configurations, the IP67-rated MX150L™ system
provides design flexibility for low level signal to high
power applications. Key features include pre-assembled
connector housings, integral TPA and two-way mat seal
on mating connector, sealed panel-mount plugs and
proven blade-type terminals.
The MX123™ is a fully sealed, high-performance
connection system designed for transportation powertrain applications in the most challenging under-hood
environments. Features include integral TPA and CPA,
lever ‘mate assist’ receptacles and ‘anti-scoop’ housings
to prevent terminal damage. Headers and dress covers
complete the range.
High-density all optical MXL38999™ provides MILDTL-38999 solutions for APC, UPC single mode and
PC multi-mode applications. The connectors include
precision-machined and plated all-metallic inserts with
zero plastic distortion. Available in all standard shell
materials and plating options. Designed with Molex’s
LumaCore™ optical terminus technology.
The Sealed SFP (Small Form-factor Pluggable) assembly
is an optical and electrical-integrated connection
system, designed to maximize valuable real estate on
the PCB while providing an environmentally rugged
interface rated to IP67. Compatible with ODVA optical
and copper assemblies.
•Automotive
•Commercial Vehicle
Sealed SFP
Industrial USB
XRC™
40
Molex’s IP67 and NEMA 6P rated Industrial type A and
type B Universal Serial Bus (USB) connectors are ideal
for industrial and harsh commercial applications. The
rugged plug and receptacle designs feature bayonetstyle latches, encapsulated PCB receptacles and fully
shielded cable assemblies to help keep out dust, debris
and water.
The IP67 rated Extra Rugged Circular (XRC™) system
includes plastic plugs and receptacles and new lowinsertion-force stamped terminals. Features include
tactile and audible mating feedback, visual markings on
outer shell, seal retainer collar, imprinted wire seals and
bayonet-latch design in shell sizes 18 (14 contact) and
24 (31 contact) types.
•Automotive
•Commercial Vehicle
www.molex.com
Sealed
Connectors
Product Name
SRC
Mizu-P25™
CMC
CMX
Perma-Seal™
Description
Molex’s SRC (Sealed Rectangular Connectors), with
single-handed blind-mate functionality offer a hybrid,
high power-and-signal, high circuit-count interface for
harsh applications in commercial vehicles. The SRC
system uses proven MX150™ terminals with current
ratings up to 18.0A and MX150L™ terminals with
current ratings up to 40.0A.
Mizu-P25™ wire-to-wire connector system is IP67
certified. The family includes systems rated up to
125 V and 250 V. Due to their small dimensions both
systems are ideal for wire-to-wire applications in
confined spaces. Other features include positive locking,
polarisation and special terminal designs for high
vibration applications.
The Molex family of CMC Hybrid Connectors provides
a sealed, high-density, modular and cost-effective
connection system for heavy-duty, powertrain and bodyelectronics applications in the transportation industry.
Traditionally a wire-to-board system, Molex has recently
introduced a 32-circuit wire-to-wire version and new
28-circuit R/A headers.
Robust, high-density CMX connectors provide IP6K9K
interfacial-seal protection in a compact, cost-effective
lean design for electronic control units and other wireto-board transportation applications. Features include
a robust TPA™ design, different color codings and
polarisation, lever-actuated movable seal protector and
sealing dummy cavity plugs.
MIL-T-7928 approved Perma-Seal™ terminals and
splices give long-lasting, moisture-proof connections
that withstand corrosive compounds and heat. The
NiAc™ insulation material (shrinks up to 40% faster
than comparable nylon/ polyolefin products) and special
hot-melt adhesive used in the inner wall of the sleeve
provide a tough and durable seal.
The MXP120™ Sealed Connector System is a highperformance 1.20mm terminal in-line connection
system for automotive and commercial vehicles. Female
receptacles feature an integral locking-latch with bridge
protection and independent secondary locking while the
male connectors feature primary lock reinforcement.
Pitch
Current
Rating
Circuits
Size
4.20mm
40.0A max
38, 66, 84
•Commercial Vehicle
•Industrial
2.50mm
3.0/4.0A
2-4
•Automotive
•Commercial Vehicle
•Consumer
•Industrial
Various
2.5 - 26.0A
(Power
Blade)
22 - 154
•Automotive
•Commercial Vehicle
•Industrial
2.50mm
3.70mm
7.50A max
55, 65
•Automotive
•Commercial Vehicle
N/A
N/A
N/A
•Industrial Automation
•Military/Aerospace
•Networking
•Telecommunications
4.00mm
13.0A
2, 6
•Automotive
•Commercial Vehicle
•Consumer
Applications
MXP120™
www.molex.com
41
Memory Module
Sockets
Product Name
DDR3 DIMM
Description
Molex offers DDR3 DIMM sockets in low-profile and verylow-profile SMT and press-fit aerodynamic versions with
2.40mm seating plane, that maximise air flow around
memory modules during operation, and ultra-low-profile
DDR3 DIMM sockets with 1.10mm seating plane for
optimum design flexibility. Accepts JEDEC specifications,
ATCA recognised.
DDR2 increases the data bandwidth over DDR by
doubling the data fetch rate at the same bus frequency.
It is able to deliver data throughput beyond 3.2 Gbps.
Features include high-temperature thermoplastic
housing, dual ejector latches, added contact wipe and
beveled metal pins.
Angle
Current
Rating
Circuits
Size
Applications
Vertical
25°
1.0A
240
•Data/Communications
•Industrial
•Medical
•Networking
•Telecommunications
Vertical
25°
22.5°
1.0A
200, 244
•Consumer
•Data/Communications
•Networking
•Telecommunications
1.0A
200, 244
•Consumer
•Networking
•Telecommunications
Vertical
28.5°
0.5A
240
•Data/Communications
•Networking
Vertical
Right Angle
25°
1.0A
168
•Consumer
•Data/Communications
•Networking
•Telecommunications
Vertical
0.75A
(Per pin)
288
•Telecom
•Datacom
DDR2 DIMM
MiniDIMM
The MiniDIMM saves PCB real estate over full size
DIMMs whilst ensuring the same reliable features.
Features include card guide style latch, direct module
Vertical
insertion into connector, integral vibration damping,
SMT fitting nails at both ends, and standard and reverse Right Angle
22.5°
configurations in vertical, angled and right-angled
versions.
FB DIMM combines the high-speed internal architecture
of DDR2 with a bi-directional point-to-point serial
memory interface which links each FB DIMM module
together in a chain. The system is available in various
color options and accepts JEDEC defined modules to
ensure 100% industry compatibility.
Fully Buffered
DIMM
Molex’s DIMM modules feature high-temperature
thermoplastic housing to withstand lead-free solder
processing, dual ejector latches to ensure easy module
insertion/removal with minimal micro-motion, added
contact wipe for oxidation wipe-off and forklocks for
secure PCB retention.
DIMM
Meeting JEDEC specifications, Molex’s DDR4 high-speed
sockets offer greater PCB real-estate and cost savings
with excellent assembly-processing compatibility. The
sockets feature high dimensional stability and excellent
compatibility in lead-free and halogen-free technologies.
DDR4
42
www.molex.com
Memory Card
Sockets
Product Name
Description
Available in various profiles, Molex’s push-push, hinged
and push-pull microSD* connectors reduce card sticking
and memory card fly-out. Features include ultra small
size, detect terminal with wiping function, metal
shielding, gold-plated beveled contacts, solder nails and
detect switch.
microSD*
SD
microSD*/
SIM Combo
Pitch
1.09mm
1.10mm
1.27mm
Current
Rating
0.5A
Circuits
Size
Applications
8/9
•Automotive
•Consumer
•Data/Communications
•Industrial
•Medical
9
•Automotive
•Consumer
•Data/Communications
•Industrial
•Medical
16 / 18
•Automotive
•Consumer
•Data/Communications
•Industrial
•Medical
6/8
•Automotive
•Consumer
•Data/Communications
•Industrial
•Medical
6, 8
•Automotive
•Consumer
•Data/Communications
•Industrial
•Medical
6
•Automotive
•Consumer
•Data/Communications
•Industrial
•Medical
*microSD is a trademark of the SD Card Association
Molex‘s compact size, user-friendly SD memory card
connectors provide space savings and features like
push-push eject for smooth card extraction and with the
newest design allowing the card to extend to 6.00mm
outside the shell in the locked position. The family
includes card polarisation features and gold-plated
beveled contacts.
This combo connector enables the user to combine two
connector form factors into one, thus saving space.
Push-push reverse-mount microSD* with detect switch
combined with push-pull normal-mount SIM provide
design flexibility with left-entry and right-entry versions.
Reliable coplanarity of 0.1mm max after reflow ensures
assembly process efficiency.
2.50mm
1.09mm
1.27mm
0.5A
0.5A
*microSD is a trademark of the SD Card Association
Molex’s low-profile micro-SIM card sockets come
in hinged, push-pull and push-push styles offering
optimum space and cost-savings. Features include
small footprint and low-profile height, terminal-beam
design with gradual lead-in, anti-shorting feature, card
polarisation and multiple soldering hold-down points.
1.35mm
1.40mm
2.54mm
Molex‘s SIM card connectors are made of hightemperature thermoplastic material and feature a range
of standard options plus the ability to custom design
parts in specific applications. The new block-type design
integrates the SIM card into the mobile application via
the connector.
1.09mm
1.27mm
2.54mm
0.5A
micro-SIM
0.5A
SIM
Molex offers ChipSIM connectors in standard and
custom designs for both the connector and cardholder.
Optionally, the connector comes with an active- or
passive-latch mechanism, location tabs and various
button designs and colors; the cardholder fascia is
modifiable for shorter customer assembly process.
ChipSIM
www.molex.com
2.54mm
0.5A
43
Standard
Antennas
Product Name
Description
•Ground-plane independent design
•Poly-flexible, double-sided adhesive tape on antenna
•Robust coaxial cable to flexi-antenna with Pull Force of over 18.0N
•Choice of several miniature coaxial cable length options
2.4/5 GHz Wifi
Standalone Antenna
•Smallest on-ground plastic antenna in the market measuring only 3.00 by 3.00 by 4.00mm
•No removal of ground layers from beneath the antenna needed
•Fully SMD-compatible
•Application of Laser Direct Structuring (LDS) chip antenna technology in manufacturing
2.4GHz Surface
Mount Device (SMD) On Ground Antenna
•Built on proprietary MobliquA™ technology enable significant antenna volume reduction
•Balanced design minimises ground-plane effects
•Minimum total radiation efficiency of 50% and 67% (respectively) for the 868 and 915 MHz bands
•Poly-flexible, double-sided adhesive tape for easy peel-and-stick mounting
868/915MHz ISM
Standalone Antenna
•Total average efficiency of 80% at the low band (GSM850, GSM900) and 70% at the high band (GSM1800, GSM1900
and LTE band-7)
•Balanced design minimises ground-plane effects
•Poly-flexible double-sided adhesive tape for easy peel-and-stick mounting
•Robust coaxial cable to flexi-antenna with a pull-force of over 18N
Cellular 6 Band
Standalone Antenna
•Simple 50 Ohm passive antenna interface provides complete CMMB band coverage
•Internal antenna design enhances mobile device appearance
•Product is RoHS compliant and halogen-free for environmental sustainability
•Specially-designed housing slots reduce antenna radiation loss
Mobile TV
Standard Antenna
44
www.molex.com
Solid State
Lighting
Product Name
LED Array
Holders
Description
•Molex LED Array Holders available for Bridgelux*, Citizen†, Cree‡, Nichia and Sharp**
•Certified and tested to UL 496 OLFB2 lampholder specification
•Simplifies the COB (chip on board) LED installation process, reducing quality concerns associated with other
installation methods such as hand solder
•Compression contacts to power array provide a reliable electrical connection
•Double-ended wire-trap terminal to attach power source, allows for wiring single or serial LED sequences to ensure
ease of assembly and design flexibility
•New elegant design features provide a clean and finished look to COB LED array installation
•Molex LED holder designs address every aspect of COB LED installation: thermal management, reliable electrical
connection and optical requirement
•New designs available for Cree XLamp‡ series CXA1507, CXA1512, CXA2520, CXA2530
•Mechanical attachment for directional optics (Optional CXA25)
•Pre-load feature allows for attachment of COB LED to holder prior to attaching to heat sink, simplifying installation
•Elegant design with flat landing surface for secondary optics and beveled area to allow for an uninterrupted beam
pattern from lightsource
•High temperature thermal plastic housing to resist high heat environments
Cree ‡ LED Array
Holders
•Designed to accommodate Nichia L series COB LED arrays
•Clearance provided around LED to easily incorporate secondary optics
•Concealed wire trap cap protects electrical contacts and provides additional voltage isolation when incorporating metal
reflectors
•High temperature thermal plastic housing to resist high heat environments
Nichia LED Array
Holders
Pico-EZmate™
Harness
•Solderless connection design minimises handling of arrays during installation, greatly reducing the possibility of
damage
•Eliminates specialised operator training and solder-joint inspection
•Vertical snap-to-mate connection enables a fast, easy and reliable connection to the LED array holder
•Low-profile 1.40mm connector height provides a slim design for space-limited applications and minimises risk of
affecting light output
•Positive-lock latching feature provides an audible click to confirm connection
•Available in 3 wire gauges and several length options for design flexibility (Bridgelux Vero* example shown in photo)
* Bridgelux and Vero are trademarks or registered trademarks of Bridgelux, Inc.
†
Citizen is a registered trademark of Citizen Electronics Co., Ltd.
‡
Cree and XLamp are registered trademarks of Cree, Inc.
** Sharp is a registered trademark of Sharp Electronics Corporation.
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Switch
Products
Switch Technology
Capacitive
Sensing
Description
•Elegant design
- Unique backlighting solution with seamless overlays allow for easy cleaning
- Unlimited cosmetic options including colors, textures and backlighting
•Robust and durable
- No moving parts to wear out; can sense through the protection of glass or thick plastic overlays
- Resistant to harsh chemical exposure, the effects of EMI and contaminants on overlays
- Can be sealed and protected from environmental effects
•Design flexibility
- Circuit can be constructed using polyester, polyimide or PCB and can be mounted to curved surfaces
- Shape and size of buttons can be tailored to customer specifications
•Extremely reliable contact system withstands even the most rugged commercial environment
•Dome designs are produced with auto-placement in mind to ensure product reliability
•Lightweight and low profile; easy to integrate into smaller and thinner packages
Metal Dome
Arrays
•Extremely resistant to shock and vibration; excellent for commercial applications
•Durable to meet the needs of rugged and high-usage applications
•Can be shielded to offer protection against static discharge and EMI/RFI
Membrane Switches
Non-Tactile
•Extremely reliable contact system that withstands even the most rugged commercial environment
•Dome designs are produced with auto-placement in mind to ensure product reliability
•Can be shielded to offer protection against static discharge and EMI/RFI
Membrane
Switches Tactile
•Allows addition of simple electronic components onto the flexible switch substrate, which often eliminates the need for
an additional LED or display board mounted below the switch substrate
•Washable and well-suited for medical, industrial and commercial applications
•Can be shielded to offer protection against static discharge and EMI/RFI
Bonded Membrane
Switch Assemblies
•Combines both the switch contact system and custom electronics into one complete package, eliminating the need for
an additional LED indicator board
•Keypad can be designed using various interface systems, such as 3-dimensional (rubber keypad) buttons or flat panels
•PCB substrate offers additional rigidity in front panel applications, which may eliminate the need for a metal backer
Hybrid Switch
Assemblies
•Combines both the switch contact system and custom electronics into once complete package, eliminating the need
for an additional motherboard or display board
•Keypad can be designed using various interface systems, such as 3-dimensional (rubber keypad) buttons or flat panels
•Can be shielded to offer protection against static discharge and EMI/RFI
Control Panel
Assemblies
•Insert molded contact system can be combined with molded assembly packages, which is well-suited for end products
such as cellular telephone volume controls and special, sealed product applications
•Front panel may be backlit by electroluminescent panels
•Washable and well-suited for medical, industrial and commercial applications
Insert Molded
Switch Assemblies
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www.molex.com
Switch
Products
Switch Technology
Description
•Alternative to PCBs or polyimide, which reduces the cost and allows printed flexible tail integration as part of the switch
substrate
•Eliminates the need for an additional interconnect method
•Easy to integrate into low-profile applications so products can be designed into tightly controlled areas
•Designers may add optional cosmetic enhancements such as rubber keypads or graphic overlays
Flexible Circuits
Custom
Solutions
When it comes to investing in research and development, Molex is an industry
leader. We know that by leveraging our internal product technology, we can drive
a continuous supply of innovation directly to you. If you are faced with a specific
challenge that cannot be solved through our existing portfolio of connectors and
integrated products, please contact Molex.
Application
Tooling
Molex offers a wide variety of production equipment designed and tested to ensure
a high quality electrical connection. From fully automatic equipment that provides
production flexibility and works in most industry standard wire processors to semiautomatic equipment and hand tools for prototyping, Molex offers the solution for
all your application needs.
www.molex.com
47
Get more insights at: www.molex.com
Order No. 987651-0991
Printed in Germany/5000/GM/BD/2014.06
©2014 Molex