AMERICAS’ EDITION
OCTOBER
2 0 14
PRODUCT AND TECHNOLOGY NEWS FROM FUTURE ELECTRONICS
NXP
LPC82x: the New Family
of Microcontrollers
PAGE 4
Renesas
Work Less. Create More.
Micrium RTOS and
Middleware Modules,
Bundled with Renesas MCUs
PAGE 5
Microchip
Perform Under Pressure
Using dsPIC® DSCs
PAGE 7
Exar
XR22804: Highly Integrated
USB-Ethernet Bridge
PAGE 13
Register to qualify to receive FREE CUI DC/DC samples!
See details on page 17
TABLE OF CONTENTS
APPLICATION SPOTLIGHT
Renesas
The DSP capabilities and performance of Renesas' RX MCU Family make all the difference
NXP
Smartphone Quick-Jack Solution
NXP
LPC82x: The New Family of Microcontrollers
Renesas
Work Less. Create More. Micrium RTOS and Middleware Modules, Bundled with Renesas MCUs
Zilog
Z8 Encore! XP F6482 Series Microcontrollers
CypressPSoC® 4 Prototyping Board for Only $4
Microchip
Perform Under Pressure Using dsPIC® DSCs
ROHM Semiconductor
Low Power Microcontrollers
Central Semiconductor Corp.
TVS Protection for USB 3.1/Thunderbolt Data Lines
TE Connectivity
Seal Against Moisture & Debris – Splashproof Micro USB 2.0 Connector
Vishay
8-Channel Precision Multiplexer with Low 3.2Ω On-Resistance and 17µA Power Consumption
ams
Integrated Color Sensor Drives New Intelligent Display Management in Smartphones and Tablets
Exar
XR22804: Highly Integrated USB-Ethernet Bridge
Micrel
Be the Superhero! Empowering Technologies of the Present and Future!
3
4
4
5
6
6
7
8
10
11
12
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13
24
DESIGN NOTE
Microsemi
Power-Aware DSP Design on Lowest Power Mainstream FPGA
14
COMPONENT FOCUS
International Rectifier
CUI Inc.
CUI Inc.
TE Connectivity
Susumu
SL Power
Future Electronics
IRFHE4250D FastIRFET™ : Exposed Top Delivers Superior Efficiency for DC/DC Applications
Rugged, Efficient, Economical DC/DC Converters Satisfy a Broad Range of Applications
Why Trust Your Circuit to Anything Else?
Protect Your Reputation for Innovation with High Quality ESD Devices
World’s Smallest Low Noise Current Sensing Resistor
Solves Power Challenges for Test & Measurement and Industrial Equipment with CINT1275 275W AC/DC Power Supply
Analog Corner
16
17
17
18
18
19
20-21
TECHNICAL VIEW
Future Electronics
Systems-on-Module: Suitable for First Time Embedded Computing Designs?
22-23
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1.800.675.1619 • www.FutureElectronics.com
Motion, Music, Filters or Feedback
The DSP capabilities and performance of Renesas’
RX MCU Family make all the difference.
With over 34%* of the $1 billion market for 32-bit Digital Signal Controllers, Renesas is the clear
leader in DSC applications. The RX Family offers the best blend of both MCU and traditional
DSP approaches for signal control, and the combination of RX performance and the extensive
DSP library are just what is needed for demanding signal processing and conditioning applications.
Traditional MCUs:
Single-chip solution
Interrupt management system
Fast interrupt response
Efficient general instructions
Fine power management
Wide connectivity choice
Rich supervisory functions
Easily programmed in C
Simple low-cost tools
The
Broad ecosystem
Traditional DSPs:
Hardware multiply and divide
Saturating math
1-cycle wide multiply-accumulate
Barrel shifters
Simultaneous Code/Data Access
Floating Point Unit
RX Family offers a perfect blend of MCU and DSP
The RX MCU is a Digital Signal Controller
The DSP Library is one of many software libraries provided by Renesas. It implements numeric
operations used in digital signal processing applications, thereby enabling general purpose
MCUs to add DSP functionalities. The DSP Library is free of charge and supported by Renesas.
Easy to Use and Fully Optimized
Application Code
API
Written in C
DSP Library
Optimized in assembly
The DSP Library includes kernels for:
Complex math
Filters
operations
Matrix
Supports
16-/32-bit
Statistical
fixed
and
floating
Transform
point data types
RX DSP Library – 36 Kernels include 314 Functions
Complex
128 Functions
47 Functions
Statistical
45 Functions
Transform
48 Functions
Get your own Speaker
Compensation code
for the RX MCU
> Click Here
Matrix
40 Functions
Forward Complex FFT
Matrix Add
IIR Biquad
Phase
Max/Min
Forward Complex DFT
Matrix Subtract
Leaky LMS Adaptive
Complex Add
Mean Absolute Value
Inverse Complex FFT
Variance
Inverse Complex DFT
Generic Complex FIR
Lattice FIR
Complex Subtract
Complex Multiply
Histogram
Lattice IIR
Complex Conjugate
Max Absolute Value
Single-Pole IIR
Magnitude Squared
Mean Absolute Deviation
Fast Magnitude Estimate
Median
Forward Real FFT
Matrix Multiply
Matrix Transpose
Matrix Scale
Forward Real DFT
Inverse Complex Conjugate
Symmetric FFT
Inverse Complex Conjugate
Symmetric DFT
With its hardware-based DSP capabilities and its extensive free DSP library, the RX Family is ideally
suited for embedded signal processing. Whether you need an ultra-low power, entry-level 32-bit
solution like the RX100 series, or a high-performance, full-featured solution like the RX600 series,
the DSP solutions offered are fully scalable across all 800+ members of the RX Family.
For more information or to buy products, go to www.FutureElectronics.com/FTM
Kernel
Mean
Kernel
Magnitude
Kernel
Generic Real FIR
Kernel
Kernel
Filter
See the RX DSP
Library in action as
Dr. Micro transforms
the quality of small,
inexpensive speakers!
> Click Here
*Forward Concepts
market analysis, 2011.
APPLICATION SPOTLIGHT
Smartphone Quick-Jack Solution
The flexible Smartphone Quick-Jack Solution
adapts the standard 3.5mm stereo audio
jack found on most iOS or Android smart
devices into a self-powered data port and
provides a universal interface for external
sensors, switches and other devices. It
gives both consumer and industrial product
designers a simple, plug-and-go way to
get data into an endless variety of control,
monitoring, data collection, maintenance,
medical and even fun applications.
The Smartphone Quick-Jack Solution includes a
small PCB with an NXP LPC812 microcontroller,
an energy harvesting circuit, a miniature joystick,
and an expansion header. The LPC812 is an ARM
Cortex M0+ microcontroller which manages the
data transport, encoding and decoding data to
be exchanged over the audio channels using the
Manchester algorithm. The board’s expansion
header makes it easy to connect myriad sensors,
switches, HMI devices or other components that
collect or log data from a variety of sources.
An energy harvesting circuit utilizes the right audio
channel to supply power from the Smartphone to
the Quick-Jack board. The supplied App for Android
phones and iPhone displays joystick position and
temperature, and can turn LEDs on the Quick-Jack
board on and off.
Smartphones vary widely in design of the 3.5mm
audio jack, so an application note is also provided
with tips for designing the communication
interface. Quick-Jack is designed to work with
various iPhone platforms and Galaxy S3, and is
an excellent reference for designing with other
mobile platforms in mind.
Box Contents
•Quick-Jack circuit board, ready for use with
smart devices
•To download the sample App please visit
Google Play at the iPhone App Store and
search for “NXP Quick-Jack”
To buy products or download data, go to
www.FutureElectronics.com/FTM
FEATURES
This fully contained solution kit (OM13069)
includes everything needed to get started:
•Circuit board based on an LPC812 MCU
•Header for connecting external debug probe,
enabling code development
•Energy harvesting design draws power from
Smartphone audio signals
•I/O devices: joystick, thermometer and LEDs
•3.5mm male stereo plus microphone audio jack
•Expansion connector for attaching external
sensor/switch/HMI devices
•Downloadable free Apps for both iOS and
Android, source code available
•Battery (optional)
Versatility redefined
From connected thermostats, to wearable fitness devices, rack and
server monitors, home and building automation devices, lighting
controls, toys, models, and many more, the new LPC82x family of
microcontrollers dramatically extends the application versatility
of the LPC800 Series for today’s highly connected, sensor-dense,
battery powered, and IoT end-node designs.
For more information or to buy products, go to
www.FutureElectronics.com/FTM
LPC82x Family At-A-Glance
Analog
Up to 12ch, 12-bit,
1.2Msps ADC
Comparator
Supply voltage
1.8 – 3.6V
2
Power
90µA/MHz (active) and
four low-power modes
UART
Up to 3
Temp range
Up to 105ºC
GPIO
Up to 29
Packages
TSSOP20, HVQFN33
Core
30MHz ARM Cortex-M0+
Memory
Up to 32kB Flash
Up to 8kB RAM
I2C
4
SPI
SECURE CONNECTIONS
FOR A SMARTER WORLD
Work Less. Create More.
Micrium RTOS and middleware modules, bundled with Renesas MCUs, let you bypass
the time consuming, expensive and often tedious process of writing infrastructure code –
freeing your time and efforts to perfect your design and go on to create new ones.
Now with IPv6-ready TCP/IP Networking Stacks
IPv
6
R E A DY
“The Power of Two” program is now an even more attractive HW/SW embedded
system development solution. With the addition of IPv6, “The Power of Two” now
supports Internet of Things (IoT) applications, enabling participants to maximize
their RX and RL78 performance for machine-to-machine and cloud communication.
The Power of Two –
Getting You to Market Fast
Application Code
Eliminates months of effort
needed to create, test and
debug fundamental system
code
Example Projects
Now Featuring IPv6
Compact, reliable, high-performance
TCP/IP protocol stack, featuring dual
IPv4 and IPv6 support.
Drivers – Renesas Firmware
Integration Technology (FIT)
Start system
design at
application
code level,
saving
valuable
time and
resources.
Peripheral-rich Renesas
MCUs provide superior
performance and versatility
$111K
VALUE!
Example projects that raise
the starting point of a design
to a higher level
Peripheral Function Modules
State-of-the-art RTOS and
Middleware modules, plus
one year technical design
support for trouble-free
design process
Renesas FIT modules and
Board Support Package
Board Support Package
(FIT supported MCU Initial Settings)
MCU
the
Get StartedtheToday!
am.renesas.com/micrium/future
of
of
APPLICATION SPOTLIGHT
Z8 Encore! XP F6482 Series Microcontrollers
Zilog’s F6482 series MCUs, members of
the Z8 Encore! XP family, are based on
our advanced 8-bit eZ8 CPU core. These
microcontrollers support 1.8V to 3.6V low
voltage operation with extremely low Active, Halt, and Stop Mode currents and offer
an assortment of speed and low power
options.
The F6482 series features 26 to 67 port pins
(Ports A-J) for general-purpose input/output
(GPIO). The number of GPIO pins available is
a function of package. Each pin is individually
programmable.
FEATURES
•24MHz eZ8 CPU core
•16KB, 32KB, 60KB or 64KB Flash memory
with in-circuit programming capability
•2KB or 3.75KB internal RAM
•Up to 128-bytes non-volatile data storage
(NVDS)
•12-bit (or 14-bit 2-pass) analog-to-digital
converter
•12-bit digital-to-analog converter (DAC)
•Two on-chip, low power analog comparators
•Two on-chip, low power operational amplifiers
•Full speed universal serial bus (USB 2.0) device
supporting eight endpoints with integrated
USBPHY
•Three enhanced 16-bit timers with capture,
compare, and PWM capability
•Watchdog timer (WDT)
•Wide operation voltage range: 1.8V to 3.6V
•32-, 44-, 64-, and 80-pin packages
APPLICATIONS
•Battery-powered sensors
•Wired/wireless keypads
•PIR motion detection
•Lighting control
•Safety and security
•Utility metering
•Digital power supervisory
•Handheld electronics
•Wireless controllers
•LCD keypads
F6482 Series Development Kit
The F6482 series development kit is a complete
development solution containing the following
tools:
•F6482 series development board
•USB SmartCable (for connecting the PC to
the F6482 series development board)
•USB A to Mini B cable
•RS-232 interface module
To buy products or download data, go to
www.FutureElectronics.com/FTM
PSoC® 4 Prototyping Board
for Only $4
PSoC 4 Programmable System-on-Chip combines the function of many ICs
around a MCU core, in a unique, customized, one-chip solution – saving
designers BOM cost, development time, and board space.
•ARM® Cortex™-M0 up to 48MHz
• 32kB Flash, 4kB SRAM
• Programmable Analog: Op Amps, Comparators,
12-bit SAR ADC
• Programmable Digital: 4 x PLD-based Universal
Digital Blocks
• Timer/Counter/PWMs, Serial Communication
(UART/I2C/SPI)
•CapSense® Touch Sensing up to 36 IO
• Low Power 150nA Hibernate, 20nA Stop Modes
• Wide Operating Voltage 1.71V to 5.5V
Free download of PSoC Creator IDE with tons of included
example projects: www.cypress.com/PSoCCreator
For more information or to buy products, go to www.FutureElectronics.com/FTM
4
$
APPLICATION SPOTLIGHT
Perform Under Pressure Using dsPIC® DSCs
dsPIC Digital Signal Controllers Help You Perform, Even in Harsh Environments, to Meet Your Deadlines and Application Requirements
Relieve your deadline pressure and get your next design done on
schedule using Microchip’s family of dsPIC® DSCs. These dsPIC
DSCs also perform well in harsh environments like extended
temperature or varying voltage ranges, making them ideal for
high-pressure applications.
The dsPIC DSC family has four key features to help you perform under
pressure to meet your deadlines and application requirements. As a hybrid
architecture, the dsPIC DSC incorporates the mathematical power of a true
DSP with the simplicity and bit manipulation of a MCU. Devices are available
in an extremely broad range of package options in many different pinouts
and package sizes. Also, this family has specialized peripherals which are
optimized for real-time response and tight control loops. The very large
dsPIC DSC portfolio includes over 1,500 product variants, so you are sure to
find the perfect match for your specific application.
Performance: A True DSP with MCU Simplicity
•Designed for real-time control
•Executes up to eight operations in one instruction
•Fixed point math manages overflow and rounding
•Zero-cycle looping
•40-bit accumulators for high-precision results
•Up to 70MHz performance
Peripherals: The Right Mix of Integration
•CAN, Dual CAN and USB
•Op-amps and fast comparators
•ADCs with multiple sample and holds
•Peripheral Trigger Generator (PTG) for scheduling complex, high speed
peripheral operations
•Sophisticated PWMs with application-specific modes
Packaging: More Package Options
•18- to 144-pin options
•Use the same 28-pin package from 6KB to 512KB of Flash
•Small pincount and form factor packages
Portfolio: Scalable and Flexible Family
•Over 1,500 dsPIC DSC product variants
•Support for both 3V and 5V operation
•Extended (125°C) and high temperature (150°C) options
•Flash memory ranging from 6KB to 512KB
TARGET APPLICATIONS
Motor Control
•HVAC
•Pumps, compressors, fans
•Appliances
Industrial
•3D printers
•Sewing machines
•CNC machines
Consumer
•Power tools
•Cameras
•Projectors
Automotive
•Fans
•Sensors
•Fuel pumps
Medical
•Pulse oximeters
•Blood pressure meters
•Portable O2 concentrators
Digital Power
•Solar inverters
•AC/DC power supplies
•DC/DC converters
FEATURED STARTER KITS
•dsPIC33E USB Starter Kit (DM330012)
•Microstick II (DM330013-2)
•MPLAB® Starter Kit for Digital Power (DM330017)
•Motor Control Starter Kit (DM330015)
FEATURED PRODUCT FAMILIES
•dsPIC33EP32MC502-I/MM
•dsPIC33EP128GP504-I/PT
•dsPIC33EP128GP506-I/PT
•dsPIC33EP256GP502-I/SP
•dsPIC33EP512GM304-I/ML
•dsPIC33EP512MU810-I/PT
•dsPIC33FJ16GS504-I/PT
•dsPIC33FJ64GS610-I/PF
To buy products or download data, go to
www.FutureElectronics.com/FTM
1.800.675.1619 • www.FutureElectronics.com
7
LAPIS offers multiple families of Low Power
Microcontrollers. These low power consuming,
high code efficient RISC core MCUs range from
very small footprint types that require no external
components for timing or power management to
models that can drive up to 1536 LCD segments in
complex displays. These devices are all ideal for
products that need long battery life.
For more information or to buy products,
go to www.FutureElectronics.com/FTM
Partnerships come in all sizes.
No matter the size of your business, Future Electronics is right
beside you every step of the way, with world-class customer service
excellence, unparalleled on-time delivery accuracy, and the only
globally integrated IT platform in the distribution industry.
www.FutureElectronics.com
APPLICATION SPOTLIGHT
TVS Protection for USB 3.1/Thunderbolt Data Lines
5.0V, 15kV, 0.35pF Bi-Directional Ultra Low Capacitance Transient
Voltage Suppressor in the SOD-882L package
Central Semiconductor’s CFTVS5V0BULC is an ultra low capacitance 5.0V
bi-directional TVS in the space saving SOD-882L surface mount package.
This device provides up to 15kV of transient voltage protection for high
speed USB 3.1, Thunderbolt and HDMI 2.0 interfaces. The CFTVS5V0BULC’s
low 0.35pF maximum capacitance is a critical characteristic in preventing
signal degradation.
Superior Electrical Performance
The CFTVS5V0BULC provides designers with an energy efficient data line
protection device in an ultra small footprint of less than 0.69mm2, with an
extremely low 0.4mm profile, making it ideal for the latest small format
electronic products such as wearable electronics and portable medical
products. Since TVS devices operate primarily in the stand-by mode, low
reverse leakage current (IR ) or idle current is essential for energy efficiency.
The CFTVS5V0BULC features a maximum IR of 100nA making it a leading
product in its class.
FEATURES
•Ultra low capacitance
•Low leakage current
•15kV ESD protection
APPLICATIONS
•High speed data line protection ideal for USB 3.1, Thunderbolt
and HDMI 2.0
•User interface protection
•Charging/power port protection
Package Advantage
Low Profile
0.65mm
0.55mm
0.4mm
The SOD-882L has a 27%1.05mm
lower profile
than the SOD-882
Footprint
Utilizes less than 0.69mm2
of board space
BENEFITS
•Space saving low profile SOD-882L package
•Data line signal integrity maintained at high speeds
0.65mm
1.05mm
0.55mm
Maximum Ratings (TA = +25˚C)
PPK
(8x20µs)
VESD
(Air)
TJ
0.4mm
Electrical Characteristics: (TA = +25˚C unless otherwise noted)
Tstg
Maximum
Reverse
Stand-off
Voltage
VRWM
Breakdown
Voltage
Test
Current
VBR @ IT
VC @ IPP
Peak
Pulse
Current
(8 x 20µs)
IPP
Typical
Junction
Capacitance
@ 0V Bias
CJ
Maximum
Junction
Capacitance
@ 0V Bias
CJ
Maximum
Clamping
Voltage
IT
Maximum
Reverse
Leakage
Current
IR @ VRWM
MAX
(W)
MAX
(kV)
MAX
(˚C)
MAX
(˚C)
(V)
MIN
(V)
MAX
(V)
(mA)
(nA)
(V)
(A)
(pF)
(pF)
14
15
-55 to +125
-55 to +150
5.0
6.0
10
1.0
100
14
1.0
0.2
0.35
To buy products or download data, go to
www.FutureElectronics.com/FTM
10
1.800.675.1619 • www.FutureElectronics.com
SEAL AGAINST
MOISTURE
& DEBRIS
Splashproof micro USB 2.0 connector from TE Connectivity has a ruggedized molded
interface that provides a complete seal.
Key benefits:
n Provides protection against water and dust ingress to allow end-application rating up to IP54
n Conforms to the micro USB 2.0 performance specification
n Mates with standard micro USB 2.0 B type receptacles
n Saves cost with integrated power and signal in one connector
n Both AB and B Types available
For more
Learn
moreinformation
at TE.com or to buy products, go to www.FutureElectronics.com/FTM
© 2014 TE Connectivity Ltd. family of companies. All Rights Reserved. TE Connectivity and TE connectivity (logo) are trademarks.
APPLICATION SPOTLIGHT
8-Channel Precision Multiplexer with
Low 3.2Ω On-Resistance and 17μA Power Consumption
FEATURES
The 8-channel precision analog multiplexer
is built on a new CMOS process; the DG1408
combines low on-resistance of 3.2Ω with
extremely low power dissipation, parasitic
capacitance, and charge injection.
Compared to previous generation and competing
analog switches with similar on-resistance in
the same footprint, the DG1408 offers 25%
lower on-resistance, 10% lower drain parasitic
capacitance, and up to 30% lower charge
injection. In addition, the device´s new CMOS
platform ensures low and flat resistance over
the full signal range, providing excellent linearity
and low signal distortion.
BENEFITS
•Low insertion loss
•Low distortion
•Low power consumption
•Compact solution
•Low charge injection over the full signal range
•35V supply maximum rating
•3.2Ω typical and 4.7Ω maximum on-resistance
at +25°C
•0.5Ω on-resistance flatness
•Channel to channel on-resistance match: 0.2Ω
•Up to 250mA continuous current
•Supports single and dual supply operation
•Fully specified at ±15V, +12V, and ±5V
•Integrated VL supply
•Low voltage logic compatible inputs, VIH = 2V,
VIL = 0.8V
•Break-before-make (BBM) switching
•Low parasitic capacitance: DG1408,
CS(off) = 23pF, CD(on) = 121pF
•Rail-to-rail signal handling
•QFN16, 4 × 4mm packages
To buy products or download data, go to
www.FutureElectronics.com/FTM
APPLICATIONS
•Medical and healthcare equipment
•Data acquisition systems
•Industrial control and automation
•Test and measurement equipment
•Communication systems
•Battery-powered systems
•Sample and hold circuits
•Audio and video signal switching
•Relay replacement
ams Integrated Color Sensor Drives New Intelligent
Display Management in Smartphones and Tablets
blocking filter makes this device an excellent
ambient light sensor, color temperature monitor,
and general purpose color sensor.
The TMD3782x device will perform color
temperature measurement, ambient light
sensing (ALS) and proximity detection with
background light rejection. The device
detects light intensity under a variety of
lighting conditions and through a variety of
attenuation materials, including dark glass.
The proximity detection feature allows a large
dynamic range of operation for accurate distance
detection, such as in a cell phone when the user
positions the phone close to their ear. IR LED
sink current is factory trimmed to provide
consistent proximity response without requiring
customer calibrations. An internal state machine
provides the ability to put the device into a
low power state between proximity and RGBC
measurements, providing very low average
power consumption.
The color sensing feature is useful in applications
such as backlight control, solid state lighting,
reflected LED color sampler, or fluorescent light
color temperature detection. The integrated IR
12
FEATURES
RGB, ALS and Proximity Support
•Power management features
•I2C fast mode interface compatible
•Integral IR LED
•Small 8-lead optical module
Color Temperature and ALS
•UV and IR blocking filters
•Programmable gain and integration time
•1,000,000:1 dynamic range
Equal Response to 360o Incident Light
•Circular segmented RGBC photodiode
Ideal for Operation Behind Dark Glass
• Very high sensitivity
Proximity Detection with Integrated IR LED
•Background ambient light rejection
•Factory trimmed, consistent response
•Programmable current sink for IR LED drive
APPLICATIONS
•Mobile phone touchscreen control
•Ambient light sensing
•Light color temperature sensing
•Medical diagnostics
•Optical switch
To buy products or download data, go to
www.FutureElectronics.com/FTM
1.800.675.1619 • www.FutureElectronics.com
XR22804
Highly Integrated USB-Ethernet Bridge
Connectivity from a Single USB Port to 10/100 Ethernet, UART, I2C, and EDGE GPIO
Features
Applications
• Integrated 480Mbps USB 2.0 PHY
• POS Terminals
• Integrated 10/100 Ethernet MAC and PHY
• Docking Stations for Handheld Devices
• UART Data Rates up to 15Mbps
• USB Dongles
• Auto RS-485 Half-Duplex Control I2C Multi-Master
• Port Expanders for Microcontrollers
• Enhanced Dedicated GPIO Entity (EDGE)
• Industrial Controls
• ±15kV HBM ESD Protection (USB)
• Medical Diagnostics
• Parallel GPIO access
5.0V VCC
5.0V VCC
GND
GND
10/100
Ethernet MAC
UART
Channel A
25MHz
XTAL
XTALIN
XTALOUT
10/100
Ethernet PHY
UART
Channel B
USBD +
USBD -
USB 2.0
PHY
USB 2.0
Hub
Pin
Mux
UART
Channel C
VBUS _SENSE
LOW_PWR#
UART
Channel D
EDGE
Controller
USB
Descriptors
OTP
I²C Master
Part
Number
CPU
Interface
Ethernet
MAC/PHY
(Mbps)
UART
Channels
UART
Max Data Rate
(Mbps)
UART
Tx/RX FIFO
(Bytes)
Auto RS-485
Half-Duplex
Control
No. of
GPIOs
(Max)
I 2C
Master
Supply
Voltage
Package
XR22800
USB 2.0
10/100
0
15
1024/1024
√
8
√
4.4 - 5.25
QFN-32
XR22801
USB 2.0
10/100
1
15
1024/1024
√
8
√
4.4 - 5.25
QFN-32
XR22802
USB 2.0
10/100
2
15
1024/1024
√
32
√
4.4 - 5.25
QFN-56
XR22804
USB 2.0
10/100
4
15
1024/1024
√
32
√
4.4 - 5.25
QFN-56
For more information or to buy products, go to www.FutureElectronics.com/FTM
©2014 Exar Corporation. All other brand names, product names, or trademarks belong to their respective holders and are hereby acknowledged.
DESIGN NOTE
Power-Aware DSP Design on Lowest Power Mainstream FPGA
By: Hichem Belhadj, Govind Krishnan, Madhubabu Anumukonda, Microsemi
450
Total Power 32-Tap
400
350
300
250
91.6
401.42
Xilinx Artix7
260
223.2
394
229.6
183.9
Microsemi M2GL150
Altera Cyclone V
Frequency MHz
0
50
100
600
150
200
Total Power 64-Tap
500
446.78
303.5
378.9
414.62
225.9
299.8
343.02
170.9
107.2
100
306.36
200
204.2
300
552.5
400
Power mW
Finite Impulse Response or FIR filters are among the DSP blocks widely used
in a large number of applications to remove unwanted noise, improve signal
quality, or shape signal spectrum. Several architectures of these FIR filters
(Transpose, Systolic with or without symmetry) have various characteristics
such as the total initial latency, the number of DSP blocks, the throughput
or performance, and the number of pipeline registers. Figure 1 depicts the
symmetric versions of Transpose and Systolic 16-Tap FIRs and illustrates the
differences between these architectures.
195.3
162.1
100
142.1
150
50
323.86
200
291.78
Power-mW
One of the pillars of Microsemi’s religion is “Power Matters.” While
the previous generations of Microsemi FPGAs delivered the lowest
static power in their class, SmartFusion2 and IGLOO2 were designed
to deliver not only the lowest static power, but also the lowest total
power. This was achieved with a comprehensive power-conscious
development of process technology, architecture, and design of the
configurable logic, and embedded features such as SerDes, DDR2/3,
and DSP blocks. Additionally, these devices offer a Flash*Freeze
power mode that reduces the power consumption to even less than
the static power. This article focuses on DSP designs; FIR filters
architectures will be briefly discussed and actual silicon power
dissipation comparison will be presented.
The power study of all these architectures covered 32-, 64-, 128-Tap Transpose FIR implementations, the power estimation tools, and more importantly actual silicon measurement at various temperatures. The following
figures provide the actual silicon Total Power measured at room temperature on the development kits for IGLOO2, Artix7, and CycloneV.
Frequency MHz
50
100
900
Xin
Xilinx Artix7
Altera Cyclone V
0
16-Tap Symmetric SYSTOLIC FIR Filter (Even-Tap)
Microsemi M2GL150
150
200
Total Power 128-Tap
reset_n
800
Clk
700
C7
36
ZEROs
B
A
C
36
B
A
36
600
500
400
100
0
50
16-Tap Symmetric Transpose FIR Filter
C0
Clk
C1
C1
C0
ZEROs
C
B
A
C
36
ZEROs
B
A
C
36
B
A
C
36
B
MultAdd2
MultAdd15
354.3
419.6
435
Xilinx Artix7
Altera Cyclone V
Frequency MHz
100
150
200
A
36
Yn_out
MultAdd1
Microsemi M2GL150
Figure 2: 32-, 64-, and 128-Tap FIRs actual silicon total power consumption for IGLOO2, Artix7,
and Cyclone V
Xin
reset_n
230.9
200
MultAdd8
139.7
MultAdd2
280
Yn_out
MultAdd1
344.6
300
839.3
C
623.26
A
450.6
B
Power-mW
C
580.1
C1
548.24
C0
ZEROs
MultAdd16
Figure 1: Architecture of Symmetric Transpose and Systolic 16-Tap FIRs
In a nutshell, systolic architectures use pipeline stages and reduce the
inputs fanout to increase the frequency of operations. However the initial
latency for N-Tap systolic FIR is (2*N -2)-cycles. The transpose architectures
run at a lower frequency but have a better initial latency of (N-1)-cycles and
use less sequential resources. Other criteria related to filter stability arise
in particular when the number of taps is very large and weighting features
need to be considered. For instance, in a voice processing application dealing with echo cancellation, the weights need to be higher at the near end,
where most of the echo resides, and decrease on the later filter taps as the
echo is lower.
Looking at the charts in Figure 2, several comments are worth making:
1.The silicon measurements prove that IGLOO2 has significantly lower
power when compared to Artix7 and CycloneV. These saving figures are
more substantial at lower frequencies and at high temperatures. These
figures will be even more drastic, as IGLOO2 numbers were collected for
1.2V while the device is capable of running at 1V.
2.The power dissipation of IGLOO2 is linear to the number of Taps.
3.The Artix7 power figures are worse when the number of Taps is low,
while the Cyclone V power dissipation gets worse when the number
of Taps grows. The in-depth analysis of the Altera peculiar power
consumption when the number of Taps increases highlights some
architectural issues.
In conclusion, Microsemi SmartFusion2 and IGLOO2 families are the best
suited for power-conscious high speed designs and particularly when these
are DSP intensive.
To buy products or download data, go to
www.FutureElectronics.com/FTM
14
1.800.675.1619 • www.FutureElectronics.com
Just because we’re big
doesn’t mean we aren’t flexible.
With flexibility, customization, and an unparalleled commitment
to service excellence, Future Electronics puts the ‘different’ in
differentiators. Being in a unique position as a privately held company,
we can offer credit terms, customer dedication and inventory
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www.FutureElectronics.com
COMPONENT FOCUS
IRFHE4250D FastIRFET™: Exposed Top Delivers
Superior Efficiency for DC/DC Applications
The IRHE4250D is the world’s first 25V
dual power MOSFET in 6 x 6mm PQFN with
exposed top for superior power density. This
addition to IR’s Power Block family uses its
latest 25V FastIRFET silicon technology for
best in class switching performance, and
the exposed top allows for maximum
thermal transfer.
The new IRFHE4250D FastIRFET dual power
MOSFET reduces power losses by more than 5%
at 25A compared to best in class conventional
power block devices. The new 25V device is
targeted at 12V input DC/DC synchronous buck
applications including advanced telecom and
netcom equipment, servers, graphic cards,
desktop, ultra book and notebook computers.
The IRFHE4250D features IR’s latest generation
silicon and expands the power block packaging
platform with a 6 x 6mm PQFN package with
exposed top and slim profile for backside
mounting that combined with excellent thermal
performance, low on-state resistance (RDS(ON) )
and gate charge (Qg ) delivers superior power
density and lower switching losses to shrink PCB
size and improve overall system efficiency.
As with all IR power block devices, the
IRFHE4250D works with any controller or driver
to offer design flexibility while delivering higher
current, efficiency and frequency capability.
The IRFHE4250D is qualified to industrial grade
and moisture sensitivity level 2 (MSL2), and
features an environmentally friendly and RoHS
compliant bill of materials.
FEATURES
•60A rated Power Block
•Low thermal resistance path to the top
•Control and synchronous MOSFETs in
one package
•Low thermal resistance path to the PCB
•Slim (<0.75mm) package height enables
backside mounting
•Low charge control MOSFET (13nC typical)
•Low RDS(ON) synchronous MOSFET (<1.35mΩ)
•Intrinsic Schottky diode with low forward
voltage on Q2
•RoHS compliant, halogen-free
16
ADVANTAGES
APPLICATIONS
•DC/DC modules (VIN = 12V nominal)
-Non-isolated
•Enterprise telecom/netcom (VIN = 12V)
-Routers
- Network bridges (switches)
- Base stations
•Servers (VIN = 12V)
- 5V and 0.3V rails
•Graphic Cards (VIN = 12V)
- Mid- to high-end
•Desktops (VIN = 12V)
-Workstations
•Ultrabooks and notebooks (narrow VDC only)
- Mid- to high-end
•IR’s FastIRFET family offers benchmark
performance with best in class R*Q figure of
merit. The device is ideal for high frequency
switching applications requiring peak
efficiency for both light and full loads.
•The IRFHE4250D offers an exposed top feature
resulting in up to 5% lower losses at 25A vs
best in class power block.
•The advanced 25V FastIRFET MOSFETs offer
industry leading power density for discrete
high performance synchronous buck DC/DC
switching applications.
To buy products or download data, go to
www.FutureElectronics.com/FTM
Specifications
Part Number
Package
Current Rating
IRFHE4250D
PQFN
6 x 6mm
60A
Typ./Max
R DS(ON) 4.5V
Qg typ @ 4.5V
(nC)
Qgd typ @ 4.5V
(nC)
Cntr 3.2/4.1
13
5
Sync 1.35/1.0
35
13
1.800.675.1619 • www.FutureElectronics.com
COMPONENT FOCUS
Rugged, Efficient, Economical DC/DC Converters
Satisfy a Broad Range of Applications
CUI’s 1W, 2W and 3W isolated DC/DC
converters are ideal for converting and
isolating voltage rails, and are housed in
space efficient packages allowing use
close to the point of load.
In total, over 90 different variants are available,
offering a choice of regulated and unregulated
outputs at standard voltages from 3.3V to 48V.
These DC/DC converters are housed in SIP, DIP or
surface mount packages, and have industry
standard pin configurations. An ultra wide
operating temperature range from -40°C up
to +105°C and an encapsulated case make the
units ideal for applications that may experience
challenging operating conditions. The converters
have been designed to maximize efficiency under
light-load and no-load conditions, making them
well suited for portable and battery-powered
equipment.
APPLICATIONS
•Network equipment
•Industrial automation
•Smart-building systems
•Smart meters
•Lighting controllers
FEATURES
•Isolation voltage up to 1500V DC or
3000V DC
•Single-output and dual-output
versions available
•Short circuit protection with
automatic recovery
•Lightweight, UL94-V0 plastic case
ERTERS
V
-DC CON
1~3 W DC
hing else?
s
it to anyt lated dc-dc converter
your circu
superior
power iso
lation, and kages
Why trusts a new family of lowncy
, higher iso
SMT pac
cie
or
uce
CUI introd offer improved effi compact SIP, DIP
up to -40
to
d in
re range
version
designed formance. House rating temperatu
precise con telecom,
per
thermal
ra-wide ope family is ideal for
, medical,
ing an ult
e
and featur this power modul range of industrial
,
a
°C
hin
to +105
tection
DC rails wit l applications.
of
on
circuit pro
and isolati machine contro
ous short
∆ Continu
and
up to 8kV
security,
protection
tic
and no load
∆ Antista
light load
ciency at
∆ High effi
kages
SMT pac
package
SIP, DIP,
05°C
voltage
standard
to -40 ~+1
isolation
∆ Industry
range up
re
atu
regulation
(Vdc)
ng temper
∆ Operati
age
SIP4
output volt
ut ratio
Vdc
inp
1.5K
d
power
DIP8
Unregulate
series
(W)
1.5K Vdc
12, 15, 24
d
3.3, 5, 9,
SIP6
Unregulate
1:1
Vdc
24
1.5K
15,
W
12,
1
d
3.3, 5, 9,
Unregulate
PDS1-S
,
1:1
SMT8
24, ±5, ±12
1W
5, 12, 15,
Vdc
1-D
1.5K
PDS
1:1
d
±15, ±24
SIP7
Unregulate
1W
3K Vdc
PDM1-S
15, 24
d
late
5, 9, 12,
egu
Unr
,
1:1
SMT8
24, ±5, ±12
1W
5, 12, 15,
3K Vdc
PDS1-M
1:1
d
, ±24
late
±15
SIP8
Unregu
1W
1.5K Vdc
PEM1-S
15, 24
5, 9, 12,
SIP8
Regulated
1:1
±15
,
3K Vdc
±5, ±12
1W
ed
5, 12, 15,
SIP7
ulat
1-M
Reg
PES
2:1
1.5K Vdc
1W
d
5, 12, 15
S
Unregulate
PQMC1,
2:1
±12
SIP7
±5,
24,
1W
5, 12, 15,
S
3K Vdc
PRMC11:1
±24
d
±15,
Unregulate
2W
,
SIP8
24, ±5, ±12
PDM2-S
5, 12, 15,
Vdc
1.5K
1:1
±15, ±24
SMT16
Regulated
2W
±15
1.5K Vdc
±5, ±12,
PEM2-S
5, 12, 15,
DIP24
ulated
Reg
2:1
±15
1.5K Vdc
±5, ±12,
3W
5, 12, 15,
DIP24
S
Regulated
PQMC32:1
±15
,
Vdc
±12
3K
±5,
3W
5, 12, 15,
Regulated
PQM3-M
2:1
±15
±5, ±12,
3W
5, 12, 15,
3-D
PQB
2:1
3W
PVB3-D
FEATURES
Go to www.FutureElectronics.com/FTM to view the 1~3W DC/DC Converter
Chart, the etech alert, to buy products or to register to qualify for
FREE DC/DC samples!
www.cui.com
2013 CUI
1~3 W DC/DC CONVERTERS
CUI introduces their family of low power
isolated DC/DC converters designed to offer
improved efficiencey, higher isolation, and
superior thermal performance.
Industry standard SIP, DIP, SMT packages
■
Operating temperature range up to -40~+105°C
■
Continuous short circuit protection
■
Antistatic protection up to 8kV
■
High efficiency at light-load and no-load
■
s reserved.
Inc. All right
04/2013
COMPONENT FOCUS
Protect Your Reputation for Innovation with
High Quality ESD Devices
TE Connectivity´s (TE) Silicon ESD (SESD)
arrays can help provide protection and
improve reliability of electronics in applications including but not limited to consumer,
portable and mobile electronics. The multichannel SESD flow-through arrays have low
capacitance of 0.20pF with low insertion
loss, which help protect high speed data
signals. The SESD arrays provide robust
ESD protection with 20kV contact and air
discharge rating per the IEC61000-4-2
standard. The low capacitance SESD arrays
enable signal integrity for today’s highest
speed interfaces including USB 3.0/2.0,
HDMI, eSATA, DisplayPort and Thunderbolt.
TE offers four- and six-channel miniature arrays
which are up to 85% smaller than common
multi-channel arrays for space constrained
applications. TE’s ultra small packages have
lower parasitic impedance which reduces
insertion loss at high frequencies compared to
larger-packaged devices. All of TE’s SESD arrays
are in flow-through design packages which
allow for matched impedance PCB trace routing
essential for high speed signal integrity.
FEATURES
•Low capacitance; provides low insertion loss
for high speed data signals
•Provides ESD protection up to 22kV contact
and air discharge per IEC61000-4-2
•Industry’s smallest footprint and lowest profile
multi-channel ESD arrays help to optimize
board space
•Flow-through and single connection design
helps routing PCB matched impedance high
speed data lines
•Helps protect electronic circuits against
damage from Electrostatic Discharge (ESD),
lightning and cable discharge events
•Helps assist equipment to pass IEC61000-4-2,
level 4 testing
To buy products or download data, go to
www.FutureElectronics.com/FTM
TE Connectivity and TE connectivity (logo) are trademarks.
APPLICATIONS
•Consumer, mobile and portable electronics
•Tablet PC and external storage with high speed
•Ultra high speed data lines
•USB 3.0/2.0, HDMI 1.3/1.4, DisplayPort
interface, Thunderbolt interface (Light Peak),
V-by-One HS, and LVDS interface
•Applications requiring high ESD performance
in small DFN packages
Part Numbers:
SESD0402Q2UG-0020-090 (2-ch)
SESD0802Q4UG-0020-090 (4-ch)
SESD1004Q4UG-0020-090 (4-ch)
SESD1103Q6UG-0020-090 (6-ch)
SESD0402Q2UG-0030-088
SESD1004Q4UG-0030-088
World’s Smallest Low Noise Current Sensing Resistor
FEATURES
Their equivalent series inductance is so small
that the signal integrity is preserved without
adding extra noise. Susumu’s current sensors
are also known to be the best in market in heat
distribution and heat dissipation.
Reduced Noise
•Smallest for wattage
•Excellent heat dissipation
•Low ESL – low noise
•Excellent current-surge tolerance
•Offered in sizes: 0402-4320
•Resistance range 1mΩ to 100Ω
•Resistance tolerance as low as ±0.5%
•RoHS compliant
•Offered in two configurations – longer and
shorter side terminal
35
Temperature Increase
Per Watt (°C/W)
In high frequency electronics, unwanted
noise added by the components themselves
can become a significant issue. In order
to address this, Susumu offers longer
side terminal low resistance chip current
sensing resistors.
APPLICATIONS
•Any application that requires current sensing
raw resistance resistors such as protection and
control circuits
To buy products or download data, go to
www.FutureElectronics.com/FTM
Temperature Increase by Power (°C/W)
30
Long-side terminal:
Competitor’s
25
20
Short-side terminal:
RL1220S-R10-F
15
Long-side terminal:
PRL1220-R10-F
10
5
0
Picture 1 with shortside terminal
18
Picture 2 with long-side
terminal
1
2
3
4
Applied Power (W)
5
6
1.800.675.1619 • www.FutureElectronics.com
COMPONENT FOCUS
SL Power Solves Power Challenges for Test & Measurement and
Industrial Equipment with CINT1275 275W AC/DC Power Supply
operating within an ambient temperature range
of -40°C to +70°C with standard interface signals.
The CINT1275 power supply models are
highly efficient – up to 92% – and are ideal
for industrial and test equipment that need
high power in a compact design.
SL Power’s CINT1275 is a high density, single
output, open frame AC/DC industrial grade
power supply family that is ideal for a variety of
test and industrial equipment with space and
airflow constraints. Ideal for the power demands
of factory automation, robotic systems, chromatography and network analyzers, the CINT1275
fits nicely into a 1U chassis and provides 275W
with forced air and is 180W convection cooled.
The CINT1275 also features input and output
monitoring alarms, plus 12V/1A fan output and
5V stand-by voltage. All 5 models are CE marked
to low voltage directive and approved to the ITE
standards of EN60950, 2nd edition.
The energy efficient models are certified to the
stringent EMC requirements for applications
requiring Class B EMI and Class A, B, C and D
of the harmonic distortion part of the IEC61000
standard. In addition, these models have been
HALT tested for durability and have more than
400,000 hours of demonstrated Mean Time
Between Failure (MTBF). In addition, the
CINT1275 has UL, CSA, CE, CB, NEMKO and VDE
approval markings and features a 3-year warranty.
APPLICATIONS
•Oscilloscopes
•Signal generators
•Spectrum analyzers
•Robotics
•Automatic test equipment
•Process control
Available in 12Vdc to 56Vdc output models, the
CINT1275 power supply has a wide temperature
range – delivering full rated output power while
1.800.675.1619 • www.FutureElectronics.com
To buy products or download data, go to
www.FutureElectronics.com/FTM
FEATURES
•3” x 5” x 1.40” package
•Up to 275W of AC/DC power
•Efficiency 92% typical
•Designed for 1U applications
•Universal input 90Vac to 264Vac input range
•Stand-by and fan output voltages
•Forced current share
•Inhibit, power fail, output OK signals
•Approved to CSA/EN/IEC/UL60950-1,
2nd edition
•3-year warranty
•RoHS compliant
ANALOG CORNER
Analog Signal Chain
MCP45HV31/51: 5kΩ Digital Potentiometers
with 36V Operating Voltage
The MCP45HV31/51 are the industry’s first digipots to
offer a 5kΩ resistance with a specified operating voltage
of 36V. They provide 10V to 36V analog operation and
1.8V to 5.5V digital operation, for systems requiring
wide signal swings or high power supply voltages. The
MCP45HV31/51 digipots support both 7-bit and 8-bit
resistor configurations, and a high terminal/wiper
current, including the ability to sink/source up to 25mA
on all terminal pins for driving larger loads.
FEATURES
• 10V to 36V analog operation range
•5kΩ, 10kΩ, 50kΩ, and 100kΩ resistance options
• Terminal disconnect via shutdown pin (SHDN)
• Terminal control (TCON) register
• 2MHz typical bandwidth (-3dB) operation
•I2C serial interface
• 1μA serial interface inactive current
• TSSOP-14 and 5 x 5mm QFN packages
• -40°C to +125°C temperature range
• 5k MSRP: $0.99 - $1.09 US
Drivers
FAN3225T: Dual 4A, High Speed,
Low Side Gate Driver
The FAN3223-25 family of dual 4A gate drivers is designed
to drive N-channel enhancement-mode MOSFETs in
low side switching applications by providing high peak
current pulses during the short switching intervals.
The driver is available with either TTL or CMOS input
thresholds. Internal circuitry provides an under-voltage
lockout function by holding the output LOW until
the supply voltage is within the operating range.
In addition, the drivers feature matched internal
propagation delays between A and B channels for
applications requiring dual gate drives with critical
timing, such as synchronous rectifiers.
MLX83100: Automotive Full Bridge
MOSFET Pre-Driver
The MLX83100 has the capability to simultaneously
drive four 500nC-rated N-FETs at up to 28V operating
voltage with minimal self-heating. The device supports
45V automotive load dump conditions. An integrated
bootstrap function and charge pump allow for support
of supply voltages down to 4.5V, ensuring continuous
operation under automotive crank conditions. The device
thereby supports 100% pulse width modulated (PWM)
operation.
FEATURES
• Qualified to AEC Q-100
• 5A peak sink/source current at VDD = 12V
• 4.3A sink/2.8A source at VOUT = 6V
•MillerDrive™ technology
• Under 20ns propagation delay
• Double current capability by paralleling channels
• 4.5V to 18V operating range
• Choice of TTL or CMOS input thresholds
• Internal resistors turn driver off if no inputs
• 12ns/9ns typical rise/fall times with 2.2nF load
• 8-lead 3 x 3mm MLP or 8-lead SOIC package
FEATURES
• Optional charge pump for low supply voltage
operation
• Compatible with 3V and 5V microcontrollers
• 100% PWM operation
• Fault interrupt and feedback to microcontroller
• Over-temperature protection
• Alternative charge pump configuration
• Converts 4 (or 2) PWM inputs to drive 4 external
N-FETs
• Low offset, low drift, fast current sense amplifier
• Under- and over-voltage protection
•VDS & VGS external FET monitoring
Interface
XR22801: USB to Ethernet and UART Bridge
The XR22801 provides an upstream USB interface with
an integrated USB 2.0 PHY and device controller that is
compliant with USB 2.0 Hi-Speed (480Mbps) and FullSpeed (12Mbps) transfer rates. Downstream there is an
Ethernet controller with integrated 10/100 Ethernet MAC
and PHY compliant to IEEE 802.3, an enhanced UART
with a fractional baud rate generator (supporting 300bps
to 15Mbps), a multi-master capable I2C controller, and an
Enhanced Dedicated GPIO Entity (EDGE) controller.
To buy products or download data, go to
www.FutureElectronics.com/FTM
20
FEATURES
• USB 2.0 compliant interface
• Enhanced UART
•I2C multi-master
• Single +5.0V power supply input
• ±15kV HBM ESD protection on USB data pins
• ±8kV HBM ESD protection on all other pins
• Single 25MHz crystal
• 10/100 Ethernet controller
• Half-duplex mode
•EDGE
• Regulated +3.3V output power
• 32- or 56-pin QFN packages
• 1k MSRP: $2.85 US
1.800.675.1619 • www.FutureElectronics.com
ANALOG CORNER
Power Regulation, Conversion and Management
ISL78268: 55V Buck Controller with
Integrated 3A Driver
The ISL78268 is a 55V synchronous buck controller with
3A integrated high side and low side drivers. The most
versatile high voltage buck solution available, the
ISL78268 buck controller provides very high step-down
efficiency for a wide variety of load currents from under
5A to over 25A, enabling it to support virtually every
12V, 24V, or 48V high current buck requirement for
automotive and industrial applications.
MIC94161/62/63/64/65: Miniature High
Side Load Switches with Reverse Blocking
The MIC94161/62/63/64/65 is a family of high side load
switches with low on-resistance (14.5mΩ) capable of
delivering up to 3A of continuous current in a small
1 x 1.5mm wafer level chip-scale package. These small
devices feature true reverse current protection with a
wide input voltage range of 1.7V to 5.5V. Other features
of these devices include an active pull-down circuit
(MIC94162/MIC94164) that discharges the output
capacitors when the device is turned off, internal soft
start function (MIC94161/MIC94164/MIC94165) that
reduces in-rush input current and input over-voltage
protection (MIC94161)
NCP1129/26/24: High Voltage Switching
Regulator for Offline SMPS
The NCP1129, NCP1126 and NCP1124 can deliver up to
25W, 15W and 12W respectively and each generate a
jittered 65kHz or 100kHz switching frequency, resulting
in marked improvements in electromagnetic interference
(EMI) performance. They integrate a fixed frequency
peak current mode controller with a low on-resistance
high voltage, 650V MOSFET. The NCP112x devices all
have a wide array of protective features including a
50ms timer-based auto-recovery short circuit protection
function. Furthermore, short circuit fault conditions can
be independently detected from the auxiliary winding
voltage.
FEATURES
• Supports 5A to 25A loads
• Two-phase, current sharing configuration for loads
up to 50A
• Provides average current limiting
• Selectable diode emulation and burst mode for
light loads
• 3µA shutdown current
• AEC-Q100 qualified
• Cycle-by-cycle peak current limiting
• 55V input tolerance (60V abs max)
• Adaptive dead time control
• Adjustable switching frequency from 50kHz to 1.1MHz
• 24-lead 4 x 4mm QFN package
• 1k MSRP: $2.45 US
FEATURES
•14.5mΩ R DS(ON)
• 3A continuous operating current
• Internal level shift for CMOS/TTL control logic
• Micropower shutdown current
• Load discharge circuit: MIC94162/4
• Ultra-fast turn-off time
• 1.7V to 5.5V input voltage range
• Reverse current flow blocking (no “body diode”)
• Ultra-low quiescent current
• Soft start: MIC94161/4/5 (2.7ms)
• -40°C to +125°C junction temperature
• 1k MSRP: starting at $0.29 US
FEATURES
• 650V avalanche rated MOSFET
• Frequency foldback down to 26kHz and skip cycle in
light load conditions
• 50ms timer-based auto-recovery short circuit protection
• Option for auto-recovery or latched short circuit
protection
• Less than 100mW stand-by power at high line
• Fixed frequency 65kHz or 100kHz current mode
control operation
• Adjustable current limit with external resistor
• Frequency jittering in normal and frequency foldback
modes
• Pb-free PDIP-7 packages
• 10k MSRP: starting at $0.32 US
Sensors
AH1902: High Sensitivity Micro-Power
Omnipolar Hall Effect Switch
®
The AH1902 is a low voltage high performance micropower omnipolar hall effect switch designed and
optimized to operate over the supply range of 1.6V to
3.6V and consumes an average current of 4.3uA typical
at 1.8V. The single output is activated with either a north
or south pole of sufficient magnetic field strength. When
the magnetic flux density (B) perpendicular to the package is larger than operate point (Bop), the output will
be turned on (pulled low) and held until B is lower than
release point (Brp). The output will remain off when
there is no magnetic field.
1.800.675.1619 • www.FutureElectronics.com
FEATURES
• Omnipolar operation (north or south pole)
• Chopper stabilized design
• Minimal switch point drift
• No external pull-up resistors required
• 8kV ESD capability (human body model)
• 1.6V to 3.6V supply voltage
• Superior temperature stability
• Enhanced immunity to physical stress
• -40°C to +85°C operating temperature
• Low profile X1-DFN1216-4, X2-DFN2015-6 and
SOT553 packages
21
TECHNICAL VIEW
Systems-on-Module: Suitable for
First Time Embedded Computing Designs?
By: Patrice Brossard, Technical Solutions Manager, Future Electronics
contrast, is highly standardized, and CoM boards’
As consumers, we have become accustomed
because it gives the user an easy way to
form factors are defined by standards bodies
to the permanent availability of internet
support advanced applications and connectivity
(see Figure 1).
access on touchscreen devices we can easily
without needing knowledge of the way to
carry in a pocket or a bag. This is leading
design a processor board.
to dramatic changes in users’ expectations
In Other Words, the Design Team
of many kinds of previously standalone and
Benefits from:
single-function products.
•A shorter development time
These new expectations are not only having an
•The flexibility to choose exactly the
impact on personal consumer devices. Intel, for
peripherals, storage and interfaces required
instance, has demonstrated a concept for an
for the application
in-store advertising panel; its futuristic design is a
At the same time, a module is cheaper than a
huge 2 x 1m touchscreen with a camera that can
complete embedded computer, and the designer
‘recognize’ shoppers and serve up appropriate
avoids paying for features or peripherals that the
advertising messages. The touchscreen lets the
end product does not need.
shopper click on items of interest, go online to
find out more information or reserve the item for
SoM Choices
collection at a checkout desk.
Figure 1: form factors of the most common embedded CoM
An SoM incorporates the circuitry essential to all
and SBC standards
This is a challenge for the panel’s manufacturer;
embedded applications. It provides a microprocesconventional advertising panels are, in essence,
Of the standards shown in Figure 1, the most comsor that interfaces with RAM and flash memory,
no more than a light box or a large display screen.
monly used in embedded designs are the following:
a power-management system, and Ethernet, USB
•Q7
But the trend is for this kind of ‘dumb’ product
and other interfaces. The module manufacturer
to become an application-specific computer; this
•COM Express (also known as ETX Express)
handles all the difficulties of processor implemenmassively increases the complexity of the design.
tation: board layout for a fine-pitch BGA device,
•PC/104 (ISA)
high speed routing, design verification, EMC
•PC/104+ (PCI)
So what is the best way to streamline the archiconformance, and the significant effort involved in •PC/104e (PCIe)
tecture and avoid the difficulties of introducing a
board bring-up and Board Support Package (BSP)
•ITX (Pico-ITX)
complex processor into a previously simple end
development.
product design?
The standard specification generally defines not
Today the Market Offers
only the size of the board, but also the connector
Flexible Off-the-Shelf Options
Two Main Types of SoM:
types used. The location of the connectors
Perhaps the most obvious choice is to use one of
•Fully modular solutions are designed to sit
might also be specified, or decided by the board
the hundreds of embedded or industrial computon a carrier card. Standard carrier cards are
manufacturer.
ers offered by manufacturers such as Advantech
available from SoM manufacturers. In some
or Technexion. This provides a complete hardware
The issue for the embedded system designer is to
circumstances, the carrier card may be customplatform including not only the processor and main
choose the level of integration that best fits the
ized, and this gives the designer complete
memory, but also storage, board-to-board interapplication. As ever in electronics, the trend is
flexibility to design a board with the exact
faces, networking capability, supervisory functions
towards more and more integration; some of the
mix of storage, peripherals, interfaces and
and an AC/DC power supply.
most innovative designs are appearing in boards
connectors required, and allows for the use of
a general-purpose SoM.
that have a very small form factor.
Although there is a very wide choice of these
•Integrated
solutions
do
not
require
a
carrier
off-the-shelf products, the problem with them is
Advantech, for example, offers PC/104 (96 x
board and provide a fixed set of connections
precisely that they provide a complete platform
90mm) computer modules. In any two applications,
and interfaces, of which the most commonly
with a huge range of built-in functions; this
the module could offer two widely differing ranges
found are SPI, I2C, UART, CAN, PCI, PCIe, SATA,
means that they are relatively expensive, and
and MMC/SD/SDIO. This type of system is better of functions in exactly the same form factor.
also inflexible. In an embedded computer, the
Several modules for embedded computing designs
described as a single-board computer (SBC)
specification of everything, down to the peripherals
are based on the x86 architecture, with up to 1GB
or Computer-on-Module (CoM). Many CoMs
and interfaces, is chosen by the computer
of DDR3 memory, dual 10/100/1000 Ethernet
also provide on-board audio functions, display
manufacturer, not by the customer.
interfaces, an audio codec, a mini-PCIe expansion
controllers and camera interfaces.
slot, and SATA and dual-display capability.
For some users, then, a System-on-Module (SoM)
It follows that a true SoM on a custom carrier
might be a better choice. An SoM is an electronic
board can be sized to fit the application’s mountmodule that provides the basic components of
ing requirements precisely. The CoM market, by
an embedded computer. And it is popular
22
1.800.675.1619 • www.FutureElectronics.com
TECHNICAL VIEW
available in a module qualified for industrial use,
and in a smaller outline (60 x 82mm) than the
PC/104 form factor.
Application Development Resources
Figure 2: the latest Advantech PC/104 board. This standard
form factor is still very popular
Another popular form factor is the COM Express®
(or ETXexpress) format. One of the latest modules
available from Advantech is shown in Figure 2.
COM Express is the first independent module
standard to support very high-speed interface
technologies such as USB 3.0. Embedded applications, however, normally favor the use of more
mature interfaces such as PCIe and SATA.
Figure 3: high-end COM Express module from Advantech
Another proven SoM supplier, Technexion, offers
the designer a choice between ARM-based and
x86-based modules. Usefully, the two families of
boards are pin-compatible with each other.
They are produced in the new ‘EDM Compact’
form factor. The aim of the developers of this
new open standard is to provide reliable and
interoperable hardware, so that users can simply
swap modules in and out of a design - a ‘modular
computing’ approach.
EDM Compact is very similar to the Q7 standard,
making use of a common connector which carries
all signals (such as Gigabit Ethernet, SPI and
HDMI). This board, shown in Figure 3 offers up
to 2GB of main memory, a 10/100/1000 Ethernet
interface, USB 2.0, CAN, PCIe, SATA, an audio
codec and strong video capabilities. All of this is
One of the biggest advantages to system
developers using an SoM is the speed
with which they can progress to application development. Most SoMs incorporate a BSP based on
Workbench. Workbench, an integrated
development environment, provides a graphical
and highly automated environment that makes
it easy even for inexperienced developers to
create applications on a choice of operating
systems, including VxWorks, Linux, Android,
Windows Embedded and Integrity (from Green
Hills Software).
Users should also expect the SoM manufacturer
to provide a complete set of drivers for devices
on the board. Device driver development requires
a high level of expertise, and would distract
attention and resources from application development if the SoM user attempted to undertake it.
The SoM supplier should take care of drivers in the
following categories:
•Protocols and communication (such as TCP/
IP, 10/100/1000 Ethernet, Profibus, PCI, PCIe,
PCMCIA)
•Wireless (Wi-Fi, SDIO, Bluetooth, ZigBee,
GPS, RFID, IrDA, Wireless USB, GSM/GPRS)
•Peripherals (LCD, touch sensing, SPI, I2C,
real-time clock, DMA)
•Storage (SATA/PATA, non-volatile memory, SD/
MMC/Compact Flash, smart card)
•Multimedia (MP4/H264 codec, camera, audio)
SoMs in Use
Thanks to the use of a SoM, Intel’s vision of smart
display panels has already been realized in part.
Future Electronics recently supported a European
manufacturer of LED public information panels
(for use for instance in airports and train and
bus stations) which has added connectivity and
user-interface functions to a previously simple
panel design.
Its successful design used an SoM carrying an
ARM based processor. The module was connected
to the internet via a GSM mobile phone network;
wireless connectivity was implemented with a
Sierra Wireless module mounted alongside the
SoM.
Since the BSP and device drivers were provided by
the SoM manufacturer, the designers were able
to start developing their application early in the
project. And by using an SoM, they were able to
introduce a completely new hardware architecture
based on an embedded computer, without having
to handle the power, thermal, board-layout and
compliance issues involved in implementing a
complex processor design.
Other Telling Examples in Which an SoM
Has Been Used Successfully Include:
•Adding a sophisticated human-machine
interface to a vending machine – this calls for
a computer module which is easy to use, and
offers high computing performance and high
reliability.
•Public information panels containing a full-HD
LCD screen. This application requires video
capability with an HDMI interface.
Enhancing Value of End Product
The examples above show, there is an opportunity for manufacturers of standalone products to
create a new, premium product without a total
reconfiguration of the design operation. Modern
processors are enormously capable devices, but
the use of an SoM insulates design teams from the
difficulties involved in realizing a processor design.
The latest SoMs from suppliers such as
Technexion, Advantech and iWave provide a
way to radically rethink end product designs,
without a huge investment in new design staff
or new expertise.
To buy products or download data, go to
www.FutureElectronics.com/FTM
This manufacturer found that an architecture
based on the use of an industrial PC was
expensive and incompatible with the environmental constraints of the application.
1.800.675.1619 • www.FutureElectronics.com
23
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