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High Performance Multilayer
Printed Circuit Boards
Look to 3M for more complete solutions to your PCB
fabrication needs. We offer physical design, modeling,
advanced materials options, signal integrity analysis,
electrical testing, field reliability simulation and analysis,
and after-sales support.
3M’s proven fabrication techniques in the
miniaturization of high density circuitry enable dense
BGA footprints for printed circuit boards and multichip
modules used in defense/aerospace, instrumentation and
test, medical, homeland security and RF applications.
The high performance materials have:
• Thin (0.032mm) composite dielectrics with low Z-axis
CTE for superior reliability
• Low Dk (3.2) and loss (0.002@9.3 Ghz) for superior
electrical performance
• High Tg (>220° C)
Design Summary
0.100 mm pitch trace/space
0.050 mm pitch signals available for custom designs
Constructions up to 25 layers
Dielectric Materials
G410™ Prepreg
Speedboard® C Prepreg
Pyralux™
Low Tg FR4
High TG FR4
Circuit Materials
3M™ Embedded Capacitor Material
Copper foil
Copper-Invar-Copper foil
Ohmega-ply®
Surface Finishes
Organic Surface Protectant (OSP)
Electroless Nickel Immersion Gold (ENIG)
Wirebond: Soft AU; Sn/Pb; Electrolytic Ni/Hard Au
Panel sizes up to 14 in. x 14 in. with an active area of 12 in. x 12 in.
16 in. x 16 in. available for small volumes
Covercoat Materials
Mechanically drilled vias down to 0.150 mm
PSR 4000™ AUS5
Blind, buried blind, through, and buried through laser vias
Blind laser vias (min. diameter 0.050 mm)
Up to 4 layers of blind laser vias per side
Through laser via min. diameter 0.040 mm
R/flex® 8080 LP1
Embedded capacitance of 5nF/in2/layer
Embedded resistors from 25 Ohm to 3.2k Ohm in production
Product Feature Properties
Standard
Metric (mm)
Advanced Custom
Standard
English (mils)
Advanced Custom
Cu Thickness Min.
0.005
0.005
0.003
1/7 oz.
1/7 oz.
1/12 oz.
Cu Thickness Max.
0.035
0.035
0.140
1 oz.
1 oz.
4 oz.
Internal Lines Min - 1/3oz Cu
0.062
0.050
0.020
2.4
2.0
0.8
Internal Spaces Min - 1/3oz Cu
0.062
0.050
0.030
2.4
2.0
1.2
External Lines Min - 1/3oz Cu
0.062
0.050
0.020
2.4
2.0
0.8
External Spaces Min - 1/3oz Cu
0.062
0.050
0.040
2.4
2.0
1.6
Minimum Pitch for Full BGA
0.800
0.500
0.400
31.5
19.7
15.7
Minimum SMT Pitch
0.300
0.225
0.100
11.8
8.9
3.9
Pad Over Drill Size (Laser)
0.050
0.040
0.030
2.0
1.6
1.2
Pad Over Drill Size (Drill)
0.200
0.125
0.125
7.9
4.9
4.9
Soldermask Registration (+/-)
0.065
0.050
0.020
2.6
2.0
0.8
Soldermask Min. Web
0.100
0.075
0.050
3.9
3.0
2.0
Soldermask Min. Clearance
0.100
0.075
0.025
3.9
3.0
1.0
Soldermask Feature Size (+/-)
0.020
0.010
0.005
0.8
0.4
0.2
Flip Chip on Board Pitch Min.
0.200
Flip Chip on Board Pad Size Min.
0.090
Routed Feature Edge (+/-)
Drilled Via Properties
0.127
0.100
0.010
Metric (mm)
Standard
Advanced
Custom
7.9
3.5
5.0
3.9
0.4
English (mils)
Standard Advanced
Custom
Via Aspect Ratio
10:1
15:1
20:1
10:1
15:1
20:1
Buried Through Via Diameter Min.
0.200
0.150
0.150
7.9
5.9
5.9
Through Via Diameter Min.
0.200
0.150
0.150
7.9
5.9
5.9
Laser Microvia Properties
Standard
Metric (mm)
Advanced
Custom
Standard
English (mils)
Advanced
Custom
Multidepth Microvias
Yes
Yes
Yes
Yes
Yes
Buried Microvias
Yes
Yes
Yes
Yes
Yes
Yes
Blind Microvia Aspect Ratio
1.3:1
1.3:1
1.3:1
1.3:1
1.3:1
1.3:1
Blind Minimum
0.050
0.050
0.050
2.0
2.0
2.0
Buried Blind Minimum
0.050
0.050
0.050
2.0
2.0
2.0
4
4
4+
4
4
4+
10:1
15:1
20:1
10:1
15:1
20:1
Max. Layers of Blind Vias/Side
Through Via Aspect Ratio
Max.Contact Layers at Max AR
Yes
8
4
2
8
4
2
Through Via Min. Diameter
0.060
0.050
0.040
2.4
2.0
1.6
Buried Through Min. Diameter
0.060
0.050
0.040
2.4
2.0
1.6
17
17
25
17
17
25
Through Via Max. Layers
Pyralux is a registered trademark of DuPont.
G410 and Speedboard are registered trademarks of W.L. Gore & Associates.
Ohmega-ply is a registered trademark of Ohmega Technologies, Inc.
PSR 4000 is a registered trademark of Taiyo.
R/flex is a registered trademark of Rogers Corporation.
3M is a registered trademark of 3M Company.
Important Notice
Before using this product, you must evaluate it and determine if it is suitable
for your intended application. You assume all risks and liability associated
with such use.
Warranty; Limited Remedy; Limited Liability.
3M’s product warranty is stated in its Product Literature available upon
request. 3M MAKES NO OTHER WARRANTIES INCLUDING, BUT NOT
LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR
FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within
the warranty period stated above, your exclusive remedy shall be, at 3M’s
option, to replace or repair the 3M product or refund the purchase price of the
3M product. Except where prohibited by law, 3M will not be liable for any
indirect, special, incidental or consequential loss or damage arising from
this 3M product, regardless of the legal theory asserted.
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3M Electronics
6801 River Place Blvd.
Austin, TX 78726-9000
800 676 8381
www.3M.com/electronics
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© 3M 2005 80-6201-3604-0