SEMICONDUCTOREQUIPMENT
http://www.asmpacific.com
ASM Semiconductor Equipment Products
Index
Materials
Handling
Model
3
AD9212 /
AD9210
IS9012TS
Materials
Handling
Process
Harrier Xtreme
4
AD8312
AD8312R
Wire
Bonding
Equipment
Eagle Xtreme
Gold Ball
WB
Epoxy DA
5
AD838R
Epoxy DA
AD908
Stud
Bumping
Equipment
AD211 / AD212
Hummingbird
Gold / Copper
Stud Bumping
AL501
Aluminium Wire
Wire
Bonding
AB559A Series
Fine
Equipment Aluminium Wire
AB530
Eutectic DA
7
Materials
Handling
AD220
SD890A
AD880
AD881 Series
Strip Form
Substrate
Soft Solder DA
8
AD100
6” Wafer
Handling
12” Wafer
Handling
Ultrasonic Wedge
Wire Bond
15
AD830U
AD830UR
Die
Attach
Equipment
13
14
Eagle60AP-LD
Heavy
6
AD830 / AD830R
8” Wafer
Handling
iHawk-V
Thermosonic
Gold Ball Wire Bond
iHawk-02
AD838
AD838P
iHawk Xtreme
Eagle Xtreme X2L
IS8912DA
AD838L
12
TwinEagle Xtreme
Flip Chip
IS9012LA
LinDA
Process
ASM GoCu
IS9012TC
12” Wafer
Handling
Model
Curing
Oven
Epoxy DA
Strip / Reel
Form
Substrate
Model
SR902 / SR902L
COE139 /
COE139R
PC139 /
PC139R2R
Process
Reflow Oven
Snap Curing Oven
AD819-PD
AD819-LD
Eutectic DA
MCM12
Multi-Chip DA
COG900 /
COG930
FOG900 /
FOG930
Misc.
IS898GA
IRGA868
IS868LA2
IS600
Materials
Handling
AOI, Map
Sorting /
Die Sorting
Equipment
1
4” Wafer
Handling
6” Wafer
Handling
Model
Materials
Handling
ACF D/A
Glass Attach
10
Process
ES100
Advanced Optical
Inspection (AOI)
MS100 Plus
Map Sorting
AS899
Die Sorting
Molding
Equipment
11
Model
Strip Form
Substrate
IDEALmold™
80/120/170t
Reel Form
Substrate
IDEALmold™
R2R
Strip Form
Substrate
OSPREY
Strip Form
Substrate
Lens Holder Attach
Solder Paste DA /
Clip Attach
eClip
9
12” Wafer
Materials
Handling
Strip / Reel
16
Transfer Molding
IDEALab™
17
IDEALcompress™
WLP300
Compression Molding
IDEALab™-WLP
Model
Dispensing/ Form Substrate DS500 Series
Jetting
Strip Form
System
DS520 / M
Substrate
Process
Process
Glob-top, Dam & Fill
Jetting
18
ASM Semiconductor Equipment Products
Index
Materials
Handling
DPAK,
D²PAK,
TO220, QFN,
DFN, SOP,
Trim/Form/ TQFP, TSOP,
Singulation TSSOP & etc.
System
Model
18
MP209
MP-TAB
Discrete Package
SD Card
MP-SDS
SD Card Singulation
All kinds of
Laser Mark
IC and
Handling Power Device
Matrix
Equipment
Leadframes
Materials
Handling
Model
Process
LS1000
Model
FT2030
SC59, SC70,
SOT23,
SOD923,
SOT113,
SOT223, etc.
FT2018
TO220, TO3P,
TO264,
DPAK, etc.
FT-Power
Laser Mark Handler
Process
21
BP2000
Ball Placement
BCC,
CSBGA,
MLP, QFN,
SiP & etc.
CS900
High Speed Tape
Sorting
Measuring
Electrical /
Optical
Characteristics
for Die /
Package
Model
TLB203
SLS230 / S
LED (SMD) SMD type
Sorting & Chip LED,
Top LED &
Taping
System Sideview LED
Process
SLS230T Plus
Process
LED Tester
SMD LED Testing and
Sorting
SLT400
SMD LED Taping
IP360 Series
High Power LED
Testing & Sorting
22
Turret Based Test
Handler
20
FV2030
Complete Quality
Inspection Handler
M-CAN,
S-CAN, SOP,
TSOP,
TSSOP & etc.
FET-CLUSTER
Singulation and
Finishing Integrated
System
M-BGA, QFN,
SOIC, QFP,
TSOP, etc.
FT1000
Carrier Based Test
FT1000-HD
Hot Test
SO, TSOP,
QFN, MLF,
BCC, BGA,
CSP, etc.
Testing
System
Model
CSBGA /
PBGA,
flex BGA
& etc.
Materials
Handling
19
TSSOP,
QFN / MLP,
MBGA, etc.
SC59, SC70,
SOT23,
SOT89,
SOT113,
SOT223,
Test and
SOIC,
TSSOP,
Finish
QFN/MLP,
Handling
MBGA,
Equipment
DPAK,
TO220,
TO3P,
TO264,
SIP9, etc.
Ball
Placement
and CSP
Handling
Equipment
Mechanical Press
Trim / Form
SOT, SOD,
QFN, DFN
& etc.
Materials
Handling
Materials
Handling
Process
2
12” Flip Chip Bonding Equipment
Dual Head Flip Chip Bonder
Thermosonic Flip Chip Bonder
AD9212 / AD9210
(for Image Sensor Application)
Applications: Flip chip bonding on SBGA, BGA, ceramic panels,
singulated units on carrier, lead frames, etc.
 High productivity with individual dual flip chip bonding systems
 Extra wide substrate handling
 Precise placement with latest linear motorizing systems
 Up to 12” wafer handling capability
 Supporting flux dipping flip chip process
 SMEMA standard compatible
 Convertible flip chip and direct die bonding processes (option)
 AD9210
• Up to 210 mm track width handling capability
• Tape feeder handling capability (option)
IS9012TS
Applications: Thermosonic flip chip bonding on SBGA, BGA, ceramic
panels, singulated units on carrier, lead frames, etc.
 High precision thermosonic flip chip bonding process
 Excellent foreign material control for image sensor application
• HEPA fan filter unit providing clean air flow
• Blow & suck cleaning for housing wafer
• And more……
 Large range of die sizes handling
 Intelligent self-compensated bond force control
 Patented transducer design
 Consistent and independent heating controls
 Workholder with rigid clamping system to hold substrate during
bonding
Thermocompression Flip Chip Bonder
12” Flip Chip Bonder
(for Image Sensor Application)
(for Image Sensor Application)
IS9012TC
IS9012LA
Applications: Thermocompression flip chip bonding on e.g. CLCC,
PLCC, BGA, PCB, singulated units on carrier, etc.
 Excellent thermocompression (TC) bonding performance
 Excellent foreign material control for image sensor application
• HEPA fan filter unit providing clean air flow
• Blow & suck cleaning for housing wafer
• And more……
 Flexible indexing system for substrate or boat carrier design
 Real time dispensing pattern inspection and position alignment
 Up to 12” wafer handling capability
 Supporting both flip chip and direct die attach processes (option)
3
*Remark: All performance is package dependent
Applications: Image sensor flip chip bonding on e.g. CLCC, PLCC,
BGA, PCB, singulated units on carrier, etc.
 Excellent foreign material control for image sensor application
•
•
•
•
HEPA fan filter unit providing clean air flow
Blow & suck cleaning for housing substrate
Workholder with clean cell feature
And more……
 Flexible indexing system for substrate or boat carrier design
 Real time epoxy pattern inspection and position alignment
 Up to 12” wafer handling capability
 Supporting both flip chip and direct die attach processes
12” FLIP CHIP / DIE ATTACH
BONDING EQUIPMENT
12” Die Attach Equipment
US PATENTED
US PATENTED
12” Automatic High Speed Die Bonder
12” Automatic Die Bonder
AD8312
(for Stacked Dice Application)
Applications: Mini-BGA, flex BGA, CSPBGA, MLP/QFN, QFP,
TQFP, PLCC, TSSOP, TSOP, SOIC, MEMS, PDIP, etc.
 World’s first 12” dual dispensing die bonding series
 Implementing patented double decoupling bond head system
 Universal workholder design for various packages
 Real time epoxy pattern inspection and position alignment
 In-line capability with curing oven or machine cascade
LinDA
Applications: Stacked dice application on Mini-BGA, flex BGA,
CSPBGA, QFN, QFP, TQFP, PLCC, TSSOP, TSOP, etc.
 World’s first 12” dual dispensing die bonding series
 Design for all-round stacked dice and thin die bonding process
• Panel bonding capability
• Excellent substrate warpage control
• Remarkable thin die handling capability with various patented designs
(option)
 Individual pick and bond system
 High precision bonding with high resolution vision system
US PATENTED
12” Automatic Die Bonder
12” Automatic Die Bonder
(Reel Form Materials Handling)
(for Image Sensor Application)
AD8312R
IS8912DA
Applications: Reel form materials handling e.g. smartcard
substrates, metal lead frames or flex substrates, etc.
 World’s first 12” dual dispensing die bonding series
 Implementing patented double decoupling bond head system
 Real time epoxy pattern inspection and position alignment
 Strategic module designs suitable for handling backside plated
substrates
 In-line capability with other equipment, e.g.
• Curing oven – PC139R2R
• Buffer station
• And more......
*Remark: All performance is package dependent
Applications: Image sensor die bonding on e.g. CLCC, PLCC, BGA,
PCB, singulated units, etc.
 Excellent foreign material control for image sensor application
•
•
•
•
HEPA fan filter unit providing clean air flow
Blow & suck cleaning for housing substrate and wafer
Workholder with clean cell feature
And more……
 Flexible indexing system for substrate or boat carrier
 Real time epoxy pattern inspection and position alignment
 Up to 12” robotic wafer handling capability
4
8” Die Attach Equipment
US PATENTED
US PATENTED
Automatic High Speed Epoxy Die Bonder
Automatic High Speed Epoxy Die Bonder
AD838
(Reel Form Materials Handling)
Applications: High density lead frames, e.g. QFN, TQFP, PLCC,
TSSOP, TSOP, SOIC, SOT, etc.
 High speed performance
• Implementing patented bond head design
• Supporting dual dispensing system
 Excellent accuracy with full range of inspection algorithms
 Extra large bonding area: up to 4” width substrate handling
capability
 Graphical user interface with multi-language support
 Providing graphical SPC data with latest IQC system
AD838R
Applications: Reel form materials handling, e.g. metal lead frames
or flex substrates, top LED, etc.
 High speed performance
• Implementing patented bond head design
• Supporting dual dispensing system
 Extra large bonding area: up to 4” width substrate handling
capability
 Automatic input reel system
 Graphical user interface with multi-language support
 In-line capability (option) with
• Lead frame cutting system – LFC130 or
• Curing oven – COE139R / PC139R2R
US PATENTED
Automatic High Speed Epoxy Die Bonder
Automatic High Precision Epoxy Die Bonder
AD838L
AD838P
Applications: Direct substrate indexing, e.g. ceramic substrates for
high power LED, etc.
 Strategic direct indexing algorithm suitable for direct ceramic
indexing or other materials handling
 Implementing excellent precision with
• Various inspection systems during bonding process
• Patented bond head design
 Extra large bonding area: up to 4” width substrate handling
capability
 Excellent substrate warpage control
 Implementing latest global substrate alignment
5
US PATENTED
*Remark: All performance is package dependent
Applications: High precision bonding performance on, e.g. QFN,
TQFP, PLCC, TSOP, SOIC, SOT, etc.
 Excellent accuracy with full range of inspection algorithms
 Extra large bonding area: up to 3” width substrate handling
capability
 Graphical user interface with multi-language support
 Providing graphical SPC data with latest IQC system
8” Die Attach Equipment
8” DIE ATTACH
EQUIPMENT
PATENT PENDING
US PATENTED
Automatic High Speed Die Bonder
Automatic High Precision Epoxy Die Bonder
AD830 / AD830R
AD908
Applications: High density substrates, e.g. chip LED, top LED,
side view LED, SOIC, SOD, etc.
 High speed performance
• Implementing patented bond head design
• Supporting dual dispensing system
 Widely implementing linear motor systems
 Graphical user interface with multi-language support
 AD830R for reel form materials handling
 Up to 8” wafer handling capability (option)
Applications: Large aspect ratio die handling, suitable for linear
scanner application, etc.
 High precision placement with special PR alignment
 Implementing patent pending bond head design
 Extra long dispensing area for large aspect ratio die handling
 Supporting epoxy writing and dotting capability
 Excellent substrate warpage control with moving bond workholder
table design
US PATENTED
US PATENTED
Automatic High Speed Eutectic Die Bonder
Automatic High Speed Eutectic Die Bonder
AD830U
AD830UR
Applications: High density substrates, e.g. SOIC, SOT, SOD, SOJ,
high power LED, etc.
 High throughput by
• Implementing patented bond head design
Applications: Reel form materials handling, e.g. metal lead frames,
top LED, etc. for eutectic die attach process
 High throughput by
• Implementing patented bond head design
 Providing excellent oxidation control with forming gas supply
 Providing excellent oxidation control with forming gas supply
 Graphical user interface with multi-language support
 Graphical user interface with multi-language support
 Supporting flux eutectic or epoxy die attach process by equipping
 Supporting flux eutectic or epoxy die attach process by equipping
with dispensing or stamping system (option)
 In-line capability with gold ball wire bonding system
– iHawk Xtreme series (option)
 In-line capability with gold ball wire bonding system
*Remark: All performance is package dependent
with dispensing or stamping system (option)
– iHawk Xtreme series (option)
6
8” Die Attach Equipment
US PATENTED
US PATENTED
Automatic Eutectic Die Bonder
Automatic Eutectic Die Bonder
AD211 / AD212
AD220
Applications: Panel form of high power LED packages, e.g.
ceramic/wafer submount for direct eutectic process
 Implementing patented technologies
• Double decoupling bond head system
• Heated collet die attach process
 Extra large bonding area:
• AD211: up to 4” x 4” bonding area
• AD212: up to 8” x 8” bonding area
 Providing excellent oxygen level control
 Excellent void control with proven heat tunnel design and mature
process know-how
 Anti-thermal shock by equipping with pre-heat and post-heat stations
 Automatic materials handling
Automatic Soft Solder Die Bonder
SD890A
Applications: High power devices, discrete units, e.g. TO-220,
SOT, DPAK, DPAK matrix, PowerSO, etc.
 Implementing flexibility with
• Matrix lead frame handling with XY shuttling bond head system
• AB dice handling with rotary collet bond arm design
• Up to 8 independently controlled heating zones suitable for various
temperature profile requirements
 Precision solder volume and pattern control with
• Precise solder wire feeding and spanking system
 Providing excellent oxygen level control with forming gas supply
 Patented solder writing technology for excellent solder control
(option)
7
*Remark: All performance is package dependent
Applications: Strip form of high power LED lead frames for direct
eutectic die attach process
 Implementing patented technologies
• Double decoupling bond head system
• Heated collet die attach process
 Providing excellent oxygen level control
 Excellent void control with proven heat tunnel design and mature
process know-how
 Automatic die theta alignment with precision stage
 Automatic lead frame input and output handling capability
6” Die Attach Equipment
8” / 6” DIE ATTACH
EQUIPMENT
PATENT PENDING
High Speed Epoxy Die Bonder
Automatic Die Bonder
(for Vertical LED Application)
AD880
AD100
Applications: Vertical LED, photo transistors, infrared diodes, etc.
 World’s fastest epoxy die bonding system with patent pending
technologies – dual shuttling system
 Pro-longing MTBA with new inputting / outputting systems
• Inputting system: dual stack loading inputting system / multi-magazine
inputting elevator system
• Outputting system: multi-magazine outputting elevator system
 Precise epoxy stamping capability with pre-bond inspection
Applications: Suitable for large area epoxy die bonding process
 Extra large bonding area: 8” x 8” substrate handling
 Providing high speed die attach with DDR bond head system
 Implementing excellent flexibility – capability of handling various
substrates with corresponding carrier design
 6 mil small die handling capability
 Graphical user friendly interface with MS Windows® based
operating system
 Getting advantages between quality control and bonding speed
with latest post-bond inspection system
Automatic Die Bonder
Automatic High Precision Epoxy Die Bonder
AD881 Series
(for Photo Diode Application)
Applications: Flexible of handling various substrates, e.g. metal
cans, bent lead frames, etc.
 Wide range of substrates handling capability
 Excellent flexibility
• AD881M: up to 3 wafers handling capability (with similar die sizes)
• AD881H: automatic materials handling
• AD881MH: up to 3 wafers and automatic substrate handling capability
 Providing extremely high speed die attach with DDR bond head
system
 Powerful inspection system providing excellent bonding quality
AD819-PD
Applications: Metal can packages, e.g. photo diodes on stem, etc.
 High precision epoxy die bonding with
• 2-in-1 stamping and bonding system
• Widely implementing linear motor systems
• Full range of PR inspection at various stages for precision bonding
 Carrier free metal cans handling design
 Supporting various configurations to fit different applications
• Programmable tilting workchuck for PD application
• Rotary workchuck for VCSEL application (option)
• Wafer PRS with PR look ahead capability
• Advanced die surface defect inspection at wafer stage
*Remark: All performance is package dependent
8
6” Die Attach Equipment
Other Die Attach Equipment
US PATENTED
Automatic High Precision Eutectic Die Bonder
(for Laser Diode Application)
AD819-LD
Applications: Metal can packages, e.g. one pass LD and submount
on stem
 Precision placement with
• Widely implementing linear motor systems
• Full range of PR inspection at various stages for precision bonding
 Carrier free metal cans handling design
 Individual bonding system for submount and LD attach
 Providing consistent eutectic environment
• Excellent oxygen level control with nitrogen gas supply
• Programmable temperature profile on various stations
 Anti-thermal shock with pre-heating and post-heating stations
Multi-chip Module Bonder
MCM12
Applications: Various multi-chip packages on, e.g. BGA, singulated
unit, metal can, wafer submount, etc.
 High speed die attach process with patented technologies
 Precision placement with latest inspection system
 Implementing excellent flexibility by supporting
•
•
•
•
•
•
•
•
Up to 12” wafer handling capability
Up to 14 types of picking tools handling capability
Up to 5 types of ejecting kits installation
Extra large substrate handling
SMD bonding capability
Direct die attach / flip chip bonding capability
Auxiliary dispensing system
And more……
 Supporting automatic wafer exchanging system
Automatic COG Bonder
Automatic FOG Bonder
COG900 / COG930
FOG900 / FOG930
Applications: Various types of glass and LSI, e.g. STN, CSTN, TFT,
etc.
 High speed and precision performance
• Full range of inspection system at each process
• 4D (XYZ-theta) workholder system driven by precise linear and DDR
actuating system
9
Applications: Various types of glass and flex, e.g. STN, CSTN,
TFT, etc.
 High speed and precision performance
• Full range of inspection system at each process
• 4D (XYZ-theta) workholder system driven by precise linear and DDR
actuating system
 Supporting various inputting and outputting configurations
• Belt inputting / outputting system
• Tray handling capability (option)
 Supporting various inputting and outputting configurations
• Belt inputting / outputting system
• Tray handling capability (option)
 Advanced inspection system with programmable LED illumination
 Advanced inspection system with programmable LED illumination
system
 Up to 13.4” glass substrate handling – COG930
 In-line capability with FOG900 / FOG930 (option)
 Up to 13.4” glass substrate handling – FOG930
*Remark: All performance is package dependent
system
 In-line capability with COG900 / COG930 (option)
Other Die Attach Equipment
6” DIE ATTACH
EQUIPMENT
Automatic IR-Cut Filter Bonder
(for Image Sensor Application)
(for Image Sensor Application)
IS898GA
IRGA868
Applications: IR glass bonding on substrates, e.g. BT, CLCC, PLCC,
or singulated lens holders, etc.
 Excellent foreign material control for image sensor application
•
•
•
•
HEPA fan filter unit providing clean air flow
Blow & suck cleaning for housing substrate
Workholder with clean cell feature
And more…...
 Flexible indexing system for substrate or boat carrier
 Supporting glass presentation on mylar / waffle pack
 Dual glue writing capability further enhances productivity
 Capable of integrating various UV snap cure systems (option)
Applications: IR glass bonding on lens holder
 Flexible materials handling capabilities
• Tape & reel input / output lens holder handling
• Vacuum / mechanical picking system to fit different lens holder
 Excellent foreign material control for image sensor application
• HEPA fan filter unit providing clean air flow
• Blow & suck cleaning for housing substrate
• Workholder with clean cell feature
• And more…...
 Up to 8” wafer handling capability
 Excellent cover tape sealing performance for protecting bonded
units in pocket tape
Automatic Lens Holder Bonder
High Mega Pixel Lens Holder Bonder
(for Image Sensor Application)
(for Image Sensor Application)
IS868LA2
IS600
Applications: Lens holder bonding on e.g. CLCC, PLCC, BGA, PCB,
singulated units, etc.
 Versatile lens holder input handling system adapts for:
• JEDEC standard tray / waffle tray
 Excellent foreign material control for image sensor application
• HEPA fan filter unit providing clean air flow
• Blow & suck cleaning for housing substrate
• Workholder with clean cell feature
• And more…...
 Supporting automatic lens orientation check
OTHER DIE ATTACH
EQUIPMENT
Automatic Glass Bonder
Applications: Lens holder bonding on e.g. CLCC, PLCC, etc. for high
mega pixel application
 Improving focusing quality of high resolution camera
 Active feedback algorithm to compensate die tilt, substrate and lens
variation
 High flexibility
• Suitable for more compact and threadless design of lens holder
 Enhancing yield by instant tracking of lens holder
 One pass solution for lens holder bonding and focusing processes
 Dual glue writing capability further enhances productivity
 Individual pick and bond arm system further enhance bonding
speed
 Capable of integrating various UV snap cure systems and post
bond heater (option)
*Remark: All performance is package dependent
10
Other Die Attach Equipment
AOI, Map Sorting / Die Sorting Equipment
US PATENTED
Total Clip Bonding Solution
Automatic AOI System
eClip
ES100
Applications: High power discrete units, e.g. DPAK matrix,
PowerSO, etc.
 All-in-one bonding solution from die bonding, clip bonding to
reflowing process
 High throughput by
• Implementing patented bond head design
• Supporting dual dispensing system
• Array clip bonding capability
Applications: Automatic advanced optical inspection system for
die, e.g. LED die
 High speed and precision inspection performance
 True color inspection capability
 Supporting pre-scan capability
 Picking “No-Good (NG) die” capability (option)
 Supporting independent temperature controlling regions
• 8 heating zones + 1 cooling zone
 Consistent reflow environment
• Excellent oxygen level control with low level of forming gas consumption
• Programmable temperature profile on various stations
Map Sorter
Die Sorter
MS100 Plus
AS899
Applications: Sorting die, e.g. blue LED, white LED, laser diode, etc.
based on wafer map information
 High speed sorting driven by
• Dual heads sorting system
• Direct drive rotary (DDR) motor and linear motor system
 User-friendly interface with Windows® based operation system
 Extra large sorting area
 Supporting pre-scan capability
Applications: Individual LED dice testing and sorting solution
 High speed die testing and sorting system with rotary testing station
design
• Dual individual linear bond heads for pick and place processes
• Parallel pick, test and sort processes
• Sorting good die only with advanced die surface defect detection at wafer
stage
 Excellent flexibilities
• Supporting various types of testers integration
• Flexible bin block arrangement
• Up to 56 bin blocks can be installed once (option)
 Precision probing performance with XYZ testing stage motions
 User-friendly interface with Windows® based operation system
11 *Remark: All performance is package dependent
Gold Ball Wire Bonding System
ASM GoCu
TwinEagle Xtreme
Applications: Ultra low–k wire bonding, stacked & thin die
overhang wire bonding, ultra low loop wire bonding
 High performance gold wire bonder
 Highest output per square foot area
 Ultra fine pitch machine
• Excellent vibration suppression technology to eliminate vibration
coupling
 Capable to handle high pin count package
• Supporting ultra low loop bonding
• Dual wire size & wire types application
AOI, MAP SORTING /
DIE SORTING EQUIPMENT
A capability enabling faster and easy conversion from Gold to Cu/CuPd
wire bonding
 With GoCu capability, CuPd UPH/productivity is higher than gold
wire bonding
 Converting to Cu/CuPd from gold wire bonding in simple clicks
 Breakthrough in wire threading with auto self rethreading feature
 Revolutionary auto PR & auto loop definition
Extreme High Speed Wire Bonder
OTHER DIE ATTACH
EQUIPMENT
Extreme High Speed Wire Bonder
GOLD BALL WIRE
BONDING SYSTEM
Extreme High Speed Wire Bonder
Ultra Fine Pitch Wire Bonder
Harrier Xtreme
Eagle Xtreme
Applications: QFN, SMD LED, HP LED, high density discrete
packages, etc.
 Dual high speed wire bond heads system
 Highest output per square foot area
 User-friendly, intelligent Windows® based interface
 Innovative algorithm for high speed PR
 Supporting copper wire bonding & copper BSOB (option)
*Remark: All performance is package dependent
Applications: Ultra low–k wire bonding, stacked & thin die
overhang wire bonding, ultra low loop wire bonding
 Wider bonding area
 Ultra small BPP bonding capability
 Precision placement with nano-scale resolution
12
Gold Ball Wire Bonding System
High Speed Wire Bonder
Automatic Gold Ball Wire Bonder
(for Discrete/Opto Applications)
(for Vertical Lead Frame Application)
iHawk Xtreme
iHawk-V
Ultra High Speed Wire Bonder
Automatic Gold Ball Wire Bonder
(for Hybrid Application)
(for Bent Lead Frame Application)
Eagle Xtreme-X2L
iHawk-02
Applications: Gold ball wire bonding, QFN, SMD LED, HP LED, high
density discrete packages, etc.
 Innovation in optics & PR system for smaller dice
 Advanced PR algorithm with PR look ahead capability
 Faster package conversion with fully motorized material handling
system
Applications: One pass solution for large bond area packages, e.g.
multi-chip modules, SiP, etc.
 High speed wire bonding capability
 Implementing patented design concept
 Extremely large bonding area
13 *Remark: All performance is package dependent
Applications: Gold ball wire bonding on vertical lead frames
 Innovative dual track design enhancing bonding speed
 Pro-longing MTBA with latest input / output magazine handling
 Innovation in optics & PR system especially for smaller LED dice
Applications: Bent lead frame handling capability for piranha LED
application
 High speed wire bonding capability
 Pro-longing MTBA with latest input / output magazine handling
 Saving cost of ownership by direct bent lead frame indexing
Gold Ball Wire Bonding System
Stud Bumping System
Automatic Gold Wire Bonder
Wafer Level Stud Bumping System
(for Laser Diode Application)
Hummingbird
Eagle60AP-LD
Applications: Metal can packages with three dimensional bonding,
e.g. LD assembly, etc.
 Rotary workholder system for multi-plane bonding
• 0° to 90° programmable rotation
 One pass LD and submount bonding
 Specially designed for photonics and optoelectronic application
 Custom-made top plate and carrier for large range of laser diode
products
Applications: Gold / copper stud bumping on wafer
 High speed bumping performance
 Excellent bumping control
• Fine pitch bumping capability
• Stack bumping capability
 Implementing flexibility
• Large bumping area: up to 12” wafer handling capability
• Supporting gold / copper stud bumping
• Automatic wafer loading system (option)
• Equipping with pre-heat / post-heat system (option)
GOLD BALL WIRE
BONDING SYSTEM
Aluminium Wire Wedge Bonding System
Heavy Aluminium Wire Bonder
Rotary Bondhead Wedge Bonder
AL501
AB559A Series
STUD BUMPING
SYSTEM
Heavy Aluminium Wire Bonding System
 Saving cost of ownership by widely implementing linear motor and
DDR systems
 Intelligent “Smart BQM” system supervising bonding quality
*Remark: All performance is package dependent
AL WIRE WEDGE
BONDING SYSTEM
• Dual light & compact bond head systems
• Hybrid wire bonding capability
• Excellent motion control
Applications: Chip-on-board, multi-die, LED display, chip-on-flex,
chip-on-glass, ceramic, etc.
 Fine pitch capability for advanced packages
 Large effective bonding area
 Vision Lead Locator (VLL) to adapt lead width variation
 Dual colour (red-blue) LED lighting for different substrates
surface reflection
 Gold wire wedge bonding application (option)
 60° wire feeding angle capability (option)
HEAVY AL WIRE
BONDING SYSTEM
Applications: Heavy aluminium wire bonding on power discrete
packages, including TO-220, DPAK matrix, etc.
 High speed, reliable and flexible heavy aluminium wire bonding
14
Aluminium Wire Wedge Bonding System
Curing System
PATENTED
Automatic Ultrasonic Wedge Bonder
Reflow Oven
AB530
SR902 / SR902L
Applications: Chip-on-board, multi-die / multi-PCB, high lead count,
etc.
 High speed bonding
 Fine pitch capability for advanced packages
 Cost saving by widely implementing linear and DDR motor systems
 Multi-unit / multi-PCB bonding capabilities
Applications: Reflowing process for high lead (>85% Pb) solder,
lead free solder, flux reflow, etc.
 Up to 8 independent temperature controlling regions
• 6 heating zones with 2 cooling zones
 Combination of convection and radiation heating modes
 Built-in reflow temperature profiler
 Sophisticated oxidation level control
 Automatic nitrogen cut-off function during idle state
 SR902L’s in-line capability with AD9212 / AD9210 or other die
attach system (option)
Snap Curing Oven
Snap Curing Oven
COE139 / COE139R
PC139 / PC139R2R
Applications: Curing process for die attached substrates in either
strip or reel form, e.g. SOT, top LED, etc.
 Excellent oxygen level control with
• N2 curtains at oven’s input and output sides
 Consistent curing temperature control with 6 temperature control
zones
Applications: Curing process for die attached substrates in either
strip or reel form, e.g. smartcards, SOT, etc.
 Stable and repeatable temperature control
 Sophisticated oxidation level control
 5 independent temperature controlling zones
• Built-in dynamic temperature profiling software
 Selectable for various substrates handling
• COE139: strip form substrate handling
• COE139R: reel form substrate handling
 Selectable for various substrates handling
• PC139: strip form substrate handling
• PC139R2R: reel form substrate handling
 In-line capability, e.g. AD830 or other die attach system (option)
 In-line capability, e.g. AD8312R, AD838R or other die attach
system (option)
15 *Remark: All performance is package dependent
Transfer Molding System
IDEALmold™ 80/120/170 ton
Applications: Mini-BGA, flex BGA, CSPBGA, QFN, QFP, TQFP,
PLCC, TSSOP, TSOP, SOIC, SOT, PDIP, singulated
units, power devices, POP, etc.
 Suitable for standalone or inline configuration
 Simple and flexible operation
• Flexible press configuration of 1 to 4 presses
 Input and output pattern recognition features
 Vacuum and wedge molding capability
 High pre-heat temperature capability
 Windows® operating system
 Pinnacle Gating System (PGS™) molding capability (option)
OSPREY
• Ultra high density molding
• POP capability
 Minimum tooling cost and shortest lead time
IDEALab™
Applications: Mini-BGA, flex BGA, CSPBGA, QFN, QFP, TQFP,
PLCC, TSSOP, TSOP, SOIC, SOT, PDIP, singulated
units, power devices, POP, etc.
 Manual molding system derived from IDEALmold™
 Mold chase compatible with IDEALmold™
 Process parameter portability to IDEALmold™
 Low conversion cost, suitable for R&D
 Advanced packaging capability
• Pinnacle Gating System (PGS™)
• Tapeless QFN, clear compound
• Punch type micro QFN
CURING
SYSTEM
 Ideal for
• Small lot, high product mix production
• Flexible manufacturing work cell
Applications: Reel form lead frames or substrates, e.g. smartcards,
SIM, flex devices, discrete devices, etc.
 World's only dual reel automatic molding system
 Pinnacle Gating System (PGS™) molding capability
 Suitable for standalone or inline configuration
 Simple operation
 Excellent productivity and short cycle time
 Fast conversion time
 Windows® operating system
 Input and output vision inspection (option)
 Clean cell and line scan (option)
 Inspection and reject punch station (option)
AL WIRE WEDGE
BONDING SYSTEM
Applications: BGA, MLP/QFN, QFP, SOIC, SOT, PDIP, COB,
carrier molding, POP, etc.
 World’s smallest footprint automatic molding machine
 Built-in PGS™ molding capability
IDEALmold™ R2R
TRANSFER
MOLDING SYSTEM
*Remark: All performance is package dependent
16
Compression Molding System
IDEALcompress™
Applications: Large substrate molding: W150mm x L300mm, LED
 Ideal for high-mix, low volume manufacturing
• Small lot assembly
• Compact
 Ideal for eco-friendly manufacturing
• No material wastage
• No mold cleaning required
 Ideal for complex designs
• Thin chip, fine pitch, long wires
• Multi stacked die package
• Low-k die
• And more...…
WLP300
Applications: WLP, wafer level LED, exposed solder ball WLP, Cu
bump pillar WLP, embedded wafer ball grid array,
redistributed chip package
 World’s first 12” automated WLP compression encapsulation system
 Flexible to handle wafer sizes ranging from 4” to 12”
 Equipped with encapsulant weight compensation
 Dispensing options
• Liquid epoxy
• Clear silicone
• Granular powder
 Various dispensing configurations, including, liquid epoxy, clear
silicone, granular powder dispensing
Dispensing / Jetting System
DS500
DS500-IL
IDEALab™ - WLP
Applications: WLP, wafer level LED, exposed solder ball WLP, Cu
bump pillar WLP, embedded wafer ball grid array,
redistributed chip package
 Tape assisted on top mold to release
 Dispensing options
• Liquid epoxy
• Clear silicone
• Granular powder
 Quick change mold chase concept with aid of IDEALtrolley™
17 *Remark: All performance is package dependent
Precision Dispensing System
DS500 Series
Applications: Die coat, adhesive dispensing, sealing, gel coating,
underfill dispensing, etc.
 Excellent encapsulant placement repeatability and dispensing
quality
 Extra large dispensing area with gantry table design
 Glob top, dam and fill dispensing mechanism
 Custom programmable dispensing patterns & parameters
 Automatic substrate handling capability with input / output elevator
systems (option)
 Dual dispensing heads with adjustable pitch (option)
 Reel-to-reel handling capability (option)
Trim / Form / Singulation System
Precision Jetting System
Mechanical Press Trim / Form System
DS520 / M
MP209
COMPRESSION
SYSTEM
Dispensing / Jetting System
 Maintaining fluid homogeneity by strategic agitating system
 Supporting individual dual workholders control
 Automatic materials handling with DS520M
•
•
•
•
QFP system (JEDEC tray off-loading)
SOIC system (Plastic tube off-loading)
SOT system (Bulk off-loading)
In-line system (integration with laser mark and finishing modules)
Discrete Package Trim / Form System
Memory Card Singulation System
MP-TAB
MP-SDS
Applications: SOT, SOD, QFN, DFN & etc.
 High UPH discrete package singulation
 Suitable for ultra high density lead frames
 Modular construction for flexible integration
 Vision inspection for orientation & uncut dam bar
*Remark: All performance is package dependent
TRIM / FORM /
SINGULATION SYSTEM
• High accuracy & repeatability
• Easy to operate & maintain
• Long modules life
Applications: DPAK, D²PAK, TO220, QFN, DFN, SOP, TQFP,
TSOP, TSSOP & etc.
 High speed eccentric cam-follower driver mechanism with
synchronized indexer
 Automatic tool height inching mechanism for tooling quality
assurance
 High speed running trim / form operation
 Modular construction configurable to accommodate different
applications
DISPENSING /
JETTING SYSTEM
Applications: Jetting encapsulant onto various substrates, including
phosphors mixed silicone on LED packages, etc.
 Extremely high speed jetting with in-house developed jetting system
 Excellent performance
Applications: Individual type SD card substrates
 Self contained system to accept stacked magazine loading and
un-loading
 Linear servo carrier transportation provides a flexible solution to
variety of frames
 Supporting mark inspection
 Flexible to integrate with any third party vision inspection
18
Laser Mark Handler
Test and Finish Handling Equipment
Laser Mark Handler
Turret Based Test Handler
LS1000
FT2030
Applications: All kinds of IC lead frames and power device matrix
lead frames
 Standard module and fully constructed in modular, flexible for any
process customization
 Open platform to accept any laser marker in market
 Walking beam type transportation provides a flexible solution to
variety of packages
 Optional mark inspection
 Flexible to integrate with any third party vision inspection
Applications: TSSOP, QFN/MLP, MBGA, etc.
 30 high speed turret pick heads for efficient processing of multiple
process steps with extremely short indexing time
 High flexibility
• Configuring any mix of process steps to provide a full range of flexible
solutions
 Flexible system configurations
• Onload: stack tube / vibratory bowl feeder / metal tray
• Offload: stack tube / plastic tube / tape-and-reel / multiple tubes / multiple bins
 Advanced vision technologies
• 2.5D lead inspection with lead co-planarity and stand-off check, 5S
inspection, in-pocket inspection, mark and surface inspection
Turret Based Test Handler
Turret Based Test Handler
FT2018
FT-Power
Applications: SC59, SC70, SOT23, SOD923, SOT113, SOT223,
etc.
 Tailor-made for mini-discrete packages with high speed and high
accuracy performance
 18 high speed turret pick heads for efficient processing of multiple
process steps with extremely short indexing time
 Individual up down driving mechanism further allowing high speed
performance
 Flexible system configurations
 Advanced vision technologies
• 2.5D lead inspection with lead co-planarity and stand-off check, 5S inspection,
in-pocket inspection, mark and surface inspection
19 *Remark: All performance is package dependent
Applications: TO220 series, TO263, TO252, TO3P, TO247, SIP9L,
TO264, etc.
 High speed performance with strategic testing sequence
 Intelligent buffer track design between HVT and main modules
 Supporting rotary table for isolation test
 Up to 4 test stations testing 8 units for HVT
 Up to 8 test stations for non HVT test on rotary table
 Advanced vision technologies
• Mark inspection in table
• 2.5D lead inspection with lead co-planarity and stand-off check
• In-pocket inspection
Test and Finish Handling Equipment
Complete Quality Inspection Handler
Singulation and Finishing Integrated System
FV2030
FET-CLUSTER
Applications: SC59, SC70, SOT23, SOT89, SOT113, SOT223,
SOIC, TSSOP, QFN/MLP, MBGA, DPAK, TO220,
TO3P, TO264, SIP9, etc.
 Complete visual cosmetic inspection capability
6S inspection: chipping, piping hole, molding size & etc.
2.5D inspection: lead standoff, lead co-planarity, stand-off & etc.
2D inspection: lead width, lead length, lead pitch & etc.
In-pocket inspection: final package & lead quality check before packing
 30 high speed turret pick heads for efficient processing of multiple
process steps with extremely short indexing time
TEST AND FINISH
HANDLING EQUIPMENT
 Flexible system configuration
• Onload: stack tube / vibratory bowl feeder / metal tray
• Offload: stack tube / plastic tube / tape-and-reel / multiple tubes / multiple
bins
Carrier Based Test Handler
Memory Test Handler
FT1000
FT1000-HD
Applications: M-BGA, QFN, SOIC, QFP, TSOP, etc.
 Parallel device testing in singulated / strip form
 Extra large carrier loading area
 Programmable 3-axis carrier indexer
 High speed performance
 In-house design test contactor
• Spring loaded Pogo™ pins
• Unlimited multi-site testing depends on tester's resources
LASER MARK
HANDLER
•
•
•
•
Applications: M-CAN, S-CAN, SOP, TSOP, TSSOP & etc.
 All-in-one solution for singulation, visual inspection and packing
 30 high speed turret pick heads
 Soft cut singulation
 Multiple output bins
 Vision inspection for mark, lead and in-pocket
 Surface inspection for molding quality check (option)
Applications: SO, TSOP, QFN, MLF, BCC, BGA, CSP, etc.
 Hi-density carrier based test handler system capable of testing 256
devices in parallel
 Temperature range: ambient to 135°C (option: 155°C)
 Adjustable contact force of 120 kgf (option: 240 kgf)
 Heat compensation during test
 Flexible input / output configuration
 Combining with finishing module to provide a one-stop testing,
sorting, inspecting and packing solution
*Remark: All performance is package dependent
20
Ball Placement and CSP Handling Equipment
US PATENTED
Ball Placement System
High Speed Tape Sorting System
BP2000
CS900
Applications: CSBGA/PBGA, flex BGA & etc.
 Ultra small ball / fine pitch CSBGA capability
 High speed performance
 Flexible material handling capability
• Strip form substrate / flat carrier / plastic tray / U-boat / pallet / slot
magazine
 Patented vision alignment pick & place mechanism
 Patented “BSU” ball handling
 Patented “Smart Vibrator” ball transfer
 Built-in diverter for easy link-up with reflow oven
LED (SMD) Testing System
LED Tester System
TLB203
Applications: Measuring electrical and optical characteristics on
wafer prober or handler, e.g. AS899, SLS230 series,
IP360 series, etc. for die / package level sorting
 Large range of power supply
 Precision measurement
 Flexible implementation
• Supporting up to two testing stations simultaneously
• Multiple drivers and photo-detectors handling capability
21 *Remark: All performance is package dependent
Applications: BCC, CSBGA, MLP, QFN, SiP & etc.
 High speed linear motor mechanism
 Advanced vision inspection capability
• Mark inspection, lead / ball inspection and 5 sides inspection
 Flexible offloading configuration – tube-tray / tray-tray /
canister-tray
LED (SMD) Sorting & Taping System
PATENT PENDING
Automatic LED (SMD) Sorting System
Automatic LED (SMD) Sorting System
SLS230 / S
SLS230T Plus
Applications: Chip LED, sideview LED, etc.
 Excellent performance by implementing patent pending design
 Anti-bin mixing design by detecting bin removal for automatic label
printing with bin criteria
 Optional with vision inspection for multi-chip LED to screen out
package with missing chip, defected chip, etc. before sorting
 Wide range of applications
Applications: Top LED, e.g. 3014, 3020, 3528, 5050, etc.
 Anti-bin mixing design by detecting bin removal for automatic label
printing with bin criteria
 Long lasting performance with latest XY table design
 Increasing bin capacity for large lot size
 Optional with vision inspection for multi-chip LED to screen out
package with missing chip, defected chip, etc. before sorting
• SLS230: chip LED devices, e.g. 0402, 0603, 0605, 0805, 1206, etc.
• SLS230S: sideview LED devices, e.g. 008, 010, 020, 215, 335, etc.
BALL PLACEMENT AND
CSP HANDLING EQUIPMENT
SLT400
IP360 Series
Applications: Chip LED, top LED, sideview LED, etc.
 In-house developed direct drive rotary motor and linear up down
motor to maximize system throughput
 Advanced inspection algorithm for high accuracy inspection
 Ensuring taping for good units with supporting test contact
technology
 Simple and easy operation with MS Windows® operating system
 Wide range of applications
• Chip LED devices: 0402, 0603, 0805, etc.
• Top LED devices: 3014, 3020, 3528, 5050, etc.
• Sideview LED devices: 008, 010, 020, etc.
*Remark: All performance is package dependent
Applications: Ceramic, silicon, molded LED with lens
 One-stop solution for test, sort and output with good traceability
 In-house developed direct drive rotary motor and linear up down
motor to maximize system throughput
 Flexible materials handling input material handling
LED (SMD) SORTING &
TAPING SYSTEM
Ingenious (LED) Packing System
LED (SMD) TESTING
SYSTEM
Automatic LED (SMD) Taping System
• Input system: wafer frame / bowl feeding system
• Output system: tape-and-reel output, bin frames and / or bins
 Powerful inspection capability
• Wafer inspection
• Tape-and-reel in-pocket inspection, etc.
 Optional wafer barcode scanning, unit map, label printing and
output file generation package for good tractability of devices
22
Manufacturing Solution
Discrete Solution
AD838
(P. 5)
AD838R
AL501
ASM GoCu
eClip
Harrier Xteme
iHawk Xteme
(P. 5)
SD890A
(P. 7)
(P. 11)
(P. 14)
(P. 12)
Die Bonding
MP209
(P. 12)
(P. 18)
(P. 13)
IDEALmold™
MP-TAB
FT2018
Molding
Trimming & Forming
Testing & Finishing
(P. 16)
Wire Bonding
(P. 18)
(P. 24)
DDR Memory / Memory Card Solution
Eagle Xtreme
MP-SDS
(P. 12)
LinDA
TwinEagle Xtreme
(P. 4)
(P. 12)
Die Bonding
Wire Bonding
IDEALmold™
(P. 18)
BP2000
(P. 21)
(P. 16)
Molding
BEP System
Smartcard / RFID Solution
AD8312R
(P. 4)
Harrier Xtreme
AD838R
(P. 5)
(P. 12)
PC139R2R
(P. 15)
(P. 13)
Curing
Die Bonding
iHawk Xtreme
Wire Bonding
AD8312
AD838
(P. 5)
Die Bonding
23
iHawk Xtreme
DS500 Series
Wire Bonding
Dispensing
(P. 13)
(P. 16)
Molding
MEMS Solution
(P. 4)
IDEALmold™ R2R
(P. 17)
Manufacturing Solution
HP LED Solution
IDEALcompress™
AD211/
AD212
(P. 17)
Harrier Xtreme
(P. 7)
DS500
(P. 12)
AD830U
AD220
(P. 6)
(P. 17)
DS520/M
iHawk Xtreme
(P. 7)
Die Bonding
IDEALab™ - WLP IP360 Series
(P. 18)
(P. 13)
Wire Bonding
(P. 17)
Molding
Dispensing / Jetting
(P. 22)
Packing
SMD LED Solution
Harrier Xtreme
SLS230/S
(P. 12)
AD830
iHawk Xtreme
(P. 6)
(P. 13)
Die Bonding
Wire Bonding
DS520/M
(P. 18)
Jetting
(P. 22)
SLS230T Plus
(P. 22)
Sorting
SLT400
(P. 22)
Taping
Vertical LED Solution
AD100
iHawk-V
DS520/M
Die Bonding
Wire Bonding
Jetting
(P. 8)
(P. 13)
(P. 18)
COB Solution
AD880
(P. 8)
AB559A
AD881
(P. 8)
Die Bonding
(P. 14)
AB530
(P. 15)
Wire Bonding
DS500 Series
(P. 17)
Dispensing
24
BEP In-line Solution
LS1000 + MP209
Applications: DPAK, D²PAK, QFN, SO, SOT, TO, TO220, TQFP, TSOP, TSSOP, etc.
Slot
Magazine
Onload
LS1000
Laser Mark Handler System
MP209
Trim/Form System
Slot Magazine
Offload
LS1000 + MP209 + FT2030
Applications: DirectFET™
LS1000 MP209
Laser Mark
Handler
System
25
Trim/Form
System
FT2030
Turret Based Test Handler
Singulation
Press
Incline
Offload
China 中國
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
2/F, Zu Chong Zhi Road Lot 1505
Shanghai Zhangjiang Hi-Tech Park
Shanghai 201203, China
先域微電子技術服務(上海)有限公司
上海市 張江高科技園區
祖冲之路 1505 弄 55 號 2 樓
Tel : 86-21-5080 5465
Fax : 86-21-5080 5467
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room 705, Da An Building B
No. 41 You Yi Road, He Xi District
Tianjin 300211, China
先域微電子技術服務(上海)有限公司
天津分公司
天津市 河西區 友誼路 41 號
大安大厦 B 座 705 室
Tel : 86-22-5881 3008
Fax : 86-22-5881 3009
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room C345-4, Chengdu Hi-Tech Zone
Innovation Service Centre
Chengdu 611731, China
先域微電子技術服務(上海)有限公司
成都辦事處
成都 西芯大道四號 西部園區基地
孵化樓 C345-4 號
Tel : 86-28-8784 6551
Fax : 86-28-8784 6562
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room B, 31/F, Bi Li Da Building
No. 22 Lv Ling Road
Xiamen 361009, China
先域微電子技術服務(上海)有限公司
廈門分公司
廈門市 呂岭路 22 號 必利達大廈 31B 室
Tel : 86-592-550 9125
Fax : 86-592-550 9121
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room 05-03/06, Block A
No. 5 Xing Han Street
Suzhou Industrial Park
Suzhou 215021, China
先域微電子技術服務(上海)有限公司
蘇州分公司
蘇州市 蘇州工業園
星漢街 五號A幢 05-03/06 室
Tel : 86-512-6762 6278
Fax : 86-512-6762 6378
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room 7-11, 4th Floor, Block A
Tai'an Square, Dongshen Road
Zhang Mu Tou Town
Dongguan 523620, China
先域微電子技術服務(上海)有限公司
東莞分公司
東莞市 樟木頭鎮 東深公路旁荔苑大道
泰安廣場 A 棟四樓 A7-A11
Tel : 86-769-8712 5600
Fax : 86-769-8712 5601
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
East Wing, 4/F, Block 2
CATIC (Zhonghang) Shahe Industrial Zone
Qiao Xiang Road, Nanshan District
Shenzhen 518053, China
先域微電子技術服務(上海)有限公司
深圳分公司
深圳市 南山區 僑香路
中航沙河工業區(北區) 2 號樓 4 層東
Tel : 86-755-8830 8533
Fax : 86-755-8344 6245
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room 1402-4
Jiangxin Guoji Jiayuan Yinzuo
No. 85 Jiefangxi Road, Qingyunpu District
Nanchang 330002, China
先域微電子技術服務(上海)有限公司
南昌分公司
江西省 南昌市 解放西路
江信國際嘉園銀座大廈 1402-1404
Tel : 86-791-8820 1517
Fax : 86-791-8820 7178
Hong Kong 香港
Japan 日本
Korea 韓國
ASM Pacific (Hong Kong) Ltd
4/F Watson Centre, 16-22 Kung Yip Street
Kwai Chung, Hong Kong
先進太平洋(香港)有限公司
香港 葵涌 工業街 16-22 號
屈臣氏中心 4 樓
Tel : 852-2619 2000
Fax : 852-2619 2118/9
ASM Assembly Technology Co Ltd
5F, Tachikawa F-Bldg, 1-7-18
Nishiki-Cho, Tachikawa-Shi
Tokyo 190-0022, Japan
〒190-0022 東京都立川市錦町 1-7-18
立川エフビル 5 階
Tel : 81-42-521 7751
Fax : 81-42-521 7750
ZEMOS Korea Inc. /
ASM Pacific Kor Ltd.
3F, 628-6, Deung Chon Dong
Kangseo Gu, Seoul 157-030, Korea
서울시 강서구 등촌동 628-6 3층 157-030
Tel : 82-2-538 5900
Fax : 82-2-561 5905
ASM Pacific Kor Ltd
Room 501, 5F, Hi-Tech Center
958-14 Daechon-dong, Buk-gu
Gwangju 500-470, Korea
광주광역시 북구 대촌동 958-14
하이테크센터 501 호 500-470
Tel : 82-62-973 4174
Fax : 82-62-973 4216
ASM Pacific (Holding) Limited
Taiwan Branch
10F, No. 530, Sec. 2, Chung Shan Road
Chung Ho Dist, New Taipei City, Taiwan
香港商先進太平洋股份有限公司
台灣分公司
台北辦事處
新北市 中和區 中山路二段 530 號 10 樓
Tel : 886-2-2227 3388
Fax : 886-2-2227 3399
ASM Pacific (Holding) Limited
Taiwan Branch
1F, No. 7, Lane 91, Dongmei Road
Hsinchu, Taiwan
香港商先進太平洋股份有限公司
台灣分公司
新竹辦事處
新竹市 東美路 91 巷 7 號 1 樓
Tel : 886-3-573 3750
Fax : 886-3-573 3551
ASM Pacific (Holding) Limited
Taiwan Branch
8F-1, No. 135, Sec 2
Chung Shan Road, Tantzu
Taichung, Taiwan
香港商先進太平洋股份有限公司
台灣分公司
台中辦事處
台中市 潭子區 中山路 2 段 135 號 8F-1
Tel : 886-4-2535 6390
Fax : 886-4-2535 6820
ASM Assembly Equipment Malaysia
Sdn Bhd
24A, Jalan Medan Ipoh 1B
Medan Ipoh Bistarli
31400 Ipoh Perak, Malaysia
Tel : 605-542 3991
Fax : 605-542 3992
ASM Assembly Equipment Malaysia
Sdn Bhd
B-1-12, Jalan SS6/20, Dataran Glomac
Pusat Bandar Kelana Jaya
47301 Petaling Jaya, Malaysia
Tel : 603-7806 4942
Fax : 603-7806 4943
ASM Assembly Equipment Malaysia
Sdn Bhd
1, Tingkat Satu, Jalan Warisan 1
Taman Warisan Jalan Junid
84000, Muar, Johor, Malaysia
Tel : 606-951 5713
Fax : 606-951 5786
Taiwan 台灣
ASM Pacific (Holding) Limited
Taiwan Branch
No. 4-2, East 3 Road Street
N.E.P.Z. Kaohsiung, Taiwan
香港商先進太平洋股份有限公司
台灣分公司
高雄市 811 楠梓加工出口區
東三街 4-2 號
Tel : 886-7-367 6300
Fax : 886-7-367 6399
Malaysia 馬來西亞
ASM Assembly Equipment Malaysia
Sdn Bhd
Bayan Point, Block A, No. 15-1-23, 15-1-24
Medan Kampung Relau
11900 Penang, Malaysia
Tel : 604-644 9490
Fax : 604-645 1294
Philippines 菲律賓
Singapore 新加坡
Thailand 泰國
Europe 歐洲
Edgeward Development Limited
Philippines Branch
2108, Prime Street
Corner Enterprise Street
Madrigal Business Park, Alabang
Muntinlupa City, Philippines 1770
Tel : 63-2-850 4543
Fax : 63-2-850 4547
ASM Technology Singapore Pte Ltd
ASM Assembly Equipment Bangkok
Ltd
ASM Assembly Products B.V.
2 Yishun Avenue 7
Singapore 768924
Tel : 65-6752 6311
Fax : 65-6758 2287
51/3, Vibhavadi Tower, 18/2 Floor
Ngamwongwan Road, Ladyao,
Chathuchak, Bangkok 10900
Thailand
Tel : 66-2-941 3181/2
Fax : 66-2-941 3183
Weltevreden 4 A, 3731 Al De Bilt
The Netherlands
Tel : 31-30-890 6310
Fax : 31-30-890 6320
U.S.A. 美國
ASM Pacific Assembly Products Inc.
3440 East University Drive, Phoenix
Arizona 85034-7200
U.S.A.
Tel : 1-602-437 4760
Fax : 1-602-437 4630
ASM Pacific Assembly Products Inc.
(Western Regional Office)
97 East Brokaw Road, Suite 100
San Jose, California 95112-4209
U.S.A.
Tel : 1-408-451 0800
Fax : 1-408-451 0808
M81
SEMICONDUCTOREQUIPMENT
http://www.asmpacific.com