GENERIC SPECIFICATION
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Titre / Title
RELAYS ELECTROMAGNETIC,
RF COAXIAL SWITCH, LATCHING
GENERIC SPECIFICATION
Rédigé par / Written by
Responsabilité / Responsibility
Date
S. POIZAT
Space Project Assistant Manager
23/03/05
Space B. U. Manager
23/03/05
Space Quality Manager
23/03/05
Vérifié par / Verified by
V. EUDELINE
Approuvée par / Approved by
A. BLANCHARD
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Signature
GENERIC SPECIFICATION
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DOCUMENTATION CHANGE NOTICE
REVISION
OR
ISSUE
DATE
CHANGE
1/1/A
27/08/04
24/11/04
1/B
23/03/05
Initial edition
Table 1.3 : 19-21 GHz Æ 17,5-21,5 GHz and 29-30 GHz Æ 27,5-31 GHz
Para 4.3.4: Open indicator resistance: 100KΩ → 1MΩ
Test number designation on Figure 9.15.A/B/C corrected. (N°2.1, 2.2 & 3.0)
Group B test added on Figure 9.15.D.
Para 7.3.5 added (radiation)
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TABLE OF CONTENTS
1.
General _____________________________________________________________________7
1.1. Scope ____________________________________________________________________________7
1.2. Applicable Documents______________________________________________________________7
1.3. Type variant : Detail Specification____________________________________________________7
2.
Characteristics________________________________________________________________8
2.1. Electrical characteristics____________________________________________________________8
2.1.1.
2.1.2.
3.
Maximum ratings _____________________________________________________________________ 8
Functional diagram ____________________________________________________________________ 8
Mechanical characteristics ______________________________________________________8
3.1. Physical dimensions________________________________________________________________8
3.2. Access ___________________________________________________________________________8
3.3. Material and finishes_______________________________________________________________8
3.4. Weight___________________________________________________________________________8
3.5. Storage and life ___________________________________________________________________8
4.
Performances ________________________________________________________________9
4.1. General description ________________________________________________________________9
4.2. Rf characteristics __________________________________________________________________9
4.2.1.
RF Input/Output Impedance _____________________________________________________________ 9
4.3. Switching characteristics and dc interface _____________________________________________9
4.3.1.
4.3.2.
4.3.3.
4.3.4.
4.3.5.
4.3.6.
4.3.7.
5.
High Level Command (HLC) characteristics ________________________________________________ 9
Dielectric Withstanding Voltage __________________________________________________________ 9
Coil DC isolation______________________________________________________________________ 9
Indicator Circuit Resistance _____________________________________________________________ 9
Protection __________________________________________________________________________ 10
Switching Time ______________________________________________________________________ 10
Dimension and mass __________________________________________________________________ 10
Interface requirements ________________________________________________________10
5.1. Mechanical ______________________________________________________________________10
5.1.1.
5.1.2.
Center of gravity _____________________________________________________________________ 10
Mounting provisions __________________________________________________________________ 10
5.2. Electrical interface________________________________________________________________10
5.2.1.
5.2.2.
Coaxial Connectors ___________________________________________________________________ 10
Command Connectors_________________________________________________________________ 10
5.3. Thermal interface ________________________________________________________________10
5.3.1.
6.
Temperature definition ________________________________________________________________ 10
Design and construction requirements ___________________________________________11
6.1. Units of measurements ____________________________________________________________11
6.2. Electrical________________________________________________________________________11
6.2.1.
6.2.2.
6.2.3.
Electrical components _________________________________________________________________ 11
Multipactor _________________________________________________________________________ 11
Failure propagation ___________________________________________________________________ 11
6.3. Mechanical ______________________________________________________________________11
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6.3.2.
6.3.3.
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Sealing_____________________________________________________________________________ 11
Orientation of the unit _________________________________________________________________ 11
Fixation ____________________________________________________________________________ 11
6.4. Material and process ______________________________________________________________12
6.4.1.
6.4.2.
6.4.3.
Parts, Materials and Processes __________________________________________________________ 12
Contamination Control ________________________________________________________________ 12
Finish______________________________________________________________________________ 12
6.5. Identification and product marking _________________________________________________12
6.5.1.
6.5.2.
6.5.3.
6.5.4.
7.
Product identification _________________________________________________________________ 12
Connector identification _______________________________________________________________ 12
Legibility___________________________________________________________________________ 12
Marking____________________________________________________________________________ 12
Operational requirements ______________________________________________________13
7.1. Safety: Connector savers __________________________________________________________13
7.2. Transportation and storage ________________________________________________________13
7.2.1.
7.2.2.
Electrical connectors __________________________________________________________________ 13
Packaging __________________________________________________________________________ 13
7.3. Environment ____________________________________________________________________13
7.3.1. Climatic and Pressure _________________________________________________________________ 13
7.3.1.1. Humidity_________________________________________________________________________ 13
7.3.1.2. Ground operation temperature ________________________________________________________ 13
7.3.1.3. Ground pressure ___________________________________________________________________ 13
7.3.1.4. Launch and Ascent _________________________________________________________________ 13
7.3.1.5. Orbit pressure _____________________________________________________________________ 13
7.3.2. Mechanical _________________________________________________________________________ 14
7.3.2.1. Vibration_________________________________________________________________________ 14
7.3.2.2. Mechanical shock __________________________________________________________________ 14
7.3.3. Thermal ____________________________________________________________________________ 14
7.3.4. Electric Field (E-field) Shielding Effectiveness _____________________________________________ 14
7.3.5. Radiation ___________________________________________________________________________ 14
8.
Hardware model definition_____________________________________________________15
8.1. Engineering Model (EM) __________________________________________________________15
8.2. Qualification Model (QM) or Engineering Qualification Model (EQM) ____________________15
8.3. ProtoFlight Model (PFM) __________________________________________________________15
8.4. Flight Model (FM) ________________________________________________________________15
9.
Verifications and tests_________________________________________________________16
9.1. General _________________________________________________________________________16
9.2. Verification matrix _______________________________________________________________16
9.3. Test conditions ___________________________________________________________________17
9.3.1. Ambient environment conditions ________________________________________________________ 17
9.3.1.1. Temperature ______________________________________________________________________ 18
9.3.1.2. Atmospheric pressure _______________________________________________________________ 18
9.3.1.3. Relative humidity __________________________________________________________________ 18
9.3.2. Tolerances __________________________________________________________________________ 18
9.3.2.1. Temperature ______________________________________________________________________ 18
9.3.2.2. Temperature stabilization ____________________________________________________________ 18
9.3.2.3. Temperature change ________________________________________________________________ 18
9.3.2.4. Pressure _________________________________________________________________________ 18
9.3.2.5. Relative humidity __________________________________________________________________ 18
9.3.2.6. Vibration frequency ________________________________________________________________ 18
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9.3.2.7. Sinusoidal vibration amplitude________________________________________________________ 18
9.3.2.8. Random vibration __________________________________________________________________ 18
9.3.2.9. Power spectral density ______________________________________________________________ 19
9.3.2.10. Shock _________________________________________________________________________ 19
9.3.2.11. Time__________________________________________________________________________ 19
9.3.2.12. Mass__________________________________________________________________________ 19
9.4. Inspection 1.0 ____________________________________________________________________19
9.4.1.
9.4.2.
Visual inspection 1.1 _________________________________________________________________ 19
Mechanical inspection 1.2 _____________________________________________________________ 19
9.5. Ambient performance tests 2.0 _____________________________________________________19
9.5.1.
9.5.2.
RF initial ambient performances 2.1______________________________________________________ 19
Electrical ambient performances 2.2______________________________________________________ 20
9.6. Operating cycle 3.0 _______________________________________________________________20
9.7. Thermal environment tests 4.0, 5.0 __________________________________________________20
9.7.1. Definitions__________________________________________________________________________ 20
9.7.2. Qualification temperature limits _________________________________________________________ 20
9.7.3. Acceptance temperature limits __________________________________________________________ 20
9.7.4. Thermal cycling 4.0 __________________________________________________________________ 21
9.7.5. Thermal test 5.0 _____________________________________________________________________ 21
9.7.5.1. Thermal Vacuum Test (TVT) 5.1 _____________________________________________________ 21
9.7.5.2. Thermal Ambient Pressure (TAP) 5.2 __________________________________________________ 21
9.8. Mechanical environment tests 6.0 ___________________________________________________22
9.8.1.
Sine vibrations 6.1 ___________________________________________________________________ 22
Perpendicular to mating plane (Z axis) ______________________________________________________ 22
9.8.2. Random vibrations 6.2 ________________________________________________________________ 22
Perpendicular to mating plane (Z axis) ______________________________________________________ 22
Perpendicular to mating plane (Z axis) ______________________________________________________ 23
9.8.3. Sine survey 6.3 ______________________________________________________________________ 23
9.9. Mechanical shock 7.0 _____________________________________________________________23
9.10.
Life test 8.0 ___________________________________________________________________24
9.11.
Final functional tests 9.0_________________________________________________________24
9.12.
E-field shielding effectiveness- EMC 10.0___________________________________________24
9.13.
Documentation and reviews ______________________________________________________24
9.13.1. Qualification data delivered ____________________________________________________________ 25
9.13.2. Acceptance data delivered______________________________________________________________ 25
9.14.
Performance test matrix _________________________________________________________26
9.14.1. Test performance parameters ___________________________________________________________ 26
9.14.2. Test matrix for EM, QM, PFM and FM ___________________________________________________ 27
9.14.3. Test legend _________________________________________________________________________ 28
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LIST OF TABLES AND FIGURES
Table 1.3 – Type of the switches _____________________________________________________________________ 7
Table 9.7.2: Qualification temperature limits __________________________________________________________ 20
Table 9.7.3: Acceptance temperature limits ___________________________________________________________ 20
Table 9.8.1: Sinusoidal vibration at qualification level __________________________________________________ 22
Table 9.8.2-A: Random vibration at qualification level __________________________________________________ 22
Table 9.8.2-B: Random vibration at acceptance level____________________________________________________ 23
Table 9.15.1: Test performance parameters ___________________________________________________________ 26
Table 9.15.2: Test Matrix for EM, QM, PFM and FM __________________________________________________ 27
Figure 9.15 A – Qualification Model (QM) Test Profile _________________________________________________ 29
Figure 9.15 B – ProtoFlight Model (PFM) Test Profile__________________________________________________ 30
Figure 9.15 C – Flight Model (FM) Test Profile _______________________________________________________ 31
Figure 9.15 D –Electrical Model (EM) Test Profil ______________________________________________________ 32
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GENERAL
1.1. SCOPE
This specification defines the general requirements for the qualification approval, procurement
including testing, delivery of Relays Electromagnetic, RF Coaxial Switch Latching, for space
application.
This specification contains the appropriate inspection and test schedules and also specifies the data
documentation requirements.
1.2. APPLICABLE DOCUMENTS
The following documents form a part of, and shall be read in conjunction with, this specification.
The relevant issues shall be those in effect at the date of placing the purchase order.
MIL C 39012 General Specification : RF Coaxial Connectors.
ESCC 20400 Internal Visual Inspection
ESCC 20500 External Visual Inspection
ESCC 24800 Resistance to solvents of Marking, Material and Finishes
IEC publication 60068-2, Basic Environmental Testing Procedures
FIQL-ES-101, Test procedure of measure of the RF Leakage in reverberante chamber
1.3. TYPE VARIANT : DETAIL SPECIFICATION
A list of switches covered by this specification is given in Table 1.3 – Type of the switches.
For each type of switch, the full electrical, physical and configuration characteristics are given in the
applicable detail specification for the switch.
Type
SPDT SMA Low Power
SPDT TNC High Power
DPDT SMA Low Power
Useful Frequency Band
Detail Specification Reference
DC to 18 GHz model
17,5-21,5 & 27,5-31GHz model
DC to 4.8 GHz model
DC to 18 GHz model
17,5-21,5 & 27,5-31GHz model
DC to 18 GHz model
DC to 4.8 GHz model
DC to 18 GHz model
17,5-21,5 & 27,5-31GHz model
DC to 4.8 GHz model
RAD-DET-SPDT-001
DP3T SMA Low Power
DP3T TNC High Power
T-switch Random Drive SMA Low
Power
T-switch Random Drive TNC High
Power
T-switch Sequential Drive SMA Low DC to 18 GHz model
Power
17,5-21,5 & 27,5-31GHz model
Table 1.3 – Type of the switches
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RAD-DET-SPDT-002
RAD-DET-DPDT-001
RAD-DET-DP3T-001
RAD-DET-DP3T-002
RAD-DET-TSRD-001
RAD-DET-TSRD-002
RAD-DET-TSSD-001
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2. CHARACTERISTICS
2.1. ELECTRICAL CHARACTERISTICS
2.1.1. Maximum ratings
The maximum ratings, which shall not be exceeded at any time during use or storage, applicable to
the RF coaxial switches specified herein, are scheduled in the applicable Detail Specifications.
2.1.2. Functional diagram
The functional diagrams of the switches specified herein are defined in the applicable Detail
Specifications.
3. MECHANICAL CHARACTERISTICS
3.1. PHYSICAL DIMENSIONS
The physical dimensions of the RF coaxial switches specified herein are scheduled in the applicable
Detail Specification.
Dimensions pointed by an arrow shall be measured for dimension check measurements.
3.2. ACCESS
Input and output accesses shall be connectors as defined in the applicable Detail Specification.
3.3. MATERIAL AND FINISHES
Specific requirements for materials and finishes are specified in the applicable Detail Specification.
3.4. WEIGHT
The weight of the RF coaxial switches specified herein are scheduled in the applicable Detail
Specifications.
3.5. STORAGE AND LIFE
The RF coaxial Switches specified herein shall be designed to guarantee a storage life of 5 years then
an operating life of 15 year.
The switch shall be capable of operating without failure for a minimum of 100 000 actuations under
specified environmental conditions
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4. PERFORMANCES
4.1. GENERAL DESCRIPTION
The RF Coaxial switches are vented electromechanical latching devices used to connect a RF signal
from RF sources.
Unless otherwise stated, the performance specification shall be met with the specified RF input level
range, under the specified environment (pressure, mechanical, thermal space radiation) and over
lifetime.
4.2. RF CHARACTERISTICS
All RF performances are given in the applicable Detail specifications: Frequency range, Insertion
Loss, Return Loss (or VSWR), Isolation, RF Power,…
4.2.1. RF Input/Output Impedance
The reference input and output impedance shall be 50Ω.
4.3. SWITCHING CHARACTERISTICS AND DC INTERFACE
4.3.1. High Level Command (HLC) characteristics
a)
b)
c)
d)
e)
The switch operation shall be possible for an actuation voltage range given in the
applicable Detail specification
The switch actuation current shall be lower or equal than the sanction given in the
applicable Detail specification.
Non active command voltage is +0V ±2V
Pulse waveform and time: pulse length shall be within values given in the applicable
Detail specification
Pick-up voltage (Threshold voltage): The switch shall operate at any temperature when
actuation voltage is higher than Max pick-up voltage indicated in applicable Detail
specification
4.3.2. Dielectric Withstanding Voltage
The dielectric withstanding voltage between each coil terminal and ground shall be: ≥ 500 Vrms at
50Hz or 60Hz
4.3.3. Coil DC isolation
The DC isolation between each coil and the case shall be a minimum of 1MΩ
4.3.4. Indicator Circuit Resistance
For the Indicator circuits specified in each Detail specification, the resistance of the indicator contact
circuit shall remain:
• Less than 1Ω (without diodes) in the short position
• Less than 10Ω (with diodes) in the short position (the diode should be polarised)
• Higher than 1MΩ in the open position
• Compliant with the resistance or diode values specified in other positions
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4.3.5. Protection
The coils self inductance effect shall be eliminated by diodes as defined in the applicable Detail
specification. The switch mechanism shall be so designed as to preclude any intermediate positions
regardless of the duration or voltage of the applied command pulse.
4.3.6. Switching Time
The switching time shall be less than the sanction given in the applicable Detail specification
4.3.7. Dimension and mass
The dimensions and mass shall be in accordance with the applicable Detail specification
5. INTERFACE REQUIREMENTS
5.1. MECHANICAL
The mechanical interface (structure, mounting lugs) shall be as defined in the applicable Detail
specification
5.1.1. Center of gravity
The center of gravity shall be in accordance with the applicable Detail specification
5.1.2. Mounting provisions
Mounting provisions shall be in accordance with the applicable Detail specification
5.2. ELECTRICAL INTERFACE
5.2.1. Coaxial Connectors
The coaxial connectors shall be in accordance with the applicable Detail specification
5.2.2. Command Connectors
The commands and telemetry interface shall be in accordance with the applicable Detail specification
5.3. THERMAL INTERFACE
5.3.1. Temperature definition
The temperature reference point shall be defined in the applicable Detail specification.
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6. DESIGN AND CONSTRUCTION REQUIREMENTS
6.1. UNITS OF MEASUREMENTS
The Système International d’Unité (SI) shall be used.
6.2. ELECTRICAL
6.2.1. Electrical components
Parts, including diodes shall be space qualified and the quality levels shall be in accordance with the
general rules in space.
6.2.2. Multipactor
The unit shall operate without multipactor discharge when used with the maximum power level
defined in the applicable Detail specification
6.2.3. Failure propagation
The unit shall be designed in such a way that any failure can not be propagated towards other units,
through electrical harness or by thermal or mechanical effects.
6.3. MECHANICAL
6.3.1. Sealing
No part of the equipment shall be designed to be hermetic, pressurised or under vacuum.
The unit shall be designed with venting holes so as to withstand the pressure change during launch
ascent .
6.3.2. Orientation of the unit
The unit shall be capable of operating in any position or during conditions under which it is rotating
around any axis.
6.3.3. Fixation
The details of fixation are given in the applicable Detail specification
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6.4. MATERIAL AND PROCESS
6.4.1. Parts, Materials and Processes
The selections of parts, materials and processes are given in dedicated documents:
- DPL (Declared Parts List)
- DML(Declared Material List)
- DCP (Declared Component List)
6.4.2. Contamination Control
Prior to assembly, all parts used in the switch shall be thoroughly cleaned (externally and internally)
of smudges, loose or spattered solder metal chips and other foreign material. Insulation shall show no
evidence of abrasion, burns or other degradation. Welding shall be free of defects such as cracks,
porosity, undercuts, voids and gaps.
Internal and external parts of the switch shall be free of burr of sharp edges.
Personnel assembling the switch shall wear clothing which are of lint-free fiber.
6.4.3. Finish
All surfaces or the item shall be adequately finished to prevent deterioration from exposure to
specified environments that might adversely affect performance. The finishes of piece parts are
defined in the applicable DML document.
6.5. IDENTIFICATION AND PRODUCT MARKING
6.5.1. Product identification
All unit supplied to this specification shall be identified by self-adhesive label on exterior surface.
The marking shall include as a minimum the following as defined in paragraph 6.5.4
The location of the label shall be such that all information can be easily read without disconnecting
any cable.
6.5.2. Connector identification
Each connector shall be identified as J1, J2, …. According to the applicable Detail specification.
6.5.3. Legibility
Marking shall be so that it is legible without any magnification and shall withstand all influence of
the tests specified herein.
6.5.4. Marking
Each unit shall be marked as a minimum with the following:
- Radiall
- Type of switch
- Radiall Part Number and phase (such as EM, FM, PFM, QM)
- Serial number and Date code
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7. OPERATIONAL REQUIREMENTS
7.1. SAFETY: CONNECTOR SAVERS
Connectors on unit shall be fitted with savers, male-female extensions for connectors during all tests.
If the savers are removed from the unit, the connectors shall be protected by means of dust caps.
The savers may be removed during some specific tests during the acceptance testing sequence.
The number of connectors mating/demating shall be noted.
7.2. TRANSPORTATION AND STORAGE
Unless otherwise specified in the contractor purchase order the units procured to this specification
shall be packaged, packed and marked for shipment as specified herein.
7.2.1. Electrical connectors
Prior to packaging and packing, the electrical connectors shall be capped with a plastic-type dust cap.
Dust cap shall be of a friction fitting type or threaded type which does not require tape or mechanical
device to secure.
7.2.2. Packaging
Each item shall be bagged and sealed in an anti-static polyethylene bag with dry nitrogen gas.
The units shall be placed in a shipping container which shall provide adequate cushioning and
protection from shock, vibration and rough handling experienced in shipment by common carrier.
7.3. ENVIRONMENT
7.3.1. Climatic and Pressure
7.3.1.1. Humidity
The equipment shall take into account a maximum relative humidity of 60% for ground operations,
transportation and storage.
7.3.1.2. Ground operation temperature
Ground operation temperature shall be +22°C ±5°C
7.3.1.3. Ground pressure
The equipment shall take into account a pressure between 80 000 and 110 000 Pa for ground
operations.
The equipment shall take into account a pressure between 20 000 and 105 000 Pa for transportation.
7.3.1.4. Launch and Ascent
The slope of pressure variation shall be 5330 Pa/s during launch vehicle ascent phase
7.3.1.5. Orbit pressure
The unit shall be exposed to a free space vacuum of 1.33.10-8 Pa
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7.3.2. Mechanical
7.3.2.1. Vibration
The unit shall be designed to withstand the vibration loads. The qualification loads are 1.5 times the
flight loads.
The qualification levels for sinusoidal vibration are defined in paragraph 9.8.1
The qualification and acceptance levels for random vibration are defined in paragraph 9.8.2
7.3.2.2. Mechanical shock
The unit shall be designed to withstand the mechanical shocks defined in paragraph 9.9
7.3.3. Thermal
The qualification and acceptance temperature ranges of the unit are defined in paragraph 9.7. The unit
shall fulfil its performance requirements within these temperature ranges
7.3.4. Electric Field (E-field) Shielding Effectiveness
To respect Radiated Emission (RE) and Radiated Susceptibility (RS) requirements, the E-field
shielding effectiveness of the unit shall be higher than values defined in the applicable Detail
specification. The shielding effectiveness shall be expressed in dBi.
7.3.5. Radiation
The maximum allowable level for total dose effect during the radiation life is 1 Mrad (Si).
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8. HARDWARE MODEL DEFINITION
8.1. ENGINEERING MODEL (EM)
An EM shall be fully representative of Flight Models except that a lower standard of electrical
components, material and processes may be used.
A clear status of the EM As design/As built status shall be made available by Radiall.
8.2. QUALIFICATION MODEL (QM) OR ENGINEERING QUALIFICATION MODEL (EQM)
A QM or an EQM shall be built to full standard in accordance with requirements imposed on Flight
Models. Flight standard parts shall be used with the same manufacturer, the same type, the same
package and the same level of testing and screening as for the Flight Models.
The Qualification Model shall be subject to the full equipment level qualification testing. The
Qualification Model or Engineering Qualification Model is not acceptable for subsequent flight use.
8.3. PROTOFLIGHT MODEL (PFM)
The PFM shall be built to full flight standard in accordance with the PA and CADM requirements
imposed on Flight Models. Flight standard parts shall be used.
ProtoFlight Model shall be subjected to protoflight qualification testing.
The ProtoFlight Model is acceptable for subsequent flight use.
8.4. FLIGHT MODEL (FM)
The FM shall be built to full flight standard in accordance with requirements imposed on Flight
Models. Flight standard parts shall be used.
Flight Model shall be subject to flight acceptance testing
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9. VERIFICATIONS AND TESTS
9.1. GENERAL
The requirements for tests/verifications of the unit performance and design characteristics and
operability are specified in this section, which includes:
• Test/Verification matrices
• Engineering evaluation and test requirements to the level of detail necessary to define the
extent of the test program and the objectives of the tests. The specific elements to be
included in the test are specified
• Formal test verification of performance to demonstrate that the unit requirements have
been satisfied
• Verification methods :
¾
Analysis is used in lieu of, or in addition to testing, to verify compliance with
specifications. The technique, typically includes an interpretation, or interpolation and
extrapolation, or analytical or empirical data under defined conditions or reasoning to
show theoretical compliance with stated requirements,
¾
Inspection is an observation or examination of the item against the applicable
documentation to confirm compliance with requirements
¾
Test is an action by which the operability, supportability, performance
capability or other specified qualities of an item are verified when subjected to
controlled conditions that are real or simulated.
* Qualification Testing
Qualification tests are formal contractual demonstrations that the design,
manufacturing, and assembly have resulted in hardware and software
conforming to specification requirements.
* Acceptance Testing
Acceptance tests are the required formal test conducted to demonstrate
acceptability of an item for delivery. They are intended to demonstrate
performance to specification requirements and to act as quality control screens
to detect deficiencies of workmanship, material, and quality
9.2. VERIFICATION MATRIX
The following Table shows verification methods for all requirement:
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REQUIREMENTS
VERIFICATION METHODES
Performance
Inspection Analysis
Test
Frequency bands
X
Insertion Loss
X
Loss Ripple
X
Isolation
X
Power Handling
X
Input & Output VSWR (Return Loss)
X
RF Input & Output Impedance
X
RF Contact Resistance
X
High Level Command (HLC)
X
Dielectric withstanding Voltage
X
Coil DC isolation
X
Indicator Circuit Resistance
X
Protection
X
Dimensions & Mass
X
Center of Gravity
X
Mounting Provisions
X
Interface(Coax. connector & TTC
X
interface)
Design and Construction
X
X
Operating Life
X
X
Storage Life
X
Reliability
X
Humidity
X
Ground Pressure
X
Launch & Ascent
X
Orbit Pressure
X
Vibration
X
Mechanical Shocks
X
Thermal
X
E-Field shielding effectiveness
X
Radiation
X
9.3. TEST CONDITIONS
9.3.1. Ambient environment conditions
The standard ambient parameters (temperature, pressure and relative humidity) shall be recorded
periodically throughout the duration of tests
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9.3.1.1. Temperature
The standard ambient temperature shall be between +15°C and +25°C
9.3.1.2. Atmospheric pressure
The standard ambient pressure shall be between 80 000 and 110 000 Pa.
9.3.1.3. Relative humidity
The standard ambient relative humidity shall be lower than 80%
9.3.2. Tolerances
9.3.2.1. Temperature
The temperature tolerance shall be ±3°C
The maximum temperature limits shall be within +3°C and –0°C
The minimum temperature limits shall be within +0°C and –3°C
9.3.2.2. Temperature stabilization
Temperature stabilization has been reached when three consecutive temperature readings taken 5
minutes apart are within the specified ±3°C temperature tolerance
9.3.2.3. Temperature change
Change from one condition to another shall be done at a rate not exceeding 2°C/minute
9.3.2.4. Pressure
The pressure tolerance shall be ±5% for pressure higher than 13 Pa and ±50% for pressure than
13Pa.
9.3.2.5. Relative humidity
The relative humidity tolerance shall be ±5%
9.3.2.6. Vibration frequency
The frequency of vibration tolerance shall be ±2% at or above 20Hz and ±0.5Hz for frequency
below 20Hz.
9.3.2.7. Sinusoidal vibration amplitude
The sinusoidal vibration amplitude (in grms) tolerance shall be ±10%, acceleration and ±20%,
displacement.
9.3.2.8. Random vibration
The random vibration (in grms) tolerance shall be ±10%
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9.3.2.9. Power spectral density
The power spectral density tolerance shall be ±3dB for frequencies of vibration between 20 and
2000Hz with a minimum analysis bandwidth of 50Hz
The random overall tolerance shall be ±1dB
9.3.2.10. Shock
For frequencies below 1000Hz, shock tolerance shall be ±6dB
For frequencies between 1000 and 6000Hz, shock tolerance shall be either 0/+6dB, or such that
the measured test level is higher than the specified level defined in paragraph 9.9
For frequencies higher than 6000Hz, shock tolerance shall be ±6dB
9.3.2.11. Time
The time tolerance shall be –0/+5%
9.3.2.12. Mass
The accuracy on mass measurement shall be ±0.002Kg or 0.15% whichever is the greater
9.4. INSPECTION 1.0
9.4.1. Visual inspection 1.1
The equipment shall be visually inspected in order to verify the integrity of the following items:
•
Multi-pin connectors,
•
Connectors and connector savers
•
Identification and marking
•
Cleanliness
9.4.2. Mechanical inspection 1.2
The equipment shall be inspected in order to verify the integrity og the following items:
•
Physical dimensions
•
Mass
•
Interface marking
Mass and dimension shall be recorded
9.5. AMBIENT PERFORMANCE TESTS 2.0
The unit shall be tested at ambient temperature and ambient pressure
9.5.1. RF initial ambient performances 2.1
The objective of these tests is to check for the initial switch performances and get initial data base
before performing any thermal, mechanical or shock cycling. These tests are:
•
RF measurements (D tests)
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9.5.2. Electrical ambient performances 2.2
These tests shall be performed to check for the switch integrity after each main step of the test profile
according to figures 9.15 A, 9.15 B and 9.15 C. These tests are:
•
TLM and RF contact resistance (A tests)
•
Isolation (B tests)
•
DC measurements (C tests)
9.6. OPERATING CYCLE 3.0
The unit shall be operated for a total of 500 continuous actuations at minimum operating temperature
and 500 at maximum operating temperature.
The frequency of cycles shall be 6 per minutes
No RF signal shall be applied to RF ports.
The applicable temperature shall be the qualification ones for Qualification Model (QM) and the
acceptance ones for ProtoFlight Model (PFM) and Flight Model (FM).
The indicator contact resistance and RF contact resistance shall be monitored (A tests)
The failure criteria shall be:
•
No missing contact on indicator circuit
•
No dispersion of RF contact resistance value
9.7. THERMAL ENVIRONMENT TESTS 4.0, 5.0
9.7.1. Definitions
Non operating mode: switch shall survive. There are neither actuation nor RF requirements.
Cold RF functional: There are no actuation requirements, RF performance specifications shall apply
only
9.7.2. Qualification temperature limits
The qualification temperature limits shall be defined in table 9.7.2
Operating mode
Non operating mode
Tmin (°C)
Tmax (°C)
Tmin (°C)
Tmax (°C)
-30
+85
-40
+85
Table 9.7.2: Qualification temperature limits
Cold switching
T (°C)
-40
9.7.3. Acceptance temperature limits
The acceptance temperature limits shall be defined in table 9.7.3
Operating mode
Non operating mode
Tmin (°C)
Tmax (°C)
Tmin (°C)
Tmax (°C)
-25
+80
-35
+80
Table 9.7.3: Acceptance temperature limits
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9.7.4. Thermal cycling 4.0
Thermal cycling shall be performed with temperature stabilization and change, defined in paragraph
9.3.2.2 and 9.3.2.3 and within a dry nitrogen chamber or equivalent.
The extreme non operating temperatures have been defined in paragraph 9.7.2 and 9.7.3 according to
specified test level (qualification or acceptance).
Then number of cycles shall be:
•
20 for Qualification Model tests at qualification temperature non operating level
•
10 for ProtoFlight Model tests at qualification temperature non operating level
•
10 for Flight Model tests at acceptance temperature non operating level
9.7.5. Thermal test 5.0
The purpose of these tests is to demonstrate the ability of unit to fulfil all functional and performance
requirements in a thermal environment, which simulates the extreme in-orbit environment with
adequate margin to compensate all tolerances
Thermal test shall be performed with temperature stabilization and change, defined in paragraphs
9.3.2.2 and 9.3.2.3.
The extreme operating temperatures have been defined in paragraphs 9.7.2 and 9.7.3 according to
specified test level (qualification for Qualification & ProtoFlight Models (QM & PFM)) and
acceptance for Flight Model (FM).
The Qualification Model (QM) and the ProtoFlight Model (PFM) shall be submitted to Thermal
Vacuum Test (TVT) at a pressure equal or less to 1.33.10-3 Pa.
The Flight Model (FM) shall be submitted to thermal Ambient Pressure test (TAP) at atmospheric
pressure and under dry nitrogen.
The thermal tests (TVT and TAP) shall be performed using thermal cycling on figures 9.15 A, 9.15 B
and 9.15 C
9.7.5.1. Thermal Vacuum Test (TVT) 5.1
This paragraph defines the TVT test applied to the Qualification Model (QM) and ProtoFlight Model
(PFM)
A group C (DC measurements) test is performed, at ambient temperature and at pressure equal or less
than 1.33.10-3 Pa. Then, using thermal cycles defined in figure 9.15 A
•
11 TVT cycles are performed for Qualification Model (QM), with measurements
defined on figure 9.15 A
•
6 TVT cycles are performed for ProtoFlight Model (PFM), with measurements defined
on figure 9.15 B
9.7.5.2. Thermal Ambient Pressure (TAP) 5.2
This paragraph defines the TAP test applied to the Flight Model (FM).
A group C (DC measurements) test is performed, at ambient temperature and at ambient pressure.
Then, six (6) TAP cycles are performed at atmospheric pressure under dry nitrogen, using thermal
cycle and measurements defined in figure 9.15 C
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9.8. MECHANICAL ENVIRONMENT TESTS 6.0
The unit shall be tested in the worst conditions which can be applied and in each switch position.
The vibration level shall be applied along 3 axes of the box for the qualification (QM & PFM) and
also for the Flight Model (FM).
•
One axis perpendicular to the mating plane
•
Two axes parallel to the mating plane
9.8.1. Sine vibrations 6.1
The Qualification and ProtoFlight Model (QM & PFM) shall be submitted to sine vibration levels as
defined in table 9.8.1
The Flight Model (FM) are not submitted to sine vibration test.
Perpendicular to mating plane (Z axis)
Parallel to mating plane (X & Y axes)
Range (Hz)
Level
Range (Hz)
Level
5-19
5-19
±10mm
±10mm
19-29
19-29
±6.4mm
±6.4mm
29-50
21g
29-50
21g
50-100
20g
50-100
20g
Table 9.8.1: Sinusoidal vibration at qualification level
The Qualification Model (QM) test sweep rate shall be 2 octaves/minute
The ProtoFlight Model (PFM) test sweep rate shall be 4 octaves/minute
The failure criteria shall be no evidence of switch transfer and no mechanical or electrical failure.
9.8.2. Random vibrations 6.2
The Qualification and ProtoFlight Model (QM & PFM) shall be submitted to random vibration levels
as defined in table 9.8.2-A
Perpendicular to mating plane (Z axis)
Parallel to mating plane (X & Y axes)
Range (Hz)
Level
Range (Hz)
Level
20-50
+6dB/oct
20-50
+6dB/oct
50-350
0.8g2/Hz
50-350
0.8g2/Hz
350-376
-12dB/oct
350-376
-12dB/oct
2
376-710
0.6g /Hz
376-710
0.6g2/Hz
710-2000
-4.5dB/oct
710-2000
-4.5dB/oct
Global overall: 28.57 grms
Global overall: 28.57 grms
Table 9.8.2-A: Random vibration at qualification level
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The Flight Model (FM) shall be submitted to random vibration acceptance levels as defined in table
9.8.2-B
Perpendicular to mating plane (Z axis)
Parallel to mating plane (X & Y axes)
Range (Hz)
Level
Range (Hz)
Level
20-50
+6dB/oct
20-50
+6dB/oct
50-350
0.36g2/Hz
50-350
0.36g2/Hz
350-376
-12dB/oct
350-376
-12dB/oct
376-710
0.27g2/Hz
376-710
0.27g2/Hz
710-2000
-4.5dB/oct
710-2000
-4.5dB/oct
Global overall: 19 grms
Global overall: 19 grms
Table 9.8.2-B: Random vibration at acceptance level
The Qualification Model (QM) test duration shall be 3 minutes/axis
The ProtoFlight Model (PFM) and Flight Model (FM) test duration shall be 1 minute/axis
The failure criteria shall be no evidence of switch transfer and no mechanical or electrical failure.
9.8.3. Sine survey 6.3
The Qualification and ProtoFlight Model (QM & PFM) shall be submitted to sine survey vibration
having the following characteristics:
•
Amplitude: 0.5g peak to peak
•
Frequency range: 10Hz to 2KHz
•
Sweep rate: 2 octaves/minute
•
Direction: X, Y and Z axis
•
Equipment non operating
The Flight Model (FM) will not be submitted to sine survey vibrations
9.9. MECHANICAL SHOCK 7.0
The test shall be performed only for Qualification Model (QM), on each axis three times, under the
following conditions:
•
Half sine wave
•
1200g (zero to peak)
•
Duration 0.25 ms
The failure criteria shall be no mechanical or electrical failure.
Switch transfer can occur at this level of shock. In that case, the switch shall recover a normal
configuration at first actuation.
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9.10. LIFE TEST 8.0
This test shall be performed only on Qualification Model (QM)
The switch shall be actuated and set 50 000 times in each of its positions using the following
sequence:
•
10 000 cycles at minimum actuation voltage
•
Electrical ambient performance test
•
15 000 cycles at minimum actuation voltage
•
Electrical ambient performance test
•
10 000 cycles at maximum actuation voltage
•
Electrical ambient performance test
•
15 000 cycles at maximum actuation voltage
•
Electrical ambient performance test
During each cycle, a group A (TLM and RF contact) measurement shall be performed
The test shall be performed at ambient temperature and ambient pressure under dry nitrogen.
9.11. FINAL FUNCTIONAL TESTS 9.0
Final functional test shall be performed within dry nitrogen chamber or equivalent according to
cycles and measurements defined on figures 9.15 A, 9.15 B and 9.15 C
9.12. E-FIELD SHIELDING EFFECTIVENESS- EMC 10.0
E-field shielding effectiveness test shall be performed as described in MIL-STD-1344A Method
3008.
Measurement shall be performed on every model (QM, PFM and FM) for:
•
E-field shielding effectiveness
•
Final test on diodes (reverse voltage if any)
9.13. DOCUMENTATION AND REVIEWS
Results of qualification, acceptance tests and analyses shall be documented and delivered.
All electronic documents are in format file of PDF (Portable Data File)
If not delivered, all data shall be retained by Radiall for a minimum of 5 years during which time it
shall be available at Radiall, if request for review.
Radiall shall deliver variables Data/Reports to the Orderer if required by the Purchase Order
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9.13.1. Qualification data delivered
The data documentation package delivered for a Qualification Model (QM or EQM) shall be
compiled in PDF file and shall be delivered on one CD-Rom by switch.
The documents contained in the CD-Rom are followings:
• Table of Contents
• Qualification test report with annexes
• Interface Control Drawing or Technical Data Sheet
• Product Nomenclature Document
• Declared Material List
• Declared Process List
• Declared Component List
• Test Plan Document
• Test Procedure
• User’s Handbook
• Acrobat Reader software
9.13.2. Acceptance data delivered
The data documentation package delivered for a ProtoFlight Model or/and Flight Model (PFM or/and
FM) shall be compiled in PDF file and shall be delivered on one CD-Rom by batch.
The documents contained in the CD-Rom are followings:
• Table of Contents
• Certificate of Conformity
• Interface Control Drawing or Technical Data Sheet
• Product Nomenclature Document
• Mandatory Inspection Point (performed by Radiall)
• Test Review Board (performed by Radiall if no deviation during the acceptance
test)
• Test Plan Document
• Test Procedure
• User’s Handbook
• Summary Data Results (for each switch, with the worst case value of each
parameters)
• Test Results (for each switch) with :
-Recording value of minimum, average and maximum in frequency band given
in the applicable Detail specification for RF characteristics. No graphs are
given for FM, only for PFM
– Recording value of minimum, average and maximum for Electrical
characteristic
– Pilot graph of accelerator for FM
– Pilot graph and switch response for PFM
– EMC graph
• Acrobat Reader software
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9.14. PERFORMANCE TEST MATRIX
9.14.1. Test performance parameters
Performance
Group of Test Parameter
RF Contact Resistance
GROUP A
TLM and RF contact
Indicator Circuit Resistance
Insertion Loss
GROUP D
Insertion Loss Ripple
Input & Output VSWR (Return Loss)
RF measurements
Isolation
Actuation voltage
GROUP C
Switching Time
Pick-Up voltage
DC measurements
Actuation Current
Dielectric Withstanding Voltage
GROUP B
Isolation
Coil DC isolation
EMC & Functional Diodes
GROUP E
Table 9.15.1: Test performance parameters
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9.14.2. Test matrix for EM, QM, PFM and FM
Test Number
1.1
1.2
10.0
2.1
3.0
2.2
4.0
5.1
5.2
2.2
1.1
6.3
6.1
6.3
6.2
6.3
1.1
2.2
6.3
7.0
6.3
2.2
8.0
2.2
9.0
10.0
1.1
Designation
EM
VISUAL INSPECTION
VIT
X
MECHANICAL INSPECTION
MIT
X
EMC
EMC
RF INITIAL AMBIENT PERFORMANCE
RAP
X
OPERATING CYCLE
OCT
ELECTRICAL AMBIENT PERFORMANCE
EAP
X
THERMAL CYCLING
TCT
THERMAL VACUUM
TVT
THERMAL AMBIENT PRESSURE
TAP
ELECTRICAL AMBIENT PERFORMANCE
EAP
VISUAL INSPECTION
VIT
SINE SURVEY
SST
SINE VIBRATION
SVT
SINE SURVEY
SST
RANDOM VIBRATION
RVT
SINE SURVEY
SST
VISUAL INSPECTION
VIT
ELECTRICAL AMBIENT PERFORMANCE
EAP
SINE SURVEY
SST
MECHANICAL SHOCK
MST
SINE SURVEY
SST
ELECTRICAL AMBIENT PERFORMANCE
EAP
OPERATING LIFE
OLT
ELECTRICAL AMBIENT PERFORMANCE
EAP
FINAL FUNCTIONAL TEST
FFT
EMC
EMC
VISUAL INSPECTION
VIT
Table 9.15.2: Test Matrix for EM, QM, PFM and FM
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QM
X
X
X
X
X
X
X
X
PFM
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
FM
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
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9.14.3. Test legend
1.0 Visual Inspection
1.1 Visual Inspection
1.2 Mechanical Inspection
2.0 Ambient Performance
2.1 Initial RF Ambient Performance
2.2 Electrical Ambient Performance
3.0 Operating Cycle
4.0 Thermal Cycling
5.0 Thermal tests
5.1 Thermal Vacuum
5.2 Thermal Ambient Pressure
6.0 Mechanical Environment Tests
6.1 Sine Vibration
6.2 Random Vibration
6.3 Sine Survey
7.0 Mechanical Shock
8.0 Life Test
9.0 Final functional Measurements, Functional Diodes
10.0 E-Field Shielding Effectiveness – EMC
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QM model test profile
1
3
2.1
2.2
4
20cycles
Temperature
THNOQ
C
E
D
B A
C
A A
C
C
C
C
A
C
A A
1.1
1.2
TCOQ
TCNOQ
Pressure
1atm
C
C
C
C
C
C
6.3 6.3 6.3 A 6.3 A
1.1 6.1 6.2 1.1 7.0 1.1
A
Temperature changerate ≤ 2 °C/mn – Plateau duration ≥30mn
10-5 atm
A
B
C
D
E
RF and Indicator contact resistance
Dielectric withstanding voltage + Coil DC isolation
Actuation voltage & current, Switching time, Pick up voltage
Insertion loss, Isolation, Input and output VSWR
EMC, ESD, Functional diodes
9
8
A
C
A
C
A
7
10
Cycle11
Cycles1to10
A
THOQ
6
5.1
THNOQ : Qualification Non Operating Hot Temperature limit,
TCNOQ : Qualification Non Operating Cold Temperature limit,
THOQ : Qualification Operating Hot Temperature limit,
TCOQ : Qualification Operating Cold Temperature limit.
Figure 9.15 A – Qualification Model (QM) Test Profile
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A
D
C
A
C
A
D
B E
1.1
C
A
D
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PFM model test profile
1
3
2.1
2.2
4
10cycles
Temperature
THNOQ
C
9
10
Cycle 6
Cycles 1to5
C
THOQ
THOA
6
5.1
C
C
C
A
A
D
A
E
D
B A
C
A
C
A A
C
A
C
1.1
1.2
C
6.3 6.3 6.3 A
1.1 6.1 6.2 1.1
A
TCOA
TCOQ
C
TCNOQ
Pressure
1 atm
C
C
C
A
Temperature changerate≤ 2 °C/mn – Plateau duration ≥30mn
10-5 atm
A
B
C
D
E
RF and Indicator contact resistance
Dielectric withstanding voltage + Coil DC isolation
Actuation voltage & current, Switching time, Pick up voltage
Insertion loss, Isolation, Input and output VSWR
EMC, Functional diodes
THNOQ : Qualification Non Operating Hot Temperature limit,
TCNOQ : Qualification Non Operating Cold Temperature limit,
THOQ : Qualification Operating Hot Temperature limit,
TCOQ : Qualification Operating Cold Temperature limit
THOA : Acceptance Operating Hot Temperature limit,
TCOA : Acceptance Operating Cold Temperature limit
Figure 9.15 B – ProtoFlight Model (PFM) Test Profile
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D
B E
C
A
1.1
C
A
D
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FM model test profile
1
3
2.1
2.2
4
10 cycles
Temperature
THNOA
C
B
D A
C
A
C
C
C
C
A
C
A
C
TCNOA
Pressure
C
A
C
C
C
C
A
Temperature change rate ≤ 2 °C/mn – Plateau duration ≥ 30 mn
1 atm
10-5 atm
A
B
C
D
E
D
C
B
AE
1.1 6.2 1.1
A
RF and Indicator contact resistance
Dielectric withstanding voltage + Coil DC isolation
Actuation voltage & current, Switching time, Pick up voltage
Insertion loss, Isolation, Input and output VSWR
EMC, Functional diodes
10
C
A
A
1.1
1.2
TCOA
9
Cycle 6
Cycles 1 to 5
A
THOA
6
5.2
THNOA : Acceptance Non Operating Hot Temperature limit,
TCNOA : Acceptance Non Operating Cold Temperature limit,
THOA : Acceptance Operating Hot Temperature limit,
TCOA : Acceptance Operating Cold Temperature limit.
Figure 9.15 C – Flight Model (FM) Test Profile
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1.1
C
A
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EM model test profile
1
2
Temperature
THNOA
THOA
11
1.2
A
B C
D
TCOA
TCNOA
Pressure
1 atm
10-5 atm
A
B
C
D
E
RF and Indicator contact resistance
Dielectric withstanding voltage + Coil DC isolation
Actuation voltage & current, Switching time, Pick up voltage
Insertion loss, Isolation, Input and output VSWR
EMC, Functional diodes
THNOA : Acceptance Non Operating Hot Temperature limit,
TCNOA : Acceptance Non Operating Cold Temperature limit,
THOA : AcceptanceOperating Hot Temperature limit,
TCOA : Acceptance Operating Cold Temperature limit.
Figure 9.15 D –Electrical Model (EM) Test Profil
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