M24M01-DF
Errata sheet
M24M01-DF package mechanical data modifications
Silicon identification
This errata sheet applies to the M24M01-DF, which is 1 Mbit serial I²C bus EEPROMs, and
specifically to the device delivered in 8-bump wafer-level chip-scale packages (WLCSP).
The impacted part number is M24M01-DFCS6TP/K.
September 2016
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www.st.com
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Contents
M24M01-DF
Contents
1
M24M01-DF physical product change . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Package mechanical data modifications . . . . . . . . . . . . . . . . . . . . . . . . 8
3
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
D and E values corresponding to front side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
D and E values corresponding to back side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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List of figures
M24M01-DF
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
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WLCSP 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
D and E front side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
D and E back side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
D or E side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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M24M01-DF
1
M24M01-DF physical product change
M24M01-DF physical product change
There is not any physical product change.
Figure 1 shows the package outline.
Figure 1. WLCSP 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale
package outline
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The figures below show the difference between D and E dimensions in the front side view
(see Figure 2), back side view (see Figure 3) and side view (see Figure 4).
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M24M01-DF physical product change
M24M01-DF
Figure 2. D and E front side view
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Figure 3. D and E back side view
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M24M01-DF physical product change
Figure 4. D or E side view
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Package mechanical data modifications
2
M24M01-DF
Package mechanical data modifications
This document refers to the changes in dimensions D and E (see Figure 3) described in the
M24M01-DF datasheet, in tables detailing the dimensions of the WLCSP
8-bump package.
D and E values must be modified to correct the following mistake:
•
The D and E values in the M24M01-DF datasheet correspond to front side view (ball
side), instead of back side view (marking side view).
Table 1 and Table 2 report the data for the front and back view, respectively.
Table 1. D and E values corresponding to front side view
Millimeters
Inches
Symbol
Min
Typ
Max
Min
Typ
Max
D
-
2.560
2.580
-
0.1008
0.1016
E
-
1.698
1.718
-
0.0669
0.0676
Table 2. D and E values corresponding to back side view
Millimeters
Inches
Symbol
Min
Typ
Max
Min
Typ
Max
D
-
2.578
2.598
-
0.1015
0.1023
E
-
1.716
1.736
-
0.0676
0.0683
The difference between back side and front side dimension is 18 µm (0.018 mm). This
difference is due to the two-step sawing process, where cut 1 and cut 2 are performed with
blades having different thicknesses (see Figure 4 in which X represents D or E and it has
the same value and tolerance).
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Revision history
Revision history
Table 3. Document revision history
Date
Revision
Changes
07-Jul-2016
1
Initial release.
13-Sep-2016
2
Deleted M24M01-R.
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M24M01-DF
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