Package information - MLP322 Surface mounted, 3 pin package Package outline e L2 e b 4x⍜1 Detail A L D4 Detail A b1 E E4 E2 r L2 D2 D bottom view A2 A A3 A1 DIM Millimeters Inches DIM Millimeters Min. Max. Min. Max. A 0.80 1.00 0.0315 0.0393 A1 0.00 0.05 0.00 0.002 E A2 0.65 0.75 0.0255 0.0295 E2 0.79 0.99 0.031 0.039 A3 0.15 0.25 0.0059 0.0098 E4 0.48 0.68 0.0188 0.0267 b 0.18 0.28 0.0070 0.0110 L 0.20 0.45 0.0078 0.0177 b1 0.17 0.30 0.0066 0.0118 L2 0.125 MAX. 0.005 REF. r 0.075 BSC 0.0029 BSC D 2.00 BSC Min. e 0.0787 BSC Max. Inches 0.65 REF. Min. Max. 0.0255 REF. 2.00 BSC 0.0787 BSC D2 1.22 1.42 0.0480 0.0559 ⍜ 0° 12° 0° 12° D4 0.56 0.76 0.0220 0.0299 - - - - - Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Soldering footprint 2.65 0.1043 1.60 0.0630 0.35 0.0138 1.35 0.0531 0.35 0.0138 0.75 0.0295 0.80 1.20 2.70 0.0315 0.0472 0.1063 0.35 0.0138 2.65 0.1043 0.65 0.0256 Issue 2 - October 2005 © Zetex Semiconductors plc 2005 mm inches 1 www.zetex.com Package information - MLP322 Nominal weight Nominal weight per device 9.1mg. Tape and reel information Orientation Tape width (mm) Reel size (inches) No. of components Tape option indicator 8 7 3,000 TA 8 13 10,000 TC Embossed carrier tape configuration 10 pitches culmulative tolerance on tape ±0.2mm (±0.008”) P0 K D P2 t E Top cover tape See Note 1 A0 F See Note 1 B1 W B0 K0 See Note 1 P D1 Center lines of cavity Embossment User direction of feed Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P Tape size (mm) 8 12 * 16 * See note 4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 ± 0.10 3.50 ± 0.10 (0.138 ± 0.004) 4.00 ±0.10 (0.157 ± 0.004) See note 8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 5.50 ± 0.05 (0.217 ± 0.002) 4.00 ±0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 4.00 ± 0.10 2.00 ± 0.05 0.40 8.00 (0.315) 4.00 ± 0.10 2.00 ± 0.05 0.40 12.00 ± 0.30 (0.472 ± 0.012) P0 P2 t (max.) W 24 * See note 12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 7.50 ± 0.10 (0.295 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 12.00 ± 0.10 (0.472 ± 0.004) 4.00 ± 0.10 2.00 ± 0.05 0.40 16.30 (0.642) See note* 20.10 (0.791) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 11.50 ± 0.10 (0.453 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) to 20.00 ± 0.10 (0.787 ± 0.004) in 4.00 (0.157) increments 4.00 ± 0.10 2.00 ± 0.05 0.40 24.30 (0.957) NOTES: * A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements (see fig. 1). Issue 2 - October 2005 © Zetex Semiconductors plc 2005 2 www.zetex.com Package information - MLP322 20° maximum 0.5mm maximum 0.5mm maximum Component cavity center line B0 20° maximum Component center line Component lateral movement Component rotation - side view A0 Component rotation - top view Figure 1 - rotational and lateral movement Reel configuration Tape slot in core for tape start. 2.5mm min. width, 10mm min. depth T B D A C N Full radius G Tape size A (max.) B (min.) C D (min.) N (min.) G T (max.) 8mm 179 (7.047) 1.5 (0.06) 13.00 ±0.02 (0.512 ±0.008) 25.0 (0.984) 50 (1.969) 8.4 +1.5 –0.0 (0.33 +0.06 – 0.00) 14.4 (0.567) 12mm 330 (12.992) 1.5 (0.06) 13.00 ±0.02 (0.512 ±0.008) 20.2 (0.795) 50 (1.969) 12.4 +2.0 –0.0 (0.49 +0.079 – 0.00) 18.4 (0.724) 16mm 330 (12.992) 1.5 (0.06) 13.00 ±0.02 (0.512 ±0.008) 20.2 (0.795) 50 (1.969) 16.4 +2.0 –0.0 (0.65 +0.079 – 0.00) 22.4 (0.882) 24mm 330 (12.992) 1.5 (0.06) 13.00 ±0.02 (0.512 ±0.008) 20.2 (0.795) 60 (2.362) 24.4 +2.0 –0.0 (0.96 +0.079 –0.00) 30.4 (1.197) This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. Issue 2 - October 2005 © Zetex Semiconductors plc 2005 3 www.zetex.com