Package information - MLP322
Surface mounted, 3 pin package
Package outline
e
L2
e
b
4x⍜1
Detail A
L
D4
Detail A
b1
E
E4
E2
r
L2
D2
D
bottom view
A2
A
A3
A1
DIM
Millimeters
Inches
DIM
Millimeters
Min.
Max.
Min.
Max.
A
0.80
1.00
0.0315
0.0393
A1
0.00
0.05
0.00
0.002
E
A2
0.65
0.75
0.0255
0.0295
E2
0.79
0.99
0.031
0.039
A3
0.15
0.25
0.0059
0.0098
E4
0.48
0.68
0.0188
0.0267
b
0.18
0.28
0.0070
0.0110
L
0.20
0.45
0.0078
0.0177
b1
0.17
0.30
0.0066
0.0118
L2
0.125 MAX.
0.005 REF.
r
0.075 BSC
0.0029 BSC
D
2.00 BSC
Min.
e
0.0787 BSC
Max.
Inches
0.65 REF.
Min.
Max.
0.0255 REF.
2.00 BSC
0.0787 BSC
D2
1.22
1.42
0.0480
0.0559
⍜
0°
12°
0°
12°
D4
0.56
0.76
0.0220
0.0299
-
-
-
-
-
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
2.65
0.1043
1.60
0.0630
0.35
0.0138
1.35
0.0531
0.35
0.0138
0.75
0.0295
0.80
1.20
2.70
0.0315 0.0472
0.1063
0.35
0.0138
2.65
0.1043
0.65
0.0256
Issue 2 - October 2005
© Zetex Semiconductors plc 2005
mm
inches
1
www.zetex.com
Package information - MLP322
Nominal weight
Nominal weight per device 9.1mg.
Tape and reel information
Orientation
Tape width
(mm)
Reel size
(inches)
No. of
components
Tape option
indicator
8
7
3,000
TA
8
13
10,000
TC
Embossed carrier tape configuration
10 pitches culmulative
tolerance on tape
±0.2mm (±0.008”)
P0
K
D
P2
t
E
Top cover
tape
See Note 1
A0
F
See Note 1
B1
W
B0
K0
See Note 1
P
D1
Center lines
of cavity
Embossment
User direction of feed
Dimensions
mm (inches)
A0, B0, K0
B1 (max.)
D
D1 (max.)
E
F
P
Tape size (mm)
8
12
*
16
*
See note
4.55 (0.179)
1.50 + 0.10 - 0.00
1.00 (0.039)
1.75 ± 0.10
3.50 ± 0.10
(0.138 ± 0.004)
4.00 ±0.10
(0.157 ± 0.004)
See note
8.20 (0.323)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
5.50 ± 0.05
(0.217 ± 0.002)
4.00 ±0.10
(0.157 ± 0.004)
8.00 ±0.10
(0.315 ± 0.004)
4.00 ± 0.10
2.00 ± 0.05
0.40
8.00 (0.315)
4.00 ± 0.10
2.00 ± 0.05
0.40
12.00 ± 0.30
(0.472 ± 0.012)
P0
P2
t (max.)
W
24
*
See note
12.10 (0.476)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
7.50 ± 0.10
(0.295 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
8.00 ±0.10
(0.315 ± 0.004)
12.00 ± 0.10
(0.472 ± 0.004)
4.00 ± 0.10
2.00 ± 0.05
0.40
16.30 (0.642)
See note*
20.10 (0.791)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
11.50 ± 0.10
(0.453 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
to 20.00 ± 0.10
(0.787 ± 0.004)
in 4.00 (0.157)
increments
4.00 ± 0.10
2.00 ± 0.05
0.40
24.30 (0.957)
NOTES:
* A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements
(see fig. 1).
Issue 2 - October 2005
© Zetex Semiconductors plc 2005
2
www.zetex.com
Package information - MLP322
20° maximum
0.5mm
maximum
0.5mm
maximum
Component
cavity
center line
B0
20° maximum
Component
center line
Component
lateral movement
Component rotation - side view
A0
Component rotation - top view
Figure 1 - rotational and lateral movement
Reel configuration
Tape slot in core
for tape start.
2.5mm min. width,
10mm min. depth
T
B
D
A
C
N
Full radius
G
Tape
size
A (max.)
B
(min.)
C
D
(min.)
N
(min.)
G
T
(max.)
8mm
179
(7.047)
1.5
(0.06)
13.00 ±0.02
(0.512 ±0.008)
25.0
(0.984)
50
(1.969)
8.4 +1.5 –0.0
(0.33 +0.06 – 0.00)
14.4
(0.567)
12mm
330
(12.992)
1.5
(0.06)
13.00 ±0.02
(0.512 ±0.008)
20.2
(0.795)
50
(1.969)
12.4 +2.0 –0.0
(0.49 +0.079 – 0.00)
18.4
(0.724)
16mm
330
(12.992)
1.5
(0.06)
13.00 ±0.02
(0.512 ±0.008)
20.2
(0.795)
50
(1.969)
16.4 +2.0 –0.0
(0.65 +0.079 – 0.00)
22.4
(0.882)
24mm
330
(12.992)
1.5
(0.06)
13.00 ±0.02
(0.512 ±0.008)
20.2
(0.795)
60
(2.362)
24.4 +2.0 –0.0
(0.96 +0.079 –0.00)
30.4
(1.197)
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 2 - October 2005
© Zetex Semiconductors plc 2005
3
www.zetex.com