GRID.pdf
GRIDMay
.pdf
2010
CHAPTER MEETINGS
Conference Calendar
SF-IAS - 4/27 | Tier 4a Interim Emissions Standards - 751HP+ standby
engines, installation guide ...
[more]
May 16-21: Conference on Lasers and Electro-Optics
(CLEO/QELS) - San Jose Convention Center
[more]
SCV-CE - 4/27 | Gigapan: Tool for Image Manipulation - project details,
create, stitch, pan, zoom, interface ...
[more]
SCV-PSES+Rel - 4/27 | How to Avoid Being the Next Toyota - panel
discussion, vulnerability, what do to, fundamental issues ...
[more]
SCV-Mag - 4/29 | Biomagnetics: An Interdisciplinary Field where
Magnetics, Biology and Medicine Overlap - weak brain fields ... [more]
May 18-19: Social Media Strategies Conference
[more]
- Hyatt Regency Hotel, Santa Clara
May 23-28: IEEE-MTT International Microwave
Symposium - Anaheim Convention Center
[more]
SCV-SSC - 4/29 | Power-Efficient Data Converters - optimal resolution,
noise sources, trade-offs, design examples ...
[more]
May 24-25: Netbook Summit
- Hyatt Regency Hotel, SF Airport
[more]
SCV-CS+ComSoc - 4/29 | Faultline Brewery Social - Networking with food
and beverage ...
[more]
June 7-9: IEEE Int’l Interconnect Technology
Conference - Hyatt Regency Hotel, SF Airport
[more]
OEB-Mag - 4/30 | Biomagnetics: An Interdisciplinary Field where
Magnetics, Biology and Medicine Overlap - impedance MRI ...
[more]
SCV-RAS - 5/6 | Next-Generation MEMS Inertial Sensors - vehicles,
consumer electronics, etching, wafer bonding, packaging ...
[more]
SCV-TMC - 5/6 | Secrets of Successful Networking: Professional
Networking for Engineering Professionals - connections, plan ... [more]
UCSC+NOVA - 5/7 | Take Your Career To the Next Level - Career
Forum, using social media, transitioning ...
[more]
SCV-EDS - 5/11 | Directions for Silicon Technology Development as
We Approach the End of CMOS Scaling - tunneling, 15nm node... [more]
SCV-CS - 5/11 | Supercomputing at NASA: Current Impact, Future
Challenges - fully-integrated, modeling, analysis, application porting ... [more]
SCV-EMC - 5/11 | How to Apply Shielded Cables to Solve More
[more]
Problems than You Create - signal integrity, crosstalk ...
June 13-18: 47th Design Automation Conference
(DAC)
- Anaheim Convention Center
[more]
June 21-25: TechConnect World Conference and
Expo
- Anaheim Convention Center
[more]
July 19-23: O'Reilly Open Source Convention
(OSCON) - Oregon Convention Center, Portland
[more]
CALL FOR PAPERS:
Nov 7-10: 44th Annual Asilomar Conf on Signals,
Systems, and Computers - Pacific Grove
[more]
- Submit abstracts by June 1
SCV-CPMT - 5/12 | Winner Take All: How Competitiveness Shapes the
Fate of Nations - industrial base, exports, America losing ...
[more]
Career Development
Professional Skills Courses
SCV-ComSoc - 5/12 | The Last Mile Smart Grid WAN Challenge Few
[more]
Understand - matching load to supply, security issues, bandwidth ...
- Managing for Managers - Collaborative Negotiating
- Managing Time and Multiple Priorities - and more
OEB-IAS - 5/13 | Approaches to Arc Flash Hazard Mitigation - letthrough energy, bolted fault, energy reduction ...
[more]
OEB-Mag - 5/17 | Novel Magnetic Materials and Magnetic Devices ferrites, magnetic films, nanoparticles, RF devices ...
[more]
SCV-Phot - 5/19 | Half a Century of Lasers: How it All Got Started Bell Labs, ARPA, Columbia, IBM, Hughes Research ...
[more]
SCV-EMBS - 5/19 | Applying Therapeutic Device Innovation To
Clinical Medicine: The Evalve Story - physician's perspective ...
[more]
IEEE-USA - 5/20 | Link Your Business Plan to Your Financing Needs
[more]
- Webinar (part 1 of 5): best market, strategy, minimizing capital ...
SCV-CE - 5/25 | Electronics Manufacturing by Inkjet Printing - digital
nature, passives, actives, particle size, viscosity ...
[more]
SCV-Mag - 5/25 | Overview of Recent Developments in HAMR
Technology - areal density, bit-patterned media, magnetic recording ...
[more]
SF-IAS - 5/25 | Arc Flash Management and Technology & Plant Tour
- safety, new approaches, technologies, minimizing risk ...
[more]
May 27 and beyond – Next Page ==
May 2010
www.e-grid.net
[more]
Chapter Seminars
SCV-MTT - 5/1 | Short Course: RF and Microwave
Design for Future Technologies - full day
[more]
SCV-Nano - 5/18-19 | Nanotechnology – State of the
[more]
Art and Applications - 2-day symposium
Technical Classes at UC-SC Extension
[more]
Packet Capture and Analysis - Perl Programming - SW Test
Automation - Computer Networking Essentials. . . and more
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IEEE GRID
Continued from previous page …
CHAPTER MEETINGS
SCV-CPMT - 5/27 | Thermal Management for the Design of Telecom
and Server Systems - CFD, testing, wind tunnels, plus lab tour ...
[more]
Your Networking Partner ®
OEB-Mag - 5/28 | Multiscale Magnetic Models - From Electronic
Structure to Device Design - nanoscale structure, phase transition... [more]
May 2010 • Volume 57 • Number 5
SCV-CS+SSC - 6/8 | 48-Core Cloud Computer Chip - DDR3 memory, 6×4
2D-mesh packet-switched network-on-chip, power ...
[more]
IEEE-SFBAC ©2010
SCV-CPMT - 6/9 | Novel Fine Pitch, Low Profile, Low Cost Connector
Technology - lithography, PCB-based, signal integrity, characteristics ... [more]
DIRECTORS
Santa Clara Valley
Ram Sivaraman
Allen Earman
(Alt: Fred Jones)
Oakland East Bay
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Bill DeHope
San Francisco
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Dan Sparks
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IEEE GRID is the monthly newsmagazine of the San
Francisco Bay Area Council of the Institute of Electrical and
Electronics Engineers, Inc. As a medium for news for
technologists, managers and professors, the editorial
objectives of IEEE GRID are to inform readers of
newsworthy IEEE activities sponsored by local IEEE units
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Bay Area; to publicize locally sponsored conferences and
seminars; to publish paid advertising for conferences,
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May 2010
SCV-Nano - 6/15 | Nanophosphors: Lighting to Life Sciences - quantum
confinement, surface-to-volume ratio, efficiency, stability ...
[more]
OEB-IAS - 6/17 | Cyber Security for Industrial Control Systems vulnerabilities, process monitoring, backbone systems ...
[more]
OEB-Mag - 6/21 | An Investigation of Magnetic Reversal at Almost the
[more]
Nanoscale - field-induced reversal, vortex, propagation ...
SCV-Mag - 6/22 | An Investigation of Magnetic Reversal at Almost the
Nanoscale - magnetic force microscope, vortex, propagation ...
[more]
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wider
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May 2010
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IEEE Professional Skills Courses
SCV Chapters, Technology Management & Components,
Packaging and Manufacturing Technology Societies
Transitioning from Individual
Contributor to Manager
Managing Time & Multiple Priorities
–
–
Date/Time: Thursday, May 6, 8:30 AM – 4:30 PM
Location: – Brocade, San Jose
Fee: $400 for IEEE Members; $500 non-members
“10 out of 10! This workshop is one of the most effective
workshops I have ever been to.”
Engineer Project Lead, Cypress Semiconductor
Managing Managers
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Date/Time: Tues-Wed, May 18-19, 9 AM – 5 PM
Location: – TIBCO Software, Palo Alto
Fee: $625 for IEEE Members; $700 non-members
Clear Business, Technical, and
E-Mail Writing
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Date/Time: Tues, May 25, 8:30 AM – 4:30 PM
Location: – Informatica, Redwood City
Fee: $425 for IEEE Members; $500 non-members
“Very practical and can use all lessons immediately in real life.”
-Cisco, Manager
Upgrade your skill set – prepare for future challenges
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Date/Time: Friday, June 11, 9:00AM-1:00PM
Instructor: Peter Turla
Location: Synopsys, Sunnyvale
Fee: $300 for IEEE Members; $350 non-members
This is the best class I have ever taken. Brilliant! Thoroughly
enjoyed it and will recommend to all my colleagues.
eBay, Inc. Attendee
Presentation Skills
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Date/Time: Tues, June 15, 9 AM – 5 PM
Location: – Cypress Semiconductor, San Jose
Fee: $500 for IEEE Members; $550 non-members
"I enjoyed this class very much. I thought it was very
informative and useful. It really made me more aware
of how I can organize my time."
For complete course information, schedule, and
registration form, see our website:
www.EffectiveTraining.com
Sponsored by IEEE MTT
2010
INTERNATIONAL
MICROWAVE SYMPOSIUM
During Microwave Week, there are 32 Workshops,
3 Short Courses, 98 Oral Sessions, 6 Interactive Forums,
9 Panel Sessions, and 13 Focused and Special Sessions
to attend, in addition to the Exhibits. Be here!
Technical Papers
Original research, development, and application work on radiofrequency and microwave theory and techniques, in the various
areas within this broad discipline.
Sessions
- Power-Amplifiers at HF, VHF, UHF, and GHz Signal
Processing - Microwave Photonics and Low Noise Receivers
- Guiding and Radiating Structures - Metamaterial Structures,
Phenomena and Applications - Advanced Millimeter-Wave
Packaging - MEMS Switches - Novel Techniques for Planar
Filter Design - RF and Microwave in Medicine - Power
Amplifier System Concepts - Microwave Photonic Technologies
- RFID and power harvesting technologies - High-speed Signal
Processing Circuits - Power Amplifier Circuits - Terahertz
Electronics - MMIC Packaging - Silicon-based MillimeterWave Integrated Circuits - Active Device Modeling - Impact of
Nanoelectronics on RF Technology - Advancements in Passive
Circuitry - Biological Effects and Medical Applications of RF
and Microwave - Non-Planar Passive Filters and Multiplexers
… and many more.
Special Sessions
Focused, honorary, and panel/rump sessions, dedicated to
specific topics to allow an in-depth discussion of those topics.
May 2010
May 23-28, 2010
Anaheim Convention Center
Exhibition dates: May 25-27
Workshops
From expert-level seminars to tutorials and short courses, aimed
at various levels of expertise and interest. Topics include:
- Software Defined Radio - Ultra-Wideband (UWB) Technology
- High Speed Signal Integrity - MOSFET Modeling for RFIC
Design - Power Management for Integrated RF Circuits - RF
Packaging Solutions - Microwave Filter Synthesis - Making
Reliable Measurements - RF MEMS For Antennas and Front
Ends - Low Phase Noise Oscillators - The Expanding Role of
GaN - Wireless Power Transmission - Optical Modulator
Technologies… and many more.
Applications Seminars
MicroApps, presented by industry speakers who will introduce
recent developments in products and processes employed in
fabrication, instrumentation, computer-aided design, and field
deployment of technologies at the cutting edge.
Earlybird Rates thru May 7 – Members save $200
For more information, and to register:
www.ims2010.org
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Page 4
UPCOMING CLASSES
FOR ENGINEERS –
IN SANTA CLARA
UCSC Extension offers practical engineering courses
in Silicon Valley and online to help hardware,
software and IT professionals develop and advance
their skills.
We are the largest professional
engineering educator in Silicon Valley.
Check out our brand new facility at 2505 Augustine
Drive, Santa Clara, near the Great America Parkway/
Bowers Ave exit off Hwy 101. This move makes our
career-oriented courses even more accessible to the Silicon
Valley engineering community.
Mixed Signal IC Verification with Verilog-AMS
(22183) Starting May 8
Packet Capture and Analysis (1990) Starting May 11
Perl Programming I (2856) Starting May 17
Software Test Automation (4882) Starting May 24
Computer Networking Essentials
(2458) Starting June 18
Embedded System-on-Chip Design Using Verilog
(21959) Starting June 19
Smart Grid, Intro (22867) Starting June 21
“Real-time" courses, and "real-world" instructors
– Take one course or a whole certificate.
Find out more. Request our Program Brochure
with year-round Course Tables:
www.ucsc-extension.edu*
Subscribe to our topic-specific email Newsletters.
Discount for early registration.
Free Open House Event for Embedded Systems and
VLSI Engineering Programs (22403) on June 9
.
To view the full spring catalog, visit
www.ucsc-extension.edu*
July 19-23, 2010
Oregon Convention Center
Portland
– 100's of sessions -- Practical tutorials
– Expo Hall: latest tools, projects, services, products
"Ground zero for the open source alpha geek tribe."
Jon Udell, Infoworld
The whole spectrum of open source, including
Linux, MySQL, the LAMP stack, Perl, Python, Ruby
on Rails, middleware, applications, cloud computing,
and more -- always great keynotes, tutorials, and
evening Birds-of-a-Feather sessions. Migrate from
expensive
commercial
installations;
explore
innovations; analyze new tools & software; learn
essential techniques & advanced tips.
Rapid change presents opportunity as well as
challenges. Open source isn't just about being costeffective – it's leading in innovation. OSCON is five
days jam-packed with everything open source—and
the people who are moving it forward. Learn from
those who have already done it.
Diamond Sponsor
Platinum Sponsor
Gold Sponsor
Tracks: - Business - Cloud Computing - Community Databases - Education - Government - Hardware Java -Javascript - Mobile - Operations - Perl
- PHP - Python - Ruby - Tools & Techniques
40 Short Courses, including: - PHP Quality Assurance
- Android for Java Developers - 3D Animation with Blender
- Advanced Vim - Mastering Perl - Building Native Mobile
Apps Using Open Source - Get Started with the Arduino
- The Gearman Cookbook - The Productive Programmer
- Django Deployment - PostgreSQL Reloaded - Faster
Python Programs
- Practical Erlang Programming
- Google App Engine - Drizzle in Depth - Catalyst 5.80
- Practical Python Patterns - Hands-on Cassandra
May 2010
OSCON welcomes everyone passionate about open
source, from developers, designers, trainers, and
programmers to sys admins, IT managers, hackers,
and entrepreneurs.
Save $250 – Register by June 2.
Save an additional 20% off – use
discount code os10iee at check-out and save.
www.e-grid.net/conf/oscon.html
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Page 5
Leveraging Social Media to achieve your business goals
-Social Media is the new enabler for business. It is
becoming the touch point connecting all components
of a business -- our customers, partners, suppliers
and employees. Businesses of all types and sizes
are leveraging social media for strategic and tactical
initiatives. Attend, Learn, Plan.
Workshops:
- How to Market your Business on Facebook
Top Presentations:
What You Will Learn:
- Leveraging Social Media for Business - Tapping into the
Power of Employees - Social Media Marketing - True Drivers
of a Successful Strategy Best and Worst of Social Media
Practices - Overcoming Objections - Branding, Reputation
Management & Legal Issues - Thinking Vertically Across Social
Media - - Tools For Social Media Marketing ... and more.
Who Should Attend:
• Chief Marketing Officers • Social Media Strategists • Social
Media Marketers & Online Advertisers • Online Community
Managers • Interactive Agency Professionals • Search Engine
Optimization Specialists • Web Marketers • e-Commerce
Managers
• Web Analytics Professionals
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Communications & PR • Recruiting Professionals
How you market your Facebook Fan Page to
increase revenue, drive website visitors and create
brand awareness through customer engagement
- How to Market on Twitter and YouTube
• How to create an effective Social Media strategy
• How to measure the effectiveness of your social media strategy
• Best practices to track, analyze, and improve your social media
marketing campaigns
Optimization techniques to increase usage and engagement of
social media tools and applications
• Trends and future direction of social media and how you can
best position your business to benefit.
Use coupon code "ieee2010" for $100 discount
For information and to register, visit
www.e-grid.net/conf/sms.html
IEEE Electron Devices Society
IEEE 2010 International Interconnect Technology Conference
June 7-9, 2010 Hyatt Regency SF Airport Hotel, Burlingame
The thirteenth annual IITC is sponsored by the IEEE
Electron Devices Society as a premier conference for
interconnect technology. IITC provides a forum for
professionals and researchers in semiconductor
processing,
advanced
materials,
equipment
development, and interconnect systems to present
and discuss exciting new science and technology.
Sessions:
- System Scaling - Systems and Interconnects
Integration - Materials And Unit Process Memory & MEMS - Packaging, 3D & TSV and Characterization
- Novel Materials and
- Plus poster sessions
- Process
Back-End
Reliability
Concepts
New Focus:
Interconnect to Interconnections and Interfaces (for "More
Moore" and "More than Moore" technologies)
May 2010
Short Course (Sunday, June 6)
Topics: - Future Interconnects:
Options, Challenges and Advances
- Advanced Patterning Techniques for
Interconnect Scaling - Plasma
Process Challenges for Porous SiOCH
Patterning - The Impact of
Interconnect on Processor Architecture
- Storage-Class Memory - Modeling Variation
Register for the full conference,
or only the Short Course:
www.his.com/~iitc
IITC invites companies to exhibit products, materials and
analytical tools related to interconnect technology.
Suppliers are also invited to participate in Supplier
Seminars which will be offered in the evenings on June 8
and 9. Contact iitc@his.com
Visit us at w w w .e - G R I D . n e t
Page 6
The Netbook Summit provides attendees
with practical information on the role of
netbooks,
using
netbooks
effectively,
developing software for netbooks, netbooks
in education, making netbooks perform
better, and expanding netbooks. Netbooks
are small, thin, lightweight and energy
efficient portable computers that have
experienced
explosive
growth
among
consumers, students, and even business
users looking for an easy to use, mobile,
and cost effective alternative to a full size
notebook computer.. Netbooks/tablets are
optimized to accommodate the user with a
longer battery life, and are lightweight and
less
intrusive
than
a
larger
laptop.
Convenience and cost are key factors for
these products, making them ideal for
students
at
any
level
as
well
as
professionals in a variety of market
segments that are continually on the go.
Challenges
facing
netbooks:
extending
battery life, improving graphics, simplifying
loading of software, improving performance,
providing software better-suited to the
environment, and typical applications.
Join industry leaders from: Adobe, ARM, Asus,
AT&T, Broadcom, CA, Dell, McAfee, Microsoft, Mozy,
NVIDIA, Phoenix, Samsung, Skype, and Toshiba, as
well as startups and new entries.
“The netbook has become one of the most popular
consumer devices in the market today, but its true
potential has been limited by applications that are not
optimized for its mobility and smaller screen size.”
– Renee James, VP, Intel, September 2009
Sponsored by Dell, AMD,
Toshiba and LAPTOP Magazine
Join the Revolution in Low-Cost
Mobile Computing
May 2010
Half-DayTutorials
to bring you up to date on the latest developments
- Nebooks in the Enterprise
- Improving
Netbook Performance - Networking Netbooks
- Netbook Security
Sessions
- New Paradigms in Networks - Doing More
with Netbooks
- Netbooks in Education
- Operating System Shootout (Windows, Linux,
Android, Chrome, etc.) - Storage/Backup for
Netbooks - Applications - Netbooks: The New
Hub of Distributed Computing
- Processor
Shootout (Atom, ARM, others) - Market Research
Panel: Netbook Report Card What Has Happened in the Past Year; Where We Are Heading
Keynotes
by NVIDIA, AMD, Dell, and Asus
Unique “Ask the Experts” session
for one-on-one interaction
Shootouts
on Processors, Operating Sy stems, Platforms
All Industry Reception (in Exhibit Hall)
Evening Open:
- Beer, Pizza and Chat with the Experts
- Kishore Jotwani, Atheros Communications;
- Sasch Pallenberg, Netbook News; - Rob
Halligan, Syncables; - Walker Blount, WebFeet Research; - Don Ry an, CMB; - Mary
Lasica and Linda Uhrenholt, AT&T; - Bob
Morris, ARM; - Simon Hunt, McAfee
Free pass for Exhibits and Open Sessions
Discounts are available to qualified educators
and government employees
Save $300 through May 19 t h
www.netbooksummit.com
Special exhibitor packages still available:
contact Kat Pate, 505.238.3208, or
email kat@netbooksummit.com
Visit us at w w w .e - G R I D . n e t
Page 7
May 2010
Visit us at w w w .e - G R I D . n e t
Page 8
CALL FOR PAPERS
th
44 Annual Asilomar Conference on
Signals, Systems, and Computers
Asilomar Hotel and Conference Grounds
Pacific Grove, California
November 7-10, 2010
www.asilomarssc.org
Authors are invited to submit papers before June 1st, 2010, in the following areas:
A. Communications Systems: 1. Error Control Coding,
2. CDMA, 3. Modulation and Detection, 4. Performance Bounds,
5. Synchronization, 6. Ultra Wideband, 7. OFDM / Multicarrier,
8. Wireless Communications, 9. Optical Communications,
10. Cognitive SDR, 11. Adaptive Waveform Design
B. MIMO Communications and Signal Processing:
1. Space-Time Coding and Decoding, 2. Channel Estimation and
Equalization, 3. Multi-User and Multi-Access Methods,
4. Cooperative Diversity.
9. Compressive Sensing, 10. Information Theoretic Signal Processing,
11. Spectral Analysis
F. Biomedical Signal and Image Processing: 1. Medical Image
Analysis, 2. Imaging Modalities, 3. Advances in Medical Imaging,
4. Biomedical Signal Processing, 5. Biomedical Applications,
6. Bioinformatics, 7. Image Registration and Multi-modal Imaging,
8. Image Reconstruction, 9. Computer Aided Diagnosis, 10. Functional
Imaging, 11. Visualization
G. Architecture and Implementation: 1. Programmable and
C. Networks: 1. Transmission Techniques for Ad Hoc
Networks, 2. Wireless Sensor Networks, 3. Network Information
Theory, 4. Optical Networks
Reconfigurable Architectures, 2. SOC Architectures, 3. Low-power
Methods, 4. Compilers and Tools, 5. Integrated Algorithm and
Architecture Implementation, 6. Computer Arithmetic, 7. Numerical
Processing
D. Adaptive Systems and Processing: 1. Adaptive Filtering,
2. Fast Algorithms for Adaptive Filtering, 3. Frequency-Domain
and Subband Adaptive Filtering, 4. Adaptive Blind Processing
E. Array Processing and Statistical Signal Processing:
1. Array Processing and Beamforming, 2. Sonar and Acoustical
Array Processing, 3. Radar Array Processing, 4. Remote Sensing,
5. Signal Separation, 6. Estimation and Detection, 7. NonGaussian and Nonlinear Methods, 8. Identification,
H. Speech, Image and Video Processing: 1. Speech Processing,
2. Speech Coding, 3. Speech Recognition, 4. Narrowband / Wideband
Speech and Audio Coding, 5. Document Processing, 6. Models for Signal
and Image Processing, 7. Image and Video Coding, 8. Image and Video
Segmentation, 9. Image and Video Analysis, 10. Image / Video Security,
Retrieval and Watermarking, 11. Image and Video Enhancement /
Filtering, 12. Biometrics and Security, 13. Wavelets
Submissions should include a 50 to 100 word abstract and an extended summary (500 to 1000 words, plus figures). Submissions must
include the title of the paper, each author's name and affiliation, and the technical area(s) in which the paper falls with number(s) from the
above list. Check the conference website (www.asilomarssc.org) for specific information on the electronic submission process. Submissions
will be accepted starting February 1, 2010. No more than FOUR submissions are allowed per contributor, as author or co-author. All
submissions must be received by June 1st, 2010. Notifications of acceptance will be mailed by mid August 2010, and author information
will be available on the conference website by late August 2010. Full papers will be due shortly after the conference and published in early
2011. All technical questions should be directed to the Technical Program Chair, Dr. Miloš Doroslovački, e-mail doroslov@gwu.edu, or
the General Chair, Dr. Linda DeBrunner, e-mail linda.debrunner@fsu.edu.
CONFERENCE COMMITTEE
General Chair:
Technical Program Chair:
Conference Coordinator:
Publication Chair:
Publicity Chair:
Finance Chair:
Linda DeBrunner, Florida State University
Miloš Doroslovački, The George Washington University
Monique P. Fargues, Naval Postgraduate School
Michael Matthews, ATK Mission Research
Murali Tummala, Naval Postgraduate School
Frank Kragh, Naval Postgraduate School
The site for the 2010 Conference is at the Asilomar Conference Grounds, in Pacific Grove, CA. The grounds border the Pacific Ocean and
are close to Monterey, Carmel, and the scenic Seventeen Mile Drive in Pebble Beach.
The Conference is organized in cooperation with the Naval Postgraduate School, Monterey, CA, and ATK Mission Research, Monterey,
CA. The IEEE Signal Processing Society is a technical co-sponsor of the conference.
May 2010
Visit us at www.e-GRID.net
Page 9
Matching Innovative Solutions to Real-World Challenges
June 21-24, 2010, Anaheim, CA
Anaheim Convention Center
Over 150 sessions
16 Short Courses (June 21)
TechConnect World brings together over 5,000
business and technical professionals including leading
researchers, entrepreneurs, corporate business
developers,
investors,
service
providers,
commercialization/tech transfer officers, industry
analysts and members of the media. Five world-class
events combine to create an extraordinary week
where innovative technology solutions are matched to
real world business challenges.
TechConnect Innovation Showcase
“Transforming The World One Technology At A Time”
The largest innovation showcase dedicated to technologies still in
development! Find partners to help make your organization’s
technology breakthrough a commercial reality. Modeled on the
incredible success of the ARPA-E Energy Innovation Showcase
in Washington, DC, this past March, TechConnect World is
extending this opportunity to the West Coast and to a broader
range of technology solutions.
FOCUS AREAS:
CleanTech: Power Electronics, Photovoltaics,
Energy Storage, Renewable Energy, Infrastructure.
NanoTech: Fabrication, Characterization, Tools,
Materials, Electronics & Microsystems, Medical &
Biotech.
MicroTech: MEMS, NEMS & Sensors, Micro
Fluidics, Life Sciences, Fabrication, Packaging.
Business Program: selected cleantech business,
policy & strategy panels
Power & Storage: solar, bio, wind, geo, marine, oil,
gas, coal, nuclear, storage
Smart Grid & Infrastructure: smart grid, water,
sustainable cities & communities
Sustainable Industries: chemistry, buildings,
transportation, electronics, waste, emissions
Ventures, Investment & Partnering: early stage
venture forum, IP showcase, corporate partnering
... and more.
EXHIBITION:
Over 400 leading companies, organizations, universities
and international pavilions will be exhibiting at the
TechConnect World Expo.
Exhibitors will include
equipment manufacturers and suppliers, systems providers,
finance and investment firms, R&D companies, project
developers, trade associations, and government agencies
focusing on nanotechnology, clean technology and
biotechnology solutions.
May 2010
SESSIONS:
- Decarbonizing Traditional Energy - Smart Grid - Clean
Alternative Fuels - Solar: Nanostructured Materials for
PV - Creating the Smart Building - Utility Technology
Challenge - Bio Energy - Carbon Capture and Power
Generation - Supercapacitors - Green Building & Grid Government Commercialization Funding
- Energy
Storage: Hydrogen Technologies - Energy Storage &
Conversion - Novel Solar Technologies - Managing Peak
Power - Creating Infrastructure for EV ... and many more
SHORT COURSES:
- Renewable Energy - Energy Storage & Conversion
- Water Cleantech - Carbon Markets & Offset Project
Development
- Photovoltaics
- Green Building:
Technologies & Opportunities - Carbon Nanotubes:
Technology & Applications - Functional Nanoparticles &
Films: Technology & Applications - Microfluidics for
Biotechnology - Polymer Nanoparticles: Synthesis &
Applications - Nanotechnology for Medical Diagnostics
and Treatment
- Soft Nanotechnology: Industrial
Applications - Nanoscale Characterization Techniques
and Applications
- Nanocomposites: Processing &
Applications - Technology Commercialization - Bio Nano
Materials & Tissues: Technology & Applications
Earlybird Rates – save, through May 1st
Full program and registration:
www.TechConnectWorld.com
Visit us at w w w .e - G R I D . n e t
P a g e 10
36 Short Courses, over 200 Sessions
Research, Development, Applications
CLEO/QELS is the leading event for early-stage lasers
and electro-optics, with a peer-reviewed program second
to none, and the most important technical developments -basic research in electro-optics, innovative developments
in laser science, and commercial applications in photonics.
The revamped Applications Program focuses on the
demonstration of components, systems, and emerging
applications of lasers and electro-optical technology.
Hot Topics: - Laser Beam Analysis - Optical Interactions
with Cold Atoms - Biophotonics and Optofluidics - Cavity
QED and Optomechanics - LEDs, Photovolatics and
Energy-Efficient ("Green") Photonics - Ultrafast Optics,
Optoelectronics and Applications - Semiconductor Lasers
Short Courses: - Micro- and Nano-Photonics Devices Solid-State, Liquid and Gas Lasers
- Terahertz
Technologies
- Ultrafast Optics
- Biophotonics &
Optofluidics - Lightwave Communications... & many more.
Register online for the full technical conference
and short courses.
Free Exhibit Pass Plus!
Access to:
 Over 300 exhibitors (Tues – Thurs)
 Technical Business Program: Market Focus,
Technology Transfer events (Tues – Thurs)
Market Focus promotes dialogue among researchers,
developers and users on emerging market trends and
business development. [more]
The Technology Transfer Program offers a “one-stop”
opportunity to learn about the latest optic and photonic
technologies coming from Universities & Government Labs.
 Job Fair (Tues, Wed)
 CLEO/QELS Plenary Sessions (Mon, Wed)
 LaserFest Events celebrating the 50th anniversary
of the laser (Sun – Thurs)
 CLEO/QELS Poster Sessions (Tues, Wed)
Register today for your free Exhibit Pass Plus!
www.cleoconference.org
EMBEDDED SYSTEMS CONFERENCE
If you can only attend one event this year, the ESC
Silicon Valley is the must-attend event for embedded
systems engineers. ESC is the largest gathering of
250+ exhibitors showcasing the latest embedded
technologies available today.



Embeddy Awards
Access to Live Product Teardowns
Exhibits (Tuesday, Wednesday, Thursday)
Customize your educational experiences by
selecting from over 250 sessions in 22 tracks
specific to your interests.
Tracks: ● Build Your Own Embedded System ● Green
Engineering ● Aerospace and Military ● Real-Time
Development ● Designing with Open-Source Software
● Developing for Windows Embedded ● SW Debugging
Techniques ● Internet/Telecom ● Medical (and more)
The 5th annual Multicore Expo will be co-located
with ESC Silicon Valley and will provide 3 days of
dedicated multicore technology training options and
multicore-related exhibits.
Technical Tracks Headliners Multicore Expo Pavilion
Tracks: ● Multicore Architectures and Processors ● Multicore
Development and Design Tools ● System-Level Multicore
Implementations ● Hypervisors and Operating Environments
May 2010
San Jose McEnery Convention Center
Keynote Speakers
Dr. Michio Kaku, Theoretical Physicist & Science
Popularizer
Richard Templeton, Chairman, President, CTO,
Texas Instruments
Jason Wolf, Vice President, Better Place
Flexible Registration Packages
• 1-day, 3-day, or the 4-day All-Access Pass value
• Free Exhibits Pass (with Keynote and sponsored sessions)
• Choose exactly what suits your needs and schedule
• Group rates – bring your team (save up to 25%)
For more information:
www.embedded.com/esc/sv
Visit us at w w w .e - G R I D . n e t
P a g e 11
47th
Design Automation Conference
Anaheim Convention Center
Where The Electronic Design
Community Meets…
DAC is the premier event for the design of
electronic circuits and systems, and for EDA and
silicon solutions. The DAC technical program is made
up of tutorials, workshops, Pavilion panels and
dozens of technical sessions divided into 12 Topical
Areas, plus keynotes, panels, and over 200 exhibits.
See the listing of Keynote Speakers,
Workshops, highlights ofTracks and
Sessions , etc, in the next GRID.
Workshops and Colocated Events:
• International Workshop on Diagnostic
Services in Network-on-Chips
• NASA/ESA Conference on Adaptive
Hardware and Systems
• Workshop on Mobile and Cloud Computing
• Workshop on Synergies between Design
Automation and Smart Grid
• Workshop on Bio-Design Automation
• Workshop on System-Level Interconnect
Prediction
• 4th IEEE International Workshop on DFM&Y
• High-Level Design, Validation and Test
Workshop
• Symposium on Hardware-Oriented Security
and Trust
• Workshop on Logic and Synthesis
• Symposium on Application-Specific
Processors
• Symposium on Nanoscale Architectures
May 2010
June 13-18, 2010
Sponsors
 Over 50 research paper sessions arranged
in six parallel tracks
 User Track, with papers and posters on
tool use and methodologies
 Pavilion panels
DAC User Track:
With its focus on significant contributions from the EDA tool
user community, this track shares challenges and benefits of
tool usage and provides educational and networking benefits
for end users as well as tool developers. The User Track
differs from vendor-specific user forums in that it is not tied
to a specific EDA vendor. Presentations highlight the
challenges and benefits of EDA tool usage, including tools
from EDA vendors, tools developed in-house, and
combinations.
Exhibits:
Exhibitors, you should know that DAC is a great showcase for
your products. It's the one place you have to be. Attendees
comprise thousands of highly qualified decision-makers from
leading semiconductor, telecom, and consumer electronics
companies and related organizations, including:
* Design Engineers
* Corporate and Engineering Management
* Developers and Researchers
* Financial and Industry analysts
* Media Professionals
Substantial discount for IEEE and ACM members, students
Access the Advance Program on the website:
www.DAC.com
Visit us at w w w .e - G R I D . n e t
P a g e 12
SF Industry Applications
TUESDAY April 27, 2010
Tier 4a Interim
Emissions Standards
1)
Speaker: Armen Kludjian, Peterson Power Systems
Time:
Social at 5:30 PM; Presentation at 6:00
PM; Dinner at 7:00 PM
Cost:
$30; student members $10 (pay at the
door)
Place:
Sinbad’s Restaurant, Pier 2 The
Embarcadero, San Francisco
RSVP:
Please email Frank Sylvester,
fsylvester@sfwater.org for reservations and
to qualify for the drawing
Web:
www.e-grid.net/docs/1004-sf-ias.pdf
3)
2)
Beginning January 1, 2011 the EPA kicks off
new tighter emission standards.
Our presentation will focus on the 751HP and
above Standby Engines.
Action is currently pending at the state level and
the information presented is extremely timely.
This presentation will be generic in nature and
questions from participants are encouraged. Copies
of Caterpillar’s “Application and Installation Guide"
will be handed out to all attendees.
For more than 20 years Armen Kludjian of
Peterson Power Systems has been designing, selling
and applying Generator Systems, Paralleling
Switchgear and Flywheel UPS for Hospitals, Data
Centers, and Water Treatment Plants from 80kW to
3MW, with voltage ranges of 208V, 480, 4160 and
12kV.
May 2010
Visit us at w w w .e - G R I D . n e t
P a g e 13
SCV Product Safety Engineering, with Reliability
TUESDAY April 27, 2010
How to Avoid Being
the Next Toyota
Speakers: Ken Kapur, KLA-Tencor); Eugene Heil,
Lewis Bass Intl.; Mike Silverman, Ops A la
Carte LLC; Fred Schenkelberg, Ops A La
Carte LLC
Time:
Networking and pizza/drinks at 6:00 PM;
Presentation at 6:30 PM
Cost:
none
Place:
Applied Materials, Bowers Café, 3090
Bowers Ave., Santa Clara
RSVP:
From the website (so we have a pizza
count)
Web:
www.ewh.ieee.org/r6/scv/pses
An exploratory discussion on what companies can
do to avoid being the next Toyota (NOT a root cause
analysis). Will discuss the vulnerability of any high
profile company having a major issue such as this.
Even when Toyota fixes this particular issue, there is
still something more fundamental they need to
address to see that this type of thing doesn't happen
again.
This will be a panel discussion with 3 speakers;
Ken Kapur will moderate the panel.
MET Laboratories
EMC – Product Safety
US & Canada
• Electromagnetic Compatibility • Product Safety Cert.
• Environmental Simulation
• Full TCB Services
• Design Consultations
• MIL-STD testing
• NEBS (Verizon ITL & FOC)
• Telecom
• Wireless, RFID (BQTF & EPCglobal Test Lab)
Facilities in Union City and Santa Clara
www.metlabs.com
May 2010
info@metlabs.com
510-489-6300
Visit us at w w w .e - G R I D . n e t
P a g e 14
SCV Consumer Electronics
TUESDAY April 27, 2010
Gigapan: Tool for
Image Manipulation
Speaker: Rich Gibson, NASA Ames
Time:
Networking and pizza at 6:30 PM;
Presentation at 7:00 PM
Cost:
$5 for IEEE members; $10 for nonmembers (pay at the door)
Place:
nVIDIA, Building E, 2800 Scott Blvd., Santa
Clara
RSVP:
From the website
Web:
www.ewh.ieee.org/r6/scv/ce
The GigaPan project provides multiple tools to
create and stitch multiple images (or mosaics of
images) to create Gigapixel and larger images which
can be explored with a pan and zoom interface at
gigapan.org. The experience of looking at a Gigapan
image is more like exploring a new space than of
looking at a conventional photo or video. You look at
a picture, you watch a movie, but you actively explore
a GigaPan. The talk will describe the history of the
project, and then show examples of work which has
been done with the tools both on and off our world,
and looking at things from human scales to the near
nanometer scale.
Rich will bring an Epic Pro and the last model of
the Epic and/or Epic 100.
Rich Gibson is a hacker, programmer, artist,
writer, and photographer who has been working with
computers for fun and profit since 1976.
He
coauthored Mapping Hacks and Google Maps
Hacks for O'Reilly, and has long been fixated on the
power of words and images to create compelling
narratives. He now works for the GigaPan project
helping to create new ways of extending the power of
high resolution pan and zoom images for scientific,
educational, artistic, and storytelling.
Patent Agent
Jay Chesavage, PE
MSEE Stanford
3833 Middlefield Road, Palo Alto 94303
info@file-ee-patents.com
www.File-EE-Patents.com
TEL: 650-619-5270 FAX: 650-494-3835
May 2010
Visit us at w w w .e - G R I D . n e t
P a g e 15
SCV Magnetics
THURSDAY April 29, 2010
Biomagnetics:
An Interdisciplinary Field
where Magnetics, Biology
and Medicine Overlap
Speaker: Prof. Shoogo Ueno, University of Tokyo,
and 2010 IEEE Magnetics Society
Distinguished Lecturer
Time:
Networking and pizza at 7:00 PM,
Presentation at 7:30 PM
Cost:
none
Place:
Western Digital, 1710 Automation Parkway,
San Jose
RSVP:
Not required
Web:
ewh.ieee.org/r6/scv/mag
Ueno Shoogo Ueno received the B.S., M.S. and Ph.D.
degrees in electronic engineering from Kyushu University,
Fukuoka, in 1966, 1968, and 1972, respectively. Dr.
Ueno was an associate professor with the Department of
Electronics, Kyushu University, from 1976 to 1986. From
1979 to 1981, he spent his sabbatical with the
Department of Biomedical Engineering, Linkoping
University, Sweden, as a guest scientist.
He
subsequently served as a professor in the Department of
Electronics, Kyushu University (1986-1994) and in the
Department of Biomedical Engineering, Graduate School
of Medicine, University of Tokyo (1994-2006). In 2006 he
retired from the University of Tokyo as professor emeritus.
Since 2006 he has been a professor with the Department
of Applied Quantum Physics, Graduate School of
Engineering, Kyushu University, and is also dean of the
Faculty of Medical Technology, Teikyo University,
Fukuoka.
Dr. Ueno is a Fellow of the IEEE and of the American
Institute for Medical and Biological Engineering. He is a
Fellow and Member-at-Large of the Governing Council of
the International Academy for Medical and Biological
Engineering. He was an elected member of the IEEE
Magnetics Society Administrative Committee (2004-2009),
President of the Bioelectromagnetics Society (2003-2004),
Chairman of the International Union of Radio Science’s
Commission K on Electromagnetics in Biology and
Medicine (2000-2003), President of the Japan
Biomagnetism and Bioelectromagnetics Society (19992001), and President of the Japanese Society for Medical
and Biological Engineering (2002-2004). He received the
Doctor Honoris Causa from Linkoping University (1998).
He was a 150th Anniversary Jubilee Visiting Professor at
Chalmers University of Technology, Sweden (2006), and a
visiting professor at Simon Frasier University, Burnaby,
Canada (1994) and Swinburne University of Technology,
Hawthorn, Australia (2008).
May 2010
Biomagnetics is an interdisciplinary field where
magnetics, biology and medicine overlap. It has a
long history since 1600, when William Gilbert
published his book De Magnete. Recent advances in
biomagnetics have enabled us not only to detect
extremely weak magnetic fields from the human
brain, but also to control cell orientation and cell
growth by extremely high magnetic fields. Pulsed
magnetic fields are used for transcranial magnetic
stimulation (TMS) of the human brain, and both high
frequency magnetic fields and magnetic nanoparticles
have
promising
therapeutic
applications
for
treatments of cancers and brain diseases such as
Alzheimer’s and Parkinson's. On the imaging front,
magnetic resonance imaging (MRI) is now a powerful
tool for basic and clinical medicine. New methods of
MRI based on the imaging of impedance of the
human
body,
called
impedance MRI, and the
imaging of neuronal current
activities in the human brain,
called current MRI, are also
being developed.
This lecture focuses on the
advances in biomagnetics and
bioimaging obtained mostly in
our laboratory in recent years.
The
lecture
describes:
(1) a method of localized
magnetic stimulation of the
human brain by TMS with a figure-eight coil;
(2) magneto-encephalography (MEG) to measure
extremely weak magnetic fields produced from brain
electrical activity using superconducting quantum
interference device (SQUID) systems; (3) impedance
MRI and current MRI; (4) cancer therapy and control
of iron-ion release from, and uptake into, ferritin, an
iron-storage protein, by using both high frequency
and pulsed magnetic fields and magnetic
nanoparticles; and (5) magnetic control of biological
cell orientation and cell growth by strong static
magnetic fields. These new biomagnetic approaches
will open new horizons in brain research, brain
treatment, and regenerative medicine.
Visit us at w w w .e - G R I D . n e t
P a g e 16
SCV Solid State Circuits
THURSDAY April 29, 2010
Power-Efficient Data Converters
Speaker: Prof. Franco Maloberti (Distinguished
Lecturer of the Solid State Circuit Society
and Fellow of IEEE)
Time:
Networking and pizza at 6:00 PM,
Presentation at 6:30 PM
Cost:
Small donation to cover food
Place:
National Semiconductor Building E
Auditorium, 2900 Semiconductor Dr., Santa
Clara
RSVP:
Not required
Web:
www.ieee.org/scv/ssc
Prof. Franco Maloberti received the Laurea degree
in physics (summa cum laude) from the University of
Parma, Parma, Italy, in 1968, and the Doctorate Honoris
Causa in electronics from the Instituto Nacional de
Astrofisica, Optica y Electronica (Inaoe), Puebla,
Mexico, in 1996. He was the TI/J.Kilby Chair Professor
at the Texas A&M University, and the Distinguished
Microelectronic Chair Professor at the University of
Texas at Dallas. He was a Visiting Professor at The
Swiss Federal Institute of Technology (ETH-PEL),
Zurich, and at the EPFL, Lausanne. Presently he is
Microelectronics Professor, Head of the Micro Integrated
Systems Group, University of Pavia, Italy and Honorary
Professor, University of Macau, China SAR. His
professional expertise is in the design, analysis, and
characterisation of integrated circuits and analog digital
applications, mainly in the areas of switched-capacitor
circuits,
data
converters,
interfaces
for
telecommunication and sensor systems, and CAD for
analog and mixed A/D design. He has written more then
400 published papers on journals or conference
proceedings, four books, and holds 30 patents. Prof.
Maloberti was the recipient of the XII Pedriali Prize for
his technical and scientific contributions to national
industrial production, in 1992. He was co-recipient of the
1996 Fleming Premium, IEE, the best Paper award,
ESSCIRC-2007, and the best paper award, IEEJ Analog
Workshop-2007. He received the 1999 IEEE CAS Society
Meritorious Service Award, the 2000 IEEE CAS Society
Golden Jubilee Medal, and the IEEE Millenium Medal. Dr.
Maloberti was Vice-President, Region 8, of the IEEE Circuit
and Systems Society (1995-1997), Associate Editor of
IEEE-Transaction on Circuit and System-II 1998 and 200607, President of the IEEE Sensor Council (2002-2003),
member of the BoG of the IEEE-CAS Society (2003-2005)
and Vice-President, Publications, of the IEEE CAS Society
(2007-2008). He is Distinguished Lecturer of the Solid
State Circuit Society and Fellow of IEEE.
May 2010
Portable and nomadic systems require developing
power effective and power aware design
methodologies for either analog or digital circuits. For
data converters, low power and optimal resolution
imply a favorable allocation of the noise budget. The
noise comes from different sources: quantisation,
sampling, clock jitter, spur interference and board
interference. The distribution of the available noise
power, that becomes lower and lower as the supply
diminishes, depends on the specification of the
system and it may require one or more extra-bits in
the data converter. The noise budget issue is new; it
was rarely faced in the past when power was just a
concern for limiting the chip temperature.
The
growing
relevance
of
power
efficiency
is
demonstrated by the great attention on the figure of
merit (FoM) of data converters that, in the past few
years, has been reduced by almost two orders of
magnitude. The presentation will show that obtaining
power effectiveness is a matter of trade-offs between
architecture,
design
methodologies,
and
implementation of circuits. Advances in technology
challenge data converter design. In addition to a
reduced supply voltage, the worsening of
transconductance and output resistance degrades the
intrinsic gain and makes it difficult to design high-gain
op-amps.
Noise, both thermal and 1/f, also
increases.
Moreover, accuracy and linearity of
passive and active components is problematic at
minimum features.
All those limits must be
understood and accounted for to ensure effective
data converters design. After discussing the above
general issues this presentation will describe the
design of significant achievements and illustrate their
experimental verifications.
The given design
examples, pertaining data converters operating in
different regions of conversion speed and resolution,
are a band-pass sigma-delta, a power effective
sigma-delta for DVB-H, some digital-assisted sigmadelta schemes and an ultra low-power SAR.
● Customized ADCs, PLLs, I/Os, SerDes
● Analog/Mixed-Signal IC design services
www.mobilitysemi.com
Ph: 408-738-5509
2953 Bunker Hill Lane #400, Santa Clara
Visit us at w w w .e - G R I D . n e t
P a g e 17
SCV Computer and Communications
THURSDAY April 29, 2010
Faultline Brewery Social
Time:
Cost:
Place:
RSVP:
Web:
6:00 PM Networking with food and
beverage; 7:30 PM Dinner if you want to
stick around (on your own)
All are welcome - IEEE members with
current membership card receive a free $8
voucher at the door.
Faultline Brewery, 1235 Oakmead Pkwy,
Sunnyvale
Limited seating; please reserve
ieeecscomsoc201004.eventbrite.com
Come and network with others in a relaxed
environment while enjoying one of the advantages of
being an IEEE member with the free voucher. All are
welcome. (Bring your IEEE membership card.)
Channel
Partner






Multiphysics, Multidisciplinary Engng
CFD, Stress, Heat Transfer, Fracture
Fatigue, Creep, Electromagnetics
Linear/Nonlinear Finite Element Analyses
Multi-objective Design Optimization
BGA Reliability
Ozen Engineering (408) 732-4665
info@ozeninc.com www.ozeninc.com
May 2010
Visit us at w w w .e - G R I D . n e t
P a g e 18
OEB Magnetics
FRIDAY April 30, 2010
Biomagnetics:
An Interdisciplinary Field
where Magnetics, Biology
and Medicine Overlap
Speaker: Prof. Shoogo Ueno, Kyushu University, and
2010 IEEE Magnetics Society
Distinguished Lecturer
Time:
11:00 AM
Cost:
none
Place:
Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley
RSVP:
Please respond by email with name,
company, to Peter Fischer,
PJFischer@lbl.gov by April 26
Web:
ewh.ieee.org/r6/oeb/mag
Ueno Shoogo Ueno received the B.S., M.S. and Ph.D.
degrees in electronic engineering from Kyushu University,
Fukuoka, in 1966, 1968, and 1972, respectively. Dr.
Ueno was an associate professor with the Department of
Electronics, Kyushu University, from 1976 to 1986. From
1979 to 1981, he spent his sabbatical with the
Department of Biomedical Engineering, Linkoping
University, Sweden, as a guest scientist.
He
subsequently served as a professor in the Department of
Electronics, Kyushu University (1986-1994) and in the
Department of Biomedical Engineering, Graduate School
of Medicine, University of Tokyo (1994-2006). In 2006 he
retired from the University of Tokyo as professor emeritus.
Since 2006 he has been a professor with the Department
of Applied Quantum Physics, Graduate School of
Engineering, Kyushu University, and is also dean of the
Faculty of Medical Technology, Teikyo University,
Fukuoka.
Dr. Ueno is a Fellow of the IEEE and of the American
Institute for Medical and Biological Engineering. He is a
Fellow and Member-at-Large of the Governing Council of
the International Academy for Medical and Biological
Engineering. He was an elected member of the IEEE
Magnetics Society Administrative Committee (2004-2009),
President of the Bioelectromagnetics Society (2003-2004),
Chairman of the International Union of Radio Science’s
Commission K on Electromagnetics in Biology and
Medicine (2000-2003), President of the Japan
Biomagnetism and Bioelectromagnetics Society (19992001), and President of the Japanese Society for Medical
and Biological Engineering (2002-2004). He received the
Doctor Honoris Causa from Linkoping University (1998).
He was a 150th Anniversary Jubilee Visiting Professor at
Chalmers University of Technology, Sweden (2006), and a
visiting professor at Simon Frasier University, Burnaby,
Canada (1994) and Swinburne University of Technology,
Hawthorn, Australia (2008).
May 2010
Biomagnetics is an interdisciplinary field where
magnetics, biology and medicine overlap. It has a
long history since 1600, when William Gilbert
published his book De Magnete. Recent advances in
biomagnetics have enabled us not only to detect
extremely weak magnetic fields from the human
brain, but also to control cell orientation and cell
growth by extremely high magnetic fields. Pulsed
magnetic fields are used for transcranial magnetic
stimulation (TMS) of the human brain, and both high
frequency magnetic fields and magnetic nanoparticles
have
promising
therapeutic
applications
for
treatments of cancers and brain diseases such as
Alzheimer’s and Parkinson's. On the imaging front,
magnetic resonance imaging (MRI) is now a powerful
tool for basic and clinical medicine. New methods of
MRI based on the imaging of impedance of the
human body, called impedance MRI, and the imaging
of neuronal current activities
in the human brain, called
current MRI, are also being
developed.
This lecture focuses on the
advances in biomagnetics and
bioimaging obtained mostly in
our laboratory in recent years.
The
lecture
describes:
(1) a method of localized
magnetic stimulation of the
human brain by TMS with a
figure-eight
coil;
(2) magneto-encephalography (MEG) to measure
extremely weak magnetic fields produced from brain
electrical activity using superconducting quantum
interference device (SQUID) systems; (3) impedance
MRI and current MRI; (4) cancer therapy and control
of iron-ion release from, and uptake into, ferritin, an
iron-storage protein, by using both high frequency
and pulsed magnetic fields and magnetic
nanoparticles; and (5) magnetic control of biological
cell orientation and cell growth by strong static
magnetic fields. These new biomagnetic approaches
will open new horizons in brain research, brain
treatment, and regenerative medicine.
Visit us at w w w .e - G R I D . n e t
P a g e 19
SCV Microwave Theory and Techniques
SATURDAY May 1, 2010
Short Course:
RF and Microwave Design
for Future Technologies
Speakers: Prof Ali Niknejad, UC-Berkeley; Dr R
Srinavasan, Intel Corp; Dr Rich Ruby,
Avago; Prof Gabriel Rebeiz, UC-San
Diego; Prof Pham, UC-Davis; Prof Tom
Lee, Stanford
Time:
Registration 7:30 - 8:00 AM; Presentations
8:00 AM - 3:00 PM
Cost:
Advance Reg: $60 IEEE members, $70
non-members, $50 Students/Unemployed
($10 more on-site)
Place:
Michaels at Shoreline, 2960 N Shoreline
Blvd, Mountain View
RSVP:
Register online
Web:
www.mtt-scv.org
May 2010
In recent years the area of RF and microwave
design has expanded into many new application
areas, generated new technologies and adapted
many new technologies into it’s products. This short
course will give an overview of some key
technologies and designs that will be used for these
new applications. A description of the technology and
designs will be given as well as the application(s) that
are targeted.
Registration/Breakfast
Introduction - Jay Banwait, IEEE MTT-SCV Short
Course Chair
Why RF Engineers Should Learn Digital (and Vice
Versa) - Prof Ali Niknejad, University of
Caliifornia, Berkeley
The New Wimax Standard - Dr R Srinavasan, Intel
Corporation
Filters - Dr Rich Ruby, Avago
Tunable RF MEMS Filters for 3G and 4G Systems
- Prof Gabriel Rebeiz, University of California
San Diego
Lunch
High Freq Packaging - Prof Pham, University of
California Davis
Historical Radio - Prof Tom Lee, Stanford University
Wrap up, raffle and giveaways - Jay Banwait
Visit us at w w w .e - G R I D . n e t
P a g e 20
SCV Robotics and Automation
THURSDAY May 6, 2010
Next-Generation MEMS
Inertial Sensors
Speaker: Dr. Peter G. Hartwell, Hewlett-Packard
Laboratories
Time:
Networking at 6:15 PM; Presentation at
6:30 PM
Cost:
none
Place:
Carnegie Mellon Silicon Valley, NASA
Research Park, Bldg. 23, Moffett Field
RSVP:
not required
Web:
www.ewh.ieee.org/r6/scv/ras
Dr. Peter G. Hartwell is currently a
senior researcher at Hewlett-Packard
Laboratories in Palo Alto.
As a
member of the Information and
Quantum Systems Lab, he is the lead
of the Central Nervous System for the
Earth (CeNSE) team developing a
broad sensing system to bring
environmental
awareness
to
information technology infrastructure. CeNSE was
selected one of 20 “World Changing Ideas” in the
December 2009 issue of Scientific American. Peter
has extensive experience in commercializing silicon
MEMS products, working on advanced sensors and
actuators, and specializes in MEMS testing
techniques. He graduated from the University of
Michigan in 1992 with a B.S.E in Materials Science
and from Cornell University in 1999 with a Ph. D. in
Electrical Engineering. He did brief post doctoral
work at HP Labs before joining the staff in 2000. His
work at HP has been documented in numerous
technical papers, patents, and articles in publications
such as The New York Times, Forbes, IEEE
Spectrum, and EETimes.
May 2010
MEMS inertial sensors have been around for more
than 25 years, from the first prototypes developed in
universities to initial product offerings. While the goal
has always been enabling inertial navigation in
mobile
devices
with
high
performance
accelerometers and gyroscopes, MEMS inertial
sensors saw their first commercial success as
collision detectors in vehicle airbag systems.
Fast-forward 20 years. Airbags that started on
high-end cars are now available on every vehicle.
The use of inertial sensors in cars has expanded into
all manner of vehicle dynamics. Improvements in the
cost, size and power of current sensors, along with
expansion of the vendor base, have allowed MEMS
sensors to spill over into consumer
electronics such as game controllers and
smartphones. Their performance, however,
remains largely unchanged and MEMS
gyroscopes have only recently come to
market in volume.
I will examine why MEMS inertial sensors
have failed to live up to their initial promise,
and to propose a different approach that
could jump-start advancements. MEMS
fabrication technologies, such as high-aspect-ratio
etching, wafer bonding, and packaging, have all seen
dramatic improvements from the first university
prototypes. Hewlett-Packard has applied 25-plus
years of nanofabrication experience creating MEMS
inkjet printheads to create a new generation of MEMS
inertial sensors. I will highlight performance goals
now within reach and the application space the new
sensors enable.
Visit us at w w w .e - G R I D . n e t
P a g e 21
SCV Technology Management
THURSDAY May 6, 2010
Secrets of Successful
Networking: Professional
Networking for Engineering
Professionals
Speaker: Jeff Richardson, CTO, Empowered
Alliances
Time:
Guided Networking at 6:30 PM; Dinner
(sandwiches, salad, cookies and sodas) at
7:15 PM; Presentation at 7:45 PM
Cost:
$10 (IEEE member), $13 (non-member) Cash or check at the door; add $3 without
reservation
Place:
Ramada Inn, 1217 Wildwood Ave,
Sunnyvale
RSVP:
Register online
Web:
www.ieee-scv-tmc.org
Jeff Richardson has an unmatched passion for
teamwork as demonstrated by his years of
consulting/training experience with entrepreneurial
startups, high tech companies and outdoor team
building.
He has been presenting Secrets of
Successful Networking seminars for over 6 years for
several thousand professionals while adapting the
core message to meet the specific needs of the
various organizations. As an educator, Jeff was one
of the lead instructional designers for Stanford’s
Advanced Project Management Program, in addition
to designing and teaching courses at Boston
University, and UC Santa Cruz – Extension as well as
corporations like Cisco, Symantec, Intuit, Texas
Instruments, Raytheon to name a few.
Mr. Richardson has a BS in Mechanical
Engineering and an MS in OD & Change
Management.
May 2010
This interactive Secrets of Successful Networking
workshop will demonstrate a more effective strategy
for meeting key individuals that can add value to you
and your project. This workshop will provide you with
tools and techniques along with a customizable
process that will generate immediate results. His fun
and engaging workshop approach will rejuvenate
your perspective on the value of the networking as a
tool for solving difficult problems and allow you to
create a more effective strategy for accelerated job
search or improved project performance.
Workshop Objectives:
Evaluate the impact of new networking principles
on your networking activities
Understand key components of an effective
networking strategy
Workshop Content
- Creating New Connections
- Key Principles for Building an Influential Network
- Developing Your Networking Strategic Plan
What
others
have
said
about
Jeff's
Presentations…“The networking events conducted by
Jeff were very innovative, allowing all participants to
interact with multiple groups of people. His high
energy level and quick wit made it very interesting for
all participants. We would definitely invite him back at
our events and would highly recommend him to other
organizations.”
-Eashwar, Programs Director for PMI Association
Silicon Valley
Visit us at w w w .e - G R I D . n e t
P a g e 22
SCV PACE Members in Transition, UCSC-Extension, NOVA,
Chamber of Commerce
FRIDAY May 7, 2010
Take Your Career
To the Next Level
(Career Forum)
Speakers: William Uranga, Director of Staffing at
TiVo; Alex Plant, Senior Social Media Guy
at NetApp
Breakout Sessions: Engineering and Technology,
Business and Management, Bioscience,
and Education (choose 2)
Time:
12:30 PM - 5:00 PM; see website for
complete schedule of talks, sessions
Cost:
none
Place:
UC-Santa Cruz Extension, 2505 Augustine
Drive, Santa Clara
RSVP:
Must register through the website
Web:
events-manager.ucsc.edu/content/takeyour-career-next-level
You’ll have the opportunity to learn about the best
ways to use social media in your job or in the hiring
process.
Panels of experts in the fields of
engineering
and
technology,
business
and
management, bioscience, and teaching will show you
ways to be more successful in your existing field or, if
you’re in transition, where there are new opportunities
to pursue.
Join us for this unique opportunity to interact and
pose questions to senior level experts in HR and
other fields, as well as recruiters. UCSC Extension
program directors and coordinators will be on hand to
outline what you can do to prepare for your next step.
You’ll wrap up the day with a guided power
networking session and you’ll walk out the door with
new tools and connections.
Career counselors will also be available for brief
one-on-one strategy sessions. These sessions will be
5-10 minutes long and can include a quick resume
review or discussion of a career-related question.
Several professional associations will have tables
offering opportunities for professional growth and
networking in your field.
12:30 - 1:00 PM Check in and visiting with
professional association representatives
1:00 - 1:50 PM Opening Session: Perspectives on
Using Social Media in your Career, featuring:
William Uranga, Director Of Talent Acquisition
at TiVo, and Alex Plant, Senior Social Media
Guy at NetApp
2:00 - 2:45 PM Concurrent Sessions (4 areas)
3:00 - 3:45 PM Concurrent Sessions (repeated)
2:00 - 3:40 PM Mini-career advising sessions
4:00 - 5:00 PM Closing Session – Power
Networking for Career Success
•
•
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20 Years of Experience
Fortune 500 Companies
Microsoft .Net, C#, C++, Java, …
Software, Firmware, Middleware, Web Applications
SCM, QA, and much more Experience/Expertise
www.esw.com
May 2010
info@esw.com
(408) 328-9240
Visit us at w w w .e - G R I D . n e t
P a g e 23
SCV Electron Devices
TUESDAY May 11, 2010
Directions for Silicon Technology
Development as We Approach
the End of CMOS Scaling
Speaker: Tak H. Ning, IBM T.J. Watson Research
Center
Time:
Pizza and Salad at 6:00 PM; Presentation
at 6:15 PM
Cost:
none
Place:
National Semiconductor Building E
Auditorium, 2900 Semiconductor Drive,
Santa Clara
RSVP:
not required
Web:
www.ewh.ieee.org/r6/scv/eds
Tak H. Ning received his Ph.D. degree in physics
from the University of Illinois at Urbana-Champaign in
1971. Prior to joining IBM at Thomas J. Watson
Research Center in 1973, he was a research assistant
professor at the University of Illinois. At Illinois, he did
research on the theory of impurity centers in silicon, the
transport of electrons in MOS surface inversion layers,
and developed a theory for the oxide-charge scattering
of electrons in MOS inversion layers.
During the early part of his IBM career, Tak and his
colleagues made significant contributions to the
understanding of hot-electron effects and electron and
hole trapping in MOSFET’s, including the discovery and
modeling of substrate hot-electron effects.
They
demonstrated the shallow-emitter effect and its
dependence on emitter-contact material. They invented
and developed the polysilicon-emitter self-aligned
bipolar transistor, which is the basis of all modern
bipolar transistor technology. They also invented the
substrate-plate trench-capacitor DRAM cell, which is
widely used in stand-alone and embedded DRAM
products.
As senior manager of the silicon device technology
department between 1982 and 1991, he directed and
contributed to the development of submicron bipolar and
CMOS technologies in IBM Research as well as led his
team in exploring SOI and EEPROM devices.
In 1991, Tak was appointed an IBM Fellow. Since
then, he has focused much of his technical work on
understanding the limits of CMOS and exploring the
opportunities in silicon technology beyond CMOS. He
also represents IBM at the Executive Advisory Board of
the Semiconductor Research Corporation, a consortium
of semiconductor companies funding university research
(continued, at right)
in semiconductors.
May 2010
CMOS at the 45-nm node has been in production for
a couple of years now, and if everything goes according
to plan, CMOS at the 15nm lithographic node should be
in production in less than ten years. However, every
technology has its limits and CMOS is no exception.
While there will be billions of CMOS devices on a chip,
and “mobility engineering” will continue to enable ever
faster CMOS devices, band-to-band tunneling will push
up the standby currents and severely cap the speed of
any transistor requiring low standby power dissipation.
Nonetheless, the glass for continuing the rapid
progress in silicon technology appears half full because
system designers need a lot more than fast transistors.
These needs include increasingly large memory
capacity and increasingly large memory bandwidth,
huge amounts of data storage, especially storage that
can be accessed at much larger bandwidth than
traditional magnetic disk storage, system-on-chip (SoC)
integration and volumetrically dense system-level
packaging. And, of course, the power dissipation must
be consistent with the thermal and power dissipation
requirements of the systems.
In this talk, the fundamentals that could limit the
scaling of CMOS at or beyond the 15nm lithographic
node will be discussed, and some thoughts on silicon
opportunities for meeting the system needs of “besides
faster CMOS transistors” will be offered. The emphases
will be on opportunities in memory technologies and in
exploiting SOI CMOS as a SoC platform.
Tak has participated in many IEEE and professional
society activities, including serving as a member of the
Administrative Committee of the IEEE Electron Device
Society, a program committee member of several technical
conferences, and a member or chair of several IEEE award
committees, including the IEEE Fellow Committee. He has
been a member of the SEMATECH Committee that
publishes the International Technology Roadmap for
Semiconductors (ITRS) since 1992.
Tak has authored or co-authored more than 120
technical papers and 36 U.S. patents. He co-authored
(with Yuan Taur) a book titled "Fundamentals of Modern
VLSI Devices" (1998), which has been adopted as a
graduate text by many universities worldwide and
translated into Japanese.
He is a fellow of the American Physical Society and of
the IEEE, and a member of the US National Academy of
Engineering. He received several awards, including the
2007 ECS Gordon E. Moore Medal, the IEEE Electron
Device Society 1989 J.J. Ebers Award, the IEEE 1991
Jack A. Morton Award, the 1998 Pan Wen-Yuan
Foundation (Taiwan) Outstanding Research Award, and
the IEEE 2000 Custom Integrated Circuits Conference
Best Paper Award.
Visit us at w w w .e - G R I D . n e t
P a g e 24
SCV Computer
TUESDAY May 11, 2010
Supercomputing at NASA:
Current Impact, Future Challenges
Speakers: Dr. Rupak Biswas, Division Chief, NASA
Advanced Supercomputing
Time:
Pizza/sodas and networking at 6:30 PM;
Presentations at 7:00 PM
Cost:
none
Place:
Microsoft Research, 1288 Pear Ave.,
Mountain View
RSVP:
from website
Web:
ewh.ieee.org/r6/scv/computer
As acting chief of the NASA Advanced
Supercomputing (NAS) Division, Dr. Rupak Biswas
oversees the full range of high-performance
computing
services
for
NASA's
primary
supercomputing center. Dr. Biswas is a nationally
recognized expert in the areas of parallel
programming models and paradigms; benchmarking
and performance characterization of emerging and
innovative architectures for high-end computing
systems; novel partitioning and load balancing
techniques for large-scale computational science
problems; and scheduling algorithms for distributed
computing environments.
Due to his broad
knowledge in advanced computing technologies and
federal agencies, Dr. Biswas was chosen to serve as
a member of the inter-agency High End Computing
Revitalization Task Force (HECRTF), as a mission
partner representative on the DARPA High
Productivity Computing Systems (HPCS) Project, and
one of five expert panelists to assess all high-end
computing R&D activities in Japan.
Biswas received his Ph.D. in Computer Science
from Rensselaer Polytechnic Institute in 1991, and
has been at NASA ever since. During this time, he
has received several NASA awards, including the
Outstanding Leadership Medal in 2009, and two Best
Paper prizes given at the international "SC"
conference on high-performance computing, network,
and storage. He has published more than 140
technical papers on a variety of scientific computing
topics in archival journals and at major peer-reviewed
conferences, given numerous talks at home and
abroad, and edited several journal special issues.
May 2010
In this talk, Dr. Biswas will describe NASA's fullyintegrated supercomputing environment, its recent
impact in several NASA mission areas, and discuss
some pacing challenges to be overcome to make the
next revolutionary advances in this field. High-fidelity
modeling, simulation, and analysis, enabled by
supercomputing, are becoming increasingly important
to NASA’s mission to pioneer the future in space
exploration, scientific discovery, and aeronautics
research.
High performance computing for
computational modeling and simulation is now
integral to the space agency’s work in all mission
areas. The NASA Advanced Supercomputing (NAS)
Division at Ames Research Center hosts the majority
of the Agency’s supercomputing assets, which
consists of over 900 teraflops of computational
capability, more than 6 petabytes of filesystem. The
NAS facility also provides full-service support to
scientists and engineers in the areas of application
porting, performance optimization, large-scale data
analysis and rendering, and multi-terabyte data
transfers.
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Email: Dave.Stevens@StevensLawGroup.com
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P a g e 25
SCV Electromagnetic Compatibility
TUESDAY May 11, 2010
How to Apply Shielded Cables
to Solve More Problems
than You Create
Speakers: Dr. Tom Jerse, Associate Technical
Fellow, Boeing Company
Time:
Networking & light dinner (no-host) at
5:30 PM; Presentation at 6:30 PM
Cost:
Free coffee, tea, snacks
Place:
Applied Materials Bowers Cafeteria, 3090
Bowers Ave., Santa Clara
RSVP:
not required
Web:
ewh.ieee.org/r6/scv/emc
Shielded cables are widely used to enhance signal
integrity and solve interference problems, but there
are several mechanisms that if not understood in a
system design can inadvertently cause interconnect
cables to become the dominant player in crosstalk or
radiated emissions. This talk explains the ways in
which cables can both mitigate and exacerbate
electromagnetic interference, and presents basic
design principles and troubleshooting techniques for
achieving the most electromagnetically compatible
designs possible.
Tom Jerse has over 30 years experience with
Hewlett-Packard and Boeing in solving EMI problems
both at the circuit and systems level, and has earned
a PhD in EMC from the University of Kentucky. He
presently holds the dual positions of Professor of
Electrical Engineering at The Citadel and Associate
Technical Fellow of the Boeing Company. He served
two years as a distinguished lecturer of the EMC
Society, and has developed and taught original EMC
courses at the professional and university level since
1981.
May 2010
Visit us at w w w .e - G R I D . n e t
P a g e 26
SCV Components, Packaging and Manufacturing Technology
WEDNESDAY May 12, 2010
Winner Take All:
How Competitiveness
Shapes the Fate of Nations
Speaker: Richard J. Elkus, Jr., Vice Chairman of the
Board, Tencor Instruments
Time:
Dinner at 6:00 PM; Presentation at 6:45 PM
Cost:
$20 if reserved by May 10 ($10 for students,
unemployed); $25 after & at door;
vegetarian available; no cost for
presentation only
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy
101 at Montague Expressway), Santa Clara
RSVP: Through the website link
Web:
www.cpmt.org/scv
Richard J. Elkus, Jr., has been intimately
connected with the development and evolution of
Silicon Valley. His business career as an executive
and entrepreneur has been integrated with
organizations and committees involved in national
and international policy development pertaining to
economic competitiveness.
Elkus spent the first decade of his career at Ampex
Corporation serving in managerial positions of
increasing responsibility.
He wrote the original
product plan for the home video recorder and headed
the team that introduced what would become the
VCR to the world in 1970. During his career, he
served as chief executive and on the board of several
high-tech companies, including Executive Vice
President and General Manager of Geometrics, Inc.,
Director and Chairman of Pacific Measurements and
Integrated Systems, Inc., Co-Founder, Chairman and
CEO of Prometrix Corporation, Director and Vice
Chairman of Tencor Instruments, Director of KLATencor, Director of OnTrak Systems and Director of
Lam Research. In addition, he served as a Director of
Tomex Corporation, Virage Logic, SOPRA-SA, and
Cameca-France.
His professional affiliations, past and present,
include serving as Chairman of the Selection
Committee for the National Medal of Technology,
presented each year by the President of the United
States; member of the Board of Directors and
executive committee of the National Science and
Technology Medals foundation, member of the Board
of
the
American
Electronics
Association,
(continued, next page)
May 2010
The strategic dilemmas now confronting America
are deep and daunting.
Though we face no
immediate threat of another world war or Great
Depression, we find ourselves in what could become
a zero sum game. And we are losing. At the core of
our growing problems is an exorbitant level of public
and private debt relative to savings and the nation's
capacity to repay its creditors. And beyond America's
insatiable demand for credit lies another problem,
one potentially much worse. The United States is
rapidly losing its ability to commercialize its innovative
strengths in the form of advancements in technology,
products, and markets that are potentially explosive
and scalable and thus strategic to any great nation.
As a result of these losses, our ability to innovate,
produce, and employ continues to decline. In the
end, the country becomes unable to regenerate itself.
This is not a danger that looms on the horizon. It
is the condition that faces America today. We are on
the verge of losing our ability to compete —- the only
viable means to paying down the nation's horrendous
financial obligations.
The United States is no longer a significant factor
in the consumer electronics industry, including
television, cameras, recorders, and cell phones.
Without the resources of China and other Asian
countries, neither computers, iPhones, HDTVs, nor
myriad other consumer electronics would be on the
shelves of American stores. Two of America's three
automobile companies went bankrupt. We are no
longer competitive in nuclear power. We face fierce
competition in aircraft and ship building. We are no
longer a significant supplier of machine tools. By
2007 nearly 80 percent of all semiconductor
fabrication tools were being purchased for
manufacturing facilities in Asia. The loss of these
markets will ultimately hinder technological advances
in the U.S. military establishment.
The high dependence of our industrial base on
foreign design and manufacturing has ominous
implications. Assuming China and India increase
domestic consumption, substantially reducing their
reliance on the U.S. consumer, America could
become marginalized. Asia will be able to get along
without us while we remain significantly dependant on
them.
To resolve this situation will cost hundreds of
billions in new investment over many years. As the
nation tries to live within its means, our standard of
living will fall. America will have to develop a totally
different competitive strategy.
We will have to
Visit us at w w w .e - G R I D . n e t
P a g e 27
become an exporting nation, selling more than we
buy. In many respects the United States will have to
take lessons from the Asian book of competitiveness.
Without that understanding we will be unable to meet
our assumed obligations. The America to which we
have become accustomed will cease to exist.
We Americans went to get money from woefully
overdrawn bank accounts only to find the banking
system could loan no more. We then called upon the
government not only to assume those debts that
individuals and corporations could not meet, but to
loan considerably more, hoping to avoid another
depression. Deep in the national memory is the civil
unrest and global savagery brought on by the Great
Depression, which ended only through the winning of
a world war. With our competitors devastated by the
war and our homeland unscathed, we became the
greatest industrial power ever known. Until the early
1970s, America had a positive balance of trade,
dominating virtually every technology, product, and
market. We have been living off that once lofty
position ever since.
But for the last 30 years competitiveness has not
been about the nation's commercialization of
innovative products in highly scalable markets, but
about short-term returns on investment —- returns
offered by other nations happy to do our
manufacturing and design for a fraction of our cost in
wages and investment. The result today is the
gutting of our industrial base, a structural imbalance
in trade, and a fundamental loss in our ability to
innovate and commercialize —- two functions,
inexorably tied together, without which America can
never pay down its debt nor provide enough jobs.
Turning this situation around will demand great
individual and collective sacrifice. It will also require
that we grasp the principles of competitiveness: As
end-use products, markets, and related technologies
evolve, they become increasingly interrelated,
interdependent, and integrated. They converge. As
this infrastructure grows it becomes very difficult to
define the difference between the functions of
marketing, engineering, and manufacturing, let alone
pick and choose what function you want to control.
The development of the infrastructure is always
evolutionary, never revolutionary. As it grows in
scale, the amount of money invested in it grows
exponentially. A semiconductor manufacturing plant
that cost $50 million in 1984 could cost $6 billion
today. Dropping out of the game often means you
don’t get back in.
The United States has been exiting the game for
nearly thirty years, a strategy rationalized through
short term monetary gains and the dream that
technology can be developed apart from the
infrastructure that supports it. We assume a good
idea will win no matter which nation builds the
May 2010
infrastructure. While a good idea might be worth a
few dollars, the cost of technological innovation and
ability to commercialize it will often run in the billions.
America is in serious danger. It is time to develop a
national strategy for international competitiveness.
Speaker Biography (continued)
member of the Board of Trustees for The Scripps
Research Institute, member of the Board of Trustees
of the Palo Alto Medical Foundation, member of the
University of California (UC) President's Board on
Science and Innovation, and the UC Merced
Foundation, Chairman of the National Science
Foundation Panel on High-Definition Products and
Systems, Co-Chairman of the American Electronics
Association Committee on High-Definition Television,
Vice Chairman of Government Policies Committee of
the Defense Science Board, member of the Council
on Competitiveness and member of the Board of
International Counselors of the Center for Strategic
and International Studies. He has also provided
testimony on U.S. Competitiveness before the Senate
Banking Committee and House Subcommittee on
Science and Technology.
Elkus is a strong advocate for the accessibility and
affordability of higher education. He served as a
member and mentor of the Stanford University's
Future Professors Program. He is the author of
WINNER TAKE ALL: How Competiveness Shapes
the Fate of Nations (Basic Books, 2008). He earned
his undergraduate degree from Stanford University
and his MBA from Dartmouth College, Tuck School of
Business Administration.
Richard Elkus will be introduced by Stanley Myers,
President and Chief Executive Officer of SEMI, in
San Jose, since 1996.
Visit us at w w w .e - G R I D . n e t
P a g e 28
SCV Communications
WEDNESDAY May 12, 2010
The Last Mile Smart Grid WAN
Challenge Few Understand
Speaker: Fred Fletcher, Smart Grid Chief Architect,
Open Access Technology International
Time:
Food/drink and networking at 6:00 PM;
Presentations at 6:30 PM
Cost:
Donation for food/drinks
Place:
National Semiconductor, Building E,
Conference Room, 2900 Semiconductor
Dr, Santa Clara
RSVP:
By May 10 to comsocscv@gmail.com
Web:
www.ewh.ieee.org/r6/scv/comsoc
Fred Fletcher has been an innovator in the
electric power industry for over 35 years. He has just
recently become a smart grid architect after
developing a cross cutting smart grid solution built
primarily for power supply applications for Burbank
Water and Power. Fred was the Assistant General
Manager at Burbank, leading the power supply
division, he retired this year after 24 years to dedicate
his focus on smart grid technology challenges.
Neither he nor the company he works for has a
commercial interest in the technologies discussed in
this presentation, but it is important that the problem
presented be addressed by the market in order to
best deploy his applications and designs.
May 2010
Smart grid development has been driven by
revenue billing and some distribution application, but
the greatest value of smart grid technologies appears
to be in matching load to available power supply.
Matching load to variable non-firm wholesale power
requires fast two-way digital networks.
This
presentation illustrates the problem and discusses
possible private network and public carrier solutions
using 4G/LTE, Wi-Fi Mesh and WiMax technologies.
With such networking, security issues rise that
could have great importance. Using such networking
to take down New York, Washington DC, Los
Angeles, or vast areas of the nation can be
devastating, taking the power grid down on command
using such networking in conjunction with terrorist or
military action could be even more serious. Security
is of paramount concern and must be built into the
networking from the beginning and be capable of
continual improvement. Many of the practices that
are common over the Internet cannot be tolerated on
such a smart grid network. Traffic over the smart grid
network must be restricted to approved traffic only, by
approved users, and some function might only be
performed by specific devices.
Smart grid intelligent networks have the potential
to make power grids stronger. In the past regional
blackouts have occurred because an outage began to
cascade into large blocks of power. The power grid
is designed to withstand failure without cascading
failures, but under certain conditions or under multiple
failures the risk of cascading failure increases. Smart
grid intelligent network can provide control
intelligence sufficient to recognize and stop
cascading system failures.
The bandwidth requirements of the smart grid are
just beginning to become understood. As recently as
last year speeds of 200kbps was generally thought to
be sufficient for smart grid applications. As demand
response has become better understood the
bandwidth requirements have increased by orders of
magnitude.
A unified communications plan is needed, but the
reality is that it is the market place and the technology
developers that will determine how this problem will
be addressed in this country. This is an opportunity
for new technological development.
Visit us at w w w .e - G R I D . n e t
P a g e 29
OEB Industry Applications
THURSDAY May 13, 2010
Approaches to Arc Flash
Hazard Mitigation
Speaker: Gary H. Fox, Senior Specification Engineer,
GE Industrial Solutions
Time:
Demo trailer at 3:00 PM; No-host social at
5:30 PM; Presentation at 6:15 PM; Dinner
at 7:15 PM; Presentation continues at 8:00
PM
Cost:
Dinner is $20 for IEEE members; $25 for
non-members
Place:
Marie Callender's Restaurant - The Garden
Room, 2090 Diamond Blvd, Concord
RSVP:
Please respond by May 12 to Gregg Boltz,
gboltz@brwncald.com, 925-210-2571
Web:
www.e-grid.net/docs/1005-oeb-ias.pdf
Gary H. Fox has been a Senior Member of IEEE
since 2001. He received his BSEE from California
Polytechnic State University, San Luis Obispo in
1978. He has been a licensed Professional Engineer
since 1982. He has been employed by General
Electric Company for over 31 years. His current
assignment is as a Senior Specification Engineer for
GE Industrial Solutions in Concord, providing
application and technical support for power
distribution and control equipment.
Mr. Fox is a member of the IEEE Industry
Applications and IEEE Power Engineering Societies
and has authored or co-authored several papers and
articles covering a diverse range of topics such as arc
flash, protective relay application, transient voltage
surge protection, selective coordination, and
application of electrical equipment in seismic hazard
locations. He is an active member in several Industry
Applications Society working groups concerning
power distribution and protection.
May 2010
This evening there will be two presentations
related to Arc Flash Hazard Mitigation:
1. Advanced breaker trip unit technologies, including
zone selective interlock, maintenance mode,
and enhanced time current curve adjustment
options can limit let-through energy and reduce
arc flash hazards without compromising system
selectivity.
This presentation will illustrate
through a case study approach the amount of
arc flash incident energy reduction that might be
realized at typical low voltage unit substations.
2. The predominant technologies for reducing arc
flash incident energy today rely on the speed of
protective devices, remote operation, arcresistant enclosures that channel energy where
it is less dangerous, and crowbars to divert the
arc energy into a bolted fault. None of these
methods has provided a solution for all
situations, particularly in existing installations.
The second presentation will describe a method
for diverting an arcing fault’s energy into a
specific environment within a half-cycle after
initiation of the arc, without the need to
introduce bolted fault current like a crowbar or
for fast current interruption, such as a currentlimiting fuse. The system protection provided is
similar to that of arc-resistant switchgear without
reliance on the strengthening or integrity of the
equipment enclosure.
Please note that a GE demonstration trailer with a
sample of the device described in the second
presentation (along with other notable exhibits) will be
available for visiting from 3:00pm to 6:00pm in the
parking lot outside the restaurant.
Visit us at w w w .e - G R I D . n e t
P a g e 29
OEB Magnetics
MONDAY May 17, 2010
Novel Magnetic Materials and
Magnetic Devices
Speaker:
Time:
Cost:
Place:
RSVP:
Web:
Prof. Yang-Ki Hong, University of Alabama
11:00 AM
none
Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley
Please respond by email with name,
company, to Peter Fischer,
PJFischer@lbl.gov by May 12
ewh.ieee.org/r6/oeb/mag
May 2010
A number of recent results achieved in the areas
of ferrite, magnetic films and nanoparticles, and
design and performance of magnetic RF devices by
the author’s laboratory will be introduced. The first
part of this talk focuses on spherical barium ferrite
(S-BaFe) nanoparticles for terabytes tape cartridge,
vortex chirality in spin-valve nanodisk for spin-torque
transfer random access memory (STT-RAM),
magnetic domain structure of submicron permalloy
ring, scaling effect of S-shaped permalloy nanoelement on bias field for magnetic logic element,
biferroic Y-type hexaferrite for magneto-electric
random access memory (ME-RAM), and green
energy permanent magnets (MnAl and MnBi) for
electric vehicles applications.
The second part
covers a self-biased GHz hexaferrite circulator, a
miniature ferrite MHz-GHz antenna, and a low-power
MHz ferrite inductor. Finally, future novel magnetic
materials will be suggested as they underpin
multifunctional magnetic devices.
Visit us at w w w .e - G R I D . n e t
P a g e 30
SCV Nanotechnology
TUESDAY-WEDNESDAY May 18-19, 2010
Nanotechnology – State
of the Art and Applications
Speakers: IEEE Distinguished Lecturer from TX
State, Univ ov Albany CSNE, NEC Japan,
U of TX NanoMed, Harvard, UCSD, Max
Planck Inst, Stanford, SJ BioCenter,
Nanosys, AMAT, IBM, others
Time:
Tuesday 8:00 AM - 6:00 PM; Wednesday
8:00 AM - 5:00 PM
Cost:
IEEE Members $160, Students $125, NonMembers $210 (before April 30th)
Place:
National Semiconductor Bldg E-1 CMA
Room. 2900 Semiconductor Drive, Santa
Clara
RSVP:
from the website
Web:
www.ieee.org/nano
Tuesday May 18th
7:30 AM Registration & Continental Breakfast
Morning:
- Dr. Michael Liehr, VP Strategy CNSE Albany, “State
of US Nanotech”
- Dr. Shuichi Tahara, Gen. Mgr. Nanoelectronics Res.
Labs, NEC Electronics, “State of Pacific Rim
Nanotech.”
- Dr. Burton Lee, Stanford Univ, “State of European
Nanotech.”
- Mark Bunger, Director, Lux Research, “NanoBio
Medical Business”
- Melinda Richter – Executive Director – San Jose
BioCenter -"An Incubator Approach to NanoBio
Development"
- Bikash Chatterjee - President & CTO -Pharmatech
Associates, Inc. - “Regulatory Issues Nanotechnology in Therapeutic Delivery
Systems”
Noon: Lunch and networking
Afternoon:
- Dr. Mauro Ferrari, Chair, Dept. of Nanomedicine,
Univ. Texas, “Silicon Nanotech for Medicine”
- Dr. Charles Lieber, Professor, Harvard,
“Nanoelectronics Meets Biology: From
Ultrasensitive Detection to Cellular Interfaces”
- Adityo Prakash, CEO of Verseon, “Engineering
Novel Drug Molecules: Replacement of Trial
and Error Driven Discovery by Systematic
Quantitative Methods”
May 2010
- James Gee, Distinguished Member of Technical
Staff, Applied Materials, Co., - “Nano-enabled
Solar”
- Joe Fisher, CEO, Contour Energy Systems,
"Reshaping Portable Power Using Nano
Materials"
- Thomas Daue, President, Smart Material
Corporation, “Energy Harvesting Systems
Using Piezo-electric Macro Fiber Composites”
5:00 PM Mixer and networking / Appetizers / Drinks /
Sponsors
Wednesday May 19th
Morning:
- Dr.Richard B. Kaner, Professor of Chemistry and
Professor of Materials Science & Engineering,
UCLA, “Synthesis and Applications of
Conducting Polymer Nanofibers.”
- Dr. Wenbing Yun, CTO, Xradia, "Nondistructive 3D
Vizualization of Nanoworld"
- Jon Brodd, CEO, Cima Nanotech,"Self Aligning
Nano Technology for Electronics"
- Dr. Walter Trybula, IEEE Distinguished Lecturer and
Director Nanomaterials Application Center –
Texas State University,
- Dr. Hans Stork, VP and CTO Applied Materials,
“Nanotechnology in Semiconductor Industry”
- Dr. Mike Stuke, Prof. Max Planck Inst., "Laserdirect-write creation of free-standing 3D
structures and some biotech applications"
- Dr. Joy Cheng - Research Staff Member,
Lithography Materials Group, IBM Almaden
Research Center - "Nanofabrication: bottom-up
meets top-down".
12:30: Lunch and networking
Afternoon:
- Dr Jason Hartlove, President and CEO Nanosys,
Inc. " From Concept to Creation: The Journey
from R&D to Everyday Products"
- Dr. Deli Wang, Professor ECE, UCSD "Nanowires
for nanoelectronics applications"
- Dr. Jeff Neaton, Director, LBNL Molecular Foundry,
"Novel Materials and Mechanisms for Solar
Energy Conversion"
- Prof. Cun-Zheng Ning, Professor of Electrical
Engineering, Center of Nanophotonics-Arizona
Institute of NanoElectronics, Arizona State
University, "Composition graded alloy
nanowires for full-spectrum solar cells"
Visit us at w w w .e - G R I D . n e t
P a g e 31
SCV Photonics
WEDNESDAY May 19, 2010
Half a Century of Lasers:
How it All Got Started
Speaker: Jeff Hecht, Author of Beam: The Race to
Make the Laser
Time:
Networking/Light Dinner at 6:00 PM,
Presentation at 7:00 PM
Cost:
none
Place:
Applied Materials Bowers Cafeteria, 3090
Bowers Ave., Santa Clara
RSVP:
from the website
Web:
www.ewh.ieee.org/r6/scv/leos
Jeff Hecht is the author of Beam: The Race to
Make the Laser (Oxford University Press, 2005),
Understanding Lasers 3rd ed (IEEE Press/Wiley
2008) and several other books. He is a contributing
editor to Laser Focus World, a correspondent for New
Scientist magazine, and writes regularly for Optics &
Photonics News. He holds a B.S. in electronic
engineering from Caltech, and has been writing about
lasers since 1974.
May 2010
The laser's conceptual roots go back to Albert
Einstein's idea of stimulated emission, but the action
didn't start until the invention of the microwave maser
in the 1950s. The next logical step was to the higher
frequencies of light waves, but how to get there was a
problem. Charles Townes formulated the physics
problem of how to build a laser. Then he and Gordon
Gould separately solved it on paper, launching a race
to make the laser that soon involved Bell Labs,
ARPA, Columbia University, IBM, American Optical,
and other labs. The winner of the race was a dark
horse, Theodore Maiman of Hughes Research Labs,
with an elegant design that others replicated within
weeks of its disclosure, starting the laser age. This
talk will describe the laser race, and the dawn of the
laser age.
Visit us at w w w .e - G R I D . n e t
P a g e 32
SCV Engineering in Medicine and Biology
WEDNESDAY May 19, 2010
Applying Therapeutic Device
Innovation To Clinical Medicine:
The Evalve Story
Speaker: Dr. Fred St. Goar, El Camino Hospital
Time:
Optional dinner at Nexus Cafeteria in the
Clark Center, 6:15 pm (no host, no
reservations); Presentation at 7:30 PM
Cost:
none
Place:
Room M-114, Stanford University Medical
School, Stanford
RSVP:
not required
Web:
www.ewh.ieee.org/r6/scv/embs
May 2010
Fred St.Goar is an interventional cardiologist at El
Camino Hospital. He did his internal medicine and
cardiology training at Stanford in the eighties during
the hayday of cardiology medical device development
where he took his lead from the plethora of
successful enterpreneurs who were actively involved
with the Stanford program including Tom Fogarty,
John Simpson, Paul Yock and Rich Popp to name a
few. Since his training he has been actively involved
in the early development of a number of projects that
went on to become successful companies including
Heartport, Cardiovascular Imaging Systems and
Cryovascular Systems. In 1999 he cofounded with
the Foundry, a then fledging medical device
incubator. Evalve, a company that prior to recently
being acquired by Abbott was recognized as one of
the leaders in area of percutaneous mitral valve
intervention. His talk will take you through the Evalve
story from the perspective of a physician innovator.
Visit us at w w w .e - G R I D . n e t
P a g e 33
SCV Power Electronics, with Women in Engineering
WEDNESDAY May 19, 2010
Behind the Scenes
at IEEE SPECTRUM,
with Tekla Perry
:
Speaker: Tekla S. Perry, Senior Editor, IEEE
Spectrum Magazine
Time:
Networking & Pizza at 6:30 PM;
Presentation at 7:00 PM
Cost:
none
Place:
National Semiconductor Building E
Auditorium, 2900 Semiconductor Drive,
Santa Clara
RSVP:
not required
Web:
www.ewh.ieee.org/r6/scv/pels
You've seen this publication for as long as you've
been an IEEE member. A veteran editor will tell you
how it's changed, how the editorial process really
works, and what being a technology journalist today
is like in a world of podcasts and blogs and youtube.
For anyone who has ever thought about writing an
article for a technology magazine, who might be
interviewed by the technology press, or is simply a
curious reader.
Tekla Perry, Senior Editor at IEEE
SPECTRUM
Magazine,
covers
consumer electronics, electronics and
the environment, and high-tech
startups from Spectrum's west coast
office in the heart of Silicon Valley, just
a few blocks from Stanford University.
Her feature articles, podcasts, blog
posts, videos, and product reviews
typically look at the people as well as
the technology behind the news. In
2008, she spearheaded Spectrum's
coverage of the U.S. transition to
digital television; her multimedia report
on a new battery technology and the engineer behind
it, "The Lady and the Li-On," was featured on public
radio's nationally syndicated program, "Here and
Now." Tekla's a long-time Spectrum veteran; her
articles on Xerox PARC, the Atari VCS, the birth of
the graphical user interface, global warming, and the
problems of the U.S. air traffic control system (which
won an award from the American Society of Business
Publication Editors) have become oft-referenced
classics. She received a B.A. degree in journalism
from Michigan State University.
Keep up-to-date on electrotechnology in the SF
Bay Area – Join the email Distribution List for the
IEEE’s e-GRID today!
www.e-grid.net/subscribe
News of upcoming meetings and conferences, delivered
twice a month to your INBOX – no cost.
May 2010
For an RSS feed of upcoming
meetings/events, visit:
www.e-grid.net/rss
Choose from 10 different categories!
Visit us at w w w .e - G R I D . n e t
P a g e 34
SCV Consumer Electronics
TUESDAY May 25, 2010
Electronics Manufacturing
by Inkjet Printing
Speaker: Joel Yocom, Conductive Inkjet Technology
Time:
Networking and pizza at 6:30 PM,
Presentation at 7:00 PM
Cost:
$5 for IEEE members, $10 for nonmembers (pay at the door)
Place:
nVIDIA - 2800 Scott Blvd., Building E,
Santa Clara
RSVP:
from the website
Web:
ewh.ieee.org/r6/scv/ce
Joel Yocom is a 25+ year veteran of the flexible
circuit board industry and has specialized in the
development of new technologies during much of that
time. He has worked for industry leaders such as
Parlex, Litchfield Precision Components and Gould in
developing products and services to support the
advancement of flexible circuit technology. For the
last 3 ½ years Joel has led the business development
efforts for Conductive Inkjet Technology, where he is
Business Development Manager, and explored
opportunities in the exploding Printed Electronics
market.
May 2010
Inkjet printing is of great interest in the field of
electronics manufacture because its digital nature
negates the need for physical tooling. A wide variety
of active and passive materials are currently being
investigated for use in inkjet printed electronics.
These include semiconductors, light emitters and
photovoltaic materials as well as dielectric materials
and conductors. The range of conducting materials
that can be printed is somewhat limited by the
constraints of inkjet printing. Ideally, particle sizes
should be below 1 micron and the viscosities and
surface tensions of the fluids need to be tailored to
the particular printhead being used. Regardless of
these limitations, various technologies are now being
implemented in the production of circuit boards,
interconnects and antennas by inkjet printing. The
properties of these inkjet printed circuits do not
currently mimic traditional PCB materials – in
particular, the sheet resistances of inkjet printed
materials tend to be significantly higher than
traditional copper clad laminate and the minimum
feature sizes are somewhat larger than state of the
art semi-additive plating. However, inkjet printed
circuit technologies are a still finding many
applications which are particularly well suited to their
properties and the digital nature of their application.
Visit us at w w w .e - G R I D . n e t
P a g e 34
SCV Magnetics
TUESDAY May 25, 2010
Overview of Recent Developments
in HAMR Technology
Speaker: Jan-Ulrich Thiele, Seagate Technology, Inc.
Time:
Networking and pizza at 7:00 PM,
Presentation at 7:30 PM
Cost:
none
Place:
Western Digital, 1710 Automation Parkway,
San Jose
RSVP:
Not required
Web:
ewh.ieee.org/r6/scv/mag
Both leading contenders in the hard disk drive
(HDD) industry’s continuing quest for ever increasing
areal storage densities, bit patterned media recording
(BPM) and heat assisted magnetic recording
(HAMR), will bring profound changes to the
components and architecture of the HDD and the way
they are manufactured.
In this presentation
Dr. Thiele will give an overview of the working
principles of HAMR, the current status and remaining
challenges for the envisioned introduction of this
recording technology at areal densities of 1 Tbit/in2 or
above.
Jan-Ulrich Thiele holds a PhD in Physics from
the University of Basel in Switzerland. After 12 years
at IBM and Hitachi GST working on many aspects of
magnetic recording technology, he joined Seagate
Technologies in Spring 2008 as a Technologist and
Senior Director for Media R&D where he currently
leads a team of Scientists and Engineers developing
HAMR media technology
May 2010
Visit us at w w w .e - G R I D . n e t
P a g e 35
SF Industry Applications
TUESDAY May 25, 2010
Arc Flash Management and
Technology & Plant Tour
Speakers: Ed Rossi, President; Ashok Kulkarni, Vice
President Engineering; Predrag Milovac,
Design Development Manager, Industrial
Electric Mfg (IEM)
Time:
Social and buffet-style dinner at 5:30 PM;
Presentation at 6:00 PM; Plant tour at 7:00
PM
Cost:
none (reservations required; seating
limited)
Place:
Industrial Electric Mfg (IEM), 48205 Warm
Springs Blvd., Fremont
RSVP:
please email Jim Avery, jima@iemfg.com
to reserve your seat
Web:
www.e-grid.net/docs/1005-sf-ias.pdf
Measures to increase equipment and personnel
safety in manufacturing are reflected in new
approaches and technologies designed to help
minimize the risk of workplace dangers in the event of
an arc flash. With a multitude of potential dangers
and new ones continuously emerging, companies
must be diligent in their ongoing efforts while
considering new approaches and technologies to
improve plant safety. This presentation will focus on
implementing techniques and practices designed to
reduce hazards and minimizing risk for workers who
must enter an area with an electrical arc-flash
potential.
Ed Rossi is president and chief executive officer of
IEM. Under his direction, IEM annual sales have
grown over 400% since 2004 and the company has
forged a solid reputation as a manufacturer of custom
electrical distribution equipment.
Ashok Kulkarni is vice president of engineering at
IEM, overseeing the development of new products
and customer solutions, product testing, IEM
processes, and agency certifications. Kulkarni was
awarded a Ph.D in Electrical Engineering from Texas
A&M.
Predrag Milovac is design development manager
at IEM responsible for the research, development and
execution of IEM’s new arc resistant switchgear.
Milovac earned a Master of Science from Purdue
University.
May 2010
Visit us at w w w .e - G R I D . n e t
P a g e 36
SCV Components, Packaging and Manufacturing Technology
THURSDAY May 27, 2010
Thermal Management for
the Design of Telecom
and Server Systems
(with Lab Tour)
Speaker: Marlin Vogel, Electronic Cooling Solutions
Time:
Registration, free pizza and soft drinks at
11:30 AM; Presentation at 12:00 Noon;
Tour at 12:30 PM
Cost:
none
Place:
Thermal Design Center, 2915 Copper
Road, Santa Clara
RSVP:
Through the website link; limited to first 40
registrants.
Web:
www.cpmt.org/scv
Marlin Vogel has over 25 years of experience in thermal
management of electronic and aerospace products. He
holds 11 patents and has authored or co-authored over 20
technical papers and publications. Before joining ECS,
Marlin held a position as a Senior Staff Engineer at Sun
Microsystems, where he worked on a wide variety of
projects during the last 18 years. Prior to working at Sun,
Marlin held a position as Engineering Specialist while at
the General Dynamics military aircraft division for 7 years,
2 years as a Research Assistant at University of Wisconsin,
and 2 years as an Engineer at Ipsen Industries. Marlin has a
Masters of Science Degree in Mechanical Engineering
from the University of Wisconsin - Milwaukee.
May 2010
A systematic approach will be provided for architecting
and determining the feasibility of a system thermal design,
along with presenting the necessary process steps required
to validate and finalize a reliable system design. The
approach includes combining “back-of-the-envelope”
calculations with computational fluid dynamic (CFD)
analysis to identify a preliminary system design; identify
critical areas for long lead thermal component design, if
applicable, such as heat pipe heat sinks or air movers;
define thermal component and system testing in order to
determine boundary conditions required by the CFD
analysis for updating the system design, along with
validating preliminary and final versions of the thermal
design. The role and impact of the thermal architect and
design process on the overall system architecture and
design will be presented. Wind tunnel test methods will be
demonstrated for validating the system airflow
performance, along with validating air mover performance.
The facility tour will also include demonstrating CFD
analysis prediction of airflow results for a system,
depicting the steady state airflow trajectory path through
the system.
Visit us at w w w .e - G R I D . n e t
P a g e 37
OEB Magnetics
FRIDAY May 28, 2010
Multiscale Magnetic Models:
From Electronic Structure
to Device Design
Speaker: Roy Chantrell, Physics Department, The
University of York
Time:
11:00 AM
Cost:
none
Place:
Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley
RSVP:
Please respond by email with name,
company, to Peter Fischer,
PJFischer@lbl.gov by May 24
Web:
ewh.ieee.org/r6/oeb/mag
Professor Roy Chantrell has made a number of
contributions to the theory of magnetism, in particular
the development of models of spin dynamics in
complex magnetic systems. He has published around
340 refereed research papers with over 5000
citations and has given invited papers at the major
international magnetism conferences (MMM and
Intermag) and at specialist magnetism meetings.
Until 1989 he was Professor at the University of
Central Lancashire, moving to the Universities of
Keele (1989), Bangor (1996) and Durham (1999).
His research group consisted of around 7 students
and postdoctoral researchers and received extensive
support from the national funding councils, the EU
and industry. In 2001 he moved to Seagate research
(Pittsburgh) to establish and lead a theory group
carrying out work on lengthscales ranging from abinitio calculations to large-scale micromagnetic
simulations. Here he initiated pioneering research
into the development of atomistic calculations with
parametrised ab-initio information. This was applied
especially to nanoparticles of FePt, to an
understanding of the physics of heat-assisted
magnetic recording, and to the development of
atomistic models of read elements. Chantrell was the
recipient of a Seagate Technical Achievement Award
in 2004. In August 2004 he was appointed to a chair
of Condensed Matter Theory at the University of
York, UK. He currently leads a group comprising 1
academic member of staff, 1 postdoctoral researcher
and 8 postgraduate students.
(Continued, next column)
May 2010
Magnetic materials make a vital contribution to a
number of technologies, including of course magnetic
recording. Increasingly, materials are structured on
the nanoscale in order to produce the desired
properties for specific applications. In addition, future
applications may require heating of the material up to
and beyond the Curie temperature characteristic of
the magnetic phase transition.
The important
consequence is that the usual formalism, termed
‘micromagnetics’, cannot be used to investigate such
complex phenomena. I will describe the development
of new approaches linking electronic structure
calculations and atomistic spin models of magnetic
materials and outline applications to the fundamental
understanding of ultrafast magnetisation reversal. In
particular I will show that magnetisation reversal in a
timescale of 300 femtoseconds is possible, and will
describe the implications for heat assisted magnetic
recording.
Finally, I will outline recent developments which
allow the bridging of the atomistic and mesoscopic
lengthscales, allowing the models to be applied to the
understanding of macroscopic experiments and
ultimately to device design. This model will be
applied to the investigation of heat assisted magnetic
reversal and also opto-magnetic reversal, in which
magnetisation reversal occurs in response to a pulse
of circularly polarised laser light.
It is shown (in agreement with experiment) that
switching times on the sub-picosecond timescale are
possible, with important implications for magnetic
recording and spin-electronic devices.
-------------------From Oct 1986 - Sept 1987 he was Visiting Fellow,
Mathematics Department, Imperial College, London.
Since then Chantrell has held numerous visiting
scientist positions, most recently at the Universite
Pierre et Marie Curie (Paris), Fudan University
(Shanghai) and the National University of Singapore,
where he has been appointed visiting Professor from
2009-2012. He is Editor of the Journal of Magnetism
and Magnetic Materials, a member of the advisory
board of a number of international conferences, and
make regular contributions as member of the program
and publications committees of these meetings. He
was a member of the management committee of the
UK EPSRC Advanced Magnetics Program (19951998). He is a member of the AdCom of the IEEE
Magnetics Society, and Coordinator of the IEEE
Magnetics
Society
Distinguished
Lecturer
Programme.
Visit us at w w w .e - G R I D . n e t
P a g e 38
IEEE-USA Entrepreneurs Webinar Series
THURSDAY May 20, 2010 (1 of 5)
Link Your Business Plan
to Your Financing Needs
(5-part Webinar)
Instructor: Dr. Dileep Rao, adjunct professor and
author of Lessons from Bootstrap to Billions
Time:
11:00 AM - Noon (monthly, part 1 of 5)
Cost:
IEEE members: $69 each or $129 for all
five. Non-members: $99 for each or $225
for all five
Place:
on the Internet
RSVP:
Sign up in advance, from the website
Web:
www.ieeeusa.org/careers/webinars/2010/
Bootstrap-to-Billions.html
Dr. Dileep Rao, financier, columnist, adjunct
professor and workshop leader, has partnered with
the IEEE-USA Entrepreneurial Activities Committee
to conduct a series of webinars for you. Dr. Rao
financed more than 450 businesses and real estate
projects as the vice-president of a venture
development financial institution.
Currently, Rao is an advisor to governments,
Fortune 1000 corporations, development financial
institutions
and
entrepreneurs
on
business
development and financing. He also teaches New
Business Development & Financing in MBA and
Executive MBA programs in the United States,
Europe and Asia, and has been selected as
Outstanding MBA Teacher at the Carlson School of
Management located at the University of Minnesota.
Rao is an entrepreneurial finance columnist for
Forbes.com, and has written such acclaimed books
as Handbook of Business Finance & Capital
Sources and Business Financing: 25 Keys to
Raising Money. He also holds two engineering
degrees and a Ph.D. in Business Administration.
May 2010
Dr. Dileep Rao, author of Lessons from
Bootstrap to Billions, will lead a series of IEEE-USA
webinars for future and seasoned entrepreneurs.
The webinars will be based on his book, which
illustrates how, contrary to currently popular belief,
entrepreneurs can bootstrap to success. Bootstrap to
Billions shows entrepreneurs and managers how
business giants used alternate financing options to
grow. Most of them — about 80 percent — never got
venture capital. These entrepreneurs found their best
market; designed the right strategy; developed the
organization culture and leadership; and reached the
top with capital-efficient strategies that minimized the
need for capital. Lack of money did not constrain
their growth. Many entrepreneurs may be better off
using alternate financing to build and control their
business, and to create wealth and keep it. Dr. Rao's
presentations are broken down into a series of five
monthly webinars:
20 May 2010 - Link Your Business Plan to Your
Financing Needs
24 June 2010 – Matching Financing Needs to the
Right Financial Structure
22 July 2010 - Fine-Tune Financing: Finding the
Right Sources/Instruments
19 August 2010 - Reduce the Agony: Learn How to
Find Financing
16 September 2010 - After the Financing: Better
Decisions & Control
See Part 2 description later in this
GRID.pdf (on June 24th)
Visit us at w w w .e - G R I D . n e t
P a g e 39
SCV Computer, with Solid State Circuits
TUESDAY June 8, 2010
48-Core Cloud Computer Chip
Speaker: Jason Howard, Senior Technical
Researcher, Intel
Time:
Networking with food and beverage at 6:30
PM; Presentation at 7:00 PM
Cost:
$2 donation helps cover food
Place:
National Semiconductor, Building E
Conference Center, 2900 Semiconductor
Drive, Santa Clara
RSVP: Via EventBrite link: 48corechip.eventbrite.com
Web:
ewh.ieee.org/r6/scv/computer
Jason Howard is a senior technical research lead
for the Advanced Microprocessor Research team
within Intel Labs, Hillsboro, Oregon. During his time
with Intel Labs, Howard has worked on projects
ranging from high performance low power digital
building blocks to the 80-Tile TeraFLOPs NoC
Processor. His research interests include alternative
microprocessor architectures, energy efficient design
techniques, variation aware and tolerant circuitry, and
exascale computing.
Jason received the B.S. degree and M.S degree in
electrical engineering Brigham Young University,
Provo, UT, in 1998 and 2000 respectively. He joined
Intel Corporation in 2000. He has authored and coauthored several papers and has several patents
issued and pending.
May 2010
In this talk, Jason Howard describes a processor
integrating 48 IA-32 cores, 4 DDR3 memory
channels, and a voltage regulator controller in a 6×4
2D-mesh network-on-chip architecture. Located at
each mesh node is a five-port virtual cut-through
packet switched router shared between two cores.
Core-to-core communication uses message passing
while exploiting 384KB of on-die shared memory.
Fine grain power management takes advantage of 8
voltage and 28 frequency islands to allow
independent DVFS of cores and mesh. At the
nominal 1.1V, cores operate at 1GHz while the 2Dmesh operates at 2GHz.
As performance and
voltage scales, the processor dissipates between
25W and 125W.
The 567mm2 processor is
implemented in 45nm Hi-K CMOS and has
1,300,000,000 transistors.
Visit us at w w w .e - G R I D . n e t
P a g e 40
SCV Components, Packaging and Manufacturing Technology
WEDNESDAY June 9, 2010
Novel Fine Pitch, Low Profile,
Low Cost Connector Technology
Speaker: David Light, VP Technology, Neoconix, Inc.
Time:
Dinner at 6:00 PM; Presentation at 6:45 PM
Cost:
$20 if reserved by June 7 ($10 for students,
unemployed); $5 more at door; vegetarian
available; no cost for presentation only
Place:
Biltmore Hotel, 2151 Laurelwood Rd (Fwy
101 at Montague Expressway), Santa Clara
RSVP:
Through the website link
Web:
www.cpmt.org/scv
David Light is Vice President, Technology at
Neoconix, Inc.
Prior to joining Neoconix in
September, 2009, he was an independent consultant
in providing ongoing and project-based services in
technology
development,
intellectual
property
evaluation, business strategy, and technology
marketing to clients including Tessera, Samtec, Flint
Hills Solutions, Microconnex, Coleman Research
Group, Latham and Watkins, and Neoconix, in areas
spanning microelectronics packaging, high density
substrates, and surface mount technology.
His
career has included fundamental process and
materials R&D, process and product development,
technology management, marketing and business
development, manufacturing operations, and General
Management.
His areas of expertise include
substrates and printed circuits, semiconductor
packages (including assembly, test and burn-in),
interconnect
technologies,
test
tooling,
and
miniaturized electronic systems.
David’s career
began at the IBM T.J. Watson Research Center, in
the electrochemical studies group, and has included
technology and business leadership positions at IBM
Microelectronics,
Tessera,
Flex2Chip,
and
Sunright/KES Systems.
David is a graduate of Stanford University. He has
over three dozen issued US patents and has
authored numerous technical publications and
presentations. He is a member of IEEE CPMT.
May 2010
This talk will present a revolutionary connector
technology providing unparalleled design flexibility at
low cost. A photolithographic approach to connector
definition coupled with batch, printed circuit
manufacturing methods allows highly configurable
designs.
Pin-out
modifications,
electrical
performance tuning, tailoring of mechanical
characteristics, and even adjustment of connector
thickness can be accomplished quickly and easily
with CAD modifications to low cost photo-masks
and/or by modifications to the bill of materials.
Connectors can be custom designed and fully
optimized for each revision or generation of a
product, with minimal tooling costs and lead time.
Lithographically defined contact arrays also enable
high levels of integration and miniaturization — pitch
is no longer limited by the practical limitations of
injection molding connector housings into which free
standing spring contacts are subsequently stitched.
Neoconix utilizes a MEMS process model,
implemented using the low-cost printed circuit
substrate infrastructure, to fabricate contact arrays
that can scale with advances in photo-lithography and
HDI printed circuit substrate technology.
The connector fabrication process starts by
defining arrays of copper alloy beams, in sheet
format, in their ultimate configuration using large
format, batch lithography and etch methods. The
arrays of beams, still in sheet format, are then formed
into three dimensional, 'S'-shaped cantilever beams,
using low cost, programmable dies. The sheets of
contact arrays are subsequently integrated into
connector 'interposer' structures using standard
printed circuit fabrication processes, including
lamination, plating, and etching. The resulting one or
two sided contact arrays can function as freestanding
interposers
or
are
readily
integrated
into
standardized, low cost connector housings that
provide alignment, attachment and actuation.
This talk will review basic elements of the
Neoconix PCBeam technology, and will use realworld applications as well as simulations to describe
recent learning on the relative impact of the flexible
design elements on signal integrity and bandwidth,
mechanical
characteristics,
durability,
contact
resistance, and reliability, and will describe
applications where system level designs have been
improved from a functional, form factor and/or cost
perspective by implementing Neoconix interconnect
structures.
Visit us at w w w .e - G R I D . n e t
P a g e 41
SCV Nanotechnology
TUESDAY June 15, 2010
Nanophosphors:
Lighting to Life Sciences
Speaker: Dr. Ravi P. Rao, Materials Research
Laboratory, SRI International
Time:
Registration & light lunch at 11:30 AM;
Presentation at 12:00 Noon
Cost:
IEEE Members and Students $5;
Non-Members $10
Place:
National Semiconductor Bldg E-1 CMA
Room, 2900 Semiconductor Drive, Santa
Clara
RSVP:
from the website
Web:
www.ieee.org/nano
Ravi P Rao is currently working as Phosphor
Program Leader at SRI International. He obtained his
Ph. D. from Indian Institute of Technology in material
science in 1982. Since then, he has worked in
Government, academia and industry and continues
his work in developing phosphors for Lighting,
Displays, Medical, Military, Security, Solar Energy,
and Authentication. He published a book, contributed
number book chapters publications (79), 19 patents.
He is a Fellow of the Luminescence Society of India.
He is also a senior member of IEEE, SID, LSI and
other scientific societies.
May 2010
Nanomaterials are extensively investigated due to
better optical, electrical and mechanical properties in
various applications. In nanocrystals, the quantum
confinement effect plays an essential role in optical
transitions.
Nanocrystals have large surface-tovolume ratios. Luminescent properties will depend on
the size and surface structure of nanocrystals.
Various nanophosphors of novel formulations and
processes of synthesis with better morphology, high
efficiency, improved stability and longer life are being
developed at SRI International. Efforts are being
made to employ these nanophosphors in medical
applications such as photodynamic therapy, DNA
sequencing, high resolution digital mammography,
cancer diagnosis and therapeutics, bio-imaging, dosimetry, and –tagging. Advantages of applying
these nanophosphors in LED based solid state
lighting, 3D displays, in defense as NIR sensors, and
invisible markers, and in security to sense nuclear
radiation from WMD (biological and nuclear events),
and authentication markers along with various
process in synthesis and manufacturing will be
described. Finally, pros, cons and challenges (cost,
environmental impact, personal safety, health risks
and storage) in manufacturing of nanophosphors will
also be presented.
Visit us at w w w .e - G R I D . n e t
P a g e 42
OEB Industry Applications
THURSDAY June 17, 2010
Cyber Security for Industrial
Control Systems
Speaker: Joseph Weiss, Managing Partner, Applied
Control Solutions, LLC
Time:
No-host social at 5:30 PM; Presentation at
6:15 PM; Dinner at 7:15 PM; Presentation
continues at 8:00 PM
Cost:
Dinner is $20 for IEEE members; $25 for
non-members
Place:
Marie Callender's Restaurant - The Garden
Room, 2090 Diamond Blvd, Concord
RSVP:
Please respond by June 16 to Gregg Boltz,
gboltz@brwncald.com, 925-210-2571
Web:
www.e-grid.net/docs/1006-oeb-ias.pdf
Joseph Weiss is an industry expert on control
systems and electronic security of control systems,
with more than 35 years of experience in the energy
industry. Mr. Weiss spent more than 14 years at the
Electric Power Research Institute (EPRI).
He
provided
testimony
before
three
House
subcommittees and one Senate Committee. He has
published over 60 papers on instrumentation,
controls, and diagnostics including a chapter on cyber
security for Electric Power Substations Engineering
and the book Protecting Industrial Control Systems
from Electronic Threats. He was tasked to write the
White Paper on Industrial Control Systems Security
for the Center for Strategic and International Studies
Blue Ribbon Panel preparing cyber security
recommendations for the Obama administration. Mr.
Weiss has conducted several SCADA, substation,
plant control system, and water systems vulnerability
and risk assessments and conducted short courses
on control system security. He established and
chairs the annual Control System Cyber Security
Conference. Mr. Weiss is an ISA Fellow with two
patents on instrumentation and control systems. He
is a registered professional engineer in the State of
California, and a Certified Information Security
Manager.
May 2010
The convergence of Industrial Control Systems
(ICS) with general information technology (IT)
systems has created security vulnerabilities for the
traditionally isolated ICS. The convergence is driven
by: 1) the need to share process monitoring data
among different corporate work groups; 2) the widespread adoption of Ethernet for data communication
of ICS; and 3) the ability to leverage existing IT
networks and backbone systems.
Corporate downsizing has led to the need for
remote access to support ICS. Remote access
includes dial-up, LAN/WAN, wireless, etc. With the
flexibility of remote access come additional cyber
security vulnerabilities.
This presentation will
describe what is control system cyber security, how it
is different than business IT security, provide some
actual examples of control system cyber incidents,
and provide recommendations for what companies
can do to better secure their systems.
Visit us at w w w .e - G R I D . n e t
P a g e 43
OEB Magnetics
Monday June 21, 2010
An Investigation of Magnetic
Reversal at Almost the Nanoscale
Speaker: E. Dan Dahlberg, School of Physics and
Astronomy, University of Minnesota
Time:
11:00 AM
Cost:
none
Place:
Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley
RSVP:
Please respond by email with name,
company, to Peter Fischer,
PJFischer@lbl.gov by June 16
Web:
ewh.ieee.org/r6/oeb/mag
E. Dan Dahlberg received the B.S. and M.S. in
physics from the University of Texas at Arlington in
1970 and 1972, respectively, and the Ph.D. from
University of California, Los Angeles, in 1978. He
joined the faculty at the University of Minnesota in
1980 and is currently a professor of physics and an
Institute of Technology Distinguished Professor. He
is the director and principal investigator of the
Magnetic Microscopy Center (MMC) at the university.
His recent research is on exchange bias, the physics
of magnetic tunnel junctions, and noise in magnetic
devices. Some of his previous research includes
magnetotransport and other magnetic properties of
thin films and multilayers, the dynamics of spin
glasses, nonequilibrium superconductivity, the
thermodynamics of magnetic superconductors, and
the quantum Hall effect.
Prof. Dahlberg is a member of Sigma Pi Sigma
(1971) and a Fellow of the American Association for
the Advancement of Science (1995) and the
American Physical Society (1996). He was an Alfred
P. Sloan Foundation Research Fellow (1981-1985).
He served as general chair of the 2001 Joint
Magnetism and Magnetic Materials (MMM)-Intermag
Conference and as an editor of several MMM and
MMM-Intermag conferences.
He was divisional
councilor to the Division of Condensed Matter
Physics of the American Physical Society (19992002), a member of the Executive Board of American
Physical Society (2001-2002), and Vice President of
the International Union of Pure and Applied Physics
(IUPAP) (2006-2009).
May 2010
One of the current frontiers in magnetism is to
understand the domain structure and the
magnetization reversal in nanometer-sized particles.
Explorations at these length scales have been
aided by the development of new magnetic imaging
techniques, one of which is the magnetic force
microscope (MFM), a variant of the atomic force
microscope. We have utilized the high resolution
MFM (30 nm) we developed to increase our
fundamental understanding of magnetism on this
length scale. I will discuss the field-induced magnetic
reversal in particles on the order of hundreds of
nanometers in width and about twice that in length. In
general, for the small aspect (length to width) ratio,
the magnetization reverses by the formation of a
single vortex and its propagation down the length of a
particle (when the fields are applied perpendicular to
the long axis). There are some surprises when the
aspect ratio of the particles increases.
Visit us at w w w .e - G R I D . n e t
P a g e 44
SCV Magnetics
Tuesday June 22, 2010
An Investigation of Magnetic
Reversal at Almost the Nanoscale
Speaker: E. Dan Dahlberg, School of Physics and
Astronomy, University of Minnesota
Time:
11:00 AM
Cost:
none
Place:
Lawrence Berkeley National Lab, Cyclotron
Rd, Berkeley
RSVP:
Please respond by email with name,
company, to Peter Fischer,
PJFischer@lbl.gov by June 16
Web:
ewh.ieee.org/r6/oeb/mag
E. Dan Dahlberg received the B.S. and M.S. in
physics from the University of Texas at Arlington in
1970 and 1972, respectively, and the Ph.D. from
University of California, Los Angeles, in 1978. He
joined the faculty at the University of Minnesota in
1980 and is currently a professor of physics and an
Institute of Technology Distinguished Professor. He
is the director and principal investigator of the
Magnetic Microscopy Center (MMC) at the university.
His recent research is on exchange bias, the physics
of magnetic tunnel junctions, and noise in magnetic
devices. Some of his previous research includes
magnetotransport and other magnetic properties of
thin films and multilayers, the dynamics of spin
glasses, nonequilibrium superconductivity, the
thermodynamics of magnetic superconductors, and
the quantum Hall effect.
Prof. Dahlberg is a member of Sigma Pi Sigma
(1971) and a Fellow of the American Association for
the Advancement of Science (1995) and the
American Physical Society (1996). He was an Alfred
P. Sloan Foundation Research Fellow (1981-1985).
He served as general chair of the 2001 Joint
Magnetism and Magnetic Materials (MMM)-Intermag
Conference and as an editor of several MMM and
MMM-Intermag conferences.
He was divisional
councilor to the Division of Condensed Matter
Physics of the American Physical Society (19992002), a member of the Executive Board of American
Physical Society (2001-2002), and Vice President of
the International Union of Pure and Applied Physics
(IUPAP) (2006-2009).
May 2010
One of the current frontiers in magnetism is to
understand the domain structure and the
magnetization reversal in nanometer-sized particles.
Explorations at these length scales have been
aided by the development of new magnetic imaging
techniques, one of which is the magnetic force
microscope (MFM), a variant of the atomic force
microscope. We have utilized the high resolution
MFM (30 nm) we developed to increase our
fundamental understanding of magnetism on this
length scale. I will discuss the field-induced magnetic
reversal in particles on the order of hundreds of
nanometers in width and about twice that in length. In
general, for the small aspect (length to width) ratio,
the magnetization reverses by the formation of a
single vortex and its propagation down the length of a
particle (when the fields are applied perpendicular to
the long axis). There are some surprises when the
aspect ratio of the particles increases.
Visit us at w w w .e - G R I D . n e t
P a g e 45
IEEE-USA Entrepreneurs Webinar Series
THURSDAY June 24, 2010 (2 of 5)
Matching Financing Needs to
the Right Financial Structure
(5-part Webinar)
Instructor: Dr. Dileep Rao, adjunct professor and
author of Lessons from Bootstrap to Billions
Time:
11:00 AM - Noon (monthly, part 2 of 5)
Cost:
IEEE members: $69 each or $129 for all
five. Non-members: $99 for each or $225
for all five
Place:
on the Internet
RSVP:
Sign up in advance, from the website
Web:
www.ieeeusa.org/careers/webinars/2010/
Bootstrap-to-Billions.html
Dr. Dileep Rao, financier, columnist, adjunct
professor and workshop leader, has partnered with
the IEEE-USA Entrepreneurial Activities Committee
to conduct a series of webinars for you. Dr. Rao
financed more than 450 businesses and real estate
projects as the vice-president of a venture
development financial institution.
Currently, Rao is an advisor to governments,
Fortune 1000 corporations, development financial
institutions
and
entrepreneurs
on
business
development and financing. He also teaches New
Business Development & Financing in MBA and
Executive MBA programs in the United States,
Europe and Asia, and has been selected as
Outstanding MBA Teacher at the Carlson School of
Management located at the University of Minnesota.
Rao is an entrepreneurial finance columnist for
Forbes.com, and has written such acclaimed books
as Handbook of Business Finance & Capital
Sources and Business Financing: 25 Keys to
Raising Money. He also holds two engineering
degrees and a Ph.D. in Business Administration.
May 2010
Dr. Dileep Rao, author of Lessons from
Bootstrap to Billions, will lead a series of IEEE-USA
webinars for future and seasoned entrepreneurs.
The webinars will be based on his book, which
illustrates how, contrary to currently popular belief,
entrepreneurs can bootstrap to success. Bootstrap to
Billions shows entrepreneurs and managers how
business giants used alternate financing options to
grow. Most of them — about 80 percent — never got
venture capital. These entrepreneurs found their best
market; designed the right strategy; developed the
organization culture and leadership; and reached the
top with capital-efficient strategies that minimized the
need for capital. Lack of money did not constrain
their growth. Many entrepreneurs may be better off
using alternate financing to build and control their
business, and to create wealth and keep it. Dr. Rao's
presentations are broken down into a series of five
monthly webinars:
20 May 2010 - Link Your Business Plan to Your
Financing Needs
24 June 2010 – Matching Financing Needs to the
Right Financial Structure
22 July 2010 - Fine-Tune Financing: Finding the
Right Sources/Instruments
19 August 2010 - Reduce the Agony: Learn How to
Find Financing
16 September 2010 - After the Financing: Better
Decisions & Control
Visit us at w w w .e - G R I D . n e t
P a g e 46