Ball Grid Array, Land Grid Array, Stack Package Design & Assembly
Wednesday 2nd September
Bedfordshire Golf Club, Stagsden, Bedford
SMART seminar starts at 10.00am with coffee & exhibition from 9.30am. The event concludes at 4.30pm
Area array technology has been around for over 10 years but whilst some companies are pushing designs and stretching their process by using the
latest array packages many companies are still on the brink of implementing their first BGA design. The LGA/QFN packages are found in many
applications but are often new to design and assembly staff. With the conversion of many small outline devices to leadless formats the package
popularity will only increase. There are many design issues that directly impact assembly; plastic packages are more prone to cracking due to
moisture in a lead-free environment as opposed to tin/lead soldering temperatures.
Reliability is a key factor with some of the larger array packages, assembly and the choice of components has a big part to play in the performance
and the visual appearance of the solder joints. Lead-free has increased the issues associated with BGA, corner ball cracks, laminate pad cratering,
incomplete reflow and package warping are just a few. All LGA/QFN packages suffer from voiding, how does solder mask reduce voiding and how do
voids impact on package standoff height and alternately reliability and thermal performance?
The seminar will be divided into three sessions covering design, assembly, rework and inspection using optical and x-ray inspection of solder joint.
The seminar will feature speakers with years of practical experience with these packages and the event will be a sell out based on the success of last
years QFN and STACK seminars
SMART Group seminar will include:
BGA & LGA Design rules for printed board assembly
LGA/QFN footprint and solder mask layout
PBGA and Ceramic Ball Grid Array design
Use of location marks
Wetting indicators
Reliability of Tin/Lead and Lead-Free mixtures
BGA and nickel/gold board reliability
BGA & LGA Assembly processes and impact on yields
Screen Printing
Placement inspection
Convection and vapour phase reflow
Correct profiling procedures
Rework plus optical/x-ray inspection
Removal procedures for area array packages
Replacement options for packages
Optical and x-ray inspection quality indicators
Process defect and why they occur
Who should attend?
This event is ideally suited to design, production and quality engineers looking at future technology and maintaining a company technology
roadmap. It’s vital to subcontractors to be up-to-date with new technology and its possible implementation along with material and equipment
requirements for future customers
Delegates will have the opportunity to win SMART Group Lead-Free Training CD-ROMs
Directions from Bedford:
Visit SMART Diary http://www.smartgroup.org
Take the A428 to Northampton and at Bromham (3 miles from central
Bedford) turn left onto the A422 to Milton Keynes. After 1 mile turn left
onto Spring Lane (signposted Kempston Church End) and immediately
left again into the golf club entrance. Once through the entrance barrier,
which will go down when you drive slowly up to it, drive up the hill and
the car park is on your right
Directions from Milton Keynes:
At Junction 14 of the M1, take the A509 North to Olney/Wellingborough.
After 3 miles turn right onto the A422 to Bedford. Drive for a further 6 miles
on the A422 and turn right into Spring Lane (signposted Kempston Church
End). Turn immediately left into the golf club entrance. Once through the
entrance barrier, which will go down when you drive slowly up to it, drive
up the hill and the car park is on your right
Get your free Lead-Free Defect Guide
from SMART Group
Ask SMART Group about on site
training workshop just for your team
To book your place fax your booking form to SMART Group registrations 01494 473975
Please reserve _______ places at the seminar on 2nd September 2009
£85 SMART Group IMAPS members/ £175 Non members + VAT)
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