DB2L32300L - Panasonic Corporation

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Doc No. TT4-EA-14798
Revision. 2
Product Standards
Schottky Barrier Diode
DB2L32300L
DB2L32300L
Silicon epitaxial planar type
Unit: mm
0.3
For rectification
0.6
2
„ Features
y Low forward voltage VF
y Forward current (Average) IF(AV) = 0.5 A rectification is possible
y RoHS compliant
(EU RoHS / MSL:Level 1 compliant)
0.4
0.0425
1
„ Marking Symbol: A2
0.215 0.115
2
0.115
1
„ Packaging
0.1
Embossed type (Thermo-compression sealing) : 20 000 pcs / reel (standard)
„ Absolute Maximum Ratings Ta = 25 °C
Parameter
Symbol
Reverse voltage
Maximum peak reverse voltage
Forward current
Non-repetitive peak forward surge current
Junction temperature
Operating ambient temperature *2
Storage temperature
*1
VR
VRM
IF
IFSM
Tj
Topr
Tstg
Rating
Unit
30
30
0.5
5
150
-40 to +85
-55 to +150
V
V
A
A
°C
°C
°C
0.215
1. Cathode
2. Anode
Panasonic
JEITA
Code
DCSP0603010-N1
―
―
Note) *1: 50 Hz sine wave 1 cycle (Non-repetitive peak current)
*2: VR×50%、Rth(j-a) = Rth(j-l)
„ Thermal Characteristics
Parameter
Thermal Resistance,Junction to Lead
Thermal Resistance,Junction to Ambient
Thermal Resistance,Junction to Ambient
*1
*2
Symbol
Rating
Unit
Rth(j-l)
Rth(j-a)
Rth(j-a)
35
202
610
°C/W
°C/W
°C/W
Note) *1: When mounted on 36 µm Cu pad(108.0mm 2 ) on 25.4mm×25.4mm board of FR4 material.
*2: When mounted on 36 µm Cu pad(27.6mm 2 ) on 25.4mm×25.4mm board of FR4 material.
Page 1 of 6
Established : 2013-07-31
Revised
: 2013-11-26
Doc No. TT4-EA-14798
Revision. 2
Product Standards
Schottky Barrier Diode
DB2L32300L
„ Electrical Characteristics Ta = 25 °C ± 3 °C
Parameter
Forward voltage
Reverse current
Terminal capacitance
Reverse recovery time
Symbol
VF
IR
Ct
trr
*1
Conditions
IF = 0.5 A
VR = 30 V
VR = 10 V, f = 1 MHz
IF = IR = 100 mA, Irr = 10 mA
Min
Typ
Max
Unit
0.45
10
10
3.5
0.54
45
V
µA
pF
ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body
and the leakage of current from the operating equipment.
3. *1: trr test circuit
Bias Insertion Unit
(N-50BU)
Pulse Generator
(PG-10N)
RS = 50 Ω
Wave Form Analyzer
(SAS-8130)
Ri = 50 Ω
Input Pulse
tp = 2 μs
tr = 0.35 ns
σ= 0.05
Output Pulse
Irr = 10 mA
IF = 100 mA
IR = 100 mA
Page 2 of 6
Established : 2013-07-31
Revised
: 2013-11-26
Doc No. TT4-EA-14798
Revision. 2
Product Standards
Schottky Barrier Diode
DB2L32300L
Technical Data ( reference )
IF-VF
Ct-VR
1.0E+00
50
Ta = 125 °C
Terminal capacitance Ct (pF)
Forward current IF (A)
1.0E-01
1.0E-02
85 °C
1.0E-03
25 °C
1.0E-04
1.0E-05
0.0
Ta = 25 °C
-40 °C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0
10
Forward voltage VF (V)
IR-VR
1.0E-01
30
Rth-t
1000
mounted on 36 µm Cu pad(27.6 mm2)
on 25.4 mm×25.4 mm board of FR4 material.
Ta = 125 °C
1.0E-02
20
Reverse voltage VR (V)
Rth(j-l) = 35 °C/W
1.0E-04
Thermal Resistance Rth (°C/W)
Reverse current IR (A)
1.0E-03
85 °C
1.0E-05
25 °C
1.0E-06
1.0E-07
100
mounted on 36 µm Cu pad(108.0 mm2)
on 25.4 mm×25.4 mm board of FR4 material.
1.0E-08
-40 °C
Single Pulse
1.0E-09
0
10
20
Reverse voltage VR (V)
30
10
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Page 3 of 6
Established : 2013-07-31
Revised
: 2013-11-26
Doc No. TT4-EA-14798
Revision. 2
Product Standards
Schottky Barrier Diode
DB2L32300L
Technical Data ( reference )
Rth-t
tp
Normalized Effective Transient
Thermal Impedance (°C/W)
1000
tp
D=
T
T
Duty Cycle = 0.5
100
0.2
0.1
0.05
0.02
mounted on 36 µm Cu pad(108.0mm 2)
on 25.4 mm×25.4 mm board of FR4 material.
Single Pulse
10
0.001
0.01
0.1
1
10
100
1000
100
1000
Square Wave Pulse Duration (s)
Normalized Effective Transient
Thermal Impedance (°C/W)
1000
D=
tp
tp
T
Rth-t
T
Duty Cycle = 0.5
0.2
100
0.1
0.05
0.02
Single Pulse
10
0.001
mounted on 36 µm Cu pad(27.6mm 2)
on 25.4 mm×25.4 mm board of FR4 material.
0.01
0.1
1
10
Square Wave Pulse Duration (s)
Page 4 of 6
Established : 2013-07-31
Revised
: 2013-11-26
Doc No. TT4-EA-14798
Revision. 2
Product Standards
Schottky Barrier Diode
DB2L32300L
Technical Data ( reference )
IF(AV)-Tl
IF
tp
Average Forward current IF(AV) (A)
0.6
tp/T
0.5
T
VR = 15 V
Tj = 150 ℃
DC
0.4
1/2
0.3
Sine Wave
0.2
1/4
0.1
0
0
25
50
75
100
125
150
175
Lead temperature Tl (°C)
PF-IF(AV)
Ta = 25 °C
Forward Power Dissipation PF (W)
0.3
IF
DC
tp
Sine Wave
T
0.2
1/2
1/4
0.1
0
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
Average Forward current IF(AV) (A)
Page 5 of 6
Established : 2013-07-31
Revised
: 2013-11-26
Doc No. TT4-EA-14798
Revision. 2
Product Standards
Schottky Barrier Diode
DB2L32300L
DCSP0603010-N1
Unit: mm
0.30±0.03
1
0.215±0.030
0.115±0.030
0.4
0.10±0.02
0.0425±0.0300
2
0.115±0.030
0.60±0.03
2
1
0.215±0.030
„ Land Pattern (Reference) (Unit: mm)
0.215
0.4
0.215
0.3
Page 6 of 6
Established : 2013-07-31
Revised
: 2013-11-26
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
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of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
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Standards in advance to make sure that the latest specifications satisfy your requirements.
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(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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