ILX485
Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers
General Description
The ILX485 is low-power transceivers for RS-485 and RS422 communication. IC contains one driver and one receiver.
The driver slew rates of the ILX485 is not limited, allowing
them to transmit up to 2.5Mbps.
These transceivers draw between 120µA and 500µA of
supply current when unloaded or fully loaded with disabled
drivers. All parts operate from a single 5V supply. Drivers are
short-circuit current limited and are protected against
excessive power dissipation by thermal shutdown circuitry
that places the driver outputs into a high-impedance state.
The receiver input has a fail-safe feature that guarantees a
logic-high output if the input is open circuit. The MAX485 is
designed for half-duplex applications.
Features
Ž Low Quiescent Current: 300µA
Ž -7V to +12V Common-Mode Input Voltage Range
Ž Three-State Outputs
Ž 30ns Propagation Delays, 5ns Skew
Ž Full-Duplex and Half-Duplex Versions Available
Ž Operate from a Single 5V Supply
Ž Allows up to 32 Transceivers on the Bus
Ž Data rate: 2,5 Mbps
Ž Current-Limiting and Thermal Shutdown for Driver Overload Protection
Pinning
1
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ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) 12V
Control Input Voltage -0.5V to (VCC + 0.5V)
Continuous Power Dissipation (TA= +70°C)
8-Pin Plastic DIP (derate 9.09mW/°C above
+70°C) 727mW
Driver Input Voltage (DI) -0.5V to (VCC+ 0.5V)
8-Pin SO (derate 5.88mW/°C above +70°C)
471mW
Driver Output Voltage (A, B) -8V to +12.5V
Operating Temperature Ranges0°C to +70°C
Receiver Input Voltage (A, B) -8V to +12.5V
Storage Temperature Range -65°C to +160°C
Receiver Output Voltage (RO) -0.5V to (VCC+0.5V) Lead Temperature (soldering, 10sec) +300°C
DC ELECTRICAL CHARACTERISTICS
(VCC = 5V ±5%, TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2)
PARAMETER
SYMBOL CONDITIONS
Differential Driver Output (no VOD1
load)
Differential Driver Output
VOD2
R = 50Ω (RS-422)
(with load)
R = 27Ω (RS-485), Figure 4
Change in Magnitude of Driver ΔVOD
R = 27Ω or 50Ω, Figure 4
Differential Output Voltage for
Complementary Output States
Driver Common-Mode Output VOC
R = 27Ω or 50Ω, Figure 4
Voltage
Change in Magnitude of Driver ΔVOD
R = 27Ω or 50Ω, Figure 4
Common-Mode Output Voltage
for Complementary Output
States
Input High Voltage
VIH
DE, DI, RE
MIN TYP MAX
5
UNITS
V
2
1.5
V
5
0.2
V
3
V
0.2
V
2.0
V
Input Low Voltage
VIL
DE, DI, RE
0.8
V
Input Current
IIN1
±2
µA
Input Current
(A, B)
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis
Receiver Output High Voltage
Receiver Output Low Voltage
Three-State (high impedance)
Output Current at Receiver
Receiver Input Resistance
IIN2
1.0
-0.8
0.2
mA
VTH
DE, DI, RE
DE = 0V;
VCC = 0V or 5.25V,
-7V ≤ VCM ≤ 12V
V
ΔVTH
VOH
VOL
IOZR
VCM = 0V
IO = -4mA, VID = 200mV
IO = 4mA, VID = -200mV
0.4V ≤ VO ≤ 2.4V
0.4
±1
mV
V
V
µA
RIN
-7V ≤ VCM ≤ 12V
2
VIN = 12V
VIN = -7V
-0.2
70
3.5
12
kΩ
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DC ELECTRICAL CHARACTERISTICS (continued)
(VCC = 5V ±5%, TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2)
PARAMETER
SYMBOL CONDITIONS
No-Load Supply Current
ICC
DE = VCC
(Note 3)
RE = 0V or V
CC
DE = 0V
MIN TYP MAX UNITS
500 900
300 500 µA
Driver Short-Circuit Current,
IOSD1
-7V ≤ VO ≤12V (Note 4)
35
250
mA
IOSD2
VO = Low
Receiver Short-Circuit Current IOSR
-7V ≤ VO ≤12V (Note 4)
35
250
mA
0V ≤ VO ≤ VCC
7
95
mA
VO = High
Driver Short-Circuit Current,
SWITCHING CHARACTERISTICS
(VCC = 5V ±5%, TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2)
PARAMETER
SYMBOL CONDITIONS
Driver Input to Output
tPLH
RDIFF = 54Ω,
Driver Output Skew to Output
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable Time from Low
Driver Disable Time from High
| tPLH - tPHL | Differential
Receiver Skew
Receiver Enable to Output Low
Receiver Enable to Output High
Receiver Disable Time from
Low
Receiver Disable Time from
High
Maximum Data Rate
tPHL
tSKEW
tZH
tZL
tLZ
tHZ
tSKD
CL1 = CL2 = 100pF
RDIFF = 54Ω, CL1 = CL2 = 100pF
CL= 100pF, S2 closed
CL= 100pF, S1 closed
CL= 15pF, S1 closed
CL= 15pF, S2 closed
RDIFF = 54Ω,
tZL
tZH
tLZ
tHZ
MIN TYP MAX UNITS
10
30
60
ns
30
5
40
40
40
40
13
60
10
70
70
70
70
CL1 = CL2 = 100pF
CRL = 15pF, S1 closed
CRL = 15pF, S2 closed
CRL = 15pF, S1 closed
20
20
20
50
50
50
ns
ns
ns
CRL = 15pF, S2 closed
20
50
ns
fMAX
10
2.5
3
ns
ns
ns
ns
ns
ns
Mbps
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Operation timing diagrams of ILX 485.
Table of ILX 485 operation.
Transmission
Inputs
RE
DE
X
1
X
1
0
0
1
0
X-don’t care
Z-high resistance
Receipt
DI
1
0
X
X
Z
0
1
Z
Z
Outputs
Y
1
0
Z
Z
4
RE
0
0
0
1
Inputs
DE
0
0
0
0
A-B
+0.2V
-0.2V
open
X
Outputs
RO
1
0
1
Z
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Chip layout diagram
02
01
08
07
03
1.76 x 2.17mm
05 06
04
Die thickness 0,46±0,02 mm.
Contact pad location table
Coordinates (Leftbottom corner), mm
Pad number
X
Y
01
02
03
04
05
06
07
08
0.167
0.167
0,506
1.877
1.877
1.862
0.680
0.167
0.668
0.277
0.254
0.571
0.982
1.449
1.449
1.005
Contact pad
size, mm
0.120 х 0.120
0.120 х 0.120
0.120 х 0.120
0.120 х 0.120
0.120 х 0.120
0.120 х 0.120
0.120 х 0.120
0.120 х 0.120
Note: Coordinates are indicated under ”Metalization” layer
5
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N SUFFIX PLASTIK SOP
(MS-012AA)
D
8
5
E1
1
H
4
hx45
C
c
A1
e
L
b
0,25 (0,010) M
C
α
Note: dimensions D, E1 do not include flash which shall not be more than 0.25
(0.010) per one side.
Fig. 9 – Package overall dimensions
Table 6 – Package dimensions
D
E1
H
b
e
α
A
A1
c
L
h
0°
8°
1.35
1.75
0.10
0.25
0.19
0.25
0.41
1.27
0.25
0.50
Mm
min
max
min
max
4.80
5.00
3.80
4.00
5.80
6.20
0.33
0.51
1.27
Inch
0.1890 0.1497 0.2284 0.013
0.1968 0.1574 0.2440 0.020 0.100
6
0°
8°
0.0532 0.0040 0.0075 0.016 0.0099
0.0688 0.0090 0.0098 0.050 0.0196
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D
8
5
E1
1
4
b2
A
E
C
A1
α
c
e
b
0,25 (0,010)
M
L
C
Note: D, E1 Dimensions do not include flash wich shall not be more than 0.25
(0.010) per one side
Package overall dimensions
D
min
max
min
max
E1
A
b
b2
e
mm
9.02 6.07
0.36 1.14
⎯
10.16 7.11 5.33 0.56 1.78 2.54
inch
0.355 0.240
0.014 0.045
⎯
0.400 0.280 0.210 0.022 0.070 0.1
7
α
L
E
c
A1
0°
15°
2.93
3.81
7.62
8.26
0.20
0.36
0.38
⎯
0°
15°
0.115 0.300 0.008 0.015
0.150 0.325 0.014
⎯
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