Product Selector Guide
Product Line Overview
Micross Components’ Retail+™ product line enables
customers to use industry leading components that were
not previously available for their hi-rel, long life applications.
Micross purchases COTS components and enhances them
for use in military, aerospace, transportation, industrial, and
medical applications.
Benefits
• Micross warranted product
• Off-the-shelf standard components in original
OEM's packages
• Tin-lead based metallurgy
• Electrical verification performed on every part
(100%)
• 100% visual inspection and AOI
• Sampled product validation testing
ƒƒ XRF: Alloy verification
ƒƒ Ball Shear: per JESD22-B117,
evaluates quality of ball attachment.
ƒƒ X-Ray: Solder voiding
ƒƒ Ionograph: Bulk ICE
ƒƒ SonoScan: Package voiding
ƒƒ MSL: J-STD-20
Additional Options
• Product banking (wafer/package)
• Extended temperature
• Lead attach
• Trim & form
• Environmental screening
• Marking
ƒƒ L = Label (default)
ƒƒ D = Orange Dot
Retail+ products are converted from RoHS Pb-free solder
metallurgies to Tin-Lead (SnPb 63/37) based metallurgies. Pb-free BGA packages are reballed and Pb-free leaded and
non-leaded packages go through a solder dip exchange using
our established processes that brings them up to standards for
use in Hi-Rel applications.
100% of the components go through electrical verification as
well visual inspection and AOI.
Micross sample performs the following product validation tests
on each product family:
• XRF: Alloy verification
• Ball shear: per JESD22-B117, evaluates quality of ball
attachment.
• X-Ray: Solder voiding
• Ionograph: Bulk ICE
• SonoScan: Package voiding
• MSL: J-STD-20
Micross encourages customers to engage on special
requirements, and will work with customers with changes to
standard specifications as needed to suit their application. At
Micross, specification revision control is key, and is managed
by our Quality organization.
It is our goal to continue providing our customers with a full
service solution, while upholding to our pedigree and tradition
of strict quality and reliability standards.
• Custom flows
Part Number Nomenclature
• Replace OEM prefix with MYX
April 15, 2015 • Revision 1.9
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com
Form #: CSI-D-688 Document 002
Retail+™ Product Selector Guide
Volts
Temp.
Range
Package
Revision
800
1.8V
C, IT
FPGA - 84
Sn63/Pb37
H
2.5ns
800
1.8V
C, IT
FPGA - 84
Sn63/Pb37
C
DDR3
1.5ns
1333
1.35V
C, IT, ET
FPGA - 84
Sn63/Pb37
G
MYX4DDR3L128M16JTBG-125ttRy
DDR3
1.25ns
1600
1.35V
C, IT
FPGA - 84
Sn63/Pb37
K
64M x 16
MYX29GL01GS11DPIV2BG-ITRy
NOR Flash
-100ns
2.7V - 3.6V
IT
FBGA - 64
Sn63/Pb37
MS4.0
1Gb
64M x 16
MYX28F00AM29EWHBG-ITRy
NOR Flash
-100ns
2.7V - 3.6V
IT, AT
FBGA - 64
Sn63/Pb37
A
512Mb
512M
MYXN25Q512A13G12BG-ttRy
Serial
NOR Flash
108MHz
(STR)
2.7V - 3.6V
IT, AT, XT
TBGA - 24
Sn63/Pb37
A
64GB
64G x 8
MYXFC64GJDDNBG-ITRy
Parallel NAND
Flash + Controler
52MHz
2.7V - 3.6V
IT
LFBGA - 169
Sn63/Pb37
J = Flash
D = Cnt'l
32GB
32G x 8
MYXFC32GJDDQBG-ITRL
Parallel NAND
Flash + Controler
52MHz
2.7V - 3.6V
IT
LFBGA - 100
Sn63/Pb37
J = Flash
D = Cnt'l
MYXE3845BG-ETRy
SoC
1.91 GHz
Numerous
Vrails
Density
Organization
Part Number
Technology
Performance
1Gb
64M x16
MYX4DDR264M16HWBG-25EttRy
DDR2
2.5ns
2Gb
128M x 16
MYX4DDR2128M16PKBG-25EttRy
DDR2
1Gb
64M x 16
MYX4DDR364M16JTBG-15EttRy
2Gb
128M x 16
1Gb
Memory
DDR2
DDR3
Non-Volatile
Processors
ET (-40°C to FCBGA - 1170
+110°C)
Sn63/Pb37
D0
Power Management IC (PMIC)
MYXPM6021BG-ITRy
PMIC
Numerous
Vrails
-30°C to
+85°C
FCBGA - 325
Sn63/Pb37
08
MYXPM9145QN-ITRy
PMIC
Numerous
Vrails
IT
QFN - 100
Sn63/Pb37
AW629D000ZNF
Micross Part # Extension-xxxxttRyzzz (e.g. -25EITR)
• xxxx = Speed Grade: 1 to 4 digits when applicable • R = Retail+
• tt = Temp. Ranges
• y = Part Marking Options:
• Blank = none
Refer to Temp. Range column for specific
• L = Label (default)
temps offered for each part #.
• D = Ink Dot
• C, CT or blank = Commercial (0°C to +70°C)
• zzz = Special Custom Characters options
• IT = Industrial (-40°C to +85°C)
controlled by Micross
• ET = Enhanced (-40°C to +105°C)
• AT = Automotive (-40°C to +125°C)
• XT = Mil (-55°C to +125°C)
April 15, 2015 • Revision 1.9
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com
Form #: CSI-D-688 Document 002
Retail+™ Product Selector Guide
Retail+ Product Nomenclature
Prefix
Code
Description
AS
ASI/Micross
MT
ASI/Micross/Micron1
MYX
Micross
SMJ/SM
ASI/Micross/TI2
Sample Part Number
Prefix
1. The MT product line was acquired from Micron Technology.
In most cases, these industry established part numbers have
been retained, but in no way does this indicate or guarantee
a die source.
Device Number
Access Time
MYX4DDR364M16JTBG-15ITRL
2. The SMJ/SM product line was acquired from Texas
Instruments. In most cases, these industry established
part numbers have been retained. This does not indicate
or guarantee a die source. Nomenclature is provided in
separate documentation.
Product Type/Description
Package
Options/Processing
See individual datasheets for exact part number and option
combinations offered.
Product Type/Description
Code
Type
Description
41 & 44
4C
28C
58C
58LC
8E
8ER
8ERLC
28F
29F
29GL
29LV
8F
8FLC
N25Q
PM
80
4DDR
4DDR2
4DDR3
4SD
5C
5LC
8S
8SLC
5SP
5SS
27C
42C
44C
6nvLC
8nvC
8nvLC
DRAM
DRAM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
FLASH
FLASH
FLASH
FLASH
FLASH
FLASH
FLASH
PMIC
Processor
SDRAM
SDRAM
SDRAM
SDRAM
SRAM
SRAM
SRAM
SRAM
SSRAM
SSRAM
UVEPROM
VRAM
VRAM
VRAM
VRAM
VRAM
5V, EPM
5V, FPM
Byte Alterable
Hitachi Die
3.3V
Multi-chip Module
Multi-chip Module, Rad-Tol
3.3V, Multi-chip Module, Rad-Tol
Spansion compatible
MirrorBit® Eclipse™
3.3V
Multi-chip Module
3.3V, Multi-chip Module
Serial NOR
Power Management IC
SoC
2.5V/1.8V, Double Data Rate
2.5V/1.8V, Double Data Rate II
1.5V/1.35V, Double Data Rate III
3.3V, SDR
5V
3.3V
5V, Multi-chip Module
3.3V, Multi-chip Module
Pipelined
Flow-thru
3.3V
5V
3.3V
Package
Code
Access Time
Description
Code
Options/Processing
ns
BG, BG1, BGM1
FBGA
10
10 or 100
C
DIP
3
3.0
CN
Narrow DIP
11
CW
Wide DIP
CZ, SV, SVM
ZIP
DCG
DCJ
Code
Description
AT
-40°C to +125°C
110
CT
0°C to +70°C
12
12 or 120
D
Orange Dot
15
15 or 150
FP Gullwing (Formed)
15E
1.5
E
Epi Die
SOJ (Formed)
17
17
DG
TSOPII
ET
-40°C to +105°C
20
20 or 200
DJ
PSOJ
25 or 250
IT
-40°C to +85°C
EC, FE, HMM
25
LCC
ECA
450 x 550 LCC
25E
2.5
L
2V Data Retention or Label
ECG
Gullwing LCC
30
30 or 300
35
Ultra Low Power
SOJ (Attached)
35
LL
ECJ
ECN
Narrow LCC
45
45
ECW
Wide LCC
55
55
F, FN, HKD, HR, HK
Flat pack
60
60
FNC
LCC
70
70
J, JD, JDD, JDM
Side Brazed DIP
75
7.5 or 75
P
PGA
85
85
PBG, PBG1
PBGA
90
90
Q
CQFP (Gullwing)
100
100
Q1
CQFP (w/special lead)
107
1.07
Q2, Q3, SQ
CQFP
120
QB
CQFP (w/Tie Bar)
125
QN
QFN
150
150
QJ
CQFP (J-lead)
187E
1.87
QT
CQFP (Thin)
QW
CQFP (1.56” sq.)
RG
TSOPI
SF
Flat pack (Rad-Tol)
SOJ, HJM
SOJ
SQB
CQFP (Rad-Tol)
M or XT -55°C to +125°C
MIL
MIL-STD-883 equivalent processing
compliant to paragraph 1.2.2 -55°C to
+125°C
Q
QML
R
Retail+
SPACE
MIL-STD-883, Method 5004, Class
Equivalent
120
ZZZ
Special Flow
1.25
883C
MIL-STD-883 (previously listed as “M”)
Formoreinformationregardingourproducts
andservices,pleasevisitwww.micross.comor
emailsales@micross.com.
April 15, 2015 • Revision 1.9
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com
Form #: CSI-D-688 Document 002
Retail+™ Product Selector Guide
Electrical Verification
Microssperformsthefollowingelectricalverificationat25°Con
everydevice(100%):
• ICCStatic-Powerisappliedandallinputspins/ballsare
configuredinaknownstate.Overallcurrentconsumptionis
measured.
• Leakage-Powerisappliedandallinputsareconfigured
inaknownstate.Currentconsumptiononeachpin/ballis
measured.
Figure 1
BallDiameter&BallHeight
Figure 2
TruePosition(BallOffset)
• Continuity-ThistestisperformedoneachI/Opin/ball.VDD
andVSSareallgrounded.~100uAofcurrentissinkedand
sourcedacrosstheprotectiondiodesofeveryI/Opin/ballto
testforopensandshorts.
Product Validation
Microssperformsthefollowingproductvalidationonevery
device(100%):
Figure 3
Array(Ball)Pitch
• VisualInspection-perMIL-STD-883,TestMethod2009
• AutomaticOpticalInspection(AOI)
ƒ BallDiameter&BallHeight-Theballwidth(WI)gives
thediameteroftheball.Itiscalculatedastheaverageof
thehorizontalandverticalballdiameters.SeeFigure1.
ƒ TruePosition(BallOffset)-TheXoffset(XO)andtheY
offset(YO)aremeasured.SeeFigure2.
ƒ Array(Ball)Pitch-Thearraypitchisthedistance
betweenthecentersofneighboringballs.Foreachball,
thesystemreportsthedistancetothenearestballin
horizontalorverticaldirection(orindiagonaldirectionfor
staggeredgrids).SeeFigure3.
ƒ BallCoplanarity-Validatethatalltheballslieinone
plane.SeeFigure4.
Figure 4
BallCoplanarity
Options
Temperature
Range
Microssperformsthefollowingadditionalproductvalidationtests
oneachproductfamily:
AT = Automotive (-40°C to +125°C)
XT & M = Extended & Military (-55°C to +125°C)
Markings
• SonoScan-Packagevoiding
• X-Ray-Soldervoiding
• Ionograph-BulkICE
IT = Industrial (-40°C to +85°C)
ET = Enhanced (-40°C to +105°C)
• XRF-Alloyverification
• BallShear-PerJESD22-B117;evaluatesqualityof
ballattachment
C, CT or blank = Commercial (0°C to +70°C)
L = Label (default)
D = Orange Dot
Special
ZZZ = Three-digit special flow requirement
• MSL-J-STD-20
April 15, 2015 • Revision 1.9
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com
Form #: CSI-D-688 Document 002