RAPID PCB PROTOTYPING

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LPKF Produktkatalog Umschlag GB
23.04.2003
12:48 Uhr
Seite 1
LPKF RAPID PCB PROTOTYPING PRODUCT CATALOG 02/03
LPKF distribution network
LPKF Headquarters
LPKF Distribution and
production facilities
LPKF Distributors
RAPID PCB PROTOTYPING
Slowenien
LPKF Laser & Elektronika d.o.o.
Planina 3
4000 Kranj
SLOVENIA
Phone +386-4-2013800
Fax
+386-4-2013820
e-mail
[email protected]
web info www.lpkf.si
UK/Ireland
LPKF Laser & Electronics Ltd.
Coppid Beech Lane, Wokingham
Berkshire-RG40 1PD
GREAT BRITAIN
Phone +44-1344-455046
Fax
+44-1344-860547
e-mail [email protected]
web info www.lpkf.co.uk
China
LPKF Tianjin Co., Ltd.
No. 1 Building, Xing Nan Cun,
Ke Yan Xi Road, Nan Kai District,
Tianjin, 300192
PEOPLE'S REPUBLIC OF CHINA
Phone +86-22-23005700
Fax
+86-22-23006965
e-mail [email protected]
Frankreich
LPKF France S.A.R.L.
Z.A. de l’Églantier
21 Rue des Cerisiers
(C.E. 1514 Lisses)
91015 Evry Cedex
FRANCE
Phone +33-1-60862691
Fax
+33-1-60869622
e-mail [email protected]
Spain
LPKF Laser & Electronics
Spain, S.L.
Apartado Nr. 1
28791 Soto del Real (Madrid)
Madrid/SPAIN
Phone +34-91-8475505
Fax
+34-91-8475522
e-mail [email protected]
web info www.lpkfspain.com
North America
LPKF Laser & Electronics
28220 SW Boberg Rd.
P.O. Box 3858
Wilsonville, OR 97070
USA
Phone +1-503-454-4200
Fax
+1-503-683-7151
e-mail [email protected]
web info www.lpkfusa.com
Japan
LPKF Japan Co., Ltd.
Yoyogi 5-8-5-304
Shibuya-ku
Tokyo 151000
JAPAN
Phone +81-3-34657105
Fax
+81-3-34676159
e-mail
[email protected]
web info www.lpkf.co.jp
www.lpkf.com
Your LPKF-Distributor
PRODUCT CATALOG 02/03
AD HOME
Germany (Headquarters)
LPKF Laser & Electronics AG
Osteriede 7
30827 Garbsen
GERMANY
Phone +49-5131-7095-0
Fax
+49-5131-7095-90
e-mail
[email protected]
web info www.lpkf.com
Germany
China
France
Japan
(Free advice/support)
Slovenia
+386-4-2013804
+49-5131-7095-0
Spain
+34-91-8475505
+86-22-23005700
UK/Ireland +44-1344-455046
+33-1-60862691
+81-3-34657105
North America +1-503-454-4229
(8 am - 5 pm PST)
Catalog number 111271
Customer Service
LPKF Produktkatalog Umschlag GB
23.04.2003
12:48 Uhr
Seite 2
Index
Index
4-layer multilayer
6-layer multilayer
8-layer multilayer
Accessories
Aluminum
Applications
AutoContac
Automatic tool change
AutoSwitch
Base materials
BGA Placer
BoardMaster
Brass
Build-up method (sequential)
CAD (please use also EDA)
CAM Station
Chemical sets
Circuit board plotter
CircuitCAM
Compressed air
Compressor
Conductive paste
Consumables
Contac
Contact printing
Contour generator
Convection oven
Custom drill bits
Custom tools
Customer service line
Data conversion
Data export
Data formats
Data import
Depanelization
Dispensing
Distribution network
Double sided printing
Drill bit
Drill data
Drilling machine
Dust extraction
EasyContac
EasySolder
Editing capabilities
Endmill
Engraving
Fine-pitch printing
Flex boards
Flexible circuits
Flex-rigid boards
Foil engraving
Front panels
Fully automatic
Galvanic
Gerber
Head lighting
Housing
Installation
Insulation process
Laser
31, 32, 33, 40
31, 32, 33, 40
31, 32, 33, 40
24, 42
8, 14, 16, 20
6, 14, 16, 18, 20, 21
6, 28
18
24
39
47
12
7
32
10
11
41
13
10
25
25
6, 28
38
29
43
10, 11
25
37
35
13
10
10
10
10, 11
9
6, 8, 28
61
43
35
10
14
24
6, 27
34, 42
10
36
8, 9
43
8
8
8, 20
9
8
18
6, 29
10 ff
26
8
18
11
21, 54
Layout
Measurement microscope
Micro cutter
Micrometer screw
Microwave circuits
Microwave layout
Microwave prototype
Milling bit
MiniContac
Multilayer boards
MultiPress
Paste
PCB drilling
PCB milling
PCB post processing
PCB prototype
Plastic / composite
Plastic engraving
Pneumatic Z-axis
Post processing of:
· populated boards
· bare boards
Printing
Program wizard
ProtoLaser
ProtoMat®
ProtoMat® 95s/II
ProtoMat® C100/HF
ProtoMat® C20
ProtoMat® C40
ProtoMat® C60
ProtoMat® H100
ProtoMat® L60
ProtoMat® M30s
ProtoMat® M60
ProtoMat® X60
Prototypes
Quality features
Quick release collet
Quick release frame
Reflow oven
Registration pin method
Reverse pulse plating
RF circuits
RF layouts
RF prototypes
RF-Endmill
Rivets
Routing
SatusLight
Screen-printing
Service
Set pin system
Sign engraving
SMD assembly
SMD fine pitch printing
SMD metal stencils
SMD polymer stencils
SMD solder paste stencils
Software upgrade
Solder mask
10
24
36
26
7, 14
11
11, 14
35
29, 41
7, 31, 32, 33, 39, 40
31, 42
42
9
7
9
6
8
8
13, 14, 26
9, 20
9, 20
43 ff
10
21
14
18
7, 14
14
14
14
18
16
16
16
20
6
13
13, 14
45
53
33
7, 29
7, 14
11
7, 14
36, 38
6, 27
7, 20
25
43
13
13, 38
7
47
43
54
54, 9
54
10, 11
7, 28
Solder paste printing
Sound enclosur
Special applications
Spindle
Starter packs
Stencil printer
Stencil printing
Tech support
Test adapter
Through hole plating
Tinning
Tool library
Tool management
Tool ring set
Tools
Training
Training
Universal cutter
Vacuum table (H100)
Working depth limiter
WYSIWYG
ZelFlex
ZelFlow
ZelPlace
ZelPrint
43
24
8
26
38
13
43
13
9
6, 27 ff
30, 41
12
12
25
35, 38
14
13,18
36
18
26
12
45
53
47
43
61
LPKF Produktkatalog GB
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Seite 1
Contents
Contents
The Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
In-house Rapid PCB Prototyping . . . . . . . . . . . . . . . . . . . . .
Utilization of LPKF Systems in the Conventional PCB Process .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LPKF CircuitCAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LPKF BoardMaster . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LPKF Circuit Board Plotter
Quality Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LPKF ProtoMat® C-Series . . . . . . . . . . . . . . . . . . . . . . . . .
LPKF ProtoMat® M/L-Series . . . . . . . . . . . . . . . . . . . . . . .
LPKF ProtoMat® H-Series (Fully Automatic) . . . . . . . . . . . . .
LPKF ProtoMat® X-Series . . . . . . . . . . . . . . . . . . . . . . . . .
LPKF ProtoLaser . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Accessories/Options . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LPKF Through-Hole Plating Technology
Rivets (LPKF EasyContac) . . . . . . . . . . . . . . . . . . . . . . . .
Conductive Paste (LPKF AutoContac) . . . . . . . . . . . . . . . . .
Electro Plating (LPKF Contac III, MiniContac III & MiniContac
LPKF Multilayer Technology
Multilayer Press (LPKF MultiPress II) . . . . . . . . . . . . . . . . .
· Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LPKF Solder Mask (LPKF EasySolder) . . . . . . . . . . . . . . . . .
Tools (Mill and Drill Bits) . . . . . . . . . . . . . . . . . . . . . . . . . .
Consumables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Surface Mount Technology (SMT)
Solder Paste Printing (LPKF ZelPrint) . . . . . . . . . . . . . . . .
Quick-Release Stencil Frames (LPKF ZelFlex) . . . . . . . . . . .
Assembly (LPKF ZelPlace & BGA Placer) . . . . . . . . . . . . . .
Reflow Oven (LPKF ZelFlow) . . . . . . . . . . . . . . . . . . . . . . .
Other LPKF Product Lines . . . . . . . . . . . . . . . . . . . . . . . . .
Imprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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1
LPKF Produktkatalog GB
2
23.04.2003
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Seite 2
The Company
The Company
Tradition and innovation
Founded in the seventies, LPKF quickly established a reputation for
innovation by launching new chemical free methods for producing
prototype circuit boards. The CAD-supported milling technique
established itself with electronic design engineers worldwide as a
clean, efficient and environmentally friendly alternative to chemical
etching. Revolutionary when first introduced, it is now an industry
standard method throughout the world.
Success led to expansion and the opening of branch offices
worldwide at an early stage. LPKF gained customers in all sectors
from one-man operations to major international corporations. With a
broad spectrum of products and services, LPKF covers all aspects
of the in-house prototyping chain. In the beginning of the nineties,
the range of products and services was significantly expanded with
the development of laser systems for making ultra-fine circuit
boards followed by, the now well known, stencil laser for making
SMD paste stencils.
The company is now the world market leader for in-house “Rapid
PCB Prototyping” and “StencilLasers”. This status is attributable to
the company’s future-oriented product policy, large investment in
R&D and the highest quality standards.
Proactively shaping markets
Specialists in a wide range of fields continuously analyze the
printed circuit board market to identify trends and set new industry
standards for accuracy and performance. This is highlighted by the
major commitment to research and development resulting in the
large number of patents registered in recent years. In addition, the
continuous exchange of information between clients and LPKF’s
R&D departments emphasizes the innovative power of the company
and the focus on user-oriented solutions. The aim is, by using LPKF
products, to optimize important commercial factors for its clients
such as time-to-market, reduction of outside service cost and
flexibility through independence.
LPKF Produktkatalog GB
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Seite 3
The Company
Package solutions
LPKF is far more than a supplier of high-end solutions: clients around the world in a wide
spectrum of industry sectors also benefit from the company’s broad expertise in all aspects
of printed circuit boards. LPKF supplies individually tailored solution packages enabling its
clients to profit from rapid, flexible and independent production processes. In addition to
the machines themselves, this is accomplished with LPKF’s comprehensive consulting
services and supply of superior tools and consumables for every day jobs. The complete
range of products in the LPKF Rapid PCB Prototyping segment includes circuit board
plotters, through-hole plating systems, SMD solder paste printers, component placement
systems, reflow ovens and a wide range of accessories.
The global service network keeps LPKF close to its customers and shows the
commitment to excellent customer service.
Over 26 years experience in printed
Precision based on quality
Finer and finer structures and high density packaging are only feasible with the
highest levels of precision. This requires machines for PCB prototyping
and production alike to be extremely precise to meet these
demands. LPKF develops and manufactures almost every
Certified by
component in its machines and systems. The result is a
perfect synthesis of quality and high-tech: this applies to
the materials used as well as the manufacturing process.
LPKF’s quality management has been certified to
ISO 9001:2000.
Innovation through exchange of
to DIN EN ISO 9001
circuit board technology
LPKF milling technology:
An efficient alternative to chemical
etching
Complete in-house Rapid PCB
Prototyping
Identifying trends, setting new
standards
ideas with customers
Individually tailored solution packages
for future-oriented customers
Global service network
Perfect synthesis of quality and
high-tech
ISO 9001:2000 certified supplier
3
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4
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Seite 4
In-house Rapid PCB Prototyping
In-house Rapid PCB Prototyping
LPKF
ss/ds without
through-hole plating
LPKF
ss/ds with
mechanical
through-hole plating
LPKF
ss/ds with
conductive paste
through-hole plating
LPKF
ss/ds with galvanic
through-hole plating
LPKF
Multilayer
LPKF PCB Prototyping
Milling Technology
CAM (CircuitCAM/BoardMaster)
CAM (CircuitCAM/BoardMaster)
Structuring the internal layers
Bonding the layers
Drilling
Drilling
Galvanic through-hole plating
Structuring
Structuring of outer layers
Contour routing
Contour routing
Conductive paste plating
Mechanical through-hole plating
Prototype printed circuit board
Solder mask
Optional
Tin plating
ss –
ds –
pth –
npth –
single-sided circuit board
double-sided circuit board
plated through hole
non-plated through hole
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
23.04.2003
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Seite 5
Use in conventional series production
Use in conventional PCB production
ss/ds with
through-hole plating
(photo resist)
ss/ds with
through-hole plating
(Pb/Sn) (metal
etching resist)
ss/ds with
through-hole plating
(metal etching
resist)
ss/ds with
through-hole plating
(tenting technology)
ss/ds without
through-hole plating
Multilayer
CAM (CircuitCAM/BoardMaster)
Creating negative artwork film
Use of LPKF systems
in conventional
PCB production
Exposing photo resist
Developing photo resist
Rinsing circuit board
Drilling pth
Drilling npth
Deburring
Cleaning
Laminating
Galvanic through-hole plating
Creating negative artwork film
Resist stripping
Exposing photo resist
Etching, rinsing, cleaning, drying
Differential etching, rinsing, cleaning, drying
Developing photo resist
Bonding the layers
Rinsing circuit board
Drilling pth
Pb/Sn
Resist stripping
Deburring
Cleaning
Etching, rinsing, cleaning, drying
Desmearing etch-back
Pb/Sn resist
Drilling npth
Galvanic through-hole plating
Contour routing
Laminating
Solder mask
Creating negative artwork film
Tin plating
Exposing photo resist
Subject to technical modifications. See imprint for details.
De-panelling
Developing photo resist
Solder paste printing
Rinsing circuit board
Assembling (SMD, BGA)
Etching, rinsing, cleaning, drying
Reflow soldering
Resist stripping
5
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Applications
Applications
Use of circuit board plotters for Rapid PCB Prototyping
Prototype circuit boards with up to 8 layers
LPKF ProtoMats have a broad range of applications: an enormous spectrum of rigid and
flexible materials, as well as soft substrates for RF and microwave technology, can easily be
machined to produce prototype boards of production quality.
100 µm (4 mil) track and gap
150 µm (6 mil) hole diameters
The electrical characteristics of the prototype can be accurately produced from the design
data. This is guaranteed by the precise reproduction of the geometrical properties by the
LPKF circuit board plotters. The capability to create 100 µm (4 mil) tracks and gaps as well
as 150 µm (6 mil) holes enables the production of state-of-the-art circuits including BGA
and fine-pitch SMD components.
Through-hole plating
An essential part of most prototype boards are through-hole connections. LPKF offers
alternative methods including: Rivets (LPKF EasyContac), conductive paste (LPKF
AutoContac) and galvanic through-hole plating (LPKF MiniContac III and Contac III).
Through-hole plating with rivets
The LPKF EasyContac system is a simple, low cost method for through-hole plating
on less complex circuit boards. The process uses rivets, manually inserted with a
special tool and then soldered. This through-hole plating method is suitable for
low-density circuit boards with up to 50 via holes.
Through-hole plating with conductive paste
A dispenser mounted on the head of the LPKF circuit board plotter automatically
injects a special conductive paste into the holes of the board and then vacuums
out the excess paste leaving an open hole.
The paste is cured in a convection oven and creates a plated through-hole that
is solderable and can be populated with wired components. LPKF AutoContac is
suitable for low-density circuit boards with up to 300 via holes with diameters of
0.5 mm - 1.4 mm (20 mil - 55 mil).
Electroplating
LPKF offers two different sized electroplating systems – LPKF Contac III and
MiniContac III. These galvanic through-hole plating systems were specially developed to provide in-house plating solutions without compromising layout density or
limiting design rules. The process takes 60 - 120 min and produces production quality through-hole plating. Holes as small as 0.2 mm (8 mil) are easily plated and
there is no limit to the number of holes.
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
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Seite 7
Applications
Reverse pulse plating
The introduction of reverse pulse plating (RPP) in 2003 has considerably improved
the quality of through-hole plating. This method guarantees uniform plating
thickness in the entire hole and allows plating of more difficult aspect ratios.
The “bone effect” (thicker plating at the top and bottom of the hole) is now a thing
of the past. This technology is based on accurately timed reverse pulsing (anodic
polarisation of the circuit board) which precisely ablates excess material to give
smoother plating.
Production of multilayer circuit boards
Multilayer circuit boards can easily be produced in house using LPKF solutions. Today the
production of 8-layer multilayers in ultra-fine technology is becoming a standard requirement as much as simple double sided boards. In the production of multilayer circuit boards
in particular, electroplating systems (Contac III or MiniContac III) combined with the LPKF
MultiPress II, are the backbone of the cost and time saving production of such complex
prototype circuit boards.
Routing slots, cut outs and board profile
The routing of slots, cut-outs and board contours or larger openings or routing of circuit
board contour to depanelize it from sheet material is no problem even with complex shapes.
Solder mask
Solder masks are used in PCB mass production to increase soldering precision and protect
the boards from environmental influences. With LPKF EasySolder, LPKF has developed an
easy, inexpensive method of producing instant solder masks for prototype boards using the
LPKF circuit board plotter. The mask is simply cut into an adhesive polymer material and
then bonded to the finished board.
RF and microwave circuits
Designers of RF and microwave circuits often require a substantial number of different
prototype boards during a development project, all made with superior accuracy. Only some
PCB manufacturers are set up to produce boards on special RF substrates and some of the
chemical methods used are unable to provide the precise geometries required.
The LPKF ProtoMat® C100/HF was developed specifically for the RF and microwave
market. It mostly uses custom designed precision tools to guarantee straight sidewalls and
minimum penetration into the substrate.
Prototypes can be quickly produced for testing as soon as the design is complete, then
small batches can also be economically made with this machine. The LPKF ProtoMat®
C100/HF easily handles all common RF substrates including PTFE and ceramic filled
substrates (RO® 4000).
Subject to technical modifications. See imprint for details.
7
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Seite 8
Applications
Special Applications
Flexible circuit boards
With LPKF’s patented non-contact air bearing it is possible to process a wide range of
flexible circuit materials. The crucial factor in this application is the ratio of flexible
material thickness to the copper layer thickness but many flexible circuits have been prototyped on an LPKF circuit board plotter equipped with this device.
Rigid-flex circuit boards
LPKF circuit board plotters have a proven track record in the production of rigid-flex circuit
boards. In small batch production as well as prototyping, the LPKF circuit board plotters
with non-contact air bearing (LPKF ProtoMat® C100/HF, H100, 95s/II and X60) highlight
the benefits of defined depth milling. Prototyping of rigid-flex circuit boards is completed
quickly and easily with these machines.
Front panels and sign production
LPKF circuit board plotters can also be used for engraving and routing front panels and
signs. These high-precision systems open up numerous options for the very fine machining
of various materials, e.g.:
· Plastic
· Plexiglass
· Aluminum
· Brass, and many more.
Housings
The multi-functional character of LPKF circuit board plotters in electronics development is
also highlighted by their ability to machine other parts such as housings. This involves the
use of different tools to suit the materials used.
Dispensing
With the LPKF AutoContac system fitted onto an LPKF circuit board plotter it is possible to
dispense media of various kinds including solder paste, adhesive, conductive paste and
sealing compounds.
Subject to technical modifications. See imprint for details.
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Seite 9
Applications
Use of circuit board plotters in PCB production
Reworking assembled/unassembled circuit boards
LPKF circuit board plotters can be used in numerous positions of PCB production lines and
easily integrated. LPKF ProtoMat® systems are ideal and cost-effective additions to
congested production lines particularly for the de-panelling of circuits (LPKF ProtoMat®
X60), or the subsequent creation of holes and openings after board manufacture. Other uses
include configuring or coding, e.g. by removing a plated hole or by severing one or more
tracks. LPKF systems can also be used to rework circuit boards, which have been produced
by etching.
Milling and engraving of special films and instant solder masks
LPKF circuit board plotters can be used to produce precision artwork for the mass production of circuit boards. This saves the expense of buying and running a photoplotter or the
cost of using an outside service.
The ability to cut very precisely defined openings in special films opens up other areas
of application for LPKF circuit board plotters including the production of:
· Instant solder mask
· Prototype SMD stencils for the application of solder paste on prototype printed circuit
boards using the printing machine LPKF ZelPrint LT300
Drilling circuit boards or test adapters
LPKF circuit board plotters can be used as CNC drilling machines. The software supplied
with each circuit board plotter system can read in drilling co-ordinates from circuit boards
if no data is available by using a camera (LPKF CircuitView) in conjunction with the teach-in
method. Test adapters for the pinhole bed of automatic circuit board testers can be drilled
or milled in materials such as plexiglass, Pertinax and antistatic fiberglass reinforced epoxy
often used for vacuum test adapters.
Solder frames and inspection templates
A crucial aspect in the production of solder frames and inspection templates is precise
machining of the carrier materials to ensure a perfect fit with the mass production circuit
boards. This is another ideal area of application for LPKF circuit board plotters.
!
Subject to technical modifications. See imprint for details.
Perhaps you have come up with a new idea, or want to machine other new materials. Maybe
you have a special application but have not yet found a solution, simply give us a call!
Our application engineers are happy to perform tests and help you find the solutions to your
problems any time.
9
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Software package (LPKF CircuitCAM & BoardMaster)
Software package (LPKF CircuitCAM & BoardMaster)
Plug & Play for a fast start
Each LPKF circuit board plotter is delivered complete with a comprehensive software package for the import of
data from any PCB layout CAD package and control of the machine itself. The development of the software
focused on three key aspects: simple operation, perfect match to the hardware, and compatibility with all
standard CAD programs. This ensures an easy to learn, easy to use and compatible package.
LPKF CircuitCAM
The software interface to your CAD/EDA system
LPKF CircuitCAM is one of the few user friendly programs offering
powerful editing options for data modification. Its core is the intelligent insulation process used to produce the milling paths for the
LPKF circuit board plotter.
Simple integration
LPKF CircuitCAM processes the same data, which would be sent to
the PCB manufacturer. The usual data flow does not need to be
changed. Automatic importing of the aperture tables and tool lists
is followed by reading in of the Gerber and NC drilling files, which
are then graphically displayed on screen. LPKF CircuitCAM provides
numerous editing options for data modification (versiondependent):
• Data input: Gerber®, GerberX, HP-GL™, Excellon®, Sieb & Meier,
DXF, Barco®, ODB++®
• Data output: Gerber®, GerberX, HP-GL™, LMD,
Excellon® formats
• Intelligent insulation: This process guarantees removal of
copper using various automatic and individually adjustable
insulation options, which optimize milling time and tool life,
with up to four different tools per insulation strategy and
freely definable rub-outs – including polygons
• Design rule check: Automatic checking of track/gap spaces
• Auto contour routing: Automatic generation of routing path
with definable breakout tabs
• Auto ground plane: automatic generation of ground planes
• Direct drawing input: Drawing of simple front panels or PCB’s
• Editing: e.g. modifying line-widths, changing hole diameters,
shifting holes, add copper areas, etc.
• The WIZARD: Integrated program assistant to guide the user
and cut the learning curve.
• True type fonts: (TTF) in CircuitCAM text function
• Auto assign: Automatic assignment of production phases/tools
for BoardMaster
• Machining order control: Modification of cutting direction
and sequence
Simple and functional
LPKF CircuitCAM is very easy to operate via the Windows interface
thanks to its intelligent structure. Particularly fast and effective
operation through programmable tool bars and input instructions.
A program assistant (Wizard) guides the user through the program
sequence step by step: from importing data, through generation of
milling/routing paths, to the export of production data. Even unskilled users can rapidly learn this software and successfully
generate the data for the circuit board plotter.
Compatible with every standard CAD/EDA
CircuitCAM supports all standard data formats
CAD data accepted
CircuitCAM
BoardMaster
· GERBER®
for Windows
for Windows
· Extended GERBER
· CAD data
Controlling the LPKF
(RS 274 X)
· DPF (BARCO®)
· EXCELLON
importing and
circuit board plotter
editing
· Tool library
· Milling data and
· SIEB & MEIER
routing path
· DXF
generation
· Process control
· HP-GL™
· ODB ++®
Subject to technical modifications. See imprint for details.
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Seite 11
Software package (LPKF CircuitCAM & BoardMaster)
High performance CAM station
With LPKF CircuitCAM PCB software, the user also has access to an independent CAM station. This opens up a wide range of options: production data
control, editing, modification, step and repeat, different design rule checks,
generation of ground planes or text in true type fonts as well as contour routing
paths. LPKF CircuitCAM PCB is also a very high-performance data converter,
e.g. for the conversion of AutoCAD® DXF data into Gerber files.
Upgrading LPKF CircuitCAM LITE to PCB is possible any time for a single flat
fee.
Special applications with LPKF CircuitCAM software
• Defined insulation at the push of a button
The diverse insulation parameters and options of LPKF CircuitCAM can be
individually adjusted and easily executed. The use of several tools
guarantees optimal, reliable removal of the copper around the conductor
lines.
• RF- and microwave layouts
Because of its special functions, it is particularly easy to use LPKF
CircuitCAM to process RF and microwave layouts from any original data.
The intelligent polygon-fill function for instance makes the processing of
DXF data really easy.
• Contour routing path generator
LPKF CircuitCAM also has the option to generate routing paths automatically. This includes the creation of cutting paths for internal slots or
openings as well as the outer contour of the circuit board. Defined breakout
tabs are created at the same time to hold the circuit board in the material.
Specifications
LPKF CircuitCAM LITE
LPKF CircuitCAM PCB
Import formats
Gerber Standard (RS-274-D), Gerber Extended (RS-274-X),
Gerber Standard (RS-274-D), Gerber Extended (RS-274-X), Excellon NC Drill (version 1 and 2),
Excellon NC Drill (version 1 and 2), Sieb & Meier NC Drill, HP-GL™
Sieb & Meier NC Drill, HP-GL™, Barco® DPF, AutoCAD™ DXF, ODB ++®
Supported shapes
Circle, square, rectangle (also rounded or angled), octagon, oval, marker, IEC 1182 (1000 - 1024) including thermal reliefs, fiducials, etc., special (arbitrary
Export formats
LPKF BoardMaster (LMD)
Editing functions
Original modification, relocating, duplicating, rotating, mirroring, erasing, extending/severing lines, line/path extension/shortening, line path/segment parallel
Special functions
Contour routing path generator with breakout tabs
definable).
LPKF BoardMaster (LMD), Gerber Standard (RS-274-D), Gerber Extended (RS-274-X),
Excellon NC Drill, HP-GL™
shifting, line path/object polygon conversion (Fill), curve linking/closing
Contour routing path generator with breakout tabs, volume operations, joining/separating objects,
step & repeat (multiple PCB), polygon cut-out, ground plane generation with defined clearance,
batch functions
Display functions
Zoom window (freely definable), zoom in/out, overview, redraw, individual layers selectable/visible, panning (keyboard), layer in solid/outline/center line display,
16 pre-set colors (up to 16 million freely available), different colors for tracks and pads of the same layer, different colors for insulation tools
Marker functions
Single element, total layer, all layers, pad groups, selection and limiting to specific layers possible for lines/polygons/circles/rectangles/pads/holes (multiple choice
and restriction to specific layers possible)
Graphic functions
Lines (open/closed), circle, polygon, rectangle, pad, hole, text (TTF)
Control functions
Measuring
Insulation methods
Single insulation method, additional multiple insulation of pads, removal of residual copper spikes (spike option), milling out of large insulation areas (rub-out),
Insulation tools
1 - 2 tools
Languages
English, German, French, Spanish, Japanese and Chinese
Hardware and software
Microsoft® Windows® 95/98/NT/2000/XP, 700 MHz processor or better, min. 128 MB RAM (256 MB recommended), screen resolution min. 1024x768 pixels
Measuring, design rule check
concentric or in serpentines maintaining minimum insulation spaces, zone insulation (only PCB version)
1 - 4 tools
specifications
Supplied with
LPKF ProtoMat® C20, C40, M30/S
Subject to technical modifications. See imprint for details.
LPKF ProtoMat® C60, C100/HF, M60, 95s/II, H100, X60, L60, Upgrade from LITE available
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Software package (LPKF CircuitCAM & BoardMaster)
LPKF BoardMaster
The powerful and comfortable control software
This intelligent control software for LPKF circuit board plotters combines a high
degree of user-friendliness with perfect process control. The graphic user
interface can handle milling and drilling data created by CircuitCAM as well as
HP-GL™ files from various design software packages.
User-friendly operating interface
The WYSIWYG (What-You-See-Is-What-You-Get) user interface shows all milling
and drilling data as well as the size of the base material. Through a simple click
of a mouse various different layouts and step-and-repeat copies can be placed
on one sheet of material. The actual machining status is constantly displayed.
Simultaneous processing of several projects
Intelligent tool management
All tool parameters such as feed rate and rpm are controlled by LPKF
BoardMaster and managed in the tool library. The life of the bits is constantly
monitored and the user is prompted to change tools when the maximum tool life
is reached. The tool change process is optimized to reduce the number of
changes necessary. The tool changing on the LPKF ProtoMat® 95s and H100 is
fully automatic and requires no user interaction.
Automatic data transmission
All of the processing phases and associated tools are automatically output by
CircuitCAM straight into BoardMaster. The production of the circuit board can
start immediately the cutting data is processed without any program change.
Tool library
LPKF BoardMaster in use
Selection of separate elements
Technical data LPKF BoardMaster
Import formats
LPKF-Mill-Drill (*.LMD), HP-GL™
Control
All ProtoMat® plotters and LPKF 101 LC, LPKF LC/VS, LPKF HI-P, LPKF AutoMill, LPKF 91, LPKF 91s and LPKF 92s
Display function
WYSIWYG display of machining data, zoom in/out/working area/projects, previous view, all viewing methods available at all times, even during the machining process
Placement functions
Copy, move, step and repeat, handles multiple artworks and placements simultaneously
Selection methods
Total production phase, specific tools, individual drill holes/lines/segments, selection from/up to a specific hole/line segment
Tool management
RPM and head down time, registering and saving actual tool life, initiating the tool change procedure if tool lifetime is exceeded
Tool Library
Unlimited, individual library for different material types, individual customizable parameters
Programming the
Positioning with corner coordinates, with the mouse, coordinates input via keyboard, option of saving frequently used material sizes
material size
Languages
English, German, Spanish, Japanese, French, Chinese
Other
Acoustic signal at end of production phase and display of production time remaining, estimated production time is displayed before start
Hard and software
Microsoft® Windows® 95/98/NT/2000/XP, 400 MHz processor or better, min. 64 MB RAM (recommended 128 MB), screen resolution min. 800 x 600 pixels, serial port
requirements
Subject to technical modifications. See imprint for details.
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Seite 13
LPKF ProtoMat® – Quality features
LPKF ProtoMat® – Quality features
High precision and long life
State-of-the-art technology and materials of the highest quality ensure that LPKF circuit
board plotters comply with the most stringent specifications for precision. This applies
to the machines themselves as well as to the boards produced by them. These systems
have an extremely long and useful operational life. Each and every LPKF ProtoMat®
plotter is built to be the best of its class with thousands of installed systems to prove it.
U
Rigid cast aluminium
table
U
U
System Design
• Precision linear shafts
• Anti-backlash lead screws
• Solid, high-precision cast machine table
• Variable high-speed spindle motors
· up to 100,000 rpm
· Increased tool lifetimes
· Automatic, software-supported, smart warm-up
phase doubles motor lifetimes
• Software-supported registration hole system
• Enclosed LPKF dust extraction
· with electronic control and absolute filter to
prevent micro dust particles from becoming
airborne
• Quick-release tool collet
· For standard and special tools with 1/8“ shaft
• Coaxial milling depth limiter O
Either mechanical foot or noncontact air bearing
· Scans the material surface
and compensates for
irregularities
· This allows the defined
Coaxial milling depth
penetration of the tool
limiter
and the production of ultra-fine
structures even on soft microwave substrates
· The shape of the depth limiter provides efficient
dust extraction of the entire cutting area.
Integrated dust
extraction system
CircuitCAM
U
U
Software solutions
• CAM software package (CircuitCAM, BoardMaster)
For circuit boards and front panel applications:
included (Windows® 95/98/2000/NT and
XP compatible)
· CircuitCAM: conversion and editing software with
intelligent insulation process
Important Parameters
• Step resolution as small as 1 µm (0.004 mil) with a
repeatability of ± 1 µm (0.004 mil)
• Circuit structures
· Minimum 80 µm (3.1 mil) tracks partially with
100 µm (4 mil) spacing
· Drill holes 150 µm (6 mil) and bigger
Upgrading Options
• The software already includes options such as
· dispensing and conductive paste through-hole
plating.
· Teach-in-camera (LPKF CircuitView)
Customer Service
Germany
China
France
Japan
Subject to technical modifications. See imprint for details.
+49-5131-7095-0
+86-22-23005700
+33-1-60862691
+81-3-34657105
· BoardMaster: circuit board
O
plotter control, process
control; intelligent tool
management guarantees
optimal use of LPKF
high-precision tools.
BoardMaster
Both standard bits and special
tools for RF circuits do not
O
require any liquid cooling.
• Machining of various materials
· FR3, FR4, G10, other glass fiber reinforced epoxies
· PTFE, filled substrates (e.g. RT/duroid®, TLX®, etc.)
· ceramic filled substrates (e.g. Rogers RO® and TMM)
· brass and aluminum
· plastic materials
• Accessories and additional equipment options allow
the adaptation of the systems to an
enormous range of tasks
(Free advice/support)
Slovenia
+386-4-2013804
Spain
+34-91-8475505
UK/Ireland
+44-1344-455046
North America +1-503-454-4229 (8 am - 5 pm PST)
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LPKF ProtoMat® C-series
LPKF ProtoMat® C-series
LPKF ProtoMat® C20
530 x 650
(20.9 x 25.6)
Simple and affordable 2-sided PCBs
This circuit board plotter is an ideal entry-level
system for users that demand precision prototypes on an affordable budget. This model is
particularly popular in schools, colleges, and
universities. The ProtoMat® C20 is ideal for
single and double sided boards using analog
and digital technology with medium layout
density.
375 x 540
(14.8 x 21.3)
X-Series
M-Series
200 x 340
(7.8 x 14.4)
C-Series
LPKF ProtoMat® C40
Working area in mm (inch)
!
C60
Applications
C40
LPKF ProtoMat®
C100/HF
Training for LPKF ProtoMat® C, M,
and X-series
All LPKF products are supplied with comprehensive operating instructions, with easy to
understand manuals to make installation and
commissioning quick and simple for the user.
Additional software assistant and multimedia
training CD allow complete self-conducted training at
the user’s convenience.
We also provide private installation and training
classes, both on-site or at one of LPKF’s worldwide
service facilities.
C20
14
23.04.2003
Robust basic model with quick tool change
Instant prototypes right out of the lab at a
higher level – The ProtoMat® C40 is setting a
new standard in the industry combining the
capability to create precision single and double
sided PCBs with the operating comfort of a
quick-release tool collet and the high performance of 40,000 rpm programmable motor
speed. This makes this entry-level circuit board
plotter the perfect fit for users from small
businesses to corporate engineering.
LPKF ProtoMat® C60
For tight specs and diverse applications
The 60,000 rpm programmable speed motor
allows the use of an extended range of tools,
including small rectangular profiled endmills
with diameters as small as 0.25 mm (10 mil).
These tools have superior characteristics for
RF and microwave applications and allow maximum precision with minimum penetration into
the substrate. The high-speed motor also allows
the production of dense digital designs with
track/gap geometries of 100 µm (4 mil) and
0.2 mm (8 mil) drill holes as well as multilayer
applications.
1 and 2-sided circuit boards
LPKF ProtoMat® C100/HF
FR3, FR4, FR5, G10
Ideal for RF substrates and flex
This system, especially designed for RF and
microwave PWBs, takes prototyping to extremes.
A motor speed of 100,000 rpm allows the
widest range of tools including 0.15 mm (6 mil)
endmills for high performance designs. In addition the ProtoMat® C100/HF is extremely versatile. A contact-less air bearing depth limiter is
ideal for use on flexible or gold plated circuits.
Micrometer depth adjustment can be used to mill
precise pockets into brass or aluminum backed
circuits or to route beryllium copper sheets.
The ProtoMat® C100/HF is fully compatible
with multilayer applications and all common
materials including FR4, Rogers RO 4000® and
TMM®, as well as PTFE substrates such as
RT/duroid®, UltraLAM®, TLX®, TLY® and many
others.
Flexible substrates
RF & microwave substrates
Front panels/sign engraving
Machining cut outs in front panels
Contour routing of circuit boards
Multilayer PCBs up to 4 layers*
Multilayer PCBs up to 8 layers*
Test adapter drilling
Milling film artworks
SMD solder stencil cutting
Rigid-flex circuit milling
Depanelization and reworking of bare
and populated boards
Solder frames for circuit board assembly
Housing production
Suitable for application
* combined with MultiPress II and Contac III/MiniContac III
Subject to technical modifications. See imprint for details.
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Seite 15
LPKF ProtoMat® C-series
Simple and affordable
Robust basic model with quick
Multifunctional for tight specs
Ideal for RF substrates
2-sided PCBs
tool change
and diverse applications
and flex
Specifications
LPKF ProtoMat® C20
LPKF ProtoMat® C40
LPKF ProtoMat® C60
LPKF ProtoMat® C100/HF
Part number
109419
110517
106511
107973
Minimum track width
0.2 mm (8 mil)
0.1 mm (4 mil)
0.1 mm (4 mil)
0.1 mm (4 mil)
Minimum gap
0.2 mm (8 mil)
0.2 mm (8 mil)
0.1 mm (4 mil)
0.1 mm (4 mil)
Minimum hole diameter
0.5 mm (20 mil)
0.3 mm (12 mil)
0.2 mm (8 mil)
0.2 mm (8 mil)
Working area
340 mm x 200 mm (13.4“ x 7.8“)
340 mm x 200 mm (13.4“ x 7.8“)
340 mm x 200 mm (13.4“ x 7.8“)
340 mm x 200 mm (13.4“ x 7.8“)
Resolution
7.937 µm (0.312 mil)
7.937 µm (0.312 mil)
7.937 µm (0.312 mil)
7.937 µm (0.312 mil)
Repeatability
+/- 0.005 mm (0.2 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.005 mm (0.2 mil)
Front-to-back registration accuracy
+/- 0.02 mm (0.8 mil)
+/- 0.02 mm (0.8 mil)
+/- 0.02 mm (0.8 mil)
+/- 0.02 mm (0.8 mil)
Milling motor
DC, 20,000 rpm
EC (brushless), 10,000 -
3-phase motor, 10,000 -
3-phase motor, 10,000 -
40,000 rpm, programmable
60,000 rpm, programmable
100,000 rpm, programmable
Tool change
Semi-automatic
Semi-automatic
Semi-automatic
Semi-automatic
Collet
1/8” collet
1/8” quick-release collet
1/8” quick-release collet
1/8” quick-release collet
Drilling capacity
78 holes/min
78 holes/min
90 holes/min
120 holes/min
Positioning speed (max.)
35 mm/sec (1.38“/sec)
35 mm/sec (1.38“/sec)
35 mm/sec (1.38“/sec)
35 mm/sec (1.38“/sec)
Depth adjustment
Mechanical scanning,
Mechanical scanning,
Mechanical scanning,
Non-contact air bearing
coaxial foot
coaxial foot
coaxial foot
stepper motors, precision lead
stepper motors, precision
stepper motors, precision
stepper motors, precision
screws ActiveCAM®
lead screws ActiveCAM®
lead screws ActiveCAM®
lead screws ActiveCAM®
X/Y positioning system
anti-backlash Supernuts
®
anti-backlash Supernuts
®
anti-backlash Supernuts
®
anti-backlash Supernuts®
electromagnetic with hydraulic
electromagnetic with
electromagnetic with
pneumatic, 14 mm (0.55“)
damper
hydraulic damper
hydraulic damper
movement
Machine table base
75mm (3”) cast aluminum
75mm (3”) cast aluminum
75mm (3”) cast aluminum
75mm (3”) cast aluminum
X/Y linear system
precision linear bushings and
precision linear bushings
precision linear bushings
precision linear bushings
dual shafts
and dual shafts
and dual shafts
and dual shafts
Dimensions (W/H/D)
16.5“ x 13.75“ x 22.25“ 1)
16.5“ x 13.75“ x 22.25“ 1)
16.5“ x 13.4“ x 22.25“ 2)
16.5“ x 13.0“ x 22.25“ 3)
Weight
24 kg (53 lb)
24 kg (53 lb)
24 kg (53 lb)
25 kg (55 lb)
Power supply
120/240V, 50 - 60 Hz/150VA
120/240V, 50 - 60 Hz/150VA
120/240V, 50 - 60 Hz/200VA
120/240V, 50 - 60 Hz/200VA
Compressed air supply
--
--
--
6 bar (87 psi), 50 l/min (1.7 cfm)
Software package CircuitCAM LITE
•
•
–
–
Software package CircuitCAM PCB
+
+
•
•
Dust extraction unit
+
+
+
+
Dust extraction AutoSwitch
+
+
+
+
Tooling starter kit (board material/tools etc.)
+
+
+
+
Measuring microscope
+
+
+
+
Mobile sound enclosure
+
+
+
+
Head illumination
++
++
++
++
CircuitView camera system
+
+
+
+
Micrometer depth adjustment
+
+
+
•
3-phase motor, 10,000 to 100,000 rpm
++
++
++
•
3-phase motor, 10,000 to 60,000 rpm
++
++
•
–
EC motor, 10,000 to 40,000 rpm
++
•
–
–
DC motor, 20,000 rpm
•
–
–
–
Pneumatic Z-stroke
++
++
++
•
Pneumatic non-contact air bearing
++
++
++
•
Raising Z-axis by 30 mm (1.2”)
++
++
++
++
Z drive
Options/accessories
•
standard equipment
+
optional (can be retrofitted)
recommended basic equipment
Dimensions (W/H/D)
1) 420 mm x 350 mm x 565 mm
++ optional (needs to be factory mounted)
2) 420 mm x 340 mm x 565 mm
–
3) 420 mm x 330 mm x 565 mm
not available
Subject to technical modifications. See imprint for details.
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Seite 16
LPKF ProtoMat® M/L-series
LPKF ProtoMat® M/L-series
LPKF ProtoMat® M30/s
530 x 650
(20.9 x 25.6)
Robust basic model with quick-release collet
for 2-sided PCBs, large panels
The large table size makes the ProtoMat® M30
very valuable for large analog and digital
boards with medium population density as well
as production of multiple copies of the same or
different layouts. For increased operating
comfort, this system provides programmable
spindle speed and quick-release tool collet.
375 x 540
(14.8 x 21.3)
X-Series
M-Series
200 x 340
(7.8 x 14.4)
C-Series
LPKF ProtoMat® M60
For precise large and multilayer boards
The ProtoMat® M60 is truly a multi-talented
system. Its large table size allows the production of large circuit boards. This is
especially helpful when producing multilayer
boards as this plotter can handle multiple
layers simultaneous.
A 60,000 rpm motor guarantees perfect
drill hole quality, which is essential for proper
interconnection on multilayer boards, and
produces dense circuitry from DC to RF.
It is also able to engrave and route inspection templates, aluminum panels and other
two-dimensional mechanical items.
Working area in mm (inch)
LPKF ProtoMat® L60
L60
Applications
M60
LPKF ProtoMat®
M30/s
16
23.04.2003
For extremely long circuit boards, antennas
and front panels
This circuit board plotter provides a long
working area that accommodates extra large circuits
including antennae and front
panels. It is equipped with a
60,000 rpm motor capable
of handling small endmills
for RF and microwave circuitry
and a pneumatic Z-axis with extra clearance for
thick substrates.
1 and 2-sided circuit boards
FR3, FR4, FR5, G10
Flexible substrates
RF & microwave substrates
Front panels/sign engraving
Machining cut outs in front panels
Contour routing of circuit boards
Multilayer PCBs up to 4 layers*
Multilayer PCBs up to 8 layers*
Test adapter drilling
Milling film artworks
SMD solder stencil cutting
Rigid-flex circuit milling
Depanelization and reworking of bare
and populated boards
Solder frames for circuit board assembly
Housing production
Suitable for application
* combined with MultiPress II and Contac III/MiniContac III
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
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Seite 17
LPKF ProtoMat® M/L-series
Robust basic model with quick-release
Multifunctional system for precise large
For extremely long circuit boards,
collet for 2-sided PCBs, large panels
and multilayer boards
antennas and front panels
Specifications
LPKF ProtoMat® M30/s
LPKF ProtoMat® M60
LPKF ProtoMat® L60
Part number
108001
108002
109797
Minimum track width
0.1 mm (4 mil)
0.1 mm (4 mil)
0.1 mm (4 mil)
Minimum gap
0.2 mm (8 mil)
0.1 mm (4 mil)
0.1 mm (4 mil)
Minimum hole diameter
0.3 mm (12 mil)
0.2 mm (8 mil)
0.2 mm (8 mil)
Working area
540 mm x 375 mm (21.3“ x 14.8“)
540 mm x 375 mm (21.3“ x 14.8“)
375 mm x 1,250 mm (14.75“ x 49.2“)
Resolution
7.937 µm (0.312 mil)
7.937 µm (0.312 mil)
7.937 µm (0.312 mil)
Repeatability
+/- 0.005 mm (0.2 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.005 mm (0.2 mil)
Front-to-back registration accuracy
+/- 0.02 mm (0.8 mil)
+/- 0.02 mm (0.8 mil)
+/- 0.02 mm (0.8 mil)
Milling motor
EC (brushless), 10,000 - 30,000 rpm,
3-phase motor, 10,000 - 60,000 rpm,
3-phase motor, 10,000 - 60,000 rpm,
programmable
programmable
programmable
Tool change
Semi-automatic
Semi-automatic
Semi-automatic
Collet
1/8“ collet
1/8“ collet
1/8“ collet
Drilling capacity
78 holes/min
90 holes/min
120 holes/min
Positioning speed (max.)
35 mm/sec (1.38“/sec)
35 mm/sec (1.38“/sec)
35 mm/sec (1.38“/sec)
Depth adjustment
Mechanical scanning, coaxial foot
Mechanical scanning, coaxial foot
Non-contact air bearing
X/Y positioning system
stepper motors, precision lead screws
stepper motors, precision lead screws
stepper motors, precision lead screw
ActiveCAM® anti-backlash Supernuts®
ActiveCAM® anti-backlash Supernuts®
assemblies with internal ball recirculating
Z drive
electromagnetic with hydraulic damper
electromagnetic with hydraulic damper
pneumatic, 14 mm (0.55“) movement
Machine table base
75mm (3“) cast aluminum
75mm (3“) cast aluminum
precision milled aluminum bed
X/Y linear system
precision linear bushings and dual shafts
precision linear bushings and dual shafts
precision linear bushings and dual shafts
Dimensions (W/H/D)
620 x 420 x 760 mm (24.4“ x 16.5“ x 29.9“)
620 x 420 x 760 mm (24.4“ x 16.5“ x 29.9“)
620 x 420 x 1,543 mm (24.4“ x 16.5“ x 60.7“)
Weight
43 kg (94.6 lb)
43 kg (94.6 lb)
110 kg (242 lb)
Power supply
120/240V, 50 - 60 Hz/150VA
120/240V, 50 - 60 Hz/200VA
120/240V, 50 - 60 Hz/200VA
Compressed air supply
--
--
6 bar (87 psi), 100 l/min (3.528 cfm)
Software package CircuitCAM LITE
•
–
–
Software package CircuitCAM PCB
+
•
•
Dust extraction unit
+
+
+
Dust extraction AutoSwitch
+
+
+
Tooling starter kit (board material/tools etc.)
+
+
+
Measuring microscope
+
+
+
Mobile sound enclosure
+
+
–
Head illumination
++
++
++
CircuitView camera system
+
+
+
Micrometer depth adjustment
+
+
+
3-phase motor, 10,000 to 100,000 rpm
++
++
++
3-phase motor, 10,000 to 60,000 rpm
++
•
•
EC motor, 10,000 to 40,000 rpm
•
–
–
Pneumatic Z-stroke
++
++
•
Pneumatic non-contact air bearing
++
++
++
Raising Z-axis by 30 mm (1.2”)
++
++
++
system
Options/accessories
•
standard equipment
+
optional (can be retrofitted)
++ optional (needs to be factory mounted)
–
not available
Subject to technical modifications. See imprint for details.
recommended basic equipment
17
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LPKF ProtoMat® H-series
LPKF ProtoMat® H-series
LPKF ProtoMat® 95s/II
Precision system with automatic tool change
The LPKF ProtoMat® 95s offers high-speed and
precision combined with the convenience of
a 30-station fully automatic tool change.
A contact-less air bearing depth limiter is ideal
for use on flexible or gold plated circuits.
This circuit board plotter is designed for
PCB labs with a high volume of prototypes in
any technology including analog, digital, power
supplies, flex boards as well as RF and microwave circuits. The high production speed is
also a substantial advantage for the in-house
fabrication of quick turn multilayer circuit
boards and small batch production.
380 x 420
(14.9 x 16.5)
95s/II, H100
Working area in mm (inch)
LPKF ProtoMat® H100
!
Installation and training for LPKF
ProtoMat® 95s/II and H100
These systems are offered with installation and
training packages to support users in their
correct operation for the many applications that
the high end LPKF ProtoMat ® 95s/II and
ProtoMat® H100 can perform.
Applications
1 and 2-sided circuit boards
FR3, FR4, FR5, G10
Flexible substrates
RF & microwave substrates
Front panels/sign engraving
Machining cut outs in front panels
Contour routing of circuit boards
Multilayer PCBs up to 4 layers*
Multilayer PCBs up to 8 layers*
Test adapter drilling
Milling film artworks
H100
LPKF ProtoMat®
95s/II
18
23.04.2003
The fastest prototyping system yet
This system allows significant reduction in the
production time of prototype PCBs. The maximum milling speed is now almost doubled
compared to prior top-of-the-range systems
and the integrated smart following-vector path
generation allows the system to maintain a
higher average speed. The combination of both
of these features pushes the performance factor
of this machine 2 - 3 times. Now prototype production of multilayer boards is accomplished
in-house comfortably. The resolution has been
increased five fold to 1 µm, which combined
with 100,000 rpm milling motor allows this
plotter to partially create 80 µm (3.1 mil)
tracks with 100 µm (4 mil) spacing which
accommodates all state of the art packages
including BGA and µBGA®.
Along with the increased performance, the
H100 also includes many new features derived
from high volume production systems, which
up to now have been unknown in this class of
prototyping equipment. These features include
automatic tool change, automatic tool adjustment by scanning sensor, and a camera system
for automatic fiducial recognition. This eliminates user interaction and simplifies the board
alignment process. The H100 system also
includes an integrated vacuum tabletop
allowing proper mounting of thin and flexible
substrates on the plotter.
SMD solder stencil cutting
Rigid-flex circuit milling
Depanelization and reworking of bare
and populated boards
Solder frames for circuit board assembly
Housing production
Suitable for application
* combined with MultiPress II and Contac III/MiniContac III
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
23.04.2003
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Seite 19
LPKF ProtoMat® H-series
Precision system with automatic tool change
The fastest prototyping system yet!
Specifications
LPKF ProtoMat® 95s/II
LPKF ProtoMat® H100
Part number
106333
111424
Minimum track width
0.1 mm (4 mil)
0.1 mm (4 mil); 0.08 mm (3.1 mil) partially
Minimum gap
0.1 mm (4 mil)
0.1 mm (4 mil)
Minimum hole diameter
0.2 mm (8 mil)
0.15 mm (6 mil)
Working area
420 mm x 380 mm (16.5“ x 14.9“)
420 mm x 380 mm (16.5“ x 14.9“)
Resolution
5 µm (0.2 mil)
1 µm (0.04 mil)
Repeatability
± 0.005 mm (0.2 mil)
± 0.001 mm (0.04 mil)
Front-to-back registration accuracy
± 0.02 mm (0.8 mil)
± 0.02 mm (0.8 mil)
Milling motor
3-phase motor, 10,000 - 60,000 rpm, programmable
3-phase motor, 10,000 - 100,000 rpm, programmable
Tool change
Automatic, 30 positions
Automatic, 30 positions
Collet
1/8“ pneumatic-release collet
1/8“ pneumatic-release collet
Drilling capacity
90 holes/min
120 holes/min
Positioning speed (max.)
60 mm/sec (2.36“/sec)
100 mm/sec (3.94“/sec)
Depth adjustment
Non-contact air bearing
Non-contact air bearing: automatic setting
X/Y positioning system
stepper motors, precision ball screw assemblies with internal
stepper motors, precision ball screw assemblies with internal
ball recirculating system
ball recirculating system
Z drive
pneumatic, 14 mm (0.55“) movement
pneumatic, 14 mm (0.55“) movement
Machine table base
75 mm (3“) cast aluminum
75 mm (3“) cast aluminum
X/Y linear system
precision linear bushings and dual shafts
precision linear bushings and dual shafts
Dimensions (W/H/D)
650 mm x 430 mm x 750 mm (25.6“ x 16.9“ x 29.5“)
650 mm x 430 mm x 750 mm (25.6“ x 16.9“ x 29.5“)
Weight
50 kg (110 lb) (without acoustic cabinet)
50 kg (110 lb) (without acoustic cabinet)
Power supply
120/240V, 50 - 60 Hz/240VA
120/240V, 50 - 60 Hz/240VA
Compressed air supply
6 bar (90 psi), 100 l/min (2.4 cfm)
6 bar (87 psi), 100 l/min (3.528 cfm)
Software package CircuitCAM LITE
–
–
Software package CircuitCAM PCB
•
•
Dust extraction unit
+
+
Dust extraction AutoSwitch
+
+
Tooling starter kit (board material/tools etc.)
+
+
Measuring microscope
+
+
Mobile sound enclosure
•
•
Head illumination
++
•
CircuitView camera system
+
+
Micrometer depth adjustment
+
•
3-phase motor, 10,000 to 100,000 rpm
+
•
3-phase motor, 10,000 to 60,000 rpm
•
–
EC motor, 10,000 to 40,000 rpm
–
–
Pneumatic Z-stroke
•
•
Pneumatic non-contact air bearing
•
•
Raising Z-axis by 30 mm (1.2”)
–
–
Options/accessories
•
standard equipment
+
optional (can be retrofitted)
++ optional (needs to be factory mounted)
–
not available
Subject to technical modifications. See imprint for details.
recommended basic equipment
19
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Seite 20
LPKF ProtoMat® X-series
LPKF ProtoMat® X-series
Model for use in series production.
530 x 650
(20.9 x 25.6)
Working area matches standard
PCB production panels
375 x 540
(14.8 x 21.3)
X-Series
M-Series
200 x 340
(7.8 x 14.4)
C-Series
Working area in mm (inch)
Specifications
LPKF ProtoMat® X60
Part number
109643
Minimum track width
0.1 mm (4 mil)
Minimum gap
0.1 mm (4 mil)
Minimum hole diameter
0.2 mm (8 mil)
Working area
650 mm x 530 mm (25.6“ x 20.9“)
Resolution
1 µm (0.04 mil)
Repeatability
± 0.001 mm (0.04 mil)
Front-to-back registration accuracy
± 0.02 mm (0.8 mil)
Milling motor
3-phase motor, 10,000 - 60,000 rpm,
programmable
LPKF ProtoMat X60
Tool change
Semi-automatic
Drilling, Routing & Depaneling
The ProtoMat® X60 is placed between two worlds – rapid
PCB prototyping plotter on one hand and versatile
production drilling and routing system on the other.
The large table holds panel sizes of 650 mm x 530 mm
(26“ x 21“). The X60 is equipped with pneumatic
z-stroke and non-contact air bearing depth limiter.
The extended Z-axis range enables depaneling and milling
of deep trenches for rigid
and rigid-flex boards.
The ProtoMat® X60
is also ideal for
producing antistatic inspection
templates for
circuit boards.
Collet
1/8” collet
Drilling capacity
120 strokes/min
Positioning speed (max.)
50 mm/sec (1.97“/sec)
Depth adjustment
Non-contact air bearing
X/Y positioning system
stepper motors, precision ball screw assemblies
®
with internal ball recirculating system
Z drive
pneumatic, 14 mm (0.55“) movement
Machine table base
75mm (3“) cast aluminum
X/Y linear system
precision linear bushings and dual shafts
Dimensions (W/H/D)
750 mm x 420 mm x 900 mm (29.5“ x 16.5“ x 35.4“)
Weight
69 kg (151.8 lb)
Power supply
120/240V, 50 - 60 Hz/240VA
Compressed air supply
6 bar (87 psi), 100 l/min (3.528 cfm)
Options/accessories
LPKF ProtoMat®
Software package CircuitCAM LITE
–
Software package CircuitCAM PCB
•
Dust extraction unit
+
1 and 2-sided circuit boards
Dust extraction AutoSwitch
+
FR3, FR4, FR5, G10
Tooling starter kit (board material/tools etc.)
+
Flexible substrates
Measuring microscope
+
RF & microwave substrates
Mobile sound enclosure
–
Front panels/sign engraving
Head illumination
++
Machining cut outs in front panels
CircuitView camera system
+
Contour routing of circuit boards
Micrometer depth adjustment
+
Multilayer PCBs up to 4 layers*
3-phase motor, 10,000 to 100,000 rpm
+
Multilayer PCBs up to 8 layers*
3-phase motor, 10,000 to 60,000 rpm
•
Test adapter drilling
EC motor, 10,000 to 40,000 rpm
–
Milling film artworks
Pneumatic Z-stroke
•
SMD solder stencil cutting
Pneumatic non-contact air bearing
•
Rigid-flex circuit milling
Raising Z-axis by 30 mm (1.2”)
+
Applications
X60
20
23.04.2003
Depanelization and reworking of bare and
populated boards
•
standard equipment
Solder frames for circuit board assembly
+
optional (can be retrofitted)
Machining of enclosures
++ optional (needs to be factory mounted)
Suitable for application
–
recommended basic equipment
not available
* combined with MultiPress II and Contac III/MiniContac III
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
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Seite 21
LPKF ProtoLaser
LPKF ProtoLaser
LPKF ProtoLaser for Rapid PCB Prototyping
Product features
• 60 µm (2.4 mil) track with 40 µm (1.6 mil) gaps
• Capable of drilling and skiving Alumina and other ceramic
substrates
• Fine marking and engraving of components and front panels
• Extremely simple operation
• Powerful software with intuitive user interface
• Laser Safety Class 1
Ultra fine geometries with laser
To be able to prototype HDI circuitry the LPKF ProtoLaser combines
the best of both worlds. This circuit board plotter features a mechanical milling head with fully automatic tool change for milling,
drilling and routing as well as a laser beam to create circuit
geometries as small as 40 µm (1.6 mil) with 100 µm (4 mil) pitch.
The laser is also capable of drilling and skiving ceramic substrates.
This system is designed to meet the needs of engineers pushing the
envelope with top-level designs without compromising the
turnaround time for prototypes.
Laser cutting head
High-end versatility
HDI circuit structuring
The LPKF ProtoLaser uses a hybrid cutting head consisting of both
a mechanical tool and a laser beam that can be used alternatively.
The laser beam creates the critical fine structures, whereas the
mechanical milling bit removes larger copper areas, drills holes or
routes the board’s contour. A completely integrated software tool
management automatically handles all tool parameters as well as
the interaction between laser and mechanical machining. If particularly high specifications are demanded an optional cleaning process
can be applied subsequently.
Substrate cutting
Another application of the LPKF ProtoLaser is the cutting of various
substrates including aluminium oxide, silicon nitride, polycrystalline silica and others.
Subject to technical modifications. See imprint for details.
Micro coil
Laser-cut ceramics
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Seite 22
LPKF ProtoLaser
High-performance CAM software
The LPKF ProtoLaser uses the LPKF CircuitCAM/BoardMaster software package.
LPKF CircuitCAM imports the artwork (Gerber® Standard [RS-274-D], Gerber® Extended
[RS-274-X], DBF [Barco], Excellon® NC Drill [versions 1 and 2], Sieb & Meier NC Drill, DXF,
HP-GL™, ODB++), provides the extensive functionality of a CAM package, calculates the
cutting paths for the laser and the milling tools, and transfers the production data to the
ProtoLaser control software (LPKF BoardMaster). In addition to numerous control functions,
this also incorporates comprehensive tool management and a comfortable WYSIWYG user
interface which permanently informs about the current status of the production process.
Data preparation with CircuitCAM
60/40 µm (2.4/1.6 mil) ultra fine circuit
Micro coil 50 µm (2 mil)
Sensor
Circuit with 40 µm (1.6 mil) geometries
If you have any questions, or inquiries about your special applications, please contact our
LPKF application engineers at any time.
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
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Seite 23
LPKF ProtoLaser
Specifications: Laser
Part number
106821
Wavelength
1,064 nm
Output
70 W multi-mode system
Frequency
0 - 50 kHz (regulated by cutting speed)
Beam diameter
40 µm (1.6 mil)
Minimum track and gap
60 µm/40 µm (2.4 mil/1.6 mil)
Copper thickness
< 35 µm (1 oz.)
Specifications: milling/drilling head
Milling motor
3-phase motor, programmable 10,000 - 60,000 rpm
Tool change
Automatic, 23 positions
Collet
1/8“ pneumatic-release collet
Drilling capacity
120 strokes/min
Positioning speed (max.)
60 mm/sec (2.4“/sec)
Depth adjustment
Non-contact air bearing
Minimum track and gap
0.1 mm/0.1 mm (4 mil/4 mil))
Minimum hole diameter
0.2 mm (8 mil)
General specifications
Working area
420 x 380 mm (16.5“ x 15“)
for laser applications: 415 mm x 320 mm (16.3“ x 12.6“)
Resolution
5 µm (0.2 mil)
Repeatibility
0.005 mm (0.2 mil)
X/Y positioning system
stepper motors, precision ball screw assemblies with internal
ball recirculating system
Z drive
pneumatic, 14 mm / 0.55” movement
Dimensions (W/H/D)
Machine table unit
730 mm x 1,340 mm x 850 mm (28.7“ x 52.8“ x 33.5“) with housing
Laser control unit
570 mm x 1100 mm x 750 m (22.4“ x 43.3“ x 29.5“)
Unit separation
215 mm (8.5“)
Weight
Machine table unit
110 kg (242 lbs) (with cover)
Laser control unit
180 kg (396 lbs)
Power supply
Machine table unit
230 V, 50/60 Hz, 240 VA; 6 bar (87 psi) compressed air, min. 100 l/min (3.5 cfm)
Laser control unit
3-phase, 3 x 400 V, 50 Hz, 4 kVA, 10 bar (145 psi) comp. air, min. 120 l/min (4.2 cfm),
cooling water 10 l /min (0.35 cfm), 2 - 6 bar (29 - 87 psi), max. 20 °C (68 °F)
Applications
· HDI circuits
· Compatible with all common circuit substrates
· Engraving of components, front panels, etc.
· Machining and circuit structuring of ceramic substrates (max. thickness 635 µm [25 mil])
Subject to technical modifications. See imprint for details.
23
LPKF Produktkatalog GB
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Seite 24
Accessories/options
Accessories/options
The LPKF accessories/options are practical additions to the
machines and systems. A very high degree of functionality is
guaranteed by the perfect match between each component.
High quality materials and precise finishing ensures products
with long lifetime.
LPKF acoustic cabinets
The acoustic cabinets reduce noise and dust emissions to ensure comfortable
operations in electronic design labs or CAD offices. Storage shelves for tools and
basic materials, as well as a space for the integrated dust extraction, simplify
routine work. LPKF acoustic cabinets are optionally available for all circuit
board plotters but are supplied standard with the LPKF ProtoMat 95s/II and the
H100 for safety purposes due to the automatic tool change. The protective
cover is mobile to ensure easy travel to various locations.
Front and rear view of the cabinet with
optional accessories
Size cabinets
Small cabinet
Large cabinet
95s/II cabinet
Part number
101097
108731
Standard
Machine
C series
M series
95s/II, H100
W/H/D approx. (mm)*
650/1,320/700
730/1,320/950
730/1,320/850
Noise reduction
Approx. 8 dB
Approx. 8 dB
Approx. 8 dB
* Dimensions W/H/D (inch)
25.6“/52“/27.6“ 28.7“/52“/37.4“ 28.7“/52“/33.5“
Measuring microscope
The measuring microscope magnifies 50 times and has a metric scale for the
precise setting of insulation gap widths and quality control.
Part number 104475
Dust extraction
Milling and drilling dust must be removed from the machining head to ensure
the proper operation of the milling depth limiter. The dust extraction system
guarantees reliable removal of the dust generated by machining.
Technical data
Part number
109039
Vacuum pressure
Max. 20,000 Pascal
Air flow rate
40 l/sec (1.411 cfm)
Power consumption
800 W (230 V)
Filter surface
1,200 cm2 (47.2“2) (cotton wool)
Dim. W/H/D mm (inch)
300/360/400 (11.8/14.2/15.7)
Acoustic pressure
50 db(A)
Absolute filter
HEPA filter
Filter material
Glass fiber
Surface filter cartridge
4,300 cm2 (169.3 sq. in)
Filter efficiency
Particle size 0.5 - 0.9 µm (0.02 - 0.036 mil) 100 %
LPKF AutoSwitch
AutoSwitch is a useful addition to the dust extraction system. When fitted, the
dust extraction system is switched on and off automatically. This ensures safety,
increases the lifetime of the dust extraction system and reduces noise when the
machine is not running.
Part number 101473
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
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Seite 25
Accessories/options
Hot air oven
The hot air oven has an integrated timer and precise temperature controller,
creating optimal conditions for hardening paste plated-holes and for laminating
solder-resist films.
Technical data
Part number
102073
Feature
Timer, temperature controller
Power
1,800 W
External dim. W/H/D mm (inch)
580/290/350 (22.8/11.4/13.8)
Internal dim. W/H/D mm (inch)
440/210/290 (17.3/8.3/11.4)
Compressor
Some LPKF systems (e.g. ProtoMat® C100/HF, H100, 95s/II, MultiPress II, AutoContac) require compressed air. The compressors supplied by LPKF guarantee
clean, dry and reliable compressed air supplies.
Technical data
Compressor type
Small
Large
Part number
101092
104863
Tank size in liters
9
50
Max. pressure bar (psi)
8 (116)
10 (145)
Output l/min (cfm)
33 (1.1)
165 (5.8)
External dim. W/H/D mm (inch)
360/430/360 (14.2/16.9/14.2)
1,000/770/390 (39.4/30.3/15.4)
Weight kg (lb)
21 (46.2)
56 (123.2)
Acoustic noise level db(A)
33
67
AutoContac, MultiPress
C100/HF, 95s/II, X60, H100
At a distance of 4 m (LPA4)
For LPKF system
LPKF precision ring setter
The LPKF ring setter includes a tool ring press, adjusting unit, and a measuring
microscope. The precise adjustment of spacing rings allows different tools to be
used without readjusting the milling depth settings.
Available for
All LPKF ProtoMat®
LPKF ProtoMat® 95s/II, H100
Part number
110368
Standard
LPKF CircuitView
The LPKF CircuitView provides a camera option for the visual positioning of the
milling head. This system is particularly suitable for the reworking of circuit
boards, as well as the coding, and teach-in functions. CircuitView contains a
monochrome camera and a frame grabber card. This option is available for all
LPKF circuit board plotters.
Available for
LPKF ProtoMat® C & M series
LPKF ProtoMat® 95s/II, H100
Part number
106345
107168
LPKF StatusLight
LPKF acoustic cabinets for the LPKF circuit board plotters can also be
equipped with a multi-colored indicator light. The StatusLight, which is
visible from a long distance, indicates the operating status of the
machine.
Part number 111093
Subject to technical modifications. See imprint for details.
25
LPKF Produktkatalog GB
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Seite 26
Accessories/options
Optional accessories are typically factory mounted to the circuit board plotter and are standard on some
systems, however the user can retrofit some options.
Integrated head illumination
The high-performance LED ring surrounds the tool holding fixture and guarantees shadowfree illumination of the immediate machining area. This makes direct quality control of
drilling and milling faster and easier. The head illumination is available for all LPKF
ProtoMat® circuit board plotters.
· for mechanical depth limiter:
part number 109153 (retrofitting upon request)
· for non-contact air bearing depth limiter: part number 109154 (retrofitting upon request)
Micrometer screw
The micrometer screw is for the infinite adjustment of the milling depth when operating on
materials without a milling depth limiter. Available for all LPKF circuit board plotters this
device works off of a backstop to control milling depth.
Part number 109688
Pneumatic Z-stroke
The pneumatic Z-stroke makes it possible to machine thicker materials (up to a maximum
of 14 mm [0.55“]). It also gives a 15 mm (0.59“) z-movement (standard: 5 mm [0.2“]),
and can use tools with much smaller diameters thanks to the adjustable lowering pressure.
Part number is available upon request
LPKF ProtoMat ®
Option
C20
C40
C60
•
•
•
Standard
C100/HF
M30/s
M60
•
•
•
L60
95s/II*
H100*
X60
•
•
•
•
* without Z-extension
Non-contact air bearing depth limiter
The pneumatic depth limiter has an air cushion which makes it possible to machine
sensitive materials without coming into direct contact.
Part number is available upon request
LPKF ProtoMat ®
Option
C20
C40
C60
•
•
•
C100/HF
M30/s
M60
•
•
•
Standard
L60
95s/II
H100
X60
•
•
•
•
Increased Z-axis height (to max. 30 mm [1.18“])
Setting the Z-axis higher enables the surface machining of thicker material. The system is
also suitable for reworking assembled circuit boards. The stroke remains unchanged at
5 mm (0.2“) (15 mm [0.59“] in the case of pneumatic stroke). This option is available for
all LPKF circuit board plotters with the exception of LPKF ProtoMat® 95s/II, H100 and
ProtoLaser.
Part number is available upon request
100,000 rpm motor
This motor is capable of using very small endmills (0.15 mm [6 mil]) for RF / microwave
applications and drilling very small holes. The higher speed provides longer tool life and
also allows higher travel speeds.
Part number is available upon request
LPKF ProtoMat ®
Option
Standard
C20
C40
C60
•
•
•
C100/HF
•
M30/s
M60
L60
95s/II
•
•
•
•
H100
X60
•
•
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
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Seite 27
LPKF EasyContac
LPKF EasyContac
Manual system for through-hole plating
LPKF EasyContac delivers a simple and easy-to-operate
system for the through-hole plating of circuit board
holes. The minor effort involved and low costs are
the major benefits of this manual solution.
LPKF EasyContac is particularly suitable where twosided soldering is not possible, e.g. beneath
components. The set contains all of the necessary
tools and materials with the exception of a soldering
iron.
LPKF EasyContac was developed for prototype circuit boards and
PCB repairs with up to 50 through-plated holes per circuit board.
All the necessary parts are conveniently packed in a handy box so
that it can also be used by service engineers.
The key components of the LPKF EasyContac are through-hole
plating rivets made of a special copper alloy. These rivets are available with external diameters of 0.8 mm (32 mil), 1.0 mm (40 mil),
1.2 mm (48 mil) and 1.4 mm (56 mil). The internal diameter is
0.2 mm (8 mil) or 0.4 mm (16 mil) smaller than the desired
external diameter. They are manually placed in the hole and riveted
with a stamping tool. A component lead can still be fed through the
hole if necessary. The rivet is then simply soldered.
Technical data
Part number
110914
Max. base material size
No limit
Number of through-plated holes per circuit board
< 50
Number of layers
2
Material costs/through-hole plating
Approx Euro 0.35 (US$ 0.35)
Max. resistance
10 m Ω
Environmental compatibility
++
Through-plated holes/min
2-3
Process reliability
+
Base material types
Any substrate with 1.5 mm (59 mil) thickness
The set contains the following:
· 1 automatic punch tool with
stamp tip A for 0.6 (24 mil)
and 0.8 mm (32 mil) (inner
diameter) rivets
· 1 stamp tip B for 1.0 (40 mil)
and 1.2 mm (48 mil) (inner
diameter) rivets
· 1 pair of tweezers
· 1 anvil plate
· 1,000 rivets per size
Available through-hole plating rivets, approx. dimensions in mm (mil)
Part
Internal
External
Collar
number
diameter
diameter
diameter
Length
Hole diameter
110907
0.6 (24)
0.8 (32)
110758
0.8 (32)
1.0 (40)
1.3 (52)
2.2 (88)
0.9 (36)
1.6 (64)
2.2 (88)
110906
1.0 (40)
1.1 (44)
1.4 (56)
2.2 (88)
2.5 (100)
110759
1.2 (48)
1.5 (60)
1.6 (64)
2.6 (104)
2.6 (104)
1.7 (68)
Subject to technical modifications. See imprint for details.
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LPKF AutoContac
LPKF AutoContac
Conductive paste through-hole plating
with the LPKF circuit board plotter
Product features
• Conductive epoxy paste through-hole plating
• Easily integrated on any existing LPKF circuit board plotters
• Suitable for boards with up to 300 holes
• Option for the dispensing of various pastes (solder paste, adhesive,
conductive paste and sealants)
The patented LPKF AutoContac system is ideal for fast environmentally friendly in-house through-hole plating without chemicals.
A special conductive paste produces plated holes suitable for component insertion and soldering in double-sided circuit boards directly
using the LPKF circuit board plotter.
This simple and easy-to-learn technique, along with the minor
investment required, makes independent Rapid PCB Prototyping
practical for even the smallest enterprise.
Procedure
LPKF AutoContac is suitable for circuit boards with max. 300 holes
and hole diameters of 0.5 - 1.4 mm (20 - 55 mil).
A special conductive paste is automatically injected into the hole
by a dispenser mounted to the head of the LPKF circuit board
plotter. The second step involves the vacuum extraction of the
excess paste. The subsequent hardening in a hot-air oven creates a
permanent through-plated hole suitable for component assembly.
The complete through-hole plating process is precisely and
automatically controlled by the LPKF BoardMaster circuit board
plotting software. The parameters for a specific drill hole diameter
are stored in the tool library of the software.
This tried-and-tested technique combined with the individual
definition of dispenser parameters is also used for the application
of solder paste, adhesives, and sealants.
Dispenser
LPKF ProtoMat® C60
with LPKF AutoContac
1
Solder paste
Dispensing needle
Copper pad
Circuit board
Backing material
2
Cross section
Vacuum removal
3
Thermal curing
Specifications
Part number
101261
Max. base material size
Varies depending on the circuit board plotter
Hole diameter
0.5 mm - 1.4 mm (20 - 55 mil)
Number of through-plated holes
< 300
Number of layers
2
Through-plated hole:
Through-plated hole:
Through-plated hole:
Material costs/through-plated hole
Approx. 2 Cents
view from top
view from bottom
with soldered
Max. resistance
150 m Ω
component lead;
Environmental compatibility
++
view from top
Through-plated holes/min
15
Process reliability
+
Process duration
~ 45 min*
Base material types
FR4, RO® 3000, RO® 4000, TMM®
Power supply
Connected to LPKF circuit board plotter
Compressed air supply
6 bar (87 psi)
* Average value dependent on circuit board size
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
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Seite 29
LPKF Contac III, MiniContac III & MiniContac III/HF
LPKF Contac III, MiniContac III & MiniContac III/HF
In house professional quality through-hole plating
Product features
• No development work hold-ups
• No chemical expertise or analysis required
• Only four tanks
• No chemical pre-coppering
• Reverse pulse plating
8-layer circuit board
The LPKF through-hole plating systems were specially developed for
the professional production of prototype and small batch production
printed circuit boards to be used in combination with an LPKF
circuit board plotter. These systems enable production quality
boards to be produced independently without the need for outside
suppliers.
The through-plated holes comply with the highest specifications
and can be made quickly in house to avoid day long hold-ups in the
design process. This system is particularly suitable for complex
circuit boards with any number of holes.
The LPKF Contac III can be optionally equipped for tin plating.
Reverse Pulse Plating
To ensure that tomorrow’s demands are fully satisfied, the LPKF
MiniContac III and Contac III systems use reverse pulse plating
technology, providing uniform copper plating that allows plating of
more difficult aspect ratios and smaller holes. It avoids the “boneeffect” (thicker copper growth at hole entrance) that can clog up
small via holes entirely before they are completely plated.
This option is also very useful for small holes on high density
PCBs and improves production reliability during soldering.
Reverse pulse plating is achieved using control electronics that
monitors the whole through-hole plating process and removes
excess material by the precise setting of reverse pulses (anodic
polarisation of the workpiece).
LPKF Contac III
LPKF MiniContac III
Conventional through-
Reverse Pulse Plating
hole plating method
(bone effect)
Subject to technical modifications. See imprint for details.
6-layer circuit board
4-layer circuit board
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LPKF Contac III, MiniContac III & MiniContac III/HF
LPKF through-hole plating technologies
Standard technology: Carbon-based through-hole plating
(black hole method)
Special technology: Palladium-based through-hole plating,
especially for PTFE based
microwave substrates
We will be happy to provide you with a list of applicable base
materials upon request!
!
Methods for both technologies
Optimal through-hole plating requires a very high standard hole
quality. The through-hole plating process starts with the pre-treatment of the circuit boards in three tanks for approx. 30 minutes all
together. This process involves degreasing, pre-treatment and
activation. The circuit boards are then copper-coated in a galvanic
bath. This takes 60 - 90 minutes depending upon the specified
thickness of the copper coating.
The equipment is very environmentally friendly because it is a
closed system: all of the chemicals remain in the tank during use.
The only external connection required is a cold water supply for the
rinsing tank. One set of chemicals lasts approximately one year.
No technical expertise is required to operate or look after the tanks.
LPKF Contac III in use
Chemical tinning option
For the Contac III, LPKF offers the additional option of a heated
tank to provide chemical tin plating for optimal soldering of
through-hole plated circuit boards and oxidation protection.
Part number 108267
Tin-plated circuit boards
Specifications
LPKF Contac III
LPKF MiniContac III
LPKF MiniContac III/HF
Part number
111253
111252
111251
Activator
Carbon
Carbon
Palladium
Max. base material size
360 mm x 420 mm (14.2” x 16.5”)
220 mm x 340 mm (8.7” x 13.4”)
210 mm x 340 mm (8.3” x 13.4”)
Max. board size *
270 mm x 330 mm (10.6” x 13.0”)
130 mm x 250 mm (5.1” x 9.8”)
130 mm x 250 mm (5.1” x 9.8”)
LPKF ProtoMat® 95s/II: 254 mm x 305 mm ( 10.0” x 12.0”)
LPKF ProtoMat® 95s/II: 110 mm x 230 mm (4.3” x 9.1”)
LPKF ProtoMat® 95s/II: 110 mm x 230 mm (4.3” x 9.1”)
Hole diameter
≥ 0.2 mm (8 mil)
≥ 0.2 mm (8 mil)
≥ 0,2 mm (8 mil)
Number of plated holes
Unlimited
Unlimited
Unlimited
Max. number of layers
8
8
8
Max. resistance
< 10 m Ω
< 10 m Ω
< 10 m Ω
Environmental compatibility
Good
Good
Good
Processing reliability
Very good
Very good
Very good
Process duration
90 minutes
90 minutes
90 minutes
Base material types
FR4, RO 3000, RO 4000®, TMM **
FR4, RO 3000, RO 4000®, TMM **
Various special materials
Power supply
120***/240 V, 50 - 60 Hz, max. 2,000 VA
120/240 V, 50 - 60 Hz, 600 VA
120/240 V, 50 - 60 Hz, 600 VA
Ambient temperature
18 - 25 °C (64.4 - 77 °F)
18 - 25 °C (64.4 - 77 °F)
18 - 25 °C (64.4 - 77 °F)
Dimensions( W/H/D)
1,150 mm x 1,110 mm x 715 mm ( 45.3” x 43.7” x 28.1”)
870 mm x 640 mm x 570 mm ( 34.2” x 25.2” x 22.4”)
870 mm x 640 mm x 570 mm ( 34.2” x 25.2” x 22.4”)
Optional chemical tinning
Yes
No
No
* Smaller board size applicable if milled with air-foot circuit board plotter (C100/HF, 95s II, H100)
** Other materials upon request
*** upon request
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
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Seite 31
LPKF MultiPress II
LPKF MultiPress II
LPKF MultiPress II – time and cost saving in-house
production of prototype multilayer circuit boards.
Product features
• Up to eight layers
• Multilayer boards to 305 mm x 254 mm (12“ x 10“)
• Microprocessor controlled
• Small footprint
8-layer circuit board
The MultiPress II stores various time, temperature and pressure
profiles for processing different materials. Combined with an LPKF
circuit board plotter and an electroplating system, this equipment
is all that is required for complete in-house multilayer prototyping.
Specifications
Part number
106328
Max. press area (gross)
420 mm x 360 mm (16.5“ x 14.1“)
Max. circuit board size (recommended)
305 mm x 254 mm (12“ x 10“)
Max. pressure
150 kN (15 t)
Max. temperature
210 °C (410 °F)
Compressed air supply
Max. 10 bar, min. 6 bar (max. 145 psi, min. 87 psi)
Compressed air volume per minute
Approx. 30 l/min (1 cfm)
Max. number of layers
8
Pressing time
After pre-heating, approx. 90 min. plus
hardening time prior to drilling *
Dimensions (W/H/D)
530 mm x 600 mm x 480 mm (20.9“ x 23.6“ x 18.9“) **
Weight
Approx. 210 kg (463 lb)
Power supply
240 V/50 - 60 Hz, 2000 VA
Microprocessor controlled
4 pressure/temperature/time profiles
Base materials
FR4, others upon request
Options
Mobile stand
Part no. 107050
* depending upon Prepreg and selected through-hole plating process
** desk-top model
Subject to technical modifications. See imprint for details.
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Technology
Technology
Different LPKF technologies for the production of multilayers
Applications
· 4, 6 and 8-layer multilayer boards with a maximum net size of 305 mm x 254 mm (12“ x 10“)
· Laminating prototype solder mask (LPKF EasySolder)
1. Sequential build-up method for multilayer production
Example: 4-layer multilayer
1. Insulation engraving of both inner layers
(layer 2 & 3) of the circuit board with
the LPKF circuit board plotter.
2. Bonding of outer layers (layer 1 & 4)
with LPKF multilayer press.
3. Drilling multilayer through-holes with
the LPKF circuit board plotter.
4. Electroplating of the through-holes with
LPKF MiniContac III or Contact III
(connecting the inner layers).
5. 5. Insulation engraving of the outer
layers (layer 1 & 4) of the circuit board
6. Surface finish: mechanical cleaning,
tin plating, flux or conformal coating,
prototype solder mask (LPKF
EasySolder)
Subject to technical modifications. See imprint for details.
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Seite 33
Technologie
2. Registration pin method for multilayer production
Example: 8-layer multilayer
1. Creating layer 2 + layer 3
· Layer 3
· Drilling the registration pin holes
· Insulation milling
· Layer 2
· Insulation milling
2. Creating layer 4 + layer 5
· Layer 5
· Drilling the registration pin holes for the MultiPress II setting
pins
· Insulation milling
· Layer 4
· Insulation milling
5. Drilling and through-hole plating
· Drilling of the plated through-holes
· Electroplating with LPKF MiniContac III or Contac III
· Drilling of the non-plated holes
6. Creating layer 1 + layer 8
· Insulation milling
7. Contour
Routing the internal/external contours
8. Surface finish
Mechanical cleaning, tin plating, flux or conformal
coating, prototype solder mask (LPKF EasySolder)
3. Creating layer 6 + layer 7
· Layer 7
· Drilling the registration pin holes for the MultiPress II setting
pins
· Insulation milling
· Layer 6
· Insulation milling
4. Bonding material
According to the layer construction (see figure above), the layers are
pinned in the pressing package and bonded in the MultiPress II.
Registration pin locations
Subject to technical modifications. See imprint for details.
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LPKF EasySolder
LPKF EasySolder
Instant solder mask for prototype circuit boards
Fast, precise, flexible: mechanically made prototype solder masks
can be produced extremely quickly using LPKF EasySolder. The
solder mask is made out of high-quality, temperature-resistant and
dimensionally stable polyimide film. A solder mask increases soldering reliability and protects the circuit board from environmental
influences. This process requires no screen printing and no
photographic technology or chemical-etching.
System accessories for
applying the solder
mask
Part number 104425
Process description
LPKF CircuitCAM software uses the soldermask CAD data to create
the cutting paths for the circuit board plotter to mechanically
produce the solder mask. Structuring is done by cutting the pads
out of the polyamide material using the LPKF circuit board plotter.
The solder-resist mask is then bonded to the circuit board using a
pressing tool. The subsequent lamination process takes place in a
hot-air oven at a temperature of 180 °C (356 °F) and takes about
60 minutes. The bonding pressure is individually adjusted to the
size of the circuit board to ensure optimal results. LPKF EasySolder
masks are suitable for all standard soldering processes such as wave
and reflow soldering, as well as manual soldering. It is temperature
resistant to 288 °C (550 °F), compliant with IPC standards.
LPKF EasySolder is supplied complete with accessories and consumables. A hot air oven for laminating the solder mask on the
circuit board is also available from LPKF as an optional accessory.
Part number 102073
Hot air oven
Solder mask lamination with LPKF MultiPress II
The LPKF MultiPress II can also be used to laminate prototype
solder masks. The advantages are a shorter process time and the
ability to handle larger circuit boards. The complete laminating
process is fully automatic and press parameters are conveniently
pre-programmed.
LPKF MultiPress II
Part number 106328
Specifications
LPKF EasySolder
LPKF EasySolder withLPKF MultiPress II
Max. circuit board size
180 mm x 120 mm (7“ x 5“) net
300 mm x 250 mm (12“ x 10“) net
Pressure setup
Manual w/ torque wrench
Automatic, programmable
Laminating time
60 minutes plus pre-heating
60 minutes, automatic pre-heating
Cool off period
Approx. 60 - 90 min
A few minutes
Accessory set
LPKF EasySolder
LPKF EasySolder for LPKF MultiPress II
Part number
s. consumables
s. consumables
Solder mask film
210 mm x 297 mm (8.3“ x 11.7“), temp. resistant to 255 °C (491 °F) for 5 min. (IPC compliant),
adhesive: modified epoxy resin, 10 per pack (custom sizes available).
Tools and accessories
LPKF micro plotter (1/8“ shaft)
Metal scalpel, glue stick
and adhesive tape
Pressure compensation mat
Rubber, reusable up to 50 times
Press sheet (stainless steel)
210 mm x 160 mm (8.3“ x 6.3“)
210 mm x 297 mm (8.3“ x 11.7“)
Cut backing material
210 mm x 160 mm (8.3“ x 6.3“)
210 mm x 297 mm (8.3“ x 11.7“)
Press cushion
210 mm x 160 mm (8.3“ x 6.3“)
210 mm x 297 mm (8.3“ x 11.7“)
Subject to technical modifications. See imprint for details.
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Seite 35
Tools
Tools
Quality and precision – LPKF tools
LPKF’s development to satisfy the extreme precision and
performance requirements of current state of the art circuit boards
has produced a large range of high performance precision cutting
tools. These tools are custom designed for LPKF and made of 100 %
top quality carbide resulting in significantly longer tool life, precise
cuts, and diminished drill flux. The proprietary designs are accomplished with extensive testing and design reconfiguration until the
highest quality results are met. LPKF’s leading commitment is an
ongoing research and development process to continually suit the
user demands and approaching technologies.
For ease of use and to minimize the set-up time, LPKF tools
come in two different lengths: 36 mm (1.42“) for tools working on
the surface (milling bits and endmills) and 38 mm (1.5“) for tools
that work through the material (drill and router bits).
38 mm
(1.50“)
36 mm
(1.42“)
1
2
3
4
5
6
7
Microcutter (1)
A Surface machining tools
(l = 36 mm/1.42“)
A.1 Conical tools
Universal cutter (2)
A.2 Cylindrical tools
RF Endmill (3)
Tools (1/8“-Shaft)
Endmill (4)
B Penetrating tools
(l = 38 mm/1.5“)
Drills (5)
Contout router (6)
Endmill (long) (7)
Subject to technical modifications. See imprint for details.
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Tools
A - Engraving tools (36 mm [1.42“] length)
A.1 Conical Tools
1
Micro cutter
· For copper thickness up to 18 µm (1/2 oz.)
· Minimum insulation space: 100 µm (4 mil)
(min. 60,000 rpm required)
100 µm (4 mil)
Copper layer
Base material
2
Universal cutter
· For milling insulation on any type of base
material
· Minimum insulation space: 200 µm (8 mil)
200 µm (8 mil)
A.2 Cylindrical tools
3
Endmill (RF)
· For RF circuit outlines: 150 µm (6 mil),
250 µm (10 mil) or 400 µm (15.7 mil) diameter
(min. 60,000 rpm required)
· Minimal substrate removal
· Straight side walls
150 µm (6 mil)
4
Endmill
· For rub-outs and wide insulations
· Engraving of aluminum front panels
· 0.8 mm (31 mil), 1 mm (39 mil),
2 mm (79 mil), 3 mm (118 mil) diameter
0.8 - 3 mm (31 - 118 mil) Ø
insulations
0.8 - 3 mm (31 - 118 mil) Ø
engraving
Aluminum
Subject to technical modifications. See imprint for details.
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Seite 37
Tools
B - Drilling / routing tools (38 mm [1.5“] length)
5
6
Spiral drill
· To drill circuit boards and other materials
· 0.15 mm (6 mil) to 3 mm (118 mil)
· Diameters bigger than 2.4 mm (96 mil) are
automatically routed
· 2.95 mm (116 mil) and 3 mm (118 mil) to
drill registration pin holes
max. 2.4 mm (95 mil) Ø
min. 0.15 mm (6 mil) Ø
Contour router
· Routes inner and outer board contours
· Routes large holes without size limitation
· 1 mm (39 mil), 2 mm (79 mil), 3 mm (118 mil)
diameter
1 - 3 mm (39 - 118 mil)
Routing
7
Endmill (long)
· For cutting out aluminum front panels and to
mill clean contours in soft RF substrates
· Also to mill pockets in brass and aluminum
backed substrates and to mill enclosures
· 1 mm - 2 mm (39 mil - 79 mil) diameter
Subject to technical modifications. See imprint for details.
1 - 2 mm
(39 - 79 mil)
Ø
1 - 2 mm
(39 - 79 mil)
Ø
Aluminum
dielectric
material
37
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Seite 38
Consumables
Consumables
Start sets for LPKF circuit board plotters
For all LPKF circuit board plotters, LPKF has comprehensive start and accessory sets available with high-quality
tools and consumables to ensure the highest levels of quality and precision. All of these components can also
be ordered separately.
Product/accessory set
Accessory set for LPKF ProtoMat®
C20, C40
C60
M30/S, M40
M60, 95s/II, X60, H100
C100/HF
Part number
102368
102374
102375
102377
111249
Drill underlay material panel A41
10
10
5
5
10
5
5
Drill underlay material panel A32
FR4, A41, 1-sided, 35 µm (1 oz.)
10
10
5
5
10
FR4, A41, 2-sided, 35 µm (1 oz.)
10
5
5
2
5
3
5
5
FR4, A41, 2-sided, 18 µm (1/2 oz.)
FR4, A32, 1-sided, 35 µm (1 oz.)
FR4, A32, 2-sided, 35 µm (1 oz.)
Tool set 1/8“ shaft
1
Micro cutter 1/8“, l = 36 mm,
1
5
5
5
5
1
1
1
5
5
5
5
5
5
0.1 - 0.15 mm (4 - 6 mil)
Endmill (RF) 1/8“, l = 36 mm,
d = 0.25 mm (10 mil)
Adhesive tape
1
1
1
1
1
Circuit board cleaning pad
3
3
3
3
3
RF and microwave tool set
1
Rogers data sheet set
1
210 mm x 297 mm (8“ x 12“)
1
2
297 mm x 420 mm (12“ x 16“)
Tool set 1/8“ shaft
5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.6 mm (24 mil)
5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.7 mm (28 mil)
5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.8 mm (31.5 mil)
5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.9 mm (35.4 mil)
5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.0 mm (39 mil)
2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.1 mm (43.3 mil)
2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.3 mm (51.2 mil)
2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.5 mm (59 mil)
2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 3.0 mm (118 mil)
1 Contour Router 1/8“, l = 38 mm (1.5“), d = 1.0 mm (39 mil)
1 Contour Router 1/8“, l = 38 mm (1.5“), d = 2.0 mm (79 mil)
2 Endmill 1/8“, l = 36 mm (1.42“), d = 1.0 mm (39 mil)
1 Endmill 1/8“, l = 36 mm (1.42“), d = 2.0 mm (79 mil)
2 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.4 mm (15.7 mil)
10 Universal cutters 1/8“, l = 36 mm (1.42“), 0.2 - 0.5 mm (8 - 20 mil)
Part number 102375
Explanation
Every LPKF circuit board plotter has a registration set pin hole system to ensure
the precise positioning of double-sided base materials in particular. This location hole system consists of set pin holes (1) positioned exactly on the center
axis of the machine in permanent set pin hole strips (3).
A special adhesive tape (2) leaves no residue and is used to mount the base
material. It also ensures that warped objects are held down flat on the machines
tabletop. The PCB cleaning pad removes minor burrs and residues from the
mechanical milling process and gives the base material surface a great finish.
RF and microwave tool set
1 RO4003, 0.8 mm (32 mil) thick, 230 x 305 mm (9“ x 12“)
5 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.25 mm (10 mil)
3 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.4 mm (15.7 mil)
5 Endmills 1/8“, l = 36 mm (1.42“), d = 1.0 mm (39 mil)
2 Endmills 1/8“, l = 36 mm (1.42“), d = 2.0 mm (79 mil)
2 Endmills 1/8“, l = 38 mm (1.42“), d = 2.0 mm (79 mil)
3 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.15 mm (6 mil)
Part number 111535
3
1
2
1
2
3
Subject to technical modifications. See imprint for details.
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Seite 39
Consumables
Base materials
Circuit board specifications are becoming ever more complex: higher packaging densities, finer structures,
tighter spaces and smaller holes all require first-class base materials. This is the only way of guaranteeing
high-quality results to match the increasing demands for RF and microwave technology and multilayer
production.
Usual base material types for prototyping*
Name
FR2
FR3
FR4/FR5 (G10)
Flex
PTFE
Resin
Phenol resin
Epoxy resin
Epoxy resin
Polyimide resin
RT/duroid® etc.
Reinforcement
Paper
Paper
Glass fiber
None
Polytetrafluorethylene (PTFE)
Dielectric constant εR
4.70
4.90
4.70
4.2 - 4.6
2.2 - 10.2
•
•
LPKF standard article
* Other materials upon request, e.g. RO4000 (Non PTFE)
®
Copper layer
Resin
Reinforcement (glass fiber)
Copper layer
Base material
Nominal thickness of the base material
Example:
The nominal thickness is calculated as follows:
1.464 mm + 2 x 0.018 mm = 1.5 mm
57.63 mil + 2 x 0.71 mil = 59 mil
Example:
The nominal thickness is calculated as follows:
1.5 mm - 2 x 0.018 mm = 1.464 mm
59 mil - 2 x 0.71 mil = 57.63 mil
Copper layer
Fiberglass reinforced epoxy resin
(insulation layer)
Copper layer
Subject to technical modifications. See imprint for details.
Nominal thickness
For internal layers of multilayers
Nominal thickness = insulation layer
Nominal thickness
For single or double-sided circuit boards
Nominal thickness = copper layer + insulation layer
Copper layer
Fiberglass reinforced epoxy resin
(Insulation layer)
Copper layer
39
LPKF Produktkatalog GB
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Seite 40
Consumables
LPKF multilayer start set
The selection of the proper material is particularly crucial for
the production of multilayer circuit boards. The carefully
selected components in LPKF material sets include all the
necessary materials of tried-and-tested quality to ensure the
best results and smooth production of multilayer prototypes.
The following material sets are available depending on the number of layers to
be produced:
LPKF 4-layer multilayer set
Floating method for ten panels with 254 mm x 304 mm (10“ x 12“) net size
Part number 106836
Contents:
20 x single sided multilayer laminate, 5 µm (1/8 oz.) Cu. clad with protective
film, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5“ x 14.2“)
40 x Prepeg, size 380 mm x 320 mm (15“ x 12.6“)
20 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)
10 x double sided FR4 laminate, 35 µm (1 oz.) Cu clad, thickness 1 mm (39 mil),
size 420 mm x 360 mm (16.5“ x 14.2“)
4 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)
4-layer multilayer
LPKF 6-layer multilayer set
Floating method for ten panels for 254 mm x 304 mm (10“ x 12“) net size
Part number 108826
Contents:
20 x single sided multilayer laminate, 5 µm (1/8 oz.) Cu. clad with protective
film, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5“ x 14.2“)
20 x laminate multi-layer 18 µm (1/2 oz.) copper base, thickness 0.2 mm (8 mil),
size 420 mm x 360 mm (16.2“ x 14.5“)
80 x Prepreg, size 380 mm x 320 mm (15“ x 12.6“)
40 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)
10 x double sided FR4 laminate, 18 µm (1/2 oz.) Cu clad, thickness 0.46 mm (18.1 mil),
size 420 mm x 360 mm (16.5“ x 14.2“)
4 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)
6-layer multilayer
LPKF 8-layer multilayer set
Method with pinned layers* for ten panels with 254 mm x 304 mm (10“ x 12“)
net size
Part number 111250
Contents:
30 x double sided FR4 laminate, 18 µm (1/2 oz.) Cu clad, thickness 0.2 mm (8 mil),
size 420 mm x 360 mm (16.5“ x 14.2“)
20 x laminate multi-layer 5 µm (1/8 oz.) copper base, thickness 0.2 mm (8 mil),
size 420 mm x 360 mm (16.2“ x 14.5“)
60 x Prepreg, size 380 mm x 320 mm (15“ x 12.6“)
20 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)
6 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)
8-layer multilayer
* This requires the accessories for MultiPress II to produce multilayers with
pinned layers:
1 x pressing frame with positioning pins
2 x pressing sheet for 400 mm x 360 mm (15.7“ x 14“)
Part number 111493
Subject to technical modifications. See imprint for details.
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Consumables
Chemicals
LPKF has put together different chemical sets for use with
LPKF Contac III and MiniContac III through-hole plating
systems as well as for circuit board surface finish. The set
contains high-quality perfectly matched components specially
selected for each system to ensure the production of first class
through-hole plated contacts.
LPKF Contac III chemical set
For through-hole plating, complete set with approx. one year’s supply
Part number 106920
Contents:
4x
13
4x
10
1x
10
4x
10
1 x 0.5
liters
liters
liters
liters
liters
(3.435
(2.642
(2.642
(2.642
(0.132
gal.)
gal.)
gal.)
gal.)
gal.)
Cleaner 110
Cleaner 210
Activator 310
Copper Plater 400
Shine 400
Chemical set LPKF MiniContac III
For through-hole plating, complete set with approx. one year’s supply
Part number 108764
Contents:
4x
6
4x
5
1x
5
2x
5
2x
1
1 x 0.25
liters
liters
liters
liters
liters
liters
(1.585 gal.) Cleaner 110
(1.321 gal.) Cleaner 210
(1.321 gal.) Activator 310
(1.321 gal.) Copper Plater 400 and
(0.2642 gal.) Copper Plater 400
(0.066 gal.) Shine 400
Chemical set for LPKF MiniContac III/HF
For through-hole plating, complete set with approx. one year’s supply
Part number 108766
Contents:
4x
6 liters (1.585 gal.) Cleaner 110
4x
5 liters (1.321 gal.) Cleaner 210
1x
Activator 310
· 4,740 ml (1.2523 gal.) Catalyst A
· 265 ml ( 0.0697 gal.) Catalyst B
· 100 ml (0.0264 gal.) Replenisher
2x
5 liters (1.321 gal.) Copper Plater 400 and
2x
1 liters (0.2642 gal.) Copper Plater 400
1 x 0.25 liters (0.066 gal.) Shine 400
Tin plating for Contac III
Tin-plates prototype circuit boards. Protects against oxidation and provides
excellent solderability.
Part number 109131
• Filled in Contac III tin plating tank 13 liters (3.5 gal.)
• Good for over 500 boards 100 x 160 mm (4“ x 6“)
• Shipped in powder form 1,170 gr. (39 oz.), distilled water required for setup
Tin plated circuit board
Subject to technical modifications. See imprint for details.
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Consumables
Accessories for LPKF AutoContac and LPKF EasySolder
Accessories for LPKF AutoContac
For rapid and environmentally-friendly in-house through-hole plating without
chemicals, LPKF AutoContac is the ideal solution. The special conductive paste
is applied by the LPKF circuit board plotter to ensure optimal through-hole
plating.
LPKF AutoContac paste set
Two pre-filled cartridges with 25 gr. (0.83 oz.) paste, and one empty cartridge.
Part number 106280
Polypropylene refill fitting (luer)
To connect two cartridges with one another for mixing.
Part number 106281
Accessories for LPKF EasySolder
The following accessory sets are specially prepared for the LPKF EasySolder
method. These sets ensure the production of high-quality solder masks to
simplify the assembly of SMT components. Each set contains the right amount
of material to produce at least ten solder masks.
LPKF EasySolder accessory set for LPKF MiniPress (manual system)
Part number 107644
Contents:
10 x solder mask film 75 µm (3 mil)
10 x pressing cardboard cushion
4 x drill underlay material
2 x pressing sheets (stainless steel)
2 x press compensation mat
3 x micro cutter
1 x scalpel
1 x glue stick and adhesive tape
200
210
210
210
210
mm
mm
mm
mm
mm
x
x
x
x
x
300
297
297
160
297
mm
mm
mm
mm
mm
(7.87“
(8.27“
(8.27“
(8.27“
(8.27“
x 11.81“)
x 11.7“)
x 11.7“)
x 6.3“)
x 11.7“)
(7.87“
(8.27“
(8.27“
(8.27“
(8.27“
x 11.81“)
x 11.7“)
x 11.7“)
x 11.7“)
x 11.7“)
Accessory set for LPKF EasySolder for LPKF MultiPress II
Part number 106244
Contents:
10 x solder mask film 75 µm (3 mil)
10 x pressing cardboard cushion
4 x drill underlay material
2 x pressing sheet (stainless steel)
2 x press compensation mat
3 x micro cutter
1 x scalpel
1 x glue stick and adhesive tape
200
210
210
210
210
mm
mm
mm
mm
mm
x
x
x
x
x
300
297
297
297
297
mm
mm
mm
mm
mm
Subject to technical modifications. See imprint for details.
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LPKF ZelPrint
LPKF ZelPrint
LPKF provides two professional stencil printers for prototypes
and small batches. Both LPKF ZelPrint models have extremely
high levels of precision and efficiency: Manual or semi-automatic: the sophisticated technology guarantees easy operation
and perfect printing results.
LPKF ZelPrint LT300
Manual tabletop stencil printer
Product description
LPKF ZelPrint LT300 is a precision manual stencil printer. This tabletop model
can be utilized for both prototypes and small batches of fine pitch SMT boards.
Precise vertical separation between stencil and circuit board is guaranteed to
meet the specifications of contact printing. This unique solution allows printing
of 0.3 mm (12 mil) pitch (ultra-fine-pitch area).
High positioning accuracy, simple operation and the ability to use milled
polymer stencils (limited to 0.65 mm [26 mil] pitch) reduces costs and increases efficiency in the production of circuit board prototypes.
This printer is shipped with a ZelFlex quick-release stretching frame for
stencils but is also compatible with various other frames. The precise threedimensional adjustment of the stencil with micrometer screws (X, Y, theta and
clearance) is vital for superior printing results. The ZelPrint LT300 has freely
adjustable, high clearance PCB nesting pins that allow printing of boards that
are already populated on the other side.
Product features
• Manual stencil printer
• Parallel stencil separation
• Quick-release stencil frame included (ZelFlex ZR)
• Precision stencil adjustment with micrometer screws
• Compatible with various stencil frames
• Test print screen included
• Printing of two side populated boards
LPKF ZelPrint with test screen, rubber squeegee and metal stencil,
clamped into a ZelFlex ZR quick-release frame (can also be
used for polymer stencils).
LPKF ZelPrint PTC 350
Semi-automatic tabletop stencil printer
Product description
This semi-automatic fine-pitch SMD stencil printer is designed for prototype
circuit board production as well as for the production of small to medium
quantity batches.
The powered squeegee is speed and pressure controlled and guarantees
highly reproducible printing results. The fast and simple circuit board clamping,
and the automatically switched vacuum table, allows up to 100 printing cycles
per hour. Straightforward settings and simple operation of four operating modes
including single and dual pass printing and print-flood/flood-print cycles.
The printing process can be started automatically just by closing the printer, or
be initiated manually at the push of a button. The stencil/PCB alignment is
precisely done in X/Y/Z and theta and a test print screen overlay allows quick
setup.
Stencil frames are held in place with pneumatic latches and can be
exchanged quickly through slide rails. Smaller frames are held in frame
adapters. The PTC 350’s rigid construction ensures the highest level of precision
and efficiency.
Product features
• Semi-automatic stencil printer
• Printing of rigid and flex boards
• Vacuum table
• Precision stencil adjust with micrometer screws
• 4 printing modes
• Compatible with various stencil frames, including
quick release
• Test print screen included
LPKF ZelPrint PTC 350
Subject to technical modifications. See imprint for details.
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LPKF ZelPrint
Specifications
LPKF ZelPrint LT300
LPKF ZelPrint PTC350
Part number
107356
105393
Frame dimensions
width up to 430 mm (16.92“);
457 x 584mm (18“ x 23“),
length adjustable from 420 mm - 520 mm (16.54“ x 20.47“),
height adjustable from 30 - 33 mm (1.18“ - 1.29“)
height adjustable from 20 - 40 mm ( 0.78“ x 1.57“)
Maximum printing area
300 x 300 mm (11.8“ x 11.8“)
350 x 350 mm (13.8“ x 13.8“)
Squeegee action
manual
power sweep
Print table adjustment
X and Y ±10 mm (0.4“/400 mil); υ ± 5°
X and Y ±10 mm (0.4“/400 mil); υ ± 5°
Max. height of printing items
5 mm (0.2“), optionally more
20 mm (0.8“)
Squeegee speed
-
10 to 120 mm/s (0.38“ - 4.72“/s)
Squeegee pressure
-
adjustable 0 - 6 bar (0 - 87 psi) + downstop
Squeegee type
rubber
dual squeegee, rubber or metal*
Accuracy (machine)
± 0.025 mm (± 0.98 mil)
± 0.025 mm (± 0.98 mil)
Accuracy (printing)
± 0.04 mm (1.57 mil)
0.04 mm (1.57 mil)
Double side printing
max. height of components 15 mm (0.59“)
max. height of components 10 mm (0.39“)
Dimensions (W/H/D)
740 mm x 180 mm x 530 mm (29.1“ x 7.1“ x 20.9“)
600 mm x 380 mm x 800 mm ( 23.6“ x 14.9“ x 31.5“)
Height with optional stand
-
1200 mm (47.4“)
Weight
30 kg (66 lb)
80 kg (176 lb), with base 122 kg (268.4 lb)
Power
-
220V-240V/50 Hz or 100V-120V/60 Hz, 300 VA
Compressed air
-
6 bar, 10 l/min (87 psi, 0.3528 cfm)
Vacuum requirements
-
approx. 40 m3/h
Vacuum connection
-
40mm (1.6“) hose
Ambient conditions
Temperature: 5 - 35 °C (41 - 95 °F)
Temperature: 20 - 30 °C (68 - 86 °F)
Humidity: 30 - 95%
Humidity: 30 - 95%
*Option
Accessories
LPKF ZelPrint
LT300
PTC350
–
+
Vacuum pump, built-in floor-standing base
–
+
Vacuum pump (external)
–
+
Compressor
–
+
Dual rubber squeegee 250 mm (9.85“)
–
+
Dual metal squeegee 350 mm (13.77“)
–
•
Manual quick release frame ZR 457 x 580 mm (18“ x 23“);
–
+
Pneumatic quick release frame Z4P 457x584
–
•
Adapter for smaller frames
+
+
Test screen overlay
•
+
Squeegee height setting with two measuring gauges
–
+
Rubber blade for squeegee
+
+
Metal blade for squeegee
+
+
ZelFlex ZR 362 x 480 mm (14.25“ x 18.89“)
•
–
ZelFlex ZR 406 x 508 mm (16“ x 20“)
+
–
Rubber squeegee 260 mm (10.23“)
•
–
Rubber squeegee 150 mm (5.9“)
+
–
Rubber/metal squeegee – custom width
+
–
Floor-standing base for semiautomatic
stencil printer PTC350
Inner area 407 x 470 mm (16“ x 18.5“)
•
standard
+
optional
–
not available
recommended basic equipment
Subject to technical modifications. See imprint for details.
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Seite 45
LPKF ZelFlex
LPKF ZelFlex
LPKF ZelFlex – quick-release stencil frames
Available for virtually every stencil printer
LPKF offers two different quick-release stencil frame systems, one
with mechanical and the other with pneumatic stretching mechanism. For ease of use the ZelFlex Z4P maintains tension without air
being constantly connected to it. Both versions allow the stencil to
be directly mounted in the frame using a perforation system.
The simple perforation pattern is royalty free and shipped as a
Gerber® file with every frame.
Product features
• Available for virtually any stencil printer
• Fast and simple changeover of stencils
• Reduces storage space for archiving stencils
• Uniform tension over the whole surface
• ZelFlex Z4P maintains tension without air being connected
• Environmentally friendly: no adhesives, lacquers and cleaning
solvents required
1. LPKF ZelFlex ZR
Mechanically stretched two-sided quick-release stencil frame for
both metal and polymer stencils
2. LPKF ZelFlex Z4P
Professional quick-release stencil frame with pneumatic 4-side
action: Ideal for high volume environment. Frame maintains tension
after air is disconnected.
LPKF ZelFlex Z4P
LPKF ZelFlex ZR frame with metal and polymer stencil
Subject to technical modifications. See imprint for details.
LPKF ZelFlex Z4P with compressed air hose
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LPKF ZelFlex
Product description LPKF ZelFlex ZR
LPKF ZelFlex mechanical quick-release frames are manufactured from rigid,
high-quality aluminum profiles and enable the direct mounting of stencils in the
frames.
Equal tension of the stencil is achieved with patented tensioning regulators,
that protect the stencil from damage through over-tensioning. Smaller stencils
can also be fitted in these frames without any problems. The tension of the
stencil can be adjusted or changed even if the frame is already installed in the
printer.
LPKF ZelFlex ZR Specifications
LPKF ZelFlex ZR 362 x 480
LPKF ZelFlex ZR 406 x 508
LPKF ZelFlex ZR 457 x 584
Part number
101321
111244
101318
Outer dimensions (W/D)*
362 mm x 480 mm
406 mm x 508 mm
457 mm x 584 mm
(14.2“ x 18.9“)
(16“ x 20“)
(18“ x 23“)
312 mm x 370 mm
356 mm x 398 mm
407 mm x 474 mm
(12.28“ x 14.56“)
(14.01“ x 15.66“)
(16.02“ x 18.66“)
250 mm x 320 mm
300 mm x 350 mm
350 mm x 420 mm
(9.87“ x 12.59“)
(11.81“ x 13.77“)
(13.77“ x 16.53“)
Max. squeegee width
260 mm (10.23“)
300 mm (11.81“)
350 mm (13.77“)
Weight
2.8 kg (6.16 lb)
3.1 kg (6.82 lb)
3.5 kg (7.70 lb)
ZelPrint type
LPKF ZelPrint LT300
LPKF ZelPrint LT300
LPKF ZelPrint PTC350
Max. inner dimensions (W/D) **
Max. printing area (W/D)***
* External dimensions without tension screws
** Rear clamping bar can be moved to reduce stencil length
*** Depending on the position of rear bar and stencil size
Product description LPKF ZelFlex Z4P
4-sided quick-release stencil frame is a flexible, cost and space saving alternative for professional stencil print operations.
The patented stencil perforation pattern guarantees simple, fast and repeatable stencil changeover. The stretching mechanism uses compressed air to
create a uniform tension over the whole working area. Once charged, the frame
maintains the tension and can be used for more than 24 hours without being
re-connected to an air supply. This feature allows simplified operation and easy
integration into the printer.
LPKF ZelFlex Z4P Specifications
Part number
105802
External dimensions (W/H/D)
457 mm x 33 mm x 584 mm (18“ x 1.30“ x 22“)
Max. inner dimensions (W/D)
357 mm x 484 mm (14“ x 19.05“)
Max. printing area (W/D)
337 mm x 464 mm (13.26“ x 18.26“)
Max. squeegee width
340 mm (13.38“)
Compressed air supply
Dependant on the stencil thickness
Max. 6 bar (87 psi) (6 x 10 Pa) for stencils > 150 µm (6 mil)
Max. 4 bar (58 psi) (6 x 10 Pa) for stencils 100 - 150 µm (4 - 6 mil)
Air refill
Every 48 hours min.
Height of frame
33 mm (1.29“) without adapters
Weight
5 to 10 kg (11 - 22 lb)
Ambient conditions
Temperature: 5 - 35 °C (41 - 95 °F)
Humidity: 30 - 95 %
!
IMPORTANT NOTE
All LPKF ZelFlex frames are produced in many different dimensions and with different
adapters to fit most available screen printers. A Gerber® file of the royalty-free perforation
pattern is supplied with every frame.
Subject to technical modifications. See imprint for details.
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LPKF ZelPlace & BGA Placer
LPKF ZelPlace & BGA Placer
LPKF ZelPlace 110, 220, 330, 340
Manual Pick and Place systems for prototype circuit
boards and small batches
General product description
LPKF ZelPlace is a manual Pick & Place system for professional
SMD assembly of prototype PCBs and small production batches.
The basic unit of all LPKF ZelPlace machines is a multi-function
dispenser for applying various media, and a vacuum pick-up nozzle
to place the components.
All LPKF ZelPlace models are based on the same platform.
Upgrading to a more sophisticated system is possible at any time.
Each ZelPlace system comes with a multifunctional dispenser unit
that features both manual and automatic dispensing mode.
Product features
• Fine-pitch assembly
• Vacuum pick-up nozzle and precision manipulator
• Modular system design
• Dispenser
• Various feeders
• Upgradable at any time
LPKF ZelPlace 110
The LPKF ZelPlace 110 system is the ideal solution for the
assembly of SMD components (surface mounted devices) with a
pitch between 1 mm (39 mil) and 1.27 mm (50 mil), such as SOIC,
SOT, PLCC and passive components 1206 and 0805.
The components are picked with a vacuum pick-up nozzle and
placed on the PCB with the help of a guided hand support. Feeders
and turntables can be mounted to LPKF ZelPlace 110 on three
sides. The multi-function LPKF ZelDisp dispenser for solder paste
or adhesives is part of the Pick & Place system.
LPKF ZelPlace 110 with component turntable
LPKF ZelPlace 220
LPKF ZelPlace 220 has a guided manipulator head and integrated
illumination. This allows precise and vibration-free placement of a
component in the desired position. When placing the component
the vacuum is controlled by the LPKF ZelDisp multifunction dispenser unit and turned on and off automatically. In addition to
classic areas of application, this system is capable of dispensing
adhesives and solder paste. Turntables (for bulk components) and
feeders can be conveniently placed on all three sides.
LPKF ZelPlace 220 enables the assembly of digital SMDs with a
large number and high density of leads. Components such as SSOP
with 0.65 mm (26 mil) pitch, TSOP with 0.5 mm (20 mil) pitch,
QFP with 0.65 mm (26 mil) pitch and 160 leads, or 0402 passive
components, can be precisely placed with this system.
Subject to technical modifications. See imprint for details.
LPKF ZelPlace 220 with component turntable, tape and stick feeder
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LPKF ZelPlace & BGA Placer
LPKF ZelPlace 330/340
LPKF ZelPlace 330 and 340 are the most advanced LPKF ZelPlace
systems. Both systems allow the placing of fine-pitch components
such as QFP with 0.5 mm ( 20 mil) and 0.4 mm (16 mil) pitch with
up to 300 pins, as well as 0402 components. The edge centring of
BGA components up to 1.27 mm (50 mil) pitch is also no problem
for LPKF ZelPlace 330/340.
The X-Y-guided manipulator can be locked in x and y direction
with fine adjustment using micrometer screws. This allows high
levels of placement accuracy for SMD components. The vacuum of
the pick-up nozzle is automatically turned on and off when placing
the component.
A swiveling micro camera can be mounted directly on the
manipulator to ease placement of large components. Other options
include a stereo microscope with or without a CCD camera, and a
monitor, so ZelPlace 330 or 340 can also be used as an inspection
unit.
A turntable for bulk components and a range of different feeders
can be placed ergonomically on all three sides (ZelPlace 330).
LPKF ZelPlace 340 contains an additional reworking station for
selective soldering of SMD components. In this case, the feeders
can be placed on the left side with the turntable sitting in the back.
Instead of a feeder rail a second turntable can be placed on the left
side of the system.
LPKF ZelPlace 330 with component turntable, feeder carrier and
feeder
LPKF ZelPlace 330/340 with optional stereo microscope and CCD camera
Subject to technical modifications. See imprint for details.
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Seite 49
LPKF ZelPlace & BGA Placer
LPKF ZelPlace BGA
Semi-automatic placement of new generation components to assemble highly integrated circuit boards.
LPKF ZelPlace BGA with monitor
BGA component
Product description
The placing of components with pins hidden from the top and sides
requires reliable and precise alignment to avoid expensive and
difficult rework.
LPKF ZelPlace BGA Placer is designed for the accurate placing
of different types of BGA, CSP and flip chip components, as well as
fine-pitch and ultra-fine-pitch components. The system is suitable
for R&D labs as well as production facilities focusing on custom
designs and small batches.
Special optics and adjustable two-colour illumination help to
simultaneously view and align the PCB leads and the component
pins. Coarse and fine adjustment is achieved using an air-bearing
table with micrometer screw adjustment.
As soon as the component is aligned, it is automatically placed
at a single push of a button.
Product features
• Semi-automatic placement of BGA and QFQ components from
5 mm x 5 mm (0.2“ x 0.2“) up to 45 mm x 45 mm (1.77“ x 1.77“)
• Granite base plate
• Air-bearing positioning table
• Optical placement verification
Specifications LPKF ZelPlace BGA
Max. PCB size
220 mm x 300 mm (8.6“ x 11.8“)
Max. size of components
45 mm x 45 mm (1.8“ x 1.8“)
Placing components
Min. size of components
5 mm x 5 mm (0.2“ x 0.2“)
with CCD camera and
Pitch
0.3 mm (12 mil)
monitor
Placement accuracy
± 50 µm (± 2 mil)
Power supply
230 V/50 Hz oder 115 V/60 Hz, 20 VA
Compressed air
6 bar (87 psi), min. 5 l/min (0.18 cfm), oil-free
Dimensions (W/H/D)
600 mm x 430 mm x 435 mm
(23.6“ x 17“ x 17.1“)
Weight
Subject to technical modifications. See imprint for details.
35 kg (77 lb)
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LPKF ZelPlace & BGA Placer
Specifications
Entry level
Professional system
High-end system
High-end / repair system
LPKF ZelPlace
LPKF ZelPlace 110
LPKF ZelPlace 220
LPKF ZelPlace 330
LPKF ZelPlace 340
Part number
106839
107953
106840
106842
Max. PCB size
370 x 290 mm
370 mm x 340 mm
370 mm x 340 mm
370 mm x 340 mm
(14.56“ x 11.42“)
(14.56“ x 13.39“)
(14.56“ x 13.39“)
(14.56“ x 13.39“)
220 x 300 mm
370 mm x 300 mm
370 mm x 300 mm
370 mm x 300 mm
(8.66“ x 11.81“)
(14.56“ x 11.81“)
(14.56“ x 11.81“)
(14.56“ x 11.81“)
Operating air pressure
0.1 - 2.5 bar (1.45 - 36.25 psi)
0.1 - 2.5 bar (1.45 - 36.25 psi)
0.1 - 2.5 bar (1.45 - 36.25 psi)
0.1 - 2.5 bar (1.45 - 36.25 psi)
Vacuum
0 - 0.8 bar (0 - 11.6 psi)
0 - 0.8 bar (0 - 11.6 psi)
0- 0.8 bar (0 - 11.6 psi)
0 - 0.8 bar (0 - 11.6 psi)
Pulse/Pause ratio
0.1 - 2s / 0.1 - 5s
0.1 - 2s / 0.1 - 5s
0.1 - 2s / 0.1 - 5s
0.1 - 2s / 0.1 - 5s
Number of dispensing points
up to 300 /min
up to 300/min
up to 300/min
up to 300/min
Dispensing quantity
minimum 0.2 mm3
minimum 0.2 mm3
minimum 0.2 mm3
minimum 0.2 mm3
Turntable location
left/right/back
left/right/back
left/right/back
left/back
Feeder location
left/right
left/right
left/right
left
Power supply
120V or 230V, 50/60Hz. 7VA
120V or 230V, 50/60Hz. 7VA
120V or 230V, 50/60Hz. 7VA
230V, 50/60Hz, 780VA
Air supply
6 bar (87 psi), 10 l/min (0.35 cfm)*
6 bar (87 psi), 10 l/min (0.35 cfm)*
6 bar (87 psi), 10 l/min (0.35 cfm)*
6 bar (87 psi), 10 l/min (0.53 cfm)*
Max. device dimensions
1,000 mm x 500 mm x 900 mm
1,000 mm x 500 mm x 900 mm
1,000 mm x 500 mm x 900 mm
1,000 mm x 500 mm x 900 mm
(W/H/D)
(40“ x 20“ x 35“)
(40“ x 20“ x 35“)
(40“ x 20“ x 35“)
(40“ x 20“ x 35“)
Weight
15 - 40 kg (33 - 88 lb)
15 - 40 kg (33 - 88 lb)
15 - 40 kg (33 - 88 lb)
15 - 40 kg (33 - 88 lb)
Ambient conditions
Temperature: 5 - 35 °C (41 - 95 °F)
Temperature: 5 - 35 °C (41 - 95 °F)
Temperature: 5 - 35 °C (41 - 95 °F)
Temperature: 5 - 35 °C (41 - 95 °F)
Humidity: 30 - 95%
Humidity: 30 - 95%
Humidity: 30 - 95%
Humidity: 30 - 95%
Max. placement area
* clean, dry, oil-free
LPKF ZelPlace accessories
Part number
ZelDisp dispenser
LPKF
LPKF
LPKF
ZelPlace 110
ZelPlace 220
ZelPlace 330
LPKF
ZelPlace 340
•
•
•
•
Bridge-guided unit for stereo-microscope and CCD camera
104766
–
+
+
+
Zoom stereo-microscope unit SM143
104767
–
+
+
+
CCD Camera
109190
–
+
+
+
Color monitor 14“
105614
–
+
+
+
Ball socket turntable 150 mm ( 5.90“)
105615
–
+
+
+
Turntable set with 45 antistatic component bins
101339
+
+
+
+
Turntable set with 90 antistatic component bins
101344
+
+
+
+
Feeder-carrier
101377
+
+
+
+
Tape feeder 8 mm (0.31“)
101352
+
+
+
+
Tape feeder 12 mm (0.47“)
101351
+
+
+
+
Tape feeder 16 mm (0.63“)
101350
+
+
+
+
Stick feeder SO8 - SO28, SO8L - SO28L
101356
+
+
+
+
Stick feeder PLCC28 - PLCC44
101357
+
+
+
+
Stick feeder PLCC52 - PLCC84
103897
+
+
+
+
Monochrome micro camera (swiveling)
106055
–
+
+
+
Upgrade kit for LPKF ZelPlace 110 to 220
Upon request
+
–
–
–
Upgrade kit for LPKF ZelPlace 110 to 330
Upon request
+
–
–
–
Upgrade kit for LPKF ZelPlace 220 to 330
Upon request
–
+
–
–
Upgrade kit for LPKF ZelPlace 330 to 340
Upon request
–
–
+
–
Set of consumables K1
•
–
–
–
Set of consumables K2
–
•
•
•
Stand for 2 cartridges*
+
+
+
+
Vacuum gripping device*
+
–
–
–
Vacuum switch*
+
–
–
–
Foot switch with 2 m (6 ft.) cable
+
+
+
+
Set of 10 dispensing and vacuum needles*
+
+
+
+
* items are included in set K1 delivered with LPKF ZelPlace
•
standard equipment
+
accessories
–
not available
optimal configuration
!
IMPORTANT NOTE
LPKF ZelPlace 110, 220 and 330 can
be upgraded to LPKF ZelPlace system
340.
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
23.04.2003
12:33 Uhr
Seite 51
LPKF ZelPlace & BGA Placer
Accessories for LPKF ZelPlace 110, 220, 330 and 340
Tape and stick feeder
Up to 13 feeders can be mounted on the feeder carrier for fast changeover of
components. They can be conveniently mounted on both sides of the system.
Feeder carrier with feeders
Turntable for bulk components
The turntable with either 45 or 90 ESD safe components bins can be located
on both sides of the system as well as in the back.
ESD safe turntable for bulk components
LPKF ZelDisp
Each LPKF ZelPlace comes with a ZelDisp dispenser unit. This multi-function
dispenser with an integrated non-drop function is also designed for the
dispensing of low viscosity fluids like adhesives. The dispensing pressure, time
and repetition rate between the pulses can be set as required. The dispensing
cycle is started by activating the foot switch (LPKF ZelPlace 110) or pressing
down the manipulator head (all other LPKF ZelPlace versions). The Pick & Place
vacuum is also generated and controlled by the LPKF ZelDisp unit.
Consumables set K1
This set contains the following parts: foot switch with 2 m (6 ft.) cable, vacuum
pick-up nozzle with vacuum valve, silicon hoses, cartridge adapter 10 ccm
(4 inch2), two 10 ccm cartridges with caps and pistons and plungers, set of ten
dispensing and vacuum needles, two vacuum caps, stand for two cartridges.
LPKF consumables set K2
One cartridge adapter 5 ccm, two 5 ccm cartridges with caps and pistons and
plungers, set of ten dispensing and vacuum needles, two vacuum caps.
Subject to technical modifications. See imprint for details.
LPKF ZelDisp
51
LPKF Produktkatalog GB
52
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Seite 52
LPKF ZelPlace & BGA Placer
Overview of typical SMD components and recommended assembly configurations
Entry level
Professional system
High-end systems
LPKF ZelPlace 110
LPKF ZelPlace 220
LPKF ZelPlace 330 & 340
LPKF ZelPlace BGA
Passive components in Inch / mm
1206 (3216)
0805 (2012)
0603 (1608)
0402 (1005)
0201 (0603)
IC packages
SOT23
SOT323
SC90-TR
SOIC 1.27 mm (0.05“)
PLCC 1.27 mm (0.05“)
SSOP 0.65 mm (0.025“) - 64 leads
TSOP 0.5 mm (0.019“) - 48 leads
QFP 0.8 mm (0.031“) - 120 leads
QFP 0.65 mm (0.025“) - 100 leads
QFP 0.65 mm (0.025“) - 160 leads
QFP 0.5 mm (0.019“) - 208 leads
QFP 0.4 mm (0.015“) - 256 leads
LQFP 0.3 mm (0.011“) - 168 leads
BGA 1.5/1.27 mm (0.06“/0.05“)
Edge Centring
BGA 1 mm (0.039“)
Edge Centring
µBGA® 0.75 mm (0.029“)
µBGA® 0.5 mm (0.019“)
Compatible
Limited compatibility (requires skilled user or is time consuming)
additional tools may be required
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
23.04.2003
12:33 Uhr
Seite 53
LPKF ZelFlow
LPKF ZelFlow
LPKF ZelFlow RO4, RO4/N2 Reflow Ovens
Product description
The LPKF ZelFlow RO4 combined hot-air/quartz reflow oven is the
ideal tool for rapid SMD prototyping and small batch production.
Compact and versatile, the oven has a large working area and
micro-processor controlled temperature-time profiles. It is capable
of SMD Reflow soldering, curing of adhesives and conductive
pastes, and other thermal treatments.
The process temperature and time can be easily programmed by
the user. All parameters such as pre-heating/reflow temperatures
and times can be saved as user profiles for later use.
It is also suitable for longer treatments such as temperature
stabilisation of electronic components for up to 24 hours. The start
and end of all processes is indicated visually and acoustically. The
timers can be set to display count-up or count-down to the end of
the process. The circuit boards are automatically cooled at the end
of the process.
Its dual access design features both drawer and a clamshell
opening with safety interlocks. The ZelFlow RO4/N2 features
optional nitrogen inerting.
LPKF RO4/N2 closed
LPKF ZelFlow RO4/N2 open
Specifications
LPKF ZelFlow RO4
LPKF ZelFlow RO4/N2
Part number
106006
109568
Maximum circuit board size
280 mm x 350 mm
(11.02“ x 13.77“)
Preheating temperature/time
50 - 230 °C (122 - 446 °F), 1 - 1800 s
Reflow temperature/time
75 - 270 °C (167 - 518 °F), 0 - 600 s
Long thermal treatments temperature/time
50 - 220 °C (122 - 428 °F), 1 - 1440 min
Temperature stabilisation time
5 min
Cooling
variable speed fans, processor controlled
Power connection
220 - 230 V/50 - 60 Hz single phase
Power consumption max.
3,500 VA
Nitrogen gas consumption (N2 model only)
0.28 m3/h (10 SCFH)*
Dimensions (W/H/D)
500 mm x 370 mm x 450 mm
(19.7“ x 14.6“ x 17.7“)
Weight
24 kg (52.8 lb)
Ambient conditions
Temperature: 20 - 30 °C (68 - 86 °F)
Humidity: 30 - 95 %
* Standard Cubic Feet per Hour
No special accessories available.
Subject to technical modifications. See imprint for details.
Product features
• Forced air (convection) and IR (quartz lamp)
• Microprocessor controlled
• Large working area
• Automatic cooling
• Programmable time/temperature profiles
• Simplified user interface
• N2 inerting option available (ZelFlow RO4/N2)
The LPKF ZelFlow RO4 working area is specially designed to match
the specifications for LPKF AutoContac and LPKF EasySolder.
53
LPKF Produktkatalog GB
54
23.04.2003
12:33 Uhr
Seite 54
Other LPKF products
Other LPKF products
Description
Application
LPKF system
Laser systems for the production of
metal and polymer stencils for solderpaste printing.
Polymer stencil
Metal stencil
LPKF StencilLaser SL 600 Polymer
LPKF StencilLaser SL 800
Laser system for drilling micro-vias,
direct circuit board structuring, skiving
and contour cutting of flex and rigid
circuit boards.
Microvia
Cutting
LPKF MicroLine Drill 600
Structuring
Rigid-flex circuit board
Laser system for the production of 3D
molded interconnect devices (MIDs).
High-density circuit structures are
created directly on three-dimensional
plastic components.
(Laser based 3D-MID technology,
additive/subtractive)
Production steps
LPKF MicroLine 3D
Assembled MID
Subject to technical modifications. See imprint for details.
LPKF Produktkatalog GB
23.04.2003
12:34 Uhr
Seite 55
Other LPKF products
Description
Application
Laser system for the high-resolution
structuring of thin metal and polymer
films using a mask projection.
Available for panels and reel-to-reel.
LPKF system
50 µm lines and spaces
created by laser
structuring
Etching resist structuring
(ATOTECH) for ultrafine
circuit boards.
High-precision sensors
e.g. for temperature
measurement.
Photos courtesy of Philips
LPKF MicroLine Laser
Sensor and sensor
elements made out of
flexible substrates, e.g.
for medical technology.
Laser system for micro-machining
metallic, organic and ceramic
materials.
Cutting, drilling and engraving
ceramics
LPKF MultifunctionLaser
MF 100 UV
Interior glass structuring
Services
LPKF Laser Center, North America
Telephone +1-503-454-4200
LPKF Laser Center, Germany
Telephone +49-5131-7095-0
3D-MID Application Center, Germany
Telephone +49-5222-944930
Subject to technical modifications. See imprint for details.
55
LPKF Produktkatalog GB
56
23.04.2003
12:34 Uhr
Seite 56
Imprint
Imprint
This catalogue was prepared with enormous attention to details. LPKF reserves the right to
change specifications and other product information without notice.
Price lists
The price lists in the catalogue or attached to the catalogue are not part of the catalogue.
All of the prices contained in the list apply ex works, excluding packaging and local taxes.
All prices are subject to changes. Only the latest price list is valid. We will be happy to
provide you with an individual quotation containing detailed specifications based on the
latest price list.
General terms and conditions
We also draw your attention to our general terms and conditions and terms of delivery and
payment which apply to all transactions and which we will be glad to send you upon request
together with the requested quotation. Special agreements must be made in writing.
Privacy protection
All of the personal data provided by customers are only saved for our own commercial
purposes and in compliance with local privacy protection law.
Trademarks & patents
© 2003 LPKF Laser & Electronics AG, Garbsen, Germany. Systems and products offered by
LPKF and its subsidiaries are covered by issued and pending German and foreign patents.
Products mentioned are for identification purposes only and may be trademarks or
registered trademarks of their respective companies. “LPKF”, the LPKF logo and “LPKF
ProtoMat” are registered trademarks of LPKF Laser & Electronics AG.
Product catalogue number 111271
Publisher
LPKF Laser & Electronics AG
Osteriede 7
30827 Garbsen
Telephone +49 (0) 51 31/70 95-0
Fax
+49 (0) 51 31/70 95-90
e-mail
[email protected]
web info www.lpkf.de
Concept, design and layout
AD HOME
Hauptstraße 17
30855 Langenhagen
Telephone +49 (0)5 11/2 15 67-44
Fax
+49 (0)5 11/2 15 67-45
e-mail
[email protected]
LPKF Produktkatalog GB
23.04.2003
12:34 Uhr
Seite 57
Information order form
PLEASE DETACH AT PERFORATION AND FAX BACK TO YOUR DISTRIBUTOR
LPKF information order form
LPKF has far more products and services available than are listed in this
catalogue. To ensure you get the best solution for your area of application, we
will be very happy to send you detailed information on other LPKF products.
Fax-No.
Germany
China
France
Japan
Slovenia
Spain
UK/Ireland
North America
+49-5131-7095-90
+86-22-23006965
+33-1-60869622
+81-3-34676159
+386-4-2013820
+34-91-8475522
+44-1344-860547
+1-503-682-7151
Company
Telephone
Contact
Fax
Department,
Building,
Mail Stop
e-mail
Address
City, State
Country
Please select from the following options for Rapid PCB Prototyping:
Personal consultation
Demo CD
Sample Board
Information on other product categories
LPKF MicroLine Laser
· Sensor technology
· Chip interposers
· Flexible circuits
· Micro-structuring of thin layers
(< 1 µm)
LPKF MicroLine 3D
· 3D-MIDs (additive/subtractive)
· Material processing
· Glass interior structuring
LPKF MultifunctionLaser UV
· Ceramic cutting
· Ceramic drilling
· Ceramic engraving
· Glass interior structuring
See imprint LPKF product catalogue for details.
LPKF HybridLaser
· Structuring
LPKF MicroLine Drill 600
· Structuring
· Micro-via drilling
· Cutting
· Solder-resist ablation
LPKF StencilLaser
· SMD metal stencils
· SMD polymer stencils
LPKF MultifunctionLaser IR
· Circuit board structuring
· Cutting very thin sheets
· Trimming resistances
LPKF stencil service
· SMD solder stencils
· Micro-cutting service
· Quick-release frames
· Precision shaped parts
· Gobos
57
LPKF Produktkatalog GB
58
23.04.2003
12:34 Uhr
Seite 58
LPKF Produktkatalog GB
23.04.2003
12:34 Uhr
Seite 59
Technical questionnaire
PLEASE DETACH AT PERFORATION, COPY AND FAX BACK TO YOUR DISTRIBUTOR
Technical questionnaire:
Solutions for your specific requirements
Please fill out the following questionnaire to help us better provide you with
accurate information to meet your needs. Your business is very important to us!
Fax-No.
Germany
China
France
Japan
Slovenia
Spain
UK/Ireland
North America
+49-5131-7095-90
+86-22-23006965
+33-1-60869622
+81-3-34676159
+386-4-2013820
+34-91-8475522
+44-1344-860547
+1-503-682-7151
Company
Telephone
Contact
Fax
Department,
Building,
Mail Stop
e-mail
Address
City, State
Country
Area of Application
Digital
Analog
RF/Microwave
Base material
FR3
FR4
Polyimide (rigid)
Ceramic substrate
RF substrates
Polyimide (flexible)
Others:
Max. board size
less than 200 x 340 mm (8“x13“)
bigger than 200 x 340 mm (8“x13“)
Circuit board technology
Single-layer
Multilayer
Flex
Rigid-flex
Multilayer
Double-layer
Number of layers (min - max)
Interior layer thickness (min - max)
Power Supplies
Blind Vias
Yes
No
Buried Vias
Yes
No
Separation between interior layers (min - max)
Through-hole plating
No
Yes
· Max. holes per circuit board
Approx. 50
≤ 300
> 300
· Min. hole diameter
mm/mil
PLEASE TURN OVER
See imprint LPKF product catalogue for details.
59
LPKF Produktkatalog GB
60
23.04.2003
12:34 Uhr
Seite 60
Technical questionnaire
Circuit board properties
Circuit board (min - max)
mm/inch
Cu clad
µm/oz.
Track widths (min)
µm/mil (
< 200 µm [8 mil])
Gaps (min)
µm/mil (
< 200 µm [8 mil])
Remaining ring of the pad (min)
µm/mil (
< 200 µm [8 mil])
Circuit geometries
Prototype circuit board assembly
Manual assembly
Semi-automatic
Automatic
Others
Conventional
SMD
Mixed assembly
Soldering methods for prototype
production
Manual soldering
Convection
Do you produce front panels?
No
Wave soldering
Vapor phase
Reflow soldering
Yes
Aluminum
Engraving
Milling
max. thickness
Fully automatic tool change
required?
PCB Layout Software
Export file formats
No
Plastic
Engraving
Milling
mm/inch
max. thickness
mm/inch
Yes
Name
Gerber® Standard (RS-274-D)
Gerber® Extended (RS-274-X)
Excellon NC Drill
Version
Sieb & Meyer NC Drill
DXF
HP-GL™
Others:
Development projects per year
No. of designs per project
No. of boards per design
How do you currently produce
prototypes?
In-house
External, by service companies
Etching
Etching
Milling
Milling
Wirewrap
(wiring technique)
Are you happy with the situation?
Yes
No
Why?
See imprint LPKF product catalogue for details.
LPKF Produktkatalog Umschlag GB
23.04.2003
12:48 Uhr
Seite 2
Index
Index
4-layer multilayer
6-layer multilayer
8-layer multilayer
Accessories
Aluminum
Applications
AutoContac
Automatic tool change
AutoSwitch
Base materials
BGA Placer
BoardMaster
Brass
Build-up method (sequential)
CAD (please use also EDA)
CAM Station
Chemical sets
Circuit board plotter
CircuitCAM
Compressed air
Compressor
Conductive paste
Consumables
Contac
Contact printing
Contour generator
Convection oven
Custom drill bits
Custom tools
Customer service line
Data conversion
Data export
Data formats
Data import
Depanelization
Dispensing
Distribution network
Double sided printing
Drill bit
Drill data
Drilling machine
Dust extraction
EasyContac
EasySolder
Editing capabilities
Endmill
Engraving
Fine-pitch printing
Flex boards
Flexible circuits
Flex-rigid boards
Foil engraving
Front panels
Fully automatic
Galvanic
Gerber
Head lighting
Housing
Installation
Insulation process
Laser
31, 32, 33, 40
31, 32, 33, 40
31, 32, 33, 40
24, 42
8, 14, 16, 20
6, 14, 16, 18, 20, 21
6, 28
18
24
39
47
12
7
32
10
11
41
13
10
25
25
6, 28
38
29
43
10, 11
25
37
35
13
10
10
10
10, 11
9
6, 8, 28
61
43
35
10
14
24
6, 27
34, 42
10
36
8, 9
43
8
8
8, 20
9
8
18
6, 29
10 ff
26
8
18
11
21, 54
Layout
Measurement microscope
Micro cutter
Micrometer screw
Microwave circuits
Microwave layout
Microwave prototype
Milling bit
MiniContac
Multilayer boards
MultiPress
Paste
PCB drilling
PCB milling
PCB post processing
PCB prototype
Plastic / composite
Plastic engraving
Pneumatic Z-axis
Post processing of:
· populated boards
· bare boards
Printing
Program wizard
ProtoLaser
ProtoMat®
ProtoMat® 95s/II
ProtoMat® C100/HF
ProtoMat® C20
ProtoMat® C40
ProtoMat® C60
ProtoMat® H100
ProtoMat® L60
ProtoMat® M30s
ProtoMat® M60
ProtoMat® X60
Prototypes
Quality features
Quick release collet
Quick release frame
Reflow oven
Registration pin method
Reverse pulse plating
RF circuits
RF layouts
RF prototypes
RF-Endmill
Rivets
Routing
SatusLight
Screen-printing
Service
Set pin system
Sign engraving
SMD assembly
SMD fine pitch printing
SMD metal stencils
SMD polymer stencils
SMD solder paste stencils
Software upgrade
Solder mask
10
24
36
26
7, 14
11
11, 14
35
29, 41
7, 31, 32, 33, 39, 40
31, 42
42
9
7
9
6
8
8
13, 14, 26
9, 20
9, 20
43 ff
10
21
14
18
7, 14
14
14
14
18
16
16
16
20
6
13
13, 14
45
53
33
7, 29
7, 14
11
7, 14
36, 38
6, 27
7, 20
25
43
13
13, 38
7
47
43
54
54, 9
54
10, 11
7, 28
Solder paste printing
Sound enclosur
Special applications
Spindle
Starter packs
Stencil printer
Stencil printing
Tech support
Test adapter
Through hole plating
Tinning
Tool library
Tool management
Tool ring set
Tools
Training
Training
Universal cutter
Vacuum table (H100)
Working depth limiter
WYSIWYG
ZelFlex
ZelFlow
ZelPlace
ZelPrint
43
24
8
26
38
13
43
13
9
6, 27 ff
30, 41
12
12
25
35, 38
14
13,18
36
18
26
12
45
53
47
43
61
LPKF Produktkatalog Umschlag GB
28.04.2003
10:56 Uhr
Seite 1
LPKF RAPID PCB PROTOTYPING PRODUCT CATALOG 02/03
LPKF distribution network
LPKF Headquarters
LPKF Distribution and
production facilities
LPKF Distributors
RAPID PCB PROTOTYPING
Slowenien
LPKF Laser & Elektronika d.o.o.
Planina 3
4000 Kranj
SLOVENIA
Phone +386-4-2013800
Fax
+386-4-2013820
e-mail
[email protected]
web info www.lpkf.si
UK/Ireland
LPKF Laser & Electronics Ltd.
Coppid Beech Lane, Wokingham
Berkshire-RG40 1PD
GREAT BRITAIN
Phone +44-1344-455046
Fax
+44-1344-860547
e-mail [email protected]
web info www.lpkf.co.uk
China
LPKF Tianjin Co., Ltd.
No. 1 Building, Xing Nan Cun,
Ke Yan Xi Road, Nan Kai District,
Tianjin, 300192
PEOPLE'S REPUBLIC OF CHINA
Phone +86-22-23005700
Fax
+86-22-23006965
e-mail [email protected]
Frankreich
LPKF France S.A.R.L.
Z.A. de l’Églantier
21 Rue des Cerisiers
(C.E. 1514 Lisses)
91015 Evry Cedex
FRANCE
Phone +33-1-60862691
Fax
+33-1-60869622
e-mail [email protected]
Spain
LPKF Laser & Electronics
Spain, S.L.
Apartado Nr. 1
28791 Soto del Real (Madrid)
Madrid/SPAIN
Phone +34-91-8475505
Fax
+34-91-8475522
e-mail [email protected]
web info www.lpkfspain.com
North America
LPKF Laser & Electronics
28220 SW Boberg Rd.
P.O. Box 3858
Wilsonville, OR 97070
USA
Phone +1-503-454-4200
Fax
+1-503-682-7151
e-mail [email protected]
web info www.lpkfusa.com
Japan
LPKF Japan Co., Ltd.
Yoyogi 5-8-5-304
Shibuya-ku
Tokyo 151000
JAPAN
Phone +81-3-34657105
Fax
+81-3-34676159
e-mail
[email protected]
web info www.lpkf.co.jp
www.lpkf.com
Your LPKF-Distributor
PRODUCT CATALOG 02/03
AD HOME
Germany (Headquarters)
LPKF Laser & Electronics AG
Osteriede 7
30827 Garbsen
GERMANY
Phone +49-5131-7095-0
Fax
+49-5131-7095-90
e-mail
[email protected]
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