FEATURES GENERAL DESCRIPTION 4.72 mm × 3.76 mm × 1.0 mm surface-mount package High SNR of 62 dBA Sensitivity of −42 dBV Flat frequency response from 100 Hz to 15 kHz Low current consumption of <250 μA Single-ended analog output High PSRR of 70 dB Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant The ADMP401 is a high quality, high performance, low power, analog output, bottom-ported omnidirectional MEMS microphone. The ADMP401 consists of a MEMS microphone element, an impedance converter, and an output amplifier. The ADMP401 sensitivity specification makes it an excellent choice for both near field and far field applications. The ADMP401 has a high SNR and flat wideband frequency response, resulting in natural sound with high intelligibility. Low current consumption enables long battery life for portable applications. A built-in particle filter provides for high reliability. The ADMP401 complies with the TIA-920 standard, Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones. APPLICATIONS Smartphones and feature phones Teleconferencing systems Digital video cameras Bluetooth headsets Video phones Tablets The ADMP401 is available in a thin, 4.72 mm × 3.76 mm × 1.0 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP401 is halide free. FUNCTIONAL BLOCK DIAGRAM OUTPUT AMPLIFIER POWER VDD GND 07712-001 ADMP401 OUTPUT Figure 1. www.BDTIC.com/ADI TABLE OF CONTENTS Features .............................................................................................. 1 Applications Information .................................................................8 Applications ....................................................................................... 1 Connecting the ADMP401 to a Codec ......................................8 General Description ......................................................................... 1 Connecting the ADMP401 to an Op Amp Gain Stage ............8 Functional Block Diagram .............................................................. 1 Handling Instructions .......................................................................9 Revision History ............................................................................... 2 Pick-and-Place Equipment ..........................................................9 Specifications..................................................................................... 3 Reflow Solder .................................................................................9 Absolute Maximum Ratings............................................................ 4 Board Wash ....................................................................................9 ESD Caution .................................................................................. 4 Reliability Specifications ................................................................ 10 Pin Configuration and Function Descriptions ............................. 5 Outline Dimensions ....................................................................... 11 Printed Circuit Board (PCB) Land Pattern Layout ...................... 6 Ordering Guide .......................................................................... 11 Typical Performance Characteristics ............................................. 7 REVISION HISTORY 12/11—Rev. C to Rev. D Updated Outline Dimensions ....................................................... 11 Changes to Figure 12 ...................................................................... 11 Added Figure 13.............................................................................. 11 Change to Ordering Guide ............................................................ 11 8/11—Rev. B to Rev. C Changes to Figure 1 .......................................................................... 1 Changes to Table 3 ............................................................................ 4 Removed Terminal Side Down from Figure 3 .............................. 5 Changes to Bullet 2 in Pick-and-Place Equipment Section ........ 9 Changes to Ordering Guide .......................................................... 11 12/10—Rev. A to Rev. B Changes to Applications and General Description Sections ...... 1 Changes to Table 1 ............................................................................ 3 8/10—Rev. 0 to Rev. A Changes to Frequency Response Parameter, Table 1 ................... 3 Changes to Supply Voltage Parameter, Table 2 ............................. 4 Changes to Applications Information Section, Figure 9, and Figure 10 ............................................................................................ 8 Updated Outline Dimensions ....................................................... 11 4/10—Revision 0: Initial Version www.BDTIC.com/ADI SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Dynamic Range Frequency Response 1 Symbol Total Harmonic Distortion Power Supply Rejection Ratio Maximum Acoustic Input POWER SUPPLY Supply Voltage Supply Current OUTPUT CHARACTERISTICS Output Impedance Output DC Offset Output Current Limit THD PSRR 1 Test Conditions/Comments Min 1 kHz, 94 dB SPL −45 SNR EIN VDD IS Derived from EIN and maximum acoustic input Low frequency, −3 dB point High frequency, −3 dB point Deviation limits from flat response within pass band 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V Peak Typ Omni −42 62 32 88 100 15 −3/+2 Max Unit −39 dBV dBA dBA SPL dB Hz kHz dB % dB dB SPL 3 70 120 1.5 ZOUT See Figure 6 and Figure 7. www.BDTIC.com/ADI 3.3 250 200 0.8 90 V µA Ω V µA ABSOLUTE MAXIMUM RATINGS ESD CAUTION Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range Rating −0.3 V to +3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +70°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CRITICAL ZONE TL TO TP tP TP tL TSMAX TSMIN tS RAMP-DOWN PREHEAT 07712-002 TEMPERATURE RAMP-UP TL t25°C TO PEAK TIME Figure 2. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C (t25°C) to Peak Temperature Sn-Pb 1.25°C/sec max Pb Free 1.25°C/sec max 100°C 150°C 60 to 75 sec 1.25°C/sec 45 to 75 sec 183°C 215°C +3°C/−3°C 20 to 30 sec 3°C/sec max 5 min max 100°C 200°C 60 to 75 sec 1.25°C/sec ~50 sec 217°C 245°C +0°C/−5°C 20 to 30 sec 3°C/sec max 5 min max www.BDTIC.com/ADI PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTPUT GND 2 1 GND 3 GND 6 VDD 4 5 BOTTOM VIEW Not to Scale 07712-003 GND Figure 3. Pin Configuration (Bottom View) Table 4. Pin Function Descriptions Pin No. 1 2 3 4 5 6 Mnemonic OUTPUT GND GND GND VDD GND Description Analog Output Signal Ground Ground Ground Power Supply Ground www.BDTIC.com/ADI PRINTED CIRCUIT BOARD (PCB) LAND PATTERN LAYOUT The recommended PCB land pattern for the ADMP401 should have a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 4. Care should be taken to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 5. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. 2.62 ø0.90 (3×) ø1.10 ø1.68 2.54 2.40 1.20 1.27 07712-004 ø0.70 (2×) 0.79 Figure 4. PCB Land Pattern Layout (Dimensions Shown in mm) 1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×) 0.649mm DIA. (2×) 0.85mm DIA. (3×) 2.4mm 2.54mm 1.2mm 2.62mm 3.41mm 07712-005 1.27mm Figure 5. Suggested Solder Paste Stencil Pattern Layout www.BDTIC.com/ADI TYPICAL PERFORMANCE CHARACTERISTICS 10 0 8 –10 6 –20 2 PSRR (dB) SENSITIVITY (dB) 4 0 –2 –30 –40 –50 –4 –60 –6 100 1k 10k FREQUENCY (Hz) 07712-006 –10 Figure 6. Frequency Response Mask –80 100 1k Figure 8. Typical Power Supply Rejection Ratio vs. Frequency 10 (dB) 0 1k FREQUENCY (Hz) 10k 07712-007 –10 –20 100 10k FREQUENCY (Hz) Figure 7. Typical Frequency Response (Measured) www.BDTIC.com/ADI 07712-008 –70 –8 APPLICATIONS INFORMATION CONNECTING THE ADMP401 TO A CODEC CONNECTING THE ADMP401 TO AN OP AMP GAIN STAGE GAIN = (R1 + R2)/R1 0.1µF R1 VDD ADMP401 R2 VREF 1µF MINIMUM OP177 10kΩ GND VREF MICBIAS 0.1µF ADMP401 OUTPUT Figure 10. ADMP401 Connected to the OP177 Op Amp ADAU1761 VDD OR 2.2µF MINIMUM ADAU1361 LINN GND 07712-009 LINP CM VO OUTPUT 07712-010 The ADMP401 output can be connected to a dedicated codec microphone input (see Figure 9) or to a high input impedance gain stage (see Figure 10). A 0.1 µF ceramic capacitor placed close to the ADMP401 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A dc-blocking capacitor is required at the output of the microphone. Figure 9. ADMP401 Connected to the Analog Devices ADAU1761 or ADAU1361 Codec www.BDTIC.com/ADI HANDLING INSTRUCTIONS PICK-AND-PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Care should be taken to avoid damage to the MEMS microphone structure as follows: For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste that is used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 3. • • • • • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Use care during pick-and-place to ensure that no high shock events above 10 kg are experienced because such events may cause damage to the microphone. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Blow-off procedures and ultrasonic cleaning must not be used. www.BDTIC.com/ADI RELIABILITY SPECIFICATIONS The microphone sensitivity after stress must deviate by no more than ±3 dB from the initial value. Table 5. Stress Test Low Temperature Operating Life High Temperature Operating Life THB Temperature Cycle High Temperature Storage Low Temperature Storage Component CDM ESD Component HBM ESD Component MM ESD Description −40°C, 500 hours, powered +125°C, 500 hours, powered +65°C/85% relative humidity, 500 hours, powered −40°C/+125°C, one cycle per hour, 100 cycles +150°C, 500 hours −40°C, 500 hours All pins, 0.5 kV All pins, 1.5 kV All pins, 0.2 kV www.BDTIC.com/ADI OUTLINE DIMENSIONS 4.82 4.72 4.62 3.30 REF REFERENCE CORNER 4.10 REF PIN 1 3.86 3.76 3.66 2.40 BSC 3.14 REF 1 2 1.68 DIA. 3 1.10 DIA. 6 4 5 0.68 REF 2.54 BSC 1.27 BSC 0.25 DIA. (THRU HOLE) 1.20 BSC TOP VIEW 1.10 1.00 0.90 0.79 BSC 2.62 BSC 0.90 DIA. (PINS 1, 5, 6) 0.61 REF 0.70 DIA. (PINS 2, 4) BOTTOM VIEW SIDE VIEW 12-12-2011-C 0.73 REF 0.24 REF Figure 11. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 4.72 mm × 3.76 mm Body (CE-6-1) Dimensions shown in millimeters DIRECTION OF FEED 07712-011 PIN 1 Figure 12. Microphone Orientation in Tape Until Date Code 1213 DIRECTION OF FEED 07712-012 PIN 1 Figure 13. Microphone Orientation in Tape Starting with Date Code 1213 ORDERING GUIDE Model1 ADMP401ACEZ-RL ADMP401ACEZ-RL7 EVAL-ADMP401Z EVAL-ADMP401Z-FLEX 1 2 Temperature Range −40°C to +70°C −40°C to +70°C Package Description 6-Terminal LGA_CAV, 13” Tape and Reel 6-Terminal LGA_CAV, 7” Tape and Reel Evaluation Board Evaluation Board Package Option2 CE-6-1 CE-6-1 Z = RoHS Compliant Part. The CE-6-1 package option is halide free. www.BDTIC.com/ADI Ordering Quantity 4,500 1,000 NOTES ©2010–2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07712-0-12/11(D) www.BDTIC.com/ADI