ECE 230B: Winter 2003 Solid-State Electronic Devices Professor Yuan Taur Electrical & Computer Engineering University of California, San Diego 1/8/2003 Yuan Taur 1 ECE 230B: Winter 2003 Solid-State Electronic Devices Prerequist: ECE 135A, B, or equivalent and ECE 230A Instructor: Yuan Taur Office: EBU1-4807 Phone: 534-3816 taur@ece.ucsd.edu Office hour: Open This course covers the physics of solid-state electronic devices, including p-n junctions, MOS devices, field-effect transistors, bipolar transistors, etc. Principles of CMOS and bipolar scaling to nanometer dimensions and their high frequency performance in digital and analog circuits will be taught. 1/8/2003 2 Topics to be Covered 1) Band diagram, Fermi level, Poisson’s eq., Carrier transport (1.5 wks) 2) P-n junction (1 wk) 3) MOS device (1 wk) 4) MOSFETs (1.5 wks) 5) CMOS scaling and design (1.5 wks) 6) CMOS performance factors (1 wk) 7) Bipolar transistors (1.5 wks) 8) SiGe bipolar device (1 wk) Textbook: “Fundamentals of Modern VLSI Devices” Y. Taur and T. H. Ning, Cambridge Univ. Press (1998) 1/8/2003 3 Homework and Grading Policy • • • 1/8/2003 Five open book quizzes (bring your calculator) Five homework assignments Equal proportion of credits among above 4 Electron Energy Levels and Bands Discrete electron energy levels in an atom: Broadening into electron energy bands in a solid: There are forbidden energy gaps between allowed electron energy bands. 1/8/2003 5 The Origin of Energy Gap in a Crystalline Solid 1/8/2003 6 The Origin of Energy Gap in a Crystalline Solid (From Kittel) 1/8/2003 7 Crystalline Lattice 1/8/2003 8 Energy Band Structures 1/8/2003 9 Metals, Insulators, and Semiconductors Insulators: Eg > 4-5 eV Semiconductors: Eg < 4-5 eV 1/8/2003 10 Metals, Insulators, and Semiconductors (From Muller and Kamins) 1/8/2003 11 Energy Band Diagram of Silicon Hole energy Conduction band Ec Eg E i Ev Valence band Electron energy Eg = 1.12 eV Free electron (− ) kT/q = 0.026 V @ 300 K Free hole (+) 1/8/2003 12 Fermi-Dirac Statistical Distribution f ( E) = 1/8/2003 1 1+ e ( E − E f )/ kT 13 Intrinsic Silicon E E E E Conduction band n Ec Eg E f Ev p Valence band 1/2 Free electron (−) Free hole (+) N(E) N (E) = ∞ 1/8/2003 f (E) 8πg 2 m x m y m z n = ∫ N ( E ) f ( E )dE Ec 1 n and p E − Ec (Appendix C) h3 p = ∫ N ( E )[1 − f ( E )]dE Ev −∞ 14 Fermi Level in Intrinsic Silicon 1 Fermi-Dirac distribution: f ( E) = For (E - Ef)/kT >> 1, f ( E) ≈ e For (E - Ef)/kT << -1, f ( E) ≈ 1 − e 1+ e ( E− E f )/ kT − ( E − E f )/ kT − ( E f − E )/ kT Carrying out the integrations, n = Nc e − ( Ec − E f )/ kT p = Nv e Nc, Nv: Effective density of states, N c = 1/8/2003 2 g mx m y mz h3 ( 2πkT ) 3 / 2 Ec + Ev kT Nc Ei = E f = − ln 2 2 Nv Intrinsic silicon: charge neutrality requires n = p = ni, − ( E f − Ev )/ kT ni = N c N v e − ( E c − E v )/ 2 kT = NcNv e − E g / 2 kT 15 Physical Properties Si SiO2 Atomic/molecular weight 28.09 60.08 Atoms or molecules/cm3 5.0×1022 2.3×1022 Density (g/cm3) 2.33 2.27 Crystal structure Diamond Amorphous Lattice constant (Å) 5.43 --- Energy gap (eV) 1.12 8-9 Dielectric constant 11.7 3.9 1.4×1010 --- Electron: 1430 --- Hole: 470 --- Conduction band Nc: 3.2×1019 --- Valence band Nv: 1.8×1019 --- Breakdown field (V/cm) 3×105 >107 Melting point (°C) 1415 1600-1700 Thermal conductivity (W/cm-°C) 1.5 0.014 Specific heat (J/g-°C) 0.7 1.0 Thermal diffusivity (cm2/s) 0.9 0.006 Thermal expansion coefficient (°C−1) 2.5×10−6 Intrinsic carrier concentration (cm−3) Carrier mobility (cm2/V-s) Effective density of states (cm−3) 1/8/2003 0.5×10−6 16 Extrinsic (n-type and p-type) Silicon Si Si Si Si Si Si Si Si Si P+ Si Si B− Si −q Si Si Si Si +q Si Si Si Si Si Si Si Si (a) (b) (c) Intrinsic n-type p-type 1/8/2003 Si 17 Band Diagrams of n-type and p-type Silicon Conduction band Conduction band Ec E d E f Ei Eg Ec E i E f E Ev a Eg Ev Valence band Free electron (−) (a) n-type 1/8/2003 Valence band Free hole (+) (b) p-type 18 Fermi Level in Extrinsic Silicon n = Nc e − ( Ec − E f )/ kT p = Nv e − ( E f − Ev )/ kT For n-type silicon with donor concentration Nd, charge neutrality requires n = p + Nd+ ≈ Nd (assuming complete ionization). Therefore, Nc Ec − E f = kT ln Nd Or, in terms of ni and Ei, Nd E f − Ei = kT ln ni For Nd > Nc, Ef > Ec Æ degenerate n+ silicon. Need full F-D eq. Note that np = ni2, independent of Ef (n- or p-type). 1/8/2003 19 Fermi Level vs. Temperature 1/8/2003 20 Fermi Level in Extrinsic Silicon If incomplete ionization, Nd+ < Nd where 1 N d = N d [1 − f ( E d )] = N d 1 − ( E d − E f )/ kT 1 + (1 / 2 ) e Ef is then solved from + Nce − ( E c − E f ) / kT = Nd 1 + 2e − ( E d − E f ) / kT + Nv e − ( E f − E v ) / kT Æ Condition for complete ionization: N d ( E c − E d ) / kT << 1 e Nc Requires the donor energy level to be within a few kT of the bottom of the conduction band. 1/8/2003 21 Donor and Acceptor Levels in Silicon 1/8/2003 22 Dopant Solubility in Silicon 1/8/2003 23 Carrier Concentration vs. Temperature 1/8/2003 24 Carrier Transport: Drift v d = − qEτ / m 1/8/2003 * 25 Mobility vd = µE Mobility (cm2/V-s) 1,400 T = 300 K Electrons 1,200 40 30 1,000 800 600 20 Holes 400 10 Diffusion coefficient (cm2/s) 1,600 200 0 1E+14 1E+15 1E+16 1E+17 1E+18 1E+19 0 1E+20 Doping concentration (cm-3) 1 1/8/2003 µ = 1 µL + 1 µI +L 26 Resistivity of Silicon J n,drift = qnvd = qnµ n E ρn = 1/8/2003 1 qnµ n 27 Velocity Saturation Carrier velocity (cm/s) 1E+7 1E+6 E 1E+5 1E+2 n ro t lec s H es l o T=300 K 1E+3 1E+4 1E+5 Electric field (V/cm) vsat ≈ 107 cm/s 1/8/2003 28 Electron concentration, n Carrier Transport: Diffusion dn Jn, diff = qDn dx n(x+l) n(x) n(x-l) kT Dn = µn q kT Dp = µp q x-l x x+l Distance 1/8/2003 29 Poisson’s Equation Define intrinsic potential: Ei ψi = − q Electric field: E=- Poisson’s eq.: Or, ρ ( x) d 2ψ dE = − = − ε si dx 2 dx d 2ψ dE q [ p ( x) − n( x ) + N d ( x ) − N a ( x)] = − = − 2 dx dx ε si Gauss’s law: 1/8/2003 dψ dx E= 1 ε si ∫ ρ ( x)dx = Qs ε si 30 Carrier Concentration in terms of Electrostatic Potential Silicon surface Ec qψ s (> 0) qψ ( x ) qψ Eg B E i E f Ev kT N b ln ψB ≡ ψ f − ψi = q ni p-type silicon Oxide ( E f− Ei )/ kT = nie q ( ψ i −ψ f )/ kT ( Ei − E f )/ kT = nie q ( ψ f −ψ i )/ kT n = nie p = nie x 1/8/2003 31 Debye Length d 2ψ i q q ( ψ i − ψ f ) / kT = − N ( x ) − n e [ ] i ε si d dx 2 LD Ef Ei Nd Nd +∆Nd d 2 ( ∆ψi ) q 2 N d q ( ∆ ψ ) ∆N d ( x ) − = − i ε si kT ε si dx 2 Solution: ∆ψi ~ exp(-x/LD) where LD ≡ 1/8/2003 ε si kT q2 Nd 32 Current Density Equations Combining drift and diffusion components, Or, J n = qnµ n E + qDn dn dx J p = qpµ p E − qD p dp dx dψ i kT dn dφ n Jn = −qnµ n − = −qnµ n dx dx qn dx dψ i kT dp dφ p J p = −qpµ p + = −qpµ p dx dx qp dx where φ n ≡ψ i − kT n ln q ni φ p ≡ψ i + kT p ln q ni are the quasi-Fermi potentials. 1/8/2003 33 Current Continuity Equations From conservation of mobile charge, ∂ n 1 ∂ Jn = − Rn + Gn ∂t q ∂x 1 ∂ Jp ∂p =− − Rp + G p q ∂x ∂t where Gn, Gp, Rn, Rp are electron-hole generation and recombination rates. In the steady state with negligible electron-hole generation and recombination rates, dJn/dx = 0 dJp/dx = 0 Simply continuity of electron and hole currents. 1/8/2003 34 Dielectric Relaxation Time Neglect Rn, Gn in the current continuity equation, ∂ n 1 ∂ Jn = ∂t q ∂x From Ohm’s law, Jn = E/ρn And from Poisson’s equation with majority carrier density n, ∂E/∂x = −qn/εsi Substituting into current continuity equation: ∂n n =− ∂t ρ nε si The solution is of the form n(t) ∝ exp(−t/ρnεsi) where ρnεsi ≈ 10-12 s is the majority carrier response time. 1/8/2003 35