Thermal Management
richardsonrfpd.com
THERMAL MANAGEMENT
Richardson RFPD offers a wide range of thermal management products
and services from Wakefield-Vette for applications utilizing natural air
convection and forced-air or liquid-cooled solutions. Our portfolio
includes more than 40 stocked extrusion profiles. You can depend on
our unique combination of global sourcing, extensive material inventory,
and engineering capabilities to meet your system development
and production requirements.
Our thermal management products from Wakefield-Vette include:
•
•
•
•
•
Extruded Heat Sinks
Bonded Fin Heat Sinks
Liquid Cold Plate Heat Sinks
Thermal Management Accessories:
• Clamp Compression Systems
• Thermal Compounds, Adhesives and Interface Material
Custom Fabrication and Plating
Standard and custom-designed
solutions are available.
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BONDED FIN HEAT SINKS
Configurable, reliable, cost-effective and highly efficient – WakefieldVette’s bonded fin heat sinks from Richardson RFPD are ideal for high
power and densely-packaged applications, even in demanding shock
and vibration environments. When the combination of large heat sink
size, tall fins and high fin density make the use of simple extrusions
impractical, bonded fins are a perfect high-power solution for either
natural or forced convection. Made by bonding straight fins into a
grooved base plate, bonded fins may involve aluminum, copper and/or
graphite fins.
Benefits of Bonded fin:
• Dissipate more heat than conventional heat sinks with the
same footprint
• Reduce heat sink and overall system volume
Wakefield-Vette Standard Sizes may be purchased with bracket
for easy fan-mounting.
Bonded Fin Bases
Base
Extrusion W
Profile No. (in/mm) T
(in/mm)
FT
(in/mm)
FP
Max#
(in/mm) Fins
8711 2.800 (71.1)
0.520 (13.2)
0.050 (1.3)
0.275 (5.4)
10
8731 3.615 (91.8)
0.575 (14.6)
0.050 (1.3)
0.239 (6.1)
15
8546 4.000 (101.6)
0.500 (12.7)
0.050 (1.3)
0.200 (5.1)
20
8737 4.425 (112.4)
0.650 (16.5)
0.050 (1.3)
0.238 (6.0)
18
8119 4.750 (120.7)
0.500 (12.7)
0.050 (1.3)
0.288 (7.3)
16
8712 5.000 (127.0)
0.530 (13.5)
0.050 (1.3)
0.198 (5.0)
25
8732 5.650 (143.5)
0.500 (12.7)
0.050 (1.3)
0.200 (5.1)
28
8556 6.000 (152.4)
0.500 (12.7)
0.050 (1.3)
0.250 (6.4)
24
8542 6.620 (168.1) 0.500 (12.7)
0.050 (1.3)
0.200 (5.1)
33
8671 7.230 (183.6)
0.550 (14.0)
0.050 (1.3)
0.239 (6.1)
30
8823 7.440 (189.0) 0.525 (13.3)
0.050 (1.3)
0.200 (5.1)
37
8734 7.500 (190.5)
0.560 (14.2)
0.050 (1.3) 0.400 (10.2)
19
8545 8.000 (203.2)
0.500 (12.7)
0.050 (1.3) 0.200 (5.1)
40
8709 8.327 (211.5) 0.400 (10.2)
0.050 (1.3)
0.215 (5.5)
37
8715 8.780 (223.0)
0.600 (15.2)
0.050 (1.3)
0.270 (6.9)
28
8707 10.00 (254.0) 0.550 (14.0)
0.050 (1.3)
0.238 (6.0)
42
8121 10.78 (273.8)
0.560 (14.2)
0.050 (1.3)
0.238 (6.0)
45
8733 12.60 (320.0)
0.600 (15.2)
0.050 (1.3)
0.207 (5.3)
60
8714 14.00 (355.6)
0.525 (13.3)
0.050 (1.3)
0.250 (6.4)
56
8735 15.00 (381.0)
0.625 (15.9)
0.050 (1.3)
0.250 (6.4)
60
ORDER GUIDE - EXAMPLE
Example Part Number - BE8546-1200-U4W
• BE8546 = Bonded fin base extrusion profile identifier
• Length (inches; 12.00 shown, two decimal point assumed)
• Finish (G = Gold Chromate, U = Unfinished)
• Fin Height (4 inches shown)
• Mounting Options (L = Mounting Legs, W = No Mounting Legs)
PART NUMBERING ORDER GUIDE
BEXXXX - XX- X X X
Contact Richardson RFPD at 800-737-6937 for additional standard
profile options. Dimensions shown are as extruded. To improve flatness
across the width, bases can be machined. Machined base thickness will
be reduced.
Mounting options (L or W)
Fin Height (inches)
Finish (G or U)
Length (inches, up to 36)
BASE EXTRUSION
PROFILE NUMBER
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EXTRUDED HEAT SINKS
Wakefield-Vette’s extruded heat sinks provide a greater
range of natural convection solutions for higher power
components and systems. Complex fin structures can be
created by forcing raw aluminum through an extrusion die.
These complex fin profiles allow greater heat dissipation
through increased surface area while eliminating the cost
and time associated with machining an equivalent shape
from block aluminum.
Advantages of extruded heat sinks include:
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•
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Greater efficiency than stamped heat sinks
Lower cost than fully-machined assemblies
Widely available in many standard shapes and sizes Easily customized for any application
Significant weight advantage over copper
Common Wakefield-Vette Configurations in Richardson RFPD’s stock
H-Style
Press Pack
Flatback
Richardson RFPD stocks
each of the popular profiles
Flatback High Fin
listed on the next page
and is the largest stocking
distributor for
Flatback
Center Channel
Wakefield-Vette extrusions
in the world.
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Wakefield-Vette Extruded Heat Sinks
Manufacturer
Part Number
Length
(in)
1025
1527
2009
2016
4483
4509
4771
4937
5079
5429
5523
5733
6274
10516-77
14820-81
1541-76
1703-HS
2002-HS
2013-HS
2030-HS
2039-HS
2044-84
2065-75
2170-HS
2199-71
2726-74
3559-2
3560-2 4471-96
4562-HS
4652-HS
4721-HS
5057-HS
5138-77
6438-2
6957-HS
7029-HS
7031-72
8403-HS
72
72
72
72
72
72
72
72
72
84
72
72
72
77
81
76
72
72
72
72
72
84
75
72
71
74
72
72 96
72
72
72
72
77
72
72
72
72
72
Width
(in)
Height
lb / ft
(in)
Thermal Resistance
(°C/W)
4.732.63 2.28
4.381.29 2.58
7.881.31 4.3
19 1.3118.71
7.9371 2.56
6.5 1.63.45
7.341.31 4.54
8.352 5.55
3.792 2.66
13.381.31 18.71
7.3420.875 2.88
7
3.13
8.39
6.962.79 9.15
7.375
3.13
7.44
5.2 2.415.24
6.256.25 7.54
9.881.31 6.15
5.561.31 3.67
2.8751.32 1.76
4.730.687 1.4
4 1.292.75
12.752.25 11
5 1.754.08
12.751.35 9.07
5.5 24.48
4.753 2.93
7.0
3.125
7.37
5
2.25
3.59
12.251 7.13
3.82
1
1.62
4.5 1.42.37
1.5
0.63
0.39
3.46
1.4
1.6
4.1251.75 3.52
7.2
2.41
5.24
5 1.65”3.32
6.7541.63 4.08
6.6241.312 4.12
6.5 1.65.49
Configuration
1.3
H-Style
1.4
Flatback
1.2
Flatback
0.5
Flatback
1.5
Flatback
1.3
Flatback
1.1
Flatback
0.9
Flatback
1.5
Flatback
0.7
Flatback
1.8
Flatback
0.88
Press Pack
0.8
Flatback
0.68
Flatback High Fin
1.4
Flatback
0.59
H-Style
0.91
Flatback
1.5
Flatback
2.3
Flatback
2.4
Flatback
1.9
Flatback
0.56
Flatback
1.6
Flatback
0.6
Flatback
1.3
Flatback
1.1
H-Style
.85
Press Pack
1.4
Press Pack
1.3
Flatback
2.5
Flatback Center Channel
1.8
Flatback
10.3
Flatback Center Channel
2.3
Flatback Center Channel
1.9
Flatback
0.9
Flatback High Fin
1.5
Flatback
1.3
Flatback
1.3
Flatback
1.3
Flatback
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EXTRUDED HEAT SINKS
High Fin Density Heat Sinks
High fin density heat sinks from Wakefield-Vette offer considerable
performance gains over standard extrusions. Used in conjunction with
intelligent power modules (IPMs), IGBTs, relays, power transistors and power
amplifiers, high fin density heat sinks provide increased efficiency for high
power applications under forced convection by creating greater volumetric
surface area. Realize several key advantages sourcing the popular 6" and 12"
styles below from Richardson RFPD:
• Immediate availability
• Competitive pricing
• Low thermal resistance value
• Machining capabilities for quick customization
Wakefield-Vette Heat Sinks
Manufacturer
Part Number
Width
(in)
Height
(in)
Length
(in)
510-12U
510-6U
511-12U
511-6U
512-12U
512-6U 7.383.136
7.383.136
5.212.41
5.212.41
7.22.41
7.2
2.41
Thermal Resistance
(°C/W)
12
6
12
6
12
6
0.24
0.38
0.45
0.65
0.45
0.65
Board Level Heat Sinks
Typically, one board level heat sink is used to increase the surface area available for
heat transfer from an individual low- to medium-power semiconductor device, thus
reducing the temperature of both its external case and its internal junction. The
add-on heat sink allows the semiconductor device to perform at or near its highest
level, with maximum reliability. Board level heat sinks are made for nearly all heatdissipating semiconductor devices, including microprocessors, diodes, rectifiers,
and transistors. Most board level heat sinks are made from stamped or extruded
metal—generally aluminum or copper, but some are made from plastic.
When choosing a Wakefield-Vette board level heat sink, consider:
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•
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The specific thru-hole or surface-mount semiconductor package type in need of being cooled
(e.g., TO-220, D2-Pak, SOT-223, BGA)
The specified thermal resistance (in °C/W)
The dimensions of the heat sink
The method by which the heat sink is “mounted” to either the PC board or the semiconductor device
package itself (e.g., clip system, conventional screw-down, adhesive, or PCB thru-hole or surface mount)
Contact Richardson RFPD with your specific board level heat sink requirements.
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LIQUID COLD PLATE HEAT SINKS
Liquid cooling is typically used in applications where desired performance can no longer be
economically met by air cooling due to thermal and/or footprint requirements. There are many
ways to accomplish liquid cooling, but the most common method is to have a plate with a flow path
that moves liquid under the device that is dissipating heat. After the heat is absorbed into the liquid,
it is taken out of the plate as the liquid flows through the system. Water or glycol/water mixes are
common for cooling, but other fluids that can be utilized as well.
Benefits of Liquid Cold Plates:
• Maximum heat removal for IGBTs, SCRs, rectifiers, diodes, thyristors and other high-power semiconductor devices.
• Several options of customization available based on performance level, materials required, and environmental conditions.
The following are examples of liquid-cooled heat sinks.
Exposed Tube
Part Number
120455
120456
120457
120458
120459
120460
Full Buried Tube
Part Number
120959
120960
120961
120962
120963
120964
Description
2- Pass Coldplate
4- Pass Coldplate
4- Pass Coldplate
6- Pass Coldplate
6- Pass Coldplate
6- Pass Coldplate
Length in Inches
2.25
6.00
12.00
6.00
12.00
24.00
Description
2- Pass Coldplate
4- Pass Coldplate
4- Pass Coldplate
6- Pass Coldplate
6- Pass Coldplate
6- Pass Coldplate
Length in Inches
2.25
6.00
12.00
6.00
12.00
24.00
Rolled Tube (180 Series)
Part Number
180-10-6C
180-10-12C
180-10-24C
180-11-6C
180-11-12C
180-11-24C
180-12-6C
180-12-12C
180-12-24C
180-20-6C
Description
2- Pass (3" Wide)
2- Pass (3" Wide)
2- Pass (3" Wide)
2- Pass (5" Wide)
2- Pass (5" Wide)
2- Pass (5" Wide)
4- Pass (7.75" Wide)
4- Pass (7.75" Wide)
4- Pass (7.75" Wide)
4- Pass (5.50" Wide)
Priatherm’s PT ZED series includes high performance liquid
cold plates for electrically non–isolated IGBT applications.
Consisting of an aluminum milled base plate and a brazed
cover, the PT ZED series is suitable for water, glycol or other
cooling liquids.
Mftg Plate
Plate
Part #
Length Length
Finish
Configuration
(mm)
(in)
PTZED1421
210
8.27
Aluminum alloy 2-Pass
Al EN AW 6060
Compatible power module packages
• MITSUBISHI 62mm package
• INFINEON 62mm package
• SEMIKRON SEMiTRANS R CaseD56
• FUJI Semiconductor M127, M234, M235
• MICROSEMI SP6, D3 and D4 packages
PTZED1426
260
10.24
Length in Inches
6.0
12.0
24.0
6.0
12.0
24.0
6.0
12.0
24.0
6.0
Aluminum alloy Al EN AW 6060
2-Pass
Compatible power module packages
• MITSUBISHI IGBTMOD™ A, NF & NFH Series
• FUJI Semiconductor M238 and M247
PTZED1518
180
7.09
Aluminum alloy Al EN AW 6060
2-Pass
Aluminum alloy Al EN AW 6060
2-Pass
Compatible power module packages
• MITSUBISHI Intellimod™ L-Series
• INFINEON EconoPACK™ +
• SEMIKRON SEMiX R 33
• FUJI Semiconductor M629
PTZED1521
210
8.27
Compatible power module packages
• MITSUBISHI IGBTMOD™ A & NX Series
• INFINEON EconoDUAL™ 3
• SEMIKRON SEMiX R 3
• FUJI 122 x 62mm package
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THERMAL ACCESSORIES
Thermal Compounds,
Adhesives and
Interface Materials
Clamp Compression Systems
Wakefield-Vette compression pack heat sink and clamp
systems provide customers with the complete system solution
for proper installation and heat dissipation for high-power
compression pack semiconductors. These high-quality
mounting clamp assemblies are the industry standard for
mounting, compressing, and clamping press-pack SCR,
thyristors, rectifiers, and other high power disc packaged
devices used in power distribution equipment, industrial
controls, transportation systems, and power supply and
conversion systems.
Max SCR DIA
101.6 mm
84 mm
63 mm
50 mm
40 mm
Clamp
Force
Extrusion
SeriesRange Profile
ALL
ALL
ALL
144
143
144
144
143
143
143
143
143
143
143
143
143
143
143
143
143
143
143
143
143
800 - 16000 LBS
800 - 16000 LBS
800 - 16000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
800 - 6000 LBS
XX7151
XX6351
XX5735
XX5360
XX10239
O16235
O14442
XX3529
XX5730
O14191
XX3849
XX5733
XX3559-2
XX5736
XX3561-2
XX5732
XX5731
XX3560-2
O13450
XX4554
XX5331
OO3537
XX5306
O14779
©2016 Richardson RFPD, Inc. All other product names and logos are trademarks of their
respective manufacturers. Specifications subject to change without notice.
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THERMAL MANAGEMENT_08/16_MK160076
• 120 Series Silicone Oil-Based
Thermal Joint Compound Fills the minute air gap between
mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier.
• 122 Series Thermal Joint Compound - Stable, silicone based, thixotropic paste developed to provide premium performance
at an affordable price.
• 126 Series Thermal Joint Compound - Nontoxic, synthetic, ester-
based (nonsilicone) compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds.
• DeltaBond™ 152 Adhesive - Ideal for general cementing;
thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high thermally conductive interfaces. It produces a rigid, high strength bond to most materials when cured.
• DeltaCast™ 153 - Pourable casting resin having thermal expansion characteristics similar to aluminum and copper allowing assemblies
to operate over a very wide temperature range.
• DeltaBond™ 154 - Medium viscosity, aluminum-filled resin with the best thermal conductivity of this series.
• DeItaBond™ 155 - Epoxy adhesive formulated for use within the semiconductor industry.
• DeltaBond™ 156 Thermally Conductive Adhesive - Modified acrylic adhesive designed for permanent mounting on components where heat must be effectively transmitted.
Why choose
Richardson RFPD
for your thermal
management requirements?
•
No other Wakefield-Vette distribution channel
stocks more extrusions
•
Ability to provide quick turns on samples and
smaller runs
•
Technical services, including comprehensive
thermal analysis
•
Complete fabricated heat sink support, including
machining and plating
•
High power thermal management capabilities,
offering high power density and compact sized
liquid-cold plate solutions
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